A fixture for thermal resistance testing of SMD packaged semiconductor devices

Abstract

The present invention discloses a fixture for thermal resistance testing of SMD packaged semiconductor devices, including a protective shell, a top end of the inner wall of the protective shell is fixedly connected with an annular plate, the inner part of the annular plate is rotatably connected with a test disk, and the surface of the test disk is evenly provided with three test slots. The present invention is provided with a driving device, which can realize automatic loading and automatic testing of the fixture, so that the thermal resistance test of the SMD packaged semiconductor device forms a complete assembly line, the automation degree of the test process is high, and the convenience and test speed of the fixture when performing thermal resistance testing can be effectively improved; by providing a matching detection device, when the fixture performs thermal resistance testing on the SMD packaged semiconductor device, the SMD packaged semiconductor device can be automatically pressed against the central part of the surface of the test device, which is convenient for the test device to perform thermal resistance testing on the SMD packaged semiconductor device, and can further improve the convenience of using the fixture.

Description

Technical Field

[0001] The invention belongs to the technical field of thermal resistance test fixtures for SMD packaged semiconductor devices, and in particular relates to a fixture that is convenient for thermal resistance test of SMD packaged semiconductor devices. Background Art

[0002] The thermal characteristics of semiconductor devices are one of the important contents in reliability design. In order to ensure the reliability of the device during use, the structural design of the device must take into account the heat dissipation characteristics of the device, and the quantitative calculation of these designs must be based on the thermal resistance parameters of the device. Therefore, the thermal resistance of semiconductor devices is an important parameter reflecting the thermal characteristics of the device. For SMD packaged semiconductor devices, the three electrodes are all located on the bottom surface of the device and on the same plane. Since the part with higher shell temperature during operation is the bottom surface of the lead-out electrode, when controlling the shell temperature, the thermocouple probe needs to be close to the bottom surface of the device, and a fixture is needed to clamp the SMD packaged semiconductor device to facilitate the thermal resistance test.

[0003] However, most of the existing fixtures for thermal resistance testing of SMD packaged semiconductor devices have a low degree of automation. When in use, the SMD packaged semiconductor device needs to be clamped first, tested, and then the SMD packaged semiconductor device needs to be removed to complete the thermal resistance test of an SMD packaged semiconductor device. This is not only cumbersome to operate, but also has low test efficiency.

[0004] Therefore, it is necessary to invent a fixture that is convenient for SMD packaged semiconductor device thermal resistance testing to solve the above problems. Summary of the invention

[0005] In view of the above problems, the present invention provides a fixture for facilitating thermal resistance testing of SMD packaged semiconductor devices to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a fixture for facilitating thermal resistance testing of SMD packaged semiconductor devices, comprising a protective shell, a ring plate is fixedly connected to the top end of the inner wall of the protective shell, a test disk is rotatably connected to the inside of the ring plate, three test slots are evenly arranged on the surface of the test disk, a test device for use with the test slots is installed on the top end of the ring plate, an L-shaped plate is fixedly connected to the top end of the protective shell, a feeding barrel for use with the test disk is fixedly connected to the inside of the top end of the L-shaped plate, a driving device for use with the test disk is arranged inside the protective shell, and a matching detection device and an automatic ejection device for use with the test device are arranged between the protective shell and the L-shaped plate.

[0007] Furthermore, the driving device includes a rotating shaft rotatably connected to the bottom of the inner wall of the protective shell, the top end of the rotating shaft is fixedly connected to the test disk, a reduction motor is installed inside the protective shell, one end of the output shaft of the reduction motor is fixedly connected to an incomplete gear, the outside of the rotating shaft is fixedly sleeved with a gear ring meshing with the incomplete gear, and the number of tooth grooves on the surface of the incomplete gear is one third of the number of tooth grooves on the surface of the gear ring.

[0008] Further, the matching detection device includes a pressing mechanism and a clamping mechanism;

[0009] The clamping mechanism includes a rotating rod rotatably connected to one side of the inner wall of the protective shell, the outside of the rotating rod is fixedly sleeved with a first bevel gear, the output shaft of the motor is fixedly connected with a second bevel gear meshing with the first bevel gear, a U-shaped rod is provided on one side of the rotating rod, and a square frame is slidably sleeved on the outside of the U-shaped rod, a positioning rod is symmetrically fixedly connected to one side of the protective shell, and two positioning rods are respectively arranged on both sides of the rotating rod, the outside of the two positioning rods are slidably connected with sliders, and one side of the two sliders is fixedly connected to the square frame.

[0010] Furthermore, a square rod is fixedly connected to one end of the bottom of the L-shaped plate, a movable rod is movably sleeved on the outside of the square rod, a clamping rod is fixedly connected to one end of the bottom of the movable rod, and the clamping rod is composed of a round rod and a contact with a rubber pad, a fixed rod is fixedly connected to the top of the L-shaped plate, a linkage rod is hinged to one end of the top of the fixed rod, a push rod is fixedly connected to one end of the movable rod, a top end of the push rod passes through the L-shaped plate and is hinged to one end of the linkage rod, a lifting rod is fixedly connected to one end of the top of the square frame, a top end of the lifting rod passes through the L-shaped plate and is hinged to the other end of the linkage rod.

[0011] Furthermore, the clamping mechanism includes three empty slots evenly opened inside the test disk, and the three empty slots are respectively arranged on the outsides of the three test slots, the insides of the three empty slots are symmetrically slidably connected with T-shaped plates, the bottom one ends of the two T-shaped plates are symmetrically rotatably connected with right-angle plates, the two ends of the four right-angle plates are rotatably connected with rollers, the bottom one ends of the two T-shaped plates are symmetrically opened with arc grooves, the insides of the four arc grooves are slidably connected with arc rods, one ends of the four arc rods extend to the outside of the arc groove and are respectively fixedly connected to the four right-angle plates, the outsides of the four arc rods are movably sleeved with first springs, and the first springs are respectively arranged between the right-angle plates and the arc grooves.

[0012] Furthermore, one side of the three empty slots is rotatably connected to a gear A, and the opposite sides of the four groups of T-shaped plates are fixedly connected to a toothed plate meshing with the gear A, one end of the top of one of the T-shaped plates is fixedly connected to a T-shaped block, and the surface of the test disk is provided with a through groove used in conjunction with the T-shaped block, one side of the through groove is slidably connected to a round pin, one end of the round pin is fixedly connected to the T-shaped block, and the outside of the round pin is movably sleeved with a second spring.

[0013] Furthermore, the external movable sleeve of the clamping rod is connected with a connecting plate, the bottom end of the connecting plate is fixedly connected with a resistance block used in conjunction with the T-shaped block, the external movable sleeve of the clamping rod is connected with a third spring, and the third spring is arranged at the top end of the connecting plate.

[0014] Furthermore, the automatic ejection device includes a lifting mechanism and an ejection mechanism;

[0015] The lifting mechanism includes a pin rod symmetrically fixedly connected to one end of the bottom of the annular plate, the outer parts of the two pin rods are movably sleeved with the same lifting block, the lifting block is composed of an arc plate and a protrusion, the surface of the sliding plate is provided with a sliding groove used in conjunction with the lifting block, the outer parts of the two pin rods are movably sleeved with a fourth spring, and the two fourth springs are respectively arranged between the lifting block and the annular plate, and one end of the rotating rod is fixedly connected to an elliptical disk used in conjunction with the lifting block.

[0016] Furthermore, the ejection mechanism includes a guide rod fixedly connected to one end of the bottom of the L-shaped plate, and the outside of the guide rod is symmetrically slidably connected to a hinge block, one side of one hinge block is fixedly connected to the movable rod, the opposite sides of the two hinge blocks are fixedly connected to the fifth spring, and the two fifth springs are movably sleeved on the outside of the guide rod, one side of the L-shaped plate is fixedly connected to a U-shaped plate, and the outside of the U-shaped plate is movably sleeved with a push plate, the two hinge blocks are hinged to a linkage plate on one side away from the square rod, and the two linkage plates are hinged to the push plate at one end away from the hinge block.

[0017] Technical effects and advantages of the present invention:

[0018] 1. The present invention can realize automatic loading and automatic testing of the fixture by providing a driving device, so that the thermal resistance test of the SMD packaged semiconductor device forms a complete production line. The automation degree of the test process is high, which can effectively improve the convenience and test speed of the fixture when performing thermal resistance testing; by providing a matching detection device, when the fixture performs thermal resistance testing on the SMD packaged semiconductor device, the SMD packaged semiconductor device can be automatically pressed against the central part of the surface of the test device, which is convenient for the test device to perform thermal resistance testing on the SMD packaged semiconductor device, and can further improve the convenience of using the fixture.

[0019] 2. The present invention is provided with an automatic ejection device, which can automatically eject the SMD packaged semiconductor device from the test slot after the test device finishes testing the SMD packaged semiconductor device. This can not only further improve the degree of automation when the fixture performs thermal resistance testing on the SMD packaged semiconductor device, but also further increase the ease of use of the fixture when testing the SMD packaged semiconductor device, thereby increasing the overall practicality of the fixture.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A front view of an embodiment of the present invention is shown;

[0023] Figure 2 A partial cross-sectional view of a protective shell according to an embodiment of the present invention is shown;

[0024] Figure 3 It shows a partial structural diagram of the cooperation detection device and the automatic ejection device in the embodiment of the present invention;

[0025] Figure 4 A partial structural cross-sectional view of a clamping mechanism in an embodiment of the present invention is shown;

[0026] Figure 5 A top cross-sectional view of a test disc according to an embodiment of the present invention is shown;

[0027] Figure 6 An enlarged schematic diagram of the structure of part A of an embodiment of the present invention is shown;

[0028] Figure 7 An enlarged schematic diagram of the structure of part B of an embodiment of the present invention is shown;

[0029] In the figure: 1, protective shell; 2, annular plate; 3, test plate; 4, test slot; 5, test device; 6, L-shaped plate; 7, feeding barrel; 8, driving device; 81, rotating shaft; 82, reduction motor; 83, incomplete gear; 84, gear ring; 9, matching detection device; 91, clamping mechanism; 911, rotating rod; 912, first bevel gear; 913, second bevel gear; 914, U-shaped rod; 915, square frame; 916, positioning rod; 917, slider; 918, square rod; 919, movable rod; 920, clamping rod; 921, fixing rod; 922, linkage rod; 923, push rod; 924, lifting rod; 93, clamping mechanism; 931, empty slot; 932, T-shaped plate; 933, right-angle plate; 934, roller; 935, arc groove; 936, arc rod; 937, first spring; 938, gear A; 939, tooth plate; 940, T-shaped block; 941, through groove; 942, round pin; 943, second spring; 944, connecting plate; 945, resistance block; 946, third spring; 10, automatic ejection device; 101, lifting mechanism; 1011, pin rod; 1012, lifting block; 1013, slide groove; 1014, fourth spring; 1015, elliptical disk; 102, ejection mechanism; 1021, guide rod; 1022, hinge block; 1023, fifth spring; 1024, U-shaped plate; 1025, push plate; 1026, linkage plate. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] The present invention provides a fixture for thermal resistance testing of SMD packaged semiconductor devices, such as Figure 1-Figure 7 As shown, it includes a protective shell 1, one end of the top of the inner wall of the protective shell 1 is fixedly connected with an annular plate 2, the inside of the annular plate 2 is rotatably connected with a test disc 3, the surface of the test disc 3 is evenly provided with three test slots 4, one end of the top of the annular plate 2 is installed with a test device 5 used in conjunction with the test slot 4, one end of the top of the protective shell 1 is fixedly connected with an L-shaped plate 6, the inside of the top end of the L-shaped plate 6 is fixedly connected with a feeding cylinder 7 used in conjunction with the test disc 3, a driving device 8 used in conjunction with the test disc 3 is arranged inside the protective shell 1, and a matching detection device 9 and an automatic ejection device 10 used in conjunction with the test device 5 are arranged between the protective shell 1 and the L-shaped plate 6;

[0032] The driving device 8 includes a rotating shaft 81 rotatably connected to the bottom of the inner wall of the protective shell 1, and one end of the top of the rotating shaft 81 is fixedly connected to the test disk 3. A reduction motor 82 is installed inside the protective shell 1, and one end of the output shaft of the reduction motor 82 is fixedly connected to an incomplete gear 83. The outer portion of the rotating shaft 81 is fixedly sleeved with a toothed ring 84 meshing with the incomplete gear 83, and the number of tooth grooves on the surface of the incomplete gear 83 is one third of the number of tooth grooves on the surface of the toothed ring 84.

[0033] The matching detection device 9 includes a pressing mechanism 91 and a clamping mechanism 93;

[0034] The clamping mechanism 91 includes a rotating rod 911 rotatably connected to one side of the inner wall of the protective shell 1, the outer portion of the rotating rod 911 is fixedly sleeved with a first bevel gear 912, the output shaft of the motor is fixedly connected with a second bevel gear 913 meshing with the first bevel gear 912, a U-shaped rod 914 is provided on one side of the rotating rod 911, the outer portion of the U-shaped rod 914 is slidably sleeved with a square frame 915, one side of the protective shell 1 is symmetrically fixedly connected with a positioning rod 916, and two positioning rods 916 are respectively arranged on both sides of the rotating rod 911, the outer portions of the two positioning rods 916 are slidably connected with a slider 917, and one side of the two sliders 917 is fixedly connected to the square frame 915;

[0035] A square rod 918 is fixedly connected to one end of the bottom of the L-shaped plate 6, and a movable rod 919 is movably sleeved on the outside of the square rod 918. A clamping rod 920 is fixedly connected to one end of the bottom of the movable rod 919, and the clamping rod 920 is composed of a round rod and a contact with a rubber pad. A fixed rod 921 is fixedly connected to the top of the L-shaped plate 6, and a linkage rod 922 is hinged to one end of the top of the fixed rod 921. A push rod 923 is fixedly connected to one end of the top of the movable rod 919, and the top end of the push rod 923 passes through the L-shaped plate 6 and is hinged to one end of the linkage rod 922. A lifting rod 924 is fixedly connected to one end of the top of the square frame 915, and the top end of the lifting rod 924 passes through the L-shaped plate 6 and is hinged to the other end of the linkage rod 922.

[0036] The clamping mechanism 93 includes three empty slots 931 evenly opened inside the test disc 3, and the three empty slots 931 are respectively arranged on the outside of the three test slots 4, the insides of the three empty slots 931 are symmetrically slidably connected with T-shaped plates 932, one end of the bottom of two of the T-shaped plates 932 is symmetrically rotatably connected with a right-angle plate 933, both ends of the four right-angle plates 933 are rotatably connected with rollers 934, one end of the bottom of the two T-shaped plates 932 is symmetrically opened with arc grooves 935, the insides of the four arc grooves 935 are slidably connected with arc rods 936, one end of the four arc rods 936 extends to the outside of the arc groove 935 and is respectively fixedly connected to the four right-angle plates 933, the outsides of the four arc rods 936 are movably sleeved with first springs 937, and the first springs 937 are respectively arranged between the right-angle plates 933 and the arc grooves 935;

[0037] One side of the three empty slots 931 is rotatably connected to a gear A938, and the opposite sides of the four groups of T-shaped plates 932 are fixedly connected to a toothed plate 939 meshing with the gear A938, and one end of the top of one of the T-shaped plates 932 is fixedly connected to a T-shaped block 940, and a through slot 941 used in conjunction with the T-shaped block 940 is provided on the surface of the test disc 3, and a round pin 942 is slidably connected to one side of the through slot 941, and one end of the round pin 942 is fixedly connected to the T-shaped block 940, and the outer part of the round pin 942 is movably sleeved with a second spring 943;

[0038] The outer movably sleeve of the clamping rod 920 is provided with a connecting plate 944, and a bottom end of the connecting plate 944 is fixedly connected with a resisting block 945 used in conjunction with the T-shaped block 940. The outer movably sleeve of the clamping rod 920 is provided with a third spring 946, and the third spring 946 is provided at a top end of the connecting plate 944.

[0039] Before using the device, the SMD packaged semiconductor devices to be tested can be placed into the feeding tube 7 in sequence. At this time, the SMD packaged semiconductor devices fall into the test slots 4 on the surface of the test disc 3 through the feeding tube 7; then the reduction motor 82 is turned on, and the reduction motor 82 drives the incomplete gear 83 to rotate, so that the incomplete gear 83 drives the rotating shaft 81 to rotate through the meshing action with the gear ring 84, so that the rotating shaft 81 drives the test disc 3 to rotate synchronously. When the motor drives the incomplete gear 83 to rotate one circle, the test disc 3 is driven to rotate one third of a circle (i.e., 120 degrees) through the cooperation between the above structures, and an SMD packaged semiconductor device is driven to rotate onto the test device 5 through the test slots 4 on the surface of the test disc 3;

[0040] At the same time, when the incomplete gear 83 is idling, the test disc 3 stops rotating, and the motor drives the first bevel gear 912 to rotate synchronously, and drives the rotating rod 911 to rotate through the meshing action between the first bevel gear 912 and the second bevel gear 913, so that the rotating rod 911 pushes the square frame 915 to move up through the U-shaped rod 914. At this time, the square frame 915 drives the two sliders 917 to move up synchronously outside the positioning rod 916, so that the square frame 915 pushes the lifting rod 924 to move up synchronously, so that the lifting rod 924 pushes The linkage rod 922 is turned over, and the push rod 923 is pushed downward by the linkage rod 922, so that the push rod 923 pushes the movable rod 919 to slide down outside the square rod 918, thereby driving the pressing rod 920 to move downward into the test slot 4 through the movable rod 919, and pressing the SMD packaged semiconductor device to be tested in the test slot 4 onto the test device 5, so as to prevent the SMD packaged semiconductor device from having poor contact during the test process. At this time, the test device 5 can perform a thermal resistance test on the SMD packaged semiconductor device;

[0041] At the same time as the above operation, the clamping rod 920 drives the connecting plate 944 to move downward synchronously, so that the connecting plate 944 drives the resistance block 945 to move downward synchronously. When the resistance block 945 contacts the T-shaped block 940, the resistance block 945 squeezes the third spring 946 through the connecting plate 944 while pushing the T-shaped block 940 to slide inside the through groove 941, so that the T-shaped block 940 pushes the round pin 942 to move synchronously and squeeze the second spring 943, so that the T-shaped block 940 pushes one of the T-shaped plates 932 to move synchronously inside the empty groove 931, thereby driving the other T-shaped plate 932 to move synchronously through the meshing action of the toothed plate 939 on one side of the T-shaped plate 932 and the gear A 938. 2 synchronously moves. At this time, the two T-shaped plates 932 drive the two groups of rollers 934 to approach each other synchronously through the two groups of right-angle plates 933. When the two groups of rollers 934 contact the side of the SMD packaged semiconductor device, the two groups of rollers 934 flip to both sides respectively, and drive the arc rod 936 to move inside the arc groove 935, so that the first spring 937 is compressed, so that the SMD packaged semiconductor device is clamped in the middle part of the test groove 4 by the two groups of rollers 934, so that when the fixture tests SMD packaged semiconductor devices of different sizes, it can ensure that the SMD packaged semiconductor device is fitted with the test point of the test device 5 during the test, thereby improving the use range of the fixture;

[0042] The present invention is provided with a driving device, which can realize automatic loading and automatic testing of the fixture, so that the thermal resistance test of the SMD packaged semiconductor device forms a complete production line, the test process has a high degree of automation, and can effectively improve the convenience and test speed of the fixture when performing thermal resistance testing; by providing a matching detection device, when the fixture performs thermal resistance testing on the SMD packaged semiconductor device, the SMD packaged semiconductor device can be automatically pressed against the central part of the surface of the test device, which is convenient for the test device to perform thermal resistance testing on the SMD packaged semiconductor device, and can further improve the convenience of using the fixture.

[0043] like Figure 1-Figure 4 As shown, the automatic ejection device 10 includes a lifting mechanism 101 and an ejection mechanism 102;

[0044] The lifting mechanism 101 includes a pin rod 1011 symmetrically fixedly connected to one end of the bottom of the annular plate 2, and the outer parts of the two pin rods 1011 are movably sleeved with the same lifting block 1012, and the lifting block 1012 is composed of an arc plate and a convex block. The surface of the sliding plate is provided with a slide groove 1013 used in conjunction with the lifting block 1012, and the outer parts of the two pin rods 1011 are movably sleeved with a fourth spring 1014, and the two fourth springs 1014 are respectively arranged between the lifting block 1012 and the annular plate 2, and one end of the rotating rod 911 is fixedly connected with an elliptical disk 1015 used in conjunction with the lifting block 1012;

[0045] The ejection mechanism 102 includes a guide rod 1021 fixedly connected to one end of the bottom of the L-shaped plate 6, and a hinge block 1022 is symmetrically slidably connected to the outside of the guide rod 1021, one side of one hinge block 1022 is fixedly connected to the movable rod 919, and the opposite sides of the two hinge blocks 1022 are fixedly connected to the fifth spring 1023, and the two fifth springs 1023 are movably sleeved on the outside of the guide rod 1021, one side of the L-shaped plate 6 is fixedly connected to a U-shaped plate 1024, and the outside of the U-shaped plate 1024 is movably sleeved with a push plate 1025, and the two hinge blocks 1022 are hinged to a linkage plate 1026 on one side away from the square rod 918, and the ends of the two linkage plates 1026 away from the hinge blocks 1022 are hinged to the push plate 1025;

[0046] In the above operation, when the detection device 9 is used to test the SMD packaged semiconductor device in one of the test slots 4, the rotating rod 911 drives the elliptical disk 1015 to rotate synchronously, so that the rotating disk pushes the lifting block 1012 to move upward, so that the lifting block 1012 slides outside the two pins 1011 and squeezes the fourth spring 1014, thereby pushing the SMD packaged semiconductor device in another test slot 4 to move upward through the lifting block 1012, and the SMD packaged semiconductor device that has finished the test is pushed out of the test slot 4;

[0047] At this time, the movable rod 919 drives the hinge block 1022 to slide synchronously outside the guide rod 1021, so that the fifth spring 1023 is compressed, so that the two hinge blocks 1022 push the push plate 1025 to slide outside the U-shaped plate 1024 through the two linkage plates 1026, so that the SMD packaged semiconductor device pushed out by the lifting block 1012 is pushed to the side away from the square rod 918 through the push plate 1025, so as to realize the automatic unloading of the SMD packaged semiconductor device after testing;

[0048] The present invention is provided with an automatic ejection device, which can automatically eject the SMD packaged semiconductor device from the test slot after the test device finishes testing the SMD packaged semiconductor device. This can not only further improve the degree of automation when the fixture performs thermal resistance testing on the SMD packaged semiconductor device, but also further increase the ease of use of the fixture when testing the SMD packaged semiconductor device, thereby increasing the overall practicality of the fixture.

[0049] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fixture for thermal resistance testing of SMD packaged semiconductor devices, comprising a protective shell (1), characterized in that: An annular plate (2) is fixedly connected to one end of the top of the inner wall of the protective shell (1), a test disc (3) is rotatably connected to the inside of the annular plate (2), three test slots (4) are evenly arranged on the surface of the test disc (3), a test device (5) for use with the test slots (4) is installed on one end of the top of the annular plate (2), an L-shaped plate (6) is fixedly connected to one end of the top of the protective shell (1), a feeding tube (7) for use with the test disc (3) is fixedly connected to the inside of one end of the top of the L-shaped plate (6), a driving device (8) for use with the test disc (3) is arranged inside the protective shell (1), and a matching detection device (9) and an automatic ejection device (10) for use with the test device (5) are arranged between the protective shell (1) and the L-shaped plate (6); A reduction motor (82) is installed inside the protective shell (1); The matching detection device (9) comprises a pressing mechanism (91) and a clamping mechanism (93); The clamping mechanism (91) comprises a rotating rod (911) rotatably connected to one side of the inner wall of the protective shell (1); a first bevel gear (912) is fixedly sleeved on the outside of the rotating rod (911); a second bevel gear (913) meshing with the first bevel gear (912) is fixedly connected to the output shaft of the reduction motor (82); a U-shaped rod (914) is provided on one side of the rotating rod (911); a square frame (915) is slidably sleeved on the outside of the U-shaped rod (914); a positioning rod (916) is symmetrically fixedly connected to one side of the protective shell (1); two positioning rods (916) are respectively provided on two sides of the rotating rod (911); the outsides of the two positioning rods (916) are slidably connected to sliders (917); one side of the two sliders (917) is fixedly connected to the square frame (915).

2. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 1, characterized in that: The driving device (8) comprises a rotating shaft (81) rotatably connected to the bottom of the inner wall of the protective shell (1), the top end of the rotating shaft (81) is fixedly connected to the test disc (3), one end of the output shaft of the reduction motor (82) is fixedly connected to an incomplete gear (83), the outer portion of the rotating shaft (81) is fixedly sleeved with a toothed ring (84) meshing with the incomplete gear (83), and the number of tooth grooves on the surface of the incomplete gear (83) is one third of the number of tooth grooves on the surface of the toothed ring (84).

3. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 2, characterized in that: A square rod (918) is fixedly connected to one end of the bottom of the L-shaped plate (6); a movable rod (919) is movably sleeved on the outside of the square rod (918); a clamping rod (920) is fixedly connected to one end of the bottom of the movable rod (919); the clamping rod (920) is composed of a round rod and a contact with a rubber pad; a fixed rod (921) is fixedly connected to the top of the L-shaped plate (6); a linkage rod (922) is hingedly connected to one end of the top of the fixed rod (921); a push rod (923) is fixedly connected to one end of the top of the movable rod (919); a push rod (923) passes through the L-shaped plate (6) and is hingedly connected to one end of the linkage rod (922); a lifting rod (924) is fixedly connected to one end of the top of the square frame (915); a lifting rod (924) passes through the L-shaped plate (6) and is hingedly connected to the other end of the linkage rod (922).

4. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 3, characterized in that: The clamping mechanism (93) comprises three empty slots (931) evenly arranged inside the test plate (3), and the three empty slots (931) are respectively arranged on the outsides of the three test slots (4), the insides of the three empty slots (931) are symmetrically slidably connected with T-shaped plates (932), the bottom ends of the two T-shaped plates (932) are symmetrically rotatably connected with right-angle plates (933), the two ends of the four right-angle plates (933) are rotatably connected with rollers (934), and the two T-shaped plates (93 2) has an arc-shaped groove (935) symmetrically formed at one end of the bottom, and the inside of the four arc-shaped grooves (935) are all slidably connected with arc-shaped rods (936), one end of the four arc-shaped rods (936) extends to the outside of the arc-shaped groove (935) and is respectively fixedly connected to four right-angle plates (933), and the outside of the four arc-shaped rods (936) are all movably sleeved with first springs (937), and the first springs (937) are respectively arranged between the right-angle plates (933) and the arc-shaped grooves (935).

5. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 4, characterized in that: One side of the three empty slots (931) is rotatably connected to a gear A (938); one side opposite to the four groups of T-shaped plates (932) is fixedly connected to a toothed plate (939) meshing with the gear A (938); one end of the top of one of the T-shaped plates (932) is fixedly connected to a T-shaped block (940); a through slot (941) for use with the T-shaped block (940) is provided on the surface of the test disc (3); a round pin (942) is slidably connected to one side of the through slot (941); one end of the round pin (942) is fixedly connected to the T-shaped block (940); and a second spring (943) is movably sleeved on the outside of the round pin (942).

6. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 5, characterized in that: The outer movably sleeve of the clamping rod (920) is connected to a connecting plate (944); a bottom end of the connecting plate (944) is fixedly connected to a resisting block (945) used in conjunction with the T-shaped block (940); the outer movably sleeve of the clamping rod (920) is connected to a third spring (946); and the third spring (946) is arranged at the top end of the connecting plate (944).

7. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 1, characterized in that: The automatic ejection device (10) comprises a lifting mechanism (101) and an ejection mechanism (102); The lifting mechanism (101) comprises a pin rod (1011) symmetrically fixedly connected to one end of the bottom of the annular plate (2); the outer parts of the two pin rods (1011) are movably sleeved with a same lifting block (1012); the lifting block (1012) is composed of an arc-shaped plate and a convex block; a sliding groove (1013) for use with the lifting block (1012) is provided on the surface of the annular plate (2); the outer parts of the two pin rods (1011) are movably sleeved with a fourth spring (1014); and the two fourth springs (1014) are respectively arranged between the lifting block (1012) and the annular plate (2); and one end of the rotating rod (911) is fixedly connected with an elliptical disk (1015) for use with the lifting block (1012).

8. A fixture for thermal resistance testing of SMD packaged semiconductor devices according to claim 7, characterized in that: The ejection mechanism (102) comprises a guide rod (1021) fixedly connected to one end of the bottom of the L-shaped plate (6); a hinge block (1022) is symmetrically slidably connected to the outside of the guide rod (1021); one side of one of the hinge blocks (1022) is fixedly connected to the movable rod (919); opposite sides of the two hinge blocks (1022) are fixedly connected to a fifth spring (1023); and the two fifth springs (1023) are movably sleeved on the outside of the guide rod (1021); one side of the L-shaped plate (6) is fixedly connected to a U-shaped plate (1024); the outside of the U-shaped plate (1024) is movably sleeved with a push plate (1025); the two hinge blocks (1022) are hingedly connected to a linkage plate (1026) on one side away from the square rod (918); and the two linkage plates (1026) are hingedly connected to the push plate (1025) at one end away from the hinge block (1022).

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