Fluid-cooled heat dissipation module

Abstract

The present invention provides a fluid-cooled heat dissipation module to solve the problem of poor heat dissipation efficiency of existing temperature equalizing plates. It includes: a body, having a plurality of first stacking plates and a plurality of second stacking plates arranged in a stacked manner, a chamber between any first stacking plate and an adjacent second stacking plate, the plurality of chambers being connected at intervals, so that a plurality of the connected chambers together form a phase change chamber, the phase change chamber is in a sealed state and filled with a phase change liquid, and another plurality of the connected chambers together form a fluid chamber; and two flow delivery parts connected to the fluid chamber.

Description

Technical Field

[0001] The present invention relates to a heat dissipation module, in particular to a fluid cooling heat dissipation module which conducts heat energy to a circulating fluid through a phase change fluid and takes away the heat energy through the circulating fluid. Background Art

[0002] In order to avoid local overheating of electronic devices, the current heat dissipation method of electronic devices is mainly to set a temperature equalizing plate inside the electronic device. The temperature equalizing plate can be attached to a heating area of ​​the electronic device. The existing temperature equalizing plate can have an upper plate body and a lower plate body. The upper plate body and the lower plate body are combined to form a cavity, and the cavity can be used to fill a working liquid; thereby, the heat energy generated in the heating area can be diffused to the temperature equalizing plate to effectively avoid the heat energy from accumulating in the heating area, so as to achieve a heat dissipation effect.

[0003] With the above-mentioned existing temperature equalizer, even if the heating zone can heat the working liquid and vaporize the working liquid, the gaseous working liquid evaporates to the side away from the heating zone to release heat and then condenses, taking the heat away from the heating zone; however, since the temperature equalizer only dissipates heat through the gas-liquid phase change of the working liquid, the heat dissipation effect of the temperature equalizer on the heating zone is limited, resulting in poor heat dissipation efficiency.

[0004] In view of this, the existing fluid cooling heat dissipation modules still need to be improved. Summary of the invention

[0005] To solve the above problems, an object of the present invention is to provide a fluid-cooled heat dissipation module that can improve heat dissipation performance.

[0006] Another object of the present invention is to provide a fluid-cooled heat dissipation module that can improve assembly convenience.

[0007] Another object of the present invention is to provide a fluid-cooled heat dissipation module that can reduce manufacturing costs.

[0008] Another object of the present invention is to provide a fluid-cooled heat dissipation module that can improve heat exchange efficiency.

[0009] The directions or their approximate terms described throughout the present invention, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inside", "outside", "side", etc., mainly refer to the directions of the accompanying drawings, and each direction or its approximate terms are only used to assist in the explanation and understanding of the embodiments of the present invention, and are not used to limit the present invention.

[0010] The components and members described throughout the present invention use the quantifiers "a" or "an" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, they should be interpreted as including one or at least one, and a single concept also includes plural cases, unless it is obvious that it means otherwise.

[0011] The similar terms such as "combination", "assembly" or "assembly" described throughout the present invention mainly include the connection that can be separated without damaging the components, or the connection that makes the components inseparable, which can be selected by technicians in this field according to the materials of the components to be connected or the assembly requirements.

[0012] The fluid-cooled heat dissipation module of the present invention comprises: a main body having a plurality of first stacking plates and a plurality of second stacking plates arranged in a stacked manner, wherein a chamber is provided between any first stacking plate and an adjacent second stacking plate, wherein the plurality of chambers are connected at intervals, so that a plurality of the connected chambers together form a phase change chamber, wherein the phase change chamber is in a sealed state and is filled with a phase change liquid, and another plurality of the connected chambers together form a fluid chamber; and two flow delivery parts connected to the fluid chamber.

[0013] Therefore, in the fluid-cooled heat dissipation module of the present invention, the phase change liquid in the phase change chamber can absorb heat energy from the liquid state and evaporate into a gas state, so that the phase change liquid in the phase change chamber absorbs the heat energy of a heat source, so that the phase change liquid can use the gas-liquid phase change mechanism to achieve heat transfer, and the circulating fluid in the fluid chamber can quickly absorb the heat energy in the phase change chamber, so that the phase change liquid in the phase change chamber can quickly condense from the gas state to the liquid state to absorb heat, and the circulating fluid in the fluid chamber can further cool the phase change liquid in the phase change chamber, which can achieve the effect of improving the heat dissipation efficiency.

[0014] The two flow delivery parts can be arranged diagonally and connected to the main body. In this way, the circulating fluid has a larger flow range and can flow smoothly and take away heat energy, so that the heat energy is not easy to stay inside the main body, which has the effect of improving the heat dissipation efficiency.

[0015] Among them, each of the plurality of first stacked plates may have a plurality of first protrusions, and the first protrusion may have a first through hole, and each of the plurality of second stacked plates may have a plurality of second protrusions, and the second protrusion may have a second through hole, and any first protrusion is connected to an adjacent second protrusion and the first through hole is connected to the second through hole, and two of the first protrusions located in the phase change chamber may additionally have at least one side through hole, and two of the second protrusions located in the fluid chamber may additionally have at least one side through hole, so that the second protrusion connected to the first protrusion having the side through hole may not have a side through hole, and the first protrusion connected to the second protrusion having the side through hole may not have a side through hole. In this way, the structure is simple and easy to assemble, and has the effect of improving the convenience of assembly.

[0016] The plurality of first stacking plates may have a plurality of first serial connection holes, the plurality of second stacking plates may have a plurality of second serial connection holes, the body may have a plurality of serial connection tubes, the plurality of serial connection tubes may penetrate and combine the first serial connection holes of the plurality of first stacking plates and the second serial connection holes of the plurality of second stacking plates, the tube wall of the plurality of serial connection tubes may have a plurality of perforations, the plurality of perforations of two of the plurality of serial connection tubes may be connected to the phase change chamber, and the plurality of perforations of the other two of the plurality of serial connection tubes may be connected to the fluid chamber. In this way, the structure is simple and easy to assemble, and has the effect of improving the convenience of assembly.

[0017] The body may have a plurality of first bosses, which are connected to the plurality of first stacked plates and are located in the phase change chamber. In this way, the contact area between the first stacked plates and the phase change liquid can be increased, the heat exchange efficiency can be improved, and the heat dissipation performance can be improved.

[0018] The body may have a plurality of second protrusions, which are connected to the plurality of second stacked plates and are located in the fluid chamber, and the distribution density of the plurality of second protrusions may be greater than the distribution density of the plurality of first protrusions. In this way, it is avoided that the number of the first protrusions is too large and occupies the space of the phase change chamber, and the contact area between the second stacked plates and the circulating fluid can be increased, and the heat energy of the phase change fluid can be taken away by the continuous circulation of the circulating fluid, thereby greatly improving the heat exchange efficiency and having the effect of improving the heat dissipation efficiency.

[0019] The plurality of first stacking plates may have a plurality of wave portions, and the plurality of second stacking plates may have a plurality of wave portions. In this way, the contact area between the first stacking plates, the second stacking plates, the phase change liquid, and the circulating fluid can be increased, and the wave portions of the plurality of first stacking plates and the wave portions of the plurality of second stacking plates can quickly transfer the heat energy of the phase change liquid to the circulating fluid, thereby improving the heat exchange efficiency.

[0020] The fluid-cooled heat dissipation module of the present invention may further include a plurality of sealing plugs, which may be combined with the body to make the phase change chamber sealed and the fluid chamber only connected to the two flow delivery parts. In this way, the phase change liquid can be prevented from flowing out, which has the effect of reducing manufacturing costs.

[0021] The fluid-cooled heat dissipation module of the present invention may further include a heat-conducting seat, which may be thermally connected to the bottom end of the body. In this way, the heat energy of the heat source may be evenly dispersed to the plurality of first stacked plates and the plurality of second stacked plates through the heat-conducting seat, thereby improving the heat dissipation effect.

[0022] The fluid chamber can be used for a circulating fluid to circulate, and the circulating fluid and the phase change liquid can be different liquids. In this way, suitable circulating fluid and phase change liquid can be selected to increase the circulation speed of the gas-liquid phase, thereby achieving a better heat dissipation effect.

[0023] The phase change liquid can be a non-conductive liquid, and the circulating fluid can be water. Thus, the phase change liquid and the circulating fluid can be easily obtained, which has the effect of reducing the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 : An exploded perspective view of a first embodiment of the present invention;

[0025] Figure 2 :like Figure 1 An enlarged view of the local structure shown;

[0026] Figure 3 : A partially cutaway perspective view of a first embodiment of the present invention;

[0027] Figure 4 : A combined stereogram of the first embodiment of the present invention;

[0028] Figure 5 :along Figure 4 AA line profile of

[0029] Figure 6 :along Figure 5 BB line profile of;

[0030] Figure 7 : A partial three-dimensional view of a first embodiment of the present invention having a first protrusion and a second protrusion;

[0031] Figure 8 :like Figure 7 The combined cross-section shown;

[0032] Fig. 9 : A combined cross-sectional view of a first embodiment of the present invention having a wave portion;

[0033] Fig.10 : An exploded perspective view of a second embodiment of the present invention;

[0034] Fig.11 : A combined cross-sectional view of the second embodiment of the present invention.

[0035] Description of Reference Numerals

[0036] [the present invention]

[0037] 1: Ontology

[0038] 11: First laminate

[0039] 111: First convex part

[0040] 112: First through hole

[0041] 113: Side through hole

[0042] 114: Wave

[0043] 115: First serial connection hole

[0044] 12: Second laminate

[0045] 121: Second convex part

[0046] 122: Second through hole

[0047] 123: Side through hole

[0048] 124: Wave

[0049] 125: Second serial port

[0050] 13: First boss

[0051] 14: Second boss

[0052] 15: Serial connection

[0053] 151:Piercing

[0054] 2: Fluid transport section

[0055] 3: Sealing plug

[0056] 4: Thermal seat

[0057] H: Heat source

[0058] L1: Phase change fluid

[0059] L2: Circulating fluid

[0060] P: Bottom

[0061] S1: Phase change chamber

[0062] S2: Fluid chamber

[0063] U: Chamber. DETAILED DESCRIPTION

[0064] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, preferred embodiments of the present invention are listed below and described in detail with reference to the accompanying drawings as follows:

[0065] Please refer to Figure 1 As shown, it is a first embodiment of the fluid-cooled heat dissipation module of the present invention, comprising a main body 1 and two flow delivery parts 2 , wherein the two flow delivery parts 2 are connected to the main body 1 .

[0066] Please refer to Figure 1 , Figure 2 , Figure 5 As shown, the body 1 has a plurality of first stacking plates 11 and a plurality of second stacking plates 12, and the plurality of first stacking plates 11 and the plurality of second stacking plates 12 can be made of metal materials with high thermal conductivity, such as copper or aluminum, and the plurality of first stacking plates 11 and the plurality of second stacking plates 12 can be welded (for example: reflow or thunder welding) to form a stacked arrangement, and there is a chamber U between any first stacking plate 11 and the adjacent second stacking plate 12. The chamber U and the structures on the first stacking plates 11 and the second stacking plates 12 can be formed by processing methods such as stamping, die casting, dry etching, wet etching or plasma etching; when the etching processing method is selected, the depth of the chamber U can be accurately controlled in μm units, which has the effect of improving the processing precision, and can be applied to electronic products with smaller volumes to ensure that the thinning requirements are met.

[0067] Please refer to Figure 3 , Figure 4 , Figure 5 As shown, in detail, the multiple first stacking plates 11 and the multiple second stacking plates 12 are staggered, that is, the arrangement of the first stacking plate 11, the second stacking plate 12, the first stacking plate 11, the second stacking plate 12, the first stacking plate 11, the second stacking plate 12..., the multiple chambers U are connected at intervals, so that multiple connected chambers U together form a phase change chamber S1, the phase change chamber S1 is in a closed state and filled with a phase change liquid L1, and the other multiple connected chambers U together form a fluid chamber S2, and the fluid chamber S2 is for a circulating fluid L2 to circulate; that is, the multiple chambers U can be divided into two groups, the two groups of chambers U can be connected to each other, and the two groups of chambers U can be the phase change chamber S1 and the fluid chamber S2 respectively.

[0068] The phase change liquid L1 may be water, alcohol or other liquids with a low boiling point; preferably, the phase change liquid L1 may be a non-conductive liquid, and the phase change liquid L1 may absorb heat from the liquid state and evaporate into a gaseous state, thereby utilizing the gas-liquid phase change mechanism of the phase change liquid L1 to achieve heat transfer; and the phase change chamber S1 is in a closed state, thereby preventing the phase change liquid L1 from being lost after it is in a gaseous state, and preventing the air from occupying the interior and compressing the space after the phase change liquid L1 is in a gaseous state, thereby affecting the heat dissipation efficiency; and the composition of the circulating fluid L2 may be liquid or gas, which is not limited by the present invention. In the present embodiment, the circulating fluid L2 may be water, for example.

[0069] Please refer to Figure 2 , Figure 5 As shown, it is particularly noted that the plurality of first stacked plates 11 and the plurality of second stacked plates 12 can be stacked on each other to form the phase change chamber S1 and the fluid chamber S2. The present invention does not limit the type and structural composition of the first stacked plates 11 and the second stacked plates 12. In this embodiment, the plurality of first stacked plates 11 can each have a plurality of first protrusions 111, and the first protrusions 111 can have a first through hole 112, and two of the first protrusions 111 located in the phase change chamber S1 can additionally have at least one side through hole 113; the plurality of second stacked plates 12 can each have a plurality of second protrusions 121, and the second protrusions 121 can have a second through hole 122, and the second protrusions 121 can each have a second through hole 122. Two of the second protrusions 121 in the fluid chamber S2 may additionally have at least one side through hole 123, any first protrusion 111 is connected to the adjacent second protrusion 121 and the first through hole 112 is connected to the second through hole 122, the side through hole 113 of the first protrusion 111 and the side through hole 123 of the second protrusion 121 may not be positioned relative to each other, that is, the position of the side through hole 113 of the first stacked plate 11 and the position of the side through hole 123 of the second stacked plate 12 are different, so that the second protrusion 121 connected to the first protrusion 111 having the side through hole 113 may not have the side through hole 123, and the first protrusion 111 connected to the second protrusion 121 having the side through hole 123 may not have the side through hole 113.

[0070] Please refer to Fig. 9 As shown, in addition, the multiple first stacking plates 11 can have multiple wave portions 114, and the multiple second stacking plates 12 can have multiple wave portions 124; in this way, the contact area between the first stacking plates 11, the second stacking plates 12 and the phase change liquid L1 and the circulating fluid L2 can be increased, and the multiple wave portions 114 and the multiple wave portions 124 can quickly transfer the thermal energy of the phase change liquid L1 to the circulating fluid L2, which can improve the heat exchange efficiency and thus improve the heat dissipation performance.

[0071] Please refer to Figure 7 , Figure 8 As shown, the body 1 may have a plurality of first convex columns 13 and a plurality of second convex columns 14, wherein the plurality of first convex columns 13 are connected to the plurality of first laminated plates 11 and are located in the phase change chamber S1; wherein the first convex columns 13 may be manufactured separately from the first laminated plates 11 and then combined in an assembled manner (e.g., welding), or the first laminated plates 11 may be integrally formed with the first convex columns 13, which is not limited by the present invention. By providing the plurality of first convex columns 13, the contact area between the first laminated plates 11 and the phase change liquid L1 may be increased, the heat exchange efficiency may be improved, and thus the heat dissipation performance may be improved.

[0072] In addition, the plurality of second bosses 14 are connected to the plurality of second laminated plates 12 and are located in the fluid chamber S2. The second bosses 14 can be manufactured separately from the second laminated plates 12 and then combined in an assembled manner (e.g., welding), or the second laminated plates 12 can be integrally formed with the second bosses 14. The present invention is not limited thereto, and the distribution density of the plurality of second bosses 14 can preferably be greater than the distribution density of the plurality of first bosses 13. In this way, it is avoided that the number of the first bosses 13 is too large and occupies the space of the phase change chamber S1, and the contact area between the second laminated plates 12 and the circulating fluid L2 can be increased, and the heat energy of the phase change liquid L1 can be taken away by the continuous circulation of the circulating fluid L2, thereby greatly improving the heat exchange efficiency and further improving the heat dissipation performance.

[0073] Please refer to Figure 1 , Figure 3 As shown, the two flow delivery parts 2 are diagonally connected to the body 1, and the two flow delivery parts 2 are connected to the fluid chamber S2; in this way, the flow range of the circulating fluid L2 is larger, and it can flow smoothly and take away the heat energy, so that the heat energy is not easy to stay inside the body 1. In addition, in other embodiments, the two flow delivery parts 2 can also be located at the same end of the body 1, and the present invention is not limited. The two flow delivery parts 2 can be connected to a pump (not shown) and a heat sink fin (not shown) through a pipe (not shown in the figure). When the pump is in operation, it can drive the circulating fluid L2 to circulate in the pipe and the fluid chamber S2.

[0074] The fluid-cooled heat dissipation module of the present invention may further include a plurality of sealing plugs 3, which may be combined with the main body 1 to make the phase change chamber S1 sealed, thereby preventing the phase change liquid L1 from flowing out, and the fluid chamber S2 may be connected only to the two flow delivery parts 2.

[0075] Please refer to Figure 3 , Figure 5As shown, the fluid-cooled heat dissipation module of the present invention may further include a heat-conducting seat 4, which can be thermally connected to the bottom end P of the main body 1, and the heat-conducting seat 4 can correspond to the multiple chambers U, and the heat-conducting seat 4 can be used to thermally connect a heat source H; in this way, the heat energy of the heat source H can be evenly dispersed to the multiple first stacked plates 11 and the multiple second stacked plates 12 through the heat-conducting seat 4, which has the effect of improving the heat dissipation effect.

[0076] Please refer to Figure 5 , Figure 6 As shown, when the fluid-cooled heat dissipation module of the present invention is in operation, the body 1 can be thermally connected to the heat source H through the heat-conducting seat 4, and the phase-change liquid L1 in the phase-change chamber S1 can absorb heat energy from the liquid state and evaporate into a gas state, so that the phase-change liquid L1 in the phase-change chamber S1 absorbs the heat energy at the heat source H; then, the circulating fluid L2 in the fluid chamber S2 can quickly absorb the heat energy in the phase-change chamber S1, so that the phase-change liquid L1 in the phase-change chamber S1 can quickly condense from the gas state to the liquid state to absorb heat, so that the circulating fluid L2 in the fluid chamber S2 can further cool the phase-change liquid L1 in the phase-change chamber S1, and then can take away the heat energy at the heat source H, so as to provide a good heat dissipation performance.

[0077] Please refer to Fig.10 , Fig.11 As shown, it is a second embodiment of the fluid-cooled heat dissipation module of the present invention, the plurality of first stacking plates 11 can have a plurality of first serial holes 115, the plurality of second stacking plates 12 can have a plurality of second serial holes 125, the plurality of first serial holes 115 of the plurality of first stacking plates 11 can be positioned relative to the plurality of second serial holes 125 of the plurality of second stacking plates 12; and the body 1 can also have a plurality of serial tubes 15, the plurality of serial tubes 15 penetrate and combine the first serial holes 115 of the plurality of first stacking plates 11 and the second serial holes 125 of the plurality of second stacking plates 12, the serial tubes 15 can With a plurality of through holes 151, the plurality of through holes 151 of two of the plurality of serial tubes 15 can be connected to the phase change chamber S1, and the plurality of through holes 151 of the other two of the plurality of serial tubes 15 can be connected to the fluid chamber S2. The plurality of through holes 151 can be respectively and spaced apart on the tube wall of the serial tube 15, so that the position heights of the plurality of through holes 151 on different serial tubes 15 can be different, thereby adjusting the plurality of connected chambers U to jointly form the phase change chamber S1, and the other plurality of connected chambers U to jointly form the fluid chamber S2.

[0078] In summary, in the fluid-cooled heat dissipation module of the present invention, the phase change liquid in the phase change chamber can absorb heat energy from the liquid state and evaporate into a gas state, so that the phase change liquid in the phase change chamber absorbs the heat energy of the heat source, so that the phase change liquid can use the gas-liquid phase change mechanism to achieve heat transfer, and the circulating fluid in the fluid chamber can quickly absorb the heat energy in the phase change chamber, so that the phase change liquid in the phase change chamber can quickly condense from the gas state to the liquid state to absorb heat, and the circulating fluid in the fluid chamber can further cool the phase change liquid in the phase change chamber, which can achieve the effect of improving the good heat dissipation efficiency.

Claims

1. A fluid-cooled heat dissipation module, characterized in that: include: A body having a plurality of first stacking plates and a plurality of second stacking plates arranged in a stacked manner, wherein a chamber is provided between any first stacking plate and an adjacent second stacking plate, wherein the plurality of chambers are connected at intervals, so that a plurality of the connected chambers together form a phase change chamber, wherein the phase change chamber is in a sealed state and is filled with a phase change liquid, and another plurality of the connected chambers together form a fluid chamber, wherein the plurality of first stacking plates each have a plurality of first protrusions, wherein the first protrusion has a first through hole, wherein the plurality of second stacking plates each have a plurality of second protrusions, wherein the second protrusion has a second through hole, wherein any first protrusion is connected to an adjacent second protrusion and the first through hole is connected to the second through hole, wherein two of the first protrusions located in the phase change chamber additionally have at least one side through hole, wherein two of the second protrusions located in the fluid chamber additionally have at least one side through hole, wherein the second protrusion connected to the first protrusion having the side through hole has no side through hole, and the first protrusion connected to the second protrusion having the side through hole has no side through hole; and Two fluid delivery parts are connected to the fluid chamber.

2. The fluid-cooled heat dissipation module according to claim 1, characterized in that: The two flow delivery parts are arranged diagonally and connected to the main body.

3. The fluid-cooled heat dissipation module according to claim 1, characterized in that: The multiple first stacking plates have multiple first serial connection holes, the multiple second stacking plates have multiple second serial connection holes, the main body has multiple serial tubes, the multiple serial tubes penetrate and combine the first serial connection holes of the multiple first stacking plates and the second serial connection holes of the multiple second stacking plates, the tube walls of the multiple serial tubes have multiple through holes, the multiple through holes of two of the multiple serial tubes are connected to the phase change chamber, and the multiple through holes of the other two of the multiple serial tubes are connected to the fluid chamber.

4. The fluid-cooled heat dissipation module according to claim 1, characterized in that: The main body has a plurality of first convex columns, which are connected to the plurality of first stacked plates and are located in the phase change chamber.

5. The fluid-cooled heat dissipation module according to claim 4, characterized in that: The body has a plurality of second protrusions, which are connected to the plurality of second stacked plates and are located in the fluid chamber, and the distribution density of the plurality of second protrusions is greater than the distribution density of the plurality of first protrusions.

6. The fluid-cooled heat dissipation module according to claim 1, wherein: The plurality of first laminated plates have a plurality of corrugated portions, and the plurality of second laminated plates have a plurality of corrugated portions.

7. The fluid-cooled heat dissipation module according to claim 1, wherein: In addition, it comprises a plurality of sealing plugs, which are combined and located in the main body, so that the phase change chamber is in a sealed state and the fluid chamber is only communicated with the two flow delivery parts.

8. The fluid-cooled heat dissipation module according to claim 1, wherein: In addition, a heat-conducting seat is included, and the heat-conducting seat is thermally connected to the bottom end of the body.

9. The fluid-cooled heat dissipation module according to any one of claims 1 to 8, characterized in that: The fluid chamber is used for a circulating fluid to circulate, and the circulating fluid and the phase change fluid are different liquids.

10. The fluid-cooled heat dissipation module according to claim 9, characterized in that: The phase change liquid is a non-conductive liquid, and the circulating fluid is water.

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