A through-hole drilling method with high hole thickness-diameter ratio for PCB board

Abstract

The invention relates to the technical field of PCB drilling, and in particular to a through-hole drilling method for a PCB board with a high hole thickness-diameter ratio; the through-hole drilling method comprises the following steps: setting an inner-layer PCB board; drilling a first through-hole process on the inner-layer PCB board; filling holes; after the filling holes are completed, performing a layer-building pressing process to obtain the layer-building PCB board; drilling a positioning hole process; recording a relative coordinate file; recording relevant coordinate values ​​of the positioning hole; a drilling machine reading an X-ray hole-building coordinate record file; the drilling machine drilling an A-side blind hole process on the layer-building PCB board; the blind drilling depth reaches the filled hole; artificially turning over the layer-building PCB board to expose the B-side of the layer-building PCB board; repeating the steps to complete the B-side blind hole drilling process of the layer-building PCB board, so that the B-side blind hole is connected with the A-side blind hole, and by first preparing an inner-layer PCB board structure and filling a filler material, the layer-building PCB board can be guided by the filler material without deviation when drilling a single-side hole.

Description

Technical Field

[0001] The invention relates to the technical field of PCB drilling, and in particular to a method for drilling through holes with a high hole thickness-to-diameter ratio on a PCB board. Background Art

[0002] like Figure 1 As shown, it is difficult to make through holes in existing PCB boards with high hole thickness-diameter ratios, which is often limited by the length of the drill needle and cannot be completed in one drilling.

[0003] like Figure 2 As shown, the method used in the prior art is: firstly, the A side of the PCB board is subjected to a blind drilling procedure for making a through hole to be drilled, and then the PCB board is turned over to the B side, and holes are drilled at the same relative position, and the drilling is continued from the B side to the A side until the blind hole on the A side is drilled through, thereby forming a through hole;

[0004] However, the above method is prone to drilling deviation when drilling blind holes on the A side. When drilling through the B side, the blind hole on the A side is skewed and cannot be drilled or can only be partially penetrated. It is similar to drilling a wall with an electric drill. The electric drill and the drill bit are perpendicular to the wall, but they are skewed when entering the wall. This situation makes it impossible to meet the requirements for through holes with a high hole thickness-to-diameter ratio. Summary of the invention

[0005] The object of the present invention is to provide a method for drilling through holes with a high hole thickness-to-diameter ratio on a PCB board, so as to effectively improve the accuracy of drill positioning and the concentricity and collimation of the drilled through holes.

[0006] To achieve the above object, the present invention provides a method for drilling a through hole with a high hole thickness-to-diameter ratio on a PCB board, the through hole drilling method comprising the following steps:

[0007] Set up the inner PCB board;

[0008] Performing a first through-hole drilling process on the inner PCB board;

[0009] Prepare a filler material, and use the filler material to fill the first through hole of the inner PCB board;

[0010] After the hole filling is completed, at least one PCB board is used to perform a build-up layer lamination process on the inner layer PCB board to obtain a build-up layer PCB board;

[0011] Performing a process of drilling positioning holes on the build-up PCB board;

[0012] Scanning the position of the filled hole on the build-up PCB board with X-rays, and recording the relative coordinate position of the filled hole and the positioning hole to form a relative coordinate file;

[0013] The build-up PCB board is placed on a drilling machine, and the CCD on the drilling machine is used to perform the alignment procedure of the positioning holes, and the relevant coordinate values ​​of the positioning holes are recorded;

[0014] The drilling machine reads the X-ray hole filling coordinate record file;

[0015] The drilling machine performs a blind hole drilling process on the A-side of the build-up PCB board according to the coordinates of the hole filling coordinate record file read by the X-ray and the relevant coordinate values ​​of the positioning hole;

[0016] The blind drill drills to a depth that reaches the filling hole;

[0017] Manually flipping the build-up PCB board to expose the B side of the build-up PCB board;

[0018] Repeat the steps to complete the process of drilling the B-side blind hole of the build-up PCB board, so that the B-side blind hole is connected with the A-side blind hole, and the through hole with a high hole thickness-to-diameter ratio of the entire PCB board can be completed.

[0019] By first making the hole-filling structure of the inner layer PCB board and then adding layers, the number of pressing times is selected according to needs. When the drill needle is drilling through the hole-filling structure, when the drill needle touches the soft hole-filling mechanism, the drill needle will drill along the position, thereby guiding the drill needle so that the drill needle will not be offset, thereby ensuring that the two directions of drilling can finally be connected, and finally solving the problem that the through holes with a high hole thickness-diameter ratio cannot meet the requirements, that is, improving the accuracy of drill positioning and the concentricity and collimation of the drilled through holes.

[0020] The process of drilling a first through hole on the inner PCB board includes the following steps:

[0021] Placing the inner PCB board on the drilling machine table;

[0022] Covering the inner PCB with a first upper cover plate;

[0023] Set drilling parameters;

[0024] The inner PCB board and the first upper cover board are connected by drilling holes.

[0025] By drilling the first through hole and filling the first through hole with a filling material, a hole-filled structure can be prepared. It should be noted that the number of the first through holes in the present application should not be limited to one, and the number can be selected and determined according to actual use requirements.

[0026] Wherein, the step of filling the first through hole of the inner PCB board with the filler material comprises the following steps:

[0027] The hole-filling material is placed on the screen, and then a scraper is used to press the hole-filling material into the grid in the screen so that the hole-filling material is pressed into the holes. The hole-filling material is a resin material or any material that can be used for hole filling.

[0028] A soft resin material or other material is used as a guide for the drill needle in the first through hole, and the drill needle deviation that is easy to occur in the prior art is avoided by guiding the moving path of the drill needle.

[0029] The step of performing a build-up layer lamination process on the inner PCB board using at least one PCB board to obtain a build-up layer PCB board comprises the following steps:

[0030] The PCB boards to be added with additional layers are respectively arranged on the upper and lower sides of the inner PCB board for overlapping;

[0031] The built-up PCB board can then be prepared by placing it in a high-temperature and high-pressure pressing device for pressing under preset conditions.

[0032] After the inner PCB hole filling structure is manufactured, the PCB boards to be pressed are arranged on both sides of the inner PCB board as needed. The number of pressing times is related to the actual product design, but does not affect the application scope of the present application, and docking can be achieved as needed.

[0033] The preset conditions are as follows: operating temperature range is 160-220°C, pressing pressure range is 400-800psi, and pressing time range is 80-150min.

[0034] The preset conditions are limited so that the subsequently prepared build-up PCB board can meet the usage requirements.

[0035] The above-mentioned process of drilling positioning holes on the build-up PCB board includes the following steps:

[0036] Placing the build-up PCB board on a drilling machine table;

[0037] Covering the build-up PCB with a second upper cover plate;

[0038] Set drilling parameters;

[0039] A hole is drilled to connect the second upper cover plate and the build-up PCB board.

[0040] When drilling the positioning holes on the A side or the B side of the build-up PCB board, the inner PCB board is connected to the PCB board, that is, the positioning holes serve as relatively stable positioning between the inner PCB board and the PCB board. For the single-sided step, the depth of the positioning holes should not be understood as passing through the entire build-up PCB board.

[0041] The present invention discloses a method for drilling through holes with a high hole thickness-diameter ratio for a PCB board. Based on the prior art, the inner layer PCB board structure is first prepared, and then the first through hole is drilled in the inner layer PCB board and filled with a filler material. When the build-up layer PCB board is drilled on one side, it can be guided by the filler material without deviation. Through double-sided drilling, the drilling of through holes with a high hole thickness-diameter ratio can be achieved, and the problems of insufficient precision and poor concentricity and collimation that are prone to occur can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 This is a schematic diagram of a hole with a high hole thickness-to-diameter ratio that cannot be drilled through in one go.

[0044] Figure 2 It is a schematic diagram of the existing drilling process.

[0045] Figure 3 The present invention is a flowchart of an example of a method for drilling a through hole with a high hole thickness-to-diameter ratio on a PCB board.

[0046] Figure 4 It is a step diagram of a through-hole drilling method for a PCB board with a high hole thickness-to-diameter ratio according to the present invention. DETAILED DESCRIPTION

[0047] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0048] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0049] See also Figure 3 to Figure 4 The present invention provides a method for drilling a through hole with a high hole thickness-diameter ratio on a PCB board, the through hole drilling method comprising the following steps:

[0050] S1 sets the inner PCB board;

[0051] S2 performs a first through-hole drilling process on the inner PCB board;

[0052] S3: preparing a filler material, and using the filler material to fill the first through hole of the inner PCB board;

[0053] After the hole filling is completed, at least one PCB board is used to perform a build-up layer lamination process on the inner layer PCB board to obtain a build-up layer PCB board;

[0054] S5 performs a process of drilling positioning holes on the build-up PCB board;

[0055] S6: Scanning the position of the filled hole on the build-up PCB board with X-rays, and recording the relative coordinate position of the filled hole and the positioning hole to form a relative coordinate file;

[0056] S7: placing the build-up PCB board on a drilling machine, using a CCD on the drilling machine to perform an alignment procedure for the positioning holes, and recording relevant coordinate values ​​of the positioning holes;

[0057] S8 drilling machine reads X-ray hole filling coordinate record files;

[0058] The S9 drilling machine performs a blind hole drilling process on the A-side of the build-up PCB board according to the coordinates of the hole filling coordinate record file read by X-ray and the relevant coordinate values ​​of the positioning hole;

[0059] S10 blind drilling reaches the filling hole;

[0060] S11 manually turning over the build-up PCB board to expose the B side of the build-up PCB board;

[0061] Step S12 is repeated to complete the process of drilling the blind holes on the B side of the build-up PCB board, so that the blind holes on the B side are connected with the blind holes on the A side, thereby completing the production of through holes with a high hole thickness-to-diameter ratio on the entire PCB board.

[0062] By first making the hole-filling structure of the inner layer PCB board and then adding layers, the number of pressing times is selected according to needs. When the drill needle is drilling through the hole-filling structure, when the drill needle touches the soft hole-filling mechanism, the drill needle will drill along the position, thereby guiding the drill needle so that the drill needle will not be offset, thereby ensuring that the two directions of drilling can finally be connected, and finally solving the problem that the through holes with a high hole thickness-diameter ratio cannot meet the requirements, that is, improving the accuracy of drill positioning and the concentricity and collimation of the drilled through holes.

[0063] Furthermore, the process of drilling a first through hole on the inner PCB board includes the following steps:

[0064] Placing the inner PCB board on the drilling machine table;

[0065] Covering the inner PCB with a first upper cover plate;

[0066] Set drilling parameters;

[0067] The inner PCB board and the first upper cover board are connected by drilling holes.

[0068] By drilling the first through hole and filling the first through hole with a filling material, a hole-filled structure can be prepared. It should be noted that the number of the first through holes in the present application should not be limited to one, and the number can be selected and determined according to actual use requirements.

[0069] Furthermore, the step of filling the first through hole of the inner PCB board with the filler material comprises the following steps:

[0070] The hole-filling material is placed on the screen, and then a scraper is used to press the hole-filling material into the grid in the screen so that the hole-filling material is pressed into the holes. The hole-filling material is a resin material or any material that can be used for hole filling.

[0071] A soft resin material or other material is used as a guide for the drill needle in the first through hole, and the drill needle deviation that is easy to occur in the prior art is avoided by guiding the moving path of the drill needle.

[0072] Furthermore, the step of performing a build-up layer lamination process on the inner PCB board using at least one PCB board to obtain a build-up layer PCB board comprises the following steps:

[0073] The PCB boards to be added with additional layers are respectively arranged on the upper and lower sides of the inner PCB board for overlapping;

[0074] The built-up PCB board can then be prepared by placing it in a high-temperature and high-pressure pressing device for pressing under preset conditions.

[0075] After the inner PCB hole filling structure is manufactured, the PCB boards to be pressed are arranged on both sides of the inner PCB board as needed. The number of pressing times is related to the actual product design, but does not affect the application scope of the present application, and docking can be achieved as needed.

[0076] Furthermore, the preset conditions are: an operating temperature range of 160-220° C., a pressing pressure range of 400-800 psi, and a pressing time range of 80-150 min.

[0077] The preset conditions are limited so that the subsequently prepared build-up PCB board can meet the usage requirements.

[0078] Furthermore, the above process of drilling positioning holes on the build-up PCB board includes the following steps:

[0079] Placing the build-up PCB board on a drilling machine table;

[0080] Covering the build-up PCB with a second upper cover plate;

[0081] Set drilling parameters;

[0082] A hole is drilled to connect the second upper cover plate and the build-up PCB board.

[0083] When drilling the positioning holes on the A side or the B side of the build-up PCB board, the inner PCB board is connected to the PCB board, that is, the positioning holes serve as relatively stable positioning between the inner PCB board and the PCB board. For the single-sided step, the depth of the positioning holes should not be understood as passing through the entire build-up PCB board.

[0084] Furthermore, the drilling parameters are as follows: the diameter range of the drill bit used is 0.1mm~3.5mm according to the hole diameter requirements, the drilling speed parameter is set to 80,000~350,000 revolutions, the drilling speed is 200~600 holes per minute, and the cooling temperature of the drilling is 18~22 degrees.

[0085] In this embodiment, the drilling parameters are adjusted to improve the use effect of the drill bit.

[0086] Furthermore, the spindle speed parameter setting range for drilling is 80,000 to 350,000 rpm, the Z-axis acceleration for drilling is set in the acceleration setting range of 0.5G to 1.6G, and the drilling speed setting range is 200 to 600 holes per minute.

[0087] In this embodiment, the spindle speed parameter is adjusted to improve the drilling effect.

[0088] The present invention discloses a method for drilling through holes with a high hole thickness-diameter ratio for a PCB board. Based on the prior art, the inner layer PCB board structure is first prepared, and then the first through hole is drilled in the inner layer PCB board and filled with a filler material. When the build-up layer PCB board is drilled on one side, it can be guided by the filler material without deviation. Through double-sided drilling, the drilling of through holes with a high hole thickness-diameter ratio can be achieved, and the problems of insufficient precision and poor concentricity and collimation that are prone to occur can be avoided.

[0089] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A method for drilling through holes with a high hole thickness-to-diameter ratio on a PCB board, characterized in that: The through hole drilling method comprises the following steps: S1 sets the inner PCB board; S2 performs a first through-hole drilling process on the inner PCB board; S3: preparing a filler material, and using the filler material to fill the first through hole of the inner PCB board; After the hole filling is completed, at least one PCB board is used to perform a build-up layer lamination process on the inner layer PCB board to obtain a build-up layer PCB board; S5 performs a process of drilling positioning holes on the build-up PCB board; S6: Scanning the position of the filled hole on the build-up PCB board with X-rays, and recording the relative coordinate position of the filled hole and the positioning hole to form a relative coordinate file of the filled hole; S7: placing the build-up PCB board on a drilling machine, using a CCD on the drilling machine to perform an alignment procedure for the positioning holes, and recording relevant coordinate values ​​of the positioning holes; The S8 drilling machine reads the relative coordinate files of the filled holes recorded by X-ray; The S9 drilling machine performs a blind hole drilling process on the A-side of the build-up PCB board according to the relative coordinate file of the hole filling read by the X-ray and the relevant coordinate values ​​of the positioning hole; S10 blind drilling reaches the filling hole; S11 manually turning over the build-up PCB board to expose the B side of the build-up PCB board; S12 repeats steps S5 to S11 to complete the process of drilling the B-side blind hole of the build-up PCB board, so that the B-side blind hole is connected with the A-side blind hole, and the through hole with a high hole thickness-diameter ratio of the entire PCB board can be manufactured; The step of filling the first through hole of the inner PCB board with the filler material comprises the following steps: Place the hole-filling material on the screen, and then use a scraper to press the hole-filling material into the grid in the screen so that the hole-filling material is pressed into the holes. The hole-filling material is a soft resin material or other material. The process of drilling a first through hole on the inner PCB board comprises the following steps: Placing the inner PCB board on the drilling machine table; Covering the inner PCB with a first upper cover plate; Set drilling parameters; Drilling a hole to connect the inner PCB board and the first upper cover board; The step of performing a build-up layer lamination process on the inner PCB board using at least one PCB board to obtain a build-up layer PCB board comprises the following steps: The PCB boards to be added with additional layers are respectively arranged on the upper and lower sides of the inner PCB board for overlapping; Then, the built-up PCB board is placed in a high-temperature and high-pressure pressing device for pressing under preset conditions to prepare the built-up PCB board; The preset conditions are: operating temperature range 160~220°C, pressing pressure range 400~800psi, pressing time range 80~150min; The process of drilling positioning holes on the build-up PCB board includes the following steps: Placing the build-up PCB board on a drilling machine table; Covering the build-up PCB with a second upper cover plate; Set drilling parameters; Drilling a hole to connect the second upper cover plate and the build-up PCB board; The drilling parameters are as follows: the diameter of the drill bit used ranges from 0.1mm to 3.5mm according to the hole diameter requirements, the Z-axis acceleration of drilling is set, the acceleration setting range is 0.5G to 1.6G, the drilling speed is 200 to 600 holes per minute, and the cooling temperature of drilling is 18 to 22 degrees.

Images