Electronic Systems

Abstract

The present invention discloses an electronic system, comprising an electronic device and a heat dissipation device. The electronic device comprises a housing, a heat source, a heat-conducting seat and a heat-conducting block. The housing has a connected space and at least one opening. The heat source is arranged in the space. The heat-conducting seat is arranged in the space and contacts the heat source, and at least a part of the heat-conducting seat is directly opposite to the opening. The heat-conducting block is located in the opening and elastically connected to the housing. The heat dissipation device comprises at least one pressing portion and a heat dissipation portion. The pressing portion is configured to press against the heat-conducting block, so that the heat-conducting block moves toward the space and abuts against the heat-conducting seat, so that the heat energy of the heat source is transmitted to the pressing portion through the heat-conducting seat and the heat-conducting block. The heat dissipation portion is connected to the pressing portion, and is configured to dissipate the heat energy transmitted to the pressing portion. Thereby, in the electronic system of the present invention, the heat dissipation device can effectively dissipate the heat source of the electronic device.

Description

Technical Field

[0001] The present invention relates to an electronic system, and in particular to an electronic system with a heat dissipation device. Background Art

[0002] With the advancement of electronic technology, the functionality of smartphones has been improving rapidly. In line with the change in people's lifestyles, electronic games on smartphones have become more and more popular. In order to enter this new business field, different developers have also launched more diversified and more detailed games to attract users in the market.

[0003] However, in order to cope with these increasingly complex games, the amount of information that the processor inside the smartphone has to process at each instant is becoming increasingly huge, so that the processor load is also becoming increasingly high. Summary of the invention

[0004] An object of the present invention is to provide an electronic system, wherein a heat dissipation device can effectively dissipate heat from a heat source of the electronic device.

[0005] The present invention provides an electronic system, comprising an electronic device and a heat dissipation device. The electronic device comprises a housing, a heat source, a heat-conducting seat and a heat-conducting block. The housing has a connected space and at least one opening. The heat source is arranged in the space. The heat-conducting seat is arranged in the space and contacts the heat source, and the heat-conducting seat at least partially faces the opening. The heat-conducting block is located in the opening and elastically connected to the housing. The heat dissipation device comprises at least one pressing portion and a heat dissipation portion. The pressing portion is configured to press against the heat-conducting block, so that the heat-conducting block moves toward the space and abuts against the heat-conducting seat, so that the heat energy of the heat source is transmitted to the pressing portion through the heat-conducting seat and the heat-conducting block. The heat dissipation portion is connected to the pressing portion and is configured to dissipate the heat energy transmitted to the pressing portion.

[0006] In summary, the present invention can effectively dissipate heat from the heat source of the electronic device by installing the heat dissipation device to the electronic device. Moreover, by inserting the protruding portion of the heat dissipation portion into the through hole of the housing and snapping the second joint portion of the heat dissipation portion to the fourth joint portion of the housing, the assembly of the heat dissipation device and the electronic device is completed, and the assembly process does not involve the use of other hand tools, thus bringing convenience to the user.

[0007] In addition, when the first end of the bracket is not pushed by the protruding portion of the heat dissipation portion, at least a portion of the supporting portion abuts against the heat conductive block. Therefore, when the heat dissipation device is not abutting against the electronic device, the supporting portion can continuously prevent the heat conductive block from contacting the heat conductive seat. In this way, the heat conductive seat cannot transfer the heat energy of the heat source to the heat conductive block, and the user will not accidentally trigger the hot heat conductive block. Therefore, the safety of the electronic device can be effectively improved.

[0008] Furthermore, in practical applications, when the user believes that the heat energy generated by the heat source of the electronic device during operation is not high, the user may choose not to install the heat dissipation device on the electronic device. Therefore, the electronic system can provide considerable flexibility in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a three-dimensional schematic diagram of an electronic system according to an embodiment of the present invention, wherein the heat dissipation device is not fixed to the electronic device.

[0010] Figure 2 for Figure 1 A partial perspective top view of an electronic device.

[0011] Figure 3 for Figure 2 Section view along line segment AA.

[0012] Figure 4 for Figure 1 A three-dimensional bottom view of a heat dissipation device.

[0013] Figure 5 for Figure 1 A partial perspective top view of an electronic device, wherein the supporting portion is away from the path of the heat conducting block moving toward the heat conducting seat.

[0014] Figure 6 for Figure 1 A three-dimensional schematic diagram of an electronic system, wherein the heat dissipation device is fixed to the electronic device.

[0015] Figure 7 for Figure 6 Section along line segment BB.

[0016] Figure 8 FIG. 4 is a side view of a heat dissipation device according to an embodiment of the present invention.

[0017] Fig. 9 It is a partial cross-sectional view of a heat dissipation device according to one embodiment of the present invention. DETAILED DESCRIPTION

[0018] Please refer to Figure 1 to Figure 3, the electronic system 100 includes an electronic device 110 and a heat dissipation device 120. In one embodiment, the electronic device 110 may be a smart phone or a tablet computer, but is not limited thereto. Specifically, the electronic device 110 includes a housing 111, a heat source 112, a heat-conducting seat 113, and a heat-conducting block 114. The housing 111 has a connected space SP and at least one opening OP. The heat source 112 is disposed in the space SP. In one embodiment, the heat source 112 may be a central processing unit or an image processor, etc. When the electronic device 110 is operating, the heat source 112 generates considerable heat energy. The heat-conducting seat 113 is disposed in the space SP and contacts the heat source 112, and the heat-conducting seat 113 is at least partially opposite to the opening OP. The heat-conducting block 114 is located in the opening OP and is elastically connected to the housing 111. In one embodiment, the heat-conducting block 114 is made of metal, and the contour of the heat-conducting block 114 matches the contour of the opening OP, so that the electronic device 110 can have a good appearance.

[0019] Please refer to Figure 4 . Figure 4 for Figure 1 3D bottom view of the heat dissipation device 120. In this embodiment, Figure 1 , Figure 4 As shown, the heat dissipation device 120 includes at least one pressing portion 121 and a heat dissipation portion 122. The heat dissipation portion 122 is connected to the pressing portion 121, and the pressing portion 121 is configured to press the heat conductive block 114 of the electronic device 110 so that the heat conductive block 114 moves toward the heat conductive seat 113 and engages with the heat conductive seat 113. In practical applications, the pressing portion 121 of the heat dissipation device 120 is made of metal material to improve the efficiency of heat conduction.

[0020] Furthermore, if Figure 4 As shown, the heat dissipation portion 122 of the heat dissipation device 120 includes a first connecting portion 1221 and a second connecting portion 1222 that are opposite to each other. Figure 1-2 As shown, the housing 111 of the electronic device 110 includes a third combining portion 1111 and a fourth combining portion 1112 that are opposite to each other. The first combining portion 1221 of the heat dissipation portion 122 is configured to be combined with the third combining portion 1111 of the electronic device 110, and the second combining portion 1222 of the heat dissipation portion 122 is configured to be combined with the fourth combining portion 1112 of the electronic device 110. In one embodiment, the third combining portion 1111 and the fourth combining portion 1112 are two opposite sides of the electronic device 110, but are not limited thereto. In one embodiment, the first combining portion 1221 and the second combining portion 1222 are snap-fit ​​structures, but are not limited thereto.

[0021] More specifically, in practical applications, such as Figure 4 As shown, the first combining portion 1221 of the heat dissipation portion 122 includes at least one protruding portion 1221a. Figure 1-2As shown, the third joint portion 1111 of the housing 111 includes at least one through hole HT, and the protrusion 1221a of the heat dissipation portion 122 is configured to be inserted into the through hole HT of the housing 111. In addition, the fourth joint portion 1112 of the housing 111 is actually the side of the housing 111, and the second joint portion 1222 of the heat dissipation portion 122 is configured to be snapped onto the fourth joint portion 1112 of the housing 111.

[0022] Furthermore, if Figure 2-Figure 3 As shown, the electronic device 110 further includes a bracket 130, which is movably located in the space SP. The bracket 130 includes a transmission part 131, at least one supporting part 132 and a connecting part 133. The transmission part 131 includes a first end 1311 and a second end 1312 opposite to each other, and the first end 1311 is located between the second end 1312 and the through hole HT, and is configured to be pushed by the protrusion 1221a. When the heat dissipation device 120 is not combined with the electronic device 110, at least a portion of the supporting part 132 abuts against the heat conductive block 114 so that the heat conductive block 114 does not contact the heat conductive seat 113. In this way, the heat conductive seat 113 will not transfer the heat energy of the heat source 112 to the heat conductive block 114, and the user will not feel that the heat conductive block 114 is hot. Therefore, the use safety of the electronic system 100 is effectively improved.

[0023] In one embodiment, the housing 111 has an edge 1113, the edge 1113 surrounds and defines the opening OP, the vertical projection of the edge 1113 on the bracket 130 is located between the connecting portion 133 and the first end 1311, the connecting portion 133 is connected to the second end 1312, and the supporting portion 132 is connected to the connecting portion 133. In fact, the transmission portion 131, the supporting portion 132 and the connecting portion 133 can be an integrally formed structure.

[0024] Please refer to Figure 5 . Figure 5 for Figure 1 1 is a partial perspective top view of the electronic device 110, wherein the supporting portion 132 is away from the heat conductive block 114 ( Figure 5 FIG. 1 shows the internal structure of the heat conducting block 114 and the electronic device 110 . Specifically, Figure 5 As shown, when the protruding portion 1221a ( Figure 5 When the protrusion 1221a (only a portion of which is shown) is inserted into the through hole HT of the housing 111, the protrusion 1221a pushes the first end 1311 of the bracket 130, so that the transmission part 131 of the bracket 130 is away from the through hole HT of the housing 111, and the supporting part 132 also moves with the transmission part 131 due to the connection part 133 and moves away from the heat conductive block 114. In this case, the supporting part 132 no longer presses against the heat conductive block 114, so the heat conductive block 114 will move toward the heat conductive seat 113 due to gravity.

[0025] In other words, when the first end 1311 of the bracket 130 is not pushed by the protrusion 1221 a of the heat dissipation portion 122 , at least a portion of the supporting portion 132 abuts against the heat conductive block 114 , so that the heat conductive block 114 does not contact the heat conductive seat 113 .

[0026] In one embodiment, if Figure 2 , Figure 5 As shown, the electronic system 100 further includes at least one first elastic component 140. The first elastic component 140 is located in the space SP and is elastically connected between the bracket 130 and the housing 111. When the first elastic component 140 is in a natural state, at least a portion of the supporting portion 132 of the bracket 130 abuts against the heat conductive block 114, and when the protruding portion 1221a of the heat dissipating portion 122 is inserted into the through hole HT of the housing 111 and pushes the first end 1311 of the bracket 130, the supporting portion 132 of the bracket 130 moves away from the heat conductive block 114, so that the first elastic component 140 is stretched to store some elastic potential energy. When the protrusion 1221a of the heat dissipation portion 122 leaves the through hole HT of the shell 111 and no longer pushes the first end 1311 of the bracket 130, the first elastic component 140 releases the stored elastic potential energy and returns to a natural state, thereby causing at least a portion of the supporting portion 132 of the bracket 130 to reset again and press against the heat conductive block 114, so that the heat conductive block 114 is no longer in contact with the heat conductive seat 113.

[0027] Please refer to Figure 6-7 . Figure 6 for Figure 1 1 is a three-dimensional schematic diagram of an electronic system 100 , wherein a heat dissipation device 120 is fixed to an electronic device 110 . Figure 7 for Figure 6 A cross-sectional view along line segment BB. In this embodiment, Figure 6-7 As shown, the heat dissipation portion 122 of the heat dissipation device 120 abuts against the housing 111 of the electronic device 110. In this case, the protrusion 1221a of the heat dissipation portion 122 is inserted into the through hole HT of the housing 111, and the second joint portion 1222 of the heat dissipation portion 122 is snapped on the fourth joint portion 1112 of the housing 111 to fix the relative position of the heat dissipation device 120 and the electronic device 110. Specifically, in this embodiment, when the second joint portion 1222 of the heat dissipation portion 122 is snapped on the fourth joint portion 1112 of the housing 111, the second joint portion 1222 covers and snaps on the side of the housing 111, as shown in FIG. Figure 6 shown.

[0028] As described above, when the protruding portion 1221a of the heat dissipation portion 122 is inserted into the through hole HT of the housing 111 and pushes the first end 1311 of the bracket 130, the supporting portion 132 of the bracket 130 is away from the heat conductive block 114. Therefore, when the second joint portion 1222 of the heat dissipation portion 122 is also snapped onto the fourth joint portion 1112 of the housing 111, the pressing portion 121 of the heat dissipation device 120 presses the heat conductive block 114 of the electronic device 110 and moves the heat conductive block 114 toward the space SP, and then engages with the heat conductive seat 113, so that the heat energy of the heat source 112 is transmitted to the pressing portion 121 of the heat dissipation device 120 through the heat conductive seat 113 and the heat conductive block 114. The heat dissipation portion 122 of the heat dissipation device 120 is configured to dissipate the heat energy transmitted to the pressing portion 121.

[0029] In other words, by installing the heat sink 120 to the electronic device 110, the heat sink 120 can effectively dissipate heat from the heat source 112 of the electronic device 110. Moreover, as described above, by inserting the protruding portion 1221a of the heat sink 122 into the through hole HT of the housing 111, and snapping the second joint portion 1222 of the heat sink 122 to the fourth joint portion 1112 of the housing 111, the assembly of the heat sink 120 and the electronic device 110 is completed, and the assembly process does not involve the use of other hand tools, thereby bringing convenience to the user.

[0030] In practical applications, when the user believes that the heat energy generated by the heat source 112 of the electronic device 110 is not high during operation, the user may choose not to install the heat dissipation device 120 on the electronic device 110 . Therefore, the electronic system 100 can provide considerable usage flexibility.

[0031] Furthermore, in this embodiment, if Figure 3 , Figure 7 As shown, the electronic system 100 further includes a heat dissipation pad 160. Specifically, the heat dissipation pad 160 is disposed on a side of the heat conducting base 113 facing the heat conducting block 114, so that the heat conducting block 114 and the heat conducting base 113 can form a better thermal contact.

[0032] In addition, in this embodiment, if Figure 3 , Figure 7As shown, the electronic system 100 further includes at least one second elastic component 150. The second elastic component 150 is located in the space SP and is elastically connected between the heat conductive block 114 and the housing 111. When the second elastic component 150 is in a natural state, the heat conductive block 114 is at least partially located in the opening OP, and when the pressing portion 121 of the heat dissipation device 120 presses the heat conductive block 114 of the electronic device 110 and causes the heat conductive block 114 to move toward the space SP and abut against the heat conductive seat 113, the second elastic component 150 is compressed and stores some elastic potential energy. When the heat dissipation device 120 leaves the electronic device 110 and the pressing portion 121 of the heat dissipation device 120 leaves the heat conductive block 114 of the electronic device 110, the second elastic component 150 releases the stored elastic potential energy and returns to the natural state, and the heat conductive block 114 is at least partially located in the opening OP again to maintain the appearance of the electronic device 110.

[0033] In some embodiments, Figure 1 , Figure 4 , Figure 7 As shown, the heat dissipation device 120 further includes a plurality of heat dissipation fins 123 to improve the heat dissipation effect of the heat dissipation device 120 , but the present invention is not limited thereto.

[0034] Please refer to Figure 8 . Figure 8 FIG. 1 is a side view of a heat dissipation device 120 according to an embodiment of the present invention. Figure 8 As shown, the heat dissipation portion 122 of the heat dissipation device 120 includes at least one fan 124 to improve the heat dissipation effect of the heat dissipation device 120 , but the present invention is not limited thereto.

[0035] Please refer to Fig. 9 . Fig. 9 FIG. 1 is a partial cross-sectional view of a heat dissipation device 120 according to an embodiment of the present invention. Fig. 9 As shown, the heat dissipation portion 122 of the heat dissipation device 120 includes at least one flow channel CH, and the flow channel CH is configured to allow a cooling fluid CF to flow therein to improve the heat dissipation effect of the heat dissipation device 120 , but the present invention is not limited thereto.

[0036] In summary, in the embodiment of the present invention, the electronic system of the present invention can effectively dissipate heat from the heat source of the electronic device by installing the heat dissipation device to the electronic device. Moreover, by inserting the protruding portion of the heat dissipation portion into the through hole of the housing and snapping the second joint portion of the heat dissipation portion to the fourth joint portion of the housing, the assembly of the heat dissipation device and the electronic device is completed, and the assembly process does not involve the use of other hand tools, thereby bringing convenience to the user.

[0037] In addition, when the first end of the bracket of the electronic system is not pushed by the protruding portion of the heat dissipation portion, at least a portion of the supporting portion abuts against the heat conductive block. Therefore, when the heat dissipation device is not abutting against the electronic device, the supporting portion can continuously prevent the heat conductive block from contacting the heat conductive seat. In this way, the heat conductive seat cannot transfer the heat energy of the heat source to the heat conductive block, and the user will not accidentally trigger the hot heat conductive block. Therefore, the safety of the electronic device can be effectively improved.

[0038] Furthermore, when the user believes that the heat energy generated by the heat source of the electronic device during operation is not high, the user may choose not to install the heat dissipation device on the electronic device. Therefore, the electronic system can provide considerable usage flexibility.

[0039] Although the present invention has been disclosed as above by the embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. An electronic system, characterized in that: Include: Electronic device, comprising: A shell having a connected space and an edge, wherein the edge surrounds and defines at least one opening, wherein the shell comprises a third joint portion and a fourth joint portion opposite to each other, and wherein the third joint portion comprises at least one through hole; a heat source, disposed in the space; A heat-conducting seat, disposed in the space and in contact with the heat source, wherein at least a portion of the heat-conducting seat faces the opening; A heat conducting block, located at the opening and elastically connected to the shell; as well as A bracket is movably located in the space, and the bracket comprises: A transmission part, comprising a first end and a second end opposite to each other, wherein the first end is located between the second end and the through hole; at least one supporting portion, at least one portion of which abuts against the heat-conducting block so that the heat-conducting block does not contact the heat-conducting seat; as well as A connecting portion, wherein the vertical projection of the edge of the bracket is located between the connecting portion and the first end, and the connecting portion connects the second end and the supporting portion; The heat dissipation device comprises: at least one pressing portion configured to press the heat conductive block so that the heat conductive block moves toward the space and abuts against the heat conductive seat, so that the heat energy of the heat source is transferred to the pressing portion through the heat conductive seat and the heat conductive block; a heat dissipation portion connected to the pressing portion and configured to dissipate the heat energy transmitted to the pressing portion, the heat dissipation portion comprising a first joint portion and a second joint portion opposite to each other, the first joint portion comprising at least one protrusion, the protrusion being configured to be inserted into the through hole, and When the heat dissipation portion abuts against the shell, the protrusion is configured to be inserted into the through hole, and the second coupling portion is snapped onto the fourth coupling portion to fix the relative position of the heat dissipation device and the electronic device, wherein when the protrusion pushes the first end, the supporting portion moves with the transmission portion and away from the heat conductive block.

2. The electronic system according to claim 1, wherein: It also includes at least one first elastic component, which is located in the space and elastically connected between the bracket and the shell, wherein when the first elastic component is in a natural state, at least a part of the supporting portion abuts against the heat conductive block.

3. The electronic system according to claim 1, wherein: It also includes at least one second elastic component, which is located in the space and elastically connected between the heat-conducting block and the shell, wherein when the second elastic component is in a natural state, the heat-conducting block is at least partially located in the opening.

4. The electronic system according to claim 1, wherein: It also comprises a heat dissipation pad, which is arranged on a side of the heat conducting seat facing the heat conducting block.

5. The electronic system according to claim 1, wherein: The contour of the heat conducting block matches the contour of the opening.

6. The electronic system according to claim 1, wherein: The heat dissipation portion includes a plurality of heat dissipation fins.

7. The electronic system according to claim 1, wherein: The heat dissipation unit includes a fan.

8. The electronic system according to claim 1, wherein: The heat dissipation portion includes a flow channel, and the flow channel is configured to allow a cooling fluid to flow therein.

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