Light source unit for vehicle lamp and vehicle lamp
By designing a plurality of heat sinks of the radiator in the light source unit of the vehicle lamp in a width direction from the opposite side of the substrate mounting portion and extending to the rear end of the male connector portion, the problem of low thermal heat dissipation efficiency of LED and electronic components in the prior art is solved, and high heat dissipation performance and convenient loading and unloading of high brightness lamps are achieved.
Patent Information
- Application Number
- CN202210035031.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-01-22
- Filing Date
- 2022-01-13
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2042-01-13
AI Technical Summary
Due to the low heat dissipation efficiency of LEDs and electronic components in the light source unit for existing vehicles, it is difficult to maintain the luminous brightness of the LEDs, especially in the case of high-brightness lamps.
A light source unit for a vehicle lamp is designed, and the heat sink of the radiator is arranged in the width direction from the opposite side of the substrate mounting portion. The first radiator extends to the rear end of the male connector portion. The second radiator is provided with a cutout for loading and unloading. Some of the radiator radiators protrude upwards than the surroundings of the base portion to improve heat dissipation performance.
With this design, the heat dissipation performance can be significantly improved, ensuring that the luminous brightness of the LED can be maintained in the use of high-brightness lamps, and the length of the heat sink does not affect the loading and unloading convenience of the male connector part.
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Figure CN114811520B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a light source unit for a vehicle lamp and a vehicle lamp. Background Art
[0002] In recent years, with the development of high brightness and low cost of light-emitting diodes (LEDs), the number of lamps using light-emitting elements such as LEDs as light sources has gradually increased. LEDs have the advantages of long life and low power consumption. On the other hand, when the temperature is high, the luminous efficiency is reduced and the life is shortened. Therefore, a heat sink is needed to efficiently dissipate the heat generated by the LED to the outside.
[0003] For example, the following patent document 1 proposes a light source unit in which a circuit substrate on which an LED and a driving circuit for driving the LED are mounted is mounted on a heat sink, and a lamp holder with a coupler is detachably mounted in a mounting hole provided on the back side of a lamp body, and the lamp holder with a coupler integrally mounts the heat sink and a female connector portion electrically connected to the circuit substrate. Such a light source unit is suitable for use as a replaceable (substitute) light source such as a tail lamp of a vehicle emitting red light.
[0004] Prior art literature
[0005] Patent Literature
[0006] Patent Document 1 Japanese Patent Application Publication No. 2018-085300 Summary of the invention
[0007] Problems to be solved by the invention
[0008] However, in the above-mentioned light source unit, since the LED and the electronic components constituting the driving circuit are mounted on the same surface of the circuit substrate, it is necessary to efficiently dissipate the heat generated by the LED and the electronic components to the outside via the heat sink. In particular, when the light source unit is applied to high-brightness lamps such as brake lights, high heat dissipation performance is required to maintain the light luminance of the LED.
[0009] In addition, in the light source unit, a plurality of heat sinks are arranged in a width direction from the back side of the heat sink in a longitudinal plate-like protrusion. In the conventional light source unit, in order to avoid the heat sink becoming an obstacle when the male connector part is inserted into the female connector part, the length of the heat sink is the same as the rear end of the female connector part.
[0010] The present invention has been made in view of such a conventional situation, and an object of the present invention is to provide a vehicle lamp light source unit capable of improving heat dissipation performance, and a vehicle lamp including such a vehicle lamp light source unit.
[0011] Means for solving problems
[0012] In order to achieve the above-mentioned object, the present invention provides the following means.
[0013] [1] A light source unit for a vehicle lamp, characterized in that the light source unit for a vehicle lamp comprises:
[0014] A circuit substrate provided with a light emitting element and a driving circuit for driving the light emitting element;
[0015] a heat sink that dissipates heat generated by the light emitting element to the outside via a substrate mounting portion on which the circuit substrate is mounted; and
[0016] a lamp holder body, the lamp holder body being integrally formed with the heat sink and provided with a female connector portion electrically connected to the circuit board via a lead terminal,
[0017] The heat sink has a plurality of heat sinks, and the plurality of heat sinks protrude in a longitudinal plate shape in a state of being arranged in a width direction from a side opposite to the substrate mounting portion.
[0018] The plurality of heat sinks include a first heat sink located above the female connector portion and second heat sinks located on both sides of the female connector portion in the width direction.
[0019] The first heat sink is extended to at least above the male connector portion connected to the female connector portion.
[0020] The second heat sink is provided so that at least a part of a side portion of a male connector portion connected to the female connector portion is exposed.
[0021] [2] The vehicle lighting light source unit according to [1] above, wherein the first heat sink is provided to extend to at least the rear end of the male connector portion.
[0022] [3] The vehicle lamp light source unit according to [1] or [2] above, wherein the second heat sink has a cutout portion that exposes at least a portion of a side portion of the male connector portion.
[0023] [4] The vehicle lamp light source unit according to [3] above, wherein the second heat sink is extended to the same length as the first heat sink.
[0024] [5] The vehicle lamp light source unit according to any one of [1] to [4] above, wherein the first heat sink among the plurality of heat sinks is located at least on an extension line of a position facing the light emitting element.
[0025] [6] The vehicle lamp light source unit according to any one of [1] to [5] above, wherein the heat sink has a base and a protrusion protruding from the front surface of the base,
[0026] The protrusion constitutes a part of the substrate mounting portion.
[0027] [7] The vehicle lighting light source unit according to [6] above, wherein the heat sink has a convex portion that is located around the protruding portion and protrudes from the front surface side of the base portion.
[0028] [8] The vehicle lighting light source unit according to [6] or [7] above, wherein at least a portion of the plurality of heat sinks is arranged to protrude upward from the periphery of the base.
[0029] [9] A vehicle lamp, characterized by comprising the vehicle lamp light source unit according to any one of [1] to [8] above.
[0030] Effects of the Invention
[0031] As described above, according to the present invention, it is possible to provide a vehicle lamp light source unit capable of improving heat dissipation performance, and a vehicle lamp including such a vehicle lamp light source unit. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 It is a cross-sectional view showing the structure of a vehicle lamp including a vehicle lamp light source unit according to an embodiment of the present invention.
[0033] Figure 2 It is a perspective view showing the structure of a light source unit for a vehicle lamp.
[0034] Figure 3 It is an exploded perspective view showing the structure of a light source unit for a vehicle lamp.
[0035] Figure 4 It is a front view showing the structure of a light source unit for a vehicle lamp.
[0036] Figure 5 It is a rear view showing the structure of the light source unit for a vehicle lamp.
[0037] Figure 6 is based on Figure 4 2 is a cross-sectional view of a light source unit for a vehicle lamp taken along line segment AA shown in FIG.
[0038] Figure 7 is based on Figure 4 2 is a cross-sectional view of the vehicle lamp light source unit taken along line segment BB shown in FIG.
[0039] Figure 8 It will be Figure 6 0 is an enlarged cross-sectional schematic diagram of a portion of the heat sink on which a circuit substrate is mounted via a substrate mounting portion.
[0040] Fig. 9 It is a top view showing the structure of a circuit board.
[0041] Fig.10 It is a side view showing a state where a male connector portion is connected to a female connector portion of a light source unit for a vehicle lamp.
[0042] Fig.11 This is a rear view showing a state in which a male connector portion is connected to a female connector portion of a light source unit for a vehicle lamp.
[0043] Fig.12 It is a side view illustrating a modified example of the heat sink of the light source unit for a vehicle lamp.
[0044] Description of symbols
[0045] 1 ... light source unit (light source unit for vehicle lamp) 2 ... light emitting element 3 ... circuit board 4 ... board mounting portion 5 ... heat sink 5a ... base 5b ... protrusion 5c ... first heat sink 5d ... second heat sink 5e ... first convex portion 5f ... second convex portion 6 ... lead terminal 7 ... female connector portion 8 ... lamp holder body 9 ... electronic component 10 ... frame 11 ... sealing resin 12 ... wiring pattern 12a ... first wiring pattern 12b ... second wiring pattern 12c ... connection pattern 12d ... thermal conductive pattern 13 ... protective layer 14 ... bonding wire 15 ... hole portion 16 ... sealing member 17 ... thermal conductive adhesive 18 ... male connector portion 19 ... cutout portion 20 ... thermal conductive member 30 ... insulating resin substrate 31 ... adhesive layer 32 ... through hole 100 ... vehicle lamp 101 ... housing 102 ... lens cover 103 ... lamp body 104 ... gasket DETAILED DESCRIPTION
[0046] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0047] In the drawings used in the following description, in order to make each component easier to see, the scale of the dimensions may be different depending on the component, and the dimensional ratio of each component is not always the same as the actual one.
[0048] As one embodiment of the present invention, for example, Figure 1 A vehicle lamp 100 including a vehicle lamp light source unit (hereinafter referred to as “light source unit”) 1 will be described.
[0049] also, Figure 11 is a cross-sectional view showing the structure of a vehicle lamp 100 including the light source unit 1 .
[0050] In addition, in the drawings shown below, an XYZ orthogonal coordinate system is set, the X-axis direction is represented as the front-to-back direction (length direction) of the light source unit 1 (vehicle lamp 100), the Y-axis direction is represented as the left-right direction (width direction) of the light source unit 1 (vehicle lamp 100), and the Z-axis direction is represented as the up-down direction (height direction) of the light source unit 1 (vehicle lamp 100).
[0051] The vehicle lamp 100 of this embodiment applies the present invention to, for example, a tail lamp and brake lamp that emits red light at both corners of the rear end of a vehicle (not shown). The light source unit 1 of this embodiment is a lamp holder with a coupler that carries a replaceable (replaceable) LED lamp.
[0052] In addition, in the following description, unless otherwise specified, the descriptions of "front", "rear", "left", "right", "up", and "down" refer to directions when the vehicle lamp 100 (light source unit 1) is viewed from the front (rear of the vehicle). Therefore, directions when the vehicle is viewed from the front (front of the vehicle) are directions in which the front, rear, left, and right directions are opposite.
[0053] Specifically, if Figure 1 As shown, the vehicle lamp 100 is configured such that the light source unit 1 of the present embodiment is housed inside a lamp body 103 , wherein the lamp body 103 is composed of a housing 101 with an opening on the front side and a transparent lens cover 102 covering the opening of the housing 101 .
[0054] The light source unit 1 can be installed around the mounting hole 101a in a removable manner via an annular packing (O-ring) 104 by inserting its front surface side into the inner side of the lamp body 103 from the mounting hole 101a provided on the back side (rear surface) of the shell 101 (lamp body 103).
[0055] Below, refer to Figure 2 to Figure 12 The specific structure of the light source unit 1 according to the present embodiment will be described.
[0056] in addition, Figure 2 It is a perspective view showing the structure of the light source unit 1 . Figure 3 It is an exploded perspective view showing the structure of the light source unit 1 . Figure 4 It is a front view showing the structure of the light source unit 1 . Figure 5 It is a rear view showing the structure of the light source unit 1 . Figure 6 is based on Figure 4 2 is a cross-sectional view of the light source unit 1 along the line segment AA shown in FIG. Figure 7 is based on Figure 42 is a cross-sectional view of the vehicle lamp light source unit taken along line segment BB shown in FIG. Figure 8 It will be Figure 6 0 is a schematic cross-sectional view of an enlarged portion of a heat sink 5 on which a circuit substrate 3 is mounted via a substrate mounting portion 4 . Fig. 9 It is a plan view showing the structure of the circuit board 3. Fig.10 It is a side view showing a state where the male connector portion 18 is connected to the female connector portion 7 of the light source unit 1 . Fig.11 It is a rear view showing a state where the male connector portion 18 is connected to the female connector portion 7 of the light source unit 1 . Fig.12 It is a side view illustrating a modified example of the heat sinks 5 c and 5 d of the light source unit 1 .
[0057] like Figure 2 to Figure 5 As shown, the light source unit 1 of the present embodiment generally comprises: a circuit substrate 3 provided with a plurality of light-emitting elements 2; a substrate mounting portion 4 on which the circuit substrate 3 is mounted; a heat sink 5 for dissipating heat generated by the light-emitting elements 2 to the outside; and a lamp holder body 8 provided with a female connector portion 7 electrically connected to the circuit substrate 3 via a plurality of lead terminals 6.
[0058] The circuit board 3 is formed of a rectangular flat plate-shaped printed wiring board (PWB) with rounded corners. For example, FR-4 or the like can be used for the PWB.
[0059] A plurality of light emitting elements 2 and a plurality of electronic components 9 constituting a drive circuit for driving the plurality of light emitting elements 2 are provided on one surface (front surface) of the circuit substrate 3 .
[0060] The plurality of light emitting elements 2 are composed of LEDs that emit red light (hereinafter referred to as light). In addition, the LED uses a high-output type LED for vehicle lighting. In addition, in the present embodiment, four light emitting elements 2 are used. These four light emitting elements 2 are located in the approximate center of the front surface side of the circuit substrate 3, and are arranged (mounted) at equal intervals at positions radially separated upward, downward, leftward, and rightward from the position that is the center between each other (the approximate center of the circuit substrate 3).
[0061] In addition, regarding the light emitting elements 2 , in addition to the above-mentioned configuration in which four light emitting elements 2 are arranged, it is also possible to have a configuration in which five light emitting elements 2 are arranged by adding one light emitting element 2 at a position that is the center between the light emitting elements 2 .
[0062] A frame 10 is provided on the front side of the circuit board 3 to reflect light emitted by the plurality of light emitting elements 2 forward. The frame 10 is made of a cylindrical resin member and is provided on the front side of the circuit board 3 to surround the plurality of light emitting elements 2.
[0063] A transparent sealing resin 11 is provided inside the frame 10 to seal the inside of the frame 10. The upper surface of the sealing resin 11 is formed into a convex shape so as to protrude outside the frame 10. The upper surface of the sealing resin 11 is not limited to a convex shape, but may be a flat surface.
[0064] The plurality of electronic components 9 are located outside the frame 10 surrounding the plurality of light emitting elements 2, and are arranged (mounted) on the front surface side of the circuit board 3. The driving circuit may be a resistance circuit using a resistor as the electronic component 9, or a linear circuit using an IC as the electronic component 9.
[0065] The front surface of the circuit substrate 3 is provided with: a plurality of wiring patterns 12, which form wiring for connecting a plurality of light emitting elements 2 in series or in parallel (in series in this embodiment), wiring for electrically connecting the light emitting elements 2 to the electronic component 9, and wiring for electrically connecting the electronic component 9 to a plurality of lead terminals 6; and a protective layer 13, which covers the wiring patterns 12. The wiring patterns 12 are made of, for example, metal foil such as copper (Cu) or gold (Au) (copper foil in this embodiment). The protective layer 13 is made of an insulating resin material such as a resist.
[0066] A plurality of bonding wires 14 for electrically connecting the light emitting element 2 and the wiring pattern 12 are provided on the front surface side of the circuit board 3. The bonding wires 14 are made of, for example, gold wires.
[0067] The circuit board 3 is provided with a plurality of holes 15 penetrating the circuit board 3 in the thickness direction. In the present embodiment, three holes 15 are arranged in the width direction at positions corresponding to the three lead terminals 6 arranged parallel to the width direction. In addition, a land portion (not shown) formed by a part of the wiring pattern 12 is provided around the hole 15.
[0068] The light source unit 1 has a structure in which the heat sink 5 and the socket body 8 are integrated by insert molding. Alternatively, the light source unit 1 may have a structure in which the heat sink 5 and the socket body 8 are integrated by screwing or the like.
[0069] The heat sink 5 is made of a metal material with high thermal conductivity, such as aluminum (Al), iron (Fe), copper (Cu), etc. The lamp holder body 8 is made of an insulating resin material, such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide (PA), etc. In addition, the lamp holder body 8 may be made of a material obtained by adding a filler with high thermal conductivity, such as carbon, ceramic, or metal, to a resin.
[0070] In the present embodiment, the heat sink 5 is made of Al with a black alumite treatment applied to the surface. The heat sink 5 has: a substantially circular plate-shaped base 5a; a protrusion 5b protruding from a substantially central portion of the front surface side of the base 5a in a substantially square cross-section; and a plurality of heat sinks 5c, 5d protruding from the rear surface side of the base 5a in a longitudinal plate-shaped state arranged in the width direction.
[0071] On the other hand, the lamp holder body 8 has: a base 8a that is roughly disc-shaped; a tube wall portion 8b with a roughly circular cross-section, which protrudes forward from the roughly central portion of the front surface side of the base 8a; and a through hole 8c with a roughly square cross-section, which penetrates the inner side of the tube wall portion 8b and the base 8a in the front-to-back direction.
[0072] In addition, a plurality of claws 8d are arranged circumferentially on the outer peripheral surface of the tube wall 8b as a rotation stop and a fall-off prevention portion to prevent rotation and fall-off relative to the mounting hole 101a. The gasket 104 is installed in a state of contact with the base 8a while penetrating the tube wall 8b.
[0073] The lamp holder body 8 has: a through hole 8e, which is located below the through hole 8c and penetrates the inner side of the tube wall portion 8b and the base 8a in the front-to-back direction; and a roughly rectangular cylindrical fitting portion 8f, which protrudes toward the rear from the periphery of the through hole 8e on the back side of the base 8a.
[0074] The female connector part 7 has a plurality of lead terminals 6. Each lead terminal 6 is integrally mounted on the female connector part 7 in a state of penetrating the main body 7a of the female connector part 7 in the front-back direction. The female connector part 7 is configured by fitting the main body 7a to the inner side of the through hole 8e in a manner that the lead terminal 6 is located inside the fitting part 8f.
[0075] The substrate mounting portion 4 is provided on the front surface of the inner side of the barrel wall portion 8b. The heat sink 5 and the lamp holder body 8 are integrated in a state where the protrusion 5b is fitted into the through hole 8c and the bases 5a and 8a are butted against each other. In addition, a sealing member 16 is arranged between the front end of the protrusion 5b and the through hole 8c to hermetically seal the space therebetween. Thus, in the substrate mounting portion 4, the front end of the protrusion 5b exposed from the through hole 8c forms a flat surface continuous with the inner front surface of the barrel wall portion 8b.
[0076] The circuit board 3 is mounted on the front surface of the board mounting portion 4 via the thermally conductive adhesive 17. Thus, the circuit board 3 is thermally connected to the heat sink 5 via the thermally conductive adhesive 17 and the protrusion 5b constituting a part of the board mounting portion 4. On the other hand, the circuit board 3 is electrically insulated from the heat sink 5 in this state.
[0077] In addition, a first convex portion 5e and a second convex portion 5f are provided around the protrusion 5b, protruding from the front surface side of the base 5a. The first convex portion 5e is located on the upper side of the protrusion 5b, and the second convex portion 5f is located on both sides of the protrusion 5b in the width direction.
[0078] Thus, in the heat sink 5, the thermal connection between the protrusion 5b and the heat sinks 5c and 5d can be improved through the first protrusions 5e and the second protrusions 5f. In addition, in the heat sink 5, the anchoring effect of the first protrusions 5e and the second protrusions 5f can prevent the bases 5a and 8a from being peeled off when a load is applied between the heat sink 5 and the lamp holder body 8. In addition, in the heat sink 5, the excess thickness on the lamp holder body 8 side can be reduced by the first protrusions 5e and the second protrusions 5f, and the generation of gaps and poor molding during the above-mentioned insert molding can be prevented.
[0079] In addition, a part of the base 8a of the socket body 8 is provided in a state of being wound around the back side of the base 5a of the heat sink 5. This can improve the bonding strength between the heat sink 5 and the socket body 8 by insert molding.
[0080] The plurality of lead terminals 6 are fixed to the land portions located around the respective holes 15 by soldering while passing through the respective holes 15. Thus, the plurality of lead terminals 6 are electrically connected to the wiring pattern 12 of the circuit board 3.
[0081] In addition, in this embodiment, the circuit substrate 3 is mounted on the front surface of the substrate mounting portion 4 by the above-mentioned thermally conductive adhesive 17, but it can also be configured such that the circuit substrate 3 is arranged on the front surface of the substrate mounting portion 4 by thermally conductive grease, and a fixing portion is additionally provided between these circuit substrates 3 and the substrate mounting portion 4.
[0082] In addition, if Figure 2 , 3 As shown in 5 to 7, 10 and 11, the light source unit 1 of the present embodiment is constructed to include a first heat sink 5c located above the female connector portion 7 and a second heat sink 5d located on both sides of the female connector portion 7 in the width direction among the above-mentioned plurality of heat sinks 5c and 5d.
[0083] In the light source unit 1 of the present embodiment, a plurality of (three in the present embodiment) first heat sinks 5c are arranged along the width direction above the female connector portion 7, and a plurality of (two in the present embodiment) second heat sinks 5d are respectively arranged on both sides of the female connector portion 7 in the width direction.
[0084] In order to improve the heat dissipation performance of the heat sink 5, the first heat sink 5c is extended to the upper side of the male connector portion 18 connected to the female connector portion 7. In particular, the first heat sink 5c of the present embodiment is extended to the rear end of the male connector portion 18. In addition, the first heat sink 5c may be formed to extend further rearward than the rear end of the male connector portion 18.
[0085] The first heat sink 5c is preferably located at least on an extension line of a position facing the light emitting element 2 (heat conducting member 20 described later). Thus, the heat generated by the light emitting element 2 can be efficiently dissipated to the outside via the first heat sink 5c, thereby improving the heat dissipation performance.
[0086] In order to improve the heat dissipation performance of the radiator 5, the second heat sink 5d is extended rearward by the same length as the first heat sink 5c. On the other hand, in order to facilitate the attachment and detachment of the male connector portion 18 to the female connector portion 7, a notch portion 19 is provided on the second heat sink 5d, in which a part of the second heat sink 5d is cut away.
[0087] The cutout 19 has a substantially L-shaped cutout to expose at least a portion of the side of the male connector 18 connected to the female connector 7. In order to facilitate the attachment and detachment of the male connector 18, the corner of the front end of the second heat sink 5d is rounded on the cutout 19 side.
[0088] Thus, in the light source unit 1 of the present embodiment, the male connector portion 18 can be easily attached to and detached from the female connector portion 7 while gripping both side surfaces of the male connector portion 18 .
[0089] In addition, at least a portion of the plurality of heat sinks 5c, 5d is as follows, for example Fig.12 As shown in (a) of FIG. 5 , a structure may be adopted in which the base 5a is provided to protrude upward from the periphery thereof. Thereby, the heat dissipation performance of the heat sink 5 can be improved.
[0090] The shape of the cutout 19 is not necessarily limited to the above-mentioned shape, and may be, for example, Fig.12 The shapes shown in (b) to (d) are as follows. Fig.12 The cutout portion 19 shown in (b) has a tapered shape. On the other hand, Fig.12 The cutout portion 19 shown in (c) has a shape that is cutout while being bent outward. Fig.12 The cutout portion 19 shown in (d) has a shape that is cutout while being bent inward.
[0091] The second heat sink 5d is not necessarily limited to the one having the cutout 19 described above, and may be shorter than the first heat sink 5c so that at least a portion of the side of the male connector 18 is exposed.
[0092] In addition, in order to facilitate attachment and detachment of the male connector portion 18 to the female connector portion 7, the notch portion 19 may be provided in the first heat sink 5c in addition to the second heat sink 5d described above.
[0093] As described above, in the light source unit 1 of the present embodiment, the heat W1 and W2 generated by the light emitting element 2 and the electronic component 9 can be efficiently dissipated to the outside via the heat sink 5 , and the heat dissipation performance of the heat sink 5 can be improved.
[0094] Therefore, in the vehicle lamp 100 including the light source unit 1 of the present embodiment, even when applied to a high-intensity lamp such as the above-mentioned tail light and brake light, the light emission brightness of the light emitting element 2 can be maintained by high heat dissipation performance.
[0095] In the light source unit 1 of the present embodiment, in order to improve the heat dissipation performance of the heat sink 5, even when the lengths of the plurality of heat dissipation fins 5c and 5d are extended, the male connector portion 18 can be easily attached to and detached from the female connector portion 7.
[0096] In addition, in the light source unit 1 of the present embodiment, Figure 6 as well as Figure 7 As shown, at least a portion of the circuit board 3 facing the light emitting element 2 is formed of an insulating thermally conductive member 20 .
[0097] The heat conducting member 20 is made of an insulating material having a higher thermal conductivity than the insulating resin substrate (FR-4 in this embodiment) constituting the circuit board 3, such as aluminum nitride (AlN), silicon nitride (SiN), or aluminum oxide (Al2O3).
[0098] The heat conducting member 20 is preferably made of AlN (about 200 W / m·K) having a high thermal conductivity as described above. The thermal conductivity of FR-4 constituting the circuit board 3 is about 0.5 W / m·K.
[0099] The heat-conducting member 20 is arranged at a position where a part of the insulating resin substrate 30 is removed. Specifically, the heat-conducting member 20 is formed in a rectangular flat plate shape with the same thickness as the insulating resin substrate 30. On the other hand, an opening 30a having a shape corresponding to the heat-conducting member 20 is provided in the insulating resin substrate 30. The heat-conducting member 20 is arranged inside the opening 30a.
[0100] In addition, an insulating adhesive layer 31 is provided between the heat conducting member 20 and the opening 30a so as to be buried therebetween. The adhesive layer 31 can be made of, for example, silicone resin, epoxy resin, or the like.
[0101] Thus, in the circuit board 3 , the heat conducting member 20 and the insulating resin substrate 30 are integrated. In addition, the heat conducting member 20 is formed flush with the insulating resin substrate 30 .
[0102] In addition, the heat-conducting member 20 is not limited to the structure in which it is arranged inside the opening 30a in which a part of the insulating resin substrate 30 is opened, and for example, it may be arranged inside a recessed portion in which a part of the insulating resin substrate 30 is recessed. In addition, the heat-conducting member 20 is not limited to the structure in which it is fixed to the insulating resin substrate 30 via the adhesive layer 31, and it may be embedded inside the opening 30a or the recessed portion.
[0103] The plurality of light emitting elements 2 are arranged inside a region overlapping with the thermally conductive member 20 in a plan view on the front surface of the circuit board 3. That is, the plurality of light emitting elements 2 are arranged to face the thermally conductive member 20.
[0104] On the other hand, the plurality of electronic components 9 are arranged on the front surface of the circuit board 3 outside the region overlapping with the heat conductive member 20 in plan view and inside the region overlapping with the insulating resin substrate 30 in plan view. That is, the plurality of electronic components 9 are arranged facing the insulating resin substrate 30.
[0105] In the present embodiment, the center position of the plurality of light emitting elements 2 coincides with the center position of the thermally conductive member 20 in a plan view. Also, the center axis of the heat sink 5 coincides with the center axis of the thermally conductive member 20 .
[0106] Thus, in the light source unit 1 of the present embodiment, the heat W1 generated by the light emitting element 2 can be efficiently conducted (dissipated) to the heat sink 5 via the heat conduction member 20 .
[0107] In the light source unit 1 of the present embodiment, the light emitting element 2 is arranged on the thermally conductive member 20 having high thermal conductivity, and the electronic component 9 is arranged on the insulating resin substrate 30 having low thermal conductivity, so that the residual heat transferred from the electronic component 9 side to the light emitting element 2 side can be suppressed.
[0108] Furthermore, in the light source unit 1 of the present embodiment, the adhesive layer 31 can make it difficult for the heat W2 generated by the electronic component 9 to be transferred to the heat conductive member 20 side.
[0109] Therefore, in the light source unit 1 of the present embodiment, it is possible to suppress the excess heat transferred from the electronic component 9 side to the light emitting element 2 side and prevent the temperature of the light emitting element 2 from rising.
[0110] In addition, the circuit board 3 has a first wiring pattern 12a electrically connected to the light emitting element 2 among the plurality of wiring patterns 12. At least a portion of the first wiring pattern 12a is located inside the region E overlapping with the heat conducting member 20 in a plan view. That is, the first wiring pattern 12a is arranged so as to straddle between the heat conducting member 20 and the insulating resin substrate 30 in a plan view.
[0111] Thus, in the light source unit 1 of the present embodiment, the heat W1 generated by the light emitting element 2 can be efficiently conducted (dissipated) from the first wiring pattern 12a to the heat sink 5 via the heat conducting member 20. In addition, the fixing strength between the heat conducting member 20 and the insulating resin substrate 30 can be increased by the first wiring pattern 12a.
[0112] Furthermore, the circuit board 3 includes a second wiring pattern 12 b electrically connected to the electronic component 9 , and a connection pattern 12 c connecting the first wiring pattern 12 a and the second wiring pattern 12 b among the plurality of wiring patterns 12 described above.
[0113] The second wiring pattern 12b is arranged outside the first wiring pattern 12a. The connection pattern 12c is formed between the first wiring pattern 12a and the second wiring pattern 12b to be narrower than the first wiring pattern 12a and the second wiring pattern 12b.
[0114] Thus, in the light source unit 1 of the present embodiment, it is possible to make it difficult for the heat W2 generated by the electronic component 9 to be transferred from the second wiring pattern 12b side to the first wiring pattern 12a side through the connection pattern 12c. Therefore, in the light source unit 1 of the present embodiment, it is possible to suppress the excess heat transferred from the electronic component 9 side to the light emitting element 2 side, and prevent the temperature of the light emitting element 2 from rising.
[0115] The circuit board 3 also includes a plurality of through holes 32 penetrating the insulating resin substrate 30 in the thickness direction and a heat conduction pattern 12 d disposed on the other surface (rear surface) of the insulating resin substrate 30 .
[0116] The plurality of through holes 32 are formed by plating, for example, copper (Cu) or gold (Au) on the inner side of a hole portion penetrating the insulating resin substrate 30 in the thickness direction. The plurality of through holes 32 are located on the inner side of a region overlapping with the second wiring pattern 12b in a plan view, and are thus thermally connected to the second wiring pattern 12b.
[0117] The thermal conductive pattern 12d is a full-surface wiring pattern (copper foil pattern in this embodiment) and is provided over the entire surface of the rear surface of the insulating resin substrate 30 (circuit substrate 3) except for the area where the wiring pattern for electrical connection is arranged. The thermal conductive pattern 12d is thermally connected to the plurality of through holes 32.
[0118] In addition, since the heat transfer pattern 12d does not constitute a wiring pattern for electrical connection, it can also be arranged on the surface of the heat transfer member 20. In this way, the heat transfer pattern 12d and the heat transfer member 20 can be thermally connected.
[0119] A protective layer 13 covering the thermally conductive pattern 12d is provided on the rear surface of the insulating resin substrate 30 (circuit substrate 3). The protective layer 13 is provided in a region other than a region E overlapping with the thermally conductive member 20 in a plan view.
[0120] Thus, in the light source unit 1 of the present embodiment, the heat W2 generated by the electronic component 9 can be conducted (dissipated) from the second wiring pattern 12b to the heat transfer pattern 12d via the plurality of through holes 32 and efficiently conducted (dissipated) to the heat sink 5 side.
[0121] In addition, in the light source unit 1 of the present embodiment, the thermal conductivity between the thermally conductive member 20 and the thermally conductive pattern 12d can also be improved, and the heat W1 generated by the light emitting element 2 can be efficiently conducted (dissipated) to the heat sink 5 via the thermally conductive member 20 and the thermally conductive pattern 12d. Furthermore, the fixing strength between the thermally conductive member 20 and the insulating resin substrate 30 can be improved by the thermally conductive pattern 12d.
[0122] In addition, a relatively large number of through holes 32 are arranged on the side separated from the side where the light emitting element 2 is located across the position where the electronic component 9 is arranged. That is, these multiple through holes 32 are arranged asymmetrically between the second wiring pattern 12b on the side where the light emitting element 2 is located and the second wiring pattern 12b on the opposite side across the electronic component 9, and the number of through holes 32 on the side where the light emitting element 2 is located is reduced.
[0123] Thus, in the light source unit 1 of the present embodiment, it is possible to make it difficult for the heat W2 generated by the electronic component 9 to be transferred to the side where the light emitting element 2 is located. Therefore, in the light source unit 1 of the present embodiment, it is possible to suppress the excess heat transferred from the electronic component 9 side to the light emitting element 2 side, and prevent the temperature of the light emitting element 2 from rising.
[0124] In addition, the electronic component 9 may be configured to be arranged on the rear surface of the insulating resin substrate 30 (circuit substrate 3). In this case, the through hole 32 and the heat conduction pattern 12d described above are omitted, and the second wiring pattern 12b is arranged on the rear surface of the insulating resin substrate 30 (circuit substrate 3), and the first wiring pattern 12a and the second wiring pattern 12b are electrically connected via the through hole 32.
[0125] As described above, in the light source unit 1 of the present embodiment, the heat W1 and W2 generated by the light emitting element 2 and the electronic component 9 can be efficiently dissipated to the outside via the heat sink 5 , thereby improving the heat dissipation performance.
[0126] Therefore, in the vehicle lamp 100 including the light source unit 1 of the present embodiment, even when applied to a high-intensity lamp such as the above-mentioned tail light and brake light, the light emission brightness of the light emitting element 2 can be maintained by high heat dissipation performance.
[0127] In addition, in the light source unit 1 of the present embodiment, by forming at least a portion of the circuit substrate 3 relative to the light-emitting element 2 with an insulating thermally conductive component 20, the manufacturing cost can be kept lower than a structure in which the entire circuit substrate 3 (insulating resin substrate 30) is formed of a thermally conductive component 20 such as AlN.
[0128] In addition, the present invention is not necessarily limited to the above-mentioned embodiment, and various modifications can be added without departing from the scope of the present invention.
[0129] For example, in the above-mentioned embodiment, the case where the present invention is applied to the above-mentioned tail light and brake light is illustrated, but in the case of constituting a tail light and brake light, in addition to the above-mentioned light source unit 1, it can also be combined with other components such as an inner lens or an outer lens, a reflector, an extension, etc.
[0130] In addition, the vehicle lighting fixtures to which the present invention is applied are not limited to the above-mentioned taillights and brake lights. For example, the present invention can be widely applied to vehicle lighting fixtures such as vehicle headlights, vehicle width lights (position lights), auxiliary headlights (sub-headlights), front (rear) fog lights (fog lamps), daytime running lights (DRL) lights, hood lights, taillights, brake lights (parking lights), reversing lights, and direction indicators (turn signals).
[0131] In addition, in addition to the above-mentioned LED, light-emitting elements such as laser diodes (LD) can also be used for the light source unit to which the present invention is applied. In addition, the color of the light emitted by the light-emitting element is not limited to the above-mentioned red light, but can also be white light or orange light, etc., and can be appropriately changed according to the purpose of the light source unit. Furthermore, the number of light-emitting elements is not limited to multiple, but can also be 1. In addition, the configuration of the light-emitting element can also be appropriately changed.
Claims
1. A light source unit for a vehicle lamp, characterized in that: The vehicle lamp light source unit comprises: A circuit substrate provided with a light emitting element and a driving circuit for driving the light emitting element; a heat sink made of a metal material, which dissipates heat generated by the light emitting element to the outside via a substrate mounting portion on which the circuit substrate is mounted; and a lamp holder body made of an insulating resin material, the lamp holder body being integrally formed with the heat sink and provided with a connector portion electrically connected to the circuit board via a lead terminal, The heat sink comprises a base, a protrusion protruding from the front surface side of the base, a plurality of heat sinks, and a protrusion, wherein the plurality of heat sinks protrude from the rear surface side of the base in a longitudinal plate shape in a state arranged in a width direction, and the protrusion is located around the protrusion and protrudes from the front surface side of the base. The plurality of heat sinks include a plurality of first heat sinks located above the connector portion and second heat sinks located on both sides of the connector portion and the first heat sinks in the width direction. The first heat sink is extended to at least above the connector portion and further rearward than the rear end of the connector portion. The second heat sink is arranged so that at least a part of a side portion of the connector portion is exposed. The lamp holder body has a base, a tube wall portion protruding forward from the front surface side of the base, and a through hole that penetrates the inner side of the tube wall portion and the base in the front-rear direction. The heat sink and the lamp holder body are integrated in a state where the protrusion and the convex portion are fitted into the through hole and the base portions thereof are butted against each other. The front end of the protrusion exposed from the through hole forms a surface continuous with the front surface of the base on the lamp holder body side, thereby constituting a part of the substrate mounting portion. The circuit board is thermally connected to the heat sink via the protrusion.
2. The vehicle lamp light source unit according to claim 1, wherein: The second heat sink has a cutout portion that exposes at least a portion of a side portion of the connector portion.
3. The vehicle lamp light source unit according to claim 2, wherein: The second heat sink is extended to have the same length as that of the first heat sink.
4. The vehicle lamp light source unit according to any one of claims 1 to 3, characterized in that: The first heat sink among the plurality of heat sinks is located at least on an extension line of a position facing the light emitting element.
5. The vehicle lamp light source unit according to claim 1, wherein: At least a portion of the plurality of heat dissipation fins is provided so as to protrude upward from the periphery of the base portion.
6. A vehicle lamp, characterized in that: The vehicle lamp includes the vehicle lamp light source unit according to any one of claims 1 to 5.
Citation Information
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