A method for sealing a camera module bracket

Abstract

The present invention relates to the technical field of camera module manufacturing process, and in particular to a method for sealing a camera module bracket, the method comprising: arranging dense metal components on a circuit board to form a dense metal component area, and forming a glue drawing area surrounding the dense metal component points at the edges of the circuit board, spraying glue in the dense metal component area to form a barrier glue layer, and the edge of the dense metal component is close to the glue drawing area of ​​the bracket for sealing the module; baking the barrier glue layer at a preset temperature for a preset time, and then forming a barrier glue layer by spraying glue in advance at a position prone to capillary phenomenon, and when applying glue in the later stage, due to the existence of the barrier glue layer, the phenomenon of glue overflow after applying glue on the edge of the board is avoided, thereby improving the product quality of the camera module.

Description

Technical Field

[0001] The present invention relates to the technical field of camera module manufacturing process, and in particular to a method for sealing a camera module bracket. Background Art

[0002] In order to increase the pixel of the camera module, more metal components need to be placed on the circuit board. In a limited space, the gaps between the metal components need to be reduced and the metal components need to be placed closer to the edge of the circuit board. Figure 1 The area indicated by the frame line is shown.

[0003] When glue is applied to the edge of the circuit board to achieve connection with the module bracket, these gaps are prone to capillary phenomena, which in turn reduces the amount of glue in the glue-applied area. Cracks or voids are likely to appear after connection with the module bracket, affecting product quality.

[0004] Therefore, how to improve the product quality of camera modules is a technical problem that needs to be solved urgently. Summary of the invention

[0005] In view of the above problems, the present invention is proposed to provide a method for sealing a camera module bracket that overcomes the above problems or at least partially solves the above problems.

[0006] The present invention provides a method for sealing a camera module bracket, comprising:

[0007] Dense metal components are arranged on the circuit board to form a dense metal component area, and the edges of the circuit board form a glue drawing area surrounding the dense metal components;

[0008] Spraying glue in the area of ​​the dense metal components to form a barrier glue layer, wherein the edge of the dense metal components is close to the glue drawing area of ​​the bracket for sealing the module;

[0009] The barrier adhesive layer is baked at a preset temperature for a preset time.

[0010] Furthermore, the metal components are specifically capacitors and chips.

[0011] Furthermore, the area of ​​dense metal components includes:

[0012] The second gap region is formed between adjacent metal components close to the glue drawing area, and / or the first gap region is formed between the edge of the dense metal components and the glue drawing area of ​​the support of the sealing module.

[0013] Furthermore, after spraying glue in the area with dense metal components to form a barrier glue layer, the method further includes:

[0014] Using laser to separate the circuit board into individual products;

[0015] Packaging a wafer on the circuit board, and connecting the wafer to the circuit board using a gold wire;

[0016] A support for the glue sealing module is provided in the glue drawing area.

[0017] Furthermore, before spraying glue in the area with dense metal components to form a barrier glue layer, the method further includes:

[0018] Using laser to separate the circuit board into individual products;

[0019] A wafer is packaged on the circuit board, and the wafer is connected to the circuit board using a gold wire.

[0020] Furthermore, after spraying glue in the area with dense metal components to form a barrier glue layer, the method further includes:

[0021] A support for the glue sealing module is provided in the glue drawing area.

[0022] Further, spraying glue in the area with dense metal components to form a barrier glue layer includes:

[0023] A three-axis dispensing machine is used to spray glue in areas with dense metal components to form a barrier glue layer.

[0024] Furthermore, after the support of the sealing module in the painting glue area, it also includes:

[0025] A lens group and a motor are assembled on the bracket.

[0026] Furthermore, the preset temperature is 75° C. to 95° C., and the preset time is 60 min to 90 min.

[0027] Furthermore, the circuit board is specifically an FPC board or a PCB board.

[0028] One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0029] The present invention provides a method for sealing a camera module bracket, comprising: arranging dense metal components on a circuit board to form a dense metal component area, and forming a glue drawing area surrounding the dense metal components at the edges of the circuit board; spraying glue in the dense metal component area to form a barrier glue layer, the edge of the dense metal component is close to the glue drawing area of ​​the bracket for sealing the module; baking the barrier glue layer at a preset temperature for a preset time, and then forming a barrier glue layer by spraying glue in advance at a position prone to capillary phenomena, and forming the barrier glue layer when glue is drawn later. Due to the existence of the barrier glue layer, the phenomenon of glue overflow after glue drawing in the glue drawing area at the edge of the board is avoided, thereby improving the product quality of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Also, throughout the accompanying drawings, the same reference figures are used to represent the same components. In the drawings:

[0031] Figure 1 A schematic diagram showing the metal components of the structure of a camera module in the prior art;

[0032] Figure 2 A schematic diagram showing the steps of a method for sealing a camera module bracket according to an embodiment of the present invention is shown;

[0033] Figure 3 A first type of gap region in a region of densely packed metal components in an embodiment of the present invention is shown;

[0034] Figure 4 A second type of gap region in an area of ​​densely packed metal components is shown in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0036] Embodiment 1

[0037] An embodiment of the present invention provides a method for sealing a camera module bracket, such as Figure 2 As shown, including:

[0038] S201, arranging dense metal components on the circuit board to form a dense metal component area, and forming a glue drawing area surrounding the dense metal components at the edges of the circuit board;

[0039] S202, spraying glue in the dense metal component area to form a barrier glue layer, where the edge of the dense metal component is close to the glue drawing area of ​​the bracket used to seal the module;

[0040] S203, baking the barrier adhesive layer at a preset temperature for a preset time.

[0041] The metal components are specifically capacitors, chips, etc.

[0042] In order to solve the above-mentioned problem of glue overflow, in an embodiment of the present invention, the step of forming a barrier glue layer on the circuit board can be performed during the surface mount technology (SMT) stage, or before sealing the support of the module.

[0043] The steps of forming the barrier adhesive layer in the surface pasting technology stage are described in detail below.

[0044] First, S201, dense metal components are arranged on the circuit board to form a dense metal component area, specifically chips and capacitors are arranged, and the dense chips and capacitors are increased so that these metal components are closer to the glue area of ​​the bracket used for sealing the module on the limited circuit board, thereby reducing the gap between the edge of the glue area and the nearest metal components. The glue area is arranged on the four edges of the circuit board, surrounding the dense metal components, and is used for the bracket of the sealing module, and the bracket is used to support the lens group.

[0045] Next, S202 is executed to spray glue in the dense metal component area to form a barrier glue layer, where the edge of the dense metal component is close to the glue drawing area of ​​the bracket for sealing the module. Specifically, the barrier glue layer is arranged in the second gap area formed between adjacent metal components close to the glue drawing area, or in the first gap area formed between the edge of the dense metal component and the glue drawing area of ​​the sealing bracket, and more preferably, it is arranged in the first gap area and the second gap area.

[0046] By determining the glue spraying points, glue is sprayed according to the glue spraying points, so as to form a barrier glue layer between adjacent metal components close to the glue drawing area and between the edges of dense metal components and the glue drawing area.

[0047] Spraying glue in the second gap area fills the gaps between adjacent metal components. After spraying glue, the capillary phenomenon is blocked, so that the glue does not flow quickly to the second gap area. Spraying glue in the first gap area forms a retaining wall between the edge of the dense metal components and the glue drawing area of ​​the sealing bracket. When glue is applied in the glue drawing area, the glue will not overflow and reduce the amount of glue in the glue drawing area, thereby ensuring the amount of glue for the sealing bracket.

[0048] Specific as Figure 3 , Figure 4 As shown, Figure 3 The frame line refers to the narrow gap 301 between the metal component 303 and the glue drawing area 302, that is, the first gap area. Figure 4 The frame line refers to the narrow gap 401 between adjacent metal components 303 near the glue drawing area 302, that is, the second gap area. These narrow gaps are prone to capillary phenomena. By forming a barrier glue layer and a retaining wall, the glue overflow is avoided when drawing the glue line.

[0049] The glue spraying in S202 is specifically performed by using inherent equipment in the STM process technology, which will not be described in detail here.

[0050] After S202, S203 is executed: the barrier adhesive layer is baked at a preset temperature for a preset time.

[0051] Specifically, the preset temperature is 75° C. to 95° C., preferably 80° C., and the preset duration is 60 min to 90 min, preferably 1 hour.

[0052] The barrier glue layer is baked by placing the entire circuit board into a baking device to solidify the barrier glue layer into a shape, thereby avoiding the influence of subsequent processes on the barrier glue layer.

[0053] Next, the subsequent processes can be continued: the circuit board is separated by laser to form a single product, that is, laser separation; then, the wafer is packaged on the circuit board and the wafer is connected to the circuit board with gold wire, that is, the wafer welding (Die Bond, DB) station operation and the gold wire welding (Wire Bond, WB) station operation. Next, glue is applied in the glue drawing area to seal the bracket of the module, that is, glue lines are applied in the glue drawing area to seal the bracket (holder), that is, the bracket welding (Holder Mount, HM) station operation. In this way, the camera module's bracket sealing operation is completed.

[0054] After sealing the bracket, it also includes: assembling the lens group and the motor on the bracket, that is, the module alignment technology (Active Alignment, AA) workstation operation. For a fixed-focus camera module, it is only necessary to assemble the lens group on the bracket. For an automatic fixed-focus camera module, the lens group and the motor are assembled on the bracket.

[0055] The step of forming the barrier adhesive layer before sealing the stent is described in detail below.

[0056] First, S201, dense metal components are arranged on the circuit board, that is, the SMT station operation, to form a dense metal component area, and a glue drawing area surrounding the dense metal components is formed on the edges of the circuit board; then, the circuit board is separated by laser to form individual products, that is, laser separation; then, the wafer is packaged on the circuit board, and the wafer is connected to the circuit board with gold wire, that is, the wafer welding station operation and the gold wire welding station operation.

[0057] Next, S202 is performed to spray glue in the dense metal component area to form a barrier glue layer. The edge of the dense metal component is close to the glue painting area of ​​the bracket used for sealing the module.

[0058] Specifically, the barrier glue layer is arranged in the second gap region formed between adjacent metal components near the glue drawing area, or in the first gap region formed between the edge of the dense metal component and the glue drawing area of ​​the sealing bracket, and more preferably arranged in the first gap region and the second gap region. By determining the glue spraying point, glue is sprayed according to the glue spraying point, so as to form a barrier glue layer between adjacent metal components near the glue drawing area and between the edge of the dense metal component and the glue drawing area.

[0059] Spraying glue in the second gap area fills the gaps between adjacent metal components. After spraying glue, the capillary phenomenon is blocked, so that the glue does not flow quickly to the second gap area. Spraying glue in the first gap area forms a retaining wall between the edge of the dense metal components and the glue drawing area of ​​the sealing bracket. When glue is applied in the glue drawing area, the glue will not overflow and reduce the amount of glue in the glue drawing area, thereby ensuring the amount of glue for the sealing bracket.

[0060] Specific as Figure 3 , Figure 4 As shown, Figure 3 The frame line refers to the narrow gap 301 between the metal component 303 and the glue drawing area 302, that is, the first gap area. Figure 4The frame line refers to the narrow gap 401 between adjacent metal components 303 near the glue drawing area 302, that is, the second gap area. These narrow gaps are prone to capillary phenomena. By forming a barrier glue layer, a retaining wall is formed to avoid glue overflow when drawing the glue line.

[0061] In this solution, a three-axis dispensing machine is used to spray glue in the area with dense metal components to form a barrier glue layer.

[0062] Then, S203 is executed to bake the barrier adhesive layer at a preset temperature for a preset time.

[0063] The preset temperature is 75°C to 95°C, preferably 80°C, and the preset time is 60min to 90min, preferably 60min.

[0064] The barrier glue layer is baked by placing the entire circuit board into a baking device to solidify the barrier glue layer into a shape, thereby preventing the barrier glue layer from being affected by subsequent processes.

[0065] Next, glue is applied in the glue drawing area to seal the holder of the module, that is, glue lines are drawn in the glue drawing area 302 to seal the holder, that is, the holder welding station is operated. In this way, the holder of the camera module is sealed.

[0066] After the bracket is sealed, it also includes: assembling the lens group and the motor on the bracket, that is, the module centering technology station operation. For the fixed-focus camera module, it is only necessary to assemble the lens group on the bracket. For the automatic fixed-focus camera module, the lens group and the motor are assembled on the bracket.

[0067] The circuit boards in the above two solutions are specifically FPC boards or PCB boards, which are not limited here.

[0068] One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0069] The present invention provides a method for sealing a camera module bracket, comprising: arranging dense metal components on a circuit board to form a dense metal component area, and forming a glue drawing area surrounding the dense metal components at the edges of the circuit board; spraying glue in the dense metal component area to form a barrier glue layer, the edge of the dense metal component is close to the glue drawing area of ​​the bracket for sealing the module; baking the barrier glue layer at a preset temperature for a preset time, and then forming a barrier glue layer by spraying glue in advance at a position prone to capillary phenomena, and forming the barrier glue layer when glue is drawn later. Due to the existence of the barrier glue layer, the phenomenon of glue overflow after glue is drawn on the edge of the board is avoided, thereby improving the product quality of the camera module.

[0070] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0071] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for sealing a camera module bracket, characterized in that: include: Dense metal components are arranged on the circuit board to form a dense metal component area, and a glue drawing area surrounding the dense metal components is formed on the edges of the circuit board, wherein the dense metal components include a plurality of metal components; Spraying glue in the dense metal component area to form a barrier glue layer, the edge of the dense metal component is close to the glue drawing area of ​​the bracket for sealing the module, wherein the barrier glue layer is arranged in a first gap area formed between the edge of the dense metal component and the glue drawing area, and in a second gap area formed between adjacent metal components close to the glue drawing area, and the second gap area is filled; Baking the barrier adhesive layer at a preset temperature for a preset time; A glue line is drawn in the glue drawing area, and a support of the module is sealed in the glue drawing area.

2. The method according to claim 1, characterized in that The metal components are specifically capacitors and chips.

3. The method according to claim 1, characterized in that After spraying glue in the area of ​​dense metal components to form a barrier glue layer and before sealing the support of the module in the glue painting area, the method further includes: Using laser to separate the circuit board into individual products; A wafer is packaged on the circuit board, and the wafer is connected to the circuit board using a gold wire.

4. The method according to claim 1, characterized in that Before spraying glue in the area of ​​dense metal components to form a barrier glue layer, it also includes: Using laser to separate the circuit board into individual products; A wafer is packaged on the circuit board, and the wafer is connected to the circuit board using a gold wire.

5. The method according to claim 4, characterized in that Spray adhesive in areas with dense metal components to form a barrier layer, including: A three-axis dispensing machine is used to spray glue in areas with dense metal components to form a barrier glue layer.

6. The method according to claim 1, characterized in that After the support of the sealing module in the glue painting area, it also includes: A lens group and a motor are assembled on the bracket.

7. The method according to claim 1, characterized in that The preset temperature is 75° C. to 95° C., and the preset time is 60 min to 90 min.

8. The method according to claim 1, characterized in that The circuit board is specifically an FPC board or a PCB board.

Images