Chuck device for cleaning equipment and cleaning equipment

Abstract

The present invention provides a chuck device of a cleaning device and a cleaning device, wherein the chuck device comprises: a chuck body, a nozzle, a gas supply pipeline and a mounting assembly; wherein a mounting hole is provided at the bottom of the chuck body, the nozzle is arranged in the mounting hole and is not connected to the chuck body; a second gas channel for conveying gas to a first gas channel is provided inside the nozzle; the mounting assembly for installing the nozzle comprises a straight-through pipe, the gas supply pipeline is provided in the straight-through pipe; an annular slit is formed between the outer circumference of the straight-through pipe and the inner circumference of the mounting hole; a third gas channel is also provided inside the nozzle, the gas inlet of the third gas channel is connected to the gas supply pipeline; the gas outlet of the third gas channel is arranged toward a side away from the bearing surface and corresponds to the top end of the annular slit, for ventilating the annular slit, so as to prevent back suction by utilizing the downward airflow, thereby preventing the gas blown onto the surface of the wafer from carrying tiny particles, thereby ensuring the yield of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor process equipment, and in particular to a chuck and a cleaning device using the chuck. Background Art

[0002] In the semiconductor manufacturing process, a back cleaning process is usually required to remove excess materials such as photoresist attached to the back and sides of the wafer, so as to ensure the overall cleanliness of the wafer and the accuracy of subsequent processes. At present, the back cleaning machine used in the back cleaning process usually includes a Bernoulli chuck. The front of the wafer faces the chuck, and the cleaning equipment is used to clean the back of the wafer. The front of the wafer is generally the surface that has undergone the previous process, or the surface to be processed as the subsequent process. The Bernoulli chuck can blow air to the surface of the wafer placed on it to form a high-speed airflow between the wafer and the Bernoulli chuck, and the wafer can be limited and fixed by the clamping parts on the chuck. According to the principle of the Bernoulli effect: when the fluid speed increases, the pressure on the interface where the object contacts the fluid will decrease. It can be seen that the Bernoulli chuck can hold the wafer while keeping a certain distance between the wafer and the Bernoulli chuck, that is, the wafer is suspended above the Bernoulli chuck to avoid scratching the front of the wafer.

[0003] However, in the existing Bernoulli chuck, the air flow delivered to the nozzle will inevitably carry tiny particles. This will cause the tiny particles to remain on the surface of the wafer when the Bernoulli chuck blows air directly to the front of the wafer, and even cause damage to the wafer surface, affecting the wafer yield. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a chuck device and a cleaning device for a cleaning device, which can prevent the gas blown onto the surface of the wafer from carrying tiny particles, thereby ensuring the yield of the wafer.

[0005] In order to achieve the purpose of the present invention, a chuck device for a cleaning device is provided, comprising a chuck body, the chuck body having a bearing surface for bearing a wafer; a first gas channel is provided inside the chuck body, and a gas outlet of the first gas channel is provided on the bearing surface for ventilating the wafer. The chuck device also comprises: a nozzle, a gas supply pipeline and a mounting assembly; wherein,

[0006] A mounting hole is provided in the chuck body, and the nozzle is provided in the mounting hole and is not connected to the chuck body; a second gas channel is provided inside the nozzle, a gas outlet of the second gas channel is communicated with a gas inlet of the first gas channel, and the gas inlet of the second gas channel is communicated with the gas supply pipeline to deliver gas to the first gas channel;

[0007] The mounting assembly is used to mount the nozzle in the mounting hole; the mounting assembly comprises a straight pipe, the top end of which is connected to the nozzle and is located in the mounting hole, and the air supply pipeline is located in the straight pipe; an annular slit is formed between the outer circumference of the straight pipe and the inner circumference of the mounting hole;

[0008] A third gas channel is also provided inside the nozzle, and an air inlet of the third gas channel is connected to the air supply pipeline; an air outlet of the third gas channel is arranged toward a side away from the bearing surface and corresponding to the top end of the annular slit, so as to ventilate the annular slit.

[0009] Optionally, the air inlet of the third gas channel is communicated with the second gas channel, and the air outlet of the third gas channel is lower than the air inlet.

[0010] Optionally, the second gas channel includes a plurality of second sub-channels extending in an inclined direction; the gas inlets of the plurality of second sub-channels are all connected to the gas supply pipeline, and the gas outlets of the plurality of second sub-channels are evenly distributed on the upper surface of the nozzle;

[0011] The third gas channel includes a third sub-channel arranged in one-to-one correspondence with each of the second sub-channels; and an air inlet of each third sub-channel is communicated with the corresponding second sub-channel.

[0012] Optionally, the angle between the axis of the third sub-channel and the vertical direction is in the range of 40° to 50°, and the aperture of the third sub-channel is in the range of 1 mm to 2 mm.

[0013] Optionally, the chuck further comprises a driving assembly; the driving assembly has an annular power output end;

[0014] The power output end is connected to the chuck body through the mounting assembly to drive the chuck body to rotate; the power output end is arranged around the straight-through pipe and is not connected to the straight-through pipe, so that the straight-through pipe and the nozzle do not rotate with the chuck body.

[0015] Optionally, the mounting assembly further comprises a sealing component and a bearing component; the sealing component is respectively sealed and connected to the chuck body and the power output end; the sealing component is arranged around the straight-through pipe;

[0016] The bearing component is located between the straight-through pipe and the power output end, and is respectively connected to the straight-through pipe, the sealing component and the power output end, so that the sealing component and the power output end can rotate relative to the straight-through pipe.

[0017] Optionally, the sealing component includes a first sealing member and a second sealing member, the first sealing member and the second sealing member are respectively sealed and connected to the top end and the bottom end of the power output end, and the first sealing member is sealed and connected to the chuck body;

[0018] The bearing component includes a first bearing and a second bearing, and the first bearing and the second bearing are respectively arranged corresponding to the first seal and the second seal.

[0019] Optionally, at least one first vent hole is formed on a side surface of the straight-through pipe, and each first vent hole is located between the first sealing member and the second sealing member;

[0020] At least one second vent hole communicating with the atmospheric environment is formed at the bottom of the straight-through pipe.

[0021] Optionally, the inner circumferential surface of the first sealing member and / or

[0022] The position where the outer circumference of the straight pipe is opposite to the inner circumference of the mounting hole, and / or

[0023] A labyrinth structure is arranged on the outer peripheral surface of the nozzle.

[0024] Optionally, the labyrinth structure includes an annular groove and an annular protrusion, and the annular groove and the annular protrusion are arranged in a direction parallel to the axis of the straight-through pipe and are alternately disposed.

[0025] As another technical solution, an embodiment of the present invention further provides a cleaning device, which includes a chuck device as described in any of the above embodiments.

[0026] The present invention has the following beneficial effects:

[0027] The chuck device of the cleaning equipment provided by the present invention comprises a chuck body, a nozzle and a gas supply pipeline. The nozzle is provided with a second gas channel which is connected to the first gas channel and the gas supply pipeline in the chuck body respectively, so that the gas flows through the gas supply pipeline, the nozzle and the first gas channel in sequence, and finally blows to the surface of the wafer, thereby utilizing the Bernoulli effect generated by the airflow between the wafer and the chuck body to suspend the wafer above the carrying surface.

[0028] A third gas channel is opened inside the nozzle, and the air inlet of the third gas channel is also connected to the air outlet connected to the gas supply pipeline. The air outlet of the third gas channel faces the annular slit between the outer circumference of the straight tube and the inner circumference of the mounting hole, so that air can be ventilated to the annular slit, thereby utilizing the downward airflow to block the gas carrying tiny particles flowing out of the annular slit from entering the gas channel inside the chuck body, thereby preventing the tiny particles from contacting the wafer surface and ensuring the wafer yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of a Bernoulli chuck in the prior art;

[0030] Figure 2 A schematic structural diagram of a chuck device of a cleaning device provided in an embodiment of the present invention;

[0031] Figure 3 A partially enlarged schematic diagram of a chuck device provided in an embodiment of the present invention;

[0032] Figure 4 Another partially enlarged schematic diagram of a chuck device provided in an embodiment of the present invention;

[0033] Figure 5 A cross-sectional view and a stereoscopic view of a nozzle in a chuck device provided by an embodiment of the present invention;

[0034] Figure 6 A cross-sectional view and a stereoscopic view of a straight-through pipe in a chuck device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the chuck device of the cleaning equipment provided by the present invention and the cleaning equipment using the chuck device are described in detail below with reference to the accompanying drawings.

[0036] like Figure 1 As shown, the Bernoulli chuck device used in the existing back cleaning equipment generally includes: a chuck device body 01 for carrying a wafer, a Bernoulli gas supply pipe 02, a Bernoulli nozzle 04, a screw 03, a straight pipe 05, a switching shaft 06 and a motor 07. The Bernoulli gas supply pipe 02 is connected to the Bernoulli nozzle 04, and is used to deliver gas to the Bernoulli nozzle 04, so as to blow gas to the inner cavity of the chuck body 01 through the Bernoulli nozzle 04, thereby blowing gas to the surface of the wafer placed on the chuck body 01, and using the Bernoulli effect generated by the airflow between the wafer and the chuck body 01 to suspend the wafer. The chuck body 01 and the adapter shaft 06 are fixedly connected by screws 03, and the motor 07 is connected to the adapter shaft 06; and the straight tube 05 and the adapter shaft 06 are connected by bearings, so that when the motor 07 drives the adapter shaft 06 to drive the chuck body 01 to rotate, the straight tube 05 will not rotate therewith, thereby ensuring that the Bernoulli nozzle 04 connected to the straight tube 05 will not rotate therewith.

[0037] As mentioned above, since the Bernoulli nozzle 04 and the straight tube 05 do not rotate with the chuck body 01, there is a gap between the outer circumference of the Bernoulli nozzle 04 and the straight tube 05 and the corresponding surface of the chuck body 01, so as to avoid severe friction with the outer circumference of the Bernoulli nozzle 04 and the straight tube 05 when the chuck body 01 rotates relative to the Bernoulli nozzle 04 and the straight tube 05; similarly, there is also a gap between the outer circumference of the straight tube 05 and the adapter shaft 06 and the motor 07, and the gap is connected to the aforementioned gap; and, as Figure 1 As shown, the two gaps are connected to the internal cavity of the chuck body 01. However, when the Bernoulli nozzle 04 delivers gas to the internal cavity of the chuck body 01, the airflow inside the internal cavity of the chuck body 01 will also produce a Bernoulli effect, so the internal cavity of the chuck body 01 will produce a certain suction force on the gap connected to it, and extract the gas in the gap into the internal cavity of the chuck body 01, which will cause the gas in the gap to carry a certain amount of tiny particles into the internal cavity of the chuck body 01, and then blow to the surface of the wafer, causing the tiny particles to remain on the surface of the wafer, affecting the yield rate of the wafer.

[0038] Please refer to Figure 2 In order to solve the above technical problems, the present embodiment provides a chuck device for cleaning equipment, which also includes a chuck body 1, and the chuck body 1 has a bearing surface for bearing a wafer; a first gas channel 11 is opened inside the chuck body 1, and the gas outlet of the first gas channel 11 is opened on the bearing surface, so as to blow air to the wafer, so that the wafer is suspended on the bearing surface after there is airflow between the wafer and the chuck body 1. Specifically, Figure 2 As shown, the chuck body 1 includes a base 13, a substrate 14 disposed on the base 13, and a cover plate 15 disposed on the substrate 14; wherein the upper surface of the cover plate 15 is used as the above-mentioned bearing surface; the above-mentioned first gas channel 11 is formed between the surfaces opposite to the cover plate 15 and the substrate 14, so the shape of the first gas channel 11 depends on the shape of the lower surface of the cover plate 15 and the shape of the upper surface of the substrate, as shown in FIG. Figure 2 Taking the chuck body shown in FIG. 1 as an example, the first gas channel 11 is generally in the shape of a disk with an edge bent upward; and Figure 2 As shown, the gas outlet of the first gas channel 11 is located in the edge region of the support surface.

[0039] The chuck device provided in this embodiment also includes: a nozzle 2, an air supply pipeline 3 and a mounting assembly; wherein, Figure 2 As shown, a mounting hole 12 is provided in the chuck body 1, and the nozzle 2 is provided in the mounting hole 12 and is not connected to the chuck body 1. Specifically, as Figure 2As shown, the opening of the mounting hole 12 is located at the bottom of the chuck body 1 and in the central area of ​​the chuck body 1. The mounting assembly is arranged around the air supply pipeline 3 and the nozzle 2, and is connected to the nozzle 2 and the chuck body 1 respectively, for mounting the nozzle in the mounting hole 12.

[0040] The mounting assembly includes a straight tube 5 arranged around the air supply pipeline 3 and the nozzle 2. The top end of the straight tube 5 is connected to the nozzle and is located in the mounting hole 12 to fix the nozzle 2 and protect the air supply pipeline 3 at the same time. In order to realize that the nozzle is located in the mounting hole 12 and is not connected and fixed to the chuck body 1, the straight tube 5 is also connected and fixed to the non-mounting hole, and an annular slit is formed between the outer circumference of the straight tube 5 and the inner circumference of the mounting hole 12.

[0041] like Figure 3 As shown, a second gas channel 21 is opened inside the nozzle 2, and the gas outlet of the second gas channel 21 is connected to the gas inlet of the first gas channel 11 in the chuck body 1. Specifically, there is a gap between the top surface of the nozzle 2 and the bottom surface of the above-mentioned cover plate 15 so as to be connected with the first gas channel 11; the gas inlet of the second gas channel 21 is connected to the gas supply pipeline 3 to transport gas to the first gas channel 11.

[0042] like Figure 3 As shown, a third gas channel 22 is also provided inside the nozzle 2, and the air inlet of the third gas channel 22 is connected to the air supply pipeline 3. The air outlet of the third gas channel 22 faces the side away from the bearing surface so as to be able to deliver an oblique downward airflow outward; and, it is arranged corresponding to the top of the above-mentioned annular slit so as to deliver the downward airflow into the annular slit. Thus, the upward airflow from the annular slit can be blocked, thereby preventing the gas in the annular slit from carrying tiny particles into the first gas channel 11 in the chuck body 1, thereby greatly reducing the risk of tiny particles remaining on the surface of the wafer and ensuring the wafer yield.

[0043] It should be noted that the above “arranged corresponding to the top of the annular slit” is not limited to the outlet of the third gas channel 22 being precisely opposite to the top of the annular slit, and the outlet can be arranged in a manner that satisfies the requirement that the airflow outputted from the outlet of the third gas channel 22 can pass into the annular slit. Figure 4 Taking the chuck device shown as an example, the gas outlet of the third gas channel 22 is arranged toward the inner circumference of the mounting hole 12, so that the oblique downward gas flow continues to flow downward after colliding with the inner circumference of the mounting hole 12 and flows into the annular slit.

[0044] In some embodiments, the air inlet of the third gas channel 22 is connected to the second gas channel 21, and the air outlet of the third gas channel 22 is lower than the air inlet, that is, the third gas channel 22 is tilted downward to guide the airflow inside the third gas channel 22 obliquely downward.

[0045] In some embodiments, Figure 5 As shown, the second gas channel 21 includes a plurality of second sub-channels extending in an inclined direction; the gas inlets of the plurality of second sub-channels are all connected to the gas supply pipeline 3, and the gas outlets of the plurality of second sub-channels are evenly distributed on the upper surface of the nozzle 2; in some preferred embodiments, as Figure 5 As shown, the second gas channel 21 also includes a central sub-channel coaxially arranged with the nozzle; the air inlet of the second gas channel 21 is opened at the bottom of the nozzle and is connected to the gas supply pipeline 3; the air inlets of multiple second sub-channels gather at the air outlet of the central sub-channel and are connected thereto.

[0046] The third gas channel 22 includes a third sub-channel arranged in one-to-one correspondence with each of the above-mentioned second sub-channels; the air inlet of each third sub-channel is connected to the corresponding second sub-channel. Figure 5 Taking the nozzle shown as an example, the third sub-channel is connected to the middle of the second sub-channel, so that when the airflow flows to the connection point between the two, it is divided into an oblique upward airflow and an oblique downward airflow.

[0047] In some preferred embodiments, the angle between the axis of the third sub-channel and the vertical direction is in the range of 40° to 50°, and the aperture of the third sub-channel is in the range of 1 mm to 2 mm.

[0048] In some preferred embodiments, Figure 5 As shown, the nozzle 2 includes a substantially columnar jet portion 23 and a connecting portion 24, wherein the outer diameter of the jet portion 23 is larger than the outer diameter of the connecting portion 24; the inner circumference of the straight tube 5 surrounds the connecting portion 24, and the top surface of the straight tube 5 abuts against the bottom surface of the jet portion 23 to provide support for the nozzle 2 in the axial direction and is sealed and connected to the nozzle 2 in the circumferential direction. On this basis, preferably, as Figure 3 and Figure 5 As shown, after the nozzle 2 is matched with the straight pipe 5, the outer edge of the bottom surface of the jet portion 23 is opposite to the junction between the straight pipe 5 and the inner circumferential surface of the mounting hole 12. Therefore, the gas outlet of the third gas channel 22 can be opened at the outer edge of the bottom surface of the jet portion 23 to allow the airflow to flow into the annular slit between the straight pipe and the mounting hole 12.

[0049] In some embodiments, Figure 2 As shown, the chuck device also includes a driving assembly 4, which has an annular power output end 41. The power output end 41 is connected to the chuck body through a mounting assembly to drive the chuck body to rotate. The power output end 41 is arranged around the straight-through pipe 5, but is not connected to the straight-through pipe 5, so that the straight-through pipe 5 and the nozzle 2 do not rotate with the chuck body 1.

[0050] In some embodiments, the mounting assembly further includes a sealing component 6 and a bearing component 7; wherein the sealing component is sealedly connected to the chuck body 1 and the power output end 41, respectively; the sealing component is arranged around the straight-through pipe 5; the bearing component 7 is located between the straight-through pipe 5 and the power output end 41, and is respectively connected to the straight-through pipe 5, the sealing component 6 and the power output end 41, so that the sealing component 6 and the power output end 41 can rotate relative to the straight-through pipe 5, so that the straight-through pipe 5 can remain stationary when the chuck body 1 rotates.

[0051] In some embodiments, the sealing component 6 includes a first sealing member 61 and a second sealing member 62, the first sealing member 61 and the second sealing member 62 are respectively sealed and connected to the top and bottom ends of the power output end 41; and the first sealing member 61 is sealed and connected to the chuck body 1. Figure 4 As shown, an annular slit extending from the top of the first seal 61 to the bottom of the second seal 62 is also formed between the first seal 61, the second seal 62, the power output end 41 and the outer peripheral surface of the straight pipe 5, and as shown in FIG. Figure 4 As shown, the annular slit is connected to the annular slit formed between the outer circumference of the straight pipe 5 and the inner circumference of the mounting hole 12. Therefore, when the third gas channel 22 of the nozzle 2 transports a downward airflow to the top of the annular slit, the downward airflow will further flow into the annular slit below.

[0052] like Figure 3 As shown, the bearing component 7 includes a first bearing 71 and a second bearing 72, and the first bearing 71 and the second bearing 72 are respectively arranged corresponding to the first seal 61 and the second seal 62, so that the power output end 41 can drive the chuck body 1 to rotate around its own axis through the first seal 61. In this way, the first bearing 71 and the second bearing 72 are respectively arranged at both ends of the power output end 41, so as to be able to evenly apply supporting force to the straight pipe 5 and the power output end 41.

[0053] In some specific embodiments, Figure 3 As shown, the above-mentioned first sealing member 61 includes a first sleeve 611, which has a first boss protruding from the outer peripheral surface; the first sleeve 611 is arranged around the straight-through pipe 5 and is not connected thereto; the outer peripheral surface of the first sleeve 611 is connected to a portion of the inner peripheral surface of the mounting hole 12, and the upper surface of the first boss is connected to the bottom surface of the chuck body 1.

[0054] The above-mentioned first sealing member 61 also includes a second sleeve 612, which has a second boss protruding from the outer peripheral surface. The second sleeve 612 is arranged around the straight-through pipe 5 and is not connected thereto; the outer peripheral surface of the second sleeve 612 is connected to a portion of the inner peripheral surface of the power output end 41, the upper surface of the second boss is sealingly connected to the first boss, and the lower surface of the second boss is connected to the upper end surface of the power output end 41.

[0055] The sealing component 6 also includes a second seal 62 arranged at the bottom of the power output end 41, and the second seal 62 includes a third sleeve having a third boss protruding from the outer peripheral surface; the third sleeve is arranged around the straight-through pipe 5, and the top surface of the third sleeve is used to support the second bearing 72; the upper surface of the third boss is connected to the bottom surface of the power output end 41, and specifically, the third boss is fixed to the bottom surface of the power output end 41 by screws.

[0056] The outer circumferences of the first bearing 71 and the second bearing 72 are connected to the power output end 41, and the inner circumferences are connected to the outer circumference of the straight pipe 5, so that the straight pipe 5 does not rotate when the driving assembly 4 drives the chuck body 1 to rotate. Figure 3 As shown, a first step protruding outward is provided at a position corresponding to the straight-through pipe 5 and the first bearing 71, and the bottom surface of the first step abuts against the top surface of the inner ring of the first bearing 71; a second step protruding outward is provided on the inner circumferential surface of the power output end 41, and the top surface of the second step abuts against the bottom surface of the outer ring of the first bearing 71, thereby cooperating with the first step to fix the first bearing 71 together; the bottom surface of the second step abuts against the top surface of the outer ring of the second bearing 72; the top surface of the above-mentioned third sleeve abuts against the bottom surface of the inner ring of the second bearing 72, thereby cooperating with the second step to fix the second bearing 72 together.

[0057] As described above, the first seal 61, the second seal 62, the annular slit between the power output end 41 and the outer circumference of the straight tube 5, and the annular slit between the outer circumference of the straight tube 5 and the inner circumference of the mounting hole 12 are connected. Since the airflow from the third gas channel 22 into the annular slit is continuously downward, if the two annular slits are completely sealed, the air pressure in the annular slit will increase, and even cause the gas to flow back into the first gas channel 11 in the chuck body 1. In order to avoid this situation, in some preferred embodiments, such as Figure 3 and Figure 6 As shown, at least one first air vent 51 is provided on the side of the straight tube 5, and both are located between the first seal 61 and the second seal 62; specifically, the first air vent 51 is located in the middle of the straight tube 5; at least one second air vent 52 connected to the atmospheric environment is provided at the bottom of the straight tube 5; in this way, the annular slit between the outer circumference of the straight tube 5 and the inner circumference of the power output end 41, the internal space of the straight tube 5 and the atmospheric environment are interconnected, so that the outward output airflow of the third gas channel 22 can flow to the atmospheric environment unimpeded and continuously.

[0058] In some preferred embodiments, the number of the first ventilation holes 51 ranges from 1 to 4, and the hole diameter ranges from 3 mm to 6 mm.

[0059] In some embodiments, Figure 4As shown, a labyrinth structure 8 is provided on the inner circumference of the first sealing member 61. Specifically, the labyrinth structure 8 is provided on the inner circumference of the second sleeve 612. Moreover, in some embodiments, a labyrinth structure 8 is also provided at a position where the outer circumference of the straight-through pipe 5 is opposite to the inner circumference of the mounting hole 12, so that when the gas in the annular slit between the outer circumference of the straight-through pipe 5 and the inner circumference of the mounting hole 12 flows back, the tiny particles in the gas are prevented from entering the first gas channel 11. Moreover, in some embodiments, as Figure 4 As shown, a labyrinth structure 8 is also provided on the top of the outer surface of the nozzle 2 .

[0060] Specifically, the labyrinth structure 8 includes annular grooves and annular protrusions, which are arranged in a direction parallel to the axis of the straight-through pipe and are alternately arranged; Figure 4 As shown, a narrow channel with multiple bends can be formed between the concave-convex inner surface of the maze structure 8 and the flat outer peripheral surface of the straight tube 5 to further block tiny particles carried in the airflow, thereby preventing tiny particles from being instantly sucked into the first gas channel 11 by the suddenly increased suction force when the gas flow inside the first gas channel 11 suddenly increases.

[0061] As another technical solution, this embodiment also provides a cleaning device, which includes the above-mentioned chuck device for fixing the wafer to be cleaned. Specifically, the cleaning device also includes a clamping member, which can be a plurality of fixed pins, and an eccentric shaft is arranged on the top of the fixed pins. The plurality of fixed pins are located above the chuck device and distributed along the circumference of the chuck device. By rotating the fixed pins, the plurality of eccentric shafts cooperate to clamp the wafer suspended above the carrying surface.

[0062] The chuck device provided in this embodiment has a second gas channel connected to the first gas channel and the gas supply pipeline in the chuck body, respectively, in the nozzle, so that the gas flows through the gas supply pipeline, the nozzle and the first gas channel in sequence, and finally blows to the surface of the wafer, thereby utilizing the Bernoulli effect generated by the airflow between the wafer and the chuck body to make the wafer suspend above the bearing surface. A third gas channel is provided in the nozzle, and the air inlet of the third gas channel is also connected to the air outlet connected to the gas supply pipeline, and the air outlet of the third gas channel faces the annular slit between the outer circumference of the straight-through pipe and the inner circumference of the mounting hole, so that air can be ventilated to the annular slit, thereby utilizing the downward airflow to block the gas carrying tiny particles flowing out of the annular slit from entering the gas channel inside the chuck body, thereby preventing the tiny particles from contacting the wafer surface and ensuring the wafer yield.

[0063] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A chuck device of a cleaning device, comprising a chuck body, wherein the chuck body has a bearing surface for bearing a wafer; a first gas channel is provided inside the chuck body, and a gas outlet of the first gas channel is provided on the bearing surface for ventilating the wafer; characterized in that: The chuck device also includes: a nozzle, an air supply pipeline and a mounting assembly; wherein, A mounting hole is provided in the chuck body, and the nozzle is provided in the mounting hole and is not connected to the chuck body; a second gas channel is provided inside the nozzle, a gas outlet of the second gas channel is communicated with a gas inlet of the first gas channel, and the gas inlet of the second gas channel is communicated with the gas supply pipeline to deliver gas to the first gas channel; The mounting assembly is used to mount the nozzle in the mounting hole; the mounting assembly comprises a straight pipe, the top end of which is connected to the nozzle and is located in the mounting hole, and the air supply pipeline is located in the straight pipe; an annular slit is formed between the outer circumference of the straight pipe and the inner circumference of the mounting hole; A third gas channel is also provided inside the nozzle, and an air inlet of the third gas channel is connected to the air supply pipeline; an air outlet of the third gas channel is arranged toward a side away from the bearing surface and corresponding to the top end of the annular slit, so as to ventilate the annular slit.

2. The chuck device according to claim 1, characterized in that: The gas inlet of the third gas channel is communicated with the second gas channel, and the gas outlet of the third gas channel is lower than the gas inlet.

3. The chuck device according to claim 2, characterized in that: The second gas channel comprises a plurality of second sub-channels extending in an inclined direction; the gas inlets of the plurality of second sub-channels are all connected to the gas supply pipeline, and the gas outlets of the plurality of second sub-channels are uniformly distributed on the upper surface of the nozzle; The third gas channel includes a third sub-channel arranged in one-to-one correspondence with each of the second sub-channels; and an air inlet of each third sub-channel is communicated with the corresponding second sub-channel.

4. The chuck device according to claim 3, characterized in that: The angle between the axis of the third sub-channel and the vertical direction is in the range of 40° to 50°, and the aperture of the third sub-channel is in the range of 1 mm to 2 mm.

5. The chuck device according to claim 1, characterized in that: The chuck also includes a drive assembly; the drive assembly has an annular power output end; The power output end is connected to the chuck body through the mounting assembly to drive the chuck body to rotate; the power output end is arranged around the straight-through pipe and is not connected to the straight-through pipe, so that the straight-through pipe and the nozzle do not rotate with the chuck body.

6. The chuck device according to claim 5, characterized in that: The mounting assembly further comprises a sealing component and a bearing component; the sealing component is respectively sealed and connected to the chuck body and the power output end; the sealing component is arranged around the straight-through pipe; The bearing component is located between the straight-through pipe and the power output end, and is respectively connected to the straight-through pipe, the sealing component and the power output end, so that the sealing component and the power output end can rotate relative to the straight-through pipe.

7. The chuck device according to claim 6, characterized in that: The sealing component comprises a first sealing member and a second sealing member, wherein the first sealing member and the second sealing member are respectively sealed and connected to the top end and the bottom end of the power output end, and the first sealing member is sealed and connected to the chuck body; The bearing component includes a first bearing and a second bearing, and the first bearing and the second bearing are respectively arranged corresponding to the first seal and the second seal.

8. The chuck device according to claim 7, characterized in that: At least one first vent hole is formed on the side of the straight pipe and is located between the first sealing member and the second sealing member; At least one second vent hole communicating with the atmospheric environment is formed at the bottom of the straight-through pipe.

9. The chuck device according to claim 7, characterized in that: On the inner circumferential surface of the first sealing member, and / or The position where the outer circumference of the straight pipe is opposite to the inner circumference of the mounting hole, and / or A labyrinth structure is arranged on the outer peripheral surface of the nozzle.

10. The chuck device according to claim 9, characterized in that: The labyrinth structure comprises an annular groove and an annular protrusion, and the annular groove and the annular protrusion are arranged in a direction parallel to the axis of the straight-through pipe and are alternately disposed.

11. A cleaning device, characterized in that: Comprising a chuck device as described in any one of claims 1-10.

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