A fast temperature sensing panel with reliable structure and electromagnetic cooking device using the same

Abstract

The present invention discloses a structurally reliable rapid temperature sensing panel and an electromagnetic cooking utensil using the panel, comprising a panel body, a temperature sensor, a bottom cover and an insulating cover, wherein the panel body has a plurality of mounting holes penetrating from top to bottom, and the bottom of the mounting hole is provided with a step; the insulating cover and the temperature sensor are both in plurality, and the insulating cover is provided with a cavity inside, and the bottom of the cavity is open, and the temperature sensor is installed in each of the cavities one by one, and the temperature sensor is in close contact with the top of the cavity; the insulating cover is arranged in the mounting hole one by one, and the bottom surface of the insulating cover is against the step; the mounting hole and the cavity are respectively filled with a heat-conducting medium; the bottom cover is arranged on the bottom surface of the panel body, and closes the bottom opening of each of the mounting holes. The present invention has the advantages of sensitive temperature sensing and reliable structure.

Description

Technical Field

[0001] The invention relates to the technical field of electromagnetic cooking appliances, and in particular to a fast temperature sensing panel with reliable structure and an electromagnetic cooking appliance using the panel. Background Art

[0002] Since electromagnetic heating technology was applied to the cooking industry, temperature control has always been a big problem. The mainstream induction cooker structures are as follows:

[0003] The first structure: from top to bottom, there are pots, microcrystalline panels (about 4mm), and sensor components (including shells, insulation layers, sensors, and the location of the sensors is at the center of the coil disk). Since the microcrystalline panel is a flat structure, the sensor component is close to the bottom of the microcrystalline panel. The characteristic of this structure is that the temperature sensor is too far away from the pot. The temperature of the pot needs to be transferred to the 4mm thick microcrystalline panel first to make the microcrystalline panel heat up, and then the microcrystalline panel transfers the heat to the sensor, so there is a problem of too slow heat conduction. Normal home cooking generally requires a heating temperature not exceeding 280 degrees Celsius, but because it is impossible to sense the temperature quickly, the thinner pots may have burned red, but the sensor cannot sense the temperature. The results of this phenomenon are as follows: 1. Safety hazards, severe delayed temperature sensing, it is possible that the oil reaches the ignition point when the amount of oil is small, causing a fire; 2. Excessive oil temperature produces a large amount of aromatic hydrocarbons, which is seriously carcinogenic. 3. Chinese dishes have a poor taste.

[0004] The second structure: a hole is opened at the center of the microcrystalline glass relative to the coil disk, so that the temperature sensor assembly can directly contact the pot. The sensor assembly includes a shell, an insulating layer, and a sensor. The shell of the sensor is generally made of metal. When the pot is placed on top of the sensor, the metal shell is in an alternating magnetic field, which will cause it to heat up (under the pot of the induction cooker, all metals will heat up, and the closer to the pot, the faster the heat), thus causing the sensor to sense the temperature inaccurately; in addition, according to the requirements of safety regulations, an insulating layer is required under the shell of the sensor, which generally uses engineering plastics with a temperature resistance of about 350°C and poor thermal conductivity. The biggest disadvantage of this structure is that the shell will heat up and continue to accumulate heat. In addition, the heating of the shell will make it impossible to truly judge the temperature of the pot, so it is impossible to achieve a breakthrough in temperature sensing technology. At the same time, waterproofing and anti-aging also require additional costs.

[0005] The above two structures also have the following common disadvantages: In order to ensure that the sensor does not have leakage problems, a shell needs to be set outside the sensor, resulting in a large size of the sensor component, so a special assembly position needs to be designed on the coil disk. Considering the heating efficiency of the coil disk, it is usually designed at the center of the coil disk. The heat of electromagnetic heating is mainly concentrated on a ring with a diameter of about 90mm, so the sensor is too far away from the high temperature area and cannot accurately feedback the temperature. Almost all induction cooker manufacturers need to use their own induction cookers to conduct different pot heating experiments and record the temperature change curve. When the user uses it, it is compared with the recorded curve and the heating condition of the pot is evaluated. However, in actual use, the changes in pot quality, pot type, and ingredients are unpredictable, which makes the induction cooker unable to become a mainstream cooking tool. It is mainly used for boiling water, making hot pot, and cooking porridge. In terms of panel use, because it is impossible to accurately sense temperature, a higher temperature-resistant microcrystalline glass is required to reduce the risk of excessive heating, which also leads to the high cost of the induction cooker panel. Summary of the invention

[0006] The object of the present invention is to provide a fast temperature sensing panel with reliable structure and an electromagnetic cooking device using the same, so as to solve the above problems.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A fast temperature sensing panel with reliable structure comprises a panel body, a temperature sensor, a bottom cover and an insulating cover, wherein the panel body has a plurality of mounting holes penetrating from top to bottom, and a step is provided at the bottom of the mounting hole; the insulating cover and the temperature sensor are both in plurality, and a cavity is provided inside the insulating cover, and the bottom of the cavity is open, and the temperature sensor is installed in each of the cavities one by one, and the temperature sensor is tightly attached to the top of the cavity; the insulating cover is arranged in the mounting holes one by one, and the bottom surface of the insulating cover is against the step; the mounting holes and the cavities are respectively filled with heat-conducting medium; the bottom cover is arranged on the bottom surface of the panel body, and closes the bottom opening of each of the mounting holes.

[0009] Preferably, the top of the insulation cover is higher than the top surface of the panel body, and the top outer edge of the insulation cover is provided with an arc-shaped surface, and the arc-shaped surface is tangent to the top surface of the panel body.

[0010] Preferably, the top of the insulation cover is higher than the top surface of the panel body, the outer wall of the insulation cover is provided with a tapered surface, the bottom of the tapered surface is connected to the top surface of the panel body, and the angle between the tapered surface and the top surface of the panel body is an obtuse angle.

[0011] Preferably, the temperature sensor abuts against the top surface of the bottom cover.

[0012] Preferably, a boss is provided on the top surface of the bottom cover, and the bottom cover abuts against the temperature sensor via the boss.

[0013] Preferably, a groove is provided on the top surface of the bottom cover, the shape of the groove is adapted to the bottom shape of the temperature sensor, and the temperature sensor abuts against the groove.

[0014] Preferably, an elastic member is provided between the temperature sensor and the bottom cover, and the top of the elastic member abuts against the temperature sensor.

[0015] Preferably, the heat-conducting medium is one or more of thermal grease or temperature-resistant glue.

[0016] Preferably, the bottom cover is provided with threading holes corresponding one-to-one to the wires of the temperature sensor.

[0017] An electromagnetic cooking appliance uses the above-mentioned rapid temperature sensing panel with reliable structure.

[0018] The beneficial effects of one of the embodiments of the present invention are:

[0019] 1. By placing the temperature sensor in the mounting hole of the panel body, the temperature sensor can detect the temperature of the pot more sensitively and accurately;

[0020] 2. A bottom cover is provided on the bottom surface of the panel body to strengthen the panel body, thereby improving safety;

[0021] 3. The insulation cover can protect the temperature sensor and prevent it from being damaged due to impact;

[0022] 4. By setting steps in the mounting hole, the insulation cover can be provided with greater support force, so that the insulation cover can withstand greater impact force and the structure is more reliable;

[0023] 4. It can also play an insulating role without installing an additional shell, and can meet the requirements of safety regulations. Therefore, the volume of the temperature sensor is much smaller than that of the temperature sensor device of the traditional electromagnetic cooking appliance. The temperature sensor is almost completely embedded in the installation hole of the panel body, and only two connecting wires are passed through. There is no need to reserve space for the installation of the temperature sensor in the electromagnetic cooking appliance. The structure is more compact and the assembly of the temperature sensor is more flexible and free.

[0024] 5. Due to its ability to sense temperature quickly, the temperature resistance requirement of the panel body is reduced, and it can be replaced by borosilicate glass or flame-retardant engineering plastics. In the future, it may even be possible to use soda-lime glass as the panel body of the induction cooker, which can greatly reduce manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings further illustrate the present invention, but the contents in the accompanying drawings do not constitute any limitation to the present invention.

[0026] Figure 1 is a schematic diagram of the installation structure of a temperature sensor in one embodiment of the present invention;

[0027] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of AA;

[0028] Figure 3 is a schematic diagram of a top view of the structure of one embodiment of the present invention;

[0029] Figure 4 is a bottom view structural schematic diagram of one embodiment of the present invention;

[0030] Figure 5 is a schematic diagram of the installation structure of a temperature sensor according to another embodiment of the present invention;

[0031] Figure 6 is a schematic diagram of the installation structure of a temperature sensor according to another embodiment of the present invention;

[0032] Figure 7 is a schematic diagram of the installation structure of a temperature sensor according to another embodiment of the present invention;

[0033] Figure 8 is a schematic diagram of the installation structure of a temperature sensor according to another embodiment of the present invention;

[0034] Fig. 9 is a schematic diagram of the installation structure of a temperature sensor according to another embodiment of the present invention;

[0035] In the accompanying drawings: 1-panel body, 11-mounting hole, 12-step, 2-temperature sensor, 3-bottom cover, 31-boss, 32-groove, 33-threading hole, 4-insulating cover, 41-cavity, 42-arc surface, 43-conical surface, 5-heat conducting medium, 6-elastic member, α-angle. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present invention, “multiple” means two or more than two, and “several” means one or more than one, unless otherwise clearly and specifically defined.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0040] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0041] A structurally reliable rapid temperature sensing panel of the present embodiment comprises a panel body 1, a temperature sensor 2, a bottom cover 3 and an insulating cover 4, wherein the panel body 1 has a plurality of mounting holes 11 extending upward and downward, and a step 12 is provided at the bottom of the mounting hole 11; the insulating cover 4 and the temperature sensor 2 are both in plurality, and a cavity 41 is provided inside the insulating cover 4, and the bottom of the cavity 41 is open, and the temperature sensor 2 is installed in each of the cavities 41 in a one-to-one correspondence, and the temperature sensor 2 is tightly attached to the top of the cavity 41; the insulating cover 4 is arranged in the mounting hole 11 in a one-to-one correspondence, and the bottom surface of the insulating cover 4 is against the step 12; the mounting hole 11 and the cavity 41 are respectively filled with a heat-conducting medium 5; the bottom cover 3 is arranged on the bottom surface of the panel body 1, and closes the bottom opening of each of the mounting holes 11.

[0042] The present invention opens a cavity 41 in the insulating cover 4 and installs the temperature sensor 2 in the cavity 41 and closely adheres to the top of the cavity 41, thereby greatly reducing the distance between the temperature sensor 2 and the cookware, thereby making the temperature sensor 2 closer to the cookware. It can be understood that when the distance between the temperature sensor 2 and the cookware is smaller, the temperature sensor 2 can sense the temperature of the cookware faster.

[0043] The bottom surface of the insulating cover 4 is against the step 12, so that the insulating cover 4 can use the step 12 as a support point, so that the insulating cover 4 can withstand a larger impact force. In order to make the step 12 have better strength, the thickness of the step 12 can be set to be larger. Since the bottom of the mounting hole 11 is through and the temperature sensor 2 does not resist the step 12, increasing the thickness of the step 12 will not affect the position of the temperature sensor 2 relative to the panel body 1 or the thickness of the panel. If the mounting hole 11 is set as a non-through hole with a sealed bottom, if the thickness from the bottom of the non-through hole to the bottom surface of the panel body 1 is increased, the position of the temperature sensor 2 will be moved up relative to the panel body 1 or the thickness of the panel will be increased.

[0044] The temperature sensor 2 is installed in the insulating cover 4, and the insulating cover 4 can be used to protect the temperature sensor 2. If the temperature sensor 2 is only installed in the insulating cover 4, when the temperature of the inner wall of the insulating cover 4 is already high, since the insulating cover 4 is full of air, and the air is a poor conductor of heat, it will be difficult for the heat of the insulating cover 4 to be transferred to the temperature sensor 2, and there will still be a problem that the temperature felt by the temperature sensor 2 is greatly different from the actual temperature of the pot; the present invention adopts the method of filling the cavity 41 of the insulating cover 4 with a heat-conducting medium 5, and the heat-conducting medium 5 completely fills the gap between the temperature sensor 2 and the cavity 41, so that there is almost no air between the temperature sensor 2 and the insulating cover 4. When the temperature of the pot is transferred to the insulating cover 4, the insulating cover 4 transfers the heat to the heat-conducting medium 5 through the inner wall of the cavity 41, and the heat-conducting medium 5 quickly transfers the heat to the temperature sensor 2, so that the temperature sensor 2 is heated as a whole, thereby achieving the effect of rapid temperature sensing. In addition, a heat-conducting medium 5 is also filled between the insulating cover 4 and the mounting hole 11, so that the heat of the panel body 1 can be quickly transferred to the insulating cover 4 through the heat-conducting medium 5, so that the temperature of the insulating cover 4 is closer to the temperature of the cookware more quickly, thereby further improving the temperature sensing efficiency; in addition, the heat-conducting medium 5 in the mounting hole 11 not only plays a role in heat conduction, but also can fill the gap between the insulating cover 4 and the mounting hole 11, thereby encapsulating the insulating cover 4 and the temperature sensor 2 into the mounting hole 11, and sealing the gap between the insulating cover 4 and the mounting hole 11, thereby preventing soup and porridge water from seeping into the mounting hole 11 and causing a short circuit.

[0045] In addition, since a number of mounting holes 11 are provided on the panel body 1, the strength of the panel body 1 will be reduced. When the panel body 1 is impacted, the position where the mounting holes 11 are provided is prone to cracking. In the present invention, a bottom cover 3 is attached to the bottom surface of the panel body 1, and the bottom cover 3 covers all the mounting holes 11. Therefore, the bottom cover 3 can play a role in strengthening the panel body 1. When the top surface of the panel body 1 is impacted, a part of the impact force exerted on the panel body 1 will be transmitted to the bottom cover 3, thereby reducing the risk of cracking of the panel body 1. Therefore, even if the panel body 1 of the present invention is provided with a plurality of mounting holes 11, it can still have sufficient strength to withstand the impact of the cookware.

[0046] The temperature sensor 2 is installed in the insulating cover 4, and the insulating cover 4 and the temperature sensor 2 are both installed in the mounting hole 11, and the insulating cover 4 and the panel body 1 are both insulated. Therefore, the temperature sensor 2 of the present invention can achieve insulation effect without the need for an additional housing, and can meet the requirements of safety regulations; since there is no need to set an additional housing at the bottom of the panel body 1 or in the electromagnetic cooking appliance to insulate the temperature sensor 2, the temperature sensor 2 is completely embedded in the mounting hole 11 of the panel body 1, and only two connecting wires are passed through. There is no need to reserve space for the installation of the temperature sensor 2 in the electromagnetic cooking appliance, the structure is more compact, the assembly of the temperature sensor 2 is more flexible and free, and multiple temperature sensors 2 can be conveniently set to accurately detect the temperature of each area of ​​the pot.

[0047] The present invention realizes rapid temperature sensing and free assembly: the temperature sensing speed reaches more than ten times that of the traditional temperature sensing speed, and no coil disk is required to provide a dedicated installation space, and multiple sensors can be assembled at a very low cost. At the same time, due to the ability to quickly sense temperature, the induction cooker has the basis for realizing intelligent cooking, reducing the temperature resistance requirements of the glass panel body 1, and can be replaced by borosilicate glass and flame-retardant engineering plastics. It may even be possible to use soda-lime glass as the panel body 1 of the induction cooker in the future. These advantages will give full play to the high energy conversion efficiency of the induction cooker, and can greatly reduce manufacturing costs, improve assembly efficiency, and expand the application range of the induction cooker. After tempering, the borosilicate glass and soda-lime glass are also much more resistant to physical impact than microcrystalline glass. When the temperature resistance requirements are reduced, the safety of the induction cooker is also greatly improved.

[0048] Furthermore, as one of the implementation modes, the top of the insulating cover 4 is higher than the top surface of the panel body 1 , and the top outer edge of the insulating cover 4 is provided with an arc surface 42 , and the arc surface 42 is tangent to the top surface of the panel body 1 .

[0049] This arrangement allows a smooth transition between the insulating cover 4 and the panel body 1. When soup or porridge is spilled on the panel body 1 during cooking, the soup or porridge at the connection between the insulating cover 4 and the panel body 1 can be easily cleaned up, avoiding the formation of a sanitary dead corner at the connection between the insulating cover 4 and the panel body 1, which makes it difficult to clean.

[0050] Furthermore, as one of the embodiments, the top of the insulating cover 4 is higher than the top surface of the panel body 1, and the outer wall of the insulating cover 4 is provided with a conical surface 43, the bottom of the conical surface 43 is connected to the top surface of the panel body 1, and the angle α between the conical surface 43 and the top surface of the panel body 1 is an obtuse angle.

[0051] The obtuse angle formed at the connection between the insulating cover 4 and the panel body 1 can reduce the dirt hidden in the joint between the insulating cover 4 and the top surface of the panel body 1 and reduce the difficulty of cleaning the panel body 1.

[0052] Further, as one implementation manner, as an example, the temperature sensor 2 abuts against the top surface of the bottom cover 3 .

[0053] When the insulating cover 4 and the temperature sensor 2 are installed in the installation hole 11, the bottom of the temperature sensor 2 is against the top surface of the bottom cover 3. Therefore, when pressure is applied to the insulating cover 4, the temperature sensor 2 can be tightly attached to the top of the cavity 41 under the support force of the bottom cover 3, so that the temperature sensor 2 can be as close to the pot as possible, thereby realizing rapid temperature sensing and avoiding a gap between the temperature sensor 2 and the top of the cavity 41. In addition, the bottom cover 3 can also fix the temperature sensor 2. Since the heat-conducting medium 5 filled in the cavity 41 needs a certain amount of time to be completely cured or will not be cured, such as temperature-resistant glue, which needs a certain amount of time to be cured, and thermal conductive silicone Grease is in a paste-like state and basically does not solidify; therefore, when the heat-conducting medium 5 is in an unsolidified state, if the panel is transported, it is very likely that the temperature sensor 2 will be displaced downward under the action of gravity or external force, and thus cannot be tightly attached to the top of the cavity 41, and may even cause a large amount of air to enter the cavity 41 and seriously affect the temperature sensing effect. Therefore, the bottom cover 3 is abutted against the temperature sensor 2, so that the temperature sensor 2 can be firmly fixed in the cavity 41. Even if the panel is transported when the heat-conducting medium 5 is in a non-solidified state, the installation position of the temperature sensor 2 will not be affected at all, thereby further ensuring the temperature sensing effect of the temperature sensor 2.

[0054] Further, as one implementation mode, as another example, a boss 31 is provided on the top surface of the bottom cover 3 , and the bottom cover 3 abuts against the temperature sensor 2 through the boss 31 .

[0055] With this arrangement, the bottom cover 3 can extend into the cavity 41 through the boss 31 , thereby pressing the temperature sensor 2 against the top of the cavity 41 .

[0056] Furthermore, as one embodiment, as another embodiment, when the size of the temperature sensor 2 is greater than the depth of the through hole, the top surface of the bottom cover 3 is provided with a groove 32, the shape of the groove 32 is adapted to the bottom shape of the temperature sensor 2, and the temperature sensor 2 is against the groove 32.

[0057] The groove 32 is used to support the temperature sensor 2 .

[0058] Further, as one of the implementation modes, an elastic member 6 is provided between the temperature sensor 2 and the bottom cover 3 , and the top of the elastic member 6 abuts against the temperature sensor 2 .

[0059] In order to make the temperature sensor 2 fit tightly against the top of the cavity 41, the bottom cover 3 is required to press the temperature sensor 2 tightly. Since there may be certain dimensional deviations among the cavity 41, the temperature sensor 2 and the bottom cover 3 during production and processing, for example, when the size of the temperature sensor 2 is too large, the bottom cover 3 may crush the temperature sensor 2 when installing the bottom cover 3; and when the size of the temperature sensor 2 is too small, the bottom cover 3 cannot press the temperature sensor 2 tightly against the top of the cavity 41. If the sizes of the various components are to be perfectly matched, a high cost will be required, and it will be difficult to achieve large-scale mass production. The present invention arranges an elastomer between the temperature sensor 2 and the bottom cover 3, and utilizes the elastic deformation of the elastomer to absorb the dimensional deviations of the cavity 41, the temperature sensor 2 and the bottom cover 3, so that the temperature sensor 2 can be pressed tightly into the cavity 41 without crushing the temperature sensor 2. The size requirements of the various components are lower, which is conducive to reducing product costs.

[0060] Further, as one implementation mode, the heat-conducting medium 5 is one or more of thermal grease or temperature-resistant glue.

[0061] The heat-conducting medium 5 includes but is not limited to one or more combinations of heat-resistant glue or heat-conducting silicone grease, wherein the heat-resistant glue refers to glue that is adapted to the application temperature of the product, including but not limited to silicone glue and ceramic glue. For example, if the upper temperature limit of an induction cooker during use is 350°C, glue with a temperature resistance of more than 350°C should be selected; in another use scenario, such as a warming plate, if the upper temperature limit during use is 60°C, glue with a temperature resistance of more than 60°C should be selected.

[0062] Furthermore, the bottom cover 3 is provided with threading holes 33 corresponding to the wires of the temperature sensor 2. This makes it easy to lead the wires of the temperature sensor 2 out from the bottom of the bottom cover 3.

[0063] An electromagnetic cooking appliance uses a fast temperature sensing panel with a reliable structure as described above. The electromagnetic cooking appliance includes but is not limited to an induction cooker, an IH rice cooker and a warming plate.

[0064] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment", "certain embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0065] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific embodiments of the present invention without creative work, and these equivalent variations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A fast temperature sensing panel with reliable structure, characterized in that: It includes a panel body, a temperature sensor, a bottom cover and an insulating cover, wherein the panel body has a plurality of mounting holes penetrating from top to bottom, and a step is provided at the bottom of the mounting hole; the insulating cover and the temperature sensor are both in plurality, and a cavity is provided inside the insulating cover, and the bottom of the cavity is open, and the temperature sensor is installed in each of the cavities one by one, and the temperature sensor is tightly attached to the top of the cavity; the insulating cover is arranged in the mounting holes one by one, and the bottom surface of the insulating cover is against the step; the mounting holes and the cavities are respectively filled with heat-conducting media; the bottom cover is arranged on the bottom surface of the panel body, and closes the bottom opening of each of the mounting holes; the temperature sensor is against the top surface of the bottom cover.

2. A fast temperature sensing panel with reliable structure according to claim 1, characterized in that: The top of the insulation cover is higher than the top surface of the panel body, and the top outer edge of the insulation cover is provided with an arc surface, and the arc surface is tangent to the top surface of the panel body.

3. A fast temperature sensing panel with reliable structure according to claim 1, characterized in that: The top of the insulation cover is higher than the top surface of the panel body. The outer wall of the insulation cover is provided with a tapered surface. The bottom of the tapered surface is connected to the top surface of the panel body. The angle between the tapered surface and the top surface of the panel body is an obtuse angle.

4. A structurally reliable rapid temperature sensing panel according to claim 1, characterized in that: A boss is provided on the top surface of the bottom cover, and the bottom cover abuts against the temperature sensor through the boss.

5. A structurally reliable rapid temperature sensing panel according to claim 1, characterized in that: The top surface of the bottom cover is provided with a groove, the shape of the groove is adapted to the bottom shape of the temperature sensor, and the temperature sensor abuts against the groove.

6. A structurally reliable rapid temperature sensing panel according to claim 1, characterized in that: An elastic member is arranged between the temperature sensor and the bottom cover, and the top of the elastic member abuts against the temperature sensor.

7. A structurally reliable rapid temperature sensing panel according to claim 1, characterized in that: The heat conducting medium is one or more of heat conducting grease or temperature resistant glue.

8. A structurally reliable rapid temperature sensing panel according to claim 1, characterized in that: The bottom cover is provided with threading holes corresponding one to one with the wires of the temperature sensor.

9. An electromagnetic cooking appliance, characterized in that: A fast temperature sensing panel with reliable structure as described in any one of claims 1 to 8 is used.

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