Packaging structure and photovoltaic optimizer

Abstract

A packaging structure and a photovoltaic optimizer are provided. The packaging structure includes a first shell, a circuit board and a heat insulation part. The circuit board is arranged inside the first shell, and a first heating device and a second heating device may be arranged at intervals on the first surface of the circuit board, and the heat generated by the first heating device at maximum power is greater than the heat generated by the second heating device at maximum power. The first end of the heat insulation part may be located on the side wall of the first shell facing the first surface of the circuit board, the second end of the heat insulation part may extend toward the first surface of the circuit board, and the heat insulation part separates the first heating device and the second heating device on both sides of the heat insulation part. The heat insulation part separates the first heating device from the second heating device, which can slow down the heat transfer from the first heating device to the second heating device, thereby alleviating the baking phenomenon of the first heating device on the second heating device, avoiding the second heating device from overheating due to the baking of the first heating device, and ensuring the working reliability of the packaging structure.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a packaging structure and a photovoltaic optimizer. Background Art

[0002] The design direction of packaging structures, such as photovoltaic optimizers, power modules and other potting or plastic packaging products, is evolving towards miniaturization and high density. The small size and high power of the packaging structure pose a great challenge to heat dissipation technology. In order to effectively increase the overall heat dissipation capacity of the packaging structure, the main technical means currently used is to fill the entire interior of the packaging structure shell with thermal conductive materials, such as potting glue.

[0003] However, the circuit board inside the package structure shell is usually equipped with different types of devices, including heat generating devices with high heat generation and high temperature specifications, such as metal-oxide-semiconductor field-effect transistors (MOSFET) (temperature specifications are usually 150°C), magnetic devices (temperature specifications are usually 130°C), etc., and low temperature devices with low heat generation and low temperature specifications, such as control chips (temperature specifications are usually 105°C), etc. Since the entire inside of the package structure shell is filled with thermal conductive materials, the heat of the heat generating devices will be transferred to the nearby low temperature devices through the thermal conductive materials, causing the low temperature devices to bake, resulting in overheating of the low temperature devices, and affecting the overall reliability of the package structure. Summary of the invention

[0004] The present application provides a packaging structure and a photovoltaic optimizer to solve the problem of heating devices baking low-temperature devices.

[0005] In a first aspect, the present application provides a packaging structure, which may include a first shell, a circuit board, and a heat insulation portion. The circuit board is disposed inside the first shell, and a first heating device and a second heating device may be disposed at intervals on the first surface of the circuit board, and the heat generated by the first heating device at maximum power may be greater than the heat generated by the second heating device at maximum power. The first end of the heat insulation portion may be located on a side wall of the first shell facing the first surface of the circuit board, the second end of the heat insulation portion may extend toward the first surface of the circuit board, and the heat insulation portion separates the first heating device from the second heating device on both sides of the heat insulation portion.

[0006] In the technical solution provided by the present application, the heat insulation part separates the first heating device from the second heating device, thereby preventing the heat emitted by the first heating device from being directly transferred to the second heating device. The heat transfer from the first heating device to the second heating device can be slowed down, thereby alleviating the baking phenomenon of the second heating device by the first heating device, preventing the second heating device from overheating due to baking by the first heating device, ensuring the working reliability of the second heating device, and further ensuring the working reliability of the overall packaging structure.

[0007] In a specific embodiment, the heat insulating part may have a cavity inside, and the cavity may be filled with a gas in contact with the first shell, so as to reduce the thermal conductivity of the heat insulating part and enhance the effect of the heat insulating part in blocking heat transfer.

[0008] In a specific embodiment, the first end of the heat insulating portion may have a first opening, and the cavity is connected to the first opening, so that the gas in the cavity can dissipate the heat transferred to the heat insulating portion to the outside of the first shell through the first opening, thereby improving the heat insulating effect of the heat insulating portion.

[0009] In a specific implementation, the first shell is filled with a heat-conducting medium, and the heat-conducting medium fills the internal space of the first shell, which can accelerate the heat dissipation of the first heating element and the second heating element and improve the overall heat dissipation capacity of the packaging structure.

[0010] In a specific implementation scheme, the projection shape of the heat insulation part on the first surface of the circuit board can be a straight line or a curve. The structure of the heat insulation part is relatively simple, and it can prevent the heat emitted by the first heating device from being transferred to the adjacent second heating device, thereby achieving heat insulation between the second heating device and the first heating device.

[0011] In a specific embodiment, the projection shape of the heat insulating portion on the first surface of the circuit board can be a broken line, so that the first heating device located on the adjacent two sides of the second heating device can be separated from the second heating device, thereby achieving heat insulation between the second heating device and the two first heating devices.

[0012] In a specific embodiment, the projection shape of the heat insulating portion on the first surface of the circuit board may be U-shaped, so that the first heating device located on three adjacent sides of the second heating device can be separated from the second heating device, thereby achieving heat insulation between the second heating device and the three first heating devices.

[0013] In addition to the above-mentioned configuration, the projection shape of the heat insulating portion on the first surface of the circuit board can also be a quadrilateral, a circle or an ellipse, so that the plurality of first heating components surrounding the second heating component can be separated from the second heating component, thereby achieving heat insulation between the second heating component and the plurality of first heating components.

[0014] In a specific implementation scheme, a first heating device and a second heating device may be separated by a plurality of heat insulating parts, which can further slow down the heat transfer from the first heating device to the second heating device and further alleviate the phenomenon of baking the second heating device by the first heating device.

[0015] In a specific implementation, a heat-scaling portion may be provided on the inner wall of the first housing, and the heat-scaling portion may be provided corresponding to the position of the first heating device, and the heat-scaling portion may abut against the first heating device. The provision of the heat-scaling portion may accelerate the heat dissipation of the first heating device and improve the heat dissipation efficiency.

[0016] In a specific implementation, the first housing may have a second opening at a position corresponding to the heat-averaging portion, and a heat-conducting portion may be disposed in the second opening, and the heat-conducting portion may abut against the heat-averaging portion. In this way, the heat-averaging portion may transfer the heat emitted by the first heating device to the heat-conducting portion, and the heat-conducting portion may transfer the heat to the outside of the first housing, thereby further accelerating the heat emission of the first heating device.

[0017] In a specific possible implementation, the packaging structure may further include a second shell, which may be disposed outside the first shell, and the inner wall of the second shell may abut against the outer wall of the first shell. The provision of the second shell may accelerate the heat dissipation of the components inside the first shell to the outside, and may also protect the first shell and the components inside the first shell.

[0018] In a specific possible implementation manner, heat dissipation protrusions or heat dissipation fins may be provided on the outer wall of the second shell to increase the heat dissipation area of ​​the second shell and improve the heat dissipation efficiency.

[0019] In a specific embodiment, the heat dissipation protrusion or heat dissipation fin is arranged on a side wall of the second housing facing the first side of the circuit board and extends outward, so as to accelerate the heat dissipation of the first heating element and the second heating element and realize the rapid heat dissipation outside the second housing.

[0020] In a second aspect, the present application provides a photovoltaic optimizer, which may include a first shell, a second shell, a circuit board, and a heat insulation portion. The first shell may be disposed inside the second shell, and a heat-conducting connection may be provided between the first shell and the second shell to conduct the heat inside the first shell outward. The circuit board is disposed inside the first shell, and a first heating device and a second heating device may be spaced apart on the first surface of the circuit board, and the heat generated by the first heating device at maximum power may be greater than the heat generated by the second heating device at maximum power. The first end of the heat insulation portion may be located on a side wall of the first shell facing the first surface of the circuit board, the second end of the heat insulation portion may extend toward the first surface of the circuit board, and the heat insulation portion separates the first heating device from the second heating device on both sides of the heat insulation portion.

[0021] The technical solution provided by the present application is that the heat insulation part separates the first heating device from the second heating device, preventing the heat emitted by the first heating device from being directly transferred to the second heating device, which can slow down the heat transfer from the first heating device to the second heating device, thereby alleviating the baking phenomenon of the first heating device on the second heating device, preventing the second heating device from overheating due to the baking of the first heating device, ensuring the working reliability of the second heating device, and then ensuring the overall working reliability of the photovoltaic optimizer. In addition, the setting of the second shell can accelerate the heat dissipation of the internal components of the first shell to the outside world, and can also protect the first shell and the internal components of the first shell.

[0022] In a specific embodiment, the heat insulating part may have a cavity inside, and the cavity may be filled with a gas in contact with the first shell, so as to reduce the thermal conductivity of the heat insulating part and enhance the effect of the heat insulating part in blocking heat transfer.

[0023] In a specific embodiment, the first end of the heat insulating portion may have a first opening, and the cavity may be connected to the space between the first shell and the second shell through the first opening. In this way, the gas in the cavity can dissipate the heat transferred to the heat insulating portion to between the first shell and the second shell through the first opening, and then the heat can be dissipated outside the second shell, which can improve the heat insulation effect of the heat insulating portion.

[0024] In a specific implementation, a heat-scaling portion may be provided on the inner wall of the first housing, and the heat-scaling portion may be provided corresponding to the position of the first heating device, and the heat-scaling portion may abut against the first heating device. The provision of the heat-scaling portion may accelerate the heat dissipation of the first heating device and improve the heat dissipation efficiency.

[0025] In a specific possible implementation, the first shell may have a second opening at a position corresponding to the heat-averaging portion, a heat-conducting portion may be disposed in the second opening, the heat-conducting portion and the heat-averaging portion may abut against each other, and a heat-conducting connection may be provided between the heat-conducting portion and the second shell. In this way, the heat-averaging portion may transfer the heat emitted by the first heating device to the heat-conducting portion, and the heat-conducting portion may transfer the heat to the second shell, and the heat may be dissipated outside the second shell, which may further accelerate the heat dissipation of the first heating device.

[0026] In a specific possible implementation scheme, a heat dissipation protrusion or heat dissipation fin may be provided on the outer wall of the second housing to increase the heat dissipation area of ​​the second housing. The heat dissipation protrusion or heat dissipation fin may be provided on a side wall of the second housing facing the first side of the circuit board and extend outward. In this way, the heat dissipation of the first heating element and the second heating element can be accelerated, and the heat can be quickly dissipated outside the second housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A schematic diagram of the internal structure of the packaging structure provided in an embodiment of the present application;

[0028] Figure 2 A schematic diagram of a part of the packaging structure provided in an embodiment of the present application at a certain viewing angle;

[0029] Figure 3 A schematic diagram of a part of the packaging structure provided in an embodiment of the present application from another perspective;

[0030] Figure 4 A schematic structural diagram of a heat insulation portion of a packaging structure provided in an embodiment of the present application;

[0031] Figure 5 A schematic structural diagram of a heat insulation portion of a packaging structure provided in another embodiment of the present application;

[0032] Figure 6 A schematic diagram of the internal structure of a packaging structure provided by another embodiment of the present application;

[0033] Figure 7 A schematic structural diagram of a heat insulation portion of a packaging structure provided in an embodiment of the present application at a certain viewing angle;

[0034] Figure 8 A schematic structural diagram of the heat insulation portion of the packaging structure provided in an embodiment of the present application from another perspective;

[0035] Fig. 9 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at a certain viewing angle;

[0036] Fig.10 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at another viewing angle;

[0037] Fig.11 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at a certain viewing angle;

[0038] Fig.12 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at another viewing angle;

[0039] Fig.13 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at a certain viewing angle;

[0040] Fig.14 A schematic structural diagram of the heat insulation portion of the packaging structure provided in another embodiment of the present application at another viewing angle.

[0041] Reference numerals:

[0042] 100 - first housing; 200 - circuit board; 300 - heat insulation part; 400 - second housing; 101 - heat conducting medium; 102 - heat equalization part;

[0043] 103 - heat conduction part; 201 - first heat generating device; 202 - second heat generating device; 401 - heat dissipation protrusion; 402 - ear hanging structure. DETAILED DESCRIPTION

[0044] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0045] For ease of understanding, the application scenario of the packaging structure involved in this application is first explained. The packaging structure provided in the embodiment of the present application can be adapted to an electrical control system, and illustratively, can be adapted to a photovoltaic power generation system, and can be specifically used in a photovoltaic optimizer to increase the power generation of the system. Of course, the packaging structure provided in the embodiment of the present application can also be applied to power modules and other potting or plastic-sealed products.

[0046] Currently, the packaging structure mainly adopts the method of filling the entire shell with thermal conductive materials to improve the heat dissipation capacity. Since the entire shell of the packaging structure is filled with thermal conductive materials, the heat of the heating device with higher heat generation and higher temperature specifications will be transferred to the nearby low-temperature devices with lower heat generation and lower temperature specifications through the thermal conductive materials, causing the low-temperature devices to bake and overheat, thus affecting the overall reliability of the packaging structure.

[0047] Based on this, an embodiment of the present application provides a packaging structure to alleviate the phenomenon of heating components baking low-temperature components.

[0048] First reference Figure 1 , Figure 2 and Figure 3 , Figure 1 The internal structure diagram of the packaging structure provided by the embodiment of the present application is shown. Figure 2 A schematic diagram of a structure of a part of the packaging structure provided by an embodiment of the present application at a certain viewing angle is shown. Figure 3 FIG. 1 is a schematic diagram showing a partial structure of the packaging structure provided by an embodiment of the present application from another perspective. Figure 1 As shown, the packaging structure provided in the embodiment of the present application may include a first shell 100 , a circuit board 200 and a heat insulation part 300 .

[0049] The first housing 100 may be a hollow structure with a storage space inside. The first housing 100 may be in a rectangular parallelepiped or cylindrical shape, etc., and the embodiment of the present application does not limit the shape of the first housing 100. The first housing 100 may be made of plastic or metal, and the embodiment of the present application does not limit the material of the first housing 100.

[0050] The circuit board 200 may be disposed inside the first housing 100, and a heating device may be disposed on the circuit board 200. In a specific implementation, the first housing 100 may be entirely filled with a heat-conducting medium 101, and the heat-conducting medium 101 may be a potting glue or the like. In this way, the heat-conducting medium 101 may fill the internal space of the first housing 100, so that the heat-conducting medium 101 may contact the heating device on the circuit board 200, and the heat dissipation of the heating device on the circuit board 200 may be accelerated.

[0051] In a specific implementation, the heating device on the circuit board 200 may include a first heating device 201 and a second heating device 202 arranged at intervals on the first surface of the circuit board 200, wherein the heat generated by the first heating device 201 at maximum power is greater than the heat generated by the second heating device 202 at maximum power. For example, the first heating device 201 may be a MOSFET, whose temperature specification is usually 150°C; the second heating device 202 may be a control chip, whose temperature specification is usually 105°C.

[0052] Combination Figure 1 , Figure 2 and Figure 3 As shown, the first end of the heat insulating portion 300 can be fixedly connected to the side wall of the first housing 100 facing the first surface of the circuit board 200. For example, when the first housing 100 is in a rectangular parallelepiped shape, the first housing 100 includes a top wall, a bottom wall and four side walls, the first surface of the circuit board 200 can be arranged facing the bottom wall of the first housing 100, and the first end of the heat insulating portion 300 can be fixedly connected to the bottom wall of the first housing 100. The second end of the heat insulating portion 300 can extend inside the first housing 100, specifically, the second end of the heat insulating portion 300 can extend toward the first surface of the circuit board 200, and the heat insulating portion 300 can separate the adjacent first heating device 201 and the second heating device 202 on both sides of the heat insulating portion 300, thereby blocking the heat emitted by the first heating device 201 from being directly transferred to the second heating device 202.

[0053] The number and arrangement of the first heating device 201 and the second heating device 202 can be specifically determined according to the realization of the hardware performance of the packaging structure and the hardware electrical connection requirements, and the embodiments of the present application do not limit this. For example, when a first heating device 201 is arranged on one side of a second heating device 202, a heat insulation portion 300 can be provided between the second heating device 202 and the first heating device 201, and one or more heat insulation portions 300 can be provided between the second heating device 202 and the first heating device 201, so that the one or more heat insulation portions 300 separate the second heating device 202 from the first heating device 201. When first heating devices 201 are arranged on multiple sides of a second heating device 202, insulation parts 300 can be respectively provided between the second heating device 202 and each adjacent first heating device 201, and one or more insulation parts 300 can be provided between the second heating device 202 and any adjacent first heating device 201, so that one or more insulation parts 300 separate the second heating device 202 from any adjacent first heating device 201.

[0054] In a specific implementation, the thermal conductivity of the heat insulating part 300 may be lower than the thermal conductivity of the heat conducting medium 101 filled in the shell. For example, when the heat conducting medium 101 is potting glue, the heat conducting medium 101 is 1W / m·K or more. At this time, the heat insulating part 300 may be made of plastic material, and the heat conducting medium 101 is 0.2W / m·K. When the heat insulating part 300 and the first shell 100 are both made of plastic material, the heat insulating part 300 may be integrally formed with the first shell 100. Specifically, the heat insulating part 300 and the first shell 100 may be integrally formed using an injection molding process.

[0055] In the packaging structure provided in the embodiment of the present application, the heat insulation part 300 separates the first heating device 201 from the second heating device 202, so as to prevent the heat emitted by the first heating device 201 from being directly transferred to the second heating device 202, and can slow down the heat transfer from the first heating device 201 to the second heating device 202, thereby alleviating the baking phenomenon of the second heating device 202 by the first heating device 201, and preventing the second heating device 202 from overheating due to the baking of the first heating device 201, thereby ensuring the working reliability of the second heating device 202, and further ensuring the working reliability of the overall packaging structure.

[0056] As a possible embodiment, the interior of the heat insulating portion 300 may have a cavity, and the cavity may be filled with a gas in contact with the first shell, or the cavity may be a vacuum environment. Taking the cavity filled with air as an example, the setting of the heat insulating portion 300 allows an air gap to exist between the adjacent first heating device 201 and the second heating device 202. The thermal conductivity of air is relatively low, only 0.023W / m·K, and it is a good heat insulating material that can effectively block the heat emitted by the first heating device 201 from being transferred to the second heating device 202. When the cavity is a vacuum environment, the effect of the heat insulating portion 300 in blocking heat transfer is more significant.

[0057] In a specific implementation, the first end of the heat insulating portion 300 may have a first opening, and the cavity inside the heat insulating portion 300 may be connected to the first opening, so that the air in the cavity of the heat insulating portion 300 can dissipate the heat transferred to the heat insulating portion 300 to the outside of the first shell 100 through the first opening, thereby improving the heat insulation effect of the heat insulating portion 300. In addition, the heat insulating portion 300 with the first opening can also increase the heat dissipation area of ​​the first shell 100, thereby improving the heat dissipation efficiency of the packaging structure.

[0058] Figure 4 A schematic diagram showing the structure of the heat insulation part of the packaging structure provided by an embodiment of the present application is shown. Figure 5 FIG. 2 shows a schematic diagram of the structure of the heat insulation portion of the packaging structure provided by another embodiment of the present application. Figure 4 As shown, the heat insulating portion 300 is a solid structure. For example, in the direction shown in the figure, the width of the heat insulating portion 300 is L, for example, L=6 mm. The heat insulating portion 300 is made of plastic. At this time, the thermal resistance of the heat insulating portion 300 is 0.03°C·m 2 / W. Figure 5 As shown, the heat insulation part 300 has a cavity inside. Figure 4 In the same direction, the width of the heat insulating part 300 is L, the width of the cavity is L / 2, and the heat insulating part 300 is made of plastic. At this time, the thermal resistance of the heat insulating part 300 is 0.165℃·m 2 / W. It can be seen that when the heat insulating part 300 is a solid structure, it has a relatively significant heat insulating effect and can effectively prevent the heat emitted by the first heating device 201 from being transferred to the second heating device 202. When there is a cavity inside the heat insulating part 300, the heat insulating effect is more significant.

[0059] Figure 6 FIG. 1 is a schematic diagram showing the internal structure of a packaging structure provided by another embodiment of the present application. Figure 7 The schematic diagram of the structure of the heat insulation part of the packaging structure provided by the embodiment of the present application at a certain viewing angle is shown. Figure 8FIG. 2 is a schematic diagram of the structure of the heat insulation part of the packaging structure provided by the embodiment of the present application from another perspective. As a possible embodiment, the heat insulation part 300 is arranged on the first shell 100, and the projection shape of the heat insulation part 300 on the first surface of the circuit board 200 can be a straight line or a curve. Figure 6 , Figure 7 and Figure 8 As shown, taking a linear heat insulating portion 300 as an example, the heat insulating portion 300 can be disposed between a second heating device 202 and an adjacent first heating device 201 to separate the two and prevent the heat emitted by the first heating device 201 from being transferred to the second heating device 202. When the first heating devices 201 are arranged on multiple sides of a second heating device 202, the heat insulating portion 300 can be disposed between a second heating device 202 and any adjacent first heating device 201, thereby ensuring that the second heating device 202 is separated from any adjacent first heating device 201. Figure 6 , Figure 7 and Figure 8 An example is given in which the first heating devices 201 are arranged on both sides of the second heating device 202 facing each other. In specific implementation, the insulation parts 300 used to separate the second heating device 202 from the adjacent different first heating devices 201 may not be connected to each other, or may be connected in sequence. It can be understood that in the case where multiple insulation parts 300 are connected in sequence, the multiple insulation parts 300 can be regarded as a larger insulation part 300, and the applicable scenarios of this situation are described in detail below.

[0060] Fig. 9 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at a certain viewing angle is shown. Fig.10 FIG. 2 shows a schematic diagram of the structure of the heat insulation portion of the packaging structure provided by another embodiment of the present application from another perspective. Fig. 9 and Fig.10 As shown, in a possible embodiment, the projection shape of the heat insulation part 300 on the first surface of the circuit board can be a fold line. The fold line-shaped heat insulation part 300 can be suitable for a scene in which the first heating device 201 is arranged on both sides adjacent to a second heating device 202. The fold line-shaped heat insulation part 300 includes two sides, and the two sides can separate the first heating device 201 and the second heating device 202 located on the two adjacent sides of the second heating device 202, respectively, to achieve heat insulation between the second heating device 202 and the two first heating devices 201. Exemplarily, the two sides of the fold line-shaped heat insulation part 300 can be set at right angles, or can be set at other angles.

[0061] Fig.11 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at a certain viewing angle is shown. Fig.12FIG. 2 shows a schematic diagram of the structure of the heat insulation portion of the packaging structure provided by another embodiment of the present application from another perspective. Fig.11 and Fig.12 As shown, in another possible embodiment, the projection shape of the heat insulating portion 300 on the first surface of the circuit board may be U-shaped. The U-shaped heat insulating portion 300 may be applicable to a scenario where the first heat generating device 201 is arranged on three adjacent sides of a second heat generating device 202, and the U-shaped heat insulating portion 300 may include three edges, and the three edges may separate the first heat generating device 201 and the second heat generating device 202 located on three adjacent sides of the second heat generating device 202, respectively, to achieve heat insulation between the second heat generating device 202 and the three first heat generating devices 201. The U-shaped heat insulating portion 300 may also be applicable to a scenario where the first heat generating device 201 is arranged on two opposite or adjacent sides of a second heat generating device 202, and the two opposite sides of the U-shaped heat insulating portion 300 may separate the first heat generating device 201 and the second heat generating device 202 located on two opposite or adjacent sides of the second heat generating device 202, respectively, to achieve heat insulation between the second heat generating device 202 and the two first heat generating devices 201.

[0062] Fig.13 A schematic structural diagram of a heat insulation portion of a packaging structure provided by another embodiment of the present application at a certain viewing angle is shown. Fig.14 FIG. 2 shows a schematic diagram of the structure of the heat insulation portion of the packaging structure provided by another embodiment of the present application from another perspective. Fig.13 and Fig.14 As shown, in another possible embodiment, the projected shape of the heat insulating portion 300 on the first surface of the circuit board can be a quadrilateral, a circle or an ellipse. In other words, the heat insulating portion 300 is a closed loop structure. Therefore, in addition to the above three shapes, the heat insulating portion 300 can also be other closed loop shapes. The heat insulating portion 300 with a closed loop structure can be suitable for a scene where a second heating device 202 is surrounded by multiple first heating devices 201, or suitable for a scene where multiple first heating devices 201 are irregularly distributed around the second heating device 202. Taking the quadrilateral heat insulating portion 300 as an example, the four sides of the heat insulating portion 300 can separate the multiple first heating devices 201 surrounding the second heating device 202 from the second heating device 202, thereby achieving heat insulation between the second heating device 202 and the multiple first heating devices 201.

[0063] It can be understood that the above-mentioned zigzag, U-shaped, quadrilateral, circular or elliptical insulation part 300 can be applied not only to the scenario where multiple first heating devices 201 are distributed around the above-mentioned second heating device 202, but also to the scenario where only one first heating device 201 is distributed around the second heating device 202.

[0064] Reference again Figure 1As shown, as a possible embodiment, a heat equalizing portion 102 may be provided on the inner wall of the first housing 100. The heat equalizing portion 102 may be made of metal. The first surface of the first heating device 201 may be arranged facing the circuit board 200, the heat equalizing portion 102 may be arranged corresponding to the position of the first heating device 201, and the heat equalizing portion 102 may abut against the second surface of the first heating device 201, and the second surface of the first heating device 201 is the reverse side of the first surface. The heat emitted by the first heating device 201 may be directly transferred to the heat equalizing portion 102, and the setting of the heat equalizing portion 102 may accelerate the heat emission of the first heating device 201 and improve the heat dissipation efficiency. In specific implementation, the heat equalizing portion 102 may be a plate-like structure, and the area of ​​the heat equalizing portion 102 may be greater than the area of ​​the second surface of the first heating device 201, so that the heat equalizing portion 102 may completely cover the first heating device 201, so that the heat emission of the first heating device 201 is more uniform.

[0065] In a specific implementation, the first housing 100 may have a second opening at a position corresponding to the heat averaging portion 102, and a heat conducting portion 103 may be disposed in the second opening, and at this time, the heat averaging portion 102 abuts against the heat conducting portion 103. The heat conducting portion 103 may be made of a thermal interface material, and may be filled in the second opening and disposed on the heat averaging portion 102 by coating. The heat averaging portion 102 transfers the heat dissipated by the first heating device 201 to the heat conducting portion 103, and the heat conducting portion 103 then transfers the heat to the outside of the first housing 100, thereby further accelerating the heat dissipation of the first heating device 201.

[0066] As a possible embodiment, the packaging structure may further include a second shell 400. The second shell 400 may be made of metal or other materials with relatively ideal heat dissipation performance. The second shell 400 may be arranged outside the first shell 100, and the inner wall of the second shell 400 may abut against the outer wall of the first shell 100, thereby accelerating the heat dissipation of the internal components of the first shell 100 and helping the first shell 100 to resist external forces. The shape of the second shell 400 may be adapted to the shape of the first shell 100. For example, the second shell 400 may be a hollow rectangular parallelepiped, and the second shell 400 may have a third opening. Specifically, the second shell 400 may include a bottom wall and four side walls. In a specific setting, the bottom wall of the first shell 100 may abut against the bottom wall of the second shell 400; the heat conducting portion 103 may abut against the bottom wall of the second shell 400.

[0067] In a specific implementation, the second housing 400 may also be a U-shaped structure, specifically, the second housing 400 may include a bottom wall and two side walls disposed opposite to each other. In this case, the bottom wall of the first housing 100 may abut against the bottom wall of the second housing 400, and the heat conducting portion 103 may abut against the bottom wall of the second housing 400.

[0068] In a specific implementation, a plurality of heat dissipation protrusions 401 or heat dissipation fins may be provided on the outer wall of the second housing 400 to increase the heat dissipation area of ​​the second housing 400, thereby improving the heat dissipation efficiency of the second housing 400, and further improving the heat dissipation efficiency of the packaging structure. Specifically, the heat dissipation protrusions 401 or heat dissipation fins may be made of metal, etc. When the heat dissipation protrusions 401 or heat dissipation fins and the second housing 400 are both made of metal, the heat dissipation protrusions 401 or heat dissipation fins may be integrally formed with the second housing 400.

[0069] The heat dissipation protrusion 401 or the heat dissipation fin can be arranged on a side wall of the second housing 400 facing the first side of the circuit board 200 and extending outward. Specifically, the first side of the circuit board 200 can be arranged facing the bottom wall of the first housing 100, the bottom wall of the first housing 100 can be abutted against the bottom wall of the second housing 400, and the heat dissipation protrusion 401 or the heat dissipation fin can be arranged on the bottom wall of the second housing 400, so that the heat dissipation protrusion 401 or the heat dissipation fin can be arranged facing the first side of the circuit board 200, thereby accelerating the heat dissipation of the first heating device 201 and the second heating device 202. In addition to being arranged on the bottom wall of the second housing 400, the heat dissipation protrusion 401 or the heat dissipation fin can also be arranged on the side wall of the second housing 400.

[0070] In practical application, the second shell 400 may be provided with a hanging ear structure 402, so that the second shell 400 can be hung and connected to other structures. Specifically, the hanging ear structure 402 may be made of metal. The hanging ear structure 402 may be a plate-like structure, and the hanging ear structure 402 may be provided at the third opening of the second shell 400. Specifically, the third opening of the second shell 400 may be provided with a groove structure, and the hanging ear structure 402 may be plugged into the groove structure, thereby realizing the connection between the hanging ear structure 402 and the second shell 400.

[0071] The present application also provides a photovoltaic optimizer. Figure 1As shown, the photovoltaic optimizer provided in the embodiment of the present application may include a first shell 100, a second shell 400, a circuit board 200 and a heat insulation part 300. The first shell 100 may be a hollow structure with a storage space inside. The first shell 100 may be in the shape of a cuboid or a cylinder, etc., and the embodiment of the present application does not limit the shape of the first shell 100. The first shell 100 may be made of plastic or metal, and the embodiment of the present application does not limit the material of the first shell 100. The second shell 400 may be made of metal or other materials with relatively ideal heat dissipation performance. The second shell 400 can be arranged outside the first shell 100, and the second shell 400 and the first shell 100 can have a heat-conducting connection, for example, the gap between the second shell 400 and the first shell 100 can be filled with a heat-conducting material, or the inner wall of the second shell 400 can be in contact with the outer wall of the first shell 100, thereby enabling heat to be transferred from the first shell 100 to the second shell 400, accelerating the heat dissipation of the internal components of the first shell 100, and also helping the first shell 100 to resist external forces. The shape of the second shell 400 can be adapted to the shape of the first shell 100, for example, when the first shell 100 is a rectangular parallelepiped, the second shell 400 is also a rectangular parallelepiped. The second shell 400 can also be a U-shaped structure.

[0072] The circuit board 200 can be arranged inside the first shell 100, and a heating device can be arranged on the circuit board 200. In a specific implementation, the first shell 100 can be filled with a heat-conducting medium 101 as a whole, and the heat-conducting medium 101 can be made of potting glue or the like. In this way, the heat-conducting medium 101 can fill the internal space of the first shell 100, so that the heat-conducting medium 101 can contact the heating device on the circuit board 200, and the heat dissipation of the heating device on the circuit board 200 can be accelerated. In a specific implementation, the heating device on the circuit board 200 may include a first heating device 201 and a second heating device 202 arranged at intervals on the first surface of the circuit board 200, wherein the heat generated by the first heating device 201 at maximum power is greater than the heat generated by the second heating device 202 at maximum power.

[0073] The first end of the heat insulating portion 300 may be fixedly connected to the side wall of the first housing 100 facing the first surface of the circuit board 200. For example, when the first housing 100 is in a rectangular parallelepiped shape, the first housing 100 includes a top wall, a bottom wall and four side walls, the first surface of the circuit board 200 may be arranged facing the bottom wall of the first housing 100, and the first end of the heat insulating portion 300 may be fixedly connected to the bottom wall of the first housing 100. The second end of the heat insulating portion 300 may extend inside the first housing 100, specifically, the second end of the heat insulating portion 300 may extend toward the first surface of the circuit board 200, and the heat insulating portion 300 may separate the adjacent first heating device 201 and the second heating device 202 on both sides of the heat insulating portion 300, thereby blocking the heat emitted by the first heating device 201 from being directly transferred to the second heating device 202. The number, arrangement and shape of the heat insulating portion 300 may refer to the above embodiment.

[0074] In the photovoltaic optimizer provided in the embodiment of the present application, the heat insulation part 300 separates the first heating device 201 from the second heating device 202, so as to prevent the heat emitted by the first heating device 201 from being directly transferred to the second heating device 202, and thus slow down the heat transfer from the first heating device 201 to the second heating device 202, thereby alleviating the baking phenomenon of the first heating device 201 to the second heating device 202, and preventing the second heating device 202 from overheating due to the baking of the first heating device 201, thereby ensuring the working reliability of the second heating device 202, and further ensuring the working reliability of the photovoltaic optimizer as a whole. In addition, the setting of the second shell 400 can accelerate the heat emission of the internal components of the first shell 100 to the outside world, and can also protect the first shell 100 and the internal components of the first shell 100.

[0075] In some possible embodiments, the interior of the heat insulating portion 300 may have a cavity, and the cavity may be filled with a gas in contact with the first shell. Taking the cavity filled with air as an example, the setting of the heat insulating portion 300 allows an air gap to be provided between the adjacent first heating device 201 and the second heating device 202. Air has a low thermal conductivity and is a good heat insulating material, which can effectively block the heat emitted by the first heating device 201 from being transferred to the second heating device 202. In some other possible embodiments, the cavity may be a vacuum environment. When the cavity is a vacuum environment, the effect of the heat insulating portion 300 in blocking heat transfer is more significant.

[0076] As a possible embodiment, the first end of the heat insulating portion 300 may have a first opening, and the cavity inside the heat insulating portion 300 may be connected to the space between the first shell 100 and the second shell 400 through the first opening. In this way, the gas in the cavity can dissipate the heat transferred to the heat insulating portion 300 to between the first shell 100 and the second shell 400 through the first opening, and then the heat can be dissipated outside the second shell 400, which can improve the heat insulation effect of the heat insulating portion 300.

[0077] As a possible embodiment, a heat averaging portion 102 may be provided on the inner wall of the first housing 100, and the heat averaging portion 102 may be made of metal. The heat averaging portion 102 may be provided corresponding to the position of the first heating device 201, and the heat averaging portion 102 may abut against the first heating device 201, and the heat emitted by the first heating device 201 may be directly transferred to the heat averaging portion 102 to accelerate the heat emission of the first heating device 201 and improve the heat dissipation efficiency. In a specific implementation, the heat averaging portion 102 may be a plate-like structure, and the area of ​​the heat averaging portion 102 may be larger than the area of ​​the second surface of the first heating device 201, so that the heat averaging portion 102 may completely cover the first heating device 201, so that the heat emission of the first heating device 201 is more uniform.

[0078] As a possible embodiment, the first shell 100 may have a second opening at a position corresponding to the heat-averaging portion 102, and a heat-conducting portion 103 may be arranged in the second opening, and the heat-averaging portion 102 and the heat-conducting portion 103 may abut against each other. Specifically, the heat-conducting portion 103 may be made of a thermal interface material, and may be filled in the second opening and arranged on the heat-averaging portion 102 by coating. The heat-conducting portion 103 and the second shell 400 may have a thermal connection, for example, the gap between the heat-conducting portion 103 and the second shell 400 may be filled with a heat-conducting material, or the heat-conducting portion 103 and the second shell 400 may abut against each other. The heat-averaging portion 102 transfers the heat dissipated by the first heating device 201 to the heat-conducting portion 103, and the heat-conducting portion 103 then transfers the heat to the second shell 400, and the heat can be dissipated outside the second shell 400, thereby further accelerating the heat dissipation of the first heating device 201.

[0079] As a possible embodiment, a plurality of heat dissipation protrusions 401 or heat dissipation fins may be provided on the outer wall of the second housing 400 to increase the heat dissipation area of ​​the second housing 400, thereby improving the heat dissipation efficiency of the second housing 400, and further improving the heat dissipation efficiency of the photovoltaic optimizer as a whole. Specifically, the heat dissipation protrusions 401 or heat dissipation fins may be made of metal, etc. When the heat dissipation protrusions 401 or heat dissipation fins and the second housing 400 are both made of metal, the heat dissipation protrusions 401 or heat dissipation fins may be integrally formed with the second housing 400. The heat dissipation protrusions 401 or heat dissipation fins may be provided on a side wall of the second housing 400 facing the first side of the circuit board 200 and extend outward, thereby accelerating the heat dissipation of the first heating device 201 and the second heating device 202.

[0080] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed in the present application should be covered within the protection scope of the present application.

Claims

1. A packaging structure, characterized in that: It includes a first shell, a circuit board and a heat insulation part; The circuit board is arranged inside the first housing, a first heating device and a second heating device are arranged on a first surface of the circuit board at intervals, and a heat generation of the first heating device at maximum power is greater than a heat generation of the second heating device at maximum power; The first end of the heat insulating portion is located on a side wall of the first housing facing the first surface of the circuit board, the second end of the heat insulating portion extends toward the first surface of the circuit board, and the heat insulating portion separates the adjacent first heating device and the second heating device on both sides of the heat insulating portion; Wherein, the first shell and the heat insulation part are made of plastic material; A heat-distributing portion is disposed on the inner wall of the first shell, the heat-distributing portion is disposed corresponding to the position of the first heating element, and the heat-distributing portion abuts against the first heating element; A second opening is provided on the first shell at a position corresponding to the heat equalizing portion, a heat conducting portion is provided in the second opening, and the heat conducting portion abuts against the heat equalizing portion; The packaging structure further includes a second shell, which is made of metal and arranged outside the first shell. The inner wall of the second shell abuts against the outer wall of the first shell on a side where the heat conducting portion is arranged.

2. The packaging structure according to claim 1, characterized in that: The heat insulating portion has a cavity therein, and the cavity is filled with a gas in contact with the first shell.

3. The packaging structure according to claim 2, characterized in that: The first end of the heat insulating portion has a first opening, and the cavity is communicated with the first opening.

4. The packaging structure according to any one of claims 1 to 3, characterized in that: The first shell is filled with a heat-conducting medium, and the heat-conducting medium fills the inner space of the first shell.

5. The packaging structure according to any one of claims 1 to 3, characterized in that: The projection shape of the heat insulation portion on the first surface of the circuit board is a straight line, a curve or a broken line.

6. The packaging structure according to any one of claims 1 to 3, characterized in that: The projection shape of the heat insulation portion on the first surface of the circuit board is U-shaped, quadrilateral, circular or elliptical.

7. The packaging structure according to any one of claims 1 to 3, characterized in that: One of the first heat-generating components is separated from one of the second heat-generating components by a plurality of the heat-insulating parts.

8. The packaging structure according to claim 7, characterized in that: The outer wall of the second shell is provided with heat dissipation protrusions or heat dissipation fins to increase the heat dissipation area of ​​the second shell.

9. The packaging structure according to claim 8, characterized in that: The heat dissipation protrusion or heat dissipation fin is arranged on a side wall of the second housing facing the first surface of the circuit board and extends outward.

10. A photovoltaic optimizer, characterized in that: It includes a first shell, a second shell, a circuit board and a heat insulation part; The first shell is disposed inside the second shell, and a heat-conducting connection is provided between the first shell and the second shell to conduct heat inside the first shell to the outside; The circuit board is arranged inside the first housing, a first heating device and a second heating device are arranged on a first surface of the circuit board at intervals, and a heat generation of the first heating device at maximum power is greater than a heat generation of the second heating device at maximum power; The first end of the heat insulating portion is located on a side wall of the first housing facing the first surface of the circuit board, the second end of the heat insulating portion extends toward the first surface of the circuit board, and the heat insulating portion separates the adjacent first heating device and the second heating device on both sides of the heat insulating portion; Wherein, the first shell and the heat insulation part are made of plastic material, and the second shell is made of metal material; A heat-distributing portion is disposed on the inner wall of the first shell, the heat-distributing portion is disposed corresponding to the position of the first heating element, and the heat-distributing portion abuts against the first heating element; A second opening is provided on the first shell at a position corresponding to the heat equalizing portion, a heat conducting portion is provided in the second opening, and the heat conducting portion abuts against the heat equalizing portion; The inner wall of the second shell abuts against the outer wall of the first shell on the side where the heat conduction portion is provided.

11. The photovoltaic optimizer according to claim 10, characterized in that: The heat insulating portion has a cavity therein, and the cavity is filled with a gas in contact with the first shell.

12. The photovoltaic optimizer according to claim 11, characterized in that: The first end of the heat insulating portion has a first opening, and the cavity is communicated with the space between the first shell and the second shell through the first opening.

13. The photovoltaic optimizer according to any one of claims 10 to 12, characterized in that: The outer wall of the second shell is provided with heat dissipation protrusions or heat dissipation fins to increase the heat dissipation area of ​​the second shell; The heat dissipation protrusion or heat dissipation fin is arranged on a side wall of the second housing facing the first surface of the circuit board and extends outward.

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