A five-layer relay hardware connection architecture

Abstract

The present invention discloses a five-layer relay hardware connection architecture, which includes: a top-level function module layer, a secondary function circuit layer, a parallel high-efficiency control layer, a node connection layer, and a bottom interface layer. The top-level function module layer is connected to the secondary function circuit layer, the parallel high-efficiency control layer, and the bottom interface layer; the secondary function circuit layer is connected to the parallel high-efficiency control layer and the bottom interface layer; the parallel high-efficiency control layer is connected to the node connection layer; and the node connection layer is connected to the bottom interface layer. The present invention adopts a five-level hardware connection architecture in the relay interface connection circuit. For a system in which each interface needs to connect to a different function circuit, the complexity of the system can be reduced and the number of relays used in the system can be reduced; the structure divided by the connection level makes the system relay structure more hierarchical and structural, and the hardware connection multi-level management architecture is more convenient for system management.

Description

Technical Field

[0001] The present invention relates to the fields of automation system control, electronic technology and specific physical operation, and is a relay hardware connection architecture for realizing multi-interface system control through five-level relay connections. Background Art

[0002] With the rapid development of science and technology, system interface control and interface testing in electronic engineering are becoming more and more complex, and the number of interfaces that need to be controlled is increasing. In the case of state changes, a single fixed connection cannot meet the requirements, and relays can be switched to any state as needed, which is convenient and simple, so relays have become a common choice for interface control. The control of relays is very simple, and the closing of relays can be controlled through simple operations. Relays are widely used in automatic control systems, but the hardware connection architecture for a large number of relay controls on the market is not mature enough. For multi-interface test platforms, the complexity of relay control is still very large, and it cannot be applied to control systems with more than one hundred interfaces. Summary of the invention

[0003] The purpose of the present invention is to propose a five-layer relay hardware connection architecture for increasingly complex system interface control and interface testing, aiming to:

[0004] (1) Simplify the complex relay connection structure and reduce the difficulty and complexity of interface control;

[0005] (2) The relay hardware connection architecture is divided into five different functional levels to achieve hierarchical and structural system interface control and interface testing;

[0006] (3) The system interface control and interface testing can be more flexibly implemented through the relay hardware connection architecture, and new functions and relay hardware connection architecture can be added scalably to the established system structure according to system requirements.

[0007] The specific technical solution for achieving the purpose of the present invention is:

[0008] A five-layer relay hardware connection architecture, characterized in that the architecture includes a top-level function module layer, a secondary function circuit layer, a parallel high-efficiency control layer, a node connection layer and a bottom-level interface layer, wherein the top-level function module layer is connected to the secondary function circuit layer, the parallel high-efficiency control layer and the bottom-level interface layer;

[0009] The secondary functional circuit layer is connected to the parallel high-efficiency control layer and the bottom interface layer, and is used to reuse the basic functional circuits, thereby reducing the complexity of the circuit and reducing redundant circuit design;

[0010] The parallel high-efficiency control layer is connected to the node connection layer and is used to transmit and receive data with the nodes of the node connection layer;

[0011] The node connection layer is connected to the bottom interface layer and is used to simplify the structure of multiple interfaces into two nodes, which is more convenient for control and management of the relay connection architecture.

[0012] The top functional module layer is composed of one or more top functional circuits and circuit selection control relays; the top functional circuit includes a VCC power supply circuit, a resistance test circuit, a capacitance test circuit, a voltage test circuit, a sampling circuit, an adjustable power supply circuit, a diode conduction test circuit, a volt-ampere characteristic test circuit, a current injection loop circuit, a PWM voltage generation circuit, a GND test loop circuit, a signal source generation circuit and a power conversion circuit;

[0013] When the top-level functional circuit is a resistance test circuit or a capacitance test circuit, the circuit further includes a built-in relay; the built-in relay is a charge and discharge relay switch control circuit of the resistance test circuit and the capacitance test circuit;

[0014] The circuit selection control relay module is composed of one or more relay switches, which are connected to one or more top-level functional circuits, and one top-level functional circuit is connected to a relay switch in the circuit selection control relay module; the function of the circuit selection control relay module is: by closing a relay switch in the circuit selection control relay module, the circuit between the top-level functional circuit connected by the relay switch and the secondary functional circuit layer is connected, so that the circuit connection between different top-level functional circuits and the secondary functional circuit layer is realized by closing the relay switches in different circuit selection control relay modules, so as to achieve a circuit selection control function; the top-level functional circuit selected by the circuit selection control relay module is a VCC power supply circuit, a voltage test circuit, an adjustable power supply circuit, a PWM voltage generation circuit, a signal source generation circuit or a power conversion circuit;

[0015] When the top-level functional circuit in the top-level functional module layer is a VCC power supply circuit, a power conversion circuit or a GND test loop circuit, the top-level functional circuit is directly connected to the bottom-level interface layer to achieve direct connection control between the top and bottom layers.

[0016] The secondary functional circuit layer is composed of m secondary functional circuits, where the range of m is greater than 1 and less than n, wherein n is the number of external interfaces; the secondary functional circuit includes a voltage amplification circuit, a current testing circuit and a filtering circuit; one end of a secondary functional circuit is connected to a control relay in the parallel high-efficiency control layer, and the other end is connected to the top-level functional module layer; for a secondary functional circuit layer in which the number of secondary functional circuits is less than n, x top-level functional circuits in the top-level functional module layer will be directly connected to the parallel high-efficiency control layer, and x is less than or equal to n minus m.

[0017] The parallel efficient control layer is composed of several relay control circuits Ki in parallel, connected to the secondary functional circuit layer or the top functional module layer upward, and connected to the node connection layer downward or directly connected to the bottom interface layer, where i is less than or equal to n.

[0018] The node connection layer is composed of two nodes, namely, node X and node Y (42), and all external interfaces are connected through relays to finally form two nodes with circuit characteristics. The two nodes can realize a complete circuit loop, which facilitates the interface control of the overall system;

[0019] The parallel high-efficiency control layer can select the top-level functional circuit and the secondary functional circuit to which the nodes X and Y of the node connection layer are connected by controlling the parallel relays.

[0020] The bottom interface layer is directly connected to n external interfaces; each external interface is connected to two relays, one relay is connected to the node X of the node connection layer, and the other relay is connected to the node Y of the node connection layer. The bottom interface layer is composed of these 2n relays.

[0021] The beneficial effects of the present invention are:

[0022] (1) The present invention adopts a hierarchical hardware connection architecture in the relay interface connection circuit. For a system where each interface needs to be connected to a different functional circuit, the present invention can reduce the complexity of the system and the number of relays used in the system;

[0023] (2) The present invention makes the system relay structure more hierarchical and structural through the hierarchical division structure of hardware connection. It is a hardware connection multi-level management architecture, which is more convenient for system management.

[0024] (3) The five-level structure of the present invention makes the relay hardware connection structure more flexible, and the system with relatively flexible functions can also be flexibly divided into levels and applied to the present architecture.

[0025] (4) There is no rigid regulation on the number of bottom-level interfaces of the present invention, which can be increased or decreased according to system requirements; the top-level functional circuit module layer and the secondary functional circuit layer can also be increased or decreased according to system needs, and the architecture has strong scalability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the hierarchical architecture of the present invention;

[0027] Figure 2 Schematic diagram of a hierarchical architecture in an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0029] See also Figure 1 The present invention comprises a top functional module layer 1, a secondary functional circuit layer 2, a parallel efficient control layer 3, a node connection layer 4 and a bottom interface layer 5, wherein the top functional module layer 1 is connected to the secondary functional circuit layer 2, the parallel efficient control layer 3 and the bottom interface layer 5;

[0030] The secondary functional circuit layer 2 is connected to the parallel high-efficiency control layer 3 and the bottom interface layer 5, and is used to reuse the basic functional circuits, thereby reducing the complexity of the circuit and reducing redundant circuit design;

[0031] The parallel high-efficiency control layer 3 is connected to the node connection layer 4, and is used to transmit and receive data with the nodes of the node connection layer;

[0032] The node connection layer 4 is connected to the bottom interface layer 5 to simplify the structure of multiple interfaces into two nodes, which is more convenient for control and management of the relay connection architecture.

[0033] The top functional module layer 1 is composed of one or more top functional circuits 11 and a circuit selection control relay 12; the top functional circuit 11 includes a VCC power supply circuit, a resistance test circuit, a capacitance test circuit, a voltage test circuit, a sampling circuit, an adjustable power supply circuit, a diode conduction test circuit, a volt-ampere characteristic test circuit, a current injection loop circuit, a PWM voltage generation circuit, a GND test loop circuit, a signal source generation circuit and a power conversion circuit;

[0034] When the top-level functional circuit 11 is a resistance test circuit or a capacitance test circuit, the circuit further includes a built-in relay 110; the built-in relay 110 is a charge and discharge relay switch control circuit of the resistance test circuit and the capacitance test circuit;

[0035] The circuit selection control relay module 12 is composed of one or more relay switches, connected to one or more top-level functional circuits 11, and one top-level functional circuit 11 is connected to a relay switch in the circuit selection control relay module 12; the function of the circuit selection control relay module 12 is: by closing a relay switch in the circuit selection control relay module 12, the circuit between the top-level functional circuit 11 connected by the relay switch and the secondary functional circuit layer 2 is connected, so that the circuit connection between different top-level functional circuits 11 and the secondary functional circuit layer 2 is achieved by closing the relay switches in different circuit selection control relay modules 12, so as to achieve a circuit selection control function; the top-level functional circuit 11 selected by the circuit selection control relay module 12 is a VCC power supply circuit, a voltage test circuit, an adjustable power supply circuit, a PWM voltage generation circuit, a signal source generation circuit or a power conversion circuit;

[0036] When the top-level functional circuit 11 in the top-level functional module layer 1 is a VCC power supply circuit, a power conversion circuit or a GND test loop circuit, the top-level functional circuit 11 is directly connected to the bottom-level interface layer 5 to achieve direct connection control between the top and bottom layers.

[0037] The secondary functional circuit layer 2 is composed of m secondary functional circuits 21, where the range of m is greater than 1 and less than n, wherein n is the number of external interfaces; the secondary functional circuit 21 includes a voltage amplification circuit, a current testing circuit and a filtering circuit; one end of a secondary functional circuit 21 is connected to a control relay in the parallel high-efficiency control layer 3, and the other end is connected to the top-level functional module layer 1; for the secondary functional circuit layer 2 in which the number of secondary functional circuits 21 is less than n, there are x top-level functional circuits 11 in the top-level functional module layer 1 that will be directly connected to the parallel high-efficiency control layer 3, and x is less than or equal to n minus m.

[0038] The parallel high-efficiency control layer 3 is composed of several relay control circuits Ki in parallel, connected to the secondary functional circuit layer 2 or the top functional module layer 1 upward, and connected to the node connection layer 4 downward or directly connected to the bottom interface layer 5, where i is less than or equal to n.

[0039] The node connection layer 4 is composed of two nodes, namely, node X 41 and node Y 42. All external interfaces are connected through relays to finally form two nodes with circuit characteristics. The two nodes can realize a complete circuit loop, which is convenient for interface control of the overall system.

[0040] The parallel high-efficiency control layer 3 can select the top-level functional circuit 11 and the secondary functional circuit 21 to which the node X 41 and the node Y 42 of the node connection layer 4 are connected by controlling the parallel relays.

[0041] The bottom interface layer 5 is directly connected to n external interfaces; each external interface is connected to two relays, one relay is connected to the node X 41 of the node connection layer 4, and the other relay is connected to the node Y 42 of the node connection layer 4. The bottom interface layer 5 is composed of these 2n relays. Example

[0042] See also Figure 2 , this embodiment takes a packaging test system with 256 external interfaces as an example.

[0043] There are 256 external interfaces in this embodiment, namely interface 0 to interface 255, each interface is connected to two relays, and is connected to node X and node Y of node connection layer 4 through two relays respectively. Interface 0 to interface 255 are connected to 512 relays in total, and these 512 relays constitute the bottom interface layer 5.

[0044] In this embodiment, the parallel high-efficiency control layer 3 is composed of relays K1 to K8, relays K1 and K2 are directly connected to the underlying interface layer 5, relays K3, K4, K5 are connected to node Y of the node connection layer 4, and K6, K7, K8 are connected to node X of the node connection layer 4.

[0045] The top functional circuit 11 of the top functional module layer 1 includes a VCC power supply circuit, a sampling circuit, an adjustable power supply module, a resistance test circuit, a capacitance test circuit, a volt-ampere characteristic test circuit and a GND common ground loop functional circuit.

[0046] Among them, the GND common ground loop functional circuit is directly connected to the interface 255 of the bottom interface layer 5; the VCC power supply circuit, the resistance test circuit, the capacitance test circuit, and the volt-ampere characteristic test circuit are directly connected to the parallel high-efficiency control layer 3; the sampling circuit is connected to the current test circuit of the secondary functional circuit layer 2; the adjustable power supply circuit is connected to the circuit selection control relay module 12, and the circuit selection control relay module 12 is connected to the voltage amplifier circuit in the secondary functional circuit layer 2.

[0047] The VCC power supply circuit of the top-level functional module layer 1 is connected to the relay K1 in the parallel high-efficiency control layer 3. By closing the relay K1, the top-level VCC power supply function circuit can supply power to the external circuit connected to the interface 0. The GND of the external circuit is required to be connected to the interface 255 to achieve the purpose of common ground.

[0048] The sampling circuit of the top functional module layer 1 is connected to the current test functional circuit of the secondary functional circuit layer 2, and the current test functional circuit of the secondary functional circuit layer 2 is connected to the relay K2 of the parallel high-efficiency control layer 3. By closing the relay K2, the interface 1 of the bottom interface layer 5 can be connected to the current test circuit of the secondary functional circuit layer 2. The function of the current test circuit of the secondary functional circuit layer 2 is to calculate the current flowing through the sampling resistor by testing the voltage across the sampling circuit. After the relay K2 of the parallel high-efficiency control layer 3 is closed, the current of the interface 1 passes through the sampling resistor of the secondary current test circuit, and the voltage across the sampling resistor is obtained by the operation of the sampling circuit, thereby calculating the current flowing through the interface 1.

[0049] The adjustable power supply circuit of the top-level functional module layer 1 is connected to the circuit selection control relay module 12, and the adjustable power supply circuit is turned on by closing the relay switch in the circuit selection control relay module 12; the voltage amplification circuit of the secondary functional circuit layer 2 is connected to the relay K3 of the parallel high-efficiency control layer 3, and the voltage amplification circuit of the secondary functional circuit layer 2 can be connected to the node Y of the node connection layer 4 by closing the relay K3. The adjustable power supply module of the top functional module layer 1 is composed of 6 power supply circuits, which can output voltages of 0.5V, 0.75V, 0.9V, 1.25V, 1.65V, and 2.5V respectively. The amplification factor of the voltage amplifier circuit of the secondary functional circuit layer 2 is 2, so the voltages after amplification are 1V, 1.5V, 1.8V, 2.5V, 3.3V, and 5V respectively; a voltage value is selected to be output through the circuit selection controller module 12, and then output through the voltage amplifier circuit of the secondary functional circuit layer 2. The amplified power supply is connected to the node Y of the node connection layer 4 through the relay K3 of the parallel high-efficiency control layer 3. Through the node Y of the node connection layer 4, the adjustable power supply of the top functional module layer 1 can be connected to any one of the interfaces 0 to 254 of the bottom interface layer 5, thereby realizing the adjustable power supply function to any one of the interfaces 0 to 254 of the bottom interface layer.

[0050] The resistance test circuit and the capacitance test circuit of the top functional module layer 1, the resistance and capacitance tested are both two-port passive components, so two interfaces are required in the bottom interface layer 5 to be connected to the two ends of the resistance and capacitance respectively. The resistance test circuit in the top functional module layer 1 is divided into two parts, one part of the resistance test circuit is connected to the relay K4 of the parallel high-efficiency control layer 3, and is connected to the node Y of the node control layer 4 through the relay K4 of the parallel high-efficiency control layer 3; the other part of the resistance test circuit is connected to the relay K6 of the parallel high-efficiency control layer 3, and is connected to the node X of the node control layer 4 through the relay K6 of the parallel high-efficiency control layer 3. The two nodes of the node connection layer 4 can be connected to any one of the interfaces 0 to 254 of the bottom interface layer 5 through the relay, and two interfaces are selected to be connected to the two ends of the resistance to be tested respectively. The above is a complete resistance test circuit.

[0051] Similarly, the capacitor test circuit in the top-level functional module layer 1 is divided into two parts. One part of the capacitor test circuit is connected to the relay K5 of the parallel high-efficiency control layer 3, and is connected to the node Y of the node control layer 4 through the relay K5 of the parallel high-efficiency control layer 3; the other part of the capacitor test circuit is connected to the relay K7 of the parallel high-efficiency control layer 3, and is connected to the node X of the node control layer 4 through the relay K7 of the parallel high-efficiency control layer 3. The two nodes of the node connection layer 4 can be connected to any one of the interfaces 0 to 254 of the bottom interface layer 5 through the relay. Two interfaces are selected and connected to the two ends of the capacitor to be tested respectively. The above is a complete capacitor test circuit.

[0052] The resistance test circuit and capacitance test circuit of the top functional module layer 1 are composed of an RC charge and discharge circuit and an internal relay circuit 110. The charge and discharge switch is the internal relay module 110. The RC charge and discharge are controlled by closing the switch. The resistance and capacitance values ​​to be tested can be calculated by measuring the RC charge and discharge time.

[0053] The volt-ampere characteristic test module of the top-level functional module layer 1 is connected to the relay K8 of the parallel high-efficiency control layer 3, and is connected to the node X of the node connection layer 4 through the relay K8 of the parallel high-efficiency control layer 3, so that the volt-ampere characteristic test of any interface from interface 0 to interface 254 of the bottom-level interface layer 5 can be realized through the node X of the node connection layer 4.

Claims

1. A five-layer relay hardware connection architecture, characterized in that: The architecture comprises a top functional module layer (1), a secondary functional circuit layer (2), a parallel high-efficiency control layer (3), a node connection layer (4) and a bottom interface layer (5), wherein the top functional module layer (1) is connected to the secondary functional circuit layer (2), the parallel high-efficiency control layer (3) and the bottom interface layer (5); The secondary functional circuit layer (2) is connected to the parallel high-efficiency control layer (3) and the bottom interface layer (5) and is used for multiplexing basic functional circuits; The parallel high-efficiency control layer (3) is connected to the node connection layer (4) and is used to transmit and receive data with the nodes of the node connection layer; The node connection layer (4) is connected to the bottom interface layer (5) and is used to simplify the structure of multiple interfaces into two nodes; wherein: The top functional module layer (1) is composed of one or more top functional circuits (11) and a circuit selection control relay module (12); the top functional circuit (11) includes a VCC power supply circuit, a resistance test circuit, a capacitance test circuit, a voltage test circuit, a sampling circuit, an adjustable power supply circuit, a diode conduction test circuit, a volt-ampere characteristic test circuit, a current injection loop circuit, a PWM voltage generation circuit, a GND test loop circuit, a signal source generation circuit and a power conversion circuit; When the top-level functional circuit (11) is a resistance test circuit or a capacitance test circuit, the circuit further includes a built-in relay (110); the built-in relay (110) is a charge and discharge relay switch control circuit of the resistance test circuit and the capacitance test circuit; The circuit selection control relay module (12) is composed of one or more relay switches, connected to one or more top-level functional circuits (11), and one top-level functional circuit (11) is connected to a relay switch in the circuit selection control relay module (12); the function of the circuit selection control relay module (12) is to conduct the circuit between the top-level functional circuit (11) connected to the relay switch and the secondary functional circuit layer (2) by closing a relay switch in the circuit selection control relay module (12), thereby achieving the circuit conduction between different top-level functional circuits (11) and the secondary functional circuit layer (2) by closing the relay switches in different circuit selection control relay modules (12), thereby achieving a circuit selection control function; the top-level functional circuit (11) selected by the circuit selection control relay module (12) is a VCC power supply circuit, a voltage test circuit, an adjustable power supply circuit, a PWM voltage generation circuit, a signal source generation circuit or a power conversion circuit; When the top functional circuit (11) in the top functional module layer (1) is a VCC power supply circuit, a power conversion circuit or a GND test loop circuit, the top functional circuit (11) is directly connected to the bottom interface layer (5) to achieve direct connection control between the top layer and the bottom layer; The secondary functional circuit layer (2) is composed of m secondary functional circuits (21), where m is greater than 1 and less than n, wherein n is the number of external interfaces; the secondary functional circuit (21) includes a voltage amplification circuit, a current test circuit and a filter circuit; one end of a secondary functional circuit (21) is connected to a control relay in the parallel high-efficiency control layer (3), and the other end is connected to the top functional module layer (1); for a secondary functional circuit layer (2) in which the number of secondary functional circuits (21) is less than n, x top functional circuits (11) in the top functional module layer (1) will be directly connected to the parallel high-efficiency control layer (3), and x is less than or equal to n minus m; The parallel high-efficiency control layer (3) is composed of a number of relay control circuits Ki in parallel, connected to the secondary functional circuit layer (2) or the top functional module layer (1) upward, and connected to the node connection layer (4) downward or directly connected to the bottom interface layer (5), wherein i is less than or equal to n; The node connection layer (4) is composed of two nodes, namely, node X (41) and node Y (42). All external interfaces are connected through relays to finally form two nodes with circuit characteristics. The two nodes can realize a complete circuit loop. The parallel high-efficiency control layer (3) is capable of controlling the parallel relays to select the top functional circuit (11) and the secondary functional circuit (21) to which the node X (41) and the node Y (42) of the node connection layer (4) are connected; The bottom interface layer (5) is directly connected to n external interfaces; each external interface is connected to two relays, one relay is connected to the node X (41) of the node connection layer (4), and the other relay is connected to the node Y (42) of the node connection layer (4). The bottom interface layer (5) is composed of these 2n relays.

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