An intelligent winding device for semiconductor materials

Abstract

The present invention discloses an intelligent winding device for semiconductor materials, including a bottom plate and a guiding mechanism; a pair of first brackets are connected to the bottom plate, a winding roller is connected between the pair of first brackets, a driving motor is installed on one of the first brackets, and the output shaft of the driving motor is connected to the winding roller; the guiding mechanism is fixedly installed on the bottom plate and arranged on one side of the winding roller, and is used to guide the winding of the semiconductor material to avoid the disorder of the semiconductor material, and the guiding mechanism includes a pair of second brackets. The present invention can position and wind up the semiconductor flexible winding material through the setting of the corresponding mechanism, avoid deviation of the semiconductor flexible material during the winding process, and further avoid the uneven winding of the semiconductor flexible material, thereby avoiding the curling phenomenon of the boundary of the semiconductor flexible material due to external force, protecting the semiconductor flexible material, and ensuring the subsequent processing quality of the semiconductor device.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor material production equipment, and in particular relates to an intelligent winding device for semiconductor materials. Background Art

[0002] Semiconductor materials are a type of electronic material that has semiconductor properties (the electrical conductivity is between that of conductors and insulators, and the resistivity is approximately in the range of 1mΩ·cm-1GΩ·cm) and can be used to make semiconductor devices and integrated circuits.

[0003] When semiconductor devices are produced, semiconductor materials need to be rolled up, especially semiconductor flexible materials, to facilitate later transportation and storage. Existing semiconductor flexible materials are generally rolled up using a winding roller, that is, the motor drives the winding roller to rotate, thereby achieving the winding of the semiconductor flexible material. However, the winding roller lacks a positioning and winding mechanism for the semiconductor flexible material, which causes the semiconductor flexible material to easily deviate during winding, making it impossible for the semiconductor flexible material to be neatly rolled up, causing the boundary of the semiconductor material to be easily affected by external forces and curling, thereby causing damage to the semiconductor flexible material and affecting the subsequent production quality of semiconductor devices.

[0004] Therefore, in view of the above technical problems, it is necessary to provide an intelligent winding device for semiconductor materials. Summary of the invention

[0005] The object of the present invention is to provide an intelligent winding device for semiconductor materials to solve the problem that the semiconductor flexible materials mentioned above are affected in winding due to the lack of a positioning winding mechanism.

[0006] In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0007] An intelligent winding device for semiconductor materials comprises a bottom plate and a guiding mechanism;

[0008] A pair of first brackets are connected to the bottom plate, a winding roller is connected between the pair of first brackets, a driving motor is installed on one of the first brackets, and an output shaft of the driving motor is connected to the winding roller;

[0009] The guiding mechanism is fixedly mounted on the bottom plate and is arranged on one side of the winding roller, and is used for guiding the winding of the semiconductor material to avoid the disorder of the semiconductor material. The guiding mechanism comprises a pair of second brackets, and a rotating disk is rotatably connected to the second brackets. A guiding roller is fixedly connected between the pair of rotating disks. A cavity is excavated in the guiding roller, and an electromagnetic plate is arranged in the cavity. A gas distribution cavity and a positioning cavity are formed between the inner wall of the cavity and the electromagnetic plate. A plurality of evenly distributed partitions are arranged in the positioning cavity, and a linkage positioning groove is formed between the pair of partitions. A plurality of linkage positioning mechanisms are installed in the linkage positioning groove.

[0010] Furthermore, a mounting plate is mounted on one of the first brackets, and the driving motor is mounted on the mounting plate.

[0011] Furthermore, the length of the guide roller is greater than the length of the winding roller, thereby ensuring the guiding effect of the guide roller on the semiconductor soft material, so that the semiconductor soft material can be fully guided and wound on the winding roller.

[0012] Furthermore, a plurality of evenly distributed positioning holes are drilled on the outer side wall of the guide roller to facilitate the extension and storage of the positioning posts, so that the plurality of positioning posts can be used to position and guide the winding of the semiconductor soft material;

[0013] The linkage positioning mechanism includes positioning posts, and the positioning posts are arranged in a one-to-one correspondence with the positioning holes. When the semiconductor flexible material needs to be rolled up, it is only necessary to control the corresponding plurality of positioning posts to extend, and the extended positioning posts can position the side walls of the semiconductor flexible material, thereby achieving a guiding rolling effect of the semiconductor flexible material, avoiding the messy rolling of the semiconductor flexible material, and ensuring the rolling effect of the semiconductor flexible material;

[0014] The linkage type positioning groove is connected with the outside through the positioning hole.

[0015] Furthermore, one end of the positioning column located in the linkage positioning groove is connected to a limiting plate, which is used to limit the positioning column on one hand to prevent the positioning column from completely extending out of the positioning hole, and on the other hand, is used to fix the positioning column through mutual cooperation with the electromagnetic plate, that is, when the positioning column does not need to be extended, the positioning column can be fixed on the electromagnetic plate through mutual cooperation with the limiting plate and the electromagnetic plate, so as to prevent the positioning column from extending out during rotation, thereby ensuring the guiding effect of the guide roller on the semiconductor flexible material;

[0016] A sealing member is connected between the limit plate and the side wall of the linkage positioning groove, which is used to wrap the limit plate. At the same time, when the limit plate is not affected by the attraction force of the electromagnetic plate, the extension effect of the positioning column can be increased, thereby ensuring the positioning effect of the positioning column on the semiconductor flexible material. The positioning hole can also be sealed to avoid leakage of gas in the linkage positioning groove, thereby ensuring the squeezing effect of the gas on the positioning column and the limit plate and avoiding retraction of the positioning column.

[0017] Furthermore, the limit plate is made of a magnetic metal material. When the electromagnetic plate is magnetic, the limit plate is attracted by the magnetic force and can contact and fix with the electromagnetic plate, thereby preventing the positioning column that does not need to be extended from the positioning hole under the action of the rotating centrifugal force, which is convenient for the user to control the extension of the positioning column.

[0018] The sealing member is made of elastic rubber material, which increases the effect of the sealing member on the limiting plate and can also improve the sealing effect on the positioning hole.

[0019] Furthermore, a plurality of gas distribution pipes are installed on the electromagnetic plate, and the gas distribution pipes are arranged corresponding to the linkage positioning grooves. The linkage positioning grooves are connected with the gas distribution cavity through the gas distribution pipes, so that the gas in the gas distribution cavity enters the linkage positioning grooves through the gas distribution pipes, and the gas is used to squeeze the limit plate and the positioning column, so that the positioning column can extend out of the positioning hole, and the extended positioning hole is used to position the winding of the semiconductor flexible material, thereby ensuring the winding effect of the semiconductor flexible material;

[0020] The gas distribution pipe is provided with a first solenoid valve, which is convenient for the user to intelligently control the on and off of the gas distribution pipe, that is, it can intelligently control which linkage positioning grooves can be injected with gas, that is, it can control which positioning columns can extend out of the positioning holes.

[0021] Furthermore, an installation cavity is provided in the guide roller, and an air pump and a power supply are installed in the installation cavity. The air pump is used to generate gas, and then use the gas to squeeze the positioning column and the limit plate, so that the positioning column can extend out of the positioning hole. The power supply supplies power to the electromagnetic plate. When the electromagnetic plate is energized, it can generate strong magnetism to attract the limit plate, so that the limit plate can be contacted and fixed with the electromagnetic plate.

[0022] Furthermore, the air pump is connected to an air outlet end, the air outlet end is communicated with the air distribution chamber, and a second solenoid valve is installed on the air pump air outlet end to prevent the gas in the air distribution chamber from flowing back.

[0023] Furthermore, the power supply is electrically connected to the electromagnetic plate.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] The present invention can position and roll up the semiconductor flexible rolling material through the setting of the corresponding mechanism, avoid deviation of the semiconductor flexible material during the rolling process, and further avoid uneven rolling of the semiconductor flexible material, thereby avoiding curling of the semiconductor flexible material due to external force at the boundary, protecting the semiconductor flexible material, and ensuring the subsequent processing quality of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A three-dimensional diagram of a use state of an intelligent winding device for semiconductor materials in one embodiment of the present invention;

[0028] Figure 2 for Figure 1 Schematic diagram of the structure at A in the middle;

[0029] Figure 3 A three-dimensional diagram of an unused state of an intelligent winding device for semiconductor materials according to an embodiment of the present invention;

[0030] Figure 4 for Figure 3 Schematic diagram of the structure at B in the middle;

[0031] Figure 5 is a cross-sectional view of a guide mechanism in one embodiment of the present invention;

[0032] Figure 6 for Figure 5 Schematic diagram of the structure at C in the middle;

[0033] Figure 7 for Figure 5 Schematic diagram of the structure at D in the middle;

[0034] Figure 8 for Figure 5 Schematic diagram of the structure at E in the middle;

[0035] Fig. 9 It is a side cross-sectional view of a smart winding device for semiconductor materials in use according to one embodiment of the present invention;

[0036] Fig.10 for Fig. 9 Schematic diagram of the structure at F in the middle;

[0037] Fig.11It is a front view of a use state of an intelligent winding device for semiconductor materials in one embodiment of the present invention;

[0038] Fig.12 for Fig.11 Schematic diagram of the structure at G in the middle.

[0039] In the figure: 1. bottom plate, 101. first bracket, 102. winding roller, 103. driving motor, 2. guiding mechanism, 201. second bracket, 202. rotating disk, 203. guiding roller, 204. cavity, 205. electromagnetic plate, 206. partition, 207. positioning hole, 208. positioning column, 209. limiting plate, 210. sealing member, 211. distribution pipe, 212. installation cavity, 213. air pump, 214. power supply, 215. auxiliary guiding member, 216. limiting member, 217. cylinder, 218. auxiliary positioning plate, 219. anti-wear pad, 220. arc groove, 221. locking screw. DETAILED DESCRIPTION

[0040] The present invention will be described in detail below in conjunction with the various embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0041] The present invention discloses an intelligent winding device for semiconductor materials, referring to Figure 1-Figure 12 As shown, it includes a base plate 1 and a guide mechanism 2.

[0042] A pair of first brackets 101 are connected to the bottom plate 1 for mounting a winding roller 102 . The winding roller 102 is connected between the pair of first brackets 101 , and the winding roller 102 is used to wind and roll up the semiconductor flexible material.

[0043] In addition, a driving motor 103 is installed on one of the first brackets 101 , and the output shaft of the driving motor 103 is connected to the winding roller 102 . The winding roller 102 is driven to rotate by the driving motor 103 , so as to be used to roll up the semiconductor flexible material.

[0044] Specifically, a mounting plate is mounted on one of the first brackets 101 , and the driving motor 103 is mounted on the mounting plate.

[0045] refer to Figure 1-Figure 12 As shown, the guide mechanism 2 is fixedly mounted on the bottom plate 1 and is disposed on one side of the winding roller 102 for guiding the winding of the semiconductor material to avoid the disorder of the semiconductor material.

[0046] Among them, the guiding mechanism 2 includes a pair of second brackets 201, and a rotating disk 202 is rotatably connected to the second bracket 201. A guiding roller 203 is fixedly connected between the pair of rotating disks 202. The guiding roller 203 is used to guide the winding of the semiconductor flexible material to avoid the disorder of the semiconductor flexible material when winding, thereby ensuring the winding and winding effect of the semiconductor flexible material and avoiding damage to the semiconductor flexible material.

[0047] Preferably, the length of the guide roller 203 is greater than the length of the winding roller 102 , so as to ensure the guiding effect of the guide roller 203 on the semiconductor soft material, so that the semiconductor soft material can be fully guided and wound on the winding roller 102 .

[0048] In addition, a cavity 204 is bored in the guide roller 203, and an electromagnetic plate 205 is provided in the cavity 204. The electromagnetic plate 205 generates magnetism under the action of a power source 214, which is used to attract the limit plate 209, and then to fix the positioning column 208, so that the positioning column 208 that does not need to extend out of the positioning hole 207 is fixed, thereby ensuring the guiding effect of the guide roller 203 on the semiconductor soft material.

[0049] Preferably, a gas distribution cavity and a positioning cavity are formed between the inner wall of the cavity 204 and the electromagnetic plate 205, that is, Figure 6 In the state shown, the gas distribution cavity is used to transport the gas generated by the air pump 213, and the positioning cavity is used to install multiple partitions 206.

[0050] Specifically, a plurality of evenly distributed partitions 206 are provided in the positioning cavity, and a linkage positioning groove is formed between a pair of partitions 206 , and the linkage positioning groove is used to install a plurality of positioning columns 208 .

[0051] In addition, a plurality of evenly distributed positioning holes 207 are drilled on the outer side wall of the guide roller 203 to facilitate the extension and storage of the positioning posts 208, so that the plurality of positioning posts 208 can be used to position and guide the winding of the semiconductor soft material.

[0052] refer to Figure 1-Figure 12 As shown, a plurality of linkage positioning mechanisms are installed in the linkage positioning groove, which are used for positioning and winding according to different semiconductor soft materials, thereby expanding the overall application scope.

[0053] Among them, the linkage positioning mechanism includes positioning columns 208, and the positioning columns 208 are arranged in a one-to-one correspondence with the positioning holes 207. When the semiconductor flexible material needs to be rolled up, it is only necessary to control the corresponding multiple positioning columns 208 to extend. The extended positioning columns 208 can position the side walls of the semiconductor flexible material, thereby achieving a guiding rolling effect of the semiconductor flexible material, avoiding messy rolling of the semiconductor flexible material, and ensuring the rolling effect of the semiconductor flexible material.

[0054] Preferably, the linkage positioning groove is connected to the outside through the positioning hole 207, so that the positioning column 208 can freely extend out of the positioning hole 207 for positioning the rolled semiconductor soft material.

[0055] In addition, one end of the positioning column 208 located in the linkage positioning groove is connected to a limiting plate 209, which is used to limit the positioning column 208 on the one hand to prevent the positioning column 208 from completely extending out of the positioning hole 207, and on the other hand, it is used to fix the positioning column 208 through mutual cooperation with the electromagnetic plate 205, that is, when the positioning column 208 does not need to be extended, the positioning column 208 can be fixed on the electromagnetic plate 205 through the mutual cooperation between the limiting plate 209 and the electromagnetic plate 205, so as to prevent the positioning column 208 from extending out during rotation, thereby ensuring the guiding effect of the guide roller 203 on the semiconductor flexible material.

[0056] Preferably, the gas pressure in the linkage positioning groove is greater than the magnetic force of the electromagnetic plate 205 on the limiting plate 209, that is, when gas is injected into the linkage positioning groove, the gas can separate the electromagnetic plate 205 and the limiting plate 209, thereby making the positioning column 208 extend from the positioning hole 207, and the extended positioning column 208 is used to position the semiconductor soft material.

[0057] Specifically, a sealing member 210 is connected between the limiting plate 209 and the side wall of the linkage positioning groove. Figure 6 The state shown is used to wrap the limiting plate 209. At the same time, when the limiting plate 209 is not affected by the attraction force of the electromagnetic plate 205, the extension effect of the positioning column 208 can be increased, thereby ensuring the positioning effect of the positioning column 208 on the semiconductor flexible material. The positioning hole 207 can also be sealed to avoid leakage of gas in the linked positioning groove, thereby ensuring the squeezing effect of the gas on the positioning column 208 and the limiting plate 209 and avoiding the retraction of the positioning column 208.

[0058] Preferably, the limit plate 209 is made of a magnetic metal material. When the electromagnetic plate 205 is magnetic, the limit plate 209 is attracted by the magnetic force and can contact and fix with the electromagnetic plate 205, thereby preventing the positioning column 208 that does not need to be extended from the positioning hole 207 under the action of the rotating centrifugal force, thereby facilitating the user to control the extension of the positioning column 208.

[0059] In addition, the sealing member 210 is made of elastic rubber material, which increases the effect of the sealing member 210 on the limiting plate 209 and also improves the sealing effect on the positioning hole 207 .

[0060] refer to Figure 5-Figure 10 As shown, a plurality of gas distribution pipes 211 are installed on the electromagnetic plate 205, and the gas distribution pipes 211 are arranged corresponding to the linkage positioning grooves, that is, Figure 6In the state shown, the linkage positioning groove is connected with the gas distribution cavity through the gas distribution pipe 211, so that the gas in the gas distribution cavity enters the linkage positioning groove through the gas distribution pipe 211, and the gas is used to squeeze the limit plate 209 and the positioning column 208, so that the positioning column 208 can extend out of the positioning hole 207, and the extended positioning hole 207 is used to position the winding of the semiconductor flexible material to ensure the winding effect of the semiconductor flexible material.

[0061] Among them, a first solenoid valve is installed on the gas distribution pipe 211, which is convenient for the user to intelligently control the on and off of the gas distribution pipe 211, that is, it can intelligently control which linked positioning grooves can be injected with gas, that is, it can control which positioning columns 208 can extend out of the positioning holes 207.

[0062] In addition, an installation cavity 212 is provided in the guide roller 203, and an air pump 213 and a power supply 214 are installed in the installation cavity 212. The air pump 213 is used to generate gas, and then use the gas to squeeze the positioning column 208 and the limit plate 209, so that the positioning column 208 can extend out of the positioning hole 207. The power supply 214 supplies power to the electromagnetic plate 205. When the electromagnetic plate 205 is energized, it can generate strong magnetism to attract the limit plate 209, so that the limit plate 209 can contact and be fixed with the electromagnetic plate 205.

[0063] Specifically, the air pump 213 is connected with an air outlet end, which is communicated with the air distribution chamber. A second solenoid valve is installed on the air outlet end of the air pump 213 to prevent the gas in the air distribution chamber from flowing back.

[0064] Preferably, the power source 214 is electrically connected to the electromagnetic plate 205 .

[0065] refer to Figure 1-Figure 12 As shown, an auxiliary guide 215 is provided on the outer side of the rotating disk 202 for installing the cylinder 217 and the auxiliary positioning plate 218. A limiting member 216 is fixedly connected to the rotating disk 202. A positioning groove matching the limiting member 216 is provided on the auxiliary guide 215. The limiting member 216 cooperates with the positioning groove to limit the auxiliary guide 215 so that the auxiliary guide 215 can rotate around the rotating disk 202 to adjust the angular position of the cylinder 217 and the auxiliary positioning plate 218.

[0066] Among them, a pair of auxiliary guide members 215 are connected to the facing surfaces with a cylinder 217, and the free end of the cylinder 217 is connected to an auxiliary positioning plate 218. The auxiliary positioning plate 218 is used to assist in positioning the side wall of the semiconductor flexible material to avoid the deviation of the semiconductor flexible material during the winding process, thereby ensuring the winding effect of the semiconductor flexible material.

[0067] Preferably, an anti-wear pad 219 is installed on the auxiliary positioning plate 218 to reduce the wear between the semiconductor flexible material and the auxiliary positioning plate 218 and ensure the guiding safety of the semiconductor flexible material.

[0068] In addition, an arc groove 220 is bored on the auxiliary positioning plate 218, and the arc groove 220 is arranged corresponding to the positioning column 208. When the positioning column 208 rotates following the guide roller 203, the positioning column 208 can pass through the arc groove 220, and then serve as a limit for the auxiliary positioning plate 218 to prevent the auxiliary positioning plate 218 from retracting.

[0069] Specifically, a locking screw 221 is threadedly connected to the auxiliary guide 215 for locking and fixing the auxiliary guide 215 to prevent the auxiliary guide 215 from rotating during auxiliary positioning, thereby ensuring the auxiliary positioning effect of the auxiliary positioning plate 218 on the semiconductor flexible material.

[0070] When used specifically, the winding roller 102 is driven to rotate by driving the motor 103, and then the winding roller 102 can be used to wind the semiconductor flexible material;

[0071] When the winding roller 102 winds the semiconductor flexible material, the guiding mechanism 2 can be used to guide the semiconductor flexible material. Specifically, a pair of cylinders 217 are controlled to extend toward each other according to the width of the semiconductor flexible material, and the cylinders 217 drive the auxiliary positioning plate 218 to move until the auxiliary positioning plate 218 contacts the semiconductor flexible material. At this time, the anti-wear pad 219 on the auxiliary positioning plate 218 can play a role in assisting the positioning of the semiconductor flexible material.

[0072] Then open the air pump 213 and the second solenoid valve on the air outlet pipe of the air pump 213, the gas enters the gas distribution cavity through the gas outlet pipe, and open the first solenoid valve on the corresponding gas distribution pipe 211, the gas in the gas distribution cavity enters the linkage positioning groove through the gas distribution pipe 211, as the gas in the linkage positioning groove gradually increases, the gas squeezes the limit plate 209 and the seal 210, so that the limit plate 209 and the seal 210 move, the limit plate 209 drives the positioning column 208 to move in the positioning hole 207, the extension amount of the positioning column 208 is set according to the position of the auxiliary positioning plate 218, so that the protruding positioning column 208 is just engaged in the arc groove 220;

[0073] When the air pump 213 is turned on, the power supply 214 also needs to be turned on. The power supply 214 makes the electromagnetic plate 205 generate magnetism. The electromagnetic plate 205 with magnetism can attract the limit plate 209 that is not squeezed by the gas, so that the positioning column 208 can be firmly fixed in the positioning hole 207, and the positioning column 208 that is not squeezed by the gas is prevented from rotating out of the positioning hole 207 under the action of the rotating centrifugal force, thereby ensuring the positioning effect of the protruding positioning column 208 on the semiconductor flexible material;

[0074] The user can also adjust the rotation angle of the cylinder 217 and the auxiliary positioning plate 218 by loosening the locking screw 221 and setting the position of the cylinder 217 and the auxiliary positioning plate 218 according to the needs. Through the setting of the guiding mechanism 2 in the present invention, the semiconductor flexible material can be well guided to avoid the deviation of the semiconductor flexible material during the winding process, thereby ensuring the winding effect of the semiconductor flexible material and avoiding damage to the semiconductor flexible material.

[0075] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0076] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that those skilled in the art can understand.

Claims

1. An intelligent winding device for semiconductor materials, characterized in that: include: A bottom plate (1), wherein a pair of first brackets (101) are connected to the bottom plate (1), a winding roller (102) is connected between the pair of first brackets (101), a driving motor (103) is mounted on one of the first brackets (101), and an output shaft of the driving motor (103) is connected to the winding roller (102); A guiding mechanism (2) is fixedly mounted on the bottom plate (1) and is disposed on one side of the winding roller (102), and is used to guide the winding of the semiconductor flexible material to avoid disorder of the semiconductor flexible material; The guide mechanism (2) comprises a pair of second brackets (201), a rotating disk (202) is rotatably connected to the second brackets (201), a guide roller (203) is fixedly connected between the pair of rotating disks (202), a cavity (204) is excavated in the guide roller (203), an electromagnetic plate (205) is arranged in the cavity (204), a gas distribution cavity and a positioning cavity are formed between the inner wall of the cavity (204) and the electromagnetic plate (205), a plurality of evenly distributed partitions (206) are arranged in the positioning cavity, a linkage positioning groove is formed between the pair of partitions (206), and a There are a plurality of linkage type positioning mechanisms, a plurality of evenly distributed positioning holes (207) are drilled on the outer side wall of the guide roller (203), the linkage type positioning mechanism comprises positioning columns (208), the positioning columns (208) and the positioning holes (207) are arranged one by one, the linkage type positioning grooves are connected to the outside through the positioning holes (207), a plurality of gas distribution pipes (211) are installed on the electromagnetic plate (205), the gas distribution pipes (211) are arranged corresponding to the linkage type positioning grooves, the linkage type positioning grooves are connected to the gas distribution cavity through the gas distribution pipes (211), and a first electromagnetic valve is installed on the gas distribution pipes (211).

2. The intelligent winding device for semiconductor materials according to claim 1, characterized in that: A mounting plate is mounted on one of the first brackets (101), and the drive motor (103) is mounted on the mounting plate.

3. The intelligent winding device for semiconductor materials according to claim 1, characterized in that: The length of the guide roller (203) is greater than the length of the winding roller (102).

4. The intelligent winding device for semiconductor materials according to claim 1, characterized in that: One end of the positioning column (208) located in the linkage positioning groove is connected to a limiting plate (209), and a sealing member (210) is connected between the limiting plate (209) and the side wall of the linkage positioning groove.

5. The intelligent winding device for semiconductor materials according to claim 4, characterized in that: The limiting plate (209) is made of a magnetic metal material, and the sealing component (210) is made of an elastic rubber material.

6. The intelligent winding device for semiconductor materials according to claim 5, characterized in that: An installation cavity (212) is provided in the guide roller (203), and an air pump (213) and a power source (214) are installed in the installation cavity (212).

7. The intelligent winding device for semiconductor materials according to claim 6, characterized in that: The air pump (213) is connected to an air outlet end, the air outlet end is in communication with the air distribution cavity, and a second solenoid valve is installed on the air outlet end of the air pump (213).

8. The intelligent winding device for semiconductor materials according to claim 7, characterized in that: The power source (214) is electrically connected to the electromagnetic plate (205).

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