Installation Method

Abstract

This invention provides a mounting tool and mounting apparatus that can reduce the residue of air bubbles and damage to the substrate when mounting electronic components onto a substrate. The embodiment is a mounting tool (31) for mounting electronic components (2) onto a substrate (W), comprising: a retaining surface (311) that is raised in a manner to bend and connect the electronic components (2); a plurality of openings (312) provided on the retaining surface (311); and a plurality of vent holes (313) respectively provided in communication with the plurality of openings (312). The plurality of vent holes (313) retain the electronic components (2) on the retaining surface (311) by setting the internal pressure to a negative pressure, and by setting the adjacent vent holes (313) to a positive pressure sequentially from the vent hole (313) closest to the most raised peak of the retaining surface (311), thereby causing the electronic components (2) to detach from the retaining surface (311).

Description

Technical Field

[0001] This invention relates to an installation method. Background Art

[0002] When mounting electronic components, such as logic, memory, and image sensors, onto a substrate, monolithic chips are created by cutting wafers on which the semiconductor components are formed. These chips are then picked up one by one and transferred to the substrate for mounting.

[0003] During the installation of such electronic components, air bubbles sometimes remain between the electronic component and the substrate. If air bubbles exist between the electronic component and the substrate, poor connection and insufficient strength will result in poor installation. To address this, during the installation of electronic components, the electronic component is bent and held in an installation tool that presses against the substrate. After a portion of the electronic component contacts the substrate, it is pressed using an elastomer, thereby expelling the air between the electronic component and the substrate for installation.

[0004] [Existing Technical Documents]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent No. 3757193

[0007] [Patent Document 2] Japanese Patent Application Publication No. 2003-203964

[0008] [Patent Document 3] Japanese Patent Application Publication No. 2005-150311 Summary of the Invention

[0009] [Problems to be solved by the invention]

[0010] However, in tools that deform and crush the elastomer while being pressed, depending on the size of the electronic component, the pressed area may not expand evenly, or sufficient force may not be applied to the outer edge, thus failing to expel air bubbles. Additionally, sometimes excessive pressing force is applied to the central portion, causing damage to the electronic component.

[0011] The present invention was made to solve the problems described above, and its purpose is to provide a mounting method that reduces the residue of air bubbles and damage to the substrate when mounting electronic components onto a substrate.

[0012] [Technical means to solve the problem]

[0013] The present invention is a mounting tool for mounting electronic components on a substrate, comprising: a retaining surface raised in such a way that the electronic components are bent and joined together; a plurality of openings provided on the retaining surface; and vent holes communicating with the openings. The electronic components are held on the retaining surface by setting the internal pressure to a negative pressure, and the electronic components are detached from the retaining surface by setting the vent holes adjacent to each other to a positive pressure, starting from the vent hole closest to the most raised peak of the retaining surface.

[0014] The installation apparatus of the present invention includes the installation tool and further includes: a tool moving mechanism that reciprocates the installation tool between a junction position and an installation position and raises and lowers the tool between the junction position and the installation position; a detection unit that detects contact with the installation tool; and a switching unit that switches the negative pressure and positive pressure of the vent hole of the installation tool when contact is detected by the detection unit.

[0015] [The effects of the invention]

[0016] According to the mounting tool and mounting apparatus of the present invention, residual air bubbles and damage to the substrate can be reduced when mounting electronic components onto the substrate. Attached Figure Description

[0017] Figure 1 This is a front view showing the mounting device of the embodiment.

[0018] Figure 2 This is a plan view showing the installation device of the embodiment.

[0019] Figure 3 (A) ~ Figure 3 (C) is a side view (A), a cross-sectional view (B), and a bottom view (C) of the installation tool for the implementation method.

[0020] Figure 4 This is a functional block diagram of the control device in the implementation method.

[0021] Figure 5 This is a flowchart showing the sequence of electronic components for installation implementation.

[0022] Figure 6 (A) ~ Figure 6 (E) is an explanatory diagram showing the mounting implementation of the electronic components in the embodiment.

[0023] Figure 7 This is a cross-sectional view showing a modified example of the installation tool.

[0024] Figure 8 (A) ~ Figure 8 (D) is an explanatory diagram showing an embodiment of receiving electronic components using an installation tool.

[0025] [Explanation of Symbols]

[0026] 1: Installation device

[0027] 2: Electronic components

[0028] 10: Supply device

[0029] 11: Sheets

[0030] 12: Supply platform

[0031] 13: Platform moving mechanism

[0032] 20: Pickup device

[0033] 21: Pick up the nozzle

[0034] 21b: Nozzle orifice

[0035] 22: Nozzle moving mechanism

[0036] 23: Direction conversion section

[0037] 24: Sales Promotion

[0038] 30: Mounting device

[0039] 31: Installation Tools

[0040] 32: Tool moving mechanism

[0041] 50: Control device

[0042] 51: Supply unit control department

[0043] 52: Upper Sales Control Department

[0044] 53: Pick-up Nozzle Control Unit

[0045] 54: Installation Tool Control Section

[0046] 56: Substrate stage control unit

[0047] 57: Storage Department

[0048] 60: Substrate carrier

[0049] 61: Platform moving mechanism

[0050] 221, 321: Sliding mechanism

[0051] 221a, 321a: Supporting framework

[0052] 221b, 321b: Guide rail

[0053] 221c, 321c: Slider

[0054] 222, 322: Lifting mechanism

[0055] 241: Support

[0056] 311: Maintain the surface

[0057] 312: Opening

[0058] 313: Vent

[0059] 322a: Testing Department

[0060] P1: Supply Location

[0061] P2: Handover Location

[0062] P3: Installation Location

[0063] S01, S02, S03, S04, S05, S06, S07, S08: Steps

[0064] W: substrate Detailed Implementation

[0065] The installation device of the embodiment will be described with reference to the accompanying drawings. Furthermore, the drawings are schematic diagrams, and the dimensions and proportions of each part are exaggerated for ease of understanding. Figure 1 and Figure 2 As shown, the mounting apparatus 1 includes a supply device 10, a pickup device 20, a mounting device 30, and a control device 50. It is a device that uses the pickup device 20 to transfer the electronic component 2 to the mounting device 30, and then uses the mounting device 30 to mount it onto the substrate W of the substrate stage 60. The electronic component 2 is, for example, a chip-shaped component. In this embodiment, the electronic component 2 is a semiconductor chip that has been diced into individual wafers.

[0066] The supply device 10 is a device for supplying electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2, which is to be picked up, to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic component 2, which is to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 on which the electronic component 2 is attached, and a stage moving mechanism 13 that moves the supply stage 12. As the stage moving mechanism 13, for example, a linear guide that moves a slider on a guide rail by a ball screw mechanism driven by a servo motor can be used.

[0067] Here, the sheet 11 on which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged with their functional surfaces exposed upwards.

[0068] The supply stage 12 is a platform that horizontally supports a wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is configured to be movable in the horizontal direction via the stage moving mechanism 13. The sheet 11 and the supply stage 12 are horizontally supported together, so the sheet 11 and the electronic component 2 mounted on the sheet 11 are also configured to be movable in the horizontal direction.

[0069] Furthermore, such as Figure 1 and Figure 2 As shown, the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Furthermore, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The up direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is mounted, and the down direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is not mounted.

[0070] [Pickup device]

[0071] The pickup device 20 is a relay device that picks up electronic components 2 from the supply device 10 and transfers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup nozzle 21, a nozzle moving mechanism 22, a direction conversion unit 23, and an upper pusher 24.

[0072] The pickup nozzle 21 is a cylindrical adsorption nozzle that holds the electronic component 2 and releases it upon release of the holding state. The pickup nozzle 21 has a nozzle orifice with an adsorption surface opening at its front end. The nozzle orifice is connected to a negative pressure generating circuit (not shown), such as a vacuum pump, through which a negative pressure is generated, and the electronic component 2 is held by adsorption through the nozzle orifice. Furthermore, the electronic component 2 is released from the pickup nozzle 21 by releasing the negative pressure.

[0073] The nozzle moving mechanism 22 is a mechanism that causes the pickup nozzle 21 to reciprocate between the supply position P1 and the transfer position P2, and to rise and fall between the supply position P1 and the transfer position P2. Specifically, the nozzle moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. Furthermore, the transfer position P2 is the position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the mounting tool 31, which functions as a receiving unit as described later.

[0074] The supply position P1 and the handover position P2 mainly refer to the positions in the XY direction, not necessarily the positions in the Z-axis direction. Furthermore, even when referring to the Z-axis position (height), its height has a specified width. This specified width includes the thickness of electronic component 2 at the time of handover, the distance at which electronic component 2 is pushed upwards, and the distance at which electronic component 2 can be attracted, etc.

[0075] The sliding mechanism 221 reciprocates the pickup nozzle 21 between the supply position P1 and the handover position P2. Here, the sliding mechanism 221 includes a guide rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c traveling on the guide rail 221b. Although not shown, the slider 221c is driven by a ball screw, linear motor, or the like driven by a rotary electric motor. The lifting mechanism 222 moves the pickup nozzle 21 vertically. Specifically, the lifting mechanism 222 can use a linear guide that moves the slider on the guide rail via a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 rises and falls along the Z-axis direction driven by the servo motor.

[0076] A direction conversion unit 23 is provided between the pickup nozzle 21 and the nozzle moving mechanism 22. Here, the direction conversion unit 23 is an actuator comprising a drive source such as an electric motor that changes the orientation of the pickup nozzle 21, and a rotating guide such as a ball bearing. Changing the orientation means rotating 0° to 180° in the vertical direction. For example, the pickup nozzle 21 with its adsorption surface facing the supply stage 12 is positioned at the supply position P1 to adsorb and hold the electronic component 2. Then, the direction conversion unit 23 changes the orientation of the pickup nozzle 21 so that its adsorption surface faces upwards. At this time, the rotation angle is 180°.

[0077] The upper pusher 24 is disposed below the sheet 11 of the supply device 10. The upper pusher 24 is a needle-like member with a sharp front end. The upper pusher 24 is disposed inside the support body 241 with its length direction parallel to the Z-axis direction.

[0078] The support 241 has a drive mechanism that causes the upper pusher 24 to move in or out of its interior or retract into its interior. The movement in or out of its interior or retracting is in the vertical direction. The drive mechanism includes, for example, a slider that moves guided by a vertical guide rail, and a cylinder or cam mechanism that drives the slider.

[0079] [Equipped device]

[0080] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate W. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a mounting tool 31 and a tool moving mechanism 32.

[0081] The mounting tool 31 is a component that functions as a receiving part to receive the electronic component 2 from the pick-up nozzle 21 at the handover position P2 and to mount the electronic component 2 onto the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases it after mounting.

[0082] Specifically, such as Figure 3 (A) Figure 3 As shown in (B), the mounting tool 31 is a block with a roughly cuboid cross-section and has a retaining surface 311, an opening 312, and a vent 313. The retaining surface 311 is the bottom surface of the mounting tool 31 and is a raised surface formed by bending and connecting the electronic components 2. The bending refers to bending in a manner that does not produce an angle, and also includes... Figure 3 The embodiment shown in (B) is a bending-like structure where a curved surface is created between flat surfaces. In this embodiment, the retaining surface 311 is mountain-shaped. Here, "mountain-shaped" refers to the shape where two flat surfaces with different angles smoothly continue at their highest peaks, including the central apex. That is, the planar shape of the retaining surface 311 is rectangular, with the central points of the two sides along the long side forming peaks, and the ridge connecting the peaks of the two sides forming the short side. Furthermore, the retaining surface 311 is preferably formed of a rigid material by the mounting tool 31 to prevent elastic deformation under pressure during the mounting of the electronic component 2. Depending on the electronic component 2 to be mounted, the planar shape of the retaining surface 311 can be rectangular or square. Furthermore, as described above, Figure 3 (A) ~ Figure 3 (C) and other accompanying drawings are schematic diagrams, and for ease of understanding, the degree of bulge of the retaining surface 311 or its ratio to other parts is exaggerated.

[0083] like Figure 3 As shown in (C), multiple openings 312 are provided on the holding surface 311. The multiple openings 312 are arranged in multiple columns. Here, when the holding surface 311 is rectangular, the direction of each column is parallel to its short side. However, it is not limited to the stated direction. In this embodiment, the openings 312 are separated by a column [1] provided in the peak portion, and columns [2] and [3] are provided on each of the two short sides of the holding surface 311.

[0084] Multiple vent holes 313 are provided, with one end of each vent hole 313 connected to a respective opening 312. The multiple vent holes 313 hold the electronic component 2 to the holding surface 311 by setting the pressure inside the holes to negative pressure, and by setting adjacent vent holes 313 to positive pressure sequentially, starting from the vent hole 313 closest to the most prominent peak of the holding surface 311, thereby causing the electronic component 2 to detach from the holding surface 311. In this embodiment, the vent holes 313 on the central side of the electronic component 2 are sequentially set to positive pressure towards the adjacent vent holes 313. The other end of each vent hole 313 is connected to a pneumatic circuit (not shown) generated by switching between negative and positive pressure. In this embodiment, each row of vent holes 313 is connected to a pipe and a valve, allowing for switching between negative and positive pressure for each row. This valve functions as a switching unit for switching between negative and positive pressure on the vent holes 313.

[0085] The tool moving mechanism 32 causes the installation tool 31 to reciprocate between the handover position P2 and the installation position P3, and to rise and fall between the handover position P2 and the installation position P3. The tool moving mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322.

[0086] The sliding mechanism 321 causes the installation tool 31 to reciprocate between the junction position P2 and the installation position P3. Here, the sliding mechanism 321 includes two guide rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c that travels on the guide rails 321b. Although not shown, the slider 321c is driven by a ball screw, linear motor, or the like driven by a rotary electric motor. Furthermore, although not shown, the sliding mechanism 321 includes a sliding mechanism that causes the installation tool 31 to slide in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider that travels on the guide rail. The slider is driven by a ball screw, linear motor, or the like driven by a rotary electric motor.

[0087] The lifting mechanism 322 drives the arm on which the installation tool 31 is detachably mounted, causing the installation tool 31 to move vertically. Specifically, the lifting mechanism 322 can use a linear guide that moves the slider on a guide rail via a ball screw mechanism driven by a servo motor. That is, the installation tool 31 is raised and lowered along the Z-axis by the drive of the servo motor. Furthermore, a detection unit 322a is provided on the lifting mechanism 322 to detect contact with the installation tool 31. As the detection unit 322a, a load sensor such as a strain gauge or a piezoelectric element can be used.

[0088] The substrate stage 60 is a platform that supports the substrate W for mounting electronic components 2. The substrate stage 60 is provided with a stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that causes the substrate stage 60 to slide in the XY plane and positions the mounting position of the electronic components 2 on the substrate W at the mounting position P3. The stage moving mechanism 61 may, for example, use a linear guide that moves a slider on a guide rail via a ball screw mechanism driven by a servo motor.

[0089] The control device 50 controls the start, stop, speed, and timing of the supply device 10, pickup device 20, mounting device 30, and substrate stage 60. In other words, the control device 50 is the control device for the mounting device 1. The control device 50 can be implemented, for example, through a dedicated electronic circuit or a computer operating according to a prescribed program. Input devices for inputting instructions or information required for control by the operator, and output devices for confirming the status of the device, are connected to the control device 50. Input devices can be switches, touchscreens, keyboards, mice, etc. Output devices can be displays such as liquid crystal displays (LCDs) or organic electroluminescent (EL) displays.

[0090] Figure 4 This is a functional block diagram of the control device 50. The control device 50 includes: a supply device control unit 51 for controlling the supply device 10, an upper push control unit 52 and a pick-up nozzle control unit 53 for controlling the pick-up device 20, an installation tool control unit 54 for controlling the mounting device 30, a substrate stage control unit 56 for controlling the substrate stage 60, and a storage unit 57.

[0091] The supply device control unit 51 controls the movement of the supply platform 12. That is, it controls the movement of the electronic component 2, which is the object to be picked up, placed on the sheet 11. The push-up control unit 52 controls the movement of the push-up 24.

[0092] The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21, that is, the operation of the nozzle movement mechanism 22 and the direction conversion unit 23. In addition, the pickup nozzle control unit 53 controls the negative pressure generation circuit connected to the nozzle orifice 21b, and controls the holding and releasing of the electronic component 2.

[0093] The mounting tool control unit 54 controls the movement of the mounting tool 31, i.e., the operation of the tool moving mechanism 32. Additionally, the mounting tool control unit 54 controls the air pressure circuit connected to the vent 313 of the mounting tool 31, switching the negative and positive pressure of each row of openings 312 to control the holding and releasing of the electronic component 2. Furthermore, the mounting tool control unit 54 controls the switching of negative and positive pressure of the vent 313 based on contact detection performed using the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage moving mechanism 61.

[0094] Storage unit 57 includes various types of memory (hard disk drive, HDD, or solid state drive, SSD, etc.) that serve as recording media, and an interface between the recording media and external devices. Storage unit 57 pre-stores data and programs required for the operation of the mounting device 1, and also stores data required for the operation of the mounting device 1. This required data includes, for example, the position coordinates of the supply position P1, the handover position P2, the mounting position P3, and the position coordinates of each moving mechanism. Each moving mechanism performs movement control of its respective structure based on these coordinates. Furthermore, storage unit 57 stores the timing for switching which column of the vent holes 313 of the mounting tool 31 from negative pressure to positive pressure.

[0095] [action]

[0096] The operation of the mounting device 1 as described above will be explained. First, the pickup device 20 picks up the electronic component 2 from the supply device 10 and transfers the electronic component 2 to the mounting device 30. That is, the pickup device 20 moves the pickup nozzle 21 to the supply position P1 where the upper pusher 24 is located, so that the nozzle hole 21b of the pickup nozzle 21 faces the upper pusher 24.

[0097] On the other hand, the supply device 10 moves the supply stage 12, positioning the electronic component 2, which is to be picked up, at the supply position P1. Then, the pick-up nozzle 21 is lowered so that the adsorption surface comes into contact with the electronic component 2 at the supply position P1 to adsorb the electronic component 2. Next, while holding the electronic component 2, the pick-up nozzle 21 is raised, and the electronic component 2 is pushed upward using the upper pusher 24, thereby picking up the electronic component 2 while it is being peeled off the sheet 11.

[0098] The pickup device 20 reverses the pickup nozzle 21 via the direction conversion unit 23. That is, the orientation of the pickup nozzle 21 is rotated 180° in the vertical direction, so that the suction surface of the pickup nozzle 21 faces upward. Furthermore, the reversing operation can also be performed at any location between the supply position P1 and the transfer position P2.

[0099] The pickup device 20 moves the picked-up electronic component 2 to the handover position P2 via the nozzle moving mechanism 22. The mounting tool 31 of the mounting device 30 is moved to the handover position P2 via the tool moving mechanism 32 and is ready to stand by. The holding surface 311 of the mounting tool 31 faces the nozzle hole 21b of the pickup nozzle 21 via the electronic component 2.

[0100] Then, after the mounting tool 31 is lowered towards the pickup nozzle 21 located at the transfer position P2, and negative pressure is applied to the vent 313 of the mounting tool 31 to hold the electronic component 2, the negative pressure on the pickup nozzle 21 is released, thereby transferring the electronic component 2 from the pickup nozzle 21 to the mounting tool 31. As a result, the electronic component 2 is bent in a manner that mimics the bulge of the holding surface 311 and is adsorbed and held.

[0101] Next, the mounting tool 31 moves to the mounting position P3 and mounts the electronic component 2 onto the substrate W. (See reference...) Figure 5 Flowchart, Figure 6 The installation process is illustrated using a diagram. First, the installation tool 31 moves to the installation position P3, as shown in the diagram. Figure 6 As shown in (A), the electronic component 2 held by the mounting tool 31 faces the substrate W (step S01). Then, the mounting tool 31 is lowered, bringing the electronic component 2 closer to the substrate W (step S02).

[0102] When the detection unit 322a of the mounting tool 31 detects contact between the electronic component 2 and the substrate W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, starting from a portion of the vent 313, the negative pressure is sequentially stopped and replaced with positive pressure, thereby causing the electronic component 2 to detach and be mounted on the substrate W. That is, according to Figure 3 (A) ~ Figure 3 The order of columns [1], [2] and [3] shown in (C) is switched to positive pressure, and air is blown from the opening 312 (steps S05 to S07).

[0103] At this time, as Figure 6 (B) Figure 6 (C) Figure 6 As shown in (D), the portion of the electronic component 2 corresponding to the most prominent peak of the holding surface 311 in the plurality of columns of vent holes 313 initially contacts the substrate W. From the column of the peak portion to the adjacent column, the pressure sequentially switches from negative (white arrows in the figure) to positive (black arrows in the figure). Thus, the bent electronic component 2 gradually detaches from the peak portion outwards, mimicking the flat surface of the substrate W, thereby expelling air bubbles while simultaneously mounting it onto the substrate W. After mounting, as... Figure 6 As shown in (E), the mounting tool 31 rises, and the remaining electronic components 2 are removed from the substrate W (step S08).

[0104] [Effect]

[0105] (1) This embodiment is a mounting tool 31 for mounting electronic components 2 on a substrate W, having: a holding surface 311 that is raised in such a way that the electronic components 2 are bent and connected; a plurality of openings 312 provided on the holding surface 311; and a plurality of vent holes 313 that are respectively provided in communication with the plurality of openings 312. The plurality of vent holes 313 hold the electronic components 2 on the holding surface 311 by setting the internal pressure to negative pressure, and by setting the vent holes 313 adjacent to each other to positive pressure starting from the vent hole 313 closest to the most raised peak of the holding surface 311, the electronic components 2 are detached from the holding surface 311.

[0106] In addition, the installation device 1 of this embodiment has an installation tool 31 and includes: a tool moving mechanism 32 that moves the installation tool 31 back and forth between a junction position and an installation position and raises and lowers the tool 31 between the junction position and the installation position; a detection unit 322a that detects the contact pressure on the installation tool 31; and a switching unit that switches the negative pressure and positive pressure on the vent 313 of the installation tool 31 when the detection unit 322a detects contact.

[0107] Therefore, by bending the electronic component 2 under negative pressure and holding it in the holding surface 311, and then sequentially setting the vent to positive pressure, the electronic component 2 is installed while air bubbles are being expelled as it flattens in a manner similar to the substrate W. This suppresses the accumulation of air bubbles between the electronic component 2 and the substrate W, thereby reducing installation defects. Since the installation is achieved by utilizing the bending and recovery of the electronic component 2 itself, the pressure is applied evenly without bias, allowing air bubbles to be expelled uniformly and reducing damage to the electronic component 2.

[0108] (2) The multiple openings 312 are arranged in multiple columns. Therefore, by switching the negative pressure to positive pressure in each column in turn, the bent part can be restored to a flat position for installation while preventing excessive force from being applied to a part of the electronic component 2.

[0109] (3) Starting from the vent 313 closest to the most prominent peak of the holding surface 311 among the multiple vent holes 313, adjacent vent holes 313 are sequentially set to positive pressure. Therefore, air bubbles can be expelled from the part where the electronic component 2 first contacts the substrate W and gradually contacts the substrate W towards the outer edge. Furthermore, by setting each column to be parallel to the short side direction, bending can be generated in the long side direction where the rectangular electronic component 2 is easily deformed.

[0110] (4) The retaining surface 311 is mountain-shaped. Therefore, by gradually flattening the outer edge substrate W from the central peak portion to both sides, the distance between the electronic component 2 and the substrate W is shortened while the bending returns to flatness from the center, thus reducing concerns about air bubbles being trapped. Furthermore, by forming a mountain shape on the long side of the retaining surface 311 and setting the edge connecting the peak portion in the short side direction, a bend is generated in the long side direction of the electronic component 2, thus making it easy for the electronic component 2 to conform to the retaining surface 311. Moreover, the edge connecting the peak portion can also be set on either side of the retaining surface 311. For example, if the edge is set on the short side at one end, by sequentially setting positive pressure from one end to the other, the electronic component 2 contacts the substrate W from one end to the other. Even in this case, the effect of reducing the breakage of the electronic component 2 while eliminating air bubbles can be obtained. The electronic component 2 does not bend, and the risk of breakage is further reduced accordingly. For example, in the case of Figure 3 In the case of a column with an opening 312 as shown in (C), starting from column [3] on one end, the pressure is switched from negative to positive in the order of column [2], column [1], column [2] on the other end, and column [3].

[0111] [Variation Example]

[0112] The following variations can also be applied to this embodiment.

[0113] (1) Surface 311 can also be a curved surface. For example, such as Figure 7As shown, the retaining surface 311 can also be a raised shape, like a portion of the side surface of a cylinder. Furthermore, the term "partial side surface of a cylinder" also includes portions of cylindrical bodies with circular, elliptical, rounded rectangular, or racetrack-shaped cross-sections. This makes the curvature of the electronic component 2 more gradual, thereby suppressing any impact on the electronic component 2. Furthermore, in the described embodiment, an opening 312 is provided at the ridgeline of the connecting peak portion. However, the opening 312 does not necessarily need to be located on the ridgeline; it can be located nearby. The same effect can be obtained by sequentially changing the pressure from negative to positive, starting from the vent holes 313 near the ridgeline in each opening 312. Additionally, even in the case of this curved surface, the ridgeline portion can be located on any side of the retaining surface 311.

[0114] (2) When the installation tool 31 receives the electronic component 2 from the pick-up nozzle 21, the adjacent vent holes 313 can be set to negative pressure starting from a portion of the vent holes 313 on the holding surface 311. That is, when the installation tool 31 receives the electronic component 2, even if the electronic component 2 is bent in accordance with the holding surface 311, if a part of it floats or leans to one side, problems such as the inability to identify the position of the electronic component 2 will occur. In addition, if the installation is carried out in a state where the electronic component 2 is floated or leans to one side, there is a possibility that an air bubble may be drawn in when moving away from the edge along the outer edge.

[0115] For example, starting with the vent 313 closest to the most prominent peak of the retaining surface 311, adjacent vents 313 can be sequentially set to negative pressure. More specifically, such as Figure 8 As shown in (A), when the holding surface 311 of the mounting tool 31 approaches the electronic component 2, and the detection unit 322a detects contact, as... Figure 8 (B) ~ Figure 8 As shown in (D), starting from column [1] of opening 312, columns [2] and [3] are sequentially placed (refer to...). Figure 3 (B) is set to negative pressure. Therefore, the electronic component 2 can be gradually bent in the manner of the holding surface 311, while the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21, thus suppressing floating or tilting and preventing failure to identify the position. Furthermore, since floating or tilting is reduced, it is less likely for the timing of detachment to occur during the mounting of the electronic component 2, reducing the possibility of air bubbles being drawn in.

[0116] [Other Implementation Methods]

[0117] This invention is not limited to the embodiments described herein, but also includes other embodiments shown below. Furthermore, this invention also includes forms that combine all or any of the embodiments described herein and other embodiments described below. Moreover, various omissions, substitutions, and modifications can be made to these embodiments without departing from the scope of the invention, and such modifications are also included in this invention.

Claims

1. A mounting method for mounting electronic components onto a substrate using mounting tools, characterized in that, The installation tool has the following features: The surface is raised in a manner that allows the electronic components to be bent and joined together; Multiple openings are provided on the retaining surface; and Multiple vents are provided, each communicating with one of the aforementioned openings. The plurality of vent holes hold the electronic components in contact with the raised retaining surface by setting the internal pressure to negative. The raised portion of the electronic component, which is raised in contact with the holding surface, stops when it comes into contact with the substrate. In this state, the electronic component is detached from the holding surface by sequentially setting the adjacent vent holes to positive pressure, starting from the vent hole closest to the most raised peak of the holding surface.

2. The installation method according to claim 1, characterized in that, The multiple openings are formed by arranging them in multiple columns.

3. The installation method according to claim 1, characterized in that, The retaining surface is mountain-shaped.

4. The installation method according to claim 1, characterized in that, The retaining surface is a curved surface.

5. The installation method according to any one of claims 1 to 4, characterized in that, Electronic components are mounted on a substrate using a mounting device, the mounting device having the mounting tool and having: The tool moving mechanism causes the installation tool to reciprocate between the handover position and the installation position, and to rise and fall between the handover position and the installation position; The detection unit detects contact with the installation tool; and The switching unit switches between negative and positive pressure on the vent of the installation tool when contact is detected by the detection unit.

6. The installation method according to claim 5, characterized in that, Starting from the vent closest to the most prominent peak of the retaining surface among the plurality of vents, adjacent vents are sequentially set to negative pressure.

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