Flexible electroluminescent device product, electroluminescent device and preparation method thereof

Abstract

The present application discloses a flexible electroluminescent device product, an electroluminescent device and a preparation method thereof. The electroluminescent device product includes a substrate, a first electrode layer, a light-emitting functional layer, a second electrode layer and an encapsulation layer in sequence; a repair layer is provided on the outside of the substrate and the outside of the encapsulation layer; when the electroluminescent device product is sheared, the edges of the two repair layers are in contact and self-repaired to form a side encapsulation; a plurality of first conductive plates are provided through the repair layer adjacent to the substrate; a plurality of second conductive plates are provided through the repair layer adjacent to the encapsulation layer; a plurality of conductive columns are provided through both sides of the substrate for electrically connecting the first electrode layer and the first conductive plate; a plurality of conductive columns are provided through both sides of the encapsulation layer for electrically connecting the second electrode layer and the second conductive plate. The OLED device formed after shearing can be a self-contained product and work independently; the technical solution of the present application realizes any design shape of the flexible electroluminescent device in a simple form, at low cost and with a simple process.

Description

Technical Field

[0001] The present disclosure generally relates to the technical field of flexible light-emitting devices, and in particular to flexible electroluminescent device products, electroluminescent devices and preparation methods thereof. Background Art

[0002] Flexible electroluminescent devices, such as OLED products, are flexible, which is a major advantage of their application, and can achieve the diversification of their shapes and design sense. At the same time, it is suitable for different application scenarios. However, its basic shape is fixed at the beginning of the design, that is, the substrate and packaging layer structure corresponding to the designed shape are determined by laser etching, and then the pixelated electrode is designed on the substrate, and then the various functional layers (first electrode, light-emitting functional layer, second electrode, etc.) are gradually formed on the substrate by evaporation or etching or other processes. When the shape is irregular, the control procedures of the above processes will be affected and adjusted, that is, when the product shape is customized, the process is also customized and adjusted accordingly; the procedure is complicated and the cost is high.

[0003] If you want to change the shape during later use, it is usually achieved by folding, etc., which may cause irreversible damage to the screen. Summary of the invention

[0004] In view of the above defects or shortcomings in the prior art, it is desirable to provide a flexible electroluminescent device product, which comprises a substrate, a first electrode layer, a light-emitting functional layer, a second electrode layer and an encapsulation layer in sequence; a repair layer is provided on the outer side of the substrate and the outer side of the encapsulation layer; when the electroluminescent device product is sheared, the edges of the two layers of the repair layer contact and self-repair to form a side encapsulation;

[0005] A plurality of first conductive plates are provided through the repair layer adjacent to the substrate; a plurality of second conductive plates are provided through the repair layer adjacent to the packaging layer; a plurality of conductive pillars are provided through both sides of the substrate for electrically connecting the first electrode layer and the first conductive plate; a plurality of conductive pillars are provided through both sides of the packaging layer for electrically connecting the second electrode layer and the second conductive plate.

[0006] According to the technical solution provided in the embodiment of the present application, the first electrode layer includes a plurality of pixelated first electrodes, auxiliary electrodes and a fuse-type short-circuit protection device connected between the pixelated first electrodes and the auxiliary electrodes arranged on the substrate.

[0007] According to the technical solution provided in the embodiment of the present application, the thickness of the repair layer is greater than the total thickness between the outer side of the substrate and the outer side of the packaging layer.

[0008] According to the technical solution provided in the embodiment of the present application, when the electroluminescent device product emits light from the substrate side, the first conductive plate is made of a transparent material; when the electroluminescent device product emits light from the packaging layer side, the second conductive pad is made of a transparent material.

[0009] According to the technical solution provided in the embodiment of the present application, the conductive base material of the conductive column extends to the outer surface of the substrate or the packaging layer to form a power connection area, and the first conductive pad and the second conductive pad are welded in the power connection area.

[0010] According to the technical solution provided in the embodiment of the present application, the conductive column is filled with protective material.

[0011] According to the technical solution provided in the embodiment of the present application, the repair layer includes a polymer matrix and microcapsules and a polymer reaction catalyst doped in the polymer matrix; a polymer precursor is encapsulated in the microcapsules.

[0012] According to the technical solution provided in the embodiment of the present application, the protective layer is made of a stretchable elastomeric material, and the elastomeric material located in the protection area contains CF3 groups.

[0013] According to the technical solution provided in the embodiments of the present application, a repair layer is provided on the inner side of the substrate and / or the inner side of the packaging layer; a conductive material or a conductive structure is provided in the repair layer located on the inner side of the substrate, which is used to electrically connect the first electrode layer with the conductive columns in the substrate; a conductive material or a conductive structure is provided in the repair layer located on the inner side of the packaging layer, which is used to electrically connect the second electrode layer with the conductive columns in the packaging layer.

[0014] According to the technical solution provided in the embodiment of the present application, the repair layer is doped with water-absorbing material.

[0015] According to the technical solution provided in the embodiment of the present application, the visible light transmittance of the self-healing material is greater than 80%.

[0016] In a second aspect, the present application provides a method for preparing a flexible electroluminescent device, comprising the following steps:

[0017] Determine a cutting outline on the above-mentioned flexible electroluminescent device product according to the designed shape; the cutting outline includes at least a first conductive pad and a second conductive pad;

[0018] The flexible electroluminescent device product is cut along the cutting outline to obtain a flexible electroluminescent device with a designed shape.

[0019] In a third aspect, the present application provides a flexible electroluminescent device, characterized in that it is prepared by the above method.

[0020] In the technical solution of the present application, a self-repairing material layer is designed on the outside of the existing electroluminescent device product, so that after the electroluminescent device product is cut, the self-repairing material layers on both sides of the outside can self-repair to form side encapsulation, thereby allowing the OLED device formed after cutting to be a self-contained product and work independently; the technical solution of the present application realizes any design shape of a flexible electroluminescent device in a simple form, at low cost and with a simple process.

[0021] In the technical solution of the present application, by providing conductive columns on the substrate and the packaging layer, each conductive column is electrically connected to an external conductive pad (a first conductive pad and a second conductive pad). The present application changes the original power connection method of the electroluminescent device from being arranged side by side with the original functional structure of the device on the same plane to a vertically stacked arrangement, so that the device product structure of the present application is more flexible when cutting, and can be suitable for very small electroluminescent devices of any shape that are cut and have a power connection structure connected to an external power supply circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0023] Figure 1 This is a schematic diagram of the structure of Example 1 of the present application;

[0024] Figure 2 A schematic diagram of the structure of a conductive column in Example 1 of the present application;

[0025] Figure 3 This is a schematic diagram of the second structure of the conductive column in Example 1 of the present application;

[0026] Figure 4 This is a schematic structural diagram of the cut edge of the electroluminescent device product after being cut in Example 1 of the present application;

[0027] Figure 5 This is a schematic diagram of the top view of the substrate of the electro-induced device product in Example 1 of the present application;

[0028] Figure 6 This is a schematic diagram of the top view of the structure of the first electrode layer in Example 1 of the present application;

[0029] Figure 7 This is a schematic diagram of the structure of Example 2 of the present application;

[0030] Figure 8 This is a schematic diagram of the structure of Example 3 of the present application;

[0031] Fig. 9 This is a schematic diagram of a top view of the structure viewed from the substrate side in implementation 7 of the present application;

[0032] Fig.10 This is a schematic diagram of a top view of the structure from the packaging layer side in implementation 7 of the present application;

[0033] Fig.11 This is a schematic diagram of the electrical connection structure of the cut electroluminescent device.

[0034] 10. Substrate 10; 20. First electrode layer; 30. Light-emitting functional layer; 40. Second electrode layer; 50. Mounting layer; 70. Side encapsulation; 60. Repair layer; 81. First conductive plate; 82. Second conductive plate; 21. Pixelated first electrode; 22. Auxiliary electrode; 24. Fuse-type short-circuit protection device; 12. Conductive column; 13. Power connection area; 61. Conductive material; 62. First auxiliary power connection column; 63. Second auxiliary power connection column. DETAILED DESCRIPTION

[0035] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0036] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0037] Example 1

[0038] Please refer to Figure 1 , this embodiment provides an electroluminescent device product, the electroluminescent device product is an OLED device, which includes a substrate 10, a first electrode layer 20, a light-emitting functional layer 30, a second electrode layer 40 and an encapsulation layer 50 in sequence; the outer sides of the substrate 10 and the encapsulation layer 50 are both provided with a repair layer 60; when the electroluminescent device product is sheared, the edges of the two layers of the repair layer contact and self-repair to form a side encapsulation 70;

[0039] The substrate is made of flexible materials such as PI, PET, etc., and the packaging layer can be made of metal foil or materials such as PI, PET, etc.

[0040] A plurality of first conductive plates 81 are penetrated through the repair layer 60 adjacent to the substrate; a plurality of second conductive plates 82 are penetrated through the repair layer 60 adjacent to the packaging layer 50; a plurality of conductive pillars 12 are penetrated through both sides of the substrate 10 for electrically connecting the first electrode layer 20 and the first conductive plates 81; a plurality of conductive pillars 12 are penetrated through both sides of the packaging layer 50 for electrically connecting the second electrode layer 40 and the second conductive plates 82.

[0041] The conductive pillar 12 may be formed by electroplating, for example, firstly, holes are punched on the substrate 20 and the packaging layer 50, for example, by laser drilling to form electroplated holes, with the diameter of the electroplated holes within 0.5 mm; then, a protective film is applied to the surface of the substrate and the packaging layer, exposing only the electroplated holes and the edge area (the area within 3 mm of the electroplated hole as the center); after electroplating, the conductive pillar 12 is formed in the electroplated holes. The material for electroplating may be copper.

[0042] like Figure 2 As shown, the conductive column 12 can be a hollow structure after being formed by electroplating, that is, the conductive substrate (electroplated copper) is only attached to the side wall of the electroplating hole; when the conductive column 12 is a hollow structure, the hollow conductive column is further filled with packaging material, and the packaging material is, for example, silicone resin or fluorine type glue.

[0043] like Figure 3 As shown, the conductive pillar 12 can also form a solid structure after electroplating, that is, the conductive substrate (electroplated copper) blocks the electroplating hole;

[0044] Preferably, if Figure 2 and Figure 3 As shown, the conductive base material of the conductive column 12 extends to the outer surface of the substrate or the packaging layer to form a power connection area 13 , and the first conductive pad 81 and the second conductive pad 82 are welded to the power connection area 13 .

[0045] Among them, in this embodiment, if Figure 6 As shown, the first electrode layer 20 is an anode, which is made of ITO or metal foil, and is composed of a plurality of pixelated first electrodes 21, and all the pixelated first electrodes 21 are electrically connected to the auxiliary electrodes 22 located between the pixelated first electrodes 21, wherein in this embodiment, the auxiliary electrodes 22 are electrically connected to the conductive columns 12 on the corresponding substrate 10; the second electrode layer 40 is a cathode, which is continuously arranged on the entire surface, and its material can also be ITO or metal foil; in other embodiments, the first electrode layer 20 can also be a cathode, and the second electrode layer can be an anode.

[0046] The light-emitting functional layer 30 may include, for example, an electron transport functional layer, a light-emitting layer, and a hole transport functional layer. In this embodiment, the specific implementation of the light-emitting functional layer 30 is not limited, as long as the material and structure can achieve organic electroluminescence.

[0047] The repair layer comprises a polymer matrix; the polymer matrix of at least one repair layer is doped with microcapsules, and the microcapsules contain polymer precursors; the polymer matrix of at least one repair layer is doped with a polymer reaction catalyst.

[0048] You can choose any of the following methods to set the repair layer:

[0049] 1. The repair layers on the outside of the substrate and the outside of the encapsulation layer are both: a polymer matrix doped with microcapsules and a polymer reaction catalyst.

[0050] 2. The repair layer outside the substrate is: a polymer matrix doped with microcapsules and a polymer reaction catalyst; the repair layer outside the encapsulation layer is: a polymer matrix doped with microcapsules.

[0051] 3. The repair layer outside the substrate is: a polymer matrix doped with microcapsules and a polymer reaction catalyst; the repair layer outside the encapsulation layer is: a polymer matrix doped with a polymer reaction catalyst.

[0052] 4. The repair layer outside the substrate is: a polymer matrix doped with microcapsules; the repair layer outside the encapsulation layer is: a polymer matrix doped with microcapsules and a polymer reaction catalyst.

[0053] 5. The repair layer outside the substrate is: a polymer matrix doped with a polymer reaction catalyst; the repair layer outside the encapsulation layer is: a polymer matrix doped with microcapsules and a polymer reaction catalyst.

[0054] 6. The repair layer outside the substrate is: a polymer matrix doped with microcapsules; the repair layer outside the encapsulation layer is: a polymer matrix doped with a polymer reaction catalyst.

[0055] 7. The repair layer outside the substrate is: a polymer matrix doped with a polymer reaction catalyst; the repair layer outside the encapsulation layer is: a polymer matrix doped with microcapsules.

[0056] In the above method, the repair layer contains at least two substances (polymer matrix + polymer reaction catalyst and / or microcapsule), so the repair layer can be optionally formed in the following manner:

[0057] Method 1: Dope all the substances contained and directly coat them on the outside of the substrate and the packaging layer to form a repair layer.

[0058] Method 2: coating the contained substances layer by layer on the substrate or the packaging layer to form a repair layer.

[0059] The microcapsules can be prepared by any of the following methods:

[0060] a. The microcapsules are made of cyclopentadiene dimer wrapped in urea-formaldehyde resin, and the polymerization catalyst is a metal ruthenium-based catalyst. In some embodiments, the metal ruthenium-based catalyst can also be wrapped in urea-formaldehyde resin to make capsules, and the cyclopentadiene dimer is doped in the matrix.

[0061] b. The microcapsules are made of epoxy resin wrapped in urea-formaldehyde resin, and the polymerization catalyst is a metal ruthenium-based catalyst. In some embodiments, the metal ruthenium-based catalyst can also be wrapped in urea-formaldehyde resin to make capsules, and the epoxy resin is doped in the matrix, or the epoxy resin is directly used as the polymer matrix.

[0062] c. The microcapsules are made of oligomeric organosiloxane wrapped in a resin, and the catalyst is a supported platinum-based catalyst. The catalyst is supported on reinforcement particles or fiber fillers.

[0063] like Figure 4 As shown, due to the design of the microcapsule, when the electroluminescent device product is sheared, the microcapsule breaks, allowing the polymer precursor to flow out and react with the polymerization catalyst to self-repair the broken part, thereby forming a side package 70.

[0064] In certain embodiments of the present application, the visible light transmittance of the self-healing material is greater than 80%.

[0065] In certain embodiments of the present application, the thickness of the repair layer 60 is greater than the total thickness between the outside of the substrate and the outside of the packaging layer. If Figure 1 As shown, the thickness of the repair layer 60 is h1, and the total thickness from the outside of the substrate to the outside of the packaging layer is h2, where h1 is greater than h2. The thickness of the repair layer is designed so that when cutting, the area of ​​adhesion and contact of the repair layers on both sides of the outside is larger and thicker, ensuring a better side packaging effect after self-repair.

[0066] In certain embodiments of the present application, the repair layer is doped with a water-absorbing material, such as calcium oxide particles. The water-absorbing material can further increase the effect of the self-healing side packaging.

[0067] If you want to Figure 5 The electroluminescent device product shown is cut into an octagonal device shape, then Figure 5 Just cut along the dotted outline shown in the figure.

[0068] Since in the present embodiment, the first conductive plate 81 and the second conductive plate 82 and other functional layers (first electrode layer, light-emitting functional layer, second electrode layer) are stacked, there is greater freedom in cutting. For example, the present embodiment can provide cutting into triangles, five-pointed stars, and polygons.

[0069] In other embodiments, various electroluminescent device shapes that can be cut into large tree-like, crescent-like, diamond-like, and the like.

[0070] The technical solution of this embodiment realizes the simplified design of the shape of the electroluminescent device, which greatly reduces the cost and process difficulty compared with the solution of designing the shape at the beginning of the preparation of the electroluminescent device in the early stage, and provides convenience for the large-scale promotion and application of electroluminescent devices.

[0071] During the cutting process, the pixelated first electrode and the second electrode may be adhered at the cutting edge. In order to ensure that the device can work normally after cutting, in this embodiment, a fuse-type short-circuit protection device is provided, which is connected between the pixelated first electrode and the auxiliary electrode. When the edge pixel is short-circuited due to adhesion, the pixel can be disconnected in the circuit by itself, so as not to affect the normal operation of other pixel areas.

[0072] In this embodiment, if Figure 6 As shown, the first electrode layer 20 includes a plurality of pixelated first electrodes 21, auxiliary electrodes 22 and a fuse-type short-circuit protection device 24 arranged on the substrate. The fuse-type short-circuit protection device 24 connects the pixelated first electrodes and the auxiliary electrodes; the implementation of the fuse-type short-circuit protection device 24 can be implemented, for example, by adopting a thin and long resistance line as described in the Chinese invention patent with publication number CN109698222B. When a short circuit occurs in a pixel, the fuse-type short-circuit protection device 24 is preferentially fused, so that the pixel circuit at that location is disconnected to ensure the normal operation of other pixels of the device.

[0073] Example 2

[0074] Based on Example 1, the present application replaces the material of the repair layer composed of the following: (polymer matrix + polymer reaction catalyst and / or microcapsule) with a stretchable elastomeric material containing CF3 groups.

[0075] Among them, in this embodiment, the elastomeric material is a perfluoroelastomer synthesized using a copolymer of TFEMA and HFBA. Fluorinated polymers generally have high transparency due to their low refractive index. In addition, they are hydrophobic and chemically stable under aqueous conditions, and the highly polar CF3 groups can also interact with each other to promote the self-healing process. In this polymer system, all monomers contain CF3 groups. Elastomers with ultra-high density CF3 groups to maximize dipole-dipole and ion-dipole interactions to achieve self-healing of materials.

[0076] In this embodiment, a fluoroelastomer having dipole-dipole interaction is used as the polymer of the polymer matrix, which can achieve self-healing and hydrophobic effects by utilizing the strong interaction between dipoles.

[0077] Example 3

[0078] like Figure 7As shown, based on Example 1, in this embodiment, a repair layer is provided on the inner side of the substrate 10 and / or the inner side of the encapsulation layer 50. A conductive material is provided in the repair layer located on the inner side of the substrate 10, which is used to electrically connect the first electrode layer 20 with the conductive pillars 12 in the substrate 10; a conductive material is provided in the repair layer located on the inner side of the encapsulation layer 50, which is used to electrically connect the second electrode layer 40 with the conductive pillars 12 in the encapsulation layer.

[0079] In this embodiment, the conductive substance is a conductive material. At this time, the repair layer located on the inner side of the substrate or the inner side of the packaging layer is doped with a conductive material 61, and the conductive material is, for example, metal powder such as silver and nickel.

[0080] In other embodiments, the conductive material 61 may also be a conductive microcapsule, which is made of conductive particles wrapped in a resin. The conductive particles may be, for example, graphene, and the resin that wraps the graphene may be, for example, urea-formaldehyde resin, epoxy resin, etc. When an electroluminescent device such as an OLED is sheared, the conductive microcapsule is broken, and the conductive particles therein flow out, and the repair layer near the inner side of the substrate 10 is electrically connected to the auxiliary electrode of the first electrode layer 20, and the repair layer near the inner side of the encapsulation layer 50 is electrically connected to the second electrode layer 40. The conductive particles in the microcapsule flow in the repair layer where they are located, thereby electrically connecting the conductive column 12 in the substrate 10 to the auxiliary electrode 22, and electrically connecting the conductive column in the encapsulation layer to the second conductive layer 40.

[0081] The repair layer provided on the inner side of the substrate 10 and / or the inner side of the encapsulation layer 50 may be provided in any of the following ways:

[0082] A. The repair layers on the inner side of the substrate and the inner side of the encapsulation layer are both: a polymer matrix doped with conductive materials, microcapsules and polymer reaction catalysts.

[0083] B. The repair layer on the inner side of the substrate is: a polymer matrix doped with conductive materials, microcapsules and polymer reaction catalysts; the repair layer inside the encapsulation layer is: a polymer matrix doped with conductive materials and microcapsules.

[0084] C. The repair layer on the inner side of the substrate is: a polymer matrix doped with conductive materials, microcapsules and polymer reaction catalysts; the repair layer inside the encapsulation layer is: a polymer matrix doped with conductive materials and polymer reaction catalysts.

[0085] D. The repair layer on the inner side of the substrate is: a polymer matrix doped with conductive materials and microcapsules; the repair layer inside the encapsulation layer is: a polymer matrix doped with conductive materials, microcapsules and a polymer reaction catalyst.

[0086] E. The repair layer on the inner side of the substrate is: a polymer matrix doped with a conductive material and a polymer reaction catalyst; the repair layer in the encapsulation layer is: a polymer matrix doped with a conductive material, microcapsules and a polymer reaction catalyst.

[0087] F. The repair layer on the inner side of the substrate is: a polymer matrix doped with conductive materials and microcapsules; the repair layer inside the encapsulation layer is: a polymer matrix doped with conductive materials and a polymer reaction catalyst.

[0088] G. The repair layer on the inner side of the substrate is: a polymer matrix doped with conductive materials and a polymer reaction catalyst; the repair layer inside the encapsulation layer is: a polymer matrix doped with conductive materials and microcapsules.

[0089] H. The repair layers on the inner side of the substrate and the inner side of the encapsulation layer are both polymer matrices doped with conductive materials and polymer reaction catalysts.

[0090] I. The repair layers on the inner side of the substrate and the inner side of the encapsulation layer are both polymer matrices doped with conductive materials and microcapsules.

[0091] In this embodiment, by also providing a repair layer on the inner side of the packaging layer and the substrate, the adhesion self-repair between the inner repair layers after shearing can further enhance the effect of the side packaging.

[0092] By setting up a repair layer on the inner side of the substrate and the encapsulation layer, especially when the inner repair layer contains microcapsules, the concentration of the inner microcapsules can be set higher than the microcapsule concentration of the outer repair layer. Through microcapsule transfer, the strength of the outer repair layer is relatively improved while ensuring the total amount of microcapsules set.

[0093] Example 4

[0094] like Figure 8 As shown, on the basis of Example 3, in this embodiment, a repair layer is provided on the inner side of the substrate 10 and / or the inner side of the packaging layer 50, and a conductive structure is provided in the repair layer located on the inner side of the substrate 10 for electrically connecting the first electrode layer 20 with the conductive column 12 in the substrate 10; a conductive structure is provided in the repair layer located on the inner side of the packaging layer 50 for electrically connecting the second electrode layer 40 with the conductive column 12 in the packaging layer.

[0095] The conductive structure specifically includes a first auxiliary conductive column and a second auxiliary conductive column, specifically:

[0096] The conductive pillar 12 on the substrate 10 is electrically connected to a first auxiliary conductive pillar 62 extending toward the first electrode layer. The first auxiliary conductive pillar 62 is used to electrically connect the conductive pillar 12 on the substrate 10 and the auxiliary electrode 22 on the first electrode layer 20. The repair layer 60 on the inner side of the substrate 10 is coated around the first auxiliary conductive pillar 62. The first auxiliary conductive pillar is made of conductive material such as tin or copper, and a contact plate 64 having a diameter larger than that of the body is provided at its end for surface contact with the auxiliary electrode 22.

[0097] The conductive pillars 12 on the packaging layer 50 are electrically connected to the second auxiliary conductive pillars 63 extending toward the second electrode layer, and the second auxiliary conductive pillars 63 are used to electrically connect the conductive pillars 12 on the packaging layer 50 to the second electrode layer 40. The second auxiliary conductive pillars 63 are made of conductive materials such as tin and copper, and have a contact pad 64 at their ends that has a diameter greater than that of the body, and are used to make surface contact with the second electrode layer 40.

[0098] At this time, the inner side of the substrate 10 and the inner side of the encapsulation layer 50 are provided with a repair layer, and the following configuration can be adopted:

[0099] A. The repair layers on the inner side of the substrate and the inner side of the encapsulation layer are both: a polymer matrix doped with microcapsules and a polymer reaction catalyst.

[0100] B. The repair layer on the inner side of the substrate is: a polymer matrix doped with microcapsules and a polymer reaction catalyst; the repair layer inside the encapsulation layer is: a polymer matrix doped with microcapsules.

[0101] C. The repair layer on the inner side of the substrate is: a polymer matrix doped with microcapsules and a polymer reaction catalyst; the repair layer inside the encapsulation layer is: a polymer matrix doped with a polymer reaction catalyst.

[0102] D. The repair layer on the inner side of the substrate is: a polymer matrix doped with microcapsules; the repair layer inside the encapsulation layer is: a polymer matrix doped with microcapsules and a polymer reaction catalyst.

[0103] E. The repair layer on the inner side of the substrate is: a polymer matrix doped with a polymer reaction catalyst; the repair layer inside the encapsulation layer is: a polymer matrix doped with microcapsules and a polymer reaction catalyst.

[0104] F. The repair layer on the inner side of the substrate is: a polymer matrix doped with microcapsules; the repair layer inside the encapsulation layer is: a polymer matrix doped with a polymer reaction catalyst.

[0105] G. The repair layer on the inner side of the substrate is: a polymer matrix doped with a polymer reaction catalyst; the repair layer inside the encapsulation layer is: a polymer matrix doped with microcapsules.

[0106] H. The repair layers on the inner side of the substrate and the inner side of the encapsulation layer are both polymer matrices doped with a polymer reaction catalyst.

[0107] I. The repair layers on the inner side of the substrate and the inner side of the encapsulation layer are both polymer matrices doped with microcapsules.

[0108] Example 5

[0109] On the basis of Example 3, the materials of the repair layer on the inner side of the substrate and the packaging layer are replaced with the stretchable elastomeric material used in Example 2, and the elastomeric material contains CF3 groups. At this time, the elastomeric material contains the conductive substance in Example 3.

[0110] Example 6

[0111] On the basis of Example 4, the materials of the substrate and the repair layer inside the encapsulation layer are replaced with the stretchable elastomeric material used in Example 2, and the elastomeric material contains CF3 groups.

[0112] Example 7

[0113] This embodiment provides a method for preparing an electroluminescent device, comprising the following steps:

[0114] S1. Determine a cutting outline on the electroluminescent device product of Embodiment 1 to Embodiment 4 according to the design shape; the cutting outline includes at least one first conductive plate and one second conductive plate.

[0115] S2, cutting the electroluminescent device product along the cutting contour to obtain an electroluminescent device with the designed shape.

[0116] Example 6

[0117] like Fig. 9 As shown, this embodiment provides an electroluminescent device (top view from the substrate side), which is cut and manufactured by the method described in Embodiment 5.

[0118] like Fig.10 As shown, Fig. 9 Correspondingly, as shown in the top view of the packaging layer, the outer side of the entire device is provided with a first conductive plate 81 and a second conductive plate 82; when the device after cutting is connected to the outside, it is preferably connected to the conductive plate near the edge, for example, Fig. 9 Any one of the three dotted boxes in the first conductive plate 81 is connected to the positive pole of the power supply, and the selection Fig.10 Any one of the second conductive plates 82 is connected to the negative pole of the power supply.

[0119] When the conductive plates of the cut electroluminescent device are all located in the middle, it is necessary to lead the external power supply area from the conductive plates through the transparent conductive material 83, such as Fig.11 As shown in the figure, the first conductive plate 81 is located in the middle of the device, and is connected to the edge and the positive electrode of the power supply through a long strip of transparent conductive material 83; accordingly, the second conductive plate and the negative electrode of the power supply are also connected in this way. The transparent conductive material can be, for example, ITO.

[0120] In certain embodiments of the present application, after the cut electroluminescent device is cut and connected to an external power circuit, a protective layer is applied to the outer surface of the device by spraying or coating.

[0121] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept. For example, the above features are replaced with (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. A flexible electroluminescent device product, characterized in that: The electroluminescent device product comprises a substrate, a first electrode layer, a light-emitting functional layer, a second electrode layer and an encapsulation layer in sequence; a repair layer is provided on the outer side of the substrate and the outer side of the encapsulation layer; when the electroluminescent device product is sheared, the edges of the two layers of the repair layer contact and self-repair to form a side encapsulation; the repair layer comprises a polymer matrix and microcapsules doped in the polymer matrix and a polymer reaction catalyst or is made of a stretchable elastomeric material; wherein the microcapsules contain a polymer precursor, and the elastomeric material contains a CF3 group; A plurality of first conductive plates are provided through the repair layer adjacent to the substrate; a plurality of second conductive plates are provided through the repair layer adjacent to the packaging layer; a plurality of conductive pillars are provided through both sides of the substrate for electrically connecting the first electrode layer and the first conductive plate; a plurality of conductive pillars are provided through both sides of the packaging layer for electrically connecting the second electrode layer and the second conductive plate.

2. The flexible electroluminescent device product according to claim 1, characterized in that: The thickness of the repair layer is greater than the total thickness between the outer side of the substrate and the outer side of the packaging layer.

3. The flexible electroluminescent device product according to claim 1, characterized in that: When the electroluminescent device product emits light from the substrate side, the first conductive plate is made of a transparent material; when the electroluminescent device product emits light from the packaging layer side, the second conductive plate is made of a transparent material; the conductive base material of the conductive column extends to the outer surface of the substrate or the packaging layer to form a power connection area, and the first conductive plate and the second conductive plate are welded in the power connection area; the conductive column is filled with a protective material.

4. The flexible electroluminescent device product according to claim 1, characterized in that: A repair layer is provided on the inner side of the substrate and / or the inner side of the packaging layer; a conductive material or a conductive structure is provided in the repair layer located on the inner side of the substrate, which is used to electrically connect the first electrode layer with the conductive columns in the substrate; a conductive material or a conductive structure is provided in the repair layer located on the inner side of the packaging layer, which is used to electrically connect the second electrode layer with the conductive columns in the packaging layer.

5. The flexible electroluminescent device product according to claim 4, characterized in that: The inner side of the substrate and / or the inner repair layer of the encapsulation layer comprises a polymer matrix: the polymer matrix of at least one inner repair layer is doped with microcapsules and / or a polymer reaction catalyst, and the microcapsules contain a polymer precursor; The concentration of microcapsules in the inner side of the substrate and / or the inner side repair layer of the encapsulation layer is higher than the concentration of microcapsules in the outer side of the substrate and / or the outer side repair layer of the encapsulation layer.

6. A flexible electroluminescent device product according to any one of claims 1 to 3, characterized in that: The visible light transmittance of the self-repairing material is greater than 80%; and the repairing layer is doped with water-absorbing material.

7. A method for preparing a flexible electroluminescent device, characterized in that: The following steps are involved: A cutting outline is determined on the flexible electroluminescent device product according to any one of claims 1 to 6 according to the designed shape; the cutting outline includes at least a first conductive plate and a second conductive plate; and the flexible electroluminescent device product is cut along the cutting outline to obtain a flexible electroluminescent device with a designed shape.

8. A flexible electroluminescent device, characterized in that: Prepared by the method described in claim 7.

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