Circuit boards, circuit boards and fixtures

Abstract

The present invention provides a substrate, which includes a first connection pad area, a second connection pad area, a first microheater, a second microheater, a first heater end pad, a second heater end pad and a third heater end pad. The first connection pad area and the second connection pad area each include at least one connection pad. The first microheater and the second microheater are respectively arranged relative to the first connection pad area and the second connection pad area. The first heater end pad and the second heater end pad are electrically connected to the outside world to form a loop with the first microheater, so that the first microheater generates heat. The second heater end pad and the third heater end pad are electrically connected to the outside world to form a loop with the second microheater, so that the second microheater generates heat. A circuit substrate and a fixture are also provided.

Description

Technical Field

[0001] The invention relates to a substrate, a circuit substrate and a fixture, and in particular to a substrate, a circuit substrate and a fixture suitable for heating installation. Background Art

[0002] If electronic components are to be connected to the connection pads of a substrate, micro-heaters are often used to heat and install them so that the electronic components are soldered to the connection pads of the substrate. As electronic devices are becoming thinner and shorter, how to reduce the number of micro-heater end pads on the substrate and achieve effective soldering is a current issue. Summary of the invention

[0003] The present invention is directed to a substrate, a circuit substrate and a fixture, which are beneficial to the miniaturization of electronic devices and are simpler to use or have better performance and / or applicability.

[0004] According to one embodiment of the present invention, the substrate of the present invention includes a first connection pad area and a second connection pad area, a first microheater and a second microheater, and a first heater end pad, a second heater end pad, and a third heater end pad. The first connection pad area and the second connection pad area each include at least one connection pad. The first microheater and the second microheater are respectively arranged relative to the first connection pad area and the second connection pad area. The first heater end pad and the second heater end pad are electrically connected to the outside world to form a loop with the first microheater, so that the first microheater generates heat, and the second heater end pad and the third heater end pad are electrically connected to the outside world to form a loop with the second microheater, so that the second microheater generates heat.

[0005] According to an embodiment of the present invention, the circuit substrate of the present invention comprises the above-mentioned substrate and a circuit layer. The circuit layer is electrically connected to the first connection pad area and the second connection pad area of ​​the substrate.

[0006] According to one embodiment of the present invention, the fixture of the present invention includes a heating probe group, which includes at least two probe heads, and the at least two probe heads are used to contact one of the following: a first heater end pad and a second heater end pad such as the above-mentioned substrate, and a second heater end pad and a third heater end pad such as the above-mentioned substrate.

[0007] According to one embodiment of the present invention, the fixture of the present invention includes a heating probe group, which includes at least two probe heads, and the at least two probe heads are used to contact one of the following: a first heater end pad and a second heater end pad such as the above-mentioned circuit substrate, and a second heater end pad and a third heater end pad such as the above-mentioned circuit substrate.

[0008] Based on the above, the substrate, circuit substrate and fixture of the present invention can reduce the number and area of ​​heater end pads on the substrate and circuit substrate by sharing the heater end pads between two adjacent connection pad areas, and can also reduce the number of probe heads of the fixture, thereby facilitating the miniaturization of electronic devices and reducing costs. It is also simpler to use or has better performance and / or applicability.

[0009] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A is a partial cross-sectional schematic diagram of a substrate according to an embodiment of the present invention.

[0011] Figure 1B is a partial top view schematically showing a substrate according to an embodiment of the present invention.

[0012] Figures 2 to 4 The invention discloses a manufacturing process of a circuit substrate according to an embodiment of the invention.

[0013] Figure 5 It is a partial top view schematic diagram of a circuit substrate according to an embodiment of the present invention.

[0014] Figure 6 is a partial top view schematically showing a substrate according to an embodiment of the present invention.

[0015] Figure 7 The invention discloses a manufacturing process of a circuit substrate according to an embodiment of the invention.

[0016] Description of Reference Numerals

[0017] 10: Carrier

[0018] 100, 100', 100": Substrate / Circuit Board

[0019] 110: Base material

[0020] 111: First surface

[0021] 112: Second surface

[0022] 115: Conductive structure

[0023] 120a, 120b: micro heater

[0024] 122a, 122b: micro-heating components

[0025] 124a, 124b: conductive path

[0026] 130a, 130b: connection pad area

[0027] 132a, 132b: connection pads

[0028] 142, 144, 146: Heater end pad

[0029] 150: Circuit layer

[0030] 160a, 160b: Insulation structure

[0031] 161a, 161b: first insulating layer

[0032] 162a, 162b: second insulating layer

[0033] 170: Electronic components

[0034] 172: Connector

[0035] 200: Circuit board

[0036] 300, 400: Jig

[0037] 310, 410: Heating probe set

[0038] 312, 412: Probe head

[0039] 320, 420: bearing parts DETAILED DESCRIPTION

[0040] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0041] The contents of the following embodiments are for illustration rather than limitation. Furthermore, descriptions of well-known devices, methods, and materials may be omitted so as not to obscure the description of the various principles of the present invention. The directional terms (e.g., up, down) used herein refer only to the idiomatic terms used or corresponding to the drawings, and are not intended to imply an absolute orientation. In the drawings, for the sake of clarity, the sizes of some components or film layers may be enlarged or reduced. Similar components are represented by the same reference numerals and have similar functions, materials, or formation methods, and descriptions are omitted. It will be apparent to those with ordinary knowledge in the technical field to which the present invention belongs that, by means of the contents of the embodiments and the corresponding illustrations, the present invention can be practiced in other embodiments that depart from the specific details disclosed herein.

[0042] Figure 1A is a partial cross-sectional schematic diagram of a substrate according to an embodiment of the present invention. Figure 1B 1 is a schematic diagram of a partial top view of a substrate according to an embodiment of the present invention. Figure 1B The diagram is shown in perspective, and some components are omitted.

[0043] Please refer to Figure 1A and Figure 1B , the substrate 100 includes a first connection pad area 130a, a second connection pad area 130b, a first microheater 120a, a second microheater 120b, a first heater end pad 142, a second heater end pad 144, and a third heater end pad 146. The substrate 110 has a first surface 111 and a second surface 112 opposite to the first surface 111. The first microheater 120a, the second microheater 120b, the first heater end pad 142, the second heater end pad 144, and the third heater end pad 146 can be disposed on the first surface 111 of the substrate 110. The substrate 110 can include a hard board (such as a glass board, a glass fiber board (such as an FR4 board); but not limited to) and / or a soft board (such as a polyimide film (PI) or other suitable soft substrates, but not limited to), but the present invention is not limited thereto. The first surface 111 of the substrate 110 may include a first connection pad area 130a and a second connection pad area 130b, but the present invention is not limited thereto, and the number of connection pad areas can be adjusted as needed. The first connection pad area 130a and the second connection pad area 130b include at least one connection pad 132a, 132b, respectively. For example, the first connection pad area 130a includes at least one connection pad 132a, and the second connection pad area 130b includes at least one connection pad 132b. The material of the connection pads 132a, 132b includes, for example, a metal with a high melting point (e.g., a melting point higher than the material of the connector 172 of the electronic component 170 described later) (e.g., copper or other alloys; but not limited thereto), but the present invention is not limited thereto.

[0044] In this embodiment, the first micro heater 120a is disposed relative to the first connection pad area 130a, and the second micro heater 120b is disposed relative to the second connection pad area 130b. For example, the first micro heater 120a can be disposed between the connection pad 132a and the substrate 110, and the second micro heater 120b can be disposed between the connection pad 132b and the substrate 110.

[0045] In this embodiment, the first heater end pad 142 and the second heater end pad 144 can be electrically connected by an external power supply. Then, a loop can be formed with the first micro heater 120a, so that the first micro heater 120a generates heat. The second heater end pad 144 and the third heater end pad 146 can be electrically connected by an external power supply. Then, a loop can be formed with the second micro heater 120b, so that the second micro heater 120b generates heat. In other words, in the substrate 100, the first micro heater 120a can be on the conductive path 124a between the first heater end pad 142 and the second heater end pad 144, and the second micro heater 120b can be on the conductive path 124b between the second heater end pad 144 and the third heater end pad 146.

[0046] In the present embodiment, the number of the first microheater 120a or the second microheater 120b may be at least one. For example, the first microheater 120a may include at least one microheating element 122a, or the second microheater 120b may include at least one microheating element 122b. The number and / or configuration of the microheating elements 122a, 122b and / or the connection pads 132a, 132b may be adjusted according to design requirements, and are not limited in the present invention. For example, the microheating elements 122a, 122b are arranged in an array on the first surface 111 of the substrate 110, and one microheating element (e.g., microheating element 122a / 122b) may be arranged relative to two connection pads (e.g., connection pads 132a / 132b).

[0047] In this embodiment, at least one micro-heating element may be electrically connected via a conductive path. For example, multiple micro-heating elements 122a may be connected in series or in parallel on the conductive path 124a, or multiple micro-heating elements 122b may be connected in series or in parallel on the conductive path 124b.

[0048] In one embodiment, an insulating structure 160a may be provided between the first connection pad area 130a and the first microheater 120a, and an insulating structure 160b may be provided between the second connection pad area 130b and the second microheater 120b. In other words, the first connection pad area 130a and the first microheater 120a are not in direct contact, and the second connection pad area 130b and the second microheater 120b are not in direct contact. The insulating structures 160a and 160b may respectively include first insulating layers 161a and 161b and second insulating layers 162a and 162b stacked successively on the first microheater 120a and the second microheater 120b, but the present invention is not limited thereto.

[0049] In one embodiment, the substrate 100 may further include a circuit layer 150. The layout design of the circuit layer 150 may be adjusted according to requirements and is not limited in the present invention.

[0050] The circuit layer 150 is located between the connection pads 132a, 132b and the first microheater 120a and the second microheater 120b. The circuit layer 150 is located on the first insulating layer 161a, 161b and is covered by the second insulating layer 162a, 162b. The circuit layer 150 is electrically connected to the connection pads 132a, 132b through the conductive vias of the second insulating layer 162a, 162b. In one embodiment, the substrate 100 including the circuit layer 150 may also be referred to as a circuit substrate.

[0051] In one embodiment, the first heater pad 142 and the second heater pad 144 can be electrically connected to the first micro heater 120a through corresponding conductive vias, corresponding circuits in the circuit layer 150, and conductive paths 124a. The second heater pad 144 and the third heater pad 146 can be electrically connected to the second micro heater 120b through corresponding conductive vias, corresponding circuits in the circuit layer 150, and conductive paths 124b, but the present invention is not limited thereto.

[0052] In one embodiment, the first heater pad 142 , the second heater pad 144 , the third heater pad 146 and the connection pads 132 a and 132 b may be formed from the same film layer. Therefore, the substrate 100 may be simpler to use or manufacture.

[0053] In one embodiment, the resistance value of the micro-heating components 122a and 122b may be between 10 ohms (Ω) and 500 Ω. In other words, the micro-heating components 122a and 122b may be resistive heaters.

[0054] Figures 2 to 4 The present invention is a schematic diagram of a manufacturing process of a circuit substrate according to an embodiment of the present invention. Figure 2 It is a bottom view schematic diagram of a fixture according to an embodiment of the present invention. Figure 3 to Figure 4 It is a cross-sectional schematic diagram of a manufacturing process of a circuit substrate according to an embodiment of the present invention. Figure 3 and Figure 4 The substrate in is similar to the substrate 100 of the aforementioned embodiment, and similar components thereof are indicated by the same or similar reference numerals and have similar functions, materials or uses, and description thereof is omitted.

[0055] Please refer to Figure 2 , provide a fixture 300, and carry the electronic component 170 on the fixture 300. The fixture 300 includes a heating probe set 310. The heating probe set 310 includes at least two probe heads 312, which can be used to contact the first heater end pad 142 and the second heater end pad 144 of the aforementioned substrate 100; or, used to contact the second heater end pad 144 and the third heater end pad 146 of the aforementioned substrate 100.

[0056] It should be noted that the present invention does not limit the number of probe heads 312 in the heating probe set 310 , and the number of probe heads 312 can be set according to actual needs.

[0057] In one embodiment, the fixture 300 may further include a carrier 320, which is suitable for disposing at least one electronic component 170 on the first connection pad area 130a or the second connection pad area 130b of the substrate 100. For example, the carrier 320 may indirectly carry the electronic component 170 through the carrier 10 to dispose the electronic component 170 on the first connection pad area 130a or the second connection pad area 130b of the substrate 100, but the present invention is not limited thereto. The carrier 10 may include glass, plastic or blue film, but the present invention is not limited thereto.

[0058] In one embodiment, the carrier 320 can directly carry the electronic component 170 .

[0059] The electronic component 170 may include at least one connector 172 for connecting to the substrate 100. The material of the connector 172 may include, for example, a conductor (such as solder, but not limited to) with a low melting point (i.e., a melting point lower than the melting points of the connection pads 132a, 132b, the micro-heaters 120a, 120b, and the insulating structures 160a, 160b of the substrate 100). The shape of the connector 172 is not limited in the present invention.

[0060] In one embodiment, the electronic component 170 may be a light emitting diode, for example, but the invention is not limited thereto.

[0061] It is worth noting that the number of electronic components 170 carried by the carrier 320 can be set according to actual needs, and the present invention is not limited thereto.

[0062] Please refer to Figure 3 , a substrate 100 including a circuit layer 150 is provided, and an electronic component 170 is arranged on the first connection pad area 130a of the substrate 100 through a fixture 300. In this embodiment, the substrate including a circuit layer used is the substrate 100 including a circuit layer 150 of the aforementioned embodiment (also referred to as a circuit substrate 100). Therefore, the same or similar reference numerals or terms are used for description in subsequent drawings or descriptions, and repeated contents are not repeated. In an embodiment not shown, the substrate including a circuit layer used can be a substrate similar to the substrate 100.

[0063] For example, the probe head 312 of the fixture 300 is respectively opposite to and in contact with the first heater end pad 142 and the second heater end pad 144 of the substrate 100, and the connector 172 of the electronic component 170 is opposite to and in contact with the connection pad 132a of the first connection pad area 130a. Since the probe head 312 is in contact with the first heater end pad 142 and the second heater end pad 144, the first microheater 120a is electrically connected to the outside to form a loop, and the first microheater 120a can be electrically heated, and the heat energy generated by the first microheater 120a can be transferred to the connection pad 132a and the connector 172 of the electronic component 170 thermally coupled thereto. In other words, the connection pad 132a and the connector 172 located thereon can be heated by the first microheater 120a. After appropriate and / or timely heating, the connector 172 thermally coupled to the connection pad 132a may be melted, and then the heating may be stopped to cool and solidify the connector 172, so that a good electrical connection may be established between the electronic component 170 and the corresponding connection pad 132a. The jig 300 may then be removed to achieve the purpose of mounting the electronic component 170 on the substrate 100.

[0064] Please refer to Figure 4 , continue to carry the electronic component 170 on the fixture 300, and configure the electronic component 170 on the second connection pad area 130b of the substrate 100 through the fixture 300. Figure 3 The electronic component 170 is arranged on the second connection pad area 130b of the substrate 100 in a manner. For example, the electronic component 170 is carried on the carrier 320 of the fixture 300, and the probe head 312 of the fixture 300 is respectively opposite to and in contact with the second heater end pad 144 and the third heater end pad 146 of the substrate 100, so that the connector 172 of the electronic component 170 is opposite to and in contact with the connection pad 132b of the second connection pad area 130b. Since the probe head 312 is in contact with the second heater end pad 144 and the third heater end pad 146, the second microheater 120b can be electrically connected to the outside to form a loop, and then the second microheater 120b can be electrically heated, and the heat energy generated by the second microheater 120b can be transferred to the connection pad 132b and the connector 172 of the electronic component 170 thermally coupled thereto. In other words, the connection pad 132b and the connector 172 located thereon can be heated by the second microheater 120b. After appropriate and / or timely heating, the connector 172 thermally coupled to the connection pad 132b may be melted, and then the heating may be stopped to cool and solidify the connector 172, so that a good connection may be established between the electronic component 170 and the corresponding connection pad 132b. Then, the jig 300 may be removed to achieve the purpose of mounting the electronic component 170 on the substrate 100.

[0065] Repeat similar to the above Figure 3 to Figure 4 The steps are repeated until all the electronic components 170 to be bonded are bonded to the substrate 100, and the manufacture of the circuit substrate 200 is completed. It should be understood that in this embodiment, only the bonding steps of part of the electronic components and part of the substrate are shown for illustration, and there are still parts of the substrate 100 that are not bonded to the electronic components in other places not shown.

[0066] Since the electronic component 170 is partitioned and bonded to the substrate 100 through the fixture 300, and part of the heater end pad (such as the second heater end pad 144) is shared between two adjacent connection pad areas (such as the first connection pad area 130a and the second connection pad area 130b), the number and area of ​​the heater end pads of the substrate 100 or the circuit substrate 200 can be reduced, and the number of probe heads 312 of the fixture 300 can also be reduced, which is beneficial to the miniaturization of electronic devices, reduces costs, and can be simpler to use or have better performance and / or applicability.

[0067] Figure 5 It is a partial top view schematic diagram of a circuit substrate according to an embodiment of the present invention.

[0068] Please refer to Figure 5 , the circuit substrate 200 includes a substrate 100 and a circuit layer 150. The substrate 100 is similar to the substrate 100 of the aforementioned embodiment, and includes a first connection pad area 130a, a second connection pad area 130b, a first microheater 120a, a second microheater 120b, a first heater end pad 142, a second heater end pad 144, and a third heater end pad 146. Among them, the first connection pad area 130a includes at least one connection pad 132a, and the second connection pad area 130b includes at least one connection pad 132b. The first microheater 120a is arranged relative to the first connection pad area 130a, and the second microheater 120b is arranged relative to the second connection pad area 130b. The first microheater 120a is composed of at least one microheating component 122a, and the second microheater 120b is composed of at least one microheating component 122b. The plurality of micro-heating components 122a can be connected in series or in parallel and are electrically connected to each other through the conductive path 124a, and the plurality of micro-heating components 122b can be connected in series or in parallel and are electrically connected to each other through the conductive path 124b. The first heater end pad 142 and the second heater end pad 144 can be electrically connected to the first micro-heater 120a, and the second heater end pad 144 and the third heater end pad 146 can be electrically connected to the second micro-heater 120b.

[0069] The circuit layer 150 is electrically connected to the first connection pad area 130a and the second connection pad area 130b. Specifically, the circuit layer 150 is located between the connection pads 132a, 132b and the first micro heater 120a and the second micro heater 120b, and is electrically connected to the connection pads 132a, 132b, but the present invention is not limited thereto.

[0070] In one embodiment, the circuit substrate 200 may further include an electronic component 170. The electronic component 170 may be disposed corresponding to the micro-heating components 122a and 122b. The electronic component 170 may be, for example, a light emitting diode, but the present invention is not limited thereto. The electronic component 170 may include at least one connector 172, and the connector 172 may correspond to the connection pads 132a and 132b of the substrate 100. The electronic component 170 may be arranged in an array on the substrate 100, but the present invention is not limited thereto.

[0071] In an exemplary application of the circuit substrate 200 , it may be a backlight source substrate or a part of a backlight source substrate.

[0072] In an exemplary application of the circuit substrate 200 , it may be a display substrate or a part of a display substrate.

[0073] Figure 6 is a partial top view schematically showing a substrate according to an embodiment of the present invention. Figure 6 The substrate is similar to the substrate 100 of the aforementioned embodiment, and similar components thereof are indicated by the same or similar reference numerals and have similar functions, materials or uses, and description thereof is omitted.

[0074] Please refer to Figure 6 The substrate 100' of this embodiment and Figure 1A or Figure 1B The biggest difference between the embodiments is that two adjacent conductive paths 124a can be connected in parallel to connect to the same first heater pad 142 and the same second heater pad 144; and adjacent conductive paths 124b can be connected in parallel to connect to the same second heater pad 144 and the same third heater pad 146. In other words, the micro-heating elements 122a on the two adjacent conductive paths 124a can be electrically connected to the outside world through the same first heater pad 142 and the same second heater pad 144, and the micro-heating elements 122b on the two adjacent conductive paths 124b can be electrically connected to the outside world through the same second heater pad 144 and the same third heater pad 146, thereby reducing the number and area of ​​the heater pads of the substrate 100'.

[0075] In some embodiments, the substrate 100' may also be made using a substrate similar to the above Figures 2 to 4By using a method, an electronic component 170 is disposed on the substrate 100' to form a circuit substrate, but the present invention is not limited thereto.

[0076] Figure 7 It is a cross-sectional schematic diagram of a manufacturing process of a circuit substrate according to an embodiment of the present invention. Figure 7 The substrate in is similar to the circuit substrate 100 of the aforementioned embodiment. Figure 7 The fixture in the embodiment is similar to the fixture 300 of the aforementioned embodiment, and similar components thereof are indicated by the same or similar reference numerals and have similar functions, materials or uses, and description thereof is omitted.

[0077] Please refer to Figure 7 , providing a substrate 100". One of the differences between the substrate 100" of this embodiment and the aforementioned embodiment is that the first heater end pad 142, the second heater end pad 144 and the third heater end pad 146 of the substrate 100" are located on the second surface 112 of the substrate 100", and the substrate 110 also includes a conductive structure 115 that penetrates the substrate 110. The conductive structure 115 corresponds to the first heater end pad 142, the second heater end pad 144 and the third heater end pad 146, and is electrically connected to the conductive paths 124a, 124b and the first heater end pad 142, the second heater end pad 144 and the third heater end pad 146.

[0078] Please continue to refer to Figure 7 , providing a fixture 400. The fixture 400 includes a heating probe set 410 and a carrier 420. The heating probe set 410 includes a probe head 412, which can be used to contact the first heater end pad 142, the second heater end pad 144 and / or the third heater end pad 146 of the substrate 100". The carrier 420 is suitable for configuring at least one electronic component 170 on the first connection pad area 130a or the second connection pad area 130b of the substrate 100".

[0079] Please continue to refer to Figure 7, the electronic component 170 is configured on the first connection pad area 130a of the substrate 100" through the fixture 400. For example, the carrier 420 of the fixture 400 can directly or indirectly carry the electronic component 170, and make the connecting member 172 of the electronic component 170 opposite to and in contact with the connection pad 132a of the first connection pad area 130a. The heating probe group 410 of the fixture 400 can be temporarily fixed under the substrate 100", and make the probe head 412 opposite to and in contact with the first heater end pad 142, the second heater end pad 144 and the third heater end pad 146. The heating probe group 410 can energize at least two probe heads 412 corresponding to the first connection pad area 130a, for example, it can energize two probe heads 412 relative to the first heater end pad 142 and the second heater end pad 144. Since the probe head 412 is in contact with the first heater end pad 142 and the second heater end pad 144, the first micro heater 120a is electrically connected to the outside world to form a loop, and the first micro heater 120a can be electrically heated, and the heat energy generated by the first micro heater 120a can be transferred to the connection pad 132a and the connector 172 of the electronic component 170 thermally coupled thereto. In other words, the connection pad 132a and the connector 172 located thereon can be heated by the first micro heater 120a. After moderate and / or timely heating, the connector 172 thermally coupled to the connection pad 132a can be melted, and then the heating can be stopped to cool and solidify the connector 172, so that the electronic component 170 can have a good electrical connection with the corresponding connection pad 132a. Then, the carrier 420 can be removed to achieve the purpose of mounting the electronic component 170 on the substrate 100".

[0080] Similarly, the electronic components 170 can continue to be carried on the carrier 420 and configured on the second connection pad area 130b or other unillustrated area of ​​the substrate 100" through the fixture 400 until all the electronic components 170 to be joined are joined to the substrate 100", thereby completing the manufacture of a similar circuit substrate 200.

[0081] Since the heating probe group 410 of the fixture 400 can be fixed under the substrate 100", it is possible to only move the carrier 420 to a predetermined area (e.g., the second connection pad area 130b), and energize at least two corresponding probe heads 412 (e.g., the probe heads 412 relative to the second heater end pad 144 and the third heater end pad) to thermally couple the electronic component 170 to the substrate 100".

[0082] In one embodiment, the substrate 100" may also be similar to Figure 6 The embodiment includes the conductive paths 124a and 124b connected in parallel to each other, but the invention is not limited thereto.

[0083] In summary, the substrate, circuit substrate and fixture of the present invention can reduce the number and area of ​​heater end pads on the substrate and circuit substrate by sharing the heater end pads between two adjacent connection pad areas, and can also reduce the number of probe heads of the fixture, thereby facilitating the miniaturization of electronic devices and reducing costs. It is also simpler to use or has better performance and / or applicability.

[0084] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate, characterized in that: include: A first connection pad area and a second connection pad area, wherein the first connection pad area and the second connection pad area respectively include at least one connection pad; A first micro heater and a second micro heater, which are respectively disposed relative to the first connection pad area and the second connection pad area; and A first heater end pad, a second heater end pad, and a third heater end pad, wherein the first and second heater end pads are electrically connected to the outside to form a loop with the first microheater, so that the first microheater generates heat, and the second and third heater end pads are electrically connected to the outside to form another loop with the second microheater, so that the second microheater generates heat.

2. The substrate according to claim 1, characterized in that The first micro-heater and the second micro-heater are respectively composed of at least one micro-heating element, wherein the at least one micro-heating element is electrically connected via a conductive path.

3. The substrate according to claim 2, characterized in that The conductive path enables the at least one micro-heating element to be electrically connected in series or in parallel.

4. The substrate according to claim 1, characterized in that An insulating structure is disposed between the first connection pad area and the first micro-heater, and between the second connection pad area and the second micro-heater, respectively.

5. A circuit substrate, characterized in that: include: The substrate according to any one of claims 1 to 4; as well as A circuit layer is electrically connected to the first connection pad area and the second connection pad area of ​​the substrate.

6. The circuit substrate according to claim 5, characterized in that: Also included is at least one electronic component electrically connected to the first connection pad region and the second connection pad region of the substrate.

7. The circuit substrate according to claim 6, characterized in that: The at least one electronic component is a light emitting diode.

8. The circuit substrate according to claim 6, characterized in that: The circuit substrate is a backlight substrate or a display substrate.

9. A fixture, characterized in that: include: A heating probe set, comprising at least two probe heads, wherein the at least two probe heads are used to contact one of the following: The first heater end pad and the second heater end pad of the substrate of claim 1; and The second heater end pad and the third heater end pad of the substrate as claimed in claim 1.

10. A fixture, characterized in that: include: A heating probe set, comprising at least two probe heads, wherein the at least two probe heads are used to contact one of the following: The first heater end pad and the second heater end pad of the circuit substrate according to claim 5 or 6; and The second heater end pad and the third heater end pad of the circuit substrate according to claim 5 or 6.

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