A power device and a photovoltaic system

Abstract

The present application provides a power device and a photovoltaic system, which are used to improve the heat dissipation performance of the power device, thereby improving the reliability of the power device. The power device includes a shell and a heat dissipation device, a partition is arranged in the shell, the partition divides the shell into a first cavity and a second cavity, and the partition is provided with a first opening and a second opening connecting the first cavity with the second cavity; a heat dissipation device is arranged in the first cavity, and an air inlet and an air outlet are arranged in the second cavity, and the air inlet and the air outlet are arranged opposite to each other along a first direction; the heat dissipation device includes a first fin arranged in the second cavity, a channel is arranged in the first fin, and the channel passes through the first fin along a second direction, and the two ends of the channel are connected to the first opening and the second opening respectively; the minimum angle between the second direction and the first direction is greater than 0° and less than or equal to 90°.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a power device and a photovoltaic system. Background Art

[0002] As the power of the inverter increases, the heat generated by the single board, on-board components, cables and other structures inside the inverter chassis is also increasing. Since heat-sensitive devices such as electrolytic capacitors are arranged inside the chassis, the temperature rise inside the chassis directly determines the performance of these devices. At present, the inverter chassis mainly relies on the natural heat dissipation of the chassis wall to the outside. However, this heat dissipation method has a relatively limited heat dissipation capacity, resulting in the inability to effectively cool down the inside of the chassis, thereby affecting the life and reliability of the internal components, and then affecting the overall service life of the inverter. Summary of the invention

[0003] The present application provides a power device and a photovoltaic system, which are used to improve the heat dissipation performance of the power device, thereby improving the reliability of the power device.

[0004] In a first aspect, the present application provides a power device, which may include a housing and a heat dissipation device. A partition is provided in the housing, which may separate the housing into a first cavity and a second cavity. A first opening and a second opening are provided on the partition, and the first opening and the second opening respectively connect the first cavity and the second cavity. A device to be dissipated is provided in the first cavity, and an air inlet and an air outlet are provided in the second cavity, and the air inlet and the air outlet may be arranged opposite to each other along a first direction. The heat dissipation device may include a first fin arranged in the second cavity, the surface of the first fin is arranged toward the partition, and a channel is provided in the first fin, which may pass through the first fin along the second direction, and the two ends of the channel may be connected to the first opening and the second opening respectively. Wherein, the minimum angle between the first direction and the second direction is greater than 0° and less than or equal to 90°.

[0005] In the above scheme, an air circulation loop can be formed between the inside of the first cavity and the channel of the first fin, so that the air in the first cavity can achieve heat exchange with the air flowing through the surface of the first fin during the circulation process, thereby effectively improving the heat dissipation effect inside the first cavity, and further reducing the risk of failure of components inside the first cavity, thereby improving the reliability of the power equipment.

[0006] Exemplarily, the first direction may be a height direction of the power device, and the second direction may be a width direction of the power device.

[0007] In some possible embodiments, there may be multiple first fins, and air ducts extending along the first direction may be formed between adjacent first fins, which helps to improve the heat exchange efficiency between the first fins and the air entering the second cavity, thereby improving the heat dissipation effect inside the first cavity.

[0008] In some possible implementations, the heat dissipation device may further include a first flow guide member and a second flow guide member disposed in the second cavity, one end of the first flow guide member being in communication with the first opening, and the other end being in communication with one end of the channel of the first fin, and one end of the second flow guide member being in communication with the second opening, and the other end being in communication with the other end of the channel of the first fin. In addition to connecting the channel of the first fin with the first cavity, the first flow guide member and the second flow guide member may also play a role in supporting and fixing the first fin, thereby improving the structural stability of the heat dissipation device.

[0009] In some possible implementations, the device to be cooled in the first cavity may include a first device to be cooled, and the first device to be cooled is arranged near the partition. The heat dissipation device may also include a substrate and a plurality of second fins arranged in the second shell, the substrate is arranged on the partition, and the substrate is in thermal contact with the first device to be cooled, the second fins are arranged on the side of the substrate away from the partition, and the second fins extend in a direction away from the partition, and an air duct extending in the first direction may be formed between two adjacent second fins. The heat generated by the first device to be cooled during operation can be transferred to the substrate, and then transferred to the second fins through the substrate, and further transferred to the air flowing through its surface by the second fins, so that the heat dissipation of the first device to be cooled can be achieved.

[0010] Exemplarily, the first device to be cooled may be a power device.

[0011] In some possible implementations, the first fin may be disposed on a side of the free end of each of the plurality of second fins away from the substrate, so as to improve the structural compactness of the heat dissipation device.

[0012] In some other possible embodiments, the plurality of second fins may be divided into a first part and a second part, and along the direction away from the substrate, the height of the second fins in the first part is less than the height of the second fins in the second part. In this case, the first fin may be arranged on the side of the free end of each second fin in the first part away from the substrate. This design can also improve the compactness of the heat dissipation device.

[0013] In some possible implementations, the projection of the outer contour of the substrate on the surface of the partition may be located between the first opening and the second opening. Alternatively, the area enclosed by the projection of the outer contour of the substrate on the surface of the partition may cover the first opening and the second opening. In this case, the positions of the substrate corresponding to the first opening and the second opening may be provided with a first avoidance hole and a second avoidance hole, respectively. The end of the first flow guide member may pass through the first avoidance hole to communicate with the first opening, and the second flow guide member may pass through the second avoidance hole to communicate with the second opening. This design can increase the area of ​​the substrate, thereby facilitating the improvement of the heat dissipation effect of the first heat dissipation device.

[0014] In some possible implementation schemes, an opening may be provided on the partition at a position corresponding to the first device to be cooled, and the first device to be cooled may extend into the opening to be in thermal contact with the substrate. This can improve the heat exchange efficiency between the first device to be cooled and the heat dissipation device, thereby helping to improve the heat dissipation effect of the first device to be cooled.

[0015] In some possible embodiments, the heat dissipation device may also include a first fan arranged in the second cavity, with the air inlet side of the first fan arranged toward the air inlet, and the air outlet side of the first fan arranged toward the air outlet. This can increase the air circulation rate in the second cavity, thereby improving the heat dissipation effect of the heat dissipation device.

[0016] In some possible implementations, the device to be cooled in the first cavity may also include a second device to be cooled and a third device to be cooled. The heat dissipation device also includes a second fan disposed in the first cavity, the second device to be cooled may be disposed between the first opening and the air inlet side of the second fan, the third device to be cooled may be disposed between the air outlet side of the second fan and the second opening, and the third device to be cooled is located on the side of the first device to be cooled away from the partition. After the air in the first fin that has undergone heat exchange and cooling enters the first cavity from the first opening, the low-temperature air may first pass through the second device to be cooled, exchange heat with the second device to be cooled, and then be blown to the third device to be cooled by the second fan, thereby further exchanging heat with the third device to be cooled, and then flowing from the second opening to the first fin, completing a cycle, and realizing heat dissipation of each device to be cooled in the first cavity.

[0017] In some possible implementations, the heat dissipation device may further include a third flow guide member disposed in the first cavity, the third flow guide member being in communication with the first opening, and the third flow guide member being provided with a first air outlet facing the third device to be cooled. The second device to be cooled is disposed in the third flow guide member, the second fan is disposed at the first air outlet, and the air inlet side of the second fan is disposed opposite to the first air outlet. By providing the third flow guide member, the second device to be cooled can be confined to a relatively closed space, reducing the risk of air on one side of the second fan outlet side flowing back to the vicinity of the second device to be cooled, thereby helping to further improve the cooling effect of the second device to be cooled.

[0018] In some possible implementations, the heat dissipation device may further include a third fan and a fourth air guide member disposed in the first cavity, the fourth air guide member being in communication with the second opening, and the fourth air guide member being provided with a second air outlet facing the third device to be cooled. The third fan may be disposed at the second air outlet, and the air inlet side of the third fan is disposed toward the third device to be cooled, and the air outlet side of the third fan is disposed opposite to the second air outlet. The provision of the third fan and the fourth air guide member may further reduce the risk of air backflow to the second device to be cooled, thereby helping to improve the reliability of the second device to be cooled.

[0019] Exemplarily, the second heat dissipation component may be an electrolytic capacitor plate, and the third heat dissipation component may be an output plate.

[0020] In some possible implementations, a fourth heat dissipation device may be provided in the second cavity, and the fourth heat dissipation device may be provided on the side of the first fin facing the air outlet. Exemplarily, the fourth heat dissipation device may be a magnetic device. Since the protection requirements of magnetic devices are relatively low, providing them downstream of the heat dissipation path may also achieve a certain heat dissipation effect and ensure their normal operation.

[0021] In a second aspect, the present application also provides a photovoltaic system, which may include a battery panel and a power device in any possible implementation of the first aspect. The battery panel can be used to convert solar energy into electrical energy, and the power device can be used to perform power conversion on the current from the battery panel, or to perform power conversion on the voltage from the battery panel, so that the output power of the photovoltaic system matches the power of the external electrical device. Since the power device has good heat dissipation performance, the reliability of the photovoltaic system is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A side cross-sectional view of a power device provided in an embodiment of the present application;

[0023] Figure 2 for Figure 1 A cross-sectional view of the power device shown in FIG. 1 from a top view;

[0024] Figure 3 for Figure 1 A partial structural schematic diagram of the heat dissipation device shown in ;

[0025] Figure 4 A side cross-sectional view of another power device provided in an embodiment of the present application;

[0026] Figure 5 for Figure 4 A cross-sectional view of the power device shown in FIG. 1 from a top view;

[0027] Figure 6 for Figure 4 A cross-sectional view of the first cavity of the power device shown in FIG. 2 taken perpendicular to the third direction;

[0028] Figure 7 A cross-sectional view of another power device provided in an embodiment of the present application in a top view;

[0029] Figure 8 for Figure 7 A cross-sectional view of the first cavity of the power device shown in FIG. 2 taken perpendicular to the third direction;

[0030] Fig. 9 A cross-sectional view of another power device provided in an embodiment of the present application in a top view;

[0031] Fig.10 for Fig. 9 A cross-sectional view of the first cavity of the power device shown in FIG. 2 taken perpendicular to the third direction;

[0032] Fig.11 A cross-sectional view of another power device provided in an embodiment of the present application in a top view;

[0033] Fig.12 for Fig.11 A cross-sectional view of the first cavity of the power device shown in FIG. 2 taken perpendicular to the third direction;

[0034] Fig.13 A side cross-sectional view of another power device provided in an embodiment of the present application;

[0035] Fig.14 for Fig.13 A cross-sectional view of the power device shown in FIG. 1 from a top view;

[0036] Fig.15 for Fig.14 A partial structural schematic diagram of the heat dissipation device shown in ;

[0037] Fig.16 A side cross-sectional view of another power device provided in an embodiment of the present application;

[0038] Fig.17 for Fig.16 A cross-sectional view of the power device shown in FIG. 1 from a top view;

[0039] Fig.18 for Fig.16 A partial structural schematic diagram of the heat dissipation device shown in ;

[0040] Fig.19 A side cross-sectional view of another power device provided in an embodiment of the present application;

[0041] Fig. 20 for Fig.19 A cross-sectional view of the power device shown in FIG. 1 from a top view;

[0042] Fig.21 for Fig.19 A partial structural schematic diagram of the heat dissipation device shown in ;

[0043] Fig. 22 A side cross-sectional view of another power device provided in an embodiment of the present application;

[0044] Fig.23 for Fig. 22 A cross-sectional view of the power device shown in FIG. 1 from a top view;

[0045] Fig.24 for Fig. 22 A partial structural schematic diagram of the heat dissipation device shown in FIG.

[0046] Reference numerals:

[0047] 100-power equipment;

[0048] 110-shell; 111-partition plate; 1111-first opening; 1112-second opening; 1101-first side wall; 1102-second side wall;

[0049] 1103 - third side wall; 1104 - fourth side wall; 1105 - fifth side wall; 1106 - sixth side wall; 112 - first cavity;

[0050] 113-second cavity; 1131-air inlet; 1132-air outlet;

[0051] 120- heat dissipation device; 121- first fin; 122- first fan; 123- first air guide member; 124- second air guide member;

[0052] 125-base plate; 1251-first avoidance hole; 1252-second avoidance hole; 126, 1261, 1262-second fin;

[0053] 127 - second fan; 128 - third air guide member; 129 - third fan; 1210 - fourth air guide member; 1211 - mounting plate;

[0054] 1212 - first support member; 1213 - second support member; 131 - first heat dissipation device, power device; 132 - power board;

[0055] 133 - second heat dissipation device, electrolytic capacitor plate; 134 - third heat dissipation device, output plate;

[0056] 135 - electrolytic capacitor; 136 - fourth heat dissipation device. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated descriptions will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0058] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0059] The photovoltaic system is a power generation system that uses the photovoltaic effect of semiconductor materials to convert solar energy into electrical energy. Photovoltaic systems usually consist of panels and power devices, where the panels can be used to convert solar energy into electrical energy, and the power devices are used to convert the current from the panels, or can also be used to convert the voltage from the panels, so that the output power of the photovoltaic system matches the power of external electrical equipment. Exemplarily, power devices include but are not limited to inverters, rectifiers, choppers, etc. As the power of power devices increases, the heat generated by components such as single boards, on-board components, and cables inside the chassis of the power equipment also increases, resulting in an increase in the temperature inside the chassis, which is very unfavorable for the components installed inside the chassis, especially some heat-sensitive devices, which have a significantly increased risk of failure under the influence of continuous high temperatures.

[0060] At present, the chassis of power equipment mainly moves the chassis wall to dissipate heat naturally outward. However, the heat dissipation effect of this heat dissipation method is relatively limited, and the inside of the chassis cannot be effectively cooled. Therefore, the life and reliability of the components inside the chassis cannot be guaranteed, which in turn affects the overall service life of the power equipment.

[0061] In view of the above problems, the embodiments of the present application improve the heat dissipation method of the power device, thereby achieving effective heat dissipation inside the power device, thereby reducing the risk of failure of components inside the power device and improving the reliability of the power device. The power device provided in the embodiments of the present application is described in detail below in conjunction with the accompanying drawings.

[0062] For reference Figure 1 and Figure 2 As shown, Figure 1 A side cross-sectional view of a power device 100 provided in an embodiment of the present application, Figure 2 for Figure 1 , a cross-sectional view of the power device 100 in a top-down state is shown in FIG. In the present embodiment, the power device 100 may include a housing 110 and a heat dissipation device. A partition 111 may be provided in the housing 110, and the partition 111 divides the housing 110 into two cavities, namely a first cavity 112 and a second cavity 113. Among them, the first cavity 112 may be a closed cavity, and the second cavity 113 may be a ventilated cavity. In this way, devices in the power device 100 that have relatively high requirements for performance such as waterproof, dustproof or corrosion-resistant can be arranged in the first cavity 112, while devices that do not have such protection requirements or have relatively low protection requirements can be arranged in the second cavity 113.

[0063] Exemplarily, the housing 110 may be a substantially rectangular parallelepiped structure, including a first side wall 1101, a second side wall 1102, a third side wall 1103, a fourth side wall 1104, a fifth side wall 1105, and a sixth side wall 1106, wherein the first side wall 1101 and the second side wall 1102 may be arranged opposite to each other along a first direction, the third side wall 1103 and the fourth side wall 1104 may be arranged opposite to each other along a second direction, and the fifth side wall 1105 and the sixth side wall 1106 may be arranged opposite to each other along a third direction. The minimum angle between the first direction and the second direction may be greater than 0° and less than or equal to 90°, the minimum angle between the second direction and the third direction may be greater than 0° and less than or equal to 90°, and the minimum angle between the first direction and the third direction may be greater than 0° and less than or equal to 90°.

[0064] As an embodiment of the present application, the first side wall 1101 is the bottom wall of the power device, the second side wall 1102 is the top wall of the power device, the fifth side wall 1105 is the front side wall of the power device, and the sixth side wall 1106 is the rear side wall of the power device. At this time, the first direction, the second direction and the third direction can be the height direction, the width direction and the length direction of the power device 100, respectively, and the three directions are perpendicular to each other. Along the first direction, the two ends of the partition 111 can be connected to the first side wall 1101 and the second side wall 1102 respectively, and the first cavity 112 and the second cavity 113 formed at this time are arranged along the third direction. The positions of the first side wall 1101 and the second side wall 1102 corresponding to the second cavity 113 can be respectively provided with an air inlet 1131 and an air outlet 1132, and the air inlet 1131 and the air outlet 1132 are opposite to each other, so that the second cavity 113 can realize the ventilation function.

[0065] For reference Figure 1 , Figure 2 and Figure 3 , Figure 3 for Figure 1Schematic diagram of the partial structure of the heat dissipation device 120 shown in . The heat dissipation device 120 may include a first fin 121 located in the second cavity, and the first fin 121 is arranged toward the partition 111. Exemplarily, a channel may be arranged inside the first fin 121, and the channel may penetrate the first fin 121 along the second direction. At this time, the partition 111 may be provided with a first opening 1111 and a second opening 1112, and the first opening 1111 and the second opening 1112 respectively connect the first cavity 112 and the second cavity 113. One end of the channel of the first fin 121 may be connected to the first opening 1111, and the other end of the channel of the first fin 121 may be connected to the second opening 1112, so that an air circulation loop can be formed between the inside of the first cavity 112 and the channel of the first fin 121, so that the air between the two can circulate. When the high-temperature air in the first cavity 112 enters the channel of the first fin 121, it can exchange heat with the low-temperature air in the second cavity 113 flowing through the surface of the first fin 121. The air in the second cavity 113 is discharged from the air outlet 1132 after being heated up by heat exchange, and the air in the first fin 121 returns to the first cavity 112 after being cooled down by heat exchange, thereby achieving heat dissipation inside the first cavity 112.

[0066] It can be seen from the above description that compared with the method of using the cavity wall to dissipate heat naturally to the outside in the prior art, the embodiment of the present application can achieve circulating flow heat dissipation of the air inside the first cavity 112 while meeting the design requirements of the relevant protection performance of the power device 100, thereby effectively improving the heat dissipation effect inside the first cavity 112, and further reducing the risk of failure of components inside the first cavity 112, thereby improving the reliability of the power device 100.

[0067] In some embodiments, the number of the first fins 121 may be multiple, and a channel extending along the first direction may be formed between two adjacent first fins 121, that is, the direction of the air duct formed between two adjacent first fins 121 is consistent with the ventilation direction of the second cavity 113, which helps to improve the heat exchange efficiency between the first fins 121 and the air entering the second cavity 113, thereby improving the heat dissipation effect inside the first cavity 112. Exemplarily, the multiple first fins 121 may be arranged along the third direction, that is, the multiple first fins 121 may be arranged away from the partition 111 in sequence.

[0068] In addition, the heat dissipation device may further include a first fan 122 (see FIG. Figure 1), the first fan 122 is disposed in the second cavity 113, and the air inlet side of the first fan 122 is disposed toward the air inlet 1131, and the air outlet side of the first fan 122 is disposed toward the air outlet 1132, so as to supply air to the side of the air outlet 1132, so as to increase the air circulation rate in the second cavity 113, thereby improving the heat dissipation effect of the heat dissipation device. Exemplarily, the first fan 122 can be located at one end close to the first side wall 1101, or can also be located at one end close to the second side wall 1102, and the present application does not limit this.

[0069] When the passage of the first fin 121 is connected to the first cavity 112, the heat dissipation device 120 may further include a first flow guide member 123 and a second flow guide member 124, both of which are disposed in the second cavity 113, and one end of the first flow guide member 123 is connected to the first opening 1111, and the other end may be connected to one end of each first fin 121, and one end of the second flow guide member 124 is connected to the second opening 1112, and the other end is connected to the other end of each first fin 121. In this embodiment, in addition to connecting the passage of the first fin 121 to the inside of the first cavity 112, the first flow guide member 123 and the second flow guide member 124 may also play a supporting and fixing role for the first fin 121, thereby improving the structural stability of the heat dissipation device 120.

[0070] At one end of the first flow-guiding member 123 connected to the first opening 1111, the first flow-guiding member 123 can be fixed to the first opening 1111 of the partition 111 by welding, or can be arranged in the first opening 1111 by assembly methods such as plugging, and the present application does not limit this. It should be noted that when the first flow-guiding member 123 is plugged into the first opening 1111, a sealing ring can be arranged between the outer wall of the first flow-guiding member 123 and the inner wall of the first opening 1111 to reduce the risk of air leakage of the first cavity 112 through the first opening 1111. At one end of the first flow-guiding member 123 connected to the channel of the first fin 121, the first flow-guiding member 123 can be provided with openings corresponding to the plurality of first fins 121, and each first fin 121 can be connected to the corresponding opening by welding or plugging. Similarly, when the first fin 121 is plugged into the opening, a sealing ring can be squeezed between the outer wall of the first fin 121 and the inner wall of the opening to reduce the risk of air leakage at the opening. The connection method of the second air guide member 124, the second opening 1112 and each first fin 121 can be set with reference to the first air guide member 123, and will not be repeated here.

[0071] In a specific embodiment, the first opening 1111 and the second opening 1112 can be arranged along the second direction. At this time, the first air guide component 123 and the second air guide component 124 are relatively arranged along the second direction, thereby reducing the obstruction to the air flow in the second cavity 113, so that the air entering the second cavity 113 can flow smoothly into the air ducts formed by adjacent first fins 121.

[0072] Please continue to refer to Figure 1 , Figure 2 and Figure 3 In some embodiments, the heat dissipation device may further include a substrate 125 and a second fin 126, wherein the substrate 125 may be disposed on the partition 111, the second fin 126 may be disposed on a side of the substrate 125 away from the partition 111, and the second fin 126 extends in a direction away from the substrate 125. Exemplarily, the second fin 126 may be a solid sheet-like structure. In one implementation, the device disposed in the first cavity 112 may include a first device to be dissipated 131, which is disposed close to the partition 111 and may be in thermal contact with the substrate 125 located in the second cavity 113, so that the heat generated during operation is transferred to the substrate 125, and further transferred to the second fin 126 through the substrate 125. In this way, external air enters the second cavity 113 through the air inlet 1131, and is discharged from the air outlet 1132 after exchanging heat with the second fins 126, thereby taking away the heat of the second fins 126, thereby achieving heat dissipation for the first heat dissipation device 131.

[0073] In some embodiments, the first device to be cooled 131 may be attached to a surface of the partition 111 facing the first cavity 112 . In this case, the first device to be cooled 131 may be in indirect thermal contact with the substrate 125 through the partition 111 .

[0074] In some other embodiments, a through hole may be opened in the partition 111 at a position corresponding to the first device to be cooled 131. In this case, the first device to be cooled 131 may at least partially extend into the through hole to achieve direct thermal contact with the substrate 125. This can improve the heat exchange efficiency between the first device to be cooled 131 and the heat dissipation device, thereby helping to improve the heat dissipation effect of the first device to be cooled 131.

[0075] Exemplarily, the first device to be cooled 131 may be a power device. It should be noted that the number of the power device below is the same as the number of the first device to be cooled 131. Since the heat generated by the power device 131 during operation is relatively large, part of the heat generated can be dissipated into the first cavity 112 and dissipated outward through the first fin 121 connected to the first cavity 112, and the other part of the heat can be dissipated outward through the second fin 126 through the above-mentioned thermal contact, thereby enhancing the heat dissipation effect of the power device 131 and improving the working reliability of the power device 131.

[0076] In one implementation, the power device 100 may also include a power board 132 disposed in the first cavity 112. The power board 132 may be disposed roughly parallel to the partition 111, and the power device 131 may be specifically disposed on the side of the power board 132 facing the partition 111. In addition, the number of power devices 131 may be one or more, and the present application does not limit this. When there are multiple power devices 131, through holes may be respectively provided on the partition 111 at positions corresponding to each power device 131, so that each power device 131 can dissipate heat by direct thermal contact. Of course, in addition to the power device 131, other electronic components, such as capacitors, may also be provided on the power board 132. These electronic components may be provided on the side of the power board 132 facing the partition 111, or on the side of the power board 132 facing away from the partition 111, and the present application does not limit this either.

[0077] In this embodiment, the projection of the outer contour of the substrate 125 on the surface of the partition 111 can be located between the first opening 1111 and the second opening 1112. Or it can be understood that the projection of the line constituting the outer edge of the substrate 125 on the surface of the partition 111 can be located between the first opening 1111 and the second opening 1112. At this time, the first flow-guiding member 123 and the second flow-guiding member 124 can be located on both sides of the substrate 125 along the second direction, respectively. In addition, the number of the second fins 126 can be multiple, and the multiple second fins 126 can be arranged along the second direction. At this time, a channel extending along the first direction can be formed between adjacent second fins 126. In other words, the wind direction of the air duct formed between adjacent second fins 126 is consistent with the ventilation direction of the second cavity 113, which helps to improve the heat exchange efficiency between the second fins 126 and the air entering the second cavity 113, and thus can improve the heat dissipation effect of the first heat dissipation device 131.

[0078] Continue to refer Figure 1 , Figure 2 and Figure 3In a specific embodiment, the first fin 121 can be arranged on a side of the free end of each second fin 126 in the plurality of second fins 126 away from the substrate 125. The free end of the second fin 126 can be understood as an end of the second fin 126 away from the substrate. Exemplarily, the projections of the plurality of first fins 121 on the surface of the substrate 125 and the projections of the plurality of second fins 126 on the surface of the substrate 125 can overlap. With this design, on the one hand, the compactness of the structure of the heat sink 120 can be improved and the space occupied by it in the power device 100 can be reduced. On the other hand, in the ventilation direction of the second cavity 113, the first fin 121 and the second fin 126 are approximately at the same height. Therefore, the low-temperature air entering the second cavity 113 from the air inlet 1131 can pass through the first fin 121 and the second fin 126 approximately synchronously, so that the temperatures of the two groups of fins can not affect each other, which helps to improve the heat dissipation effect of the heat sink.

[0079] For reference Figure 4 and Figure 5 As shown, Figure 4 A side cross-sectional view of another power device 100 provided in an embodiment of the present application, Figure 5 for Figure 4 , a cross-sectional view of the power device 100 in a top-down state is shown in FIG. In the present embodiment, the heat dissipation device may further include a second fan 127, which may be disposed in the first cavity 112, and the second fan 127 may be disposed near the first opening 1111. At this time, the device disposed in the first cavity 112 may further include a second device to be cooled 133 and a third device to be cooled 134, wherein the second device to be cooled 133 may be disposed between the first opening 1111 and the air inlet side of the second fan 127, and the third device to be cooled 134 may be disposed between the air outlet side of the second fan 127 and the second opening 1112. In one implementation, the second device to be cooled 133 may be located at one end of the third device to be cooled 134 along the second direction, and the third device to be cooled 134 may be located on the side of the first device to be cooled 131 away from the partition 111.

[0080] After the air in the first fin 121 that has undergone heat exchange and cooling enters the first cavity 112 through the first opening 1111, the low-temperature air can first pass through the second heat dissipation device 133, exchange heat with the second heat dissipation device 133, and then be blown to the third heat dissipation device 134 by the second fan 127, thereby further exchanging heat with the third heat dissipation device 134, and then flow into the first fin 121 through the second opening 1112 to complete a cycle. Through this arrangement, the position of the heat dissipation device in the first cavity 112 can be arranged according to the heat dissipation priority or heat generation of the heat dissipation device in the first cavity 112. For example, a device with a relatively high heat dissipation priority can be placed upstream of a device with a relatively low heat dissipation priority, or a device with a relatively low heat generation can be placed upstream of a device with a relatively high heat generation, so as to ensure the heat dissipation effect of each heat dissipation device.

[0081] Exemplarily, the second heat dissipation device 133 can be an electrolytic capacitor plate, and the third heat dissipation device 134 can be an output plate. It should be noted that the number of the electrolytic capacitor plate below is the same as the number of the second heat dissipation device 133, and the number of the output plate is the same as the number of the third heat dissipation device 134. One or more electrolytic capacitors 135 can be provided on the electrolytic capacitor plate 133, and devices such as relays, common mode inductors and capacitors can be provided on the output plate 134. The heat generation of the electrolytic capacitor 135 is relatively small, so it is set upstream of the heat dissipation circuit, and the low-temperature air entering the first cavity 112 from the first opening 1111 can still be at a relatively low temperature after heat exchange with it, so that other downstream devices can still achieve a good heat dissipation effect. And since the electrolytic capacitor 135 is a heat-sensitive device, placing it at the first opening 1111 can also reduce the risk of failure of the electrolytic capacitor 135 due to high temperature, thereby improving the overall reliability of the power device 100.

[0082] In some embodiments, the heat dissipation device may further include a third air guide member 128, which is disposed in the first cavity 112, and one end of the third air guide member 128 may be connected to the first opening 1111, and a first air outlet (not shown in the figure) is disposed at the position of the third air guide member 128 facing the third heat dissipation device 134. In this case, the second heat dissipation device 133 may be disposed in the third air guide member 128, and the second fan 127 may be disposed at the first air outlet of the third air guide member 128, and the air inlet side of the second fan 127 is opposite to the first air outlet, so as to blow the air in the third air guide member 128 toward the third heat dissipation device 134. By providing the third air guide member 128, the second heat dissipation device 133 may be confined in a relatively closed space, reducing the risk of air on the outlet side of the second fan 127 flowing back to the vicinity of the second heat dissipation device 133, thereby helping to further improve the heat dissipation effect of the second heat dissipation device 133.

[0083] Figure 6 for Figure 4 The cross-sectional view of the first cavity 112 of the power device 100 shown in FIG. Figures 4 to 6 In this embodiment, the second heat dissipation device 133 can be arranged substantially parallel to the third heat dissipation device 134. When the second heat dissipation device 133 is an electrolytic capacitor plate and the third heat dissipation device 134 is an output plate, the electrolytic capacitor plate 133, the output plate 134 and the power plate 132 can be parallel to each other, and the output plate 134 is located on the side of the power plate 132 away from the partition 111.

[0084] For reference Figure 7 and Figure 8 As shown, Figure 7 A cross-sectional view of another power device 100 provided in an embodiment of the present application in a top view. Figure 8 for Figure 7 FIG. 4 is a cross-sectional view of the first cavity 112 of the power device 100 shown in FIG. 1 , taken along a direction perpendicular to the third direction.

[0085] In this embodiment, the heat dissipation device of the power device 100 can refer to Figures 4 to 6 The embodiment shown in the figure is arranged, except that, in this embodiment, the second heat dissipation device 133 and the third heat dissipation device 134 can be arranged substantially vertically. When the second heat dissipation device 133 is an electrolytic capacitor plate and the third heat dissipation device 134 is an output plate, the electrolytic capacitor plate 133 can be arranged parallel to the first direction, and the output plate 134 can still be located on the side of the power plate 132 away from the partition and parallel to the power plate 132.

[0086] For reference Fig. 9 and Fig.10 As shown, Fig. 9 A cross-sectional view of another power device 100 provided in an embodiment of the present application in a top view. Fig.10 for Fig. 9The first cavity 112 of the power device 100 shown in FIG. is a cross-sectional view perpendicular to the third direction. In this embodiment, the heat dissipation device may further include a third fan 129 and a fourth air guide member 1210, and both of the third fan 129 and the fourth air guide member 1210 may be arranged in the first cavity 112, and both are arranged near the second opening 1112. One end of the fourth air guide member 1210 may be connected to the second opening 1112, and the position of the fourth air guide member 1210 facing the third heat dissipation device 134 may be provided with a second air outlet (not shown in the figure). The third fan 129 may be arranged at the second air outlet, and the air inlet side of the third fan 129 is arranged toward the third heat dissipation device 134, and the air outlet side of the third fan 129 is opposite to the second air outlet, so as to send the high-temperature air after heat exchange with the third heat dissipation device 134 into the fourth air guide member 1210, and further flow from the fourth air guide member 1210 to the channel of the first fin 121 for heat exchange and cooling.

[0087] In a specific embodiment, the third fan 129 and the second fan 127 can be arranged on both sides of the first cavity 112 along the second direction. At this time, the fourth air guide member 1210 and the third air guide member 128 are also arranged relatively to each other along the second direction. On the one hand, the scheme of this embodiment can increase the air flow rate in the first cavity 112, thereby achieving the purpose of improving the heat dissipation efficiency of each heat dissipation device in the first cavity 112. On the other hand, the arrangement of the third fan 129 and the fourth air guide member 1210 can further reduce the risk of air backflow to the second heat dissipation device 133, which helps to improve the reliability of the second heat dissipation device 133.

[0088] In addition, in this embodiment, the second heat dissipation device 133 can be arranged substantially parallel to the third heat dissipation device 134. When the second heat dissipation device 133 is an electrolytic capacitor plate and the third heat dissipation device 134 is an output plate, the electrolytic capacitor plate 133, the output plate 134 and the power plate 132 can be parallel to each other, and the output plate 134 is located on the side of the power plate 132 away from the partition.

[0089] Of course, in some other implementations, reference may also be made to Figure 7 and Figure 8 In the manner shown in , the second heat dissipation device and the third heat dissipation device are arranged substantially vertically. When the second heat dissipation device is an electrolytic capacitor plate and the third heat dissipation device is an output plate, the electrolytic capacitor plate can be arranged parallel to the first direction, and the output plate can still be located on the side of the power plate away from the partition and parallel to the power plate.

[0090] For reference Fig.11 and Fig.12 As shown, Fig.11 A cross-sectional view of another power device 100 provided in an embodiment of the present application in a top view. Fig.12for Fig.11 The first cavity 112 of the power device 100 shown in FIG. is a cross-sectional view perpendicular to the third direction. Figures 9 and 10 Compared with the embodiment shown in the figure, the third air guide member is omitted in this embodiment. At this time, in order to facilitate the installation of the second fan 127, a mounting plate 1211 can also be provided in the first cavity 112, and the mounting plate 1211 is arranged between the second heat dissipation device 133 and the third heat dissipation device 134, and a third air outlet (not shown in the figure) can be provided on the mounting plate 1211. At this time, the second heat dissipation device 133 can be isolated in the space between the side wall of the housing and the mounting plate 1211, and the second fan 127 is arranged at the third air outlet of the mounting plate 1211, and the air inlet side of the second fan 127 is opposite to the third air outlet, so as to blow the air between the side wall and the mounting plate 1211 to the third heat dissipation device 134. This solution can also reduce the risk of air on the outlet side of the second fan 127 flowing back to the vicinity of the second heat dissipation device 133, thereby helping to improve the heat dissipation effect of the second heat dissipation device 133.

[0091] Similarly, in this embodiment, the second heat dissipation device 133 can be arranged substantially parallel to the third heat dissipation device 134. When the second heat dissipation device 133 is an electrolytic capacitor plate and the third heat dissipation device 134 is an output plate, the electrolytic capacitor plate 133, the output plate 134 and the power plate 132 can be parallel to each other, and the output plate 134 is located on the side of the power plate 132 away from the partition.

[0092] Of course, in some other implementations, reference may also be made to Figure 7 and Figure 8 In the manner shown in , the second heat dissipation device and the third heat dissipation device are arranged substantially vertically. When the second heat dissipation device is an electrolytic capacitor plate and the third heat dissipation device is an output plate, the electrolytic capacitor plate can be arranged parallel to the first direction, and the output plate can still be located on the side of the power plate away from the partition and parallel to the power plate.

[0093] For reference Fig.13 , Fig.14 and Fig.15 As shown, Fig.13 A side cross-sectional view of another power device 100 provided in an embodiment of the present application, Fig.14 for Fig.13 A cross-sectional view of the power device 100 shown in FIG. 1 is a top view of the power device 100, Fig.15 for Fig.14Schematic diagram of the partial structure of the heat dissipation device 120 shown in . In this embodiment, the heat dissipation device 120 may also include a first fin 121, a substrate 125, a second fin 126, a first air guide member 123, a second air guide member 124, a first fan 122 and other structures. Different from the above-mentioned embodiments, the multiple second fins 126 in this embodiment can be designed as two parts with different heights, namely a first part and a second part, and the two parts of the second fins 126 are arranged along the first direction. Among them, the height of the second fin 1261 located in the first part is less than the height of the second fin 1262 located in the second part. It should be noted that the height direction of the second fin 126 here can be understood as the direction away from the substrate 125, that is, the third direction defined above. At this time, the first fin 121 can be arranged on the side of the free end of each second fin 1261 located in the first part away from the substrate 125. That is, the projections of the plurality of first fins 121 on the surface of the substrate 125 and the projections of the plurality of second fins 1261 located in the first portion on the surface of the substrate 125 may overlap, and this design can also achieve the effect of improving the structural compactness of the heat dissipation device.

[0094] It should also be noted that, in this embodiment, the third air guide member, the fourth air guide member 1210, and the second fan and the third fan 129 can be selectively arranged according to the heat dissipation requirements in the first cavity. Fig.14 FIG. 1 schematically shows only the situation that the fourth air guide member 1210 and the third fan 129 are arranged in the first cavity 112 .

[0095] For reference Fig.16 , Fig.17 and Fig.18 As shown, Fig.16 A side cross-sectional view of another power device 100 provided in an embodiment of the present application, Fig.17 for Fig.16 A cross-sectional view of the power device 100 shown in FIG. 1 is a top view of the power device 100, Fig.18 for Fig.16, which is a partial structural diagram of the heat dissipation device 120. In this embodiment, the heat dissipation device 120 may also include a first fin 121, a base plate 125, a second fin 126, a first air guide member 123, a second air guide member 124, a first fan 122 and other structures. Different from the above-mentioned embodiments, in this embodiment, the area enclosed by the projection of the outer contour of the base plate 125 on the partition surface may cover the first opening 1111 and the second opening 1112. In other words, the projection of the line constituting the outer edge of the base plate 125 on the partition surface may cover the first opening 1111 and the second opening 1112. At this time, in order to connect the first air guide member 123 and the second air guide member 124 with the first cavity 112, the base plate 125 may be provided with a first avoidance hole 1251 and a second avoidance hole 1252 at positions opposite to the first opening 1111 and the second opening 1112, respectively. For example, the end of the first air guide member 123 can pass through the first avoidance hole 1251 to communicate with the first opening 1111, and the end of the second air guide member 124 can pass through the second avoidance hole 1252 to communicate with the second opening 1112. This design can increase the area of ​​the substrate 125, thereby facilitating the improvement of the heat dissipation effect of the first heat dissipation device 131.

[0096] For reference Fig.19 , Fig. 20 and Fig.21 As shown, Fig.19 A side cross-sectional view of another power device 100 provided in an embodiment of the present application, Fig. 20 for Fig.19 A cross-sectional view of the power device 100 shown in FIG. 1 is a top view of the power device 100, Fig.21 for Fig.19 The partial structural diagram of the heat dissipation device 120 is shown in FIG. In this embodiment, the first fin 121 and the second fin 126 can be Fig.12 and Fig.13 The arrangement in the embodiment shown in Fig.12 and Fig.13 What is different from the embodiment shown in is that, in this embodiment, the area enclosed by the projection of the outer contour of the substrate 125 on the partition surface can also cover the first opening 1111 and the second opening 1112, and the first avoidance hole 1251 and the second avoidance hole 1252 are respectively arranged at positions opposite to the first opening 1111 and the second opening 1112 on the substrate, so as to facilitate connecting the first guide member 123 and the second guide member 124 with the first cavity 112.

[0097] For reference Fig. 22 and Fig.23 As shown, Fig. 22 A side cross-sectional view of another power device 100 provided in an embodiment of the present application, Fig.23 for Fig. 22A cross-sectional view of the power device 100 shown in FIG. 1 is a top view of the power device 100, Fig.24 for Fig. 22 , a partial structural diagram of the heat dissipation device 120 is shown in FIG. In this embodiment, the heat dissipation device may include a first fin 121, a base plate 125, a second fin 126 and a first fan 122 structure. The positional relationship of each component can refer to the description in the above embodiments, and will not be repeated here. Different from the above embodiments, in this embodiment, the first fin 121 and the second fin 126 can both adopt a solid thin sheet structure, and the first fin 121 is no longer connected to the first cavity 112. At this time, the heat dissipation device also includes a first support member 1212 and a second support member 1213, the first support member 1212 and the second support member 1213 are arranged in the second cavity 113 along the second direction, and one end of the first support member 1212 and the second support member 1213 are respectively fixedly connected to the base plate 125, and the other end of the first support member 1212 and the second support member 1213 are respectively fixedly connected to the two ends of each first fin 121, so that the first fin 121 is supported on the side of the second fin 126 away from the base plate 125.

[0098] In this embodiment, after the heat generated by the first heat dissipation device 131 during operation is transferred to the substrate 125, a portion of the heat can be directly transferred to the second fin 126 through the substrate 125, and another portion of the heat can be transferred to the first support member 1212 and the second support member 1213 through the substrate 125, and further transferred to the first fin 121 by the first support member 1212 and the second support member 1213. After the external air enters the second cavity 113 through the air inlet 1131, it exchanges heat with the first fin 121 and the second fin 126 respectively, and finally is discharged from the air outlet 1132, thereby taking away the heat of the first fin 121 and the second fin 126. It can be seen that the first fin 121 and the second fin 126 in this embodiment are both used to dissipate heat for the first heat dissipation device 131, thereby improving the heat dissipation effect of the first heat dissipation device 131.

[0099] In addition, it should be noted that in the above embodiments, a fourth heat dissipation device 136 may be provided in the second cavity 113 of the power device 100. The fourth heat dissipation device 136 may be provided on the side of the first fin 121 facing the air outlet 1132, that is, located downstream of the ventilation path of the second cavity 113. In this way, the low-temperature air entering the second cavity 113 may be preferentially heat-exchanged with the first fin 121 and the second fin 126, thereby ensuring the heat dissipation effect of each device in the first cavity 112. Since the protection requirements of the fourth heat dissipation device 136 are relatively low, setting it downstream of the heat dissipation path can also achieve a certain heat dissipation effect and ensure its normal operation. Exemplarily, the fourth heat dissipation device 136 may be a magnetic device, such as an inductor.

[0100] It should be understood that in each embodiment of the present application, the device arranged in the first cavity is not limited to the first device to be cooled, the second device to be cooled, and the third device to be cooled mentioned above. Similarly, the device arranged in the second cavity is not limited to the fourth device to be cooled mentioned above. In actual applications, matching devices can be set according to the specific type of power equipment, which will not be elaborated here.

[0101] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A power device (100), characterized in that: It comprises a housing (110) and a heat dissipation device (120), wherein: A partition (111) is arranged in the shell (110), the partition (111) divides the shell (110) into a first cavity (112) and a second cavity (113), and the partition (111) is provided with a first opening (1111) and a second opening (1112) for connecting the first cavity (112) with the second cavity (113); a heat dissipation device is arranged in the first cavity (112), and the second cavity (113) is provided with an air inlet (1131) and an air outlet (1132), and the air inlet (1131) and the air outlet (1132) are arranged opposite to each other along a first direction; The heat dissipation device (120) comprises a first fin (121) arranged in the second cavity (113); the surface of the first fin (121) faces the partition (111); a channel is arranged in the first fin (121); the channel penetrates the first fin (121) along the second direction; two ends of the channel are respectively connected to the first opening (1111) and the second opening (1112); The heat dissipation device in the first cavity (112) comprises a first heat dissipation device (131), and the first heat dissipation device (131) is arranged close to the partition (111); The heat dissipation device (120) further comprises a substrate (125) and a plurality of second fins (126); the substrate (125) is arranged on the partition (111), and the substrate (125) is in thermal contact with the first heat dissipation device (131); the second fins (126) are arranged on a side of the substrate (125) away from the partition (111), and extend in a direction away from the partition (111); and an air duct extending in the first direction is formed between adjacent second fins (126); The minimum angle between the second direction and the first direction is greater than 0° and less than or equal to 90°.

2. The power device (100) according to claim 1, characterized in that There are a plurality of first fins (121), and an air duct extending along the first direction is formed between adjacent first fins (121).

3. The power device (100) according to claim 1 or 2, characterized in that: The heat dissipation device (120) further comprises a first flow guiding component (123) and a second flow guiding component (124) which are arranged in the second cavity (113); one end of the first flow guiding component (123) is connected to the first opening (1111), and the other end is connected to one end of the channel; one end of the second flow guiding component (124) is connected to the second opening (1112), and the other end is connected to the other end of the channel.

4. The power device (100) according to claim 1, characterized in that The first fin (121) is arranged on a side of a free end of each of the plurality of second fins (126) that is away from the base plate (125).

5. The power device (100) according to claim 1, characterized in that The plurality of second fins (126) are divided into a first part and a second part, and along a direction away from the base plate (125), the height of the second fins (1261) located in the first part is smaller than the height of the second fins (1262) located in the second part; The first fin is disposed on a side of the free end of each of the second fins in the first portion away from the base plate.

6. The power device (100) according to claim 4 or 5, characterized in that The projection of the outer contour of the substrate (125) on the surface of the partition (111) is located between the first opening (1111) and the second opening (1112); or, The outer contour of the substrate (125) covers the first opening (1111) and the second opening (1112) in the area enclosed by the projection of the surface of the partition (111), and the substrate is provided with a first avoidance hole and a second avoidance hole at positions corresponding to the first opening (1111) and the second opening (1112), respectively.

7. The power device (100) according to any one of claims 4 to 6, characterized in that: The partition (111) is provided with an opening at a position corresponding to the first heat dissipation device (131), and the first heat dissipation device (131) extends into the opening to be in thermal contact with the substrate (125).

8. The power device (100) according to any one of claims 1 to 7, characterized in that: The heat dissipation device (120) further comprises a first fan (122) arranged in the second cavity (113), wherein the air inlet side of the first fan (122) is arranged toward the air inlet (1131), and the air outlet side of the first fan (122) is arranged toward the air outlet (1132).

9. The power device (100) according to any one of claims 4 to 7, characterized in that: The heat dissipation device in the first cavity (112) includes a second heat dissipation device (133) and a third heat dissipation device (134); The heat dissipation device (120) further comprises a second fan (127) arranged in the first cavity (112); the second heat dissipation device (133) is arranged between the first opening (1111) and the air inlet side of the second fan (127); the third heat dissipation device (134) is arranged between the air outlet side of the second fan (127) and the second opening (1112); and the third heat dissipation device (134) is located on a side of the first heat dissipation device (131) facing away from the partition (111).

10. The power device (100) according to claim 9, characterized in that The heat dissipation device (120) further comprises a third flow guiding component (128) arranged in the first cavity (112), the third flow guiding component (128) being in communication with the first opening (1111), and the third flow guiding component (128) being provided with a first air outlet facing the third heat dissipation device (134); The second heat dissipation device (133) is arranged in the third air guide component (128), the second fan (127) is arranged at the first air outlet, and the air inlet side of the second fan (127) is arranged opposite to the first air outlet.

11. The power device (100) according to claim 9 or 10, characterized in that The heat dissipation device (120) further comprises a third fan (129) and a fourth air guide component (1210) arranged in the first cavity (112); the fourth air guide component (1210) is in communication with the second opening (1112), and the fourth air guide component (1210) is provided with a second air outlet facing the third heat dissipation device (134); The third fan (129) is arranged at the second air outlet, the air inlet side of the third fan (129) is arranged toward the third heat dissipation device (134), and the air outlet side of the third fan (129) is arranged opposite to the second air outlet.

12. The power device (100) according to any one of claims 9 to 11, characterized in that: The second heat dissipation device (133) is an electrolytic capacitor plate; and / or the third heat dissipation device (134) is an output plate.

13. The power device (100) according to any one of claims 1 to 12, characterized in that: A fourth heat dissipation device (136) is provided in the second cavity (113), and the fourth heat dissipation device (136) is provided on a side of the first fin (121) facing the air outlet (1132).

14. A photovoltaic system, characterized in that: It comprises a solar panel and a power device (100) as claimed in any one of claims 1 to 13, wherein the solar panel is used to convert solar energy into electrical energy, and the power device is used to convert current and / or voltage from the solar panel.

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