Binding device, display component, binding system and binding method

Abstract

The present application provides a binding device, a display component, a binding system and a binding method. The binding device is used to bind a display panel to a part to be bound, and the binding device includes a bearing platform, a pressing head, a heating component and a heat dissipation component. The bearing platform is used to bear the display panel and the part to be bound, and the bearing platform includes a bearing surface. The pressing head is movably arranged in a manner that it can approach or move away from the bearing surface. The heating component is arranged on at least one of the bearing platform and the pressing head. The heating component is used to heat at least one of the bearing platform and the pressing head. The heat dissipation component contacts the display panel during the binding process to reduce the heating of the display panel. The embodiments of the present application can reduce the heating of the display panel during the hot-pressing binding process of the display module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a binding device, a display component, a binding system and a binding method. Background Art

[0002] In a display module, a thermal compression bonding process is usually used to bond an integrated circuit board to a display panel to achieve connection of electrical signals between the integrated circuit board and the display panel.

[0003] At present, a binding device is generally used to heat-press the parts to be bound to the display panel to form a display module. During the hot-pressing binding process, part of the heat output by the bearing platform and the pressure head of the binding device will cause the risk of heat failure of the components in the display panel, thereby affecting the display function of the display panel. Therefore, it is urgent to improve the binding device and the binding system. Summary of the invention

[0004] In view of the above problems, the present application provides a binding device, a display assembly, a binding system and a binding method, which can reduce the heat of the display panel during the hot pressure binding process of the display module.

[0005] In the first aspect, the embodiment of the present application provides a binding device for binding a display panel with a part to be bound, and the binding device includes a bearing platform, a pressing head, a heating component, and a heat dissipation component. The bearing platform is used to bear the display panel and the part to be bound, the bearing platform includes a bearing surface, the pressing head is movably arranged in a manner that it can approach or move away from the bearing surface, the heating component is arranged on at least one of the bearing platform and the pressing head, the heating component is used to heat at least one of the bearing platform and the pressing head, and the heat dissipation component contacts the display panel during the binding process to reduce the heat of the display panel.

[0006] In the above technical solution, a heat dissipation component is provided in the binding device to contact the display panel, so as to improve the heat dissipation capacity of the display panel. During the hot pressing binding process, the heat dissipation component can absorb the heat of the display panel, reducing the risk of thermal degradation of the performance and structure of the components in the display panel, improving the quality of the display module formed after hot pressing binding, and improving the manufacturing yield of the display module.

[0007] In a second aspect, the present application provides a display component, which includes a display panel, a part to be bound and a heat dissipation component. The part to be bound is configured to be bound and connected to the display panel by the binding device provided in any embodiment of the first aspect. The heat dissipation component is arranged between the display panel and the part to be bound. The heat dissipation component is in contact with the display panel to reduce the heat applied to the display panel during the binding process.

[0008] In the above technical solution, by arranging a heat dissipation component between the display panel and the parts to be bound, during the hot pressing binding process between the display panel and the parts to be bound, the heat dissipation component can fully contact with the display panel and absorb the heat of the display panel, thereby reducing the risk of thermal degradation of the performance and structure of the devices in the display panel, improving the quality of the display module formed after hot pressing binding, and improving the preparation yield of the display module.

[0009] In a third aspect, the present application provides a binding system, which includes the binding device provided by any embodiment of the first aspect, and the display component provided by any embodiment of the second aspect, wherein the display panel and the parts to be bound are stacked on a carrying platform.

[0010] In the above technical solution, during the hot pressing bonding process between the display panel and the parts to be bonded, the heat dissipation components and / or heat dissipation members can absorb the heat of the display panel, which can further reduce the heat of the display panel, further improve the quality of the display module formed after the hot pressing bonding, and further improve the preparation yield of the display module.

[0011] In a fourth aspect, the present application provides a binding method, which is applied to the binding system provided in the embodiment of the third aspect, and the binding method includes: providing a display panel and a part to be bound; stacking the display panel and the part to be bound on a carrying platform; and controlling a pressure head to hot-press the display panel and at least one of the parts to be bound so that the part to be bound is bound to the display panel.

[0012] In the above technical scheme, the display panel and the part to be bound are bound by adopting a binding device provided with a heat dissipation component and a display assembly provided with a heat dissipation member. During the hot-pressing binding of the display panel and the part to be bound, the heat dissipation component and / or the heat dissipation member can absorb the heat of the display panel, thereby reducing the risk of thermal degradation of the performance and structure of the devices in the display panel, improving the quality of the display module formed after hot-pressing binding, and improving the preparation yield of the display module.

[0013] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0015] Figure 1A schematic diagram of a binding device structure provided in some embodiments of the present application;

[0016] Figure 2 A schematic diagram of another binding device structure provided in some embodiments of the present application;

[0017] Figure 3 A schematic diagram of another binding device structure provided in some embodiments of the present application;

[0018] Figure 4 A schematic diagram of a display component structure provided in some embodiments of the present application;

[0019] Figure 5 A schematic diagram of a display assembly and a binding device provided in some embodiments of the present application;

[0020] Figure 6 A schematic diagram of another display component structure provided in some embodiments of the present application;

[0021] Figure 7 for Figure 6 A schematic diagram of a top view structure;

[0022] Figure 8 A schematic diagram of another display component structure provided in some embodiments of the present application;

[0023] Fig. 9 for Figure 8 A schematic diagram of a top view structure;

[0024] Fig.10 A schematic diagram of another display component and binding device coordination structure provided in some embodiments of the present application.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 10. Carrying platform; 20. Press head; 30. Heating component; 40. Heat dissipation component; 41. First heat dissipation component; 42. Second heat dissipation component; 43. Third heat dissipation component; 44. Fourth heat dissipation component; 50. Buffer component; 60. Conductive adhesive layer; 100. Display panel; 110. Binding area; 120. Heat dissipation area; 200. Component to be bound; 210. Connecting part; 300. Display assembly; 400. Heat dissipation component. DETAILED DESCRIPTION

[0027] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0028] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the embodiments of the present application should have the common meanings understood by technicians in the field to which the embodiments of the present application belong.

[0029] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom" and so on are used interchangeably.

[0030] The orientations or positional relationships indicated by “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc. are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0031] In addition, the technical terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0032] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0033] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] In display modules, the integrated circuit board is usually bonded to the display panel using a hot press bonding process to achieve the connection of electrical signals between the integrated circuit board and the display panel. Bonding is a processing method that uses a certain intermediate medium to achieve mechanical connection and electrical conduction between the display panel and the integrated circuit board under a certain temperature, pressure and time. It is an important production process in the display industry.

[0035] The inventor of the present application has noticed that the commonly used hot pressing binding method is to hot press the components to be bound to the display panel to form a display module. During the hot pressing binding process, part of the heat output by the bearing platform and the pressing head will cause the components in the non-hot pressing area of ​​the display panel to fail due to heat, affecting the display function of the display panel.

[0036] The inventors of the present application have discovered that the heat dissipation capacity of the display panel can be improved by providing a heat dissipation component in contact with the display panel, thereby effectively reducing the temperature of the display panel and preventing the components in the non-hot pressing area of ​​the display panel from failing due to heat, thereby effectively improving the preparation yield of the display module.

[0037] In order to solve the problems in the prior art, the embodiments of the present application provide a binding device, a display component, a binding system and a binding method. The binding device provided by the embodiments of the present application is first introduced below.

[0038] Figure 1 A schematic diagram of the structure of a binding device provided in some embodiments of the present application.

[0039] like Figure 1 As shown, the binding device includes a carrying platform 10, a pressing head 20, a heating component 30 and a heat dissipation component 40. The carrying platform 10 is used to carry the display panel 100 and the part to be bound 200, and the carrying platform 10 includes a carrying surface. The pressing head 20 is movably arranged in a manner that it can approach or move away from the carrying surface. The heating component 30 is arranged on at least one of the carrying platform 10 and the pressing head 20, and the heating component 30 is used to heat at least one of the carrying platform 10 and the pressing head 20. The heat dissipation component 40 contacts the display panel 100 during the binding process to reduce the heat of the display panel 100.

[0040] The display panel 100 and the to-be-bound component 200 are stacked and arranged on the carrying surface of the carrying platform 10. Optionally, the display panel 100 is arranged on the carrying surface, and the to-be-bound component 200 is arranged on the side of the display panel 100 away from the carrying surface; or, the to-be-bound component 200 is arranged on the carrying surface, and the display panel 100 is arranged on the side of the to-be-bound component 200 away from the carrying surface.

[0041] The pressing head 20 and the display panel 100 are arranged on the same side of the carrying platform 10. The pressing head 20 can be movable by, but not limited to, pneumatic driving, hydraulic driving, or electric driving. During the binding process, the pressing head 20 applies pressure to at least one of the display panel 100 or the part to be bound 200, so that the part to be bound 200 is bound to the display panel 100.

[0042] Optionally, the heating component 30 may be disposed on the carrier platform 10, or on the pressure head 20, or both the carrier platform 10 and the pressure head 20 may be provided with the heating component 30. The heating component 30 is used to heat the carrier platform 10 and / or the pressure head 20. The heating component 30 may be, but is not limited to, an electric heating wire, a thermistor, or an electric heating tube.

[0043] Exemplarily, the heat dissipation component 40 may be made of, but not limited to, graphene, thermally conductive silicone grease, thermally conductive metal, and other materials. The present application does not limit the specific material of the heat dissipation component 40, and it can be selected according to actual needs. The heat dissipation component 40 is configured to contact the display panel 100. During the hot pressing binding process, the heat dissipation component 40 can conduct the heat on the display panel 100 to the external environment more quickly, thereby reducing the heat of the display panel 100 during the hot pressing binding process.

[0044] Before hot-press binding, the display panel 100 and the part to be bound 200 are first stacked on the carrying surface of the carrying platform 10. During the hot-press binding process, the heating component 30 outputs heat to the carrying platform 10 and / or the pressing head 20. The pressing head 20 moves toward the display panel 100 and the carrying platform 10. The pressing head 20 applies pressure and outputs heat to at least one of the display panel 100 or the part to be bound 200. The display panel 100 and the part to be bound 200 are bound under high temperature and pressure.

[0045] In the above technical solution, the heat dissipation component 40 is arranged to contact the display panel 100 to improve the heat dissipation capacity of the display panel 100. During the hot pressing binding process, the heat dissipation component 40 can absorb the heat of the display panel 100, thereby preventing the performance and structure of the components in the display panel 100 from being deteriorated due to heat, improving the quality of the display module formed after the hot pressing binding, and improving the manufacturing yield of the display module.

[0046] In some embodiments, the heat dissipation component 40 includes a first heat dissipation member 41 , and the first heat dissipation member 41 is disposed on a side of the pressing head 20 facing the display panel 100 .

[0047] Optionally, the display panel 100 and the part to be bound 200 are stacked on the bearing surface of the bearing platform 10, the part to be bound 200 is disposed on the bearing surface, and the display panel 100 is disposed on the side of the part to be bound 200 away from the bearing surface. A first heat sink 41 is disposed on the side of the pressing head 20 facing the display panel 100. The first heat sink 41 can be a film structure made of a thermally conductive material, and the film structure is coated on the side of the pressing head 20 facing the display panel 100; or it can be a sheet structure made of a metal material with good thermal conductivity, and the sheet structure is attached to the side of the pressing head 20 facing the display panel 100.

[0048] During the hot press bonding process, the side of the pressing head 20 facing the display panel 100 contacts the display panel 100 and applies pressure to the display panel 100. Therefore, the first heat sink 41 is disposed on the side of the pressing head 20 facing the display panel 100, and the first heat sink 41 can contact the display panel 100 and absorb the heat of the display panel 100, thereby reducing the risk of thermal degradation of the performance and structure of the components in the display panel 100, improving the quality of the display module formed after hot press bonding, and improving the manufacturing yield of the display module.

[0049] Figure 2 A schematic diagram of another binding device structure provided in some embodiments of the present application.

[0050] like Figure 2 As shown, in some embodiments, a buffer component 50 is disposed on a side of the pressing head 20 facing the display panel 100 , and the buffer component 50 is located between the pressing head 20 and the first heat dissipation member 41 .

[0051] A buffer component 50 is provided on the side of the press head 20 facing the display panel 100. The buffer component 50 is located between the press head 20 and the first heat sink 41, that is, the first heat sink 41 is provided on the side of the buffer component 50 close to the display panel 100. Exemplarily, the buffer component 50 may be made of, but not limited to, polystyrene, polyethylene, polyurethane, polypropylene, and the like. Optionally, the buffer component 50 may be provided in the middle area of ​​the press head 20, or may be covered on the surface of the side of the press head 20 facing the display panel 100. The shape of the buffer component 50 is not limited in this application.

[0052] The buffer component 50 is elastic. When the pressure head 20 applies pressure to the display panel 100 and the part to be bound 200, the buffer component 50 can release a portion of the pressure of the pressure head 20, so that the display panel 100 and the part to be bound 200 are subjected to more uniform pressure. At the same time, it can prevent the display panel 100 and the part to be bound 200 from being damaged by excessive impact force.

[0053] Figure 3A schematic diagram of another binding device structure provided in some embodiments of the present application.

[0054] like Figure 3 As shown, in some embodiments, the heat dissipation component 40 includes a second heat dissipation element 42 , and the second heat dissipation element 42 is disposed on a side of the carrying platform 10 facing the display panel 100 .

[0055] A second heat sink 42 is disposed on the side of the carrying platform 10 facing the display panel 100. For example, the second heat sink 42 may be, but is not limited to, a strip, a rod, a sheet, or other shaped structure. The second heat sink 42 is disposed on the side of the carrying platform 10 facing the display panel 100 and is connected to the display panel 100. The second heat sink 42 can contact the display panel 100 and absorb the heat of the display panel 100.

[0056] During the hot pressing binding process, the heating component 30 outputs heat to the carrying platform 10, and the second heat sink 42 is arranged on the side of the carrying platform 10 facing the display panel 100. The second heat sink 42 can contact the display panel 100 and absorb the heat of the display panel 100, thereby preventing the performance and structure of the components in the display panel 100 from being deteriorated due to heat, improving the quality of the display module formed after hot pressing binding, and improving the preparation yield of the display module.

[0057] In some embodiments, the second heat dissipation element 42 is disposed between the carrying platform 10 and the display panel 100 .

[0058] Optionally, the display panel 100 and the to-be-bound component 200 are stacked and arranged on the bearing surface of the bearing platform 10, the display panel 100 is arranged on the bearing surface, and the to-be-bound component 200 is arranged on the side of the display panel 100 away from the bearing surface. In the embodiment of the present application, exemplarily, the second heat sink 42 can be a film structure made of a thermally conductive material, the film structure is coated on the side surface of the bearing platform 10 facing the display panel 100 and is located between the bearing platform 10 and the display panel 100; or it can be a sheet structure made of a metal material with good thermal conductivity, the sheet structure is attached to the side surface of the bearing platform 10 facing the display panel 100 and is located between the bearing platform 10 and the display panel 100.

[0059] In the above technical solution, the second heat sink 42 is disposed between the carrying platform 10 and the display panel 100 , which can increase the contact area between the second heat sink 42 and the display panel 100 and further improve the heat absorption efficiency of the display panel 100 .

[0060] Based on the binding device provided in the above-mentioned embodiments of the present application, the embodiments of the present application also provide a display component 300, the display component 300 includes a display panel 100, a part to be bound 200 and a heat dissipation component 400, the part to be bound 200 is configured to be bound and connected to the display panel 100 by the binding device provided in any of the above-mentioned embodiments, the heat dissipation component 400 is arranged between the display panel 100 and the part to be bound 200, and the heat dissipation component 400 is in contact with the display panel 100 to reduce the heat applied to the display panel 100 during the binding process.

[0061] Exemplarily, the heat dissipation component 400 may be made of, but not limited to, graphene, thermally conductive silicone grease, thermally conductive metal and other materials. The present application does not limit the specific material of the heat dissipation component 400, and it can be selected according to actual needs. The heat dissipation component 400 is arranged between the display panel 100 and the part to be bound 200 and contacts the display panel 100. During the hot pressing binding process, the heat dissipation component 400 can conduct the heat on the display panel 100 to the external environment faster, thereby reducing the heat of the display panel 100 during the hot pressing binding process.

[0062] In the above technical solution, by setting a heat dissipation component 400 between the display panel 100 and the part to be bound 200, during the hot pressing binding process of the display panel 100 and the part to be bound 200, the heat dissipation component 400 can fully contact with the display panel 100 and absorb the heat of the display panel 100, thereby reducing the risk of thermal degradation of the performance and structure of the devices in the display panel 100, improving the quality of the display module formed after hot pressing binding, and improving the preparation yield of the display module.

[0063] Figure 4 A schematic diagram of a display component structure provided in some embodiments of the present application; Figure 5 A schematic diagram of the coordination structure of a display component and a binding device provided in some embodiments of the present application.

[0064] like Figure 4 and Figure 5 As shown, in some embodiments, the display component 300 also includes a conductive adhesive layer 60, which is arranged between the display panel 100 and the part to be bound 200, and the conductive adhesive layer 60 is used to bond the display panel 100 and the part to be bound 200, and the heat dissipation component 400 includes a third heat dissipation member 43, and the third heat dissipation member 43 is evenly distributed in the conductive adhesive layer 60.

[0065] The main material of the conductive adhesive layer 60 is an organic substance with conductive properties. The conductive adhesive layer 60 can not only form a high-strength connection between the display panel 100 and the to-be-bound component 200, but also enhance the conductivity between the display panel 100 and the to-be-bound component 200. The to-be-bound component 200 can be firmly connected to the display panel 100 through the conductive adhesive layer 60, thereby effectively preventing the to-be-bound component 200 from falling off the display panel 100.

[0066] Exemplarily, the conductive adhesive layer 60 may be made of anisotropic conductive film (ACF), which is characterized in that electrical conduction is achieved only in the direction where pressure is applied, and electrical conduction is not achieved in other directions where no pressure is applied.

[0067] Optionally, the material of the third heat sink 43 can be a fluid or granular heat dissipation material that can flow and diffuse with the adhesive during the pressing process. The fluid heat dissipation material can be an insulating thermal conductive adhesive, and the granular heat dissipation material can be a metal granular thermal conductive filler or a non-metallic granular filler with good thermal conductivity. Exemplarily, the insulating thermal conductive adhesive can be selected from one or more mixtures of adhesives, silicones, thermal conductive pastes, thermal conductive filling adhesives, etc.; the metal granular thermal conductive filler can be selected from one or more mixtures of silver powder, copper powder, aluminum powder, iron powder, zinc powder, gold powder, etc.; the non-metallic granular filler with good thermal conductivity can be selected from one or more mixtures of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, high thermal conductivity graphite carbon powder, ceramic powder, etc.

[0068] The third heat sink 43 can be disposed on the surface of the conductive adhesive layer 60 close to the display panel 100, or can be disposed inside the conductive adhesive layer 60. Adding the third heat sink 43 to the conductive adhesive layer 60 enables the conductive adhesive layer 60 to not only play a connecting and conducting role, but also a heat dissipating role.

[0069] Before the display panel 100 and the part to be bound 200 are bound, anisotropic conductive adhesive is applied on the display panel 100 to form a conductive adhesive layer 60, and then the part to be bound 200 is attached to the conductive adhesive layer 60. During the binding process of the display panel 100 and the part to be bound 200, the binding device applies pressure to the display panel 100 and the part to be bound 200 so that the display panel 100 and the part to be bound 200 are firmly connected through the conductive adhesive layer 60 to form a display module.

[0070] In the above technical solution, the third heat sink 43 is evenly distributed in the conductive adhesive layer 60, the conductive adhesive layer 60 can contact the display panel 100, and absorb the heat of the display panel 100 through the third heat sink 43, so as to avoid the performance and structure of the devices in the display panel 100 being deteriorated due to heat, improve the quality of the display module formed after hot pressing and improve the preparation yield of the display module.

[0071] In some embodiments, the third heat sink 43 and the conductive adhesive layer 60 are an integrally formed structure.

[0072] Specifically, in the process of using conductive adhesive to make the conductive adhesive layer 60, the third heat sink 43 is added to the conductive adhesive to form the conductive adhesive layer 60 as an integral part, so that the third heat sink 43 and the conductive adhesive layer 60 form an integrated structure. On the one hand, it is convenient to apply the conductive adhesive layer 60 containing the third heat sink 43 of this embodiment to the binding process of the existing display module without making too many changes to the binding process of the existing display module; on the other hand, the integrated structure between the third heat sink 43 and the conductive adhesive layer 60 has a simple manufacturing process, and there is no need to use other process means to set the third heat sink 43 on the conductive adhesive layer 60.

[0073] Figure 6 Another schematic diagram of a display assembly structure provided in some embodiments of the present application is shown in FIG. Figure 7 for Figure 6 A top view of the structure. Figure 8 A schematic diagram of another display component structure provided in some embodiments of the present application is shown. Fig. 9 for Figure 8 A top view of the structure. Fig.10 A schematic diagram of another display component and binding device coordination structure provided in some embodiments of the present application.

[0074] like Figures 6 to 10 As shown, in some embodiments, the display panel 100 includes a binding area 110 and a heat dissipation area 120, the part to be bound 200 includes a connecting portion 210 corresponding to the binding area 110, and the connecting portion 210 is connected to the binding area 110 so that the part to be bound 200 is bound to the display panel 100, and the heat dissipation component 400 includes a fourth heat dissipation member 44, and the fourth heat dissipation member 44 is arranged in the heat dissipation area 120.

[0075] Optionally, the binding area 110 of the display panel 100 corresponds to the connection portion 210 of the member to be bound 200. Further, the binding area 110 of the display panel 100 and the connection portion 210 of the member to be bound 200 have the same shape and size; or, the binding area 110 of the display panel 100 and the connection portion 210 of the member to be bound 200 have the same shape, and the area of ​​the binding area 110 of the display panel 100 is slightly larger than the area of ​​the connection portion 210 of the member to be bound 200, so as to better fully connect the connection portion 210 of the member to be bound 200 with the binding area 110 of the display panel 100.

[0076] The heat dissipation area 120 can be understood as the area on the display panel 100 except the binding area 110. The heat dissipation area 120 can be distributed around the binding area 110, or around the connection between the to-be-bound component 200 and the display panel 100. The heat dissipation area 120 is an area divided for the arrangement of the fourth heat dissipation element 44. In the embodiment of the present application, the specific shape and distribution position of the heat dissipation area 120 are not limited, and can be arranged according to actual conditions, as long as it does not conflict with other device areas on the display panel 100.

[0077] For example, the fourth heat sink 44 can be a film structure made of a thermally conductive material, or a sheet structure made of a metal material with good thermal conductivity. The fourth heat sink 44 is disposed in the heat dissipation area 120, and can conduct the heat of the display panel 100 to the external environment, while not affecting the connection between the to-be-bound member 200 and the binding area 110 of the display panel 100.

[0078] By providing the fourth heat sink 44 in the heat dissipation area 120 of the display panel 100, the display panel 100 can better absorb the heat of the display panel 100, avoid the performance and structure of the components in the display panel 100 from being deteriorated by heat, improve the quality of the display module formed after hot pressing and binding, and improve the manufacturing yield of the display module. At the same time, it will not affect the connection between the to-be-bound component 200 and the binding area 110 of the display panel 100.

[0079] In some embodiments, the heat dissipation area 120 is formed by a surface of the display panel 100 that is close to the to-be-bound component 200 and is recessed in a direction away from the to-be-bound component 200 .

[0080] The heat dissipation zone 120 is recessed in a direction away from the part to be bound 200 and is formed on a side surface of the display panel 100 close to the part to be bound 200 , that is, the heat dissipation zone 120 forms a recess with an accommodating space on a side surface of the display panel 100 close to the part to be bound 200 , and the accommodating space of the recess can be used to accommodate the fourth heat dissipation member 44 .

[0081] In the above technical solution, the fourth heat sink 44 is accommodated in the accommodation space of the heat dissipation zone 120, which can reduce the space occupied by the fourth heat sink 44 on the display panel 100, thereby reducing the thickness of the display panel 100 and effectively improving the space utilization of the display panel 100.

[0082] In some embodiments, along the thickness direction of the display panel 100 , a side of the fourth heat dissipation member 44 close to the member to be bound 200 is farther away from the member to be bound 200 than a side of the binding region 110 close to the member to be bound 200 .

[0083] Optionally, along the thickness direction of the display panel 100, the side of the fourth heat dissipation member 44 close to the part to be bound 200 is farther away from the part to be bound 200 relative to the side of the binding area 110 close to the part to be bound 200, that is, the height of the fourth heat dissipation member 44 along the thickness direction of the display panel 100 is lower than the height of the binding area 110.

[0084] During the hot-pressing binding of the display panel 100 and the member to be bound 200, the connection portion 210 of the member to be bound 200 will not touch the fourth heat sink 44 when connected to the binding area 110 of the display panel 100, thereby reducing the influence of the fourth heat sink 44 on the connection between the display panel 100 and the member to be bound 200. At the same time, the above technical solution can further reduce the thickness of the display panel 100, further improving the space utilization of the display panel 100.

[0085] In some embodiments, the fourth heat dissipation element 44 and the display panel 100 are integrally formed.

[0086] Specifically, during the manufacturing process of the display panel 100, the fourth heat sink 44 is integrally formed with the display panel 100. On the one hand, it is convenient to apply the display panel 100 containing the fourth heat sink 44 of this embodiment to the binding process of the existing display module without making too many changes to the binding process of the existing display module; on the other hand, the manufacturing process of the fourth heat sink 44 and the display panel 100 being an integral structure is simple, and it is not necessary to use other process means to set the fourth heat sink 44 on the display panel 100. In addition, the connection strength of the fourth heat sink 44 and the display panel 100 being an integral structure is high, and the fourth heat sink 44 is not easy to fall off from the display panel 100.

[0087] Based on the binding device and display component provided in the above-mentioned embodiments of the present application, the present application provides a binding system, which includes the binding device provided in any of the above-mentioned embodiments, and the display component provided in any of the above-mentioned embodiments, wherein the display panel and the parts to be bound are stacked on a carrying platform.

[0088] Specifically, the binding system includes a binding device, a display panel 100 and a to-be-bound part 200. The display panel 100 and the to-be-bound part 200 are stacked and arranged on a carrying platform 10. Optionally, the display panel 100 is arranged on the carrying platform 10, and the to-be-bound part 200 is arranged on a side of the display panel 100 away from the carrying surface; or, the to-be-bound part 200 is arranged on the carrying platform 10, and the display panel 100 is arranged on a side of the to-be-bound part 200 away from the carrying surface.

[0089] During the hot-pressing binding process, the heating component 30 outputs heat to the carrying platform 10 and / or the pressing head 20, and the pressing head 20 moves toward the display panel 100 and the carrying platform 10. The pressing head 20 applies pressure and outputs heat to at least one of the display panel 100 or the part to be bound 200, and the display panel 100 and the part to be bound 200 are bound under high temperature and pressure.

[0090] In the above technical solution, during the hot pressing binding process of the display panel 100 and the part to be bound 200, the heat dissipation component 40 and / or the heat dissipation member 400 simultaneously absorbs the heat of the display panel 100, which can further reduce the heat exposure of the display panel 100, further improve the quality of the display module formed after the hot pressing binding, and further improve the preparation yield of the display module.

[0091] It can be understood that the binding system of the embodiment of the present application can correspond to the binding device provided in the embodiment of the present application. The specific details of the binding device can refer to the description of the corresponding parts of the binding device described in the above embodiment of the present application. For the sake of brevity, it will not be repeated here.

[0092] Based on the binding system provided by the above-mentioned embodiment of the present application, the embodiment of the present application also provides a binding method, which can be applied to the binding system described in the embodiment of the present application, and the binding method includes: providing a display panel 100 and a part to be bound 200; stacking the display panel 100 and the part to be bound 200 on a carrying platform 10; controlling the pressing head 20 to hot-press the display panel 100 and at least one of the part to be bound 200, so that the part to be bound 200 is bound to the display panel 100.

[0093] In the above technical solution, during the process of hot pressing binding the display panel 100 and the part to be bound 200, the heat dissipation component 40 is in contact with the display panel 100. The heat dissipation component 40 can absorb the heat of the display panel 100, thereby reducing the risk of thermal degradation of the performance and structure of the devices in the display panel 100, improving the quality of the display module formed after hot pressing binding, and improving the preparation yield of the display module.

[0094] It can be understood that the binding method of the embodiment of the present application can correspond to the binding device provided in the embodiment of the present application. The specific details of the binding device can refer to the description of the corresponding parts of the binding device described in the above embodiment of the present application. For the sake of brevity, it will not be repeated here.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A binding device for binding a display panel with a part to be bound, characterized in that: The binding device comprises: A carrying platform, used for carrying the display panel and the parts to be bound, the carrying platform comprising a carrying surface; a pressing head, the pressing head being movably arranged so as to be able to approach or move away from the bearing surface; A heating component is provided on the pressing head, and the heating component is used to heat the pressing head; a heat dissipation component, contacting the display panel during the binding process to reduce heat exposure of the display panel; The pressing head is arranged opposite to the bearing surface, the heat dissipation component includes a second heat dissipation member, the second heat dissipation member is used to be arranged between the bearing platform and the display panel, and the part to be bound is used to be arranged on the side of the display panel facing the pressing head.

2. The binding device according to claim 1, characterized in that The heat dissipation component includes a first heat dissipation element, which is arranged on a side of the pressure head facing the display panel.

3. The binding device according to claim 2, characterized in that: A buffer component is provided on a side of the pressing head facing the display panel, and the buffer component is located between the pressing head and the first heat dissipation element.

4. A display component, characterized in that: include: Display panel; a component to be bound, configured to be bound and connected to the display panel using the binding device according to any one of claims 1 to 3; A heat dissipation component is provided between the display panel and the to-be-bound component, and the heat dissipation component contacts the display panel to reduce heat exposure of the display panel during the binding process.

5. The display assembly according to claim 4, wherein: The display assembly also includes a conductive adhesive layer, which is arranged between the display panel and the part to be bound. The conductive adhesive layer is used to bond the display panel and the part to be bound. The heat dissipation component includes a third heat dissipation member, and the third heat dissipation member is evenly distributed in the conductive adhesive layer.

6. The display assembly according to claim 5, characterized in that The third heat sink and the conductive adhesive layer are integrally formed.

7. The display assembly according to claim 4, wherein: The display panel includes a binding area and a heat dissipation area. The part to be bound includes a connecting portion corresponding to the binding area. The connecting portion is connected to the binding area so that the part to be bound is bound to the display panel. The heat dissipation component includes a fourth heat dissipation member, which is arranged in the heat dissipation area.

8. The display assembly according to claim 7, wherein: The heat dissipation area is formed by a surface of the display panel on one side close to the to-be-bound component being recessed in a direction away from the to-be-bound component.

9. The display assembly according to claim 8, wherein: Along the thickness direction of the display panel, a side of the fourth heat dissipation member close to the member to be bound is farther away from the member to be bound than a side of the binding region close to the member to be bound.

10. The display assembly according to claim 9, wherein: The fourth heat dissipation element and the display panel are integrally formed.

11. A binding system, characterized in that: include: The binding device according to any one of claims 1 to 3; And the display assembly according to any one of claims 4 to 10; Wherein, the display panel and the components to be bound are stacked on the carrying platform.

12. A binding method, applied to the binding system according to claim 11, the method comprising: Provide display panels and parts to be bound; The display panel and the components to be bound are stacked on a carrying platform; The pressing head is controlled to heat-press at least one of the display panel and the component to be bound, so that the component to be bound is bound to the display panel.

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