Measurement method for semiconductor wafer teaching using a measuring instrument

Abstract

The present invention relates to a measurement method for semiconductor wafer teaching using a measuring instrument, that is, in a semiconductor production line, if a manipulation arm for extracting a wafer on a loading table operating in a state where a semiconductor wafer box is installed is damaged or fails or an error occurs, or if preventive maintenance (the operation of stopping the equipment before a sudden failure occurs and inspecting and repairing it in advance) and other pre-operation tests of the normal manufacturing process are required, re-teaching is performed.

Description

Technical Field

[0001] The present invention relates to a measurement method for semiconductor wafer teaching using a measuring instrument, that is, in a semiconductor production line, if an operating arm (index arm) for extracting a wafer (wafer) on a loading table operating in a state where a semiconductor wafer box is installed is damaged or fails or an error occurs, or if preventive maintenance (preventive maintenance, an operation behavior of stopping the equipment before a sudden failure occurs and inspecting and repairing it in advance) and other normal manufacturing process pre-operation tests are required, then teaching is re-performed. In more detail, the present invention relates to the following measurement method for semiconductor wafer teaching using a measuring instrument, that is, when a teaching operation is performed in order to reset manufacturing equipment such as an operating arm, the following operating relationship between the operating arm and the wafer can be conveniently and accurately confirmed during teaching, and the position measurement and calibration of the operating arm can be accurately and conveniently implemented. Not only that, it can also conveniently confirm whether the operating arm and the wafer are located in the correct clamping position and whether the wafer can be accurately inserted, installed or extracted by the operating arm.

[0002] In other words, the present invention relates to a measurement method for semiconductor wafer teaching using a measuring instrument, namely, in a semiconductor production line, when a process stops due to damage, failure, error, etc. of a manipulation arm and equipment needs to be set up for restarting the process, it is pre-confirmed, checked and calibrated whether the manipulation arm can accurately clamp the wafer from a semiconductor wafer box (hereinafter referred to as the "box") to extract and install it, thereby setting up the equipment for the manipulation arm. Background Art

[0003] Typically, in the semiconductor manufacturing process, when equipment such as a manipulation arm that inserts or extracts semiconductor wafers into or from a box that stores and installs multiple wafers (i.e., Front Opening Unified Pod, also called "FOUP") is damaged, malfunctions, or errors occur, the manufacturing process is stopped and the equipment is replaced or repaired. In the past, in order to pre-check whether the manipulation arm can accurately extract or insert the installed wafers from the box, teaching is performed using the box.

[0004] As a column, in the appendix of Korean Patent Gazette Grant No. 10-0293906 Figure 1 In the figure, the box is labeled as a "resin sheet storage container".

[0005] However, the box itself is used in the semiconductor manufacturing production line to supply and transfer semiconductor wafers after they are stored and installed. When such a box is used for teaching, it is difficult to clearly confirm whether the operating arm accurately clamps the wafer and performs insertion, installation or extraction normally during the teaching operation, or it is difficult to clearly confirm whether the operating relationship between the operating arm and the wafer is accurate. It is inconvenient and the operability is deteriorated.

[0006] That is, it is difficult and inconvenient to precisely measure and calibrate the height, straightness, level, center, inclination, and position of the manipulator arm, so it may be necessary to re-teach when the process is running after the equipment is set up.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 0001: Korean Patent Gazette No. 10-0293906 (published on November 22, 2001) Summary of the invention

[0010] Therefore, the present invention is used to solve the above-mentioned problems, and the purpose of the present invention is to provide a measuring instrument for teaching semiconductor wafers, that is, when teaching operations are performed in order to re-set manufacturing equipment such as an operating arm, the following operating relationship between the operating arm and the wafer can be conveniently and accurately confirmed during teaching, and the position measurement and calibration of the operating arm can be accurately and conveniently implemented. Not only that, it is also possible to accurately and conveniently confirm through automatic detection sensors whether the operating arm and the wafer are in the correct clamping position and whether the wafer can be accurately inserted, installed or extracted by the operating arm.

[0011] As an embodiment for realizing the above-mentioned purpose of the present invention, the measuring instrument for semiconductor wafer teaching of the present invention comprises: a support shaft, which is vertically arranged on both sides on a support plate, and has a plurality of support slots (Slots) for inserting and installing semiconductor wafers formed at the upper and lower parts; a stopper shaft, which is vertically arranged on both sides of the rear of the above-mentioned support shaft, and is used to fix the semiconductor wafer in an accurate position; and a frame top plate, which is fixed to the upper end parts of the above-mentioned support shaft and the stopper shaft, and the support slot of the above-mentioned support shaft is formed by a shelf shoulder, and the above-mentioned shelf shoulder is formed with an inclined part at the entrance, and on the shelf shoulder, a support shoulder for installing the semiconductor wafer is formed by protruding to both sides, and a support shoulder is formed on the above-mentioned stopper shaft to install the semiconductor wafer on the same horizontal line as the above-mentioned support shoulder, and on the above-mentioned A position measuring device is arranged on the front side of the bracket shaft, and the position measuring device is fixed with guide rails on both sides, and a measuring fixed block with a stopper is inserted into the guide rail in a manner of guiding through a rail block, and a measuring plate marked with a position scale is arranged on the measuring fixed block in a manner of being rotatable through a hinge shaft, and magnets with different polarities are respectively fixed to the stopper and the measuring plate, and a scale indicating tip is fixed to the end of the measuring fixed block 10, and scale plates are arranged in front of the scale indicating tips on both sides, and a level measuring grade meter for measuring the horizontal state is arranged in front of the support plate, and a hole block for fixing the support plate to a stake during teaching is arranged at a specified position of the support plate, and handles for carrying or moving during teaching are arranged on both sides of the support plate.

[0012] A control box with a built-in central processing unit is fixedly installed between the above-mentioned bracket shafts on both sides. The above-mentioned central processing unit is configured with programs for executing detection functions and measurement functions. A touch display panel is configured on the rear surface of the above-mentioned control box, which can be viewed by displaying measured values ​​and operated by touch. The first laser sensor, the second laser sensor, the third laser sensor and the fourth laser sensor are respectively configured on both sides of the lower part of the above-mentioned bracket shafts on both sides. The first laser sensor and the second laser sensor are used to measure the left and right deviations of the semiconductor wafer, and the third laser sensor and the fourth laser sensor are used to measure the left and right inclinations of the semiconductor wafer. The fifth laser sensor, the sixth laser sensor and the seventh laser sensor are configured on both sides of the frame top plate configured on the upper side of the above-mentioned bracket shafts on both sides. Laser sensor and the eighth laser sensor, the fifth laser sensor and the sixth laser sensor are used to measure the left and right deviation of the semiconductor wafer, the seventh laser sensor and the eighth laser sensor are used to measure the left and right inclination of the semiconductor wafer, the ninth laser sensor and the tenth laser sensor are arranged at the rear lower center of the above-mentioned support axis on both sides, the ninth laser sensor is used to measure the depth of the semiconductor wafer, the tenth laser sensor is used to measure the front and rear inclination of the semiconductor wafer, the eleventh laser sensor and the twelfth laser sensor are arranged at the center of the frame top plate on the upper side of the above-mentioned support axis on both sides, the eleventh laser sensor is used to measure the depth of the semiconductor wafer, and the twelfth laser sensor is used to measure the front and rear inclination of the semiconductor wafer.

[0013] As another embodiment of the present invention to achieve the above-mentioned purpose, the measuring method for semiconductor wafer teaching using a measuring instrument of the present invention comprises: a first step of turning on (ON) by operating a power switch of the measuring instrument; a second step of automatically starting a window (Window) and automatically starting a measuring program as the measuring instrument is turned on by operating the power switch; a third step of automatically initializing as the measuring program is working; a fourth step of completing the initialization by automatically initializing according to the working of the measuring program; a fifth step of starting the placement detection of the semiconductor wafer when the semiconductor wafer starts to enter the bracket slot in the step of completing the initialization, measuring the left and right deviations of the semiconductor wafer by the first laser sensor and the second laser sensor on the lower side and the fifth laser sensor and the sixth laser sensor on the upper side; if the deviations are beyond the deviation range, the semiconductor wafer cannot be placed and the initialization step is returned; if the deviations are within the deviation range, the semiconductor wafer is placed, thereby measuring the left and right deviations; a sixth step of measuring the left and right deviations of the semiconductor wafer by the third laser sensor on the lower side if the deviations are within the deviation range. The first laser sensor and the second laser sensor on the lower side and the fifth laser sensor and the sixth laser sensor on the upper side and the third laser sensor and the fourth laser sensor on the lower side and the seventh laser sensor and the eighth laser sensor on the upper side measure the left and right inclination of the semiconductor wafer, and measure the height after entering through the sixth step of the semiconductor wafer starting to enter, and perform full entry if the measured value does not exceed the deviation range; and the eighth step, if the semiconductor wafer is completely completed, perform depth measurement through the ninth laser sensor on the lower side of the rear part and the eleventh laser sensor on the upper side, and perform front and rear inclination measurement of the semiconductor wafer through the tenth laser sensor and the third laser sensor and the fourth laser sensor on the lower side, and perform front and rear inclination measurement of the semiconductor wafer through the twelfth laser sensor and the seventh laser sensor and the eighth laser sensor on the upper side, and perform front and rear inclination measurement of the semiconductor wafer through the twelfth laser sensor and the seventh laser sensor and the eighth laser sensor on the upper side, and if the measured value does not exceed the deviation range, end the measurement.

[0014] The present invention as described above can confirm the measured values ​​of left-right deviation, left-right inclination, depth, front-back inclination, and height of the semiconductor wafer measured by the laser sensor by outputting them on the touch display panel. It can also confirm the measurement values ​​of the straightness, flatness, left-right deviation, entry height, etc. of the semiconductor wafer, thereby completing the test through all measurements and calibrations.

[0015] That is, when teaching operations are performed in order to re-set manufacturing equipment such as a manipulator arm, the operational relationship between the manipulator arm and the wafer can be easily and accurately confirmed during teaching, and precise measurements of the straightness, level, height, left and right eccentricity, inclination and position of the manipulator arm and the wafer can be accurately and conveniently performed. Not only that, calibration can be easily performed through such measurements, and it can be easily confirmed whether the manipulator arm and the wafer are in the correct clamping position and whether the wafer can be accurately inserted, installed or extracted by the manipulator arm.

[0016] Moreover, all the measured information can be stored in the central processor in the control box and can be transmitted through an interface to an external terminal such as a personal computer (PC) or a smart phone based on wired or wireless communication for management and storage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a perspective view showing the structure of the "measuring apparatus for semiconductor wafer teaching" according to the present invention.

[0018] Figure 2 This is an overall front view of the "measuring instrument for semiconductor wafer teaching" of the present invention.

[0019] Figure 3 It is an overall top view of the "measuring instrument for semiconductor wafer teaching" of the present invention.

[0020] Figure 4 This is a top view of the "measuring instrument for semiconductor wafer teaching" of the present invention, in which the position of the manipulator arm and the wafer is measured by inserting the manipulator arm into the holder slot in a state where the manipulator arm carries the wafer.

[0021] Figure 5 This is an overall side view of the "measuring instrument for semiconductor wafer teaching" of the present invention, which is a side view of a manipulation arm loaded with a wafer and inserted into a support slot to measure the position of the manipulation arm and the wafer.

[0022] Figure 6 It is an overall rear view of the "measuring instrument for semiconductor wafer teaching" of the present invention.

[0023] Figure 7 This is an enlarged perspective view of a partially cutout position measuring device in the "measuring apparatus for semiconductor wafer teaching" of the present invention.

[0024] Figure 8 A partially cutaway enlarged view showing a state in which a wafer is inserted into a holder groove mounted on a holder shaft and a stopper groove of a stopper shaft in the "measuring apparatus for teaching semiconductor wafers" of the present invention.

[0025] Fig. 9This is a schematic diagram showing a state in which a semiconductor wafer is inserted into the entrance of a holder slot and the left-right deviation of the wafer is measured by a laser sensor in the "measuring instrument for semiconductor wafer teaching" of the present invention as viewed from a plane.

[0026] Fig.10 This is a schematic diagram of a state in which a semiconductor wafer is inserted into the entrance of a holder groove and the left-right deviation of the wafer is measured by a laser sensor in the "measuring instrument for semiconductor wafer teaching" of the present invention as seen from the side.

[0027] Fig.11 This is a schematic diagram of a state in which a semiconductor wafer is placed in a holder slot and the left-right deviation and left-right inclination of the wafer are measured by a laser sensor in the "measuring instrument for semiconductor wafer teaching" of the present invention as viewed from a plane.

[0028] Fig.12 This is a schematic diagram of a state in which a semiconductor wafer is placed in a holder groove and the left-right deviation and left-right inclination of the wafer are measured by a laser sensor in the "measuring instrument for semiconductor wafer teaching" of the present invention as seen from the side.

[0029] Fig.13 This is a schematic diagram of a state in which a semiconductor wafer is completely inserted into a holder groove and the depth and front-back tilt of the wafer are measured by a laser sensor in the "measuring instrument for semiconductor wafer teaching" of the present invention as viewed from a plane.

[0030] Fig.14 This is a schematic diagram of a state in which a semiconductor wafer is completely inserted into a holder groove and the depth and front-back tilt of the wafer are measured by a laser sensor in the "measuring instrument for semiconductor wafer teaching" of the present invention as viewed from the side.

[0031] Fig.15 The flowchart is a flowchart showing a measurement method for semiconductor wafer teaching using the “measurement apparatus for semiconductor wafer teaching” of the present invention. DETAILED DESCRIPTION

[0032] Hereinafter, a detailed description will be given based on the accompanying drawings showing preferred embodiments.

[0033] In the process of describing the present invention, the terms in the present specification are defined in consideration of the functions or forms of the present invention, and should not be understood as limiting the technical structural elements of the present invention.

[0034] The present invention can be subjected to various changes and can have various embodiments, so examples (aspects) (or embodiments) will be described in detail herein. However, this does not limit the present invention to the specific disclosed embodiments, and it should be understood that all changes, equivalent technical solutions or alternative technical solutions within the scope of the concept and technology of the present invention are included.

[0035] Moreover, to facilitate understanding, etc., the size or thickness of the structural elements in each drawing may be exaggerated (or thicker) or reduced (or thinner), or the structural elements in the drawings may be simplified, but this should not be construed as limiting the scope of protection of the present invention.

[0036] The terms used in this specification are only used to describe specific examples (embodiments) (or embodiments) and do not limit the present invention.

[0037] Common terms defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the relevant technology, and should not be interpreted as idealized or overly formal meanings unless explicitly defined in this application.

[0038] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings.

[0039] As an embodiment for realizing the purpose of the present invention, the following first refers to Figures 1 to 8 Provide explanation.

[0040] The present invention includes: a support shaft 3, which is vertically arranged on both sides of a support plate 1, and has a plurality of support grooves 2 formed at the upper and lower parts for inserting and installing semiconductor wafers W; a stopper shaft 4, which is vertically arranged on both sides of the rear of the above-mentioned support shaft 3, and is used to fix the semiconductor wafer W in an accurate position; and a frame top plate 7, which is fixed to the upper end parts of the above-mentioned support shaft 3 and the stopper shaft 4.

[0041] The support groove 2 of the support shaft 3 is formed by a support shoulder 2a, and the support shoulder 2a is formed with an inclined portion 2b at the entrance. On the support shoulder 2a, support shoulders 2c for mounting the semiconductor wafer W are formed to protrude to both sides, and a support shoulder 4b is formed on the stopper shaft 4 to mount the semiconductor wafer W on the same horizontal line as the support shoulder 2c (refer to Figure 8 ).

[0042] A position measuring device P is provided at the front side of the bracket shaft 3. The position measuring device P is provided with guide rails 8 fixed on both sides. A measuring fixed block 10 having a stopper 9 is inserted into the guide rail 8 in a manner guided by a rail block 11 (see Figure 2 and Figure 7 ).

[0043] A measuring plate 13 marked with position scale 12 is arranged on the measuring fixed block 10 in a manner that it can rotate through a hinge shaft 14, magnets 15 and 15a with different polarities are fixed to the stopper 9 and the measuring plate 13 respectively, and a scale indicating tip 16 is fixed to the end of the measuring fixed block 10.

[0044] A scale plate 17 is arranged in front of the above-mentioned scale indicating tip 16 on both sides, a level measurement level meter 18 for measuring the horizontal state is set in front of the above-mentioned support plate 1, a hole block 20 for fixing the support plate 1 to a stake (not shown) during teaching is set at a specified position of the support plate 1, and handles 21 for carrying or moving during teaching are set on both sides of the above-mentioned support plate 1.

[0045] A control box C with a built-in central processing unit is fixedly installed between the above-mentioned bracket shafts 3 on both sides. The above-mentioned central processing unit is configured with programs for executing detection functions and measurement functions. A touch display panel 22 is configured on the rear surface of the above-mentioned control box C, which can be viewed by displaying measured values ​​and operated by touch.

[0046] On both sides of the lower part of the above-mentioned support shaft 3 on both sides, the first laser sensor 23 and the second laser sensor 23a and the third laser sensor 24 and the fourth laser sensor 24a are respectively arranged. The first laser sensor 23 and the second laser sensor 23a are used to measure the left and right deviation of the semiconductor wafer W, and the third laser sensor 24 and the fourth laser sensor 24a are used to measure the left and right inclination of the semiconductor wafer W.

[0047] On both sides of the frame top plate 7 of the upper side of the above-mentioned support shaft 3 arranged on both sides, the fifth laser sensor 25 and the sixth laser sensor 25a and the seventh laser sensor 26 and the eighth laser sensor 26a are arranged. The fifth laser sensor 25 and the sixth laser sensor 25a are used to measure the left-right deviation of the semiconductor wafer, and the seventh laser sensor 26 and the eighth laser sensor 26a are used to measure the left-right inclination of the semiconductor wafer.

[0048] A ninth laser sensor 27 and a tenth laser sensor 28 are arranged at the rear lower center portion of the above-mentioned support shaft 3 on both sides, the above-mentioned ninth laser sensor 27 is used to measure the depth of the semiconductor wafer, and the above-mentioned tenth laser sensor 28 is used to measure the front and rear inclination of the semiconductor wafer. An eleventh laser sensor 29 and a twelfth laser sensor 30 are arranged at the center portion of the frame top plate 7 arranged at the upper side portion of the above-mentioned support shaft 3 on both sides, the above-mentioned eleventh laser sensor 29 is used to measure the depth of the semiconductor wafer, and the above-mentioned twelfth laser sensor 30 is used to measure the front and rear inclination of the semiconductor wafer W.

[0049] In the present invention as described above, the semiconductor wafer casing is first mounted on a reference plate of a loading platform for operation, and the orifice block 20 disposed on the bottom surface of the support plate 1 is set on the pegs provided on the reference plate.

[0050] In this case, the measuring instrument of the present invention is positioned on the above-mentioned loading platform, and the robot equipped with the manipulator arm R is also moved to the position where teaching is to be performed.

[0051] In this case, the teaching position (for example, XYZ space coordinates) of the robot is stored, and the insertion mounting or extraction test of the wafer is performed in the measuring instrument of the present invention to store the teaching data.

[0052] Then, when the test is finished, the measuring instrument for teaching of the present invention is separated from the reference plate of the loading stage.

[0053] Next, a method for performing an insertion mounting or extraction test of a wafer using a laser sensor and a window and a measurement program provided in the above-mentioned measuring instrument for teaching of the present invention will be described.

[0054] The wafer W is mounted on the manipulator arm R connected to the robot, and then inserted into the support groove 2 formed on the inner side of the support shaft 3 on both sides (refer to Figure 5 , Fig. 9 and Fig.10 ).

[0055] The wafer W may be inserted into both the lower and upper sides at the same time, or may be selectively inserted into only the lower side or the upper side, respectively.

[0056] As described above, if the wafer W is inserted into the support groove 2 by the operating arm R, the edge of the wafer W will be inserted and located at the entrance of the support groove 2. In this case, the left and right deviations of the semiconductor wafer W are measured by the first laser sensor 23 and the second laser sensor 23a on the lower side and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side.

[0057] That is, if the edge of the wafer W is inserted into and located at the entrance of the bracket groove 2, the first laser sensor 23 and the second laser sensor 23a on the lower side and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side will irradiate the laser and detect. If the measured value exceeds the left and right deviation range of the semiconductor wafer, the semiconductor wafer cannot be placed. If it does not exceed the left and right deviation range, it can enter.

[0058] For example, if the left-right deviation of the semiconductor wafer is greater than ±0.5 mm, the semiconductor wafer is re-entered through adjustment teaching. If the left-right deviation of the semiconductor wafer is less than ±0.5 mm, it is entered without the need for teaching.

[0059] The measured left-right deviation value of the semiconductor wafer can be confirmed by being output to the touch display panel C arranged at the rear.

[0060] like Fig.11 and Fig.12As shown, if the above-mentioned semiconductor wafer is able to enter, the left and right deviations of the semiconductor wafer are measured by the first laser sensor 23 and the second laser sensor 23a on the lower side, and the height is measured by the third laser sensor 24 and the fourth laser sensor 24a to measure the left and right inclinations (i.e., the height of the left or right side of the semiconductor wafer).

[0061] Furthermore, the left-right deviation of the semiconductor wafer is measured by the fifth laser sensor 25 and the sixth laser sensor 25 a on the upper side, and the left-right inclination is measured by the seventh laser sensor 26 and the eighth laser sensor 26 a.

[0062] As described above, the left-right deviation, straightness, and flatness of the inserted and entered semiconductor wafer are measured.

[0063] As described above, if the measured values ​​of the left-right deviation, straightness and flatness of the semiconductor wafer do not exceed the deviation range, the entry will continue. If the measured values ​​exceed the deviation range, the semiconductor wafer installed on the operating arm R connected to the robot is taught to be reinserted, entered and measured.

[0064] like Fig.13 and Fig.14 As shown, the semiconductor wafer that does not exceed the above-mentioned deviation range achieves full entry. If full entry is achieved, the ninth laser sensor 27 on the rear lower side of the support plate 1 measures the depth of the semiconductor wafer W to measure whether full entry is achieved, and the tenth laser sensor 28 and the above-mentioned third laser sensor 24 and fourth laser sensor 24a measure the front and rear inclination of the semiconductor wafer (that is, the height of the front or rear side of the semiconductor wafer).

[0065] Moreover, the depth of the semiconductor wafer W is measured by the eleventh laser sensor 29 arranged at the rear of the frame top plate 7 set on the upper side of the above-mentioned support shaft 3 on both sides, thereby measuring whether complete entry is achieved, and the front and rear inclination of the semiconductor wafer is measured by the twelfth laser sensor 30 and the above-mentioned seventh laser sensor 26 and eighth laser sensor 26a.

[0066] As described above, confirmation can be achieved by outputting measured values ​​of the left-right deviation, left-right inclination, depth, front-back inclination, and height of the semiconductor wafer on the touch display panel 22. The measurement values ​​of the straightness, flatness, left-right deviation, entry height, etc. of the semiconductor wafer can also be confirmed. The test is completed through all measurements and calibrations. If it is determined that the operating arm is operating normally during the process, the teaching performed by the measuring instrument for teaching of the present invention is completed.

[0067] All the above-mentioned measurement information can be stored in the central processing unit in the control box C, or can be transmitted through an interface to an external terminal such as a personal computer or a smart phone based on wired communication or wireless communication for management and storage.

[0068] As described above, according to the present invention, when a teaching operation is performed in order to re-set manufacturing equipment such as a manipulator arm, the following operational relationship between the manipulator arm and the wafer can be conveniently and accurately confirmed during the teaching, and the position measurement and calibration of the manipulator arm can be accurately and conveniently performed. Not only that, it can also conveniently confirm whether the manipulator arm and the wafer are in the correct clamping position and whether the manipulator arm can accurately insert, install or extract the wafer, etc.

[0069] On the other hand, in the present invention, the user can directly confirm the state of the semiconductor wafer with the naked eye, and can also teach while confirming the horizontal state, left and right eccentricity and inclination, which will be explained in the following content.

[0070] As described above, the semiconductor wafer casing is mounted and placed on the reference plate of the loading platform for operation, and the hole blocks 20 arranged on the bottom surface of the support plate 1 are set on the pegs provided on the reference plate.

[0071] Next, the wafer W is mounted on the manipulator arm R connected to the robot, and then moved into the support groove 2 (see FIG. Figures 1 to 8 ).

[0072] The wafer W may be inserted into both the lower and upper sides at the same time, or may be selectively inserted into only the lower side or the upper side, respectively.

[0073] As described above, if the wafer W is inserted into the support groove 2 by the operating arm R, the edge of the wafer W will be inserted into the support groove 2, thereby being installed on the support shoulder 2c of the shelf shoulder 2a, and the rear edge portion of the wafer W will be installed on the support shoulder 4b of the stopper shaft 4. If the wafer enters the correct position, it will be stuck in the stopper groove 4a formed on the above-mentioned stopper shaft 4 on both sides and stop further entry.

[0074] As described above, if wafer W is inserted and installed, the level, height, left and right eccentricity, inclination and position of wafer W are precisely measured. The erroneous part will be recalibrated and the test data will be stored when normal operation is confirmed.

[0075] The height of the wafer when it enters can be measured by the scale mark 5a marked on the above-mentioned scale ruler 5. If the state of the wafer on the support shoulder 2c of the bracket shaft 3 installed on both sides and the support shoulder 4b of the stopper shaft 4 is confirmed, the horizontal state, left and right eccentricity and inclination can be confirmed, and all measurements can be easily confirmed with the naked eye.

[0076] Furthermore, even when the wafer W is inserted and installed and is extracted by the operating arm R, the operation relationship can be easily confirmed through the transparent window 6, that is, whether the wafer W is accurately loaded into the operating arm R and extracted.

[0077] When the operating arm R enters, the first position measuring device P arranged in front of the above-mentioned bracket shaft 3 moves the measuring fixed blocks 10 on both sides toward each other along the guide rails 8 when the above-mentioned operating arm R is paused, so that the measuring plates 13 on both sides are tightly attached to the side corners of the operating arm R, and then the scale indicating tips 16 on both sides are located at the scale marks 17 and the center is accurately measured and confirmed when the operating arm R enters or is withdrawn, thereby measuring the left and right eccentric states.

[0078] Furthermore, a first position measuring device P is disposed on the front side of the support shaft 3 to measure straightness when the operating arm enters and withdraws, and to measure horizontality and inclination through the scale marks 12 of the measuring plate 13 on both sides.

[0079] The level measurement level gauge 18 for measuring the left side level and the right side level, which is arranged on the front side of the support plate 1, measures the left side level and the right side level of the loading table on which the wafer is placed.

[0080] The inclined surface 2b formed on the front lower side of the above-mentioned shelf shoulder 2a is used to prevent collision when the operating arm loading the wafer enters in advance. The protrusions of the supporting shoulders 2c and 4b minimize the contact area of ​​the wafer to prevent high-precision measurement in the horizontal state and damage to the wafer.

[0081] As described above, if the test is completed through all measurements and calibrations and it is determined that the manipulator arm operates normally during the process operation, the teaching is completed by the measuring instrument for teaching of the present invention.

[0082] Next, refer to Fig.15 A measurement method for teaching a semiconductor wafer using a measuring instrument as another embodiment of the present invention will be described.

[0083] The measurement method for teaching semiconductor wafers using a measuring instrument includes: a first step S1, turning on (ON) by operating the power switch (not shown) of the measuring instrument; a second step S2, as the measuring instrument is turned on by operating the above-mentioned power switch, the window starts and the measurement program automatically starts to work; a third step S3, as the above-mentioned measurement program works, an automatic initialization work is performed; a fourth step S4, as the automatic initialization work is performed according to the work of the above-mentioned measurement program, the initialization is completed; a fifth step S5, in the step of completing the above-mentioned initialization, when the semiconductor wafer W begins to enter the bracket groove 2, the semiconductor wafer placement detection is started, and the left and right deviations of the semiconductor wafer W are measured by the first laser sensor 23 and the second laser sensor 23a on the lower side and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side. If it exceeds the deviation range, the semiconductor wafer cannot be placed and the initialization step is returned again. If it does not exceed the deviation range, the semiconductor wafer W is placed, thereby measuring the left and right deviations.

[0084] The semiconductor wafer W may be inserted into the support groove 2 at the same time into the lower side and the upper side, or may be selectively inserted into only the lower side or the upper side.

[0085] Therefore, if the semiconductor wafer enters the bracket groove 2 at the same time and enters the lower side and the upper side, the left and right deviations of the semiconductor wafer W are measured by the first laser sensor 23 and the second laser sensor 23a on the lower side and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side. When the semiconductor wafer W only enters the bracket groove 2 at the lower side, the left and right deviations are measured by the first laser sensor 23 and the second laser sensor 23a. When the semiconductor wafer W only enters the bracket groove 2 at the upper side, the left and right deviations of the semiconductor wafer W are measured by the fifth laser sensor 25 and the sixth laser sensor 25a.

[0086] The present invention also includes a sixth step S6, that is, when measuring the left and right deviations of the above-mentioned semiconductor wafer, if it does not exceed the deviation range, the left and right inclinations of the semiconductor wafer (that is, the height of the left side or the height of the right side of the semiconductor wafer) are measured by the third laser sensor 24 and the fourth laser sensor 24a on the lower side and the seventh laser sensor 26 and the eighth laser sensor 26a on the upper side. If it does not exceed the deviation range, the entry of the semiconductor wafer is started.

[0087] If the semiconductor wafer W in the above-mentioned fifth step S5 enters the bracket groove 2 by being inserted into the lower side and the upper side at the same time, then the left and right inclination of the semiconductor wafer in the above-mentioned sixth step S6 is also measured by the third laser sensor 24 and the fourth laser sensor 24a on the lower side and the seventh laser sensor 26 and the eighth laser sensor 26a on the upper side to measure the left and right inclination of the semiconductor wafer W. If the semiconductor wafer W only enters the bracket groove 2 on the lower side, the left and right inclination is measured by the third laser sensor 24 and the fourth laser sensor 24a. If the semiconductor wafer W only enters the bracket groove 2 on the upper side, the left and right inclination of the semiconductor wafer W is measured by the seventh laser sensor 26 and the eighth laser sensor 26a.

[0088] The present invention also includes a seventh step S7, that is, after entering through the sixth step S6 in which the semiconductor wafer starts to enter, the left and right entry deviations and left and right inclinations of the semiconductor wafer W are measured at the top and bottom respectively by the first laser sensor 23 and the second laser sensor 23a on the lower side and the fifth laser sensor 25 and the sixth laser sensor 25a on the upper side and the third laser sensor 24 and the fourth laser sensor 24a on the lower side and the seventh laser sensor 26 and the eighth laser sensor 26a on the upper side, and the height is measured. If the measured value does not exceed the deviation range, full entry is performed.

[0089] The present invention also includes an eighth step S8, that is, if the above-mentioned semiconductor wafer W has completely completed entering, depth measurement is performed by the ninth laser sensor 27 on the lower side of the rear part and the eleventh laser sensor 29 on the upper side, and the front and rear inclination (that is, the height of the front side or the height of the rear side of the semiconductor wafer) of the semiconductor wafer W is measured by the tenth laser sensor 28 and the third laser sensor 24 and the fourth laser sensor 24a on the lower side, and the front and rear inclination of the semiconductor wafer W is measured by the twelfth laser sensor 30 and the seventh laser sensor 26 and the eighth laser sensor 26a on the upper side. If the measured value does not exceed the deviation range, the measurement is terminated.

[0090] As described above, since the left and right deviation, left and right inclination, depth, front and back inclination, and height of the semiconductor wafer can be measured, the measured values ​​of the straightness, flatness, left and right deviation, entry height, etc. of the semiconductor wafer entering the measuring instrument used for teaching can be confirmed.

[0091] Thus, the test is completed through all the measurements and calibrations, and if it is identified that the manipulator arm is operating normally during the operation of the process, the teaching by the measuring instrument for teaching of the present invention is completed.

[0092] As described above, when teaching operations are performed to reset manufacturing equipment such as a manipulator arm based on the measurement information obtained through the measurement method of the present invention, the following operational relationship between the manipulator arm and the wafer can be conveniently and accurately confirmed during teaching, and the position measurement and calibration of the manipulator arm can be accurately and conveniently performed. Not only that, it can also conveniently confirm whether the manipulator arm and the wafer are in the correct clamping position and whether the manipulator arm can accurately insert, install or extract the wafer.

Claims

1. A measurement method for semiconductor wafer teaching using a measuring instrument, characterized in that: include: The first step is to turn on the measuring instrument by operating the power switch; In the second step, as the measuring instrument is turned on by operating the power switch, the window startup and the measuring program automatically start working; The third step is to perform automatic initialization work along with the above measurement program; The fourth step is to perform automatic initialization according to the measurement program, thereby completing initialization; The fifth step, in the step of completing the above initialization, when the semiconductor wafer begins to enter the bracket slot, the semiconductor wafer placement detection is started, and the left and right deviations of the semiconductor wafer are measured by the first laser sensor and the second laser sensor on the lower side and the fifth laser sensor and the sixth laser sensor on the upper side. If the deviation range is exceeded, the semiconductor wafer cannot be placed and the initialization step is returned. If the deviation range is not exceeded, the semiconductor wafer is placed, so as to measure the left and right deviations. The sixth step is to measure the left-right deviation of the semiconductor wafer in the fifth step. If it does not exceed the deviation range, the third laser sensor and the fourth laser sensor on the lower side and the seventh laser sensor and the eighth laser sensor on the upper side measure the left-right inclination of the semiconductor wafer, that is, the height of the left side or the height of the right side of the semiconductor wafer. If it does not exceed the deviation range, the entry of the semiconductor wafer is started; The seventh step is to measure the left and right entry deviation and left and right inclination of the semiconductor wafer at the upper and lower parts respectively, and measure the height, after the semiconductor wafer enters through the sixth step of starting to enter, by using the first laser sensor and the second laser sensor on the lower side, the fifth laser sensor and the sixth laser sensor on the upper side, the third laser sensor and the fourth laser sensor on the lower side, and the seventh laser sensor and the eighth laser sensor on the upper side. If the measured value does not exceed the deviation range, the full entry is performed; as well as The eighth step, if the above-mentioned semiconductor wafer has completely completed the entry, the ninth laser sensor on the lower side of the rear part and the eleventh laser sensor on the upper side perform depth measurement, and the tenth laser sensor on the lower side and the third laser sensor and the fourth laser sensor perform front and rear inclination measurement of the semiconductor wafer, that is, the height of the front side or the height of the rear side of the semiconductor wafer, and the twelfth laser sensor on the upper side and the seventh laser sensor and the eighth laser sensor perform front and rear inclination measurement of the semiconductor wafer. If the measured value does not exceed the deviation range, the measurement is terminated.

2. A measurement method for semiconductor wafer teaching using a measuring instrument, characterized in that: include: The first step is to turn on the measuring instrument by operating the power switch; In the second step, as the measuring instrument is turned on by operating the power switch, the window startup and the measuring program automatically start working; The third step is to perform automatic initialization work along with the above measurement program; The fourth step is to perform automatic initialization according to the measurement program, thereby completing initialization; The fifth step, in the step of completing the above initialization, when the semiconductor wafer begins to enter the bracket slot, the semiconductor wafer placement detection is started, and the left and right deviations of the semiconductor wafer are measured by the first laser sensor and the second laser sensor on the lower side. If the deviation range is exceeded, the semiconductor wafer cannot be placed and the initialization step is returned. If the deviation range is not exceeded, the semiconductor wafer is placed, so as to measure the left and right deviations. In the sixth step, when the left-right deviation of the semiconductor wafer is measured in the fifth step, if it does not exceed the deviation range, the left-right inclination of the semiconductor wafer is measured by the third laser sensor and the fourth laser sensor on the lower side, that is, the height of the left side or the height of the right side of the semiconductor wafer. If it does not exceed the deviation range, the entry of the semiconductor wafer is started; The seventh step is to measure the left and right entry deviation and the left and right inclination of the semiconductor wafer at the bottom through the first laser sensor, the second laser sensor, the third laser sensor and the fourth laser sensor on the lower side, respectively, and measure the height. If the measured value does not exceed the deviation range, the full entry is performed; as well as The eighth step, if the above-mentioned semiconductor wafer has completely completed the entry, the ninth laser sensor on the lower side of the rear part performs depth measurement, and the tenth laser sensor and the third laser sensor and the fourth laser sensor on the lower side perform front and rear inclination measurement of the semiconductor wafer, that is, the height of the front side or the back side of the semiconductor wafer. If the measured value does not exceed the deviation range, the measurement is terminated.

3. A measurement method for semiconductor wafer teaching using a measuring instrument, characterized in that: include: The first step is to turn on the measuring instrument by operating the power switch; In the second step, as the measuring instrument is turned on by operating the power switch, the window startup and the measuring program automatically start working; The third step is to perform automatic initialization work along with the above measurement program; The fourth step is to perform automatic initialization according to the measurement program, thereby completing initialization; The fifth step, in the step of completing the above initialization, when the semiconductor wafer begins to enter the bracket slot, the semiconductor wafer placement detection is started, and the left and right deviations of the semiconductor wafer are measured by the fifth laser sensor and the sixth laser sensor on the upper side. If the deviation range is exceeded, the semiconductor wafer cannot be placed and the initialization step is returned. If the deviation range is not exceeded, the semiconductor wafer is placed, so as to measure the left and right deviations. In the sixth step, when the left-right deviation of the semiconductor wafer is measured in the fifth step, if it does not exceed the deviation range, the left-right inclination of the semiconductor wafer is measured by the seventh laser sensor and the eighth laser sensor on the upper side, that is, the height of the left side or the height of the right side of the semiconductor wafer. If it does not exceed the deviation range, the entry of the semiconductor wafer is started; The seventh step is to measure the left and right entry deviation and the left and right inclination of the semiconductor wafer at the upper part respectively through the fifth laser sensor and the sixth laser sensor and the seventh laser sensor and the eighth laser sensor on the upper side after the semiconductor wafer enters the upper part, and to measure the height. If the measured value does not exceed the deviation range, the full entry is performed; as well as In the eighth step, if the semiconductor wafer has completely entered, the eleventh laser sensor on the upper rear side performs depth measurement, and the twelfth laser sensor, the seventh laser sensor, and the eighth laser sensor perform front and rear inclination measurement of the semiconductor wafer, that is, the height of the front side or the rear side of the semiconductor wafer. If the measured value does not exceed the deviation range, the measurement is terminated.

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