Display device

Abstract

A display device includes: a circuit board connected to one side of a first panel, wherein the circuit board includes: a first solder pad; and a second solder pad arranged adjacent to the first solder pad in a first direction, wherein the circuit board has a first side surface adjacent to the first panel, wherein the first solder pad and the second solder pad have a predetermined length in a second direction intersecting the first direction, and wherein the spacing between the first solder pad and the second solder pad changes from the first side surface of the circuit board along the second direction.

Description

Technical Field

[0001] The present invention relates to a display device, and more particularly, to a display device including a circuit board. Background Art

[0002] Multimedia electronic devices such as televisions, mobile phones, computers such as tablet computers, navigation systems, and game consoles have display devices for displaying images. In addition to a display module for displaying images, the display device may also include an input sensing unit capable of providing a touch-based input method in addition to conventional input methods such as buttons, keyboards, or mice, which allows a user to easily, intuitively, and conveniently input information or commands.

[0003] Typically, the input sensing unit includes an input sensing panel on which a plurality of sensing electrodes are arranged and a driving integrated circuit (IC) connected to one side of the input sensing panel to drive the sensing electrodes. The driving IC generates a driving signal and provides the generated driving signal to the sensing electrodes. The sensing electrodes can provide the driving IC with touch information corresponding to the user's input.

[0004] The driver IC is mounted on a flexible printed circuit board (FPCB), and one side of the FPCB is connected to one side of the input sensing panel. The driver IC is connected to the sensing electrode of the input sensing panel through the FPCB. This connection method is defined as a chip on film (COF) method.

[0005] The FPCB and the input sensing panel each have a pad for signal transmission. A method of stably electrically and physically connecting the pad of the FPCB and the pad of the input sensing panel is required.

[0006] Disclosure of the Invention

[0007] Technical issues

[0008] The present invention provides a display device capable of stably electrically and physically connecting a pad of a circuit board and a pad of an input sensing panel. Summary of the invention

[0009] Technical Solution

[0010] According to a feature of the present invention for achieving the above-mentioned purpose, a display device includes: a first panel; and a circuit board connected to one side of the first panel, wherein the circuit board includes: a first solder pad; and a second solder pad arranged adjacent to the first solder pad in a first direction, wherein the circuit board has a first side surface adjacent to the first panel, wherein the first solder pad and the second solder pad have a predetermined length in a second direction intersecting the first direction, wherein the spacing between the first solder pad and the second solder pad changes from the first side surface of the circuit board along the second direction.

[0011] In an embodiment, a spacing between the first pad and the second pad gradually increases as the distance from the first side surface of the circuit board in the second direction increases.

[0012] In an embodiment, a second spacing between the first pad and the second pad at a second point may be greater than the first spacing at a first point, wherein the first point may be closer to the first side surface of the circuit board than the second point.

[0013] In an embodiment, a first width of the first pad may be greater than a second width, and the first width of the first pad may be closer to the first side surface of the circuit board than the second width.

[0014] In an embodiment, the first width of the second pad may be greater than the second width, and the first width of the second pad may be closer to the first side surface of the circuit board than the second width.

[0015] In an embodiment, the first pad may be an alignment pad, and the second pad may be a signal pad.

[0016] In an embodiment, the first panel may be an input sensing panel comprising sensing electrodes.

[0017] In an embodiment, the input sensing panel may include a sensing pad, wherein the second pad may be electrically connected to the sensing pad.

[0018] In an embodiment, the display device may further include: an anisotropic conductive film electrically connecting the sensing pad and the second pad.

[0019] A display device according to another aspect of the present invention includes: a display panel including pixels; an input sensing panel, which is arranged on the upper surface of the display panel and includes sensing electrodes and sensing pads electrically connected to the sensing electrodes; and a circuit board, which is connected to one side of the input sensing panel, wherein the circuit board includes: a first pad; and a second pad, which is arranged adjacent to the first pad in a first direction and electrically connected to the sensing pad, wherein the circuit board has a first side surface adjacent to the first panel, wherein the first pad and the second pad have a predetermined length in a second direction intersecting the first direction, and wherein the spacing between the first pad and the second pad varies along the second direction from the first side surface of the circuit board.

[0020] In an embodiment, the display device may further include: an optical member disposed on the input sensing panel.

[0021] In an embodiment, the first side surface of the circuit board may be spaced apart from the optical member by a predetermined distance.

[0022] In an embodiment, the interval between the first pad and the second pad may gradually increase as moving away from the first side surface of the circuit board in the second direction.

[0023] In an embodiment, the interval between the first pad and the second pad may gradually increase as moving away from the first side surface of the circuit board in the second direction.

[0024] In an embodiment, a second spacing between the first pad and the second pad at a second point may be greater than the first spacing at a first point, wherein the first point may be closer to the first side surface of the circuit board than the second point.

[0025] In an embodiment, a first width of the first pad may be greater than a second width, and the first width of the first pad may be closer to the first side surface of the circuit board than the second width.

[0026] In an embodiment, the first width of the second pad may be greater than the second width, and the first width of the second pad may be closer to the first side surface of the circuit board than the second width.

[0027] In an embodiment, the first pad may be an alignment pad, and the second pad may be a signal pad.

[0028] In an embodiment, the display device may further include: an anisotropic conductive film electrically connecting the sensing pad and the second pad.

[0029] Beneficial Effects

[0030] In the display device having such a configuration, when the pads of the circuit board and the pads of the input sensing panel are electrically and physically bonded using an anisotropic conductive material, the anisotropic conductive material can be sufficiently introduced into the space between the pads. Therefore, by minimizing the leakage of the anisotropic conductive material to the outside of the flexible printed circuit board, defects in the display device can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a perspective view of a display device according to an embodiment.

[0032] Figure 2 is an exploded view of a display device according to an embodiment.

[0033] Figure 3 is a plan view of a display panel according to an embodiment.

[0034] Figure 4 is a plan view of an input sensing panel according to an embodiment of the present invention.

[0035] Figure 5 and Figure 6 is a side view of a display device according to an embodiment.

[0036] Figures 7a to 7c is a diagram exemplarily showing a process of attaching a second circuit board to an input sensing panel.

[0037] Figure 8a is a view illustrating pads provided on a rear surface of a second printed circuit board according to an embodiment.

[0038] Figure 8b yes Figure 8a An enlarged view of a partial area AA of the second printed circuit board is shown in FIG.

[0039] Figure 9a is a view illustrating pads provided on a rear surface of a second printed circuit board according to an embodiment.

[0040] Figure 9b yes Figure 9a An enlarged view of a partial area BB of the second printed circuit board is shown in FIG.

[0041] Fig.10a is a view illustrating pads provided on a rear surface of a second printed circuit board according to an embodiment.

[0042] Fig.10b yes Fig.10a An enlarged view of a partial area CC of a second printed circuit board is shown in FIG.

[0043] Fig.11a is a diagram illustrating pads provided on a rear surface of a second printed circuit board according to an embodiment.

[0044] Fig.11b yes Fig.11a An enlarged view of a partial area DDA of the second printed circuit board is shown in FIG.

[0045] Fig.12a yes Figure 8a An enlarged view of a partial area AA of the second printed circuit board is shown in FIG.

[0046] Figure 12b yes Fig.11a An enlarged view of a partial area DDA of the second printed circuit board is shown in FIG. DETAILED DESCRIPTION

[0047] In this specification, when an element (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another element, it means that the element can be directly placed on / directly connected to / directly coupled to another element, or a third element can be arranged between them.

[0048] The same reference numerals refer to the same elements. In addition, in the drawings, the thickness, proportion and size of components are exaggerated for effective description. "And / or" includes all one or more combinations defined by the relevant components.

[0049] It will be understood that the terms "first" and "second" are used herein to describe various components, but these components should not be limited by these terms. The above terms are only used to distinguish one component from another component. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and vice versa. Unless otherwise specified, a term in the singular may include a plural form.

[0050] In addition, terms such as "below", "lower side", "on", and "upper side" are used to describe the relationship of the configurations shown in the drawings. The terms are described as relative concepts based on the directions shown in the drawings.

[0051] In various embodiments of the present invention, the terms "includes," "comprising," "containing," or "having" specify properties, regions, fixed numbers, steps, processes, elements, and / or components, but do not exclude other properties, regions, fixed numbers, steps, processes, elements, and / or components.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the relevant technology, and unless interpreted in an idealized or overly formalized sense, these terms are clearly defined in this article.

[0053] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0054] Figure 1 is a perspective view of a display device DD according to an embodiment of the present invention.

[0055] Reference Figure 1 , a portable terminal is shown as an example of a display device DD according to an embodiment of the present invention. The portable terminal may include a tablet PC, a smart phone, a personal digital assistant (PDA), a portable multimedia player (PMP), a game console, and a wristwatch type electronic device. However, the present invention is not limited thereto.

[0056] The display device DD of the present invention can be used in large electronic devices such as televisions or external billboards, and in small and medium-sized electronic devices such as personal computers, notebook computers, car navigation units, and cameras. These are only presented by way of example, and can be used in other electronic devices without departing from the concept of the present invention.

[0057] like Figure 1 As shown in the figure, the display surface on which the image IM is displayed is parallel to the surface defined by the first direction DR1 and the second direction DR2. The display device DD includes a plurality of areas divided on the display surface. The display surface includes a display area DA on which the image IM is displayed and a non-display area NDA adjacent to the display area DA. The non-display area NDA may be referred to as a border area. For example, the display area DA may have a rectangular shape. The non-display area NDA surrounds the display area DA. In addition, although not shown in the figure, for example, the display device DD may have a partially curved shape. As a result, one area of ​​the display area DA may have a curved shape.

[0058] The front surface (or upper surface, or first surface) and the rear surface (or lower surface, or second surface) of each member are defined based on the direction of displaying the image IM. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts and can be converted to other directions.

[0059] The display device DD according to an embodiment of the present invention can sense the user's input TC applied from the outside. The user's input TC includes various types of external inputs using a part of the user's body or a device such as an electronic pen or a stylus. In the present embodiment, it is assumed that the user's input TC is the user's hand applied to the front surface of the display device DD, but this is only exemplary, and as described above, the user's input TC can be provided in various forms, and further, according to the structure of the display device DD, the display device DD can sense the user's input TC applied to the side surface or rear surface of the display device DD, and the present invention is not limited thereto.

[0060] Figure 2 is an exploded view of a display device according to an embodiment. Figure 2 The adhesive member is not shown. Figure 5 The adhesive member is described in detail.

[0061] like Figure 2 As shown in , the display device DD includes a window module WM, a display module DM and a bottom case BC.

[0062] The window module WM may be disposed on the display module DM and transmit an image provided from the display module DM through the transmission area TA. In detail, the window module WM includes the transmission area TA and the non-transmission area NTA. The transmission area TA is adjacent to the display area DA (refer to FIG. 1 ). Figure 1 ) overlap and may have a shape corresponding to the display area DA. The image IM displayed on the display area DA of the display device DD may be viewed from the outside through the transmission area TA of the window module WM (refer to Figure 1 ). The non-transmission area NTA and the non-display area NDA (refer to Figure 1 ) overlap and may have a shape corresponding to the non-display area NDA. The non-transmission area NTA may be an area having a relatively low light transmittance compared to the transmission area TA. However, the technical spirit of the present invention is not limited thereto, and the non-transmission area NTA may be omitted.

[0063] The window module WM may include a glass substrate, a sapphire substrate, a plastic substrate, etc. In addition, the window module WM may include a functional coating such as an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer. Although in the present embodiment, the window module WM has a flat shape within the display area DA, the shape of the window module WM may be modified. The edge of the window module WM facing the first direction DR1 may provide a curved surface.

[0064] The display module DM is disposed on the rear surface of the window module WM to generate an image. In addition, the display module DM can sense the user's input TC (refer to Figure 1 ).

[0065] Although the display module DM providing a flat display surface is exemplarily shown in this embodiment, the shape of the display module DM may be modified. An edge of the display module DM facing the first direction DR1 may be bent from a central portion to provide a curved surface.

[0066] The display module DM may include an input sensing panel ISP, a display panel DP, a protection film PF, a support panel SPP, an input control module ICM, and a driving control module DCM.

[0067] Input sensing panel ISP obtains Figure 1 , the coordinate information of the user's input TC shown in . The input sensing panel ISP can sense various types of inputs provided from the outside of the display device DD. In an embodiment, the input sensing panel ISP can sense a touch input by the user's body, but the present invention is not limited thereto. For example, the input sensing panel ISP can recognize various types of external inputs such as light, heat, or pressure. In addition, the input sensing panel ISP can sense not only inputs that contact the sensing surface, but also inputs adjacent to the sensing surface.

[0068] The input sensing panel ISP may be, for example, a capacitive touch panel or an electromagnetic induction touch panel, etc. The input sensing panel ISP may include a base layer, sensing electrodes, and signal lines connected to the sensing electrodes.

[0069] In a plan view, the input sensing panel ISP includes a sensing area SA and a sensing peripheral area NSA. In the present embodiment, the sensing peripheral area NSA may be defined along the edge of the sensing area SA. The sensing area SA and the sensing peripheral area NSA of the input sensing panel ISP correspond to the display area DA of the display device DD (see FIG. Figure 1 ) and non-display area NDA (see Figure 1 ).

[0070] The input control module ICM includes a second circuit board FCB2 (or a flexible circuit board) and an input drive circuit IDC. The second circuit board FCB2 is electrically and physically connected to the input sensing panel ISP. The input drive circuit IDC can be mounted on the second circuit board FCB2. The input drive circuit IDC can be implemented as an integrated circuit. The second circuit board FCB2 can be a flexible circuit board. The second circuit board FCB2 can also be electrically connected to the main circuit board MCB to be described later.

[0071] The display panel DP may include various display elements. For example, the display element may be a liquid crystal display device, an organic light emitting device, an electrophoretic device, or an electrowetting device. The display element according to the embodiment is described as a plurality of organic light emitting diodes. That is, the display panel DP according to the present invention is a flexible display panel and may be, for example, an organic light emitting display panel.

[0072] In a plan view, the display panel DP includes a display area DP-DA and a non-display area DP-NDA. In this embodiment, the non-display area DP-NDA may be defined along an edge of the display area DP-DA. The display area DP-DA and the non-display area DP-NDA of the display panel DP correspond to the display area DA of the display device DD, respectively (see FIG. Figure 1 ) and non-display area NDA (see Figure 1 ).

[0073] The protective film PF is disposed on the rear surface of the display panel DP. The protective film PF may include a plastic film as a base layer. The protective film PF may include a plastic film including any one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0074] The material constituting the protection film PF is not limited to the plastic resin, and may include an organic / inorganic composite material. The protection film PF may include a porous organic layer and an inorganic material filled in the pores of the organic layer.

[0075] The support panel SPP is disposed on the rear surface of the protective film PF to support the display panel DP and the protective film PF. The support panel SPP may be a metal plate having a rigidity greater than or equal to a standard. The support panel SPP may be a stainless steel plate. The support panel SPP may have a black color to block external light incident on the display panel DP.

[0076] The drive control module DCM includes a main circuit board MCB (or a drive circuit board), a first circuit board FCB1 (or a panel flexible circuit board) and a panel drive circuit PDC. The first circuit board FCB1 electrically connects the main circuit board MCB and the display panel DP. The panel drive circuit PDC can be mounted on the first circuit board FCB1. The panel drive circuit PDC can be implemented as an integrated circuit. Although not shown separately in the figure, a plurality of passive components and active components can be mounted on the main circuit board MCB. The main circuit board MCB can be a rigid circuit board or a flexible circuit board, and the first circuit board FCB1 can be a flexible circuit board.

[0077] In an embodiment of the present invention, the protection film PF may be omitted. Also, some components of the drive control module DCM may be omitted. The panel drive circuit PDC may be mounted on the display panel DP.

[0078] The bottom case BC may be coupled to the window module WM. The bottom case BC provides a rear surface of the display device DD and is coupled to the window module WM to define an internal space. The bottom case BC may include a material having relatively high rigidity. For example, the bottom case BC may include a plurality of frames and / or plates made of glass, plastic, and metal. The bottom case BC may stably protect the components of the display device DD housed in the internal space from external impacts.

[0079] In addition, although the bottom case BC is described as including a material having high rigidity, the present invention is not limited thereto, and the bottom case BC may include a flexible material. Although not shown in the drawings, when the display device DD according to an embodiment of the present invention has a characteristic of being foldable or bendable, the components included in the display device DD may also have a flexible characteristic.

[0080] Figure 3 is a plan view of a display panel DP according to an embodiment of the present invention. Figure 3 The signal circuit diagram is schematically shown. Figure 3 In the description, some components are omitted and not shown.

[0081] like Figure 3 As shown in FIG. 1 , in a plan view, the display panel DP includes a display area DP-DA and a non-display area DP-NDA. In this embodiment, the non-display area DP-NDA may be defined along the edge of the display area DP-DA. The display area DP-DA and the non-display area DP-NDA of the panel DP correspond to Figure 1 The display area DA and the non-display area NDA of the display device DD shown in FIG.

[0082] The display panel DP includes a scan drive circuit SDC, a plurality of signal lines SGL (hereinafter referred to as signal lines), a plurality of signal pads PD (hereinafter referred to as signal pads), and a plurality of pixels PX (hereinafter referred to as pixels). The pixels PX are arranged in the display area DP-DA. Although not shown in the figure, each of the pixels PX includes an organic light emitting diode and a drive circuit connected to the organic light emitting diode.

[0083] The scan drive circuit SDC generates a plurality of scan signals (hereinafter referred to as scan signals) and sequentially outputs the scan signals to a plurality of scan lines SL (hereinafter referred to as scan lines) to be described later. The scan drive circuit SDC may also output another control signal to the drive circuit of the pixel PX.

[0084] The scan driving circuit SDC may include a plurality of thin film transistors formed by the same process as the driving circuit of the pixel PX, for example, a low temperature polysilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process.

[0085] The signal lines SGL include scan lines SL, data lines DL, power lines PL, and control signal lines CSL. The scan lines SL are connected to corresponding pixels PX among the pixels PX, and the data lines DL are connected to corresponding pixels PX among the pixels PX. The power lines PL are connected to the pixels PX. The control signal lines CSL can provide control signals to the scan drive circuit SDC.

[0086] The signal line SGL overlaps the display area DP-DA and the non-display area DP-NDA. The signal line SGL may include a pad portion and a line portion. The line portion overlaps the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to an end of the line portion. The pad portion is disposed in the non-display area DP-NDA and overlaps with a corresponding signal pad PD among the signal pads PD. An area in the non-display area DP-NDA where the signal pad PD is disposed may be defined as a pad area NDA-PD.

[0087] The line portion substantially connected to the pixel PX constitutes most of the signal line SGL. The line portion is connected to a transistor (not shown) of the pixel PX. The line portion may have a single-layer / multi-layer structure, and the line portion may have a single body or include two or more parts. The two or more parts may be arranged on different layers and may be connected to each other through a contact hole passing through an insulating layer arranged between the two or more parts.

[0088] Figure 4 is a plan view of an input sensing panel ISP according to an embodiment of the present invention.

[0089] Reference Figure 4 , the input sensing panel ISP can sense the user's input TC ( Figure 1 ) to obtain the position or intensity information of the external input. In a plan view, the input sensing panel ISP includes a sensing area SA and a sensing peripheral area NSA. In this embodiment, the sensing peripheral area NSA can be defined along the edge of the sensing area SA. The sensing area SA and the sensing peripheral area NSA of the input sensing panel ISP correspond to Figure 1 The display area DA and the non-display area NDA of the display device DD shown in FIG.

[0090] The input sensing panel ISP includes a plurality of first sensing electrodes SE1 , a plurality of second sensing electrodes SE2 , a plurality of sensing lines TL1 , TL2 , and TL3 , and a plurality of sensing pads SPD.

[0091] The first sensing electrode SE1 and the second sensing electrode SE2 are disposed in the sensing area SA. The input sensing panel ISP may obtain information about an input through a change in capacitance between the first sensing electrode SE1 and the second sensing electrode SE2.

[0092] Each of the first sensing electrodes SE1 extends along the first direction DR1, and the first sensing electrodes SE1 are arranged along the second direction DR2. The first sensing electrodes SE1 may include a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1.

[0093] The first sensing patterns SP1 constituting one first sensing electrode SE1 are arranged to be spaced apart from each other in the first direction DR1. In this embodiment, for ease of explanation, the first sensing patterns SP1 are illustrated by forming shading therefor. The first connection pattern CP1 is disposed between the first sensing patterns SP1 to connect two adjacent first sensing patterns SP1.

[0094] Each of the second sensing electrodes SE2 extends along the second direction DR2, and the second sensing electrodes SE2 are arranged along the first direction DR1. The second sensing electrodes SE2 may include a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2.

[0095] The second sensing patterns SP2 constituting one second sensing electrode are arranged to be spaced apart from each other in the second direction DR2. The second connection pattern CP2 is disposed between the second sensing patterns SP2 to connect two adjacent second sensing patterns SP2.

[0096] The sensing lines TL1, TL2, and TL3 are arranged in the sensing peripheral area NSA. The sensing lines TL1, TL2, and TL3 may include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3. The first sensing lines TL1 are respectively connected to the first sensing electrodes SE1. The second sensing lines TL2 are respectively connected to the first ends of the second sensing electrodes SE2. The third sensing lines TL3 are respectively connected to the second ends of the second sensing electrodes SE2. The other ends of the second sensing electrodes SE2 may be portions facing the ends of the second sensing electrodes SE2. According to the present invention, the second sensing electrode SE2 may be connected to the second sensing line TL2 and the third sensing line TL3. Therefore, with respect to the second sensing electrode SE2 having a relatively longer length than the first sensing electrode SE1, the sensitivity according to the region may be consistently maintained. Meanwhile, this is shown by way of example, and the third sensing line TL3 may be omitted, and the embodiment is not limited thereto.

[0097] The sensing pad SPD is disposed in the sensing peripheral area NSA. The sensing pad SPD is connected to the sensing lines TL1, TL2, and TL3, respectively, to electrically transmit an external signal to each of the first sensing electrode SE1 and the second sensing electrode SE2. Although not shown in the figure, the sensing pad SPD may further include a second circuit board FCB2 (refer to Figure 5 ) alignment pads, for example, can be connected to Figure 8a The alignment pads ALP11 and ALP12 shown in FIG. The shape of the alignment pads provided in the sensing pad SPD may be different from that of the alignment pads ALP11 and ALP12 shown in FIG. Figure 8a The shapes of the alignment pads ALP11 and ALP12 shown in FIG. 1 are the same or different.

[0098] In the following, reference will be made to Figure 5 and Figure 6 The display device DD is described in more detail.

[0099] Figure 5 and Figure 6 is a side view of a display device DD according to the embodiment. Figure 5 shows the display panel DP in an unfolded state, and Figure 6 The display panel DP is shown in a bent state.

[0100] Reference Figure 5 and Figure 6 The display device DD includes a window module WM and a display module DM. The window module WM includes a base member BS and a frame layer BZL disposed on the rear surface of the base member BS. The region where the frame layer BZL is disposed is defined as Figure 1 Although the window module WM has a flat shape within the display area DA in the present embodiment, the shape of the window module WM may be modified.

[0101] The base member BS may include a glass substrate, a sapphire substrate, a plastic substrate, etc. The base member BS may have a multi-layer or single-layer structure. For example, the base member BS may include a plurality of plastic films bonded with an adhesive. The base member BS may include a glass substrate and a plastic film bonded to the glass substrate by an adhesive member.

[0102] The frame layer BZL may have a single layer or a multilayer structure. The multilayer frame layer BZL may include a buffer layer to improve adhesion, a pattern layer to provide a predetermined pattern, and an achromatic layer. The patterned layer may provide a pattern called a fine line. The achromatic layer may include an organic mixture containing a black pigment or dye. The layer may be formed by vapor deposition, printing, coating, etc. Although not shown separately, the window module WM may also include a functional coating disposed on the front surface of the base member BS. The functional coating may include an anti-fingerprint layer, an anti-reflection layer, and a hard coating.

[0103] The display module DM may include an optical member POL, an input sensing panel ISP, a display panel DP, a protection film PF, and a support panel SPP. The optical member POL may also be referred to as a polarization layer POL.

[0104] The first adhesive member AM1 to the sixth adhesive member AM6 to be described below may be a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, or an optically clear adhesive resin (OCR) film. The first adhesive member AM1 to the sixth adhesive member AM6 include a light-curable adhesive material or a heat-curable adhesive material, and the materials of the first adhesive member AM1 to the sixth adhesive member AM6 are not specifically limited. Moreover, some of the first adhesive member AM1 to the sixth adhesive member AM6 may be omitted.

[0105] The polarizing layer POL is disposed between the display panel DP and the window module WM. The polarizing layer POL polarizes external light incident through the window module WM, thereby preventing the circuit elements included in the display module DM from being visually recognized by the outside. The first adhesive member AM1 is disposed between the polarizing layer POL and the window module WM to adhere the polarizing layer POL and the window module WM to each other. In another embodiment, the polarizing layer POL may include at least one of a polarizing film and a delay film. The polarizing layer POL covers the entire display area DA and a portion of the non-display area NDA. Therefore, on a plane, the polarizing layer POL may overlap with the border layer BZL of the display area DA and the non-display area NDA.

[0106] The polarization layer POL and the input sensing panel ISP may be coupled to each other through the second adhesive member AM2. The display panel DP is disposed on the rear surface of the input sensing panel ISP. The input sensing panel ISP and the display panel DP may be coupled to each other through the third adhesive member AM3.

[0107] The second circuit board FCB2 is connected on one side of the input sensing panel ISP. The first side surface SS1 of the second circuit board FCB2 is arranged adjacent to the input sensing panel ISP. The input drive circuit IDC is mounted on the rear surface of the second circuit board FCB2. In a state where the second circuit board FCB2 is bent, the second circuit board FCB2 can be connected to the main circuit board MCB. In an embodiment, the main circuit board MCB and the second circuit board FCB2 are shown as being in direct contact, but the present invention is not limited thereto. For example, the main circuit board MCB and the second circuit board FCB2 may be electrically connected by a conductive member (not shown) arranged between the main circuit board MCB and the second circuit board FCB2 in a thickness direction (e.g., a third direction DR3) of the display module DM. The second circuit board FCB2 may be bent in the rear direction of the display module DM.

[0108] exist Figure 5 and Figure 6 , the display panel DP is schematically shown as a single layer. Although not shown in the figure, the display panel DP may include a base layer, a circuit layer, a light emitting element layer, and a sealing layer.

[0109] The rear surface of the display panel DP and the protection film PF may be coupled to each other by the fourth adhesive member AM4.

[0110] The protection film PF and the support panel SPP may be coupled to each other by the fifth adhesive member AM5.

[0111] A portion of the display panel DP may be disposed to correspond to the bending area BA. In a state where the display panel DP is bent, the display panel DP and the support panel SPP may be coupled to each other through the sixth adhesive member AM6. The sixth adhesive member AM6 may also serve as a spacer for maintaining the curvature radius of the bending area BA.

[0112] In the embodiment, the main circuit board MCB and the first circuit board FCB1 are shown as being in direct contact, but the present invention is not limited thereto. For example, the main circuit board MCB and the first circuit board FCB1 may be electrically connected by a conductive member (not shown) disposed between the main circuit board MCB and the first circuit board FCB1 in the thickness direction (e.g., the third direction DR3) of the display module DM.

[0113] Figures 7a to 7c Schematically shows a process of attaching the second circuit board FCB2 to the input sensing panel ISP. Figures 7a to 7c In the figure, for the convenience of explanation, the polarization layer POL, the input sensing panel ISP, the display panel DP and the second circuit board FCB2 of the display device DD are briefly shown.

[0114] Reference Figure 7a , the input sensing panel ISP is disposed on the display panel DP. The polarization layer POL is disposed on the top of the input sensing panel ISP. After the polarization layer POL is disposed on the input sensing panel ISP, the second circuit board FCB2 may be attached to one side of the input sensing panel ISP. The input sensing panel ISP includes a reference Figure 4 The sensing pads SPD are described, and the second circuit board FCB2 includes base pads BPD.

[0115] Reference Figure 7b , the sensing pads SPD of the input sensing panel ISP and the base pads BPD of the second circuit board FCB2 can be coupled through the anisotropic conductive film ACF. The anisotropic conductive film ACF includes a curable resin and conductive balls irregularly distributed in the curable resin to couple the sensing pads SPD of the input sensing panel ISP and the base pads BPD of the second circuit board FCB2. The curable resin is made of, for example, a thermosetting resin and is cured by thermal compression applied from the outside. The conductive balls can electrically connect the sensing pads SPD and the base pads BPD while being deformed by thermal compression.

[0116] When the sensing pads SPD of the input sensing panel ISP and the base pads BPD of the second circuit board FCB2 with the anisotropic conductive film ACF therebetween are thermally compressed, the anisotropic conductive film ACF may leak in the direction of the input sensing panel ISP due to the high fluidity of the conductive balls of the anisotropic conductive film ACF. After the sensing pads SPD of the input sensing panel ISP and the base pads BPD of the second circuit board FCB2 are bonded in the manufacturing step of the display device DD, the polarization layer POL may be disposed on the input sensing panel ISP. In this case, the bonding between the input sensing panel ISP and the polarization layer POL may be incomplete due to interference caused by the leaking anisotropic conductive film ACF.

[0117] In an embodiment of the present invention, after the polarization layer POL is disposed on the input sensing panel ISP, the sensing pad SPD of the input sensing panel ISP is combined with the base pad BPD of the second circuit board FCB2. Therefore, even if the anisotropic conductive film ACF leaks, the bonding between the input sensing panel ISP and the polarization layer POL is not affected.

[0118] Recently, efforts are being made to make the non-display area NDA (see Figure 1 ). As one of the methods to minimize the non-display area NDA, the distance L1 between the second circuit board FCB2 and the polarizing layer POL is decreasing. For example, when the distance L1 between the second circuit board FCB2 and the polarizing layer POL is reduced from 0.25 mm to 0.13 mm, the leaked anisotropic conductive film ACF may adhere to a portion of the polarizing layer POL.

[0119] Reference Figure 7c , when the anisotropic conductive film ACF is thermally compressed, the display device DD according to an embodiment of the present invention includes a second circuit board FCB2 having a base pad BPD, and the base pad BPD has a shape that can minimize the flow of the anisotropic conductive film ACF in the direction of the polarization layer POL. Therefore, the leakage of the anisotropic conductive film ACF in the direction of the polarization layer POL can be minimized. As a result, even if the distance L1 between the second circuit board FCB2 and the polarization layer POL is reduced, the anisotropic conductive film ACF does not contact the polarization layer POL. Therefore, even if the polarization layer POL is set on the input sensing panel ISP after the thermal compression of the sensing pads SPD of the input sensing panel ISP and the base pads BPD of the second circuit board FCB2, the contact failure between the input sensing panel ISP and the polarization layer POL due to the anisotropic conductive film ACF can be prevented from occurring.

[0120] Figure 8a is a diagram illustrating pads provided on the rear surface of the second printed circuit board FCB21 according to an embodiment. Figure 8b yes Figure 8a FIG. 4 is an enlarged view of a partial area AA of the second printed circuit board FCB21 shown in FIG.

[0121] Reference Figure 8a and Figure 8b , the second printed circuit board FCB21 includes alignment pads ALP11 and ALP12 and a signal pad SGP1. The alignment pads ALP11 and ALP12 and the signal pad SGP1 may be Figure 5 The substrate pad BPD shown in .

[0122] The alignment pads ALP11 and ALP12 and the signal pad SGP1 of the second printed circuit board FCB21 may be connected to Figure 4 The sensing pads SPD of the input sensing panel ISP shown in FIG. The aligning pads ALP12, the signal pads SGP1, and the aligning pads ALP11 may be sequentially disposed along the first direction DR1. The aligning pads ALP11 and ALP12 and the signal pad SGP1 have a predetermined length in the second direction DR2.

[0123] The second printed circuit board FCB21 includes a first side surface SS1, a second side surface SS2, and a third side surface SS3. The first side surface SS1 may be connected to the input sensing panel ISP (see Figure 5 The alignment pad ALP11 is disposed adjacent to the second side surface SS2, and the alignment pad ALP12 is disposed adjacent to the third side surface SS3.

[0124] The alignment pads ALP11 and ALP12 and the signal pad SGP1 may extend to the first side surface SS1 of the second printed circuit board FCB21. In another embodiment, the first side surface SS1 of the second printed circuit board FCB21 and the alignment pads ALP11 and ALP12 and the signal pad SGP1 may be spaced apart from each other by a predetermined distance. Although not shown in the drawings, one end of the signal pad SGP1 may be electrically connected to the signal wiring.

[0125] The alignment pads ALP11 and ALP12 may be used to align the signal pad SGP1 and the sensing pad SPD (refer to Figure 5 ) is aligned with the connection position. The signal pad SGP1 may be used for inputting the drive circuit IDC (refer to Figure 5 ) and input sensing panel ISP (refer to Figure 5 ). The signal pad SGP1 includes n signal pads SGP11 to SGP1n. The alignment pad ALP11 is disposed adjacent to the first signal pad SGP11, and the alignment pad ALP12 is disposed adjacent to the n-th signal pad SGP1n.

[0126] The pitches P11 and P12 between the alignment pad ALP11 and the first signal pad SGP11 may be different in the second direction DR2. The pitches P11 and P12 between the alignment pad ALP11 and the first signal pad SGP11 increase as the distance from the first side surface SS1 in the second direction DR2 increases. For example, the second pitch P12 between the alignment pad ALP11 and the first signal pad SGP11 may be greater than the first pitch P11 (P12>P11).

[0127] In other words, the first width W11 of the first signal pad SGP11 in the first direction DR1 is greater than the second width W12. The first width W11 of the first signal pad SGP11 is closer to the first side surface SS1 of the second printed circuit board FCB21 than the second width W12. Moreover, the first width W14 of the alignment pad ALP11 is greater than the second width W15. The first width W14 of the alignment pad ALP11 is closer to the first side surface SS1 of the second printed circuit board FCB21 than the second width W15.

[0128] In the above, the spacing between the alignment pad ALP11 and the first signal pad SGP11 and the width of each of the alignment pad ALP11 and the first signal pad SGP11 have been described, but the spacing between the alignment pad ALP12 and the nth signal pad SGP1n and the width of each of the alignment pad ALP12 and the nth signal pad SGP1n may also be applicable with the same principle.

[0129] The width of each of the signal pads SGP1 except the first signal pad SGP11 and the n-th signal pad SGP1n among the signal pads SGP1 may be the same as the third width W13. Moreover, the spacing between the signal pads SGP1 may be the third spacing P13. However, the present invention is not limited thereto. For example, the signal pads SGP1 may have different widths, and the spacing between the signal pads SGP1 may also be different from each other. In another embodiment, all or some of the signal pads SGP1 except the first signal pad SGP11 and the n-th signal pad SGP1n among the signal pads SGP1 may have the same shape as the signal pads SGP11 and SGP1n.

[0130] In another embodiment, the widths of the first signal pad SGP11 and the nth signal pad SGP1n may be the same as the width W13 of the remaining signal pads SGP1 among the signal pads SGP1. In this case, since the first width W14 of the alignment pad ALP11 is greater than the second width W15, the second pitch P12 between the alignment pad ALP11 and the first signal pad SGP11 may be greater than the first pitch P11 (P12>P11).

[0131] exist Figure 8a and Figure 8b In the example shown in FIG. 1 , the second pitch P12 is greater than the first pitch P11 between the alignment pad ALP11 and the first signal pad SGP11. Therefore, the separation distance between the alignment pad ALP11 and the first signal pad SGP11 increases so that the anisotropic conductive film ACF (see FIG. 1 ) can be accommodated. Figure 7c ) space increases. As a result, when using anisotropic conductive film ACF (see Figure 7c ) When the base pads BPD and the sensing pads SPD are thermally compressed, the anisotropic conductive film ACF may have fluidity between the alignment pads ALP11 and the first signal pads SGP11 in a direction opposite to the first side surface SS1 of the second printed circuit board FCB21.

[0132] exist Figure 7b In the example shown, also refer to Figure 8a , when the amount of the anisotropic conductive film ACF flowing out from the first side surface SS1 of the second printed circuit board FCB21 increases, poor contact between the input sensing panel ISP and the polarization layer POL may occur. According to an embodiment of the present invention, the leakage of the anisotropic conductive film ACF to the outside of the first side surface SS1 of the second printed circuit board FCB21 can be minimized, and the poor contact between the input sensing panel ISP and the polarization layer POL can be prevented.

[0133] In this specification, only the second circuit board FCB2 (refer to Figure 5 ) of the sensing pad SPD (refer to Figure 5 ) arrangement method, but the present invention is not limited thereto. The same principle as the sensing pad SPD of the second circuit board FCB2 can also be used to arrange Figure 2 and Figure 5 The pads of the first circuit board FCB1 are shown in FIG.

[0134] Figure 9a is a diagram illustrating pads provided on the rear surface of the second printed circuit board FCB22 according to an embodiment. Figure 9b yes Figure 9a FIG. 4 is an enlarged view of a partial area BB of the second printed circuit board FCB22 shown in FIG.

[0135] because Figure 9a and Figure 9b The second printed circuit board FCB22 shown in FIG. Figure 8a and Figure 8b The second printed circuit board FCB21 shown in FIG. 1 has a similar configuration, so a repeated description will be omitted.

[0136] Reference Figure 9a and Figure 9bThe second printed circuit board FCB22 includes alignment pads ALP21 and ALP22 and a signal pad SGP2. The alignment pads ALP21 and ALP22 and the signal pad SGP2 may be Figure 5 The substrate pad BPD shown in .

[0137] Pitches P21 and P22 between the align pad ALP21 and the first signal pad SGP21 may be different along the second direction DR2. For example, the second pitch P22 between the align pad ALP21 and the first signal pad SGP21 may be greater than the first pitch P21 (P22>P21).

[0138] In other words, the first width W21 of the first signal pad SGP21 is greater than the second width W22 (W21>W22). The first width W21 of the first signal pad SGP21 is closer to the first side surface SS1 of the second printed circuit board FCB22 than the second width W22. Moreover, the first width W24 of the alignment pad ALP21 is greater than the second width W25. The first width W24 of the alignment pad ALP21 is closer to the first side surface SS1 of the second printed circuit board FCB22 than the second width W25.

[0139] One side of the alignment pad ALP21 (i.e., the side adjacent to the first signal pad SGP21) has a concavo-convex shape along the second direction DR2. One side of the first signal pad SGP21 (i.e., the side adjacent to the alignment pad ALP21) has a concavo-convex shape along the second direction DR2. The concavo-convex shapes of one side of the alignment pad ALP21 and one side of the first signal pad SGP21 may be variously modified, such as a semicircle or a triangle.

[0140] In the above, the spacing between the alignment pad ALP21 and the first signal pad SGP21 and the width of each of the alignment pad ALP21 and the first signal pad SGP21 have been described, but the spacing between the alignment pad ALP22 and the nth signal pad SGP2n and the width of each of the alignment pad ALP22 and the nth signal pad SGP2n may also be applicable with the same principle.

[0141] The width of each of the signal pads SGP2 except the first signal pad SGP21 and the nth signal pad SGP2n among the signal pads SGP2 may be the same as the third width W23. Moreover, the spacing between the signal pads SGP2 may be the third spacing P23. However, the present invention is not limited thereto. For example, the signal pads SGP2 may have different widths, and the spacing between the signal pads SGP2 may also be different from each other.

[0142] exist Figure 9a and Figure 9bIn the example shown in , the second pitch P22 is greater than the first pitch P21 between the alignment pad ALP21 and the first signal pad SGP21. In addition, due to the concavo-convex shapes of one side of the alignment pad ALP21 and one side of the first signal pad SGP21, the separation distance between the alignment pad ALP21 and the first signal pad SGP21 is increased, so that the anisotropic conductive film ACF (refer to Figure 7c ) space becomes larger. As a result, when using anisotropic conductive film ACF (see Figure 7c ) connect the base pad BPD and the sensing pad SPD (refer to Figure 7c ) When the anisotropic conductive film ACF is thermally compressed, it can have fluidity between the alignment pad ALP21 and the first signal pad SGP21 in the direction opposite to the first side surface SS1 of the second printed circuit board FCB22. According to the embodiment of the present invention, the leakage of the anisotropic conductive film ACF to the outside of the first side surface SS1 of the second printed circuit board FCB22 can be minimized, and the input sensing panel ISP (refer to Figure 7c ) and polarization layer POL (refer to Figure 7c ) between the two.

[0143] In another embodiment, only one of the side of the alignment pad ALP21 and the side of the first signal pad SGP21 may have a concavo-convex shape. Even in this case, the separation distance between the alignment pad ALP21 and the first signal pad SGP21 increases, so that the space that can accommodate the anisotropic conductive film ACF increases.

[0144] Fig.10a is a diagram illustrating pads provided on the rear surface of the second printed circuit board FCB23 according to an embodiment. Fig.10b yes Fig.10a An enlarged view of a partial area CC of the second printed circuit board FCB23 is shown in FIG.

[0145] because Fig.10a and Fig.10b The second printed circuit board FCB23 shown in FIG. Figure 8a and Figure 8b The second printed circuit board FCB21 shown in FIG. 1 has a similar configuration, so a repeated description will be omitted.

[0146] Reference Fig.10a and Fig.10b The second printed circuit board FCB23 includes alignment pads ALP31 and ALP32 and a signal pad SGP3. The alignment pads ALP31 and ALP32 and the signal pad SGP3 may be Figure 5 The substrate pad BPD shown in .

[0147] The pitches P31 and P32 between the alignment pad ALP31 and the first signal pad SGP31 may be different along the second direction DR2. The pitches P31 and P32 between the alignment pad ALP31 and the first signal pad SGP31 gradually increase as the alignment pad ALP31 and the first signal pad SGP31 move away from the first side surface SS1 in the second direction DR2. For example, the second pitch P32 between the alignment pad ALP31 and the first signal pad SGP31 may be greater than the first pitch P31 (P32>P31).

[0148] In other words, the first width W31 of the first signal pad SGP31 is greater than the second width W32 (W31>W32). The first width W31 of the first signal pad SGP31 is closer to the first side surface SS1 of the second printed circuit board FCB23 than the second width W32. The width of the first signal pad SGP31 may gradually decrease as the first signal pad SGP31 moves away from the first side surface SS1 in the second direction DR2.

[0149] Furthermore, the first width W34 of the aligning pad ALP31 is greater than the second width W35. The first width W34 of the aligning pad ALP31 is closer to the first side surface SS1 of the second printed circuit board FCB23 than the second width W35. The width of the aligning pad ALP31 may gradually decrease as the aligning pad ALP31 moves away from the first side surface SS1 in the second direction DR2.

[0150] In the above, the spacing between the alignment pad ALP31 and the first signal pad SGP31 and the width of each of the alignment pad ALP31 and the first signal pad SGP31 have been described, but the spacing between the alignment pad ALP32 and the nth signal pad SGP3n and the width of each of the alignment pad ALP32 and the nth signal pad SGP3n may also be applicable with the same principle.

[0151] The width of each of the signal pads SGP3 except the first signal pad SGP31 and the nth signal pad SGP3n among the signal pads SGP3 may be the same as the third width W33. Moreover, the spacing between the signal pads SGP3 may be the third spacing P33. However, the present invention is not limited thereto. For example, the signal pads SGP3 may have different widths, and the spacing between the signal pads SGP3 may also be different from each other.

[0152] exist Fig.10a and Fig.10bIn the example shown in FIG. 1 , the second pitch P32 is greater than the first pitch P31 between the alignment pad ALP31 and the first signal pad SGP31. Therefore, the separation distance between the alignment pad ALP31 and the first signal pad SGP31 increases so that the anisotropic conductive film ACF (see FIG. 1 ) can be accommodated. Figure 7c ) space increases. As a result, when using anisotropic conductive film ACF (see Figure 7c ) connect the base pad BPD and the sensing pad SPD (refer to Figure 7c ) When the anisotropic conductive film ACF is thermally compressed, it can have fluidity between the alignment pad ALP31 and the first signal pad SGP31 in the direction opposite to the first side surface SS1 of the second printed circuit board FCB23. According to the embodiment of the present invention, the leakage of the anisotropic conductive film ACF to the outside of the first side surface SS1 of the second printed circuit board FCB23 can be minimized, and the input sensing panel ISP (refer to Figure 7c ) and polarization layer POL (refer to Figure 7c ) between the two.

[0153] Fig.11a is a diagram illustrating pads provided on the rear surface of the second printed circuit board FCB24 according to an embodiment. Fig.11b yes Fig.11a FIG. 4 is an enlarged view of a partial area DDA of the second printed circuit board FCB24 shown in FIG.

[0154] because Fig.11a and Fig.11b The second printed circuit board FCB24 shown in FIG. Figure 8a and Figure 8b The second printed circuit board FCB21 shown in FIG. 1 has a similar configuration, so a repeated description will be omitted.

[0155] Reference Fig.11a and Fig.11b The second printed circuit board FCB24 includes alignment pads ALP41 and ALP42 and a signal pad SGP4. The alignment pads ALP41 and ALP42 and the signal pad SGP4 may be Figure 5 The substrate pad BPD shown in .

[0156] The spacing P41 between the alignment pad ALP41 and the first signal pad SGP41 may be constant along the second direction DR2. For example, the spacing P41 between the alignment pad ALP41 and the first signal pad SGP41 and the spacing P42 between the first signal pad SGP41 and the second signal pad SGP42 may be the same (P41=P42). In other words, the widths of the signal pads SGP4 are equal to each other (for example, W41=W42). Moreover, the width W43 of the alignment pad ALP41 may be constant. In this case, the anisotropic conductive film ACF (refer to Figure 7c ) space is limited. Therefore, when using anisotropic conductive film ACF (see Figure 7c ) connect the base pad BPD and the sensing pad SPD (refer to Figure 7c ) During thermal compression, the amount of the anisotropic conductive film ACF flowing out from the first side surface SS1 of the second printed circuit board FCB24 may increase.

[0157] Fig.12a yes Figure 8a FIG. 4 is an enlarged view of a partial area AA of the second printed circuit board FCB21 shown in FIG. Figure 12b yes Fig.11a FIG. 4 is an enlarged view of a partial area DDA of the second printed circuit board FCB24 shown in FIG.

[0158] Fig.12a The arrows OF11 to OF13 in FIG. 1 conceptually represent the amount of the anisotropic conductive film flowing out of the second printed circuit board FCB21, and the arrows IF11 to IF13 conceptually represent the amount of the anisotropic conductive film flowing out of the second printed circuit board FCB21 toward the alignment pad ALP11 (refer to FIG. 11 ). Figure 8a ) and the first signal pad SGP11 (refer to Figure 8a ) direction and the amount of anisotropic conductive film introduced and received.

[0159] Figure 12b The arrows OF41 to OF43 in 2000 conceptually represent the amount of the anisotropic conductive film flowing out from the second printed circuit board FCB24, and the arrows IF41 to IF43 conceptually represent the amount of the anisotropic conductive film introduced and received in the direction toward the alignment pad ALP41 and the first signal pad SGP41.

[0160] like Figure 8a , Figure 8b and Fig.12aAs shown in FIG, the second pitch P12 is greater than the first pitch P11 between the alignment pad ALP11 and the first signal pad SGP11. Therefore, the flowable anisotropic conductive film is more likely to be introduced and received in a direction toward the space between the alignment pad ALP11 and the first signal pad SGP11 (see arrow IF13) than leaking out from the second printed circuit board FCB21 (see arrow OF13).

[0161] like Fig.11a , Fig.11b and Figure 12b As shown in FIG. 1 , a conductive layer for accommodating an anisotropic conductive film ACF (see FIG. 1 ) between the alignment pad ALP41 and the first signal pad SGP41 is formed. Figure 7c ) is limited in the second printed circuit board FCB24. Therefore, in the anisotropic conductive film ACF having fluidity, the amount flowing out (see arrow OF43) from the second printed circuit board FCB24 is greater than the amount flowing in and received in (see arrow IF43) in the direction toward the space between the alignment pad ALP41 and the first signal pad SGP41.

[0162] also, Fig.12a The first height H11 of the alignment pad ALP11 shown in FIG. Figure 12b The second height H41 of the alignment pad ALP41 is shown in FIG.

[0163] In Settings Figure 12b In the area of ​​the alignment pad ALP41 of the second printed circuit board FCB24 shown in , the amount of anisotropic conductive film flowing out (see arrows OF41 and OF42) is greater than the amount of anisotropic conductive film flowing in and received in the direction in which the alignment pad ALP41 is set (see arrows IF41 and IF42).

[0164] In the second printed circuit board FCB21 according to an embodiment of the present invention, the amount of the anisotropic conductive film flowing in and received in the direction where the alignment pad ALP11 is set (see arrows IF11 and IF12) can be greater than the amount of the anisotropic conductive film flowing out from the area where the alignment pad ALP11 is set (see arrows OF11 and OF12).

[0165] Although described with reference to the embodiments, it will be understood by those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention described in the appended claims. In addition, the embodiments disclosed in the present invention are not intended to limit the technical concept of the present invention, and all technical concepts within the scope of the appended claims and equivalents should be understood to be included within the scope of the present invention.

[0166] Industrial Applicability

[0167] A technology for electrically and physically joining a pad of a circuit board and a pad of an input sensing panel using an anisotropic conductive material is one of the technologies required for producing a display device. In order to prevent defects in a production process, the display device of the present invention has high industrial applicability.

Claims

1. A display device, comprising: First panel; as well as A circuit board connected to one side of the first panel, Wherein, the circuit board comprises: a first pad; and A second pad is disposed adjacent to the first pad in a first direction, wherein the circuit board has a first side surface adjacent to the first panel, The first pad and the second pad have a predetermined length in a second direction intersecting the first direction. Wherein, the distance between the first pad and the second pad changes along the second direction from the first side surface of the circuit board.

2. The display device according to claim 1, wherein: A second spacing between the first solder pad and the second solder pad at a position farther from the first side surface of the circuit board in the second direction is greater than a first spacing between the first solder pad and the second solder pad at a position closer to the first side surface of the circuit board in the second direction.

3. The display device according to claim 1, wherein: The interval between the first pad and the second pad gradually increases as being away from the first side surface of the circuit board in the second direction.

4. The display device according to claim 1, wherein: At least one of a side of the first pad adjacent to the second pad and a side of the second pad adjacent to the first pad has a concave-convex shape, and a second spacing between the first pad and the second pad at a second point is greater than the first spacing at a first point, wherein the first point is at a protruding portion of the concave-convex shape, and the second point is at a concave portion of the concave-convex shape.

5. The display device according to claim 1, wherein: The first width of the first pad is greater than the second width, and a portion of the first pad having the first width is closer to the first side surface of the circuit board than a portion of the first pad having the second width.

6. The display device according to claim 1, wherein: The first width of the second pad is greater than the second width, and a portion of the second pad having the first width is closer to the first side surface of the circuit board than a portion of the second pad having the second width.

7. The display device according to claim 1, wherein: The first pad is an alignment pad, and the second pad is a signal pad.

8. The display device according to claim 1, wherein: The first panel is an input sensing panel including sensing electrodes.

9. The display device according to claim 8, wherein: The input sensing panel includes a sensing pad, Wherein, the second pad is electrically connected to the sensing pad.

10. The display device according to claim 9, further comprising: An anisotropic conductive film electrically connects the sensing pad and the second pad.

11. A display device, comprising: A display panel, including pixels; an input sensing panel disposed on an upper surface of the display panel and comprising sensing electrodes and sensing pads electrically connected to the sensing electrodes; as well as A circuit board connected to one side of the input sensing panel, Wherein, the circuit board comprises: a first pad; and a second pad disposed adjacent to the first pad in a first direction and electrically connected to the sensing pad, The circuit board has a first side surface adjacent to the input sensing panel. The first pad and the second pad have a predetermined length in a second direction intersecting the first direction. Wherein, the distance between the first pad and the second pad changes along the second direction from the first side surface of the circuit board.

12. The display device according to claim 11, further comprising: The optical component is disposed on the input sensing panel.

13. The display device according to claim 12, wherein: The first side surface of the circuit board is spaced apart from the optical member by a predetermined distance.

14. The display device according to claim 11, wherein: A second spacing between the first solder pad and the second solder pad at a position farther from the first side surface of the circuit board in the second direction is greater than a first spacing between the first solder pad and the second solder pad at a position closer to the first side surface of the circuit board in the second direction.

15. The display device according to claim 11, wherein: The interval between the first pad and the second pad gradually increases as being away from the first side surface of the circuit board in the second direction.

16. The display device according to claim 11, wherein: At least one of a side of the first pad adjacent to the second pad and a side of the second pad adjacent to the first pad has a concave-convex shape, and a second spacing between the first pad and the second pad at a second point is greater than the first spacing at a first point, wherein the first point is at a protruding portion of the concave-convex shape, and the second point is at a concave portion of the concave-convex shape.

17. The display device according to claim 11, wherein: The first width of the first pad is greater than the second width, and a portion of the first pad having the first width is closer to the first side surface of the circuit board than a portion of the first pad having the second width.

18. The display device according to claim 11, wherein: The first width of the second pad is greater than the second width, and a portion of the second pad having the first width is closer to the first side surface of the circuit board than a portion of the second pad having the second width.

19. The display device according to claim 11, wherein: The first pad is an alignment pad, and the second pad is a signal pad.

20. The display device according to claim 19, further comprising: An anisotropic conductive film electrically connects the sensing pad and the second pad.

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