Upper cover plate for drilling circuit board and manufacturing method thereof

Abstract

A cover plate for drilling a circuit board, comprising an aluminum-manganese alloy substrate, a lubricating layer and a hardening layer. The thickness of the aluminum-manganese alloy substrate ranges from 70 μm to 200 μm. The lubricating layer is located on the aluminum-manganese alloy substrate, and the thickness of the lubricating layer ranges from 25 μm to 70 μm. The lubricating layer comprises a lubricating resin and a binding resin, the weight percentage of the lubricating resin in the lubricating layer is 45% to 75%, and the weight percentage of the binding resin in the lubricating layer is 25% to 55%. The hardening layer is located on the side of the aluminum-manganese alloy substrate opposite to the lubricating layer. The thickness of the hardening layer ranges from 1 μm to 6 μm, and the hardening layer comprises a hard resin and a hardener, and the hard resin and the hardener are mixed. The hard resin comprises at least one of acrylic, polyurethane, and epoxy resin, and the hardener comprises at least one of an amino hardener and an isocyanate hardener.

Description

Technical Field

[0001] The invention relates to a process tool for a printed circuit board, in particular to an upper cover plate for drilling a hole in the circuit board and a manufacturing method thereof. Background Art

[0002] In recent years, due to the evolution of integrated circuit technology, the number of electronic components in a single electronic product has increased significantly, and the size of the electronic components has been greatly reduced. In other words, the density of electronic components per unit area on the circuit board has been greatly increased.

[0003] In order to achieve high-density electronic component configuration, multiple layers of circuit boards are stacked on top of each other, and drilling technology is used to penetrate the joints between layers so that the circuits are connected to achieve series connection between electronic components. Summary of the invention

[0004] When drilling holes, it is necessary to use a plate to locate the desired drilling position of the circuit board. Generally speaking, urea plates are used as upper cover plates for drilling, with a thickness of about 200μm to 400μm. However, their hardness is limited and requires additional process adjustments, which increases costs.

[0005] In view of this, an object of the present invention is to provide a circuit board drilling cover plate applicable to different drilling operation requirements and a manufacturing method thereof.

[0006] In some embodiments, a cover plate for drilling a circuit board includes an aluminum-manganese alloy substrate and a lubricating layer. The thickness of the aluminum-manganese alloy substrate ranges from 70 μm to 200 μm. The lubricating layer is located on the aluminum-manganese alloy substrate, and the thickness of the lubricating layer ranges from 25 μm to 70 μm. The lubricating layer includes a lubricating resin and a binding resin, the weight percentage of the lubricating resin in the lubricating layer is 45% to 75%, and the weight percentage of the binding resin in the lubricating layer is 25% to 55%.

[0007] In some embodiments, the thickness of the aluminum-manganese alloy substrate is 180 μm.

[0008] In some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.3% to 1.5%. Furthermore, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 1.0% to 1.5%.

[0009] In some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.01% to 1.0%. Furthermore, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.5% to 1.0%.

[0010] In some embodiments, the upper cover plate for drilling a circuit board further includes a hardening layer located on the side of the aluminum-manganese alloy substrate opposite to the lubricating layer. The thickness of the hardening layer ranges from 1 μm to 6 μm, and the hardening layer includes a hard resin and a hardener, and the hard resin and the hardener are mixed. The hard resin includes at least one of acrylic, polyurethane, and epoxy resin, and the hardener includes at least one of an amino hardener and an isocyanate hardener.

[0011] In some embodiments, the weight percentage of the hard resin in the hardened layer is 80% to 95%, and the weight percentage of the hardener in the hardened layer is 5% to 20%.

[0012] Furthermore, another embodiment of the present invention provides a method for manufacturing a top cover plate for drilling a circuit board, comprising a lubricating component adding step and a lubricating component drying step. The lubricating component adding step comprises adding a lubricating component to an aluminum-manganese alloy substrate to form a semi-finished top cover plate for drilling, wherein the lubricating component comprises a lubricating resin and a binding resin, the weight percentage of the lubricating resin in the lubricating component is 45% to 75%, and the weight percentage of the binding resin in the lubricating component is 25% to 55%. The lubricating component drying step comprises drying the lubricating component of the semi-finished top cover plate for drilling at a drying temperature to obtain the top cover plate for drilling, wherein the drying temperature is 80°C to 180°C. The top cover plate for drilling comprises an aluminum-manganese alloy substrate and a lubricating layer, the thickness of the aluminum-manganese alloy substrate ranges from 70μm to 200μm, and the thickness of the lubricating layer ranges from 25μm to 70μm.

[0013] In some embodiments, the manufacturing method of the upper cover plate for drilling circuit boards further includes a hardening component adding step and a hardening component drying step. The hardening component adding step includes adding a hardening component on the side of the aluminum-manganese alloy substrate opposite to the lubricating component, wherein the hardening component includes a hard resin and a hardener, and the hard resin and the hardener are mixed, wherein the hard resin includes at least one of acrylic, polyurethane, and epoxy resin, and the hardener includes at least one of an amino hardener and an isocyanate hardener. The hardening component drying step includes drying the hardening component at a drying temperature to obtain a hardened layer, wherein the drying temperature is 60°C to 180°C, the drying time is 1 minute to 2 minutes, and the thickness of the hardened layer ranges from 1μm to 6μm.

[0014] In some embodiments, the lubricating resin includes at least one of nonyl phenol polyethyleneglycol ether, polyethylene glycol (PEG), polyethyleneoxide (PEO), polyvinyl alcohol (PVA), and acrylic acid; the bonding resin includes at least one of epoxy resin, acrylic resin, oriented polypropylene (OPP), polyethylene terephthalate (PET), polyurethane (PU), polymerized siloxanes, polyether-siloxane copolymer branched siloxane copolymer, and polyvinyl pyrrolidone (PVP).

[0015] To sum up, in one or more embodiments of the present invention, the upper cover plate for drilling circuit boards can provide appropriate hardness through the aluminum-manganese alloy substrate; in some embodiments, in addition to providing the hardness of the aluminum-manganese alloy substrate itself, the upper cover plate for drilling circuit boards can further improve the hardness through the configuration of a hardening layer, thereby being suitable for different drilling operation requirements.

[0016] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A cross-sectional schematic diagram of an upper cover plate for drilling a circuit board according to a first embodiment of the present invention is shown;

[0018] Figure 2 A cross-sectional schematic diagram of a top cover plate for drilling a circuit board according to a second embodiment of the present invention is shown;

[0019] Figure 3 A flow chart showing a method for manufacturing a top cover plate for drilling a circuit board according to a third embodiment of the present invention;

[0020] Figure 4 A flow chart of a method for manufacturing a top cover plate for drilling a circuit board according to a fourth embodiment of the present invention is shown.

[0021] Among them, the reference numerals

[0022] S40-S43: Steps 100, 200: Upper cover plate for drilling holes in circuit board

[0023] 10: Aluminum-manganese alloy substrate

[0024] 20: Lubricating layer

[0025] 21: Lubricating resin

[0026] 22: Binding resin

[0027] 30: Hardened layer

[0028] 31:Hard resin

[0029] 32: Hardener DETAILED DESCRIPTION

[0030] The structural principle and working principle of the present invention are described in detail below in conjunction with the accompanying drawings:

[0031] See also Figure 1 , a cross-sectional view of a top cover plate for drilling a circuit board according to a first embodiment of the present invention is shown. Figure 1 As shown, in this embodiment, the upper cover plate 100 for drilling a circuit board includes an aluminum-manganese alloy substrate 10 and a lubricating layer 20. The lubricating layer 20 is located on the aluminum-manganese alloy substrate 10. Thus, the aluminum-manganese alloy substrate 10 can provide rigidity, and the lubricating layer 20 can achieve lubrication.

[0032] In some embodiments, the thickness of the aluminum-manganese alloy substrate 10 ranges from 70 μm to 200 μm, and the thickness of the lubricating layer 20 ranges from 25 μm to 70 μm.

[0033] In some embodiments, the thickness of the aluminum-manganese alloy substrate 10 is 180 μm.

[0034] In some embodiments, the aluminum-manganese alloy substrate 10 is made of 3 series aluminum alloy material, in other words, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 0.3% to 1.5%. Furthermore, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 1.0% to 1.5%.

[0035] In some embodiments, the aluminum-manganese alloy substrate 10 is made of 5 series aluminum alloy material, in other words, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 0.01% to 1.0%. Furthermore, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 0.5% to 1.0%.

[0036] Therefore, by using the aluminum-manganese alloy substrate 10 containing different proportions, it can be suitable for the drilling process of circuit boards with different softness and hardness, thereby improving the flexibility of the process.

[0037] The lubricating layer 20 includes a lubricating resin 21 and a bonding resin 22 . The weight percentage of the lubricating resin 21 in the lubricating layer 20 is 45% to 75%, and the weight percentage of the bonding resin 22 in the lubricating layer 20 is 25% to 55%.

[0038] In some embodiments, the lubricating layer 20 can be tightly disposed on the aluminum-manganese alloy substrate 10 by using a coating head, roller coating, spin coating, laminating, spraying, screen printing or other film-making methods to avoid debonding during drilling.

[0039] In some embodiments, the lubricating resin 21 includes at least one of nonylphenolpolyethylene glycol ether, polyethylene glycol (PEG), polyethylene oxide (PEO), polyvinyl alcohol (PVA), and acrylic acid; the bonding resin 22 includes at least one of epoxy resin, acrylic resin, oriented polypropylene (OPP), polyethylene terephthalate (PET), polyurethane (PU), silicone resin (polymerized siloxanes), polyether-siloxane copolymer branched siloxane copolymer, and polyvinyl pyrrolidone (PVP).

[0040] The lubricating layer 20 can cover and lubricate the drill needle when the drill needle enters, thereby reducing the rigid impact between the drill needle and the aluminum-manganese alloy substrate 10, helping to guide the drill needle into the aluminum-manganese alloy substrate 10 and the circuit board, and reducing the wear of the drill needle.

[0041] See also Figure 2 , depicts a schematic diagram of the structure of a top cover plate for drilling a circuit board according to a second embodiment of the present invention. Figure 2 As shown, in this embodiment, the upper cover plate 200 for drilling a circuit board further includes a hardening layer 30 located on a side of the aluminum-manganese alloy substrate 10 opposite to the lubricating layer 20 .

[0042] In this embodiment, the thickness of the hardening layer 30 ranges from 1 μm to 6 μm, and the hardening layer 30 includes a hardening resin 31 and a hardening agent 32, wherein the hardening resin 31 is mixed with the hardening agent 32. The hardening resin 31 includes at least one of acrylic, polyurethane, and epoxy resin, and the hardening agent 32 includes at least one of an amino hardener and an isocyanate hardener.

[0043] In some embodiments, the weight percentage of the hard resin 31 in the hardening layer 30 is 80% to 95%, and the weight percentage of the hardener 32 in the hardening layer 30 is 5% to 20%.

[0044] In this embodiment, the hardness of the upper cover plate 200 for drilling a circuit board can be further improved by configuring the hardening layer 30 , thereby meeting different process requirements.

[0045] Please refer to Figure 3 , depicts a flow chart of a method for manufacturing a top cover plate for drilling a circuit board according to a third embodiment of the present invention. Figure 3 As shown, in this embodiment, the manufacturing method of the upper cover plate for drilling a circuit board includes a lubricating component adding step S40 and a lubricating component drying step S41.

[0046] See also Figure 3 The aforementioned lubricating component adding step S40 includes: adding lubricating components to the aluminum-manganese alloy substrate to form a semi-finished upper cover plate for drilling. The lubricating components include lubricating resins and binding resins. Moreover, the lubricating components will form a lubricating layer after the subsequent lubricating component drying step S41, and the proportions of the various components in the lubricating layer have been described in the aforementioned embodiment and will not be repeated. It should be noted that in this step, the lubricating component can be arranged on the aluminum-manganese alloy substrate by a coating head, roller coating, spin coating, laminating, spraying, screen printing and other film-making methods.

[0047] See also Figure 3 The aforementioned lubricating component drying step S41 includes: drying the lubricating component of the semi-finished upper cover plate for drilling at a drying temperature to obtain the upper cover plate for drilling, and the drying temperature is 80°C to 180°C. For example, the lubricating component drying step S41 can be achieved by configuring a heating device (such as an oven) with a conveyor belt on the production line, and the drying time can also be adjusted by controlling the speed of the conveyor belt and changing the size of the heating device. In one or more embodiments, the drying time can be 2 to 5 minutes; in one or more embodiments, the drying time can be further 3 minutes.

[0048] See also Figure 4 , depicts a flow chart of a method for manufacturing a top cover plate for drilling a circuit board according to a fourth embodiment of the present invention. Figure 4 As shown, in this embodiment, the manufacturing method of the upper cover plate for drilling a circuit board further includes a hardening component adding step S42 and a hardening component drying step S43.

[0049] See also Figure 4The aforementioned hardening component adding step S42 includes: adding a hardening component on the side of the aluminum-manganese alloy substrate opposite to the lubricating component. The hardening component includes a hard resin and a hardener mixed with the hard resin. Moreover, the hardening component forms a hardened layer after the subsequent hardening component drying step S43, and the proportion of each component in the hardened layer has been described in the aforementioned embodiment and will not be repeated here.

[0050] See also Figure 4 The aforementioned hardening component drying step S43 includes: drying the hardening component at a drying temperature to obtain a hardened layer, wherein the drying temperature is 60°C to 180°C, and the drying time is 1 minute to 2 minutes. Similarly, the hardening component drying step S43 can be achieved by configuring a heating device (such as an oven) with a conveyor belt on the production line, and the drying time can also be adjusted by controlling the speed of the conveyor belt and changing the size of the heating device.

[0051] It should be noted that if there are no logical errors in the aforementioned steps, they can be performed simultaneously or in a different order. For example, the lubricating component adding step S40 and the lubricating component drying step S41 can be performed first, and then the hardening component adding step S42 and the hardening component drying step S43 can be performed; or the hardening component adding step S42 and the hardening component drying step S43 can be performed first, and then the lubricating component adding step S40 and the lubricating component drying step S41 can be performed.

[0052] In an experimental example, the components and their proportions used in the process of the finished upper cover plates for drilling circuit boards (hereinafter referred to as control group plates, sample 1 plates, sample 2 plates and sample 3 plates, respectively) are shown in Table 1. When the water therein escapes, a lubricating layer 20 having a weight percentage of the lubricating resin 21 and the binding resin 22 in the above-mentioned proportion range can be obtained. And from Table 1, it can be seen that compared with the control group plates (general urea plates), the sample 1 plates, the sample 2 plates and the sample 3 plates all have a higher Shore D hardness.

[0053] Table 1

[0054]

[0055] In another experimental example, the components and their proportions used in the process of the finished plate products (hereinafter referred to as the control group plate, sample 4 plate, sample 5 plate and sample 6 plate) are shown in Table 2. When the water therein escapes, a lubricating layer 20 with a weight percentage of the lubricating resin 21 and the binding resin 22 in the above-mentioned proportion range can be obtained, and a hardening layer 30 with a weight percentage of the hard resin 31 and the hardener 32 in the above-mentioned proportion range can be obtained. And from Table 2, it can be seen that compared with the control group plate (general urea plate), the sample 4 plate, the sample 5 plate and the sample 6 plate all have higher Shore hardness.

[0056] Table 2

[0057]

[0058] In addition, the circuit board drilling cover plate 100 / 200 disclosed in one or more embodiments of the present invention can be applied to different drilling processes. Specifically, one method is a back drilling process, that is, one side of the circuit board corresponds to the lubricating layer 20 of the circuit board drilling cover plate 100 / 200, and the drill needle drills from the other side of the circuit board. Another method is that the circuit board corresponds to the hardening layer 30, and the drill needle drills from the side of the circuit board drilling cover plate 100 / 200 with the lubricating layer 20.

[0059] To sum up, in one or more embodiments of the present invention, the upper cover plate for drilling circuit boards can provide appropriate hardness through the aluminum-manganese alloy substrate; in some embodiments, in addition to providing the hardness of the aluminum-manganese alloy substrate itself, the upper cover plate for drilling circuit boards can further improve the hardness through the configuration of a hardening layer, thereby being suitable for different drilling operation requirements.

[0060] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A cover plate for drilling a circuit board, characterized in that: include: An aluminum-manganese alloy substrate, wherein the thickness of the aluminum-manganese alloy substrate ranges from 70 μm to 200 μm; a lubricating layer located on the aluminum-manganese alloy substrate, wherein the thickness of the lubricating layer ranges from 25 μm to 70 μm, wherein the lubricating layer comprises a lubricating resin and a binding resin, wherein the weight percentage of the lubricating resin in the lubricating layer is 45% to 75%, and the weight percentage of the binding resin in the lubricating layer is 25% to 55%; as well as A hardened layer is located on the side of the aluminum-manganese alloy substrate opposite to the lubricating layer, and the thickness of the hardened layer ranges from 1 μm to 6 μm, wherein the hardened layer includes a hard resin and a hardener, and the hard resin and the hardener are mixed, wherein the hard resin includes at least one of acrylic, polyurethane, and epoxy resin, and wherein the hardener includes at least one of an amino hardener and an isocyanate hardener.

2. The upper cover plate for drilling a circuit board according to claim 1, characterized in that: The weight percentage of manganese in the aluminum-manganese alloy substrate is 0.3% to 1.5%.

3. The upper cover plate for drilling a circuit board according to claim 2, characterized in that: The weight percentage of manganese in the aluminum-manganese alloy substrate is 1.0% to 1.5%.

4. The upper cover plate for drilling a circuit board according to claim 1, characterized in that: The weight percentage of manganese in the aluminum-manganese alloy substrate is 0.01% to 1.0%.

5. The upper cover plate for drilling a circuit board according to claim 4, characterized in that: The weight percentage of manganese in the aluminum-manganese alloy substrate is 0.5% to 1.0%.

6. The upper cover plate for drilling a circuit board according to claim 1, characterized in that: The weight percentage of the hard resin in the hardened layer is 80% to 95%, and the weight percentage of the hardener in the hardened layer is 5% to 20%.

7. A method for manufacturing an upper cover plate for drilling a circuit board, characterized in that: include: a lubricating component adding step: adding a lubricating component to an aluminum-manganese alloy substrate to form a semi-finished upper cover plate for drilling, wherein the lubricating component includes a lubricating resin and a binding resin, the weight percentage of the lubricating resin in the lubricating component is 45% to 75%, and the weight percentage of the binding resin in the lubricating component is 25% to 55%; a lubricating component drying step: drying the lubricating component of the semi-finished upper cover plate for drilling at a drying temperature to obtain an upper cover plate for drilling, wherein the drying temperature is 80° C. to 180° C., the upper cover plate for drilling comprises the aluminum-manganese alloy substrate and a lubricating layer, the thickness of the aluminum-manganese alloy substrate ranges from 70 μm to 200 μm, and the thickness of the lubricating layer ranges from 25 μm to 70 μm; a hardening component adding step: adding a hardening component to the side of the aluminum-manganese alloy substrate opposite to the lubricating component, wherein the hardening component includes a hardening resin and a hardening agent, the hardening resin and the hardening agent are mixed, wherein the hardening resin includes at least one of acrylic, polyurethane, and epoxy resin, wherein the hardening agent includes at least one of an amino hardening agent and an isocyanate hardening agent; and A hardening component drying step: drying the hardening component at a drying temperature to obtain a hardened layer, wherein the drying temperature is 60° C. to 180° C., the drying time is 1 minute to 2 minutes, and the thickness of the hardened layer ranges from 1 μm to 6 μm.

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