A circuit board anti-stacking system and method

Abstract

This application discloses a circuit board anti-overlapping system and method. The method includes conveying circuit boards via a conveying device. When the circuit board is conveyed to the position corresponding to a thickness detection device, a controller stops the conveying device and controls the thickness detection device to detect the thickness of the circuit board. In response to a first detected thickness exceeding a set thickness, the controller controls the conveying device to reverse the conveying device to a first set distance, and then stops the conveying device. The first set distance is greater than the distance the circuit board travels in the conveying direction after passing the thickness detection device. Circuit boards with a first detected thickness exceeding the set thickness are processed, and after processing, the circuit board anti-overlapping system is reset so that a second thickness detection can be performed on the processed circuit boards. This application can fundamentally prevent overlapping boards from flowing into the processing line, avoiding the problems of board scrapping and waste, thereby improving production efficiency and product quality.

Description

Technical Field

[0001] This application relates to the field of circuit board processing, and in particular to a circuit board anti-overlapping system and method. Background Technology

[0002] Printed Circuit Boards (PCBs) are extremely important materials in electronic products, and with the development of 5G technology, the demand for PCBs is increasing. PCBs are usually stacked together. When an automatic board placement machine picks up PCBs through a suction nozzle, due to static electricity or attraction between the boards, multiple PCBs often overlap, which can even scratch the PCBs, affecting production efficiency and product quality.

[0003] Since it is currently impossible to completely eliminate static electricity or attraction between boards, existing technologies generally involve adding anti-overlapping devices to intercept overlapping PCBs before processing, and then manually handling them. After one manual handling, the PCBs are allowed to flow into the next process.

[0004] However, during a single processing step, it is inevitable that there will be problems with the stacked boards flowing out due to human negligence, which will lead to the scrapping of boards in subsequent processing, resulting in serious production cost losses. In some cases, some overlapping boards may even flow out to customers, causing customer complaints and seriously affecting the company's reputation. Summary of the Invention

[0005] The main technical problem addressed by this application is to provide a circuit board anti-overlapping system and method. By repeatedly detecting the thickness of the circuit board and intercepting overlapping components, as well as having staff repeatedly check and handle overlapping components, the problem of overlapping components being leaked can be solved.

[0006] To solve the above-mentioned technical problems, the first technical solution adopted in this application is to provide a circuit board anti-overlapping system. The circuit board anti-overlapping system includes baffles, a conveying device, a thickness detection device, and a controller. The conveying device is disposed between the baffles and is used to convey the circuit board. The thickness detection device is disposed perpendicular to the baffles and located on the conveying path of the circuit board and is used to detect the thickness of the circuit board. The controller is integrated into an external device and is used to control the conveying direction of the conveying device and control the thickness detection device to perform thickness detection.

[0007] The thickness detection device includes a support device, a telescopic device, and a pressure roller. The support device is set on the conveying path of the circuit board and includes multiple brackets and a crossbeam set between the brackets. One end of the telescopic device is set on the crossbeam, and the other end is connected to the pressure roller to drive the pressure roller to rise and fall.

[0008] The thickness detection device also includes a measuring device, which is used to determine the length of the telescopic device based on the position of the pressure roller.

[0009] The circuit board anti-overlapping system also includes an alarm.

[0010] The controller includes a programmable logic controller (PLC) to enable the circuit board anti-overlapping system to be linked with external devices.

[0011] To solve the above-mentioned technical problems, the second technical solution adopted in this application is to provide a method for preventing circuit board stacking. This method is implemented through a circuit board anti-stacking system, which includes baffles, a conveying device, a thickness detection device, and a controller. The conveying device is disposed between the baffles for conveying the circuit boards. The thickness detection device is disposed perpendicular to the baffles and located on the conveying path of the circuit boards for detecting the thickness of the circuit boards. The controller is integrated into an external device for controlling the conveying direction of the conveying device and controlling the thickness detection device to perform thickness detection. The circuit board anti-stacking method includes: conveying the circuit boards through the conveying device. When the circuit board is conveyed to the position corresponding to the thickness detection device, the controller controls the conveying device to stop conveying and controls the thickness detection device to detect the thickness of the circuit board. In response to the first detected thickness being greater than the set thickness, the controller controls the conveying device to reverse the conveying device to the first set distance and then controls the conveying device to stop conveying. The first set distance is greater than the distance the circuit board travels in the conveying direction after passing the thickness detection device. Circuit boards with the first detected thickness being greater than the set thickness are processed, and after processing, the circuit board anti-overlapping system is reset so that the processed circuit board can be subjected to a second thickness detection.

[0012] The steps of processing circuit boards whose first detected thickness exceeds the set thickness, and resetting the circuit board anti-overlapping system after processing to allow for a second thickness detection of the processed circuit boards, specifically include: processing circuit boards whose first detected thickness exceeds the set thickness, resetting the circuit board anti-overlapping system after processing to continue conveying the processed circuit boards; when the processed circuit boards are conveyed to the position corresponding to the thickness detection device, the controller stops the conveying device and controls the thickness detection device to detect the thickness of the processed circuit boards.

[0013] The process includes the following steps: when the processed circuit board is conveyed to the position corresponding to the thickness detection device, the controller stops the conveying device and controls the thickness detection device to detect the thickness of the processed circuit board. The process further includes: in response to a second detected thickness exceeding a set thickness, the controller controls the conveying device to reverse the conveying of the processed circuit board to a second set distance, and then stops the conveying device; the second set distance is greater than the distance the processed circuit board travels in the conveying direction after passing the thickness detection device; the processed circuit board with a second detected thickness exceeding the set thickness undergoes secondary processing, and after processing, the circuit board anti-overlapping system is reset so that a third thickness detection can be performed on the reprocessed circuit board; the above steps are repeated until the detected thickness of the circuit board after multiple processing steps is less than the set thickness, and then the controller controls the conveying device to convey the circuit board after multiple processing steps to the next process.

[0014] The process includes, after the circuit board is conveyed by a conveying device, and when the circuit board is conveyed to the position corresponding to the thickness detection device, the controller stops the conveying device and controls the thickness detection device to detect the thickness of the circuit board. The process further includes, in response to the first detected thickness being equal to the set thickness, the controller controls the conveying device to convey the circuit board to the next process.

[0015] The circuit board anti-overlapping system also includes an alarm; in response to the first detected thickness being greater than a set thickness, the controller controls the conveying device to reverse the transmission of the circuit board to a first set distance, and then controls the conveying device to stop transmission; the step of the first set distance being greater than the distance the circuit board travels in the transmission direction after passing the thickness detection device also includes: in response to the first detected thickness being greater than the set thickness, the controller controls the alarm to output an alarm.

[0016] The beneficial effects of this application are as follows: Unlike the prior art, this application uses a circuit board anti-overlapping system to detect the thickness of the circuit board multiple times, intercept overlapping boards multiple times, and has staff check and handle overlapping boards multiple times. This can prevent overlapping boards from flowing into the processing line at the source, avoid the problem of board scrapping and waste during processing, thereby improving production efficiency and product quality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of one embodiment of the circuit board anti-overlapping system of this application;

[0019] Figure 2 yes Figure 1 A schematic diagram of the thickness detection device in a non-working state in one embodiment of the circuit board anti-overlapping system;

[0020] Figure 3 This is a flowchart illustrating one embodiment of the circuit board anti-overlapping method of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless otherwise clearly indicated above. “Multiple” generally includes at least two, but does not exclude the inclusion of at least one.

[0023] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0024] It should be understood that the terms "comprising," "including," or any other variations used herein are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0025] Printed Circuit Boards (PCBs) are extremely important materials in electronic products, and with the development of 5G technology, the demand for PCBs is increasing. PCBs are usually stacked together. When an automatic board placement machine picks up PCBs through a suction nozzle, due to static electricity or attraction between the boards, multiple PCBs often overlap, which can even scratch the PCBs, affecting production efficiency and product quality.

[0026] Since it is currently impossible to completely eliminate static electricity or attraction between boards, existing technologies generally involve adding anti-overlapping devices to intercept overlapping PCBs before processing, and then manually handling them. After one manual handling, the PCBs are allowed to flow into the next process.

[0027] However, people are the most uncontrollable factor. In a single processing process, it is inevitable that there will be problems such as the loss of stacked boards due to human negligence. For example, when an abnormal stacking alarm is triggered, whether the staff handles it in a timely manner, whether the handling complies with the document regulations, and whether the abnormal stacking boards are completely removed are all issues that can lead to the loss of stacked boards, resulting in the scrapping of boards in subsequent processing, causing serious production cost losses. Some overlapping boards may even be lost to customers, causing customer complaints and seriously affecting the company's reputation.

[0028] Based on the above, this application provides a circuit board anti-overlapping system and method. By repeatedly detecting the thickness of the circuit board and intercepting overlapping boards multiple times, and by having staff repeatedly check and handle overlapping boards, the problem of overlapping boards can be solved.

[0029] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of one embodiment of the circuit board anti-overlapping system of this application. Figure 2 yes Figure 1 A schematic diagram of the thickness detection device in a non-operating state in one embodiment of the circuit board anti-overlapping system.

[0031] In this embodiment, the circuit board anti-overlapping system 100 includes a baffle 1, a conveying device 2, a thickness detection device 3, and a controller (not shown).

[0032] The conveying device 2 is disposed between the baffles 1 and is used to convey the circuit board 4; the thickness detection device 3 is disposed perpendicular to the baffles 1 and is located on the conveying path of the circuit board 4 and is used to detect the thickness of the circuit board 4; the controller is integrated into an external device and is used to control the conveying direction of the conveying device 2 and control the thickness detection device 3 to perform thickness detection.

[0033] Depending on the size and spacing of the circuit boards 4, at least one row of boards can be placed on the conveying device 2. In this embodiment, two rows of circuit boards 4 are placed in parallel on the conveying device 2. In other embodiments, three, four or more rows of circuit boards 4 can be placed in parallel on the conveying device 2. This application does not limit this.

[0034] The controller includes a programmable logic controller (PLC) integrated into an external device to enable the circuit board anti-overlapping system 100 to be linked with the external device. The external device can be any electronic device with analysis and display functions, such as a laptop or desktop computer.

[0035] The thickness detection device 3 includes a support device 31, a telescopic device 32, and a pressure roller 33. The support device 31 is set on the conveying path of the circuit board 4 and includes multiple supports and a crossbeam set between the supports. One end of the telescopic device 32 is set on the crossbeam and the other end is connected to the pressure roller 33 to drive the pressure roller 33 to rise and fall.

[0036] The thickness detection device 3 also includes a measuring device (not shown in the figure), which is used to determine the length of the telescopic device 32 based on the position of the pressure roller 33.

[0037] A sensor (not shown) is installed below the pressure roller 33, located within the gap of the conveying device 2. When the circuit board 4 is conveyed to the area below the pressure roller 33, the sensor transmits the information about the circuit board 4 to the controller. The controller then stops the conveying device 2 and controls the thickness detection device 3 to detect the thickness of the circuit board. After the thickness detection device 3 completes the thickness detection, the controller controls the conveying device 2 to continue conveying the circuit board 4 in the conveying direction.

[0038] Specifically, during thickness detection, the telescopic device 32 lowers the pressure roller 33, causing it to press against the circuit board 4. The measuring device determines the length 'a' of the telescopic device 32 based on the position of the pressure roller 33, and then rotates 'a' back to the controller. The controller then determines the first detection thickness of the circuit board 4 based on 'a' and 'b' when the telescopic device 32 is in a non-working state. The obtained first detection thickness is compared with the set thickness of the circuit board 4 stored in the controller to determine whether the circuit board 4 is an overlapping board. After the measurement is completed, the telescopic device 32 raises the pressure roller 33, and the controller controls the conveying device 2 to continue conveying the circuit board 4 in the conveying direction.

[0039] In this embodiment, if the first detected thickness is greater than a set thickness, the controller controls the conveying device 2 to reverse the transmission of the circuit board 4 to the first set distance, and then controls the conveying device 2 to stop conveying. The first set distance is greater than the distance the circuit board 4 travels in the conveying direction after passing the thickness detection device 3. It can be understood that when the reverse conveying distance is greater than the forward conveying distance, it ensures that the circuit board 4, which has undergone thickness detection, will not stop below the thickness detection device 3, facilitating the operator's handling of abnormal components.

[0040] In existing technologies, after the thickness detection device detects stacked boards, the telescopic device remains extended, meaning the pressure roller is still tightly pressed against the circuit board. Operators must manually release the extended telescopic device to handle abnormal boards. For ease of operation, operators often visually inspect and manually remove the rows or rows of boards pre-determined from the pressure roller's compression state for abnormality handling. However, this is not only non-compliant but also easily scratches the boards. In this embodiment, the thickness detection device 3 raises the pressure roller 33 immediately after detection, and the circuit board 4 that has undergone thickness detection does not remain below the thickness detection device 3, avoiding being pressed by the pressure roller 33. This also facilitates observation and operation by the operator, preventing damage to the circuit board 4.

[0041] Furthermore, after manual processing is completed, the circuit board anti-overlapping system 100 can perform a second inspection on the circuit board 4 that has undergone the initial inspection through a reset operation, so as to avoid the possibility that there are still overlapping boards that have not been processed due to human negligence.

[0042] Understandably, when multiple rows of circuit boards 4 are placed in parallel on the conveying device 2, even if the controller detects that the first detection thickness of the circuit board 4 is greater than the set thickness, it cannot determine which row has overlapping boards. For example, if 5 rows are placed, there may be overlapping boards in one row, or there may be overlapping boards in two or three rows. Therefore, manual intervention is required to confirm the boards in each row one by one and to completely process the overlapping boards.

[0043] In existing technologies, the outflow of overlapping boards often occurs because operators fail to completely confirm the number of rows of overlapping boards. For example, when processing 5 rows simultaneously, overlapping boards may appear in 3 rows. However, during a single processing run, the operator may only process 2 rows of overlapping boards, leaving 1 row unprocessed. In this case, after the equipment resets and the pressure rollers rise, the unprocessed row of overlapping boards will enter the line for processing along with the other normal boards. If the operator at the end of the line fails to detect the overlapping boards in time, the overlapping boards will be scrapped, or some overlapping boards will be outflowed, resulting in significant production cost losses. In this embodiment, since the first set distance is greater than the distance the circuit board 4 travels in the conveying direction after passing through the thickness detection device 3, the thickness detection device 3 can also perform a secondary inspection on the circuit board 4 that has already undergone the initial inspection. Through multiple inspections and processing, overlapping boards can be prevented from flowing into the processing line at the source, avoiding the problems of board scrapping and waste during processing, thereby improving production efficiency and product quality.

[0044] Furthermore, in this embodiment, the circuit board anti-overlapping system 100 also includes an alarm (shown in the figure). Understandably, when the controller determines that overlapping boards have occurred, it will control the alarm to output an alarm, so as to warn the operator to check and handle the abnormal boards in a timely manner.

[0045] Unlike existing technologies, this implementation method uses a circuit board anti-overlapping system to detect the thickness of circuit board 4 more than 100 times, repeatedly intercepting overlapping boards and alerting operators to repeatedly check and handle overlapping boards. This fundamentally prevents overlapping boards from flowing into the processing line, avoiding board scrap and waste during processing, thereby improving production efficiency and product quality. Furthermore, since the controller controls the conveyor 2 to reverse the circuit board 4 to a set distance each time an overlapping board is detected, it also prevents the circuit board 4 from stopping below the thickness detection device 3, facilitating operator observation and handling, further preventing damage to the circuit board 4, and thus improving product quality.

[0046] Correspondingly, this application provides a method for preventing circuit board stacking.

[0047] Specifically, please refer to Figure 3 , Figure 3 This is a flowchart illustrating one embodiment of the circuit board anti-overlapping method of this application. In this embodiment, the circuit board anti-overlapping method is implemented through a circuit board anti-overlapping system, which includes baffles, a conveying device, a thickness detection device, and a controller. The conveying device is disposed between the baffles and is used to convey the circuit boards. The thickness detection device is disposed perpendicular to the baffles and located on the conveying path of the circuit boards, and is used to detect the thickness of the circuit boards. The controller is integrated into an external device and is used to control the conveying direction of the conveying device and control the thickness detection device to perform thickness detection.

[0048] like Figure 3 As shown, methods to prevent circuit board stacking include:

[0049] S31: The circuit board is conveyed by the conveying device. When the circuit board is conveyed to the position corresponding to the thickness detection device, the controller controls the conveying device to stop conveying and controls the thickness detection device to detect the thickness of the circuit board.

[0050] In this embodiment, the thickness detection device includes a support device, a telescopic device, and a pressure roller; the support device is set on the conveying path of the circuit board, and the support device includes multiple brackets and a crossbeam set between the brackets; one end of the telescopic device is set on the crossbeam, and the other end is connected to the pressure roller to drive the pressure roller to rise and fall.

[0051] Specifically, when the circuit board is conveyed to the position corresponding to the thickness detection device, the controller stops the conveying device and controls the telescopic device to lower the pressure roller, so that the pressure roller and the circuit board are in a pressing state. The length 'a' of the telescopic device is determined according to the position of the pressure roller. The controller then determines the first detection thickness of the circuit board based on length 'a' and the length 'b' of the telescopic device 32 when it is not in the working state. The obtained first detection thickness is compared with the set thickness of the circuit board stored in the controller to determine whether the circuit board is an overlapping board. After the measurement is completed, the controller controls the telescopic device to raise the pressure roller and controls the conveying device to continue conveying the circuit board in the conveying direction.

[0052] In this embodiment, in response to the first detected thickness being equal to a set thickness, the controller controls the conveying device to convey the circuit board to the next process. It can be understood that the first detected thickness being equal to the set thickness indicates that no overlapping boards have occurred, and the circuit board can be directly conveyed to the next process.

[0053] S32: In response to the first detected thickness being greater than the set thickness, the controller controls the conveying device to reverse the transmission of the circuit board to the first set distance and then controls the conveying device to stop the transmission; the first set distance is greater than the distance the circuit board travels in the transmission direction after passing the thickness detection device.

[0054] Understandably, when the first set distance is greater than the distance the circuit board travels in the conveying direction after passing the thickness detection device, it can ensure that the circuit board that has undergone thickness detection will not stop below the thickness detection device, making it easier for operators to handle abnormal boards and avoid damage to the board surface. Furthermore, after the operator handles the abnormal board and resets the circuit board anti-overlapping system, since the circuit board after the initial detection is located at the end away from the thickness detection device in the conveying direction, the subsequent conveying device can transport the circuit board after the initial detection back to below the thickness detection device for a second thickness detection.

[0055] In this embodiment, the circuit board anti-overlapping system also includes an alarm, and in response to the first detected thickness exceeding a set thickness, the controller controls the alarm to output an alarm. Understandably, the alarm output can promptly alert operators to inspect the boards, allowing for quick handling of abnormal boards and thus improving production efficiency.

[0056] S33: Process the circuit board whose first detection thickness is greater than the set thickness, and reset the circuit board anti-overlapping system after processing so that the processed circuit board can be tested for thickness a second time.

[0057] In this embodiment, circuit boards with a first detection thickness greater than a set thickness are processed, and after processing, the circuit board anti-overlapping system is reset to continue conveying the processed circuit boards; when the processed circuit board is conveyed to the position corresponding to the thickness detection device, the controller controls the conveying device to stop conveying and controls the thickness detection device to detect the thickness of the processed circuit board.

[0058] Understandably, when multiple rows of circuit boards are placed in parallel on a conveyor, even if the controller detects that the first detection thickness of the circuit boards is greater than the set thickness, it cannot determine which row has overlapping boards. For example, with 5 rows, overlapping boards may appear in one row, or even in two or three rows. Therefore, manual intervention is required to confirm each row's boards one by one and to completely process the overlapping boards. If only a single detection is performed, operators are likely to make mistakes during the single processing. For example, multiple rows of circuit boards may overlap, but only a portion may be processed, resulting in overlapping boards still flowing into the processing line, causing them to be scrapped, or overlapping boards may flow out, resulting in significant production cost losses.

[0059] In this embodiment, since the first set distance is greater than the distance the circuit board travels in the conveying direction after passing the thickness detection device, after resetting the circuit board anti-overlapping system, the circuit board can pass under the thickness detection device again, allowing the thickness detection device to perform a second detection on the circuit board that has already undergone the initial detection. Understandably, if the second detection thickness is determined to be equal to the set thickness during the second detection, it indicates that the operator has completed all the abnormal boards in the previous processing, and the controller can directly send the processed circuit board into the processing line; if the second detection thickness is determined to be greater than the set thickness, it indicates that the operator has not completed all the abnormal boards in the previous processing, and further abnormal processing of the boards is still required.

[0060] In this embodiment, in response to the second detected thickness being greater than the set thickness, the controller controls the conveying device to reverse the transmission of the processed circuit board to the second set distance, and then controls the conveying device to stop transmission; the second set distance is greater than the distance the processed circuit board travels in the transmission direction after passing the thickness detection device; the processed circuit board with the second detected thickness being greater than the set thickness is subjected to secondary processing, and after the processing is completed, the circuit board anti-overlapping system is reset so that the circuit board after the second processing can be subjected to a third thickness detection; the above steps are repeated until the detected thickness of the circuit board after multiple processing is less than the set thickness, and then the controller controls the conveying device to transmit the circuit board after multiple processing to the next process.

[0061] Understandably, this implementation method, through multiple detections and interceptions of overlapping circuit boards using a circuit board anti-overlapping system, along with multiple warnings for operators to inspect and handle overlapping boards, can fundamentally prevent overlapping boards from entering the processing line, avoiding board scrap and waste during processing, thereby improving production efficiency and product quality. Furthermore, since the conveyor device reverses the circuit board to a set distance each time an overlapping board is detected, it also prevents the circuit board from stopping below the thickness detection device, facilitating operator observation and handling, further preventing damage to the circuit board, and thus improving product quality.

[0062] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A circuit board anti-overlapping system, characterized in that, The circuit board anti-overlapping system includes a baffle, a conveying device, a thickness detection device, and a controller; The conveying device is disposed between the baffles and is used to convey the circuit board; The thickness detection device is arranged perpendicular to the baffle and located on the conveying path of the circuit board, and is used to detect the thickness of the circuit board. The controller is integrated into an external device and is used to control the conveying direction of the conveying device and to control the thickness detection device to perform thickness detection. The controller is configured to control the conveying device to stop conveying when the circuit board is conveyed to the position corresponding to the thickness detection device, and to control the thickness detection device to detect the thickness of the circuit board, and to control the conveying device to continue conveying the circuit board in the conveying direction after the thickness detection device has completed the thickness detection. The controller is also configured to, when determining that the first detected thickness is greater than a set thickness, control the conveying device to reverse the transmission of the circuit board to a first set distance and then control the conveying device to stop the transmission; the first set distance is greater than the distance the circuit board travels in the transmission direction after passing the thickness detection device; The thickness detection device is also used to perform a second thickness detection on the processed circuit board after the circuit board with the first detected thickness greater than the set thickness has been processed and the circuit board anti-overlapping system has been reset.

2. The circuit board anti-overlapping system according to claim 1, characterized in that, The thickness detection device includes a support device, a telescopic device, and a pressure roller; The support device is disposed on the transmission path of the circuit board, and the support device includes multiple brackets and a crossbeam disposed between the brackets; One end of the telescopic device is mounted on the crossbeam, and the other end is connected to the pressure roller, which is used to drive the pressure roller to rise and fall.

3. The circuit board anti-overlapping system according to claim 2, characterized in that, The thickness detection device also includes a measuring device, which is used to determine the length of the telescopic device based on the position of the pressure roller.

4. The circuit board anti-overlapping system according to claim 1, characterized in that, The circuit board anti-overlapping system also includes an alarm.

5. The circuit board anti-overlapping system according to claim 1, characterized in that, The controller includes a programmable logic controller to enable the circuit board anti-overlap system to be linked with the external device.

6. A method for preventing circuit board stacking, characterized in that, The circuit board anti-overlapping method is implemented through a circuit board anti-overlapping system, which includes baffles, a conveying device, a thickness detection device, and a controller. The conveying device is disposed between the baffles and is used to convey the circuit board. The thickness detection device is disposed perpendicular to the baffles and located on the conveying path of the circuit board, and is used to detect the thickness of the circuit board. The controller is integrated into an external device and is used to control the conveying direction of the conveying device and to control the thickness detection device to perform thickness detection. The method for preventing circuit board stacking includes: The circuit board is conveyed by the conveying device. When the circuit board is conveyed to the position corresponding to the thickness detection device, the controller controls the conveying device to stop conveying and controls the thickness detection device to detect the thickness of the circuit board. In response to the first detected thickness being greater than a set thickness, the controller controls the conveying device to reverse the transmission of the circuit board to a first set distance, and then controls the conveying device to stop conveying; the first set distance is greater than the distance the circuit board travels in the conveying direction after passing the thickness detection device; The circuit board whose first detected thickness is greater than the set thickness is processed, and after the processing is completed, the circuit board anti-overlapping system is reset so that the processed circuit board can be subjected to a second thickness detection.

7. The method for preventing circuit board stacking according to claim 6, characterized in that, The step of processing the circuit board whose first detected thickness is greater than the set thickness, and resetting the circuit board anti-overlapping system after processing, so as to perform a second thickness detection on the processed circuit board, specifically includes: The circuit board whose first detected thickness is greater than the set thickness is processed, and after the processing is completed, the circuit board anti-overlapping system is reset so that the processed circuit board can continue to be transmitted. When the processed circuit board is conveyed to the position corresponding to the thickness detection device, the controller controls the conveying device to stop conveying and controls the thickness detection device to detect the thickness of the processed circuit board.

8. The method for preventing circuit board stacking according to claim 7, characterized in that, After the step of controlling the conveying device to stop conveying when the processed circuit board is conveyed to the position corresponding to the thickness detection device, and controlling the thickness detection device to detect the thickness of the processed circuit board, the method further includes: In response to the second detected thickness being greater than the set thickness, the controller controls the conveying device to reverse the transmission of the processed circuit board to the second set distance, and then controls the conveying device to stop transmitting; the second set distance is greater than the distance the processed circuit board travels in the transmission direction after passing the thickness detection device; The processed circuit board with the second detected thickness greater than the set thickness is subjected to a second processing, and after the processing is completed, the circuit board anti-overlapping system is reset so that the processed circuit board can be subjected to a third thickness detection. Repeat the above steps until the thickness of the circuit board after multiple processing is less than the set thickness. Then, use the controller to control the conveying device to convey the circuit board after multiple processing to the next process.

9. The method for preventing circuit board stacking according to claim 6, characterized in that, After the steps of conveying the circuit board via the conveying device, and when the circuit board is conveyed to the position corresponding to the thickness detection device, controlling the conveying device to stop conveying using the controller, and controlling the thickness detection device to detect the thickness of the circuit board, the method further includes: In response to the first detected thickness being equal to the set thickness, the controller controls the conveying device to convey the circuit board into the next process.

10. The method for preventing circuit board stacking according to claim 6, characterized in that, The circuit board anti-overlapping system also includes an alarm; In response to the first detected thickness being greater than a set thickness, after controlling the conveying device to reverse the transmission of the circuit board to a first set distance using the controller, the conveying device is then controlled to stop conveying; the step of the first set distance being greater than the distance the circuit board has traveled in the conveying direction after passing the thickness detection device further includes: In response to the first detected thickness being greater than the set thickness, the controller controls the alarm to output an alarm.

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