Electronic device and control method of electronic device

Abstract

The present disclosure provides an electronic device and a control method of the electronic device, the electronic device comprising: a middle frame; a heat source mounted on the middle frame; a shell having a heat dissipation area and a non-heat dissipation area, the heat source being located between the heat dissipation area and the middle frame; the heat dissipation coefficient of the heat dissipation area being higher than that of the non-heat dissipation area; and a processing module for adjusting the heat dissipation power of the heat dissipation area according to the temperature at the non-wearing position of the shell and the detected temperature at the wearing position of the shell. The technical scheme of the embodiment of the present disclosure improves the heat dissipation effect of the heat source.

Description

Technical Field

[0001] This disclosure relates to heat dissipation technology, and more particularly to an electronic device and a method for controlling the electronic device. Background Technology

[0002] Taking mobile phones as an example, 5G (5th Generation Mobile Communication Technology) phones consume significantly more power than 4G (4th Generation Mobile Communication Technology) phones. This leads to more severe overheating. While phone performance is improving, overheating negatively impacts the user experience. Current methods for cooling phones include graphite sheets, copper pipes, vapor chambers (VCSELs), and metal frames. However, these methods are insufficient. In some scenarios, overheating becomes even more severe, with the back cover and frame reaching extremely high temperatures, making the phone feel hot to the touch and resulting in a poor user experience. Summary of the Invention

[0003] This disclosure provides an electronic device and a method for controlling the electronic device.

[0004] According to a first aspect of this disclosure, an electronic device is provided, the electronic device comprising:

[0005] Mid-frame;

[0006] The heat source is installed on the middle frame;

[0007] The outer casing has a heat dissipation area and a non-heat dissipation area, and the heat source is located between the heat dissipation area and the middle frame; the heat dissipation coefficient of the heat dissipation area is higher than that of the non-heat dissipation area.

[0008] The processing module is used to adjust the heat dissipation power of the heat dissipation area based on the temperature detected at the non-wearing position of the shell and the temperature detected at the wearing position of the shell.

[0009] In some embodiments, the heat dissipation area includes:

[0010] The first insulating and heat-conducting wall faces the heat source;

[0011] The second insulating and heat-conducting wall is stacked with the first insulating and heat-conducting wall;

[0012] An electrically controlled thermal conductive layer is located between the first insulating thermal conductive wall and the second insulating thermal conductive wall. It is used to conduct heat conduction between the first insulating thermal conductive wall and the second insulating thermal conductive wall when there is an electrical signal; and to stop heat conduction between the first insulating thermal conductive wall and the second insulating thermal conductive wall when there is no electrical signal.

[0013] In some embodiments, the electrically controlled thermally conductive layer includes:

[0014] A thermocouple pair includes an alternately distributed first semiconductor and a second semiconductor, located between the first insulating and heat-conducting wall and the second insulating and heat-conducting wall;

[0015] A conductive sheet is used to electrically connect adjacent first semiconductors and second semiconductors. The conductive sheet includes a first conductive sheet and a second conductive sheet, wherein the first conductive sheet is located between the first insulating thermally conductive wall and the first end of the thermocouple pair, and the second conductive sheet is located between the second insulating thermally conductive wall and the second end of the thermocouple pair, the second end being the opposite end of the first end.

[0016] The conductive sheet is electrically connected to the adjacent first semiconductor and the second semiconductor;

[0017] When current flows through the conductive sheet and the thermocouple pair, the heat from the first insulating heat-conducting wall is transferred to the second insulating heat-conducting wall.

[0018] In some embodiments, the electrical signal includes a pulse-modulated signal;

[0019] The parameters of the pulse modulation signal are used to adjust the heat dissipation power; wherein the parameters include frequency and / or duty cycle.

[0020] In some embodiments, the first insulating heat-conducting wall and the inner wall of the non-heat-dissipating area are an integral structure, and / or the second insulating heat-conducting wall and the outer wall of the non-heat-dissipating area are an integral structure.

[0021] In some embodiments, the material of the first insulating thermally conductive wall is the same as the material of the non-heat-dissipating area, and / or the material of the second insulating thermally conductive wall is the same as the material of the non-heat-dissipating area.

[0022] In some embodiments, the heat dissipation area is located at the center of the non-heat dissipation area, or the heat dissipation area is located above the center of the non-heat dissipation area.

[0023] In some embodiments, the electronic device further includes:

[0024] A transmitting coil, located on the middle frame and electrically connected to the processing module, is used to transmit the pulse modulation signal;

[0025] A receiving coil, located on the housing, is electrically connected to the heat dissipation area and transmits the pulse modulation signal to the heat dissipation area.

[0026] In some embodiments, the electronic device further includes:

[0027] The field-effect transistor is electrically connected to the transmitting coil;

[0028] A pulse generator, electrically connected to the processing module, is used to generate the pulse modulation signal that controls the on or off state of the field-effect transistor;

[0029] The processing module is used to adjust the power of the heat dissipation area by adjusting the frequency and / or duty cycle of the pulse modulation signal.

[0030] According to a second aspect of this disclosure, a control method for an electronic device is provided, applied to the electronic device described in the first aspect embodiment, the method comprising:

[0031] The temperature of the non-wearing area of ​​the outer casing of the electronic device and the temperature of the wearing area of ​​the outer casing are obtained.

[0032] The heat dissipation power of the heat dissipation area is adjusted according to the temperature at the non-wearing position and the temperature at the wearing position.

[0033] In some embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing location and the temperature at the wearing location includes:

[0034] If the temperature difference between the non-wearing location and the wearing location reaches a preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be greater than or equal to the preset power; and / or,

[0035] If the difference does not reach the preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be less than the preset power.

[0036] In some embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing location and the temperature at the wearing location includes:

[0037] The power of the heat dissipation area is adjusted by adjusting the frequency and / or duty cycle of the pulse modulation signal generated by the pulse generator; wherein the pulse modulation signal is used to control the field-effect transistor to be turned on or off, and the field-effect transistor is electrically connected to the transmitting coil of the electronic device.

[0038] In some embodiments, obtaining the temperature at the wearing position of the outer shell includes:

[0039] Establish a communication connection between the electronic device and the wearable device;

[0040] The temperature at the wearing location is obtained through the wearable device.

[0041] In some embodiments, the wearable device includes a wristband, watch, or ring.

[0042] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0043] As can be seen from the above embodiments, the embodiments of this disclosure, by forming heat dissipation areas and non-heat dissipation areas on the outer casing, utilize the increased heat dissipation areas to transfer the heat generated by the heat source to the external environment, further improving the heat dissipation effect of the heat source and alleviating the overheating phenomenon of the outer casing and the middle frame. Moreover, since the heat dissipation area is part of the outer casing, compared to external heat dissipation components, utilizing the heat dissipation area of ​​the outer casing for heat dissipation results in a simpler structure. Furthermore, the technical solution of the embodiments of this disclosure adjusts the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing position and the temperature at the wearing position, fully considering the temperature perception at the wearing position, improving the accuracy of heat dissipation power adjustment, further improving the overheating phenomenon, and enhancing the user experience of electronic devices.

[0044] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0045] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0046] Figure 1 This is one of the schematic diagrams of a partial structure of an electronic device according to an exemplary embodiment;

[0047] Figure 2 This is a second schematic diagram of a partial structure of an electronic device according to an exemplary embodiment;

[0048] Figure 3 This is a schematic diagram illustrating an electronic device being charged via a transmitting coil according to an exemplary embodiment;

[0049] Figure 4 This is one of the structural schematic diagrams of a heat dissipation area according to an exemplary embodiment;

[0050] Figure 5 This is a second schematic diagram of the structure of a heat dissipation area according to an exemplary embodiment;

[0051] Figure 6This is a flowchart illustrating a control method for an electronic device according to an exemplary embodiment;

[0052] Figure 7 This is a schematic diagram of the structure of a control device for an electronic device according to an exemplary embodiment;

[0053] Figure 8 This is a block diagram illustrating the structural composition of a device for controlling an electronic device according to an exemplary embodiment. Detailed Implementation

[0054] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0055] The first aspect of this disclosure provides an electronic device, Figure 1 This is a schematic diagram showing the back structure of the electronic device after the back cover has been removed. Figure 2 This is a schematic diagram of the inner structure of the rear shell, where the inner side of the rear shell faces... Figure 1 The back of the electronic device shown, see Figure 1 and Figure 2 As shown, the electronic device includes:

[0056] Mid-frame 10;

[0057] Heat source 20 is installed on the middle frame 10;

[0058] The outer casing 30 has a heat dissipation area 80 and a non-heat dissipation area 70, and the heat source 20 is located between the heat dissipation area 80 and the middle frame 10; the heat dissipation coefficient of the heat dissipation area 80 is higher than that of the non-heat dissipation area 70.

[0059] The processing module is used to adjust the heat dissipation power of the heat dissipation area 80 based on the temperature at the non-wearing position of the housing 30 and the temperature detected at the wearing position of the housing 30.

[0060] Without limitation, heat source 20 includes heat-generating components such as processor memory and / or circuit boards. The processing module may be a CPU (central processing unit), serving as one of the heat sources.

[0061] The middle frame 10 provides support for the heat source 20.

[0062] In some embodiments, the heat dissipation area 80 is aligned with the heat source 20, or the heat source 20 is in contact with the heat dissipation area 80, thereby shortening the heat conduction path and further improving the heat dissipation effect on the heat source 20.

[0063] Electronic devices include, but are not limited to, mobile phones, tablets, laptops, televisions, or wearable electronic products.

[0064] In some embodiments, the electronic device is a mobile phone, which includes a display screen and a battery. The display screen and the housing 30 are respectively mounted on opposite surfaces of the mid-frame 10, and the battery is located between the rear housing and the mid-frame 10. The battery is used to power the processing module and the motherboard.

[0065] The heat dissipation area 80 and the non-heat dissipation area 70 can be made of different materials to improve the heat dissipation effect of the heat dissipation area 80. For example, the heat dissipation area 80 can be made of materials with high thermal conductivity, such as metal or phase change material, while the non-heat dissipation area 70 can be made of materials such as plastic or glass. Alternatively, some materials of the heat dissipation area 80 can be the same as those of the non-heat dissipation area 70, but materials with high thermal conductivity can be incorporated into the heat dissipation area 80. For example, the outer wall of the heat dissipation area 80 and the non-heat dissipation area 70 can both be made of ceramic, but by adding a phase change material or an electrically controlled thermal conductivity layer to the heat dissipation area 80, the thermal conductivity of the heat dissipation area 80 is improved, thereby ensuring the heat dissipation effect through the improvement of the thermal conductivity. This structure of the heat dissipation area 80 in this example helps to improve the overall integrity of the outer casing 30.

[0066] This embodiment of the present disclosure forms a heat dissipation area 80 and a non-heat dissipation area 70 on the outer shell 30. The increased heat dissipation area 80 transfers the heat generated by the heat source 20 to the external environment, further improving the heat dissipation effect of the heat source 20 and improving the phenomenon of overheating of the outer shell 30 and the middle frame 10.

[0067] In this embodiment of the disclosure, the heat dissipation area 80 may be the non-wearing area of ​​the electronic device, that is, the area where the electronic device does not directly contact the user's skin after being worn.

[0068] It is understood that the added heat dissipation area 80 refers to an additional heat dissipation component added on top of the existing heat dissipation components within the electronic device. For example, in this embodiment, the mid-frame 10 can be made of metal or alloy, and the mid-frame 10 itself has a heat dissipation effect, serving as a heat dissipation component to achieve a certain degree of heat dissipation. However, in practical applications, if the gaming function is used for a long time, the heat generated by the heat source 20 will be greater, and the heat dissipation of the mid-frame 10 will no longer meet the requirements. Both the mid-frame 10 and the back cover will experience heat generation or overheating. Adding the heat dissipation area 80 can further improve the heat dissipation effect and alleviate the overheating or overheating problem.

[0069] Without limitation, the heat dissipation area 80 and the non-heat dissipation area 70 are an integral structure, meaning that the heat dissipation area 80 and the non-heat dissipation area 70 are physically inseparable. Compared with the technical solution of adding an external heat dissipation component to the housing 30 to improve the problem of overheating, the electronic device of this disclosure incorporates the heat dissipation area 80 as part of the housing 30, eliminating the need for an external heat dissipation component and making it more convenient to use.

[0070] The temperature at the non-wearing location can be the temperature of the heat dissipation area 80, or the temperature of the non-heat dissipation area 70 adjacent to the heat dissipation area 80. Relatively speaking, the non-wearing location is farther away from the user, while the wearing location is closer to the user. The wearing location can be the user's hand or wrist, or other wearing parts. Generally, the temperature at the wearing location is the skin temperature of the wearing area, which is more sensitive to heat dissipation. Based on the temperatures at the non-wearing and wearing locations of the casing 30, the heat dissipation power of the heat dissipation area 80 is adjusted. This fully considers the temperature sensitivity of the wearing location, improves the accuracy of heat dissipation power adjustment, further reduces overheating, and enhances the user experience of electronic devices.

[0071] In some embodiments, the processing module is used to adjust the heat dissipation power of the heat dissipation area 80 based on the temperature at the non-wearing position of the housing 30, the detected temperature at the wearing position of the housing 30, and the current ambient temperature.

[0072] The current ambient temperature refers to the temperature of the environment in which the electronic device is located. The current ambient temperature affects the heat dissipation effect of the heat dissipation area. Generally, the higher the current ambient temperature, the more difficult it is for heat to dissipate into the environment, and the greater the heat dissipation power required to achieve the desired heat dissipation effect, such as preventing the back cover from getting hot. Conversely, the lower the current ambient temperature, the easier it is for heat to dissipate into the environment, and the less heat dissipation power is required to achieve the desired heat dissipation effect.

[0073] In a general sense, the current ambient temperature refers to the temperature of the environment in which the electronic device is located. Electronic devices can obtain the current ambient temperature by viewing the weather information in an application.

[0074] In other alternative embodiments, such as Figure 4 As shown, the heat dissipation area 80 includes:

[0075] The first insulating and heat-conducting wall 81 faces the heat source 20;

[0076] The second insulating heat-conducting wall 82 is stacked with the first insulating heat-conducting wall 81.

[0077] An electrically controlled thermally conductive layer 83 is located between the first insulating thermally conductive wall 81 and the second insulating thermally conductive wall 82. It is used to conduct heat conduction between the first insulating thermally conductive wall 81 and the second insulating thermally conductive wall 82 when there is an electrical signal; and to stop heat conduction between the first insulating thermally conductive wall 81 and the second insulating thermally conductive wall 82 when there is no electrical signal.

[0078] The electrically controlled thermally conductive layer 83 refers to a structure capable of controlling heat conduction via electrical signals. By adjusting the duration and / or time period of the electrical signal, the heat transfer efficiency between the first insulating thermally conductive wall 81 and the second insulating thermally conductive wall 82 can be adjusted. For example, the electrically controlled thermally conductive layer 83 comprises two different conductors with different energy levels of charge in each conductor. When current flows through it, the electrically controlled thermally conductive layer 83 absorbs the heat generated by the heat source 20 through the first insulating thermally conductive wall 81 and transfers the heat to the second insulating thermally conductive wall 82, thus achieving heat dissipation. At this time, the first insulating thermally conductive wall 81 forms the cold end, and the second insulating thermally conductive wall 82 forms the hot end. Figure 4 In the image, the arrow points in the direction of heat transfer.

[0079] Unrestricted, the heat dissipation area 80 can be a Peltier cooling plate. Both the first insulating heat-conducting wall 81 and the second insulating heat-conducting wall 82 are made of ceramic or glass.

[0080] See Figure 5 As shown, in other alternative embodiments, the electrically controlled thermally conductive layer 83 includes:

[0081] Thermocouple pair, comprising alternating distributions of first semiconductor 832 and second semiconductor 831;

[0082] A conductive sheet is used to electrically connect the adjacent first semiconductor 832 and the second semiconductor 831; the conductive sheet includes a first conductive sheet 84 and a second conductive sheet 85, wherein the first conductive sheet 84 is located between the first insulating heat-conducting wall 81 and the first end of the thermocouple pair, and the second conductive sheet 85 is located between the second insulating heat-conducting wall 82 and the second end of the thermocouple pair, the second end being the opposite end of the first end;

[0083] The conductive sheet is electrically connected to the adjacent first semiconductor 832 and second semiconductor 831;

[0084] When current flows through the conductive sheet and the thermocouple pair, the heat from the first insulating heat-conducting wall 81 is transferred to the second insulating heat-conducting wall 82.

[0085] In some embodiments, the first conductive sheet 84, the second conductive sheet 85, and the thermocouple pair are connected in series, and a heat dissipation effect is generated under the action of an electrical signal.

[0086] The conductive sheet can be a metallic conductor, such as copper or aluminum. In the thermocouple pair, the first semiconductor 832 can be an N-type semiconductor, and the second semiconductor 831 can be a P-type semiconductor. For example, the material of the thermocouple pair includes bismuth telluride, but is not limited to this.

[0087] In other alternative embodiments, the electrical signal includes a pulse-width modulation (PWM) signal.

[0088] The parameters of the pulse modulation signal are used to adjust the heat dissipation power; wherein the parameters include frequency and / or duty cycle.

[0089] Within a certain frequency range, the higher the frequency of the pulse modulation signal, the higher the heat dissipation power.

[0090] Within a certain duty cycle range, the larger the duty cycle, the higher the heat dissipation power.

[0091] In other alternative embodiments, the first insulating heat-conducting wall 81 and the inner wall of the non-heat-dissipating area 70 are integral structures, and / or the second insulating heat-conducting wall 82 and the outer wall of the non-heat-dissipating area 70 are integral structures.

[0092] In practical applications, the first insulating heat-conducting wall 81 and / or the second insulating heat-conducting wall 82 can be integrally manufactured with the non-heat-dissipating area 70, and then an electrically controlled thermally conductive layer is added between the first insulating heat-conducting wall 81 and the second insulating heat-conducting wall 82 to form the heat-dissipating area 80.

[0093] This heat dissipation area 80 helps to improve the overall integrity of the casing 30.

[0094] In other alternative embodiments, the material of the first insulating heat-conducting wall 81 is the same as the material of the non-heat-dissipating area 70, and / or the material of the second insulating heat-conducting wall 82 is the same as the material of the non-heat-dissipating area 70.

[0095] In some embodiments, both the first insulating heat-conducting wall 81 and the second insulating heat-conducting wall 82 are made of ceramic, and the non-heat-dissipating area 70 is also made of ceramic. Using the same material can further improve the overall integrity of the housing 30.

[0096] In other alternative embodiments, the heat dissipation area 80 is located at the center of the non-heat dissipation area 70, or the heat dissipation area 80 is located above the center of the non-heat dissipation area 70.

[0097] Generally, in the use of electronic devices, the wearing position is typically located between the center of the non-heat-dissipating area 70 and the bottom of the non-heat-dissipating area 70, that is, the wearing position is below the non-heat-dissipating area 70, while the non-wearing position is located either in the center of the non-heat-dissipating area 70 or below the non-heat-dissipating area 70. For example... Figure 2 As shown, for the rectangular non-heat-dissipating area 70, the intersection of the two diagonals of the rectangle is taken as the center position O of the non-heat-dissipating area 70. The heat-dissipating area 80 is set at the center position of the non-heat-dissipating area 70, or, as shown... Figure 2 As shown, placing the heat dissipation area 80 above the center position O of the non-heat dissipation area 70 allows the heat dissipation area 80 to be in a non-wearing position. This distribution of the heat dissipation area 80 not only improves the tactile experience when wearing it by being further away from the heat dissipation area 80, but also improves the heat dissipation effect of the heat dissipation area 80 by reducing the user's obstruction of the heat dissipation area 80.

[0098] Figure 2 An example is shown of a heat dissipation area 80 located at the center of a non-heat dissipation area 70.

[0099] In other alternative embodiments, the electronic device further includes:

[0100] A transmitting coil 50, located on the middle frame 10, is electrically connected to the processing module and is used to transmit pulse modulation signals;

[0101] The receiving coil 40 is located on the housing 30, electrically connected to the heat dissipation area 80, and transmits the pulse modulation signal to the heat dissipation area 80.

[0102] In this embodiment, a pulse-modulated signal is transmitted by a transmitting coil 50 and a pulse-modulated signal is transmitted by a receiving coil 40 to wirelessly power the heat dissipation area 80. This power supply process also serves as a process for adjusting the heat dissipation power of the heat dissipation area 80. This wireless power supply method allows the transmitting coil 50 and the receiving coil to be two separable components. When assembling the middle frame 10 and the outer casing 30, no further charging connection is required; the outer casing 30 can be directly installed on the middle frame 10, saving assembly steps. Furthermore, since no additional wiring is needed to power the heat dissipation area 80, the space occupied between the outer casing 30 and the middle frame 10 is reduced, allowing for more expansion space for the battery located between the middle frame 10 and the outer casing 30.

[0103] like Figure 1 and Figure 2 As shown, the transmitting coil 50 and the receiving coil 40 are aligned to further improve the power supply effect to the heat dissipation area 80.

[0104] See Figure 3 As shown, in other alternative embodiments, the electronic device further includes:

[0105] The field-effect transistor 90 is electrically connected to the transmitting coil 50;

[0106] A pulse generator 60 is electrically connected to the processing module and is used to generate the pulse modulation signal that controls the on or off state of the field-effect transistor 90.

[0107] The processing module is used to adjust the power of the heat dissipation area 80 by adjusting the frequency and / or duty cycle of the pulse modulation signal.

[0108] In some embodiments, the processing module controls the pulse generator 60 to generate a pulse modulation signal, which enables the field-effect transistor 90 to be turned on or off under the action of the pulse modulation signal. In turn, the transmitting coil 50, which is electrically connected to the field-effect transistor 90, generates an electromagnetic wave based on the pulse modulation signal. The receiving coil generates an electrical signal that is transmitted to the heat dissipation area 80 under the action of the electromagnetic wave.

[0109] A second aspect of this disclosure provides a control method for an electronic device, applicable to the electronic device described in the first aspect embodiment, such as... Figure 6 As shown, the method includes:

[0110] Step S110: Obtain the temperature of the non-wearing position of the outer shell of the electronic device and the temperature of the wearing position of the outer shell;

[0111] Step S120: Adjust the heat dissipation power of the heat dissipation area according to the temperature at the non-wearing position and the temperature at the wearing position.

[0112] In step S110, the temperature at the non-wearing location can be the temperature of the heat dissipation area or the temperature of a non-heat dissipation area adjacent to the heat dissipation area. Relatively speaking, the non-wearing location is farther away from the user, while the wearing location is closer to the user. The wearing location can be a part of the user's body such as their hand or wrist.

[0113] The temperature can be detected by the built-in temperature sensor of the electronic device at the non-wearing position and the temperature at the wearing position of the outer shell, respectively. Alternatively, the temperature can be detected by the temperature sensor in other devices besides the electronic device, and then the temperature information can be sent to the electronic device wirelessly.

[0114] In some embodiments, the temperature at the non-wearing location is detected by a temperature sensor located within the electronic device.

[0115] In step S120, the temperature at the wearing position is generally the skin temperature of the wearing area. The skin at the wearing area is more sensitive to the heat dissipation effect. Based on the temperature of the non-wearing area and the wearing position of the outer shell, the heat dissipation power of the heat dissipation area is adjusted. This fully considers the temperature sensitivity of the wearing position, improves the accuracy of the heat dissipation power adjustment, further improves the overheating phenomenon, and improves the user experience of electronic devices.

[0116] In other alternative embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing location and the temperature at the wearing location includes:

[0117] If the temperature difference between the non-wearing location and the wearing location reaches a preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be greater than or equal to the preset power; and / or,

[0118] If the difference does not reach the preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be less than the preset power.

[0119] In practical applications, when the temperature difference between the non-wearing position and the wearing position is greater than a preset threshold, it indicates that the heat source is dissipating more heat and the shell temperature is higher, requiring increased heat dissipation power to improve the heat dissipation effect. Conversely, when the temperature difference between the non-wearing position and the wearing position is less than the preset threshold, it indicates that the heat source is dissipating less heat and the shell temperature is lower, requiring reduced heat dissipation power to reduce the heat dissipation effect, or stopping heat dissipation in the heat dissipation area to reduce power consumption.

[0120] The preset threshold can be 10℃, 15℃, or 20℃, but is not limited to these.

[0121] In some embodiments, the method further includes:

[0122] The communication module receives current ambient temperature information from other devices.

[0123] The heat dissipation power of the heat dissipation area is adjusted based on the temperature at the non-wearing position of the outer shell, the detected temperature at the wearing position of the outer shell, and the current ambient temperature.

[0124] Without limitation, the current ambient temperature refers to the temperature of the environment in which the electronic device is located. The electronic device can obtain the current ambient temperature by viewing the weather conditions in the application. The application can receive the indication information of the current ambient temperature from a server on the network side.

[0125] The ambient temperature affects the heat dissipation effect of the heat dissipation area. Generally, the higher the ambient temperature, the more difficult it is for heat to dissipate into the environment, and the greater the heat dissipation power is required to achieve the desired heat dissipation effect, such as preventing the back cover from getting hot. Conversely, the lower the ambient temperature, the easier it is for heat to dissipate into the environment, and the less heat dissipation power is required to achieve the desired heat dissipation effect.

[0126] In some embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing position of the housing, the detected temperature at the wearing position of the housing, and the current ambient temperature includes:

[0127] If the temperature difference between the non-wearing position and the wearing position reaches a preset threshold, or if the current ambient temperature reaches a preset ambient temperature, the heat dissipation power of the heat dissipation area is adjusted to be greater than or equal to a preset power.

[0128] At the same time, the heat dissipation power is adjusted based on the temperature detected at the wearing position of the shell and the current ambient temperature, which helps to further improve the accuracy of the heat dissipation power adjustment and further improve the heat dissipation effect.

[0129] For example, with a preset threshold of 10℃ and a preset ambient temperature of 28℃, if the temperature difference between the non-wearing position and the wearing position is less than 10℃, but the current ambient temperature is 35℃, adjust the heat dissipation power of the heat dissipation area to be greater than or equal to the preset power to ensure heat dissipation effect and improve the problem of the shell or mid-frame getting too hot to the touch.

[0130] In some embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing position of the housing, the detected temperature at the wearing position of the housing, and the current ambient temperature includes:

[0131] If the temperature difference between the non-wearing position and the wearing position does not reach a preset threshold, and the current ambient temperature does not reach a preset ambient temperature, the heat dissipation power of the heat dissipation area is adjusted to be less than a preset power.

[0132] For example, with a preset threshold of 10℃ and a preset ambient temperature of 28℃, if the temperature difference between the non-wearing position and the wearing position is less than 10℃, and the current ambient temperature is 25℃, the heat dissipation power of the heat dissipation area is adjusted to be less than the preset power, so as to save power consumption while ensuring heat dissipation effect.

[0133] In some embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing position of the housing, the detected temperature at the wearing position of the housing, and the current ambient temperature includes:

[0134] The preset threshold is determined based on the current ambient temperature;

[0135] The heat dissipation power is determined based on whether the temperature difference between the non-wearing position and the wearing position reaches a preset threshold.

[0136] In one embodiment, the value of the preset threshold is related to the current ambient temperature; for example, the preset threshold is negatively correlated with the current ambient temperature.

[0137] In other alternative embodiments, adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing location and the temperature at the wearing location includes:

[0138] The power of the heat dissipation area is adjusted by adjusting the frequency and / or duty cycle of the pulse modulation signal generated by the pulse generator; wherein the pulse modulation signal is used to control the field-effect transistor to be turned on or off, and the field-effect transistor is electrically connected to the transmitting coil of the electronic device.

[0139] Within a certain frequency range, the higher the frequency of the pulse modulation signal, the higher the heat dissipation power.

[0140] Within a certain duty cycle range, the larger the duty cycle, the higher the heat dissipation power.

[0141] like Figure 3 The processing module controls the pulse generator to generate a pulse modulation signal, which enables the field-effect transistor to be turned on or off under the action of the pulse modulation signal. In turn, the transmitting coil, which is electrically connected to the field-effect transistor, generates an electromagnetic wave based on the pulse modulation signal. The receiving coil generates an electrical signal that is transmitted to the heat dissipation area under the action of the electromagnetic wave.

[0142] In other alternative embodiments, obtaining the temperature at the wearing position of the outer shell includes:

[0143] Establish a communication connection between the electronic device and the wearable device;

[0144] The temperature at the wearing location is obtained through the wearable device.

[0145] Compared to using the temperature sensor built into electronic devices to detect the temperature at the wearing location, using wearable devices to detect the temperature at the wearing location reduces the interference of the heat dissipation area on the detected temperature, which helps to further improve the accuracy of temperature detection and thus improve the accuracy of adjusting the heat dissipation power.

[0146] In some embodiments, the temperature at the wearing location is skin temperature. Skin temperature changes with the external environment, and by detecting skin temperature, the user's perception of the heat dissipation status of the heat dissipation area can be further improved, thereby further improving the accuracy of adjusting the heat dissipation power.

[0147] In other words, the wearable device includes a wristband, watch, or ring.

[0148] Because skin temperature varies significantly across different parts of the human body, it's particularly important to consider hand-operated electronic devices such as mobile phones, tablets, or televisions. Using wristbands, watches, or rings to detect skin temperature is closer to the hand, and these devices generate very little heat, improving the accuracy of temperature detection at the wearing location.

[0149] In a specific example, the electronic device is a mobile phone. For example... Figures 1 to 5 As shown, the wristband measures the skin temperature of the hand, specifically the temperature T1 at the point of contact between the wristband and the wrist, measured by the temperature sensor inside the wristband. The phone's built-in temperature sensor detects the outer casing temperature, which can be recorded as T2. T3 = T2 - T1 represents the temperature rise when the hand touches the phone. When T3 exceeds a certain value (a preset threshold), it can be determined that the phone is generating too much heat, exceeding the comfortable touch temperature for the hand. The phone will then adjust the heat dissipation of the heat dissipation area according to the following scheme to improve the phone's touch experience.

[0150] When the T3 temperature reaches the preset threshold, the CPU (i.e., the processing module) will notify... Figure 3 The pulse generator in the circuit initiates PWM control to turn the MOSFET (i.e., field-effect transistor 90) on and off. The transmitting coil then generates electromagnetic waves, and the receiving coil generates electricity through the changing magnetic field, thereby affecting the... Figure 5 The heat dissipation area shown is powered by the motherboard (heat source) with the cold end facing the motherboard and the hot end facing the external environment of the phone. In this way, the heat generated by the motherboard will be dissipated through the heat dissipation area, thereby reducing the heat of other parts of the phone, improving the overall feel, and without reducing the phone's performance. Figure 3 In this circuit, the pulse generator 60 is electrically connected to the field-effect transistor 90 via its output terminal (OUT). In addition to the output terminal, the pulse generator 60 also includes a ground terminal (GND), a power supply terminal (VDD), a clock signal terminal (SCL), and a port (SDA) for transmitting data.

[0151] This example phone can eliminate the need for external cooling devices, achieving intelligent temperature control through the temperature difference between the phone's casing and the user's hand. This provides a more comfortable contact temperature for the user without compromising phone performance.

[0152] A third aspect of this disclosure provides a control device for an electronic device, applied to the electronic device described in the first aspect embodiment, such as... Figure 7 As shown, the device 200 includes:

[0153] The acquisition module 210 is used to acquire the temperature of the non-wearing position of the outer shell of the electronic device and the temperature of the wearing position of the outer shell;

[0154] The adjustment module 220 is used to adjust the heat dissipation power of the heat dissipation area according to the temperature at the non-wearing position and the temperature at the wearing position.

[0155] In other alternative embodiments, the adjustment module is further configured to:

[0156] If the temperature difference between the non-wearing location and the wearing location reaches a preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be greater than or equal to the preset power; and / or,

[0157] If the difference does not reach the preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be less than the preset power.

[0158] In other alternative embodiments, the adjustment module is used to: adjust the heat dissipation power of the heat dissipation area according to the temperature at the non-wearing position of the shell, the detected temperature at the wearing position of the shell, and the current ambient temperature.

[0159] In a general sense, the current ambient temperature refers to the temperature of the environment in which the electronic device is located. Electronic devices can obtain the current ambient temperature by viewing the weather information in an application.

[0160] The ambient temperature affects the heat dissipation effect of the heat dissipation area. Generally, the higher the ambient temperature, the more difficult it is for heat to dissipate into the environment, and the greater the heat dissipation power is required to achieve the desired heat dissipation effect, such as preventing the back cover from getting hot. Conversely, the lower the ambient temperature, the easier it is for heat to dissipate into the environment, and the less heat dissipation power is required to achieve the desired heat dissipation effect.

[0161] In some embodiments, the adjustment module is further configured to:

[0162] If the temperature difference between the non-wearing position and the wearing position reaches a preset threshold, or if the current ambient temperature reaches a preset ambient temperature, the heat dissipation power of the heat dissipation area is adjusted to be greater than or equal to a preset power.

[0163] At the same time, the heat dissipation power is adjusted based on the temperature detected at the wearing position of the shell and the current ambient temperature, which helps to further improve the accuracy of the heat dissipation power adjustment and further improve the heat dissipation effect.

[0164] For example, with a preset threshold of 10℃ and a preset ambient temperature of 28℃, if the temperature difference between the non-wearing position and the wearing position is less than 10℃, but the current ambient temperature is 35℃, adjust the heat dissipation power of the heat dissipation area to be greater than or equal to the preset power to ensure heat dissipation effect and improve the problem of the shell or mid-frame getting too hot to the touch.

[0165] In some embodiments, the adjustment module is further configured to:

[0166] If the temperature difference between the non-wearing position and the wearing position does not reach a preset threshold, and the current ambient temperature does not reach a preset ambient temperature, the heat dissipation power of the heat dissipation area is adjusted to be less than a preset power.

[0167] For example, with a preset threshold of 10℃ and a preset ambient temperature of 28℃, if the temperature difference between the non-wearing position and the wearing position is less than 10℃, and the current ambient temperature is 25℃, the heat dissipation power of the heat dissipation area is adjusted to be less than the preset power, so as to save power consumption while ensuring heat dissipation effect.

[0168] In some embodiments, the adjustment module is further configured to:

[0169] The preset threshold is determined based on the current ambient temperature;

[0170] The heat dissipation power is determined based on whether the temperature difference between the non-wearing position and the wearing position reaches a preset threshold.

[0171] In one embodiment, the value of the preset threshold is related to the current ambient temperature; for example, the preset threshold is negatively correlated with the current ambient temperature.

[0172] In other alternative embodiments, the adjustment module is further configured to:

[0173] The power of the heat dissipation area is adjusted by adjusting the frequency and / or duty cycle of the pulse modulation signal generated by the pulse generator; wherein the pulse modulation signal is used to control the field-effect transistor to be turned on or off, and the field-effect transistor is electrically connected to the transmitting coil of the electronic device.

[0174] In other alternative embodiments, the acquisition module is further configured to:

[0175] Establish a communication connection between the electronic device and the wearable device;

[0176] The temperature at the wearing location is obtained through the wearable device.

[0177] In some embodiments, the wearable device includes a wristband, watch, or ring.

[0178] A third aspect of this disclosure provides an electronic device, including:

[0179] processor;

[0180] Memory for processor-executable instructions; wherein the processor is configured to, when implemented, perform the steps of the method described in the second aspect embodiment.

[0181] A fourth aspect of this disclosure provides a computer-readable storage medium having a computer program stored thereon, wherein when the instructions in the storage medium are executed by a processor of an electronic device, the electronic device is able to perform the steps of the method described in the second aspect of the disclosure.

[0182] In an exemplary embodiment, multiple modules in the control device of an electronic device may be implemented by one or more central processing units (CPUs), graphics processing units (GPUs), baseband processors (BPs), application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers (MCUs), microprocessors, or other electronic components to perform the aforementioned method.

[0183] Figure 8 This is a block diagram illustrating a device 800 for controlling an electronic device according to an exemplary embodiment. For example, device 800 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0184] Reference Figure 8 The device 800 may include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0185] Processing component 802 typically controls the overall operation of device 800, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0186] Memory 804 is configured to store various types of data to support the operation of device 800. Examples of this data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0187] Power supply component 806 provides power to various components of device 800. Power supply component 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power to device 800.

[0188] Multimedia component 808 includes a screen that provides an output interface between the device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0189] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when device 800 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0190] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0191] Sensor assembly 814 includes one or more sensors for providing status assessments of various aspects of device 800. For example, sensor assembly 814 may detect the on / off state of device 800, the relative positioning of components such as the display and keypad of device 800, changes in the position of device 800 or a component of device 800, the presence or absence of user contact with device 800, the orientation or acceleration / deceleration of device 800, and temperature changes of device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0192] Communication component 816 is configured to facilitate wired or wireless communication between device 800 and other devices. Device 800 can access wireless networks based on communication standards, such as WiFi, 4G, or 5G, or combinations thereof. In one exemplary embodiment, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0193] In an exemplary embodiment, the apparatus 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0194] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, which can be executed by a processor 820 of the device 800 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0195] The methods disclosed in the several method embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments.

[0196] The features disclosed in the several device embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new product embodiments.

[0197] The features disclosed in the several method or device embodiments provided in this disclosure can be arbitrarily combined without conflict to obtain new method embodiments or product embodiments.

[0198] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0199] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: Mid-frame; The heat source is installed on the middle frame; The outer casing has a heat dissipation area and a non-heat dissipation area, and the heat source is located between the heat dissipation area and the middle frame; the heat dissipation coefficient of the heat dissipation area is higher than that of the non-heat dissipation area. The processing module is used to adjust the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing position of the shell and the temperature detected at the wearing position of the shell.

2. The electronic device according to claim 1, characterized in that, The heat dissipation area includes: The first insulating and heat-conducting wall faces the heat source; The second insulating and heat-conducting wall is stacked with the first insulating and heat-conducting wall; An electrically controlled thermal conductive layer is located between the first insulating thermal conductive wall and the second insulating thermal conductive wall. It is used to conduct heat conduction between the first insulating thermal conductive wall and the second insulating thermal conductive wall when there is an electrical signal; and to stop heat conduction between the first insulating thermal conductive wall and the second insulating thermal conductive wall when there is no electrical signal.

3. The electronic device according to claim 2, characterized in that, The electrically controlled thermal conductive layer includes: A thermocouple pair comprises an alternating distribution of a first semiconductor and a second semiconductor; A conductive sheet is used to electrically connect adjacent first semiconductors and second semiconductors. The conductive sheet includes a first conductive sheet and a second conductive sheet, wherein the first conductive sheet is located between the first insulating thermally conductive wall and the first end of the thermocouple pair, and the second conductive sheet is located between the second insulating thermally conductive wall and the second end of the thermocouple pair, the second end being the opposite end of the first end. When current flows through the conductive sheet and the thermocouple pair, the heat from the first insulating heat-conducting wall is transferred to the second insulating heat-conducting wall.

4. The electronic device according to claim 2, characterized in that, The electrical signal includes a pulse-modulated signal; The parameters of the pulse modulation signal are used to adjust the heat dissipation power; wherein the parameters include frequency and / or duty cycle.

5. The electronic device according to claim 2, characterized in that, The first insulating heat-conducting wall and the inner wall of the non-heat-dissipating area are integral structures, and / or the second insulating heat-conducting wall and the outer wall of the non-heat-dissipating area are integral structures.

6. The electronic device according to claim 2, characterized in that, The first insulating heat-conducting wall is made of the same material as the non-heat-dissipating area, and / or the second insulating heat-conducting wall is made of the same material as the non-heat-dissipating area.

7. The electronic device according to claim 1, characterized in that, The heat dissipation area is located at the center of the non-heat dissipation area, or the heat dissipation area is located above the center of the non-heat dissipation area.

8. The electronic device according to claim 4, characterized in that, The electronic device also includes: A transmitting coil, located on the middle frame and electrically connected to the processing module, is used to transmit the pulse modulation signal; A receiving coil, located on the housing, is electrically connected to the heat dissipation area and transmits the pulse modulation signal to the heat dissipation area.

9. The electronic device according to claim 8, characterized in that, The electronic device also includes: The field-effect transistor is electrically connected to the transmitting coil; A pulse generator, electrically connected to the processing module, is used to generate the pulse modulation signal that controls the on or off state of the field-effect transistor; The processing module is used to adjust the power of the heat dissipation area by adjusting the frequency and / or duty cycle of the pulse modulation signal.

10. A control method for an electronic device, characterized in that, Applied to the electronic device according to any one of claims 1 to 9, the method comprises: The temperature of the non-wearing area of ​​the outer casing of the electronic device and the temperature of the wearing area of ​​the outer casing are obtained. The heat dissipation power of the heat dissipation area is adjusted according to the temperature at the non-wearing position and the temperature at the wearing position.

11. The control method for an electronic device according to claim 10, characterized in that, Adjusting the heat dissipation power of the heat dissipation area based on the temperature at the non-wearing location and the temperature at the wearing location includes: If the temperature difference between the non-wearing location and the wearing location reaches a preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be greater than or equal to the preset power; and / or, If the difference does not reach the preset threshold, the heat dissipation power of the heat dissipation area is adjusted to be less than the preset power.

12. The control method for an electronic device according to claim 10, characterized in that, Adjusting the heat dissipation power of the heat dissipation area includes: The power of the heat dissipation area is adjusted by adjusting the frequency and / or duty cycle of the pulse modulation signal generated by the pulse generator; wherein the pulse modulation signal is used to control the field-effect transistor to be turned on or off, and the field-effect transistor is electrically connected to the transmitting coil of the electronic device.

13. The control method for an electronic device according to claim 10, characterized in that, The step of obtaining the temperature at the wearing position of the outer shell includes: Establish a communication connection between the electronic device and the wearable device; The temperature at the wearing location is obtained through the wearable device.

14. The control method for an electronic device according to claim 13, characterized in that, The wearable devices include wristbands, watches, or rings.

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