Processing method and device of heat dissipation structure based on board card, and electronic equipment

Abstract

The present invention discloses a processing method and device based on a heat dissipation structure of a board, and an electronic device, wherein the processing method includes: obtaining pad data of all pads on a target board, and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, identifying heat dissipation pads from all pads based on the number of steel mesh holes, determining the position coordinates of vias on the heat dissipation pads based on the vertex coordinates of each heat dissipation pad, determining the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pads based on the vertex coordinates of each heat dissipation pad, and generating a heat dissipation channel for a chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad. The present invention solves the technical problem in the related art that manual design of vias and addition of copper skins are required, which easily results in inappropriate via positions and omission of copper skins, resulting in poor heat dissipation effect on the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a processing method and device for a heat dissipation structure based on a board, and an electronic device. Background Art

[0002] With the development of cloud computing applications, informatization has gradually covered all areas of society. In daily work and life, more and more people communicate through the Internet, the amount of network data is also increasing, the performance requirements for servers are getting higher and higher, and the power consumption of servers is also increasing. Therefore, how to dissipate heat for chips has become a key issue that needs to be solved.

[0003] Figure 1 is a schematic diagram of a chip structure according to the related art, such as Figure 1 As shown, a heat dissipation pin with a larger area is designed on the chip body and welded on a PCB (Printed Circuit Board). The heat inside the chip is transferred to the PCB through the heat dissipation pin, thereby achieving the purpose of improving the heat dissipation efficiency of the chip.

[0004] The PCB board transfers heat to other locations by increasing the copper surface area. Figure 2 It is a schematic diagram of a board structure according to the related art, such as Figure 2 As shown in the figure, the board includes: chip body, pins, heat sink pins, solder, PCB board (including: pads, heat sink pads, vias, copper sheet to increase heat dissipation). In the PCB board design stage, engineers will design vias on the heat sink pads and lay copper sheet directly under the heat sink pads, so that heat can be transferred outward through the heat sink pins -> solder -> heat sink pads -> vias -> copper sheet, thereby increasing the heat dissipation area.

[0005] During the PCB design process, engineers mainly rely on manual methods to design the via positions, heat dissipation copper sheets, adjust the size of the heat dissipation copper sheets, and design the shape of the soldermask (solder mask, which is used to avoid the area covered by green oil in circuit board design) for the heat dissipation pads one by one. However, relying solely on manual methods will lead to problems such as irregular copper sheet shapes, soldermask areas larger than copper sheet areas (which will cause the board to expose the substrate, which is not allowed by the design), and inappropriate via position selection due to human factors. A lot of time will also be spent on checking one by one in the later stage. This manual design method is not only inefficient, but also requires manpower and time for inspection, and the design quality cannot be guaranteed.

[0006] In the related technology, some software (such as Allegro software) can realize manual addition of copper foil, manual design of vias, and manual addition of soldermask, but it all requires human intervention and judgment. During the design process, there will be problems such as missing copper foil, inappropriate via position, missing soldermask, etc. The heat sink pads need to be designed one by one, which is time-consuming and labor-intensive. It also requires manpower to check the designs one by one, and lacks the functions of automatic identification and batch design.

[0007] To address the above-mentioned problems, no effective solution has been proposed yet. Summary of the invention

[0008] The embodiments of the present invention provide a processing method and device for a heat dissipation structure based on a board, and an electronic device, so as to at least solve the technical problem in the related art that manual design of vias and addition of copper foil are required, which may easily cause inappropriate via positions and omission of copper foil, resulting in poor heat dissipation effect for the chip.

[0009] According to one aspect of an embodiment of the present invention, a processing method for a heat dissipation structure based on a board is provided, including: obtaining pad data of all pads on a target board, and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, wherein a chip is arranged on the target board; identifying heat dissipation pads from all pads based on the number of steel mesh holes; determining the position coordinates of vias on the heat dissipation pads based on the vertex coordinates of each heat dissipation pad, wherein the vias are used to expand the heat dissipation area; determining the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad; and generating a heat dissipation channel for the chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0010] Optionally, before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, it also includes: setting a steel mesh on each pad, wherein the steel mesh is provided with at least one hole; filling solder paste into the holes of the steel mesh to generate tin leakage areas of the pads; determining the number of tin leakage areas on the pads to obtain the number of steel mesh holes of the pads.

[0011] Optionally, the pad is a polygonal pad. Before obtaining the pad data of all the pads on the target board and obtaining the number of steel mesh voids and the vertex coordinates of each vertex of each pad from the pad data, it also includes: selecting any one of the two connected edges of the heat dissipation pad as a baseline; establishing a horizontal axis parallel to the baseline, and establishing a vertical axis perpendicular to the horizontal axis; establishing a coordinate axis based on the horizontal axis and the vertical axis; and determining the vertex coordinates of each vertex of each pad based on the coordinate axis.

[0012] Optionally, based on the number of steel mesh voids, the step of identifying the heat dissipation pad from all the pads includes: setting a steel mesh void number threshold; and determining that the pad is a heat dissipation pad when the number of steel mesh voids of the pad is greater than or equal to the steel mesh void number threshold.

[0013] Optionally, the step of determining the position coordinates of a via on the heat sink pad based on the vertex coordinates of each heat sink pad includes: determining the lower left vertex and upper right vertex of the heat sink pad based on the vertex coordinates of the heat sink pad; determining the via area of ​​the via based on a preset diameter of the via; when the center of the via is located at the lower left vertex, calculating the area of ​​the via on the heat sink pad and not on the steel mesh cavity based on the via area; taking the lower left vertex as the starting point, moving the center of the via by a preset distance along the horizontal axis or the vertical axis in sequence until the center of the via moves to the upper right vertex of the heat sink pad, and calculating the area of ​​the via on the heat sink pad and not on the steel mesh cavity based on the via area in sequence to obtain multiple areas; determining the position coordinates of the via on each heat sink pad based on the multiple areas and the center coordinates corresponding to each area.

[0014] Optionally, the step of determining the position coordinates of the via on each heat dissipation pad based on multiple areas and the center coordinates of a circle corresponding to each area includes: sorting the multiple areas to obtain a sorting result; based on the sorting result, screening out areas greater than a preset area threshold from the multiple areas to obtain an initial area set; based on the initial area set, screening a target area set; and determining the center coordinates of each target area in the target area set as the position coordinates of the via on the heat dissipation pad.

[0015] Optionally, the step of determining the heat dissipation skin area of ​​the heat sink under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad includes: determining the turning angle formed by every two connected sides of each heat dissipation pad based on the vertex coordinates of each heat dissipation pad; when the turning angle is a right angle, adjusting the horizontal coordinate of each vertex coordinate of the heat dissipation pad, generating a first coordinate point based on the adjusted horizontal coordinate and the original vertical coordinate, and adjusting the vertical coordinate of each vertex coordinate of the heat dissipation pad, generating a second coordinate point based on the adjusted vertical coordinate and the original horizontal coordinate, wherein the first coordinate point and the second coordinate point are both located on the pad area of ​​the heat dissipation pad; characterizing the first coordinate point and the second coordinate point as a corner point combination of corresponding vertices to obtain multiple groups of corner point combinations; sequentially connecting each corner point in the corner point combination of each vertex to obtain a contour, and determining the area within the contour as the heat dissipation skin area of ​​the heat sink under the heat dissipation pad.

[0016] Optionally, after determining the heat dissipation skin area of ​​the heat dissipation skin under each heat dissipation pad, the method further includes: determining a solder resist area of ​​the solder resist layer within the heat dissipation skin area.

[0017] According to another aspect of an embodiment of the present invention, a processing device based on a heat dissipation structure of a board is also provided, including: an acquisition unit, used to acquire pad data of all pads on a target board, and acquire the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, wherein a chip is arranged on the target board; an identification unit, used to identify heat dissipation pads from all pads based on the number of steel mesh holes; a first determination unit, used to determine the position coordinates of vias on the heat dissipation pads based on the vertex coordinates of each heat dissipation pad, wherein the vias are used to expand the heat dissipation area; a second determination unit, used to determine the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad; a generation unit, used to generate a heat dissipation channel of the chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0018] Optionally, the processing device also includes: a first setting module, used to set a steel mesh on each pad before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, wherein the steel mesh is provided with at least one hole; a first generating module, used to fill solder paste into the holes of the steel mesh to generate a tin leakage area of ​​the pad; and a first determining module, used to determine the number of tin leakage areas on the pad to obtain the number of steel mesh holes of the pad.

[0019] Optionally, the pad is a polygonal pad, and the processing device also includes: a first selection module, which is used to select any one of the two connected edges of the heat dissipation pad as a baseline before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh voids and the vertex coordinates of each vertex of each pad from the pad data; a first establishment module, which is used to establish a horizontal axis parallel to the baseline and a vertical axis perpendicular to the horizontal axis; a second establishment module, which is used to establish a coordinate axis based on the horizontal axis and the vertical axis; and a second determination module, which is used to determine the vertex coordinates of each vertex of each pad based on the coordinate axis.

[0020] Optionally, the identification unit includes: a second setting module, used to set a steel mesh void number threshold; a third determination module, used to determine that the pad is a heat dissipation pad when the number of steel mesh voids of the pad is greater than or equal to the steel mesh void number threshold.

[0021] Optionally, the first determination unit includes: a fourth determination module, used to determine the lower left vertex and upper right vertex of the heat dissipation pad based on the vertex coordinates of the heat dissipation pad; a fifth determination module, used to determine the via area of ​​the via based on a preset diameter of the via; a first calculation module, used to calculate the area of ​​the via on the heat dissipation pad and not on the steel mesh cavity based on the via area when the center of the via is located at the lower left vertex; a second calculation module, used to take the lower left vertex as the starting point, move the center of the via by a preset distance along the horizontal axis or the vertical axis in sequence until the center of the via moves to the upper right vertex of the heat dissipation pad, and calculate the area of ​​the via on the heat dissipation pad and not on the steel mesh cavity based on the via area in sequence to obtain multiple areas; a sixth determination module, used to determine the position coordinates of the via on each heat dissipation pad based on multiple areas and the center coordinates corresponding to each area.

[0022] Optionally, the sixth determination module includes: a first sorting submodule, used to sort multiple areas to obtain a sorting result; a first screening submodule, used to screen out areas greater than a preset area threshold from multiple areas based on the sorting result to obtain an initial area set; a second screening submodule, used to screen a target area set based on the initial area set; and a first determination submodule, used to determine the center coordinates of each target area in the target area set as the position coordinates of the via on the heat sink.

[0023] Optionally, the second determination unit includes: a seventh determination module, used to determine the corner angle formed by every two connected edges of each heat dissipation pad based on the vertex coordinates of each heat dissipation pad; a first adjustment module, used to adjust the horizontal coordinate of each vertex coordinate of the heat dissipation pad when the corner angle is a right angle, generate a first coordinate point based on the adjusted horizontal coordinate and the original vertical coordinate, and adjust the vertical coordinate of each vertex coordinate of the heat dissipation pad, and generate a second coordinate point based on the adjusted vertical coordinate and the original horizontal coordinate, wherein the first coordinate point and the second coordinate point are both located on the pad area of ​​the heat dissipation pad; a first characterization module, used to characterize the first coordinate point and the second coordinate point as a corner point combination of corresponding vertices to obtain multiple groups of corner point combinations; an eighth determination module, used to sequentially connect each corner point in the corner point combination of each vertex to obtain a contour, and determine the area within the contour as the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad.

[0024] Optionally, the processing device further includes: a ninth determining module, configured to determine a solder resist area of ​​the solder resist layer within the heat resist area after determining a heat dissipation area of ​​the heat dissipation area under each heat dissipation pad.

[0025] According to another aspect of an embodiment of the present invention, a computer-readable storage medium is provided, in which a computer program is stored, wherein when the computer program is executed by a processor, the steps of the processing method based on the heat dissipation structure of the board are implemented.

[0026] According to another aspect of an embodiment of the present invention, an electronic device is also provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the steps of the above-mentioned processing method based on the heat dissipation structure of the board when executing the computer program.

[0027] In the present disclosure, pad data of all pads on a target board are obtained, and the number of steel mesh holes and the vertex coordinates of each vertex of each pad are obtained from the pad data; based on the number of steel mesh holes, heat dissipation pads are identified from all pads; based on the vertex coordinates of each heat dissipation pad, the position coordinates of the vias on the heat dissipation pads are determined; based on the vertex coordinates of each heat dissipation pad, the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pads is determined; based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad, a heat dissipation channel for the chip on the target board is generated. Through the present application, the heat sink pad can be automatically identified according to the number of voids in the steel mesh, and the position coordinates of the via and the heat sink area can be automatically determined according to the coordinate data of the heat sink pad. Then, the heat sink pad, the vias on each heat sink pad and the heat sink under each heat sink pad are constructed as a heat dissipation channel for the chip to dissipate heat for the chip, which can improve design efficiency and ensure the heat dissipation effect of the chip, thereby solving the technical problem in the related technology that manual design of vias and addition of copper foils are required, which easily causes inappropriate via positions and omission of copper foils, resulting in poor heat dissipation effect for the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0029] Figure 1 It is a schematic diagram of a chip structure according to the related art;

[0030] Figure 2 It is a schematic diagram of a board structure according to the related art;

[0031] Figure 3 is a hardware structure block diagram of a mobile terminal for a processing method based on a heat dissipation structure of a board according to an embodiment of the present invention;

[0032] Figure 4 is a flow chart of an optional processing method based on a heat dissipation structure of a board according to an embodiment of the present invention;

[0033] Figure 5 is a schematic diagram of a structure in which a steel mesh is optionally provided on a pad according to an embodiment of the present invention;

[0034] Figure 6 is a schematic diagram of an optional pad cross-sectional structure according to an embodiment of the present invention;

[0035] Figure 7 is a schematic diagram of an optional via hole moving on a heat dissipation pad according to an embodiment of the present invention;

[0036] Figure 8 is a schematic diagram of an optional method for determining a combination of corner points according to an embodiment of the present invention;

[0037] Fig. 9 is a schematic diagram of an optional process of determining a turning point of point A according to an embodiment of the present invention;

[0038] Fig.10 is a schematic diagram of an optional processing device based on a heat dissipation structure of a board according to an embodiment of the present invention;

[0039] Fig.11 The present invention is a hardware structure block diagram of an electronic device (or mobile device) for a processing method of a heat dissipation structure based on a board according to an embodiment of the present invention. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0041] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0042] The processing method embodiment based on the heat dissipation structure of the board provided in the embodiment of the present application can be executed in a mobile terminal, a computer terminal or a similar computing device. Taking running on a mobile terminal as an example, Figure 31 is a hardware structure block diagram of a mobile terminal for a processing method based on a heat dissipation structure of a board according to an embodiment of the present invention. Figure 3 As shown, the mobile terminal may include one or more ( Figure 3 Only one is shown in the figure) a processor 302 (the processor 302 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 304 for storing data, wherein the mobile terminal may also include a transmission device 306 and an input / output device 308 for communication functions. It can be understood by those skilled in the art that Figure 3 The structure shown is only for illustration and does not limit the structure of the mobile terminal. Figure 3 More or fewer components as shown, or with Figure 3 Different configurations are shown.

[0043] The memory 304 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the processing method based on the heat dissipation structure of the board in the embodiment of the present application. The processor 302 executes various functional applications and data processing by running the computer program stored in the memory 304, that is, the processing method based on the heat dissipation structure of the board is realized. The memory 304 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 304 may further include a memory remotely arranged relative to the processor 302, and these remote memories can be connected to the mobile terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0044] The transmission device 306 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the mobile terminal. In one example, the transmission device 306 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 306 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0045] The present invention proposes a method for automatically identifying heat dissipation pads and designing vias and heat dissipation copper foils. The method can automatically identify all heat dissipation pads in a board, batch design vias on the heat dissipation pads, batch add heat dissipation copper foils directly below the heat dissipation pads, batch add soldermasks and ensure that the shape of the soldermasks does not exceed the heat dissipation copper foils, and then dissipate heat for chips on the board through the designed vias, heat dissipation copper foils and soldermasks.

[0046] The present invention is described in detail below in conjunction with various embodiments.

[0047] Embodiment 1

[0048] According to an embodiment of the present invention, an embodiment of a processing method for a board-based heat dissipation structure running on the above-mentioned mobile terminal is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0049] Figure 4 is a flow chart of an optional processing method based on a heat dissipation structure of a board according to an embodiment of the present invention, such as Figure 4 As shown, the method comprises the following steps:

[0050] Step S401, obtaining pad data of all pads on a target board, and obtaining the number of steel mesh cavities and vertex coordinates of each vertex of each pad from the pad data, wherein a chip is provided on the target board.

[0051] Step S402, identifying heat dissipation pads from all pads based on the number of stencil cavities.

[0052] Step S403 , based on the vertex coordinates of each heat dissipation pad, determining the position coordinates of a via hole on the heat dissipation pad, wherein the via hole is used to expand the heat dissipation area.

[0053] Step S404: determining a heat dissipation area of ​​a heat dissipation cover under each heat dissipation pad based on the vertex coordinates of each heat dissipation pad.

[0054] Step S405 , generating a heat dissipation channel of the chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0055] Through the above steps, the pad data of all pads on the target board can be obtained, and the number of steel mesh holes and the vertex coordinates of each vertex of each pad can be obtained from the pad data. Based on the number of steel mesh holes, the heat dissipation pads are identified from all pads, and based on the vertex coordinates of each heat dissipation pad, the position coordinates of the vias on the heat dissipation pads are determined, and based on the vertex coordinates of each heat dissipation pad, the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad is determined, and based on the heat dissipation pads, the vias on each heat dissipation pad and the heat dissipation skin under each heat dissipation pad, the heat dissipation channel of the chip on the target board is generated. Through the present application, the heat sink pad can be automatically identified according to the number of voids in the steel mesh, and the position coordinates of the via and the heat sink area can be automatically determined according to the coordinate data of the heat sink pad. Then, the heat sink pad, the vias on each heat sink pad and the heat sink under each heat sink pad are constructed as a heat dissipation channel for the chip to dissipate heat for the chip, which can improve design efficiency and ensure the heat dissipation effect of the chip, thereby solving the technical problem in the related technology that manual design of vias and addition of copper foils are required, which easily causes inappropriate via positions and omission of copper foils, resulting in poor heat dissipation effect for the chip.

[0056] The execution subject of the above steps may be a server, a mobile terminal, etc., but is not limited thereto.

[0057] The embodiment of the present invention is described in detail below in combination with the above steps.

[0058] In an embodiment of the present invention, before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, it also includes: setting a steel mesh on each pad, wherein the steel mesh is provided with at least one hole; filling solder paste into the holes of the steel mesh to generate tin leakage areas of the pads; determining the number of tin leakage areas on the pads to obtain the number of steel mesh holes of the pads.

[0059] In the embodiment of the present invention, the pad is a metallized copper sheet used for welding devices on the surface of the circuit board. The area of ​​the pad should be consistent with or slightly larger than the area of ​​the pin on the chip. Before welding the two, solder paste needs to be brushed on the pad using a steel mesh. The steel mesh will have multiple holes on the pad, so that when the solder paste passes through the surface of the steel mesh, the solder paste can fill the holes (that is, a steel mesh is set on each pad (the steel mesh is set with at least one hole), and the solder paste is filled into the hole of the steel mesh to generate a tin leakage area of ​​the pad). Afterwards, the number of tin leakage areas on the pad is determined to obtain the number of steel mesh holes of the pad.

[0060] In this embodiment, the stencil cavity in the pad area can be designed through paskmask design (ie, the design used to guide stencil processing in a circuit board).

[0061] Figure 5is a schematic diagram of a structure in which a steel mesh is set on an optional pad according to an embodiment of the present invention, such as Figure 5 As shown, a soldering pad is arranged on the surface of the PCB board, a steel mesh is arranged on the soldering pad, and there are holes on the steel mesh, that is, the structure of the steel mesh arranged on the soldering pad includes: a PCB board, a soldering pad, a steel mesh, and a hole on the steel mesh.

[0062] Optionally, the pad is a polygonal pad. Before obtaining the pad data of all the pads on the target board and obtaining the number of steel mesh voids and the vertex coordinates of each vertex of each pad from the pad data, it also includes: selecting any one of the two connected edges of the heat dissipation pad as a baseline; establishing a horizontal axis parallel to the baseline, and establishing a vertical axis perpendicular to the horizontal axis; establishing a coordinate axis based on the horizontal axis and the vertical axis; and determining the vertex coordinates of each vertex of each pad based on the coordinate axis.

[0063] In the embodiment of the present invention, the pad is a polygonal pad (for example, a square), and any two connected sides of the heat dissipation pad can be selected as a reference line, and a horizontal axis parallel to the reference line (also called the X axis) is established, and a vertical axis perpendicular to the horizontal axis (also called the Y axis) is established, and then a coordinate axis is established based on the horizontal axis and the vertical axis. After that, the vertex coordinates of each vertex of each pad (such as the point coordinates of the upper left corner, the upper right corner, the lower left corner, and the lower right corner) can be determined based on the coordinate axis.

[0064] Step S401, obtaining pad data of all pads on a target board, and obtaining the number of steel mesh cavities and vertex coordinates of each vertex of each pad from the pad data, wherein a chip is provided on the target board.

[0065] In an embodiment of the present invention, the pad data of all pads on a target board (on which a chip is disposed) may be first obtained (the pad data includes: the number of steel mesh holes and the vertex coordinates of each vertex of the pad, and also includes: the center coordinates of the pad, the specific shape and size of the pad, etc.). Then, the number of steel mesh holes and the vertex coordinates of each vertex of each pad may be obtained from the pad data.

[0066] Step S402, identifying heat dissipation pads from all pads based on the number of stencil cavities.

[0067] Optionally, based on the number of steel mesh voids, the step of identifying the heat dissipation pad from all the pads includes: setting a steel mesh void number threshold; and determining that the pad is a heat dissipation pad when the number of steel mesh voids of the pad is greater than or equal to the steel mesh void number threshold.

[0068] In an embodiment of the present invention, a threshold value for the number of steel mesh voids (for example, 2, which can be set according to actual conditions) can be set first. If the number of steel mesh voids of a pad is greater than or equal to the threshold value for the number of steel mesh voids, it can be determined that the pad is a heat dissipation pad, thereby being able to automatically screen out the heat dissipation pad.

[0069] Figure 6 is a schematic diagram of an optional pad cross-sectional structure according to an embodiment of the present invention, such as Figure 6 As shown in FIG. 1 , the pads are divided into: ordinary pads and heat dissipation pads. If the pad has only one tin leakage area, it can be determined as an ordinary pad; if the pad has four tin leakage areas (i.e. Figure 6 If there are four black tin leakage areas in the figure, it can be determined as the heat dissipation pad.

[0070] Step S403 , based on the vertex coordinates of each heat dissipation pad, determining the position coordinates of a via hole on the heat dissipation pad, wherein the via hole is used to expand the heat dissipation area.

[0071] Optionally, the step of determining the position coordinates of a via on the heat sink pad based on the vertex coordinates of each heat sink pad includes: determining the lower left vertex and upper right vertex of the heat sink pad based on the vertex coordinates of the heat sink pad; determining the via area of ​​the via based on a preset diameter of the via; when the center of the via is located at the lower left vertex, calculating the area of ​​the via on the heat sink pad and not on the steel mesh cavity based on the via area; taking the lower left vertex as the starting point, moving the center of the via by a preset distance along the horizontal axis or the vertical axis in sequence until the center of the via moves to the upper right vertex of the heat sink pad, and calculating the area of ​​the via on the heat sink pad and not on the steel mesh cavity based on the via area in sequence to obtain multiple areas; determining the position coordinates of the via on each heat sink pad based on the multiple areas and the center coordinates corresponding to each area.

[0072] In the embodiment of the present invention, the heat dissipation pad is located on the surface of the PCB board. It is necessary to design vias on the heat dissipation pad so that the pad is connected to other positions through the vias. At the same time, the vias also play the role of expanding the heat dissipation area. However, the vias cannot be placed randomly on the heat dissipation pad. The following design strategies need to be followed: (1) The vias cannot be located in the center of the heat dissipation pad; (2) The vias should be placed at the edge of the steel mesh cavity area; (3) The vias should be placed at the edge of the heat dissipation pad, which can be used as a judgment condition for automatically determining the via position coordinates.

[0073] In this embodiment, the position coordinates of the via hole can be determined on the heat dissipation pad according to the vertex coordinates of each heat dissipation pad. Specifically, the via hole can be regarded as a circle with a preset diameter (for example, 20 mil, mil (i.e., mil) is a unit of length), and the vertex coordinates of each vertex of the pad (for example, assuming that each vertex is point A (X1, Y1), point B (X2, Y2), point C (X3, Y3), and point D (X4, Y4)) are captured. Then, according to the vertex coordinates of the heat dissipation pad, the lower left vertex and the upper right vertex of the heat dissipation pad are determined. The step of determining the lower left vertex and the upper right vertex of the heat dissipation pad is as follows: the X coordinate and Y coordinate of a vertex can be subtracted from the X coordinate and Y coordinate of the remaining vertices, such as X1-X2, X1-X3, X1-X4, Y1-Y2, Y1-Y3, and Y1-Y4, and the vertices with the largest number of differences greater than 0 are located in the upper right corner of the pad, and the vertices with the least number of differences greater than 0 are located in the lower left corner of the pad.

[0074] In this embodiment, the coordinates of the lower left corner can be used as the coordinates of the center of the via, and a via circle with a preset diameter can be drawn (for example, if the diameter is 20 mil, the area is 100π), and the area of ​​the via circle outside the pad is recorded as S1, and the area of ​​the via circle overlapping with the paskmask (i.e., the steel mesh hole) is recorded as S2. It can be obtained that the area of ​​the via on the pad but not on the paskmask is L1=100π-S1-S2 (i.e., the via area of ​​the via can be determined based on the preset diameter of the via, and then when the center of the via is located at the lower left vertex, the area of ​​the via on the heat dissipation pad and not on the steel mesh hole can be calculated based on the via area). Afterwards, move the via along the X-axis direction by a preset distance (such as a smaller distance such as 1 mil), and calculate the area L2 again; move the via along the Y-axis direction by a preset distance, and calculate the area L3 again. Continue to move the via, each time by a preset distance along the X-axis or Y-axis direction, until the center of the via moves to the upper right top of the heat sink pad, and finally obtain multiple areas (i.e., take the lower left vertex as the starting point, move the center of the via by a preset distance along the horizontal axis or the vertical axis in sequence, until the center of the via moves to the upper right vertex of the heat sink pad, and calculate the area of ​​the via on the heat sink pad and not on the steel mesh cavity based on the via area in sequence, to obtain multiple areas). Then, based on the multiple areas and the coordinates of the center of the circle corresponding to each area, determine the position coordinates of the via on each heat sink pad.

[0075] Optionally, the step of determining the position coordinates of the via on each heat dissipation pad based on multiple areas and the center coordinates of a circle corresponding to each area includes: sorting the multiple areas to obtain a sorting result; based on the sorting result, screening out areas greater than a preset area threshold from the multiple areas to obtain an initial area set; based on the initial area set, screening a target area set; and determining the center coordinates of each target area in the target area set as the position coordinates of the via on the heat dissipation pad.

[0076] In an embodiment of the present invention, the obtained multiple areas and the center coordinates corresponding to each area can be combined into a two-dimensional array L = {(x5, y5, L1), (x6, y6, L2), (x7, y7, L3) ...}, where (x5, y5) are the center coordinates corresponding to area L1, (x6, y6) are the center coordinates corresponding to area L2, and (x7, y7) are the center coordinates corresponding to area L3. Afterwards, according to the two-dimensional array L, the multiple areas (L1, L2, L3 ...) in the array L can be sorted to obtain the sorting result, and according to the sorting result, the area greater than the preset area threshold (which can be set according to the actual situation) is screened out from the multiple areas to obtain the initial area set (each initial area in the initial area set can be stored in the MAX array), and the vias corresponding to the areas in the MAX array are all located between the paskmask shapes and on the heat dissipation pad. Then, the coordinate data of the areas in the MAX array (i.e., the data of the center coordinates of each area) and the coordinate data of the edge of the heat sink pad are calculated to calculate the vias located at the edge of the heat sink pad and store them in the N array. Finally, the vias can be designed based on the coordinate data of the vias in the N array (i.e., based on the initial area set, the target area set is screened, and then the center coordinates of each target area in the target area set are determined as the position coordinates of the vias on the heat sink pad).

[0077] Figure 7 is a schematic diagram of an optional via hole moving on a heat dissipation pad according to an embodiment of the present invention, such as Figure 7 As shown, there are multiple common pads around the heat dissipation pad with four tin leakage areas, and the four vertices of the heat dissipation pad have been determined (point A (X1, Y1), point B (X2, Y2), point C (X3, Y3), point D (X4, Y4)). The via can first take point A as the initial center, calculate the area of ​​the via on the pad that is not in the paskmask, and then move along the X-axis or Y-axis direction, and calculate the area of ​​the via on the pad that is not in the paskmask after each movement.

[0078] Step S404: determining a heat dissipation area of ​​a heat dissipation cover under each heat dissipation pad based on the vertex coordinates of each heat dissipation pad.

[0079] Optionally, the step of determining the heat dissipation skin area of ​​the heat sink under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad includes: determining the turning angle formed by every two connected sides of each heat dissipation pad based on the vertex coordinates of each heat dissipation pad; when the turning angle is a right angle, adjusting the horizontal coordinate of each vertex coordinate of the heat dissipation pad, generating a first coordinate point based on the adjusted horizontal coordinate and the original vertical coordinate, and adjusting the vertical coordinate of each vertex coordinate of the heat dissipation pad, generating a second coordinate point based on the adjusted vertical coordinate and the original horizontal coordinate, wherein the first coordinate point and the second coordinate point are both located on the pad area of ​​the heat dissipation pad; characterizing the first coordinate point and the second coordinate point as a corner point combination of corresponding vertices to obtain multiple groups of corner point combinations; sequentially connecting each corner point in the corner point combination of each vertex to obtain a contour, and determining the area within the contour as the heat dissipation skin area of ​​the heat sink under the heat dissipation pad.

[0080] In an embodiment of the present invention, the heat dissipation area of ​​the heat dissipation pad under the heat dissipation pad can be determined according to the principle that the heat dissipation area of ​​the heat dissipation pad (i.e., the copper pad) is as close as possible to the pad area, but the heat dissipation pad design cannot have a right angle, specifically: the turning angle of the heat dissipation pad can be determined according to the vector algorithm (i.e., based on the vertex coordinates of each heat dissipation pad, the turning angle of each two connected sides of each heat dissipation pad is determined). When the turning angle is a right angle, the horizontal coordinate of each vertex coordinate of the heat dissipation pad can be adjusted, and a first coordinate point can be generated based on the adjusted horizontal coordinate and the original vertical coordinate (the first coordinate point can be obtained by moving the horizontal coordinate of the vertex coordinate), or the vertical coordinate of each vertex coordinate of the heat dissipation pad can be adjusted, and a second coordinate point can be generated based on the adjusted vertical coordinate and the original horizontal coordinate (the second coordinate point can be obtained by moving the vertical coordinate of the vertex coordinate), and both the first coordinate point and the second coordinate point need to be located on the pad area of ​​the heat dissipation pad. Then, the first coordinate point and the second coordinate point can be characterized as a corner point combination of the corresponding vertices to obtain multiple groups of corner point combinations.

[0081] Figure 8 is a schematic diagram of an optional method for determining a combination of corner points according to an embodiment of the present invention, such as Figure 8As shown in the figure, there are multiple common pads around the heat dissipation pad, and the four vertices of the heat dissipation pad (point A (X1, Y1), point B (X2, Y2), point C (X3, Y3), point D (X4, Y4)) have been determined. According to AB*AD=(X2-X1, Y2-Y1)*(X4-X1, Y4-Y1)=0, it can be judged that point A is a right angle. Similarly, it can be judged that points B, C and D are also right angles. Therefore, the corner coordinates of the copper foil need to be redesigned according to the corner point combination of the heat dissipation pad. The mark is set so that there is no right angle in the copper design. By adjusting the horizontal coordinate or vertical coordinate of each vertex coordinate of the heat sink pad, it can be determined that the corner point combination of point A is {(X1, Y1+5), (X1+5, Y1)}, the corner point combination of point B is {(X2-5, Y2), (X2, Y2+5)}, the corner point combination of point C is {(X3-5, Y2), (X3, Y3+5)}, and the corner point combination of point D is {(X4, Y4-5), (X4+5, Y4)}.

[0082] Fig. 9 is a schematic diagram of an optional process of determining the turning point of point A according to an embodiment of the present invention, such as Fig. 9 As shown, for Figure 8 Point A (X1, Y1) in the figure can be obtained by adjusting the horizontal or vertical coordinates of the coordinates of point A to obtain (X1, Y1+5), (X1+5, Y1), (X1-5, Y1), and (X1, Y1-5). By comparing with the coordinates of the heat sink pad area, it can be seen that only (X1 Y1+5) and (X1+5Y1) fall in the heat sink pad area, so the coordinates of these two points can be used as the corner points of point A.

[0083] Then, the coordinate values ​​of each corner point are calculated in turn to automatically draw the copper skin shape according to the coordinate values ​​of each corner point (that is, each corner point in the corner point combination of each vertex is connected in turn to obtain the outline, and the area within the outline is determined as the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad).

[0084] Optionally, after determining the heat dissipation skin area of ​​the heat dissipation skin under each heat dissipation pad, the method further includes: determining a solder resist area of ​​the solder resist layer within the heat dissipation skin area.

[0085] In an embodiment of the present invention, based on the principle that the soldermask shape area (i.e., the solder resist area of ​​the solder resist layer) does not exceed the copper skin area (to prevent the copper skin area from being covered with an insulating layer, thereby reducing the heat dissipation effect), the soldermask shape area can be automatically drawn according to the coordinates of the copper skin area, which can effectively avoid the situation where the soldermask shape area exceeds the copper skin area.

[0086] Step S405 , generating a heat dissipation channel of the chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0087] In the embodiment of the present invention, a heat dissipation channel for dissipating heat for a chip on a target board can be formed through the heat dissipation pad, the via hole on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0088] Another optional specific implementation is described in detail below.

[0089] This embodiment proposes a method for automatically and batch-wise adding vias and copper foils to a heat dissipation pad, which can automatically identify the heat dissipation pad according to its features, automatically identify the position of the vias, automatically design the heat dissipation copper foil area according to the position of the heat dissipation pad, and automatically add a soldermask shape area. The specific process is as follows:

[0090] (1) Put all the pads on the board into the array Pad = (P1, P2...), calculate the paskmask number a of the pad area, if a is greater than or equal to the preset number (such as 2), then judge that this pad is a heat dissipation pad, and record this pad in the array Q = {Z1, Z2, Z3, Z4...}, where P1, P2, etc. are used to indicate all pads (including ordinary pads and heat dissipation pads), and Z1, Z2, Z3, Z4, etc. are used to indicate heat dissipation pads.

[0091] (2) Operate the pads in array Q one by one, such as pad Z1, grab each vertex (X1, Y1), (X2, Y2), (X3, Y3), (X3, Y4) of the pad, and make the difference between the X coordinate and Y coordinate of a vertex and the other vertices, X1-X2, X1-X3, X1-X4, Y1-Y2, Y1-Y3, Y1-Y4, and the vertex with the largest number of values ​​greater than 0 is located in the upper right corner of the pad, and the vertex with the least number of values ​​greater than 0 is located in the lower left corner of the pad. Take the coordinate of the lower left corner as the center of the via, draw a circle with a preset diameter (such as 20 mil), if the preset diameter is 20 mil, then the area is 100π, the area of ​​the via circle outside the pad is S1, the area of ​​the via circle overlapping with paskmask is S2, and the area of ​​the via on the pad that is not in paskmask is L1=100π-S1-S2. Then move the via in the X-axis direction by a preset distance, and calculate L2 again; or move the via in the Y-axis direction by a preset distance, and calculate L3 again. Continue to move the via, each time moving the preset distance along the X-axis or Y-axis direction, and store the area obtained after each movement in the two-dimensional array L (each area in the array L corresponds to the coordinates of the center of the circle), compare and sort all the area data (L1, L2...) in the array L, and store the area greater than the preset area threshold indicated by the sorting result in the MAX array. The vias in this MAX array are located between the paskmask shapes and on the heat sink. After that, the coordinate data of the MAX array members are calculated by difference to obtain the via located at the edge of the heat sink, and stored in the N array, and then the via position is designed according to the coordinate data in the N array.

[0092] (3) Operate the pads in array Q one by one, such as Z1 pad, grab each vertex of the pad ((X1, Y1), (X2, Y2), (X3, Y3), (X3, Y4), and then determine the rotation angle of the vertex of the heat sink pad based on the principle that if the vector product is 0, the two vectors are perpendicular. For example, according to Figure 8 , AB*AD=(X2-X1,Y2-Y1)*(X4-X1,Y4-Y1)=0, it can be judged that point A is a right angle. Afterwards, the corner coordinates of the copper foil are redesigned according to the corner angle of the pad so that the copper foil design does not have a right angle. The corner point combination of the heat dissipation pad vertex can be re-determined by adjusting the horizontal coordinate or vertical coordinate of each vertex coordinate of the heat dissipation pad, and the corner point combination of each heat dissipation pad vertex is recorded in the array K. Finally, the copper foil shape is automatically drawn according to the array K.

[0093] (4) Based on the principle that the shape area of ​​the soldermask does not exceed the copper area, the shape of the soldermask is drawn according to the data in the array K to avoid the situation where the shape area of ​​the soldermask exceeds the copper area.

[0094] In the embodiment of the present invention, the method of automatically and batch adding vias and copper foil on the heat dissipation pad can replace the cumbersome manual design, obtain the appropriate via position through data comparison, and the determined copper foil area can cover the heat dissipation pad area to the maximum extent. At the same time, through the automatic operation of the program, the via position on the heat dissipation pad, the heat dissipation copper foil area, the soldermask shape, etc. can be determined in batches, which effectively improves the design efficiency, saves labor costs and inspection costs, and improves the design quality and design consistency.

[0095] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the relevant technology, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods of each embodiment of the present application.

[0096] The following is a detailed description in conjunction with another embodiment.

[0097] Embodiment 2

[0098] In this embodiment, a processing device based on the heat dissipation structure of the board is also provided, and the processing device is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0099] Fig.10 is a schematic diagram of an optional processing device based on a heat dissipation structure of a board according to an embodiment of the present invention, such as Fig.10 As shown, the processing device may include: an acquisition unit 100, an identification unit 101, a first determination unit 102, a second determination unit 103, and a generation unit 104, wherein:

[0100] The acquisition unit 100 is used to acquire pad data of all pads on a target board, and acquire the number of stencil cavities and the vertex coordinates of each vertex of each pad from the pad data, wherein a chip is provided on the target board;

[0101] An identification unit 101 is used to identify the heat dissipation pad from all pads based on the number of stencil cavities;

[0102] A first determining unit 102 is used to determine the position coordinates of via holes on the heat dissipation pad based on the vertex coordinates of each heat dissipation pad, wherein the via holes are used to expand the heat dissipation area;

[0103] A second determining unit 103, configured to determine a heat dissipation skin area of ​​a heat dissipation skin under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad;

[0104] The generating unit 104 is used to generate a heat dissipation channel of the chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0105] The above-mentioned processing device can obtain the pad data of all pads on the target board through the acquisition unit 100, and obtain the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, identify the heat dissipation pad from all pads based on the number of steel mesh holes through the identification unit 101, determine the position coordinates of the via on the heat dissipation pad based on the vertex coordinates of each heat dissipation pad through the first determination unit 102, determine the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad through the second determination unit 103, and generate the heat dissipation channel of the chip on the target board based on the heat dissipation pad, the via on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad through the generation unit 104. Through the present application, the heat sink pad can be automatically identified according to the number of voids in the steel mesh, and the position coordinates of the via and the heat sink area can be automatically determined according to the coordinate data of the heat sink pad. Then, the heat sink pad, the vias on each heat sink pad and the heat sink under each heat sink pad are constructed as a heat dissipation channel for the chip to dissipate heat for the chip, which can improve design efficiency and ensure the heat dissipation effect of the chip, thereby solving the technical problem in the related technology that manual design of vias and addition of copper foils are required, which easily causes inappropriate via positions and omission of copper foils, resulting in poor heat dissipation effect for the chip.

[0106] Optionally, the processing device also includes: a first setting module, used to set a steel mesh on each pad before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, wherein the steel mesh is provided with at least one hole; a first generating module, used to fill solder paste into the holes of the steel mesh to generate a tin leakage area of ​​the pad; and a first determining module, used to determine the number of tin leakage areas on the pad to obtain the number of steel mesh holes of the pad.

[0107] Optionally, the pad is a polygonal pad, and the processing device also includes: a first selection module, which is used to select any one of the two connected edges of the heat dissipation pad as a baseline before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh voids and the vertex coordinates of each vertex of each pad from the pad data; a first establishment module, which is used to establish a horizontal axis parallel to the baseline and a vertical axis perpendicular to the horizontal axis; a second establishment module, which is used to establish a coordinate axis based on the horizontal axis and the vertical axis; and a second determination module, which is used to determine the vertex coordinates of each vertex of each pad based on the coordinate axis.

[0108] Optionally, the identification unit includes: a second setting module, used to set a steel mesh void number threshold; a third determination module, used to determine that the pad is a heat dissipation pad when the number of steel mesh voids of the pad is greater than or equal to the steel mesh void number threshold.

[0109] Optionally, the first determination unit includes: a fourth determination module, used to determine the lower left vertex and upper right vertex of the heat dissipation pad based on the vertex coordinates of the heat dissipation pad; a fifth determination module, used to determine the via area of ​​the via based on a preset diameter of the via; a first calculation module, used to calculate the area of ​​the via on the heat dissipation pad and not on the steel mesh cavity based on the via area when the center of the via is located at the lower left vertex; a second calculation module, used to take the lower left vertex as the starting point, move the center of the via by a preset distance along the horizontal axis or the vertical axis in sequence until the center of the via moves to the upper right vertex of the heat dissipation pad, and calculate the area of ​​the via on the heat dissipation pad and not on the steel mesh cavity based on the via area in sequence to obtain multiple areas; a sixth determination module, used to determine the position coordinates of the via on each heat dissipation pad based on multiple areas and the center coordinates corresponding to each area.

[0110] Optionally, the sixth determination module includes: a first sorting submodule, used to sort multiple areas to obtain a sorting result; a first screening submodule, used to screen out areas greater than a preset area threshold from multiple areas based on the sorting result to obtain an initial area set; a second screening submodule, used to screen a target area set based on the initial area set; and a first determination submodule, used to determine the center coordinates of each target area in the target area set as the position coordinates of the via on the heat sink.

[0111] Optionally, the second determination unit includes: a seventh determination module, used to determine the corner angle formed by every two connected edges of each heat dissipation pad based on the vertex coordinates of each heat dissipation pad; a first adjustment module, used to adjust the horizontal coordinate of each vertex coordinate of the heat dissipation pad when the corner angle is a right angle, generate a first coordinate point based on the adjusted horizontal coordinate and the original vertical coordinate, and adjust the vertical coordinate of each vertex coordinate of the heat dissipation pad, and generate a second coordinate point based on the adjusted vertical coordinate and the original horizontal coordinate, wherein the first coordinate point and the second coordinate point are both located on the pad area of ​​the heat dissipation pad; a first characterization module, used to characterize the first coordinate point and the second coordinate point as a corner point combination of corresponding vertices to obtain multiple groups of corner point combinations; an eighth determination module, used to sequentially connect each corner point in the corner point combination of each vertex to obtain a contour, and determine the area within the contour as the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad.

[0112] Optionally, the processing device further includes: a ninth determining module, configured to determine a solder resist area of ​​the solder resist layer within the heat resist area after determining a heat dissipation area of ​​the heat dissipation area under each heat dissipation pad.

[0113] The above-mentioned processing device may also include a processor and a memory. The above-mentioned acquisition unit 100, identification unit 101, first determination unit 102, second determination unit 103, generation unit 104, etc. are all stored in the memory as program units, and the processor executes the above-mentioned program units stored in the memory to realize corresponding functions.

[0114] The processor includes a kernel, which retrieves the corresponding program unit from the memory. One or more kernels can be set, and the kernel parameters are adjusted to generate the heat dissipation channel of the chip on the target board based on the heat dissipation pad, the via on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0115] The above-mentioned memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one storage chip.

[0116] The present application also provides a computer program product, which, when executed on a data processing device, is suitable for executing an initialization program having the following method steps: obtaining pad data of all pads on a target board, and obtaining the number of steel mesh holes and the vertex coordinates of each vertex of each pad from the pad data, identifying heat dissipation pads from all pads based on the number of steel mesh holes, determining the position coordinates of vias on the heat dissipation pads based on the vertex coordinates of each heat dissipation pad, determining the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad based on the vertex coordinates of each heat dissipation pad, and generating a heat dissipation channel for the chip on the target board based on the heat dissipation pads, the vias on each heat dissipation pad, and the heat dissipation skin under each heat dissipation pad.

[0117] It should be noted that the above modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0118] According to another aspect of an embodiment of the present invention, a computer-readable storage medium is provided, in which a computer program is stored, wherein when the computer program is executed by a processor, the steps of the processing method based on the heat dissipation structure of the board are implemented.

[0119] According to another aspect of an embodiment of the present invention, an electronic device is also provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the steps of the above-mentioned processing method based on the heat dissipation structure of the board when executing the computer program.

[0120] Fig.11 1 is a hardware structure block diagram of an electronic device (or mobile device) for a processing method for a heat dissipation structure based on a board according to an embodiment of the present invention. Fig.11 As shown, the electronic device may include one or more (shown as 1102a, 1102b, ..., 1102n in the figure) processors 1102 (the processor 1102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA), and a memory 1104 for storing data. In addition, it may also include: a display, an input / output interface (I / O interface), a universal serial bus (USB) port (which may be included as one of the ports of the I / O interface), a network interface, a keyboard, a power supply and / or a camera. It can be understood by those skilled in the art that Fig.11 The structure shown is only for illustration and does not limit the structure of the above electronic device. Fig.11 More or fewer components as shown, or with Fig.11 Different configurations shown.

[0121] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0122] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0123] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0124] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0125] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0126] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the relevant technology or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk and other media that can store program codes.

[0127] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A processing method based on a heat dissipation structure of a board, characterized in that: include: Obtaining pad data of all pads on a target board, and obtaining the number of stencil cavities and vertex coordinates of each vertex of each pad from the pad data, wherein a chip is provided on the target board; Based on the number of stencil voids, a heat dissipation pad is identified from all the pads, wherein the step of identifying the heat dissipation pad from all the pads comprises: setting a stencil void number threshold; and determining that the pad is the heat dissipation pad when the number of stencil voids of the pad is greater than or equal to the stencil void number threshold; Based on the vertex coordinates of each of the heat dissipation pads, the position coordinates of the via holes are determined on the heat dissipation pad, wherein the via holes are used to expand the heat dissipation area; the step of determining the position coordinates of the via holes on the heat dissipation pad comprises: determining the lower left vertex and the upper right vertex of the heat dissipation pad based on the vertex coordinates of the heat dissipation pad; determining the via area of ​​the via hole based on a preset diameter of the via hole; when the center of the via hole is located at the lower left vertex, calculating the area of ​​the via hole on the heat dissipation pad and not on the steel mesh cavity based on the via area; taking the lower left vertex as the starting point, moving the center of the via hole by a preset distance along the horizontal axis or the vertical axis in sequence until the center of the via hole moves to the upper right vertex of the heat dissipation pad, and calculating the area of ​​the via hole on the heat dissipation pad and not on the steel mesh cavity based on the via area in sequence to obtain multiple areas; determining the position coordinates of the via hole on each of the heat dissipation pad based on the multiple areas and the center coordinates corresponding to each area; Based on the vertex coordinates of each of the heat dissipation pads, a heat dissipation area of ​​the heat dissipation pad under the heat dissipation pad is determined, wherein the step of determining the heat dissipation area of ​​the heat dissipation pad under the heat dissipation pad comprises: based on the vertex coordinates of each of the heat dissipation pads, determining the turning angle formed by every two connected sides of each of the heat dissipation pads; when the turning angle is a right angle, adjusting the horizontal coordinate of each vertex coordinate of the heat dissipation pad, generating a first coordinate point based on the adjusted horizontal coordinate and the original vertical coordinate, and adjusting the vertical coordinate of each vertex coordinate of the heat dissipation pad, generating a second coordinate point based on the adjusted vertical coordinate and the original horizontal coordinate, wherein both the first coordinate point and the second coordinate point are located on the pad area of ​​the heat dissipation pad; characterizing the first coordinate point and the second coordinate point as a corresponding corner point combination of the vertices to obtain a plurality of groups of corner point combinations; sequentially connecting each of the corner points in the corner point combinations of each of the vertices to obtain a contour, and determining the area within the contour as the heat dissipation area of ​​the heat dissipation pad under the heat dissipation pad; A heat dissipation channel of the chip on the target board is generated based on the heat dissipation pads, the via holes on each of the heat dissipation pads, and the heat dissipation skin under each of the heat dissipation pads.

2. The processing method according to claim 1, characterized in that: Before obtaining the pad data of all pads on the target board and obtaining the number of steel mesh voids and the vertex coordinates of each vertex of each pad from the pad data, the method further includes: Arranging a steel mesh on each of the pads, wherein the steel mesh is provided with at least one cavity; Filling solder paste into the cavities of the steel mesh to generate a solder leakage area of ​​the pad; The number of tin leakage areas on the pad is determined to obtain the number of stencil cavities of the pad.

3. The processing method according to claim 1, characterized in that: The pad is a polygonal pad, and before obtaining pad data of all pads on the target board and obtaining the number of steel mesh voids and vertex coordinates of each vertex of each pad from the pad data, it also includes: Select any one of two connected edges of the pad as a reference line; Establishing a horizontal axis parallel to the reference line, and establishing a vertical axis perpendicular to the horizontal axis; Establishing a coordinate axis based on the horizontal axis and the vertical axis; Based on the coordinate axis, the vertex coordinates of each vertex of each of the pads are determined.

4. The processing method according to claim 1, characterized in that: The step of determining the position coordinates of the via hole on each of the heat dissipation pads based on the multiple areas and the coordinates of the center of a circle corresponding to each of the areas comprises: Sorting the multiple areas to obtain a sorting result; Based on the sorting result, select an area greater than a preset area threshold from the multiple areas to obtain an initial area set; Based on the initial area set, screening a target area set; The center coordinates of each target area in the target area set are determined as the position coordinates of the via hole on the heat dissipation pad.

5. The processing method according to claim 1, characterized in that: After determining the heat dissipation area of ​​the heat dissipation skin under each of the heat dissipation pads, the method further includes: A solder resist area of ​​the solder resist layer is determined in the heat dissipation skin area.

6. A processing device based on a heat dissipation structure of a board, characterized in that: include: An acquisition unit, used for acquiring pad data of all pads on a target board, and acquiring the number of stencil cavities and vertex coordinates of each vertex of each pad from the pad data, wherein a chip is provided on the target board; An identification unit, configured to identify a heat dissipation pad from all the pads based on the number of cavities in the steel mesh; A first determining unit, configured to determine the position coordinates of a via hole on the heat dissipation pad based on the vertex coordinates of each of the heat dissipation pads, wherein the via hole is used to expand a heat dissipation area; A second determining unit, configured to determine a heat dissipation skin area of ​​a heat dissipation skin under the heat dissipation pad based on the vertex coordinates of each of the heat dissipation pads; A generating unit, for generating a heat dissipation channel of the chip on the target board based on the heat dissipation pad, the vias on each of the heat dissipation pads, and the heat dissipation skin under each of the heat dissipation pads; The identification unit includes: a second setting module for setting a steel mesh void number threshold; a third determination module for determining that the pad is a heat dissipation pad when the number of steel mesh voids of the pad is greater than or equal to the steel mesh void number threshold; The first determination unit includes: a fourth determination module, which is used to determine the lower left vertex and the upper right vertex of the heat dissipation pad based on the vertex coordinates of the heat dissipation pad; a fifth determination module, which is used to determine the via area of ​​the via based on the preset diameter of the via; a first calculation module, which is used to calculate the area of ​​the via on the heat dissipation pad and not on the steel mesh cavity based on the via area when the center of the via is located at the lower left vertex; a second calculation module, which is used to take the lower left vertex as the starting point, move the center of the via by a preset distance along the horizontal axis or the vertical axis in sequence until the center of the via moves to the upper right vertex of the heat dissipation pad, and calculate the area of ​​the via on the heat dissipation pad and not on the steel mesh cavity based on the via area in sequence to obtain multiple areas; a sixth determination module, which is used to determine the position coordinates of the via on each heat dissipation pad based on the multiple areas and the center coordinates corresponding to each area; The second determination unit includes: a seventh determination module, which is used to determine the corner angle formed by every two connected edges of each heat dissipation pad based on the vertex coordinates of each heat dissipation pad; a first adjustment module, which is used to adjust the horizontal coordinate of each vertex coordinate of the heat dissipation pad when the corner angle is a right angle, and generate a first coordinate point based on the adjusted horizontal coordinate and the original vertical coordinate, and adjust the vertical coordinate of each vertex coordinate of the heat dissipation pad, and generate a second coordinate point based on the adjusted vertical coordinate and the original horizontal coordinate, wherein the first coordinate point and the second coordinate point are both located on the pad area of ​​the heat dissipation pad; a first characterization module, which is used to characterize the first coordinate point and the second coordinate point as a corner point combination of corresponding vertices to obtain multiple groups of corner point combinations; an eighth determination module, which is used to sequentially connect each corner point in the corner point combination of each vertex to obtain a contour, and determine the area within the contour as the heat dissipation skin area of ​​the heat dissipation skin under the heat dissipation pad.

7. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the processing method of the heat dissipation structure based on the board described in any one of claims 1 to 5.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the processing method based on the heat dissipation structure of the board described in any one of claims 1 to 5 are implemented.

Images