A camera chip high-speed mounting machine
By designing a camera chip high-speed patch machine using a chassis, bracket, bracket and guide frame, the existing patch machine equipment is solved, with complex, high working strength and prone to failure, and the equipment structure is simplified and the working efficiency is improved.
Patent Information
- Application Number
- CN202211482883.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-24
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2042-11-24
AI Technical Summary
The existing patch machine equipment is complex, has high working intensity, is prone to failure, has low working efficiency, and often requires shutdown and maintenance. The equipment is complex, has high purchase cost, high maintenance cost, and is inconvenient to use.
A high-speed camera chip patch machine is designed, which adopts the structure of a chassis, bracket, bracket and guide frame. It is equipped with a conveyor roller and conveyor frame. The patch device is driven up and down through an electric push rod. The combination of the stapler, toggle plate and guide frame is used to make the conveyor frame move automatically and synchronously, achieving efficient mounting of the chip.
It simplifies the equipment structure, reduces the purchase and maintenance costs, improves the reliability and work efficiency of equipment, reduces the frequency of shutdown and repair, is easy to operate, and is not easy to damage.
Smart Images

Figure CN115867020B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip mounters, and in particular to a high-speed chip mounter for camera chips. Background Art
[0002] With the development of science and technology and the improvement of living standards, photographic tools have become indispensable electronic products in daily life. They can record every bit of life and beautiful moments, and today's cameras have separate processing chips.
[0003] Chip testing and patching are indispensable. Chips are small and fragile, and it is difficult to move chips manually. Chip patching equipment is generally used to install chips during chip patching. The patch machine needs to perform uninterrupted cycle patching, but the existing patch machine equipment is complex and has high work intensity, which leads to easy failure and low work efficiency. It often needs to be shut down for maintenance. In addition, the equipment is complex, the purchase cost is high, the maintenance cost is high, and it is inconvenient to use. Summary of the invention
[0004] The purpose of the present invention is to solve the problems that the existing placement machines are complex, have high working intensity, are prone to failure, have low working efficiency, often need to stop working for maintenance, and have complex equipment, high purchase cost, high maintenance cost, and are inconvenient to use.
[0005] To achieve the above object, the technical solution of the present invention is: a camera chip high-speed placement machine, comprising a base frame, the upper surface of the base frame is provided with a bracket, a bracket and a guide frame, the bracket is provided with a plurality of conveying rollers, the conveying rollers are provided with a conveying frame, the bracket is located on one side of the bracket, the top of the bracket is provided with an electric push rod, and the output end of the electric push rod is provided with a placement device;
[0006] The patch device comprises a shell, an air pump is arranged inside the shell, a bellows is arranged at the output end of the air pump, a patch tube is arranged at one end of the bellows, a buffer mechanism connected to the patch tube is arranged at the bottom of the shell, the patch tube passes through the shell and the buffer mechanism and extends to the outside, and a rotatable lever is arranged on the side of the shell through a torsion spring;
[0007] The guide frame is located at one side of the bracket, and comprises an inclined block for changing the direction of the shifting rod. A stopper is arranged at one side of the inclined block, and the distance between the stopper and the inclined block is the same as the width of the shifting rod.
[0008] Preferably, the conveying rack includes a rack body, a plurality of mounting positioning grooves for mounting chips are formed on the rack body, a chip rack is fixedly connected to the rack body through pillars, a plurality of square holes are formed on the chip rack, grooves are formed on both side walls of the square holes, a spring is provided inside the groove, a fixing block for fixing the chip is provided at one end of the spring, a toggle plate is fixedly connected to one side of the rack body, and a plurality of toggle square holes matching with the toggle rods are formed on the toggle plate.
[0009] Preferably, the mounting positioning grooves correspond to the number of the square holes and are located directly above the square holes, and the toggle square holes correspond to the number of the square holes and are located on one side of the square holes.
[0010] Preferably, the frame body, the chip frame and the shifting plate are each provided with a convex card slot at one end, and a concave card slot matched with the convex card slot at the other end, and screw holes are provided on the convex card slot and the concave card slot.
[0011] Preferably, one end of the patch tube is fixedly connected to a rubber head, and the rubber head is provided with a through hole communicating with the patch tube.
[0012] Preferably, the buffer mechanism includes a buffer spring fixed to the bottom of the shell, a limit plate is provided at one end of the buffer spring, the limit plate is sleeved on the patch tube, and two symmetrical limit columns are also provided at the bottom of the shell, and the limit plate is sleeved on the limit columns.
[0013] Preferably, a guide rod is provided on the bracket, and the patch device is arranged on the guide rod.
[0014] Preferably, a limiting top block for limiting the movement of the lever is fixedly connected to one side of the shell.
[0015] Preferably, a positioning plate is provided on the upper surface of the base frame at one end of the bracket, a rotatable limiting frame is provided on the side of the positioning plate through a torsion spring, and a limiting inclined block adapted to the toggle square hole is provided at one end of the limiting frame.
[0016] Compared with the prior art, the present invention has the following beneficial effects: through the arrangement of the conveying frame, the present invention can install chips and circuit boards or packaging boards for mounting chips on the conveying frame, so that the chips and the circuit boards for mounting chips are vertical structures up and down, the chips can be directly installed through the mounter, and the conveying frame can be moved by the cooperation of the shifting rod, the shifting plate and the guide frame, without the need for complicated equipment, with a simple structure, easy operation, not easy to damage, low maintenance cost, and easy to promote. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a front view of the present invention.
[0018] Figure 2It is a rear view of the present invention.
[0019] Figure 3 This is the first operation diagram of the present invention.
[0020] Figure 4 This is the second operation diagram of the present invention.
[0021] Figure 5 It is a schematic diagram of the conveying frame of the present invention.
[0022] Figure 6 It is a cross-sectional view of the conveying frame of the present invention.
[0023] Figure 7 It is a cross-sectional view of the patch device of the present invention.
[0024] Figure 8 It is a cross-sectional view of the positioning plate of the present invention.
[0025] In the figure: 1. base frame; 2. bracket; 3. guide frame; 31. tilting block; 32. stopper; 4. conveyor roller; 5. conveyor frame; 51. frame body; 52. mounting positioning groove; 53. chip frame; 54. spring; 55. fixing block; 56. toggle plate; 57. toggle square hole; 58. convex card slot; 59. concave card slot; 6. electric push rod; 7. mounter; 71. housing; 72. vacuum pump; 73. bellows; 74. mount tube; 741. rubber head; 75. buffer mechanism; 751. buffer spring; 752. limit plate; 753. limit column; 76. lever; 77. limit top block; 8. guide rod; 9. positioning plate; 91. limit frame; 92. limit oblique block. DETAILED DESCRIPTION
[0026] The present invention will now be described in further detail with reference to the accompanying drawings. The accompanying drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and thus only show the components related to the present invention.
[0027] Please refer to Figure 1-8 A high-speed chip mounter for camera chip comprises a base frame 1, a bracket 2, a support and a guide frame 3 are arranged on the upper surface of the base frame 1, a plurality of conveying rollers 4 are arranged on the bracket 2, a conveying frame 5 is arranged on the conveying roller 4, the bracket is located on one side of the bracket 2, an electric push rod 6 is arranged on the top of the bracket, and a chip mounter 7 is arranged at the output end of the electric push rod 6. The conveying frame 5 is placed on the conveying roller 4 and can move. It is necessary to install limiting guide plates on both sides of the conveying roller 4 to ensure that the conveying frame 5 can move parallel to the conveying roller 4 to avoid offset, so that the chip mounter 7 can be aligned.
[0028] The patch device 7 includes a shell 71, an air pump 72 is arranged inside the shell 71, a bellows 73 is arranged at the output end of the air pump 72, a patch tube 74 is arranged at one end of the bellows 73, a buffer mechanism 75 connected to the patch tube 74 is arranged at the bottom of the shell 71, the patch tube 74 passes through the shell 71 and the buffer mechanism 75 and extends to the outside, and a rotatable lever 76 is arranged on the side of the shell 71 through a torsion spring. The patch device 7 is driven up and down by the electric push rod 6, as shown in FIG. Figure 1 and Figure 2 As described above, the lever 76 can only move toward the housing 71 through the torsion spring, and rotates around the torsion spring. The patch tube 74 is connected to the air pump 72 through the bellows 73, so that the end of the patch tube 74 can have a large suction force, so that the patch tube 74 can grab the chip. It should be noted that the lever 76 is made of metal and has a smooth arc shape at the bottom. The lever 76 rotates toward the patch tube 74 through the torsion spring.
[0029] The guide frame 3 is located on one side of the bracket, and the guide frame 3 includes a tilting block 31 for changing the direction of the lever 76. A stopper 32 is provided on one side of the tilting block 31, and the distance between the stopper 32 and the tilting block 31 is the same as the width of the lever 76. When the mounter 7 moves downward through the electric push rod 6, the lever 76 moves downward. Figure 3 and 4 As shown, the lever 76 passes through the inclined surface of the tilting block 31. The downward force will cause the lever 76 to change its position along the tilting block 31 and finally reach between the stopper 32 and the tilting block 31. At this time, the lever 76 changes from an inclined state to a vertical state, and the lever 76 will rotate and move. When the lever 76 moves downward, it will first pass through the toggle square hole 57 of the conveyor frame 5. When the lever 76 reaches between the stopper 32 and the tilting block 31, the rotation of the lever 76 will simultaneously push the toggle square hole 57 forward, that is, push the conveyor frame 5 forward. Each time the lever 76 moves downward, it will first pass through the toggle square hole 57, which will cause the conveyor frame 5 to move forward, thereby achieving the purpose of automatic and synchronous movement of the conveyor frame 5.
[0030] The conveyor frame 5 includes a frame body 51, on which a plurality of mounting positioning grooves 52 for mounting chips are provided, and a chip frame 53 is fixedly connected to the frame body 51 through a support, and a plurality of square holes are provided on the chip frame 53, and grooves are provided on both side walls of the square holes, and a spring 54 is provided inside the groove, and a fixing block 55 for fixing the chip is provided at one end of the spring 54, and a toggle plate 56 is fixedly connected to one side of the frame body 51, and a plurality of toggle square holes 57 adapted to the toggle rod 76 are provided on the toggle plate 56. Figure 5As shown, the mounting positioning groove 52 can be installed with a paste board or a circuit board, and the fixing block 55 lifted by the spring 54 inside the square hole can clamp the chip to fix the chip. It should be noted that in order to ensure the correct price of the installed chip, a limiting groove needs to be opened on the fixing block 55 so that the chip is just stuck in the groove and the chip is accurately fixed.
[0031] The mounting positioning grooves 52 correspond to the number of the square holes and are located directly above the square holes. The shifting square holes 57 correspond to the number of the square holes and are located on one side of the square holes.
[0032] The frame 51, the chip frame 53 and the toggle plate 56 are all provided with a convex groove 58 at one end and a concave groove 59 matched with the convex groove 58 at the other end, and screw holes are provided on the convex groove 58 and the concave groove 59. The convex groove 58 and the concave groove 59 can connect multiple conveying frames 5 by bolts to form a longer patch processing line.
[0033] One end of the patch tube 74 is fixedly connected with a rubber head 741, and a through hole communicating with the patch tube 74 is provided on the rubber head 741. When the rubber head 741 contacts the chip, damage to the chip can be avoided, and the rubber head 741 can be closely attached to the surface of the chip for easy adsorption.
[0034] The buffer mechanism 75 includes a buffer spring 751 fixed to the bottom of the housing 71, a limit plate 752 is provided at one end of the buffer spring 751, the limit plate 752 is sleeved on the patch tube 74, and two symmetrical limit posts 753 are also provided at the bottom of the housing 71, the limit plates 752 are sleeved on the limit posts 753. The buffer mechanism 75 can prevent the rubber head 741 from applying too much force when contacting the chip, and also prevent the chip from being crushed by too much force during mounting, playing a buffering role.
[0035] The bracket is provided with a guide rod 8, and the patch mounter 7 is arranged on the guide rod 8. The guide rod 8 enables the patch mounter 7 to move up and down only along the guide rod 8 to avoid misalignment.
[0036] A limit top block 77 for limiting the movement of the lever 76 is fixedly connected to one side of the housing 71. The limit top block 77 prevents the lever 76 from being reset too much, so that it can be accurately reset and start to fall at one position each time.
[0037] The upper surface of the base frame 1 is provided with a positioning plate 9 at one end of the bracket 2, and a rotatable limiting frame 91 is provided on the side of the positioning plate 9 through a torsion spring, and a limiting inclined block 92 adapted to the square hole 57 is provided at one end of the limiting frame 91. The limiting inclined block 92 can fix the position of the conveying frame 5, and the limiting frame 91 can only rotate upward through the torsion spring. The limiting inclined block 92 is a special structure and can only move along the inclined surface to prevent the conveying frame 5 from moving backward when the lever 76 rises. It should be noted that there are slots on the positioning plate 9, which will not affect the movement of the conveying frame 5.
[0038] When the camera chip high-speed placement machine is in use, the chip is installed in the square hole and clamped by the fixing block 55. The circuit board or packaging board is installed in the placement positioning groove 52. The vacuum pump 72 is started, and the conveyor frame 5 can be moved by the conveying roller 4. The placement device 7 moves up and down by the electric push rod. Under normal conditions, the lever 76 is pressed against the limit top block 77, and the whole is in an inclined state. At this time, the bottom of the lever 76 corresponds to the toggle square hole 57 on the conveyor frame 5. When the placement device 7 moves downward, the lever 76 will first pass through the toggle square hole 57, and then continue to move downward. When it hits the inclined surface of the inclined block 31, it will move along the inclined surface due to the downward force, and change direction, which will cause the lever 76 to rotate a certain amount. The angle changes from inclined to vertical, and becomes vertical when moving between the inclined block 31 and the stop block 32. When the angle is changed, the square hole 57 will be pushed forward, that is, the conveyor frame 5 will be pushed forward. At this time, the limiting inclined block 92 will enter the corresponding square hole 57. At the same time, the patch tube 74 will correspond to the chip in the square hole, and the rubber head 741 will absorb the chip and push the chip downward, so that the chip will fall on the circuit board or packaging board installed in the mounting positioning groove 52, stop the vacuum pump 72, and then the electric push rod 6 drives the patch device 7 to rise. At this time, because the limiting inclined block 92 is fixed, the conveyor frame 5 will not move. When the lever 76 drops next time, the conveyor frame 5 will move.
[0039] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.
Claims
1. A camera chip high-speed placement machine, comprising a base frame (1), characterized in that: The upper surface of the base frame (1) is provided with a bracket (2), a support and a guide frame (3); a plurality of conveying rollers (4) are provided on the bracket (2); a conveying frame (5) is provided on the conveying rollers (4); the bracket is located on one side of the bracket (2); an electric push rod (6) is provided on the top of the bracket; and a patch mounter (7) is provided at the output end of the electric push rod (6); The patch device (7) comprises a shell (71), an air pump (72) is arranged inside the shell (71), a bellows (73) is arranged at the output end of the air pump (72), a patch tube (74) is arranged at one end of the bellows (73), a buffer mechanism (75) connected to the patch tube (74) is arranged at the bottom of the shell (71), the patch tube (74) passes through the shell (71) and the buffer mechanism (75) and extends to the outside, and a rotatable lever (76) is arranged on the side of the shell (71) via a torsion spring; The guide frame (3) is located on one side of the bracket, and the guide frame (3) comprises a tilting block (31) for changing the direction of the shifting rod (76); a stopper (32) is provided on one side of the tilting block (31), and the distance between the stopper (32) and the tilting block (31) is the same as the width of the shifting rod (76); The conveying frame (5) comprises a frame body (51), the frame body (51) is provided with a plurality of mounting positioning grooves (52) for mounting chips, the frame body (51) is fixedly connected to a chip frame (53) via a support, the chip frame (53) is provided with a plurality of square holes, two side walls of the square holes are provided with grooves, a spring (54) is arranged inside the groove, one end of the spring (54) is provided with a fixing block (55) for fixing the chip, a toggle plate (56) is fixedly connected to one side of the frame body (51), and the toggle plate (56) is provided with a plurality of toggle square holes (57) adapted to the toggle rod (76).
2. A camera chip high-speed placement machine according to claim 1, characterized in that: The mounting positioning grooves (52) correspond to the number of the square holes and are located directly above the square holes; the shifting square holes (57) correspond to the number of the square holes and are located on one side of the square holes.
3. The camera chip high-speed placement machine according to claim 1, characterized in that: The frame body (51), the chip frame (53) and the toggle plate (56) are each provided with a convex card slot (58) at one end and a concave card slot (59) matched with the convex card slot (58) at the other end, and screw holes are provided on the convex card slot (58) and the concave card slot (59).
4. The camera chip high-speed placement machine according to claim 1, characterized in that: One end of the patch tube (74) is fixedly connected to a rubber head (741), and the rubber head (741) is provided with a through hole communicating with the patch tube (74).
5. The camera chip high-speed placement machine according to claim 1, characterized in that: The buffer mechanism (75) comprises a buffer spring (751) fixed to the bottom of the housing (71); a limit plate (752) is provided at one end of the buffer spring (751); the limit plate (752) is sleeved on the patch tube (74); and two symmetrical limit columns (753) are also provided at the bottom of the housing (71); the limit plate (752) is sleeved on the limit columns (753).
6. The camera chip high-speed placement machine according to claim 1, characterized in that: A guide rod (8) is provided on the bracket, and the patch mounter (7) is provided on the guide rod (8).
7. The camera chip high-speed placement machine according to claim 1, characterized in that: A limiting top block (77) for limiting the movement of the shifting rod (76) is fixedly connected to one side of the housing (71).
8. The camera chip high-speed placement machine according to claim 1, characterized in that: A positioning plate (9) is provided on the upper surface of the base frame (1) at one end of the bracket (2); a rotatable limiting frame (91) is provided on the side of the positioning plate (9) via a torsion spring; and a limiting inclined block (92) adapted to the toggle square hole (57) is provided at one end of the limiting frame (91).
Citation Information
Patent Citations
Braid feeding device of chip mounter and chip mounter
CN103754678A
Chip mounting equipment
CN110678059A