Printed circuit board and method for manufacturing the same

Abstract

The application discloses a printed circuit board and a preparation method thereof. The preparation method of the printed circuit board comprises the following steps: obtaining at least one conductive layer, preparing a circuit by using the at least one conductive layer to form at least one circuit layer, obtaining at least one insulating layer, drilling and metallizing the at least one insulating layer to form at least one conductive hole on the insulating layer, and cross-laminating and pressing the at least one circuit layer and the at least one insulating layer to prepare the printed circuit board. By the above method, the printed circuit board preparation process can be reduced, the printed circuit board preparation cycle can be shortened, the production energy consumption can be saved, and the printed circuit board preparation efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the technical field of printed circuit board processing, and in particular to a printed circuit board and its preparation method. Background Technology

[0002] PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board, is a widely used and important electronic component. It serves as the support for electronic components and also as the carrier for the electrical connections of electronic components.

[0003] The current manufacturing of printed circuit boards often uses HDI technology, which involves using a substrate as a reference and sequentially performing laser drilling, electroplating, circuit fabrication, and lamination. These actions are repeated until the entire printed circuit board is laminated. In other words, each layer addition requires repeating the above actions.

[0004] Existing printed circuit board (PCB) fabrication hardware configurations are costly, the fabrication process is complex, and the efficiency is low. Summary of the Invention

[0005] This invention provides a printed circuit board and a method for manufacturing the same, thereby improving the manufacturing efficiency and reliability of printed circuit boards.

[0006] To solve the above-mentioned technical problems, the present invention provides a method for manufacturing a printed circuit board, comprising: obtaining at least one conductive layer, using the at least one conductive layer to prepare circuits to form at least one circuit layer; obtaining at least one insulating layer, drilling and metallizing the at least one insulating layer to form at least one conductive hole on each insulating layer; and sequentially stacking and laminating the at least one circuit layer and the at least one insulating layer in a cross-layer manner to prepare a printed circuit board.

[0007] The step of obtaining at least one insulating layer, drilling and metallizing the at least one insulating layer to form at least one conductive hole on each insulating layer includes: obtaining at least one insulating layer, attaching a first protective layer to one side of each insulating layer; drilling and metallizing each insulating layer with the attached first protective layer to form at least one conductive hole on each insulating layer and the corresponding first protective layer; and removing the first protective layer.

[0008] The step of drilling and metallizing each insulating layer to which the first protective layer is attached, so as to form at least one conductive hole on each insulating layer and the corresponding first protective layer, includes: drilling each insulating layer to which the first protective layer is attached, so as to prepare at least one through hole on each insulating layer; attaching a first carrier to the side of each insulating layer away from the first protective layer, and filling at least one through hole with conductive slurry from the side of each insulating layer to which the first protective layer is attached and curing it, so as to metallize at least one through hole to form at least one conductive hole; and removing the first carrier.

[0009] The step of obtaining at least one insulating layer, drilling and metallizing the at least one insulating layer to form at least one conductive hole on each insulating layer includes: drilling each insulating layer to which a first protective layer is attached, to prepare at least one through hole on each insulating layer; and installing at least one conductive post into each of the at least one through hole to form at least one conductive hole on each insulating layer; wherein the size of the conductive post matches the size of the corresponding through hole.

[0010] The step of obtaining at least one conductive layer and using the at least one conductive layer to fabricate a circuit to form at least one circuit layer includes: obtaining a second carrier and setting a conductive layer on one side of the second carrier; attaching a second protective layer to the side of the conductive layer away from the second carrier according to a preset wiring rule; electroplating the side of the conductive layer away from the second carrier to form a circuit layer; and removing the second protective layer.

[0011] The step of sequentially stacking and pressing at least one circuit layer and at least one insulating layer to prepare a printed circuit board includes: sequentially placing the side of two circuit layers away from the corresponding second carrier on opposite sides of the same insulating layer and pressing them together; removing the second carrier and conductive layer until a predetermined number of core boards are obtained; and stacking and pressing the predetermined number of core boards and corresponding insulating layers together to prepare a printed circuit board.

[0012] The steps of obtaining at least one conductive layer and fabricating circuits on the conductive layer to form at least one circuit layer include: obtaining at least one conductive layer; and performing mechanical depth control or laser depth control on each conductive layer based on a preset position to remove conductive layers outside the preset position and form at least one circuit layer.

[0013] The step of obtaining at least one conductive layer and fabricating circuits on the conductive layer to form at least one circuit layer includes: obtaining at least one conductive layer; exposing and developing each conductive layer based on a preset position to remove the conductive layer outside the preset position, thereby forming at least one circuit layer.

[0014] The insulating layer is made of at least one or more of the following materials: epoxy resin, phenolic resin, polyimide, bismaleimide triazine, and ceramic matrix.

[0015] To solve the above-mentioned technical problems, the present invention also provides a printed circuit board, which is prepared by the printed circuit board preparation method of any of the above-mentioned methods.

[0016] The beneficial effects of this invention are as follows: Unlike the prior art, the preparation method of this invention utilizes at least one conductive layer for circuit fabrication to form at least one circuit layer, and drills and metallizes at least one insulating layer to form at least one conductive hole on each insulating layer. Thus, the fabrication of each circuit layer and conductive hole is completed before lamination. By cross-stacking at least one circuit layer and at least one insulating layer and laminating once, the layer addition between all board components can be completed, reducing the number of lamination steps in the printed circuit board fabrication process. Furthermore, the circuits and corresponding conductive holes of each circuit layer can be fabricated simultaneously without sequential processing, thereby shortening the production cycle, saving production energy, reducing hardware configuration requirements, and improving the fabrication efficiency of printed circuit boards. Attached Figure Description

[0017] Figure 1 This is a schematic flowchart of an embodiment of the printed circuit board manufacturing method provided by the present invention;

[0018] Figure 2 This is a schematic flowchart of another embodiment of the printed circuit board manufacturing method provided by the present invention;

[0019] Figure 3 yes Figure 2 A schematic diagram of the structure of the plate after electroplating in step S21 of the embodiment;

[0020] Figure 4 yes Figure 2 A schematic diagram of the structure of an embodiment during the hole metallization step S22 in the example;

[0021] Figure 5 yes Figure 2 A schematic diagram of the structure of the core board in step S23 of the embodiment;

[0022] Figure 6 This is a schematic diagram of the structure of a printed circuit board according to an embodiment of the present invention. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] Please see Figure 1 , Figure 1 This is a schematic flowchart of an embodiment of the printed circuit board manufacturing method provided by the present invention.

[0027] Step S11: Obtain at least one conductive layer and use the at least one conductive layer to fabricate a circuit to form at least one circuit layer.

[0028] First, at least one conductive layer is obtained. This conductive layer may include one or more of the following: copper, silver, gold, alloy, or other metals. The specific material of the conductive layer can be set based on actual needs and is not limited here.

[0029] After obtaining at least one conductive layer, the circuit is fabricated using the at least one conductive layer to form at least one circuit layer.

[0030] In a specific application scenario, the depth of at least one conductive layer can be controlled by mechanical depth control or laser depth control to complete the circuit fabrication and form at least one circuit layer.

[0031] In another specific application scenario, at least one conductive layer can be partially removed by exposure and development to complete the circuit fabrication and form at least one circuit layer.

[0032] In another specific application scenario, a circuit can be formed on one side of the conductive layer by partial electroplating, followed by removal of the conductive layer, thereby forming at least one circuit layer. Electroplating can improve circuit precision and allow for the fabrication of finer linewidths. The specific circuit fabrication method described in this embodiment is not limited to any particular method.

[0033] Step S12: Obtain at least one insulating layer, drill holes in the at least one insulating layer and metallize it to form at least one conductive hole on each insulating layer.

[0034] At least one insulating layer is obtained. The number of insulating layers and conductive layers can be set based on the fabrication requirements of the printed circuit board and are not limited here. In a specific application scenario, the number of insulating layers can be one less than the number of conductive layers, so that the conductive and insulating layers can be stacked and bonded in sequence to form a printed circuit board, with the opposite sides of the printed circuit board being conductive layers.

[0035] After obtaining at least one insulating layer, the at least one insulating layer is drilled and metallized to form at least one conductive hole on each insulating layer.

[0036] In a specific application scenario, at least one hole can be fabricated on each insulating layer using mechanical drilling, laser drilling, or local etching. Then, the at least one hole on each insulating layer is metallized, thereby forming at least one conductive hole on each insulating layer. This at least one conductive hole is used to achieve interlayer interconnection between circuit layers.

[0037] In a specific application scenario, the step of metallizing at least one hole on each insulating layer may include: firstly depositing copper on at least one hole on each insulating layer, and then electroplating the at least one hole after depositing copper with an electroplating solution to fill the hole, thereby metallizing at least one hole on each insulating layer.

[0038] In a specific application scenario, the step of metallizing at least one hole on each insulating layer may further include: placing each insulating layer on a first carrier, injecting conductive slurry from the side of each insulating layer away from the first carrier and curing it, thereby filling at least one hole with conductive material and achieving metallization of at least one hole on each insulating layer.

[0039] In this case, steps S12 and S11 only need to be completed before step S13, and the order of steps S12 and S11 is not limited here.

[0040] Step S13: At least one circuit layer and at least one insulating layer are sequentially stacked and pressed together to prepare a printed circuit board.

[0041] The at least one circuit layer prepared in step S11 and the at least one insulating layer prepared in step S12 are sequentially stacked and pressed together to prepare a printed circuit board.

[0042] In this embodiment, by preparing each circuit layer separately and then stacking at least one circuit layer and at least one insulating layer in a cross-layer configuration and performing a single lamination, all additional layers of the printed circuit board can be prepared. This avoids the traditional process where each additional layer requires at least one drilling, electroplating, circuit fabrication, and lamination operation. This embodiment reduces the number of lamination operations in the printed circuit board preparation process, and the circuits and corresponding conductive holes of each circuit layer can be prepared simultaneously without sequential processing. This shortens the production cycle, reduces hardware configuration requirements, saves production energy, and improves the preparation efficiency of the printed circuit board.

[0043] Through the above steps, the printed circuit board manufacturing method of this embodiment utilizes at least one conductive layer for circuit fabrication to form at least one circuit layer, and drills and metallizes at least one insulating layer to form at least one conductive hole on each insulating layer. Thus, the fabrication of each circuit layer and conductive hole is completed before lamination. Then, by cross-stacking at least one circuit layer and at least one insulating layer and laminating once, the layer addition between all board components can be completed, reducing the number of laminations in the printed circuit board manufacturing process. Moreover, the circuits and corresponding conductive holes of each circuit layer can be fabricated simultaneously without sequential processing, thereby shortening the production cycle, saving production energy, and improving the fabrication efficiency of the printed circuit board.

[0044] In other embodiments, the step of obtaining at least one conductive layer and fabricating circuits on the conductive layer to form at least one circuit layer may further include: obtaining at least one conductive layer; and performing mechanical depth control or laser depth control on each conductive layer based on preset positions to remove conductive layers outside the preset positions, thereby forming at least one circuit layer. The preset positions may be determined based on preset wiring rules for the corresponding conductive layer; that is, the preset positions may be the locations on the corresponding conductive layer where conductive circuits need to be fabricated.

[0045] By using mechanical depth control or laser depth control to fabricate circuits on each conductive layer to form a circuit layer, the fabrication process can be simplified, improving the fabrication efficiency of the circuit layer, reducing hardware configuration requirements, and enabling the simultaneous fabrication of each circuit layer, thereby improving the fabrication efficiency of printed circuit boards.

[0046] In other embodiments, the step of obtaining at least one conductive layer and fabricating circuits on the conductive layer to form at least one circuit layer may further include: obtaining at least one conductive layer, exposing and developing each conductive layer based on a preset position to remove the conductive layer outside the preset position, thereby forming at least one circuit layer.

[0047] By using exposure and development to fabricate circuits on each conductive layer to form circuit layers, the fabrication process can be improved by utilizing exposure and development, thus increasing the fabrication precision and accuracy of the circuits. Furthermore, it enables the simultaneous fabrication of each circuit layer, thereby improving the fabrication efficiency of printed circuit boards.

[0048] In other embodiments, the step of obtaining at least one insulating layer, drilling and metallizing the at least one insulating layer to form at least one conductive hole on each insulating layer may include: drilling each insulating layer to which a first protective layer is attached, to prepare at least one through-hole on each insulating layer; and installing at least one conductive post into at least one hole on each insulating layer to form at least one conductive hole on each insulating layer, wherein the size of the conductive post matches the size of the corresponding hole, thereby filling the corresponding entire hole and achieving metallization of at least one hole on each insulating layer. The above method can utilize the simple process of conductive post installation to improve the fabrication efficiency of circuit layers, reduce hardware configuration requirements, and achieve simultaneous fabrication of each circuit layer, thereby improving the fabrication efficiency of printed circuit boards.

[0049] Please see Figure 2 , Figure 2 This is a schematic flowchart of another embodiment of the printed circuit board manufacturing method provided by the present invention.

[0050] Step S21: Obtain the second carrier, set a conductive layer on one side of the second carrier, attach a second protective layer on the side of the conductive layer away from the second carrier according to the preset wiring rules, electroplate the side of the conductive layer away from the second carrier to form a circuit layer, and remove the second protective layer.

[0051] First, a second carrier is obtained. The second carrier is used to support the preparation of the circuit layer. It may include glass carrier, wood carrier, resin carrier, etc., and the specific type is not limited here.

[0052] A conductive layer is disposed on one side of the second carrier, wherein the conductive layer in this embodiment is used to assist in the formation of the circuit layer. In a specific application scenario, a conductive layer can be formed on one side of the second carrier by depositing copper.

[0053] After a conductive layer is disposed on one side of the second carrier, a second protective layer is attached to the side of the conductive layer away from the second carrier according to a preset wiring rule. The second protective layer may include a dry film, an anti-plating film, or an anti-plating structure.

[0054] Specifically, a second protective layer is applied to the side of the conductive layer away from the second carrier, and the areas where wiring needs to be fabricated are exposed according to a preset wiring rule, while the areas where wiring does not need to be fabricated are covered with the second protective layer. The preset wiring rule can be set based on the wiring fabrication requirements.

[0055] Next, electroplating is performed on the side of the conductive layer away from the second carrier to form a conductive layer on that side. At this point, since the areas where circuitry is not required are covered by the second protective layer, electroplating on the side of the conductive layer away from the second carrier allows the desired conductive lines to be formed along the edge of the second protective layer. The second protective layer is then removed to form the circuit layer.

[0056] In this step, each circuit layer is prepared as described above, resulting in at least one circuit layer. The preset routing rules for each circuit layer can differ, and are specifically set based on the circuit preparation requirements of each layer.

[0057] Please see Figure 3 , Figure 3 yes Figure 2 A schematic diagram of the structure of the plate after electroplating in step S21 of the embodiment.

[0058] A conductive layer 104 is formed on one side of the second carrier 101. A second protective layer 103 is attached to the side of the conductive layer 104 away from the second carrier 101. A circuit layer 102 is provided on the side of the conductive layer 104 away from the second carrier 101, except for the second protective layer 103.

[0059] In this step, a second protective layer is applied to the side of the conductive layer away from the second carrier where no circuitry is required. Then, conductive circuitry is formed along the edge gaps of the second protective layer by electroplating. This allows the linewidth of the conductive circuitry to be controlled by adjusting the application position of the second protective layer, thereby enabling the fabrication of conductive circuitry with arbitrary linewidths, especially ultra-fine conductive circuitry (linewidth less than 45 micrometers) and ultra-fine line spacing. This enables the fabrication of high-density circuit boards, expands the application range of printed circuit boards, and facilitates the miniaturization and high-density production of printed circuit boards.

[0060] Step S22: Obtain at least one insulating layer, attach a first protective layer to one side of each insulating layer, drill holes and metallize each insulating layer with the attached first protective layer to form at least one conductive hole on each insulating layer and the corresponding first protective layer, and remove the first protective layer.

[0061] At least one insulating layer is obtained, wherein the material of the insulating layer includes at least one or more of epoxy resin, phenolic resin, polyimide, bismaleimide triazine, and ceramic matrix.

[0062] A first protective layer is attached to one side of each insulating layer. The first protective layer may include a dry film, an anti-plating film, or an anti-plating structure.

[0063] Drill holes and metallize each insulating layer to which the first protective layer is attached, so as to form at least one conductive hole on each insulating layer and the corresponding first protective layer, and then remove the first protective layer.

[0064] In a specific application scenario, holes are drilled in each insulating layer to which the first protective layer is attached, to create at least one through-hole in each insulating layer. A first carrier is attached to the side of each insulating layer away from the first protective layer, and at least one through-hole is filled with conductive paste from the side of each insulating layer where the first protective layer is attached, and then cured to metallize at least one through-hole, forming at least one conductive hole. After curing, the first carrier and the first protective layer are removed. The conductive paste may include copper paste, silver paste, gold paste, or a mixture of metal paste and resin, etc., and is not specifically limited here.

[0065] In this process, when at least one through-hole is filled with conductive paste and cured, the first protective film is adhered to one side of the insulating layer. Therefore, after removing the first protective layer, the metallized conductive hole protrudes from the insulating layer on the side away from the first carrier. This allows the conductive hole to enhance its conductivity with the corresponding circuit layer after lamination, ensuring effective interlayer interconnection. Furthermore, the process of metallizing holes by filling with conductive paste is relatively simple and easy to control. Compared to electroplating, it reduces related process steps, saves the preparation cycle of metallized holes, and improves the manufacturing efficiency of printed circuit boards.

[0066] Please see Figure 4 , Figure 4 yes Figure 2 A schematic diagram of the structure of an embodiment during the hole metallization process in step S22 of the embodiment.

[0067] An insulating layer 202 is provided on one side of the first carrier 201, and at least one conductive hole 204 is provided on the insulating layer 202. A first protective layer 203 is attached to the side of the insulating layer 202 away from the first carrier 201. The side of the conductive hole 204 away from the first carrier 201 is flush with the side of the first protective layer 203 away from the first carrier 201.

[0068] Step S23: Place the two circuit layers away from the corresponding second carrier on opposite sides of the same insulating layer and press them together. Remove the second carrier and conductive layer until a preset number of core boards are obtained.

[0069] After preparing the insulation layer and the circuit layer, place the two circuit layers on opposite sides of the same insulation layer, away from the corresponding second carrier, and press them together. Remove the second carrier and the conductive layer until the preset number of core boards are obtained.

[0070] In a specific application scenario, when fabricating a 10-layer circuit board, a total of 10 circuit layers and 9 insulating layers need to be fabricated. Then, the sides of two circuit layers furthest from their corresponding second carriers are placed on opposite sides of the same insulating layer and pressed together. The second carrier and conductive layers are then removed until 5 core boards and the remaining 4 insulating layers are obtained. During the removal of the second carrier and conductive layers, to avoid impurities or etching solutions affecting the circuit layers, the sides of two circuit layers furthest from their corresponding second carriers are first pressed together with opposite sides of the same insulating layer. This allows the insulating layers to fill the gaps between the circuit layers, thus protecting the signal integrity of the circuit layers during the removal of the second carrier and conductive layers.

[0071] Please see Figure 5 , Figure 5 yes Figure 2 A schematic diagram of the structure of the core board in step S23 of the embodiment.

[0072] The core board 300 in this embodiment includes a first circuit layer 301, an insulating layer 303, and a second circuit layer 302. The first circuit layer 301, the insulating layer 303, and the second circuit layer 302 are stacked and bonded together in sequence, and the insulating layer 303 fills the gap between the first circuit layer 301 and the second circuit layer 302.

[0073] The insulating layer 303 is provided with at least one conductive hole 304, and the two ends of the at least one conductive hole 304 contact the first circuit layer 301 and the second circuit layer 302 respectively, thereby connecting the first circuit layer 301 and the second circuit layer 302.

[0074] Step S24: Stack and press a predetermined number of core boards and corresponding insulating layers together to prepare a printed circuit board.

[0075] After preparing a predetermined number of core boards, the predetermined number of core boards and corresponding insulating layers are stacked and pressed together once to prepare a printed circuit board with a complete number of layers.

[0076] Through the above method, the printed circuit board fabrication method of this embodiment obtains a second carrier, sets a conductive layer on one side of the second carrier, attaches a second protective layer to the side of the conductive layer away from the second carrier according to a preset wiring rule, and electroplats the side of the conductive layer away from the second carrier to form a circuit layer on one side of the second carrier. This allows control of the linewidth of the conductive lines by controlling the attachment position of the second protective layer, thereby enabling the fabrication of conductive lines of arbitrary width and improving the accuracy of the conductive lines in the circuit layer. In this embodiment, at least one insulating layer is also obtained, and a first protective layer is attached to one side of each insulating layer. Each insulating layer with the attached first protective layer is drilled and metallized to form at least one conductive hole on each insulating layer and the corresponding first protective layer. By preparing the conductive holes for each insulating layer before lamination, the preparation of the conductive holes for each insulating layer can be performed simultaneously, thereby avoiding the step-by-step drilling and metallization operations after lamination, saving the fabrication cycle. Then, in this embodiment, the two circuit layers, with the side furthest from the corresponding second carrier, are placed on opposite sides of the same insulating layer and pressed together to remove the second carrier and conductive layer until a predetermined number of core boards are obtained. Finally, the predetermined number of core boards and the corresponding insulating layers are stacked and pressed together to prepare a printed circuit board. This process separates the conductive layer of the copper plating in the circuit layers through core board preparation, ensuring the accuracy and signal integrity of the circuit layers. In this embodiment, the preparation of each circuit layer and conductive via is completed before pressing. By cross-stacking at least one circuit layer and at least one insulating layer and pressing them together once, the layering between all board components can be completed, reducing the number of pressing operations in the printed circuit board preparation process. Furthermore, the circuits and corresponding conductive vias of each circuit layer can be prepared simultaneously, eliminating the need for sequential processing. This shortens the production cycle, saves production energy, reduces hardware configuration requirements, and improves the efficiency of printed circuit board preparation.

[0077] Please see Figure 6 , Figure 6 This is a schematic diagram of a printed circuit board according to an embodiment of the present invention. This embodiment will be described using an 8-layer circuit board as an example. When the circuit board is a multilayer circuit board with other numbers of layers, its structure is similar to this embodiment, and will not be described again here.

[0078] The printed circuit board 400 in this embodiment includes eight circuit layers 420 and seven insulating layers 410. The eight circuit layers 420 and the seven insulating layers 410 are stacked and bonded together sequentially. Furthermore, the printed circuit board 400 has circuit layers 420 on both opposite sides.

[0079] The printed circuit board 400 also includes at least one conductive via 430. In a specific application scenario, at least one conductive via 430 is provided between each pair of adjacent circuit layers 420 to make contact with the adjacent two circuit layers 420 respectively through the conductive via 430, so as to realize interlayer interconnection.

[0080] In a specific application scenario, the conductive vias 430 between the circuit layers 420 in the printed circuit board 400 can form multi-level blind vias 440 to gradually connect each circuit layer 420 and realize the interlayer interconnection of the entire printed circuit board 400.

[0081] In this embodiment, the printed circuit board 400 is prepared by any of the above-described printed circuit board preparation methods.

[0082] Through the above structure, the circuit accuracy of the printed circuit board in this embodiment can be effectively improved, the interlayer conductivity, bonding force and stability are significantly enhanced, and the printed circuit board is made thinner, the circuit is more refined and the aperture is more dense.

[0083] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a printed circuit board, characterized in that, The method for manufacturing the printed circuit board includes: At least one insulating layer is obtained; the at least one insulating layer is drilled and metallized to form at least one conductive hole on each insulating layer; wherein, after obtaining the at least one insulating layer, a first protective layer is attached to one side of each insulating layer; the insulating layers with the attached first protective layer are drilled and metallized to form at least one conductive hole on each insulating layer and the corresponding first protective layer; the first protective layer is removed; wherein the conductive hole is prepared using a first carrier or conductive post; At least one conductive layer is obtained, and circuit fabrication is performed using the at least one conductive layer to form at least one circuit layer; wherein, a second carrier is obtained, and a conductive layer is disposed on one side of the second carrier; a second protective layer is attached to the conductive layer on the side away from the second carrier according to a preset wiring rule; the conductive layer on the side away from the second carrier is electroplated to form the circuit layer; and the second protective layer is removed. At least one layer of the circuit layer and at least one layer of the insulating layer are sequentially stacked and pressed together to prepare a printed circuit board; wherein, the sides of two circuit layers away from the corresponding second carrier are respectively placed on opposite sides of the same insulating layer and pressed together; the second carrier and the conductive layer are removed until a predetermined number of core boards are obtained; the predetermined number of core boards and the corresponding insulating layers are stacked and pressed together to prepare a printed circuit board.

2. The method for preparing a printed circuit board according to claim 1, characterized in that, The step of drilling and metallizing each insulating layer to which the first protective layer is attached, so as to form at least one conductive hole on each insulating layer and the corresponding first protective layer, includes: Drill holes in each insulating layer to which the first protective layer is attached, so as to prepare at least one through hole in each insulating layer; A first carrier is attached to the side of each insulating layer away from the first protective layer, and at least one through hole is filled with conductive slurry and cured from the side of each insulating layer where the first protective layer is attached, so as to metallize the at least one through hole and form the at least one conductive hole. Remove the first carrier.

3. The method for preparing a printed circuit board according to claim 1, characterized in that, The step of obtaining at least one insulating layer, drilling and metallizing the at least one insulating layer to form at least one conductive hole on each of the insulating layers includes: Drill holes in each insulating layer to which the first protective layer is attached, so as to prepare at least one through hole in each insulating layer; At least one conductive post is installed in at least one of the through holes to form at least one conductive hole on each of the insulating layers. The size of the conductive post is matched with the corresponding through hole.

4. The method for preparing a printed circuit board according to claim 1, characterized in that, The step of obtaining at least one conductive layer and using the at least one conductive layer to fabricate a circuit to form at least one circuit layer includes: At least one conductive layer is obtained; Based on preset positions, each of the conductive layers is subjected to mechanical depth control or laser depth control to remove conductive layers outside the preset positions, thereby forming the at least one circuit layer.

5. The method for preparing a printed circuit board according to claim 1, characterized in that, The step of obtaining at least one conductive layer and using the at least one conductive layer to fabricate a circuit to form at least one circuit layer includes: At least one conductive layer is obtained; Each conductive layer is exposed and developed based on a preset position to remove the conductive layer outside the preset position, thereby forming the at least one circuit layer.

6. The method for preparing a printed circuit board according to claim 1, characterized in that, The insulating layer is made of at least one or more of the following materials: epoxy resin, phenolic resin, polyimide, bismaleimide triazine, and ceramic matrix.

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