Apparatus for manufacturing an epitaxial wafer and method of manufacturing the same

Abstract

The application discloses a preparation device and method of an epitaxial wafer, and relates to the technical field of epitaxial wafer preparation technology. The device comprises a processing table, a bearing groove arranged on the processing table for bearing the epitaxial wafer, a sliding groove arranged at the center end of the bearing groove, a push plate slidingly arranged in the sliding groove, and a driving mechanism connected with the push plate for driving the push plate to lift and lower, so that the epitaxial wafer is pushed out to a preset height by the push plate. The device further comprises a material taking assembly arranged on the processing table for placing the epitaxial wafer in the bearing groove for coating treatment. The material taking assembly comprises a first air cylinder and an adsorption mechanism connected with the first air cylinder at the telescopic end. A material discharging assembly is arranged on the processing table for moving the epitaxial wafer out of the bearing groove after coating. Compared with the existing adsorption type material discharging assembly, the device does not affect the coating layer of the epitaxial wafer, and the epitaxial wafer can be directly moved out after coating, so that the next epitaxial wafer can be coated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of epitaxial wafer preparation technology, and particularly relates to an epitaxial wafer preparation device and a preparation method thereof. BACKGROUND

[0002] An epitaxial wafer refers to a semiconductor thin film grown on a substrate, and the thin film is mainly composed of a P type, a quantum well and an N type. A mainstream epitaxial material is gallium nitride, and substrate materials mainly include sapphire, silicon and carbon.

[0003] In the preparation process of the epitaxial wafer, the cleanliness of the epitaxial wafer is improved by coating a film on the epitaxial wafer. In the prior art, a layer of material is sprayed on the epitaxial wafer to form a thin film on the surface of the epitaxial wafer. When the epitaxial wafer is placed on a coating platform, a suction cup is generally used to adsorb the epitaxial wafer, and then a mechanical hand is used to transfer the epitaxial wafer. When the epitaxial wafer is unloaded, the suction cup and the mechanical hand are still used in cooperation. However, after the coating is completed, the epitaxial wafer needs to be placed for a period of time before being moved, otherwise, when the suction cup contacts the epitaxial wafer, the thin film material has not been formed and is in an unstable state, thereby affecting the processing quality. However, if the placement time is too long, the coating efficiency will be reduced. SUMMARY

[0004] The present application aims to provide an epitaxial wafer preparation device and a preparation method thereof, and solve the following technical problems:

[0005] When the epitaxial wafer is unloaded, the suction cup and the mechanical hand are still used in cooperation. However, after the coating is completed, the epitaxial wafer needs to be placed for a period of time before being moved, otherwise, when the suction cup contacts the epitaxial wafer, the thin film material has not been formed and is in an unstable state, thereby affecting the processing quality. However, if the placement time is too long, the coating efficiency will be reduced.

[0006] The purpose of the present application can be achieved by the following technical solutions:

[0007] An epitaxial wafer preparation device comprises:

[0008] a processing table;

[0009] a bearing groove arranged on the processing table and used for bearing the epitaxial wafer;

[0010] a sliding groove arranged at a center end of the bearing groove;

[0011] a push plate slidingly arranged in the sliding groove;

[0012] a driving mechanism connected with the push plate and used for driving the push plate to ascend and descend, so as to push the epitaxial wafer out of a preset height through the push plate;

[0013] Further comprising:

[0014] A material taking assembly is arranged on the processing table and used for placing the epitaxial wafer into the carrying groove for film coating treatment;

[0015] The material taking assembly comprises:

[0016] A first air cylinder;

[0017] An adsorption mechanism is connected to the first air cylinder at the telescopic end;

[0018] A material discharging assembly is arranged on the processing table and used for discharging the epitaxial wafer from the carrying groove after film coating treatment;

[0019] The material discharging assembly comprises:

[0020] A second air cylinder;

[0021] A clamping mechanism is connected to the second air cylinder at the telescopic end;

[0022] A transferring mechanism is arranged on one side of the processing table and connected to the material taking assembly and the material discharging assembly and used for adjusting the positions of the material taking assembly and the material discharging assembly.

[0023] Preferably, the adsorption mechanism comprises a suction disc fixedly connected to the output end of the first air cylinder, and the suction disc is connected to the vacuum equipment through a pipeline.

[0024] Preferably, the clamping mechanism comprises a support plate fixedly connected to the output end of the second air cylinder, and the support plate is arranged with a first screw rod on the side facing the processing table, and a first nut fixedly connected to the clamping plate is arranged on the first screw rod in a relative screwing manner.

[0025] Preferably, a first conveying belt for feeding is arranged on one side of the processing table, and a second conveying belt for discharging is arranged on the other side of the processing table.

[0026] Preferably, the transferring mechanism comprises a transferring frame slidingly arranged on the processing table, and a first rack plate is arranged on the inner end face of the transferring frame in a relative manner.

[0027] A half gear for engaging with the first rack plate is arranged on the processing table in a rotating manner, and a first rack and a second rack for mounting the first air cylinder and the second air cylinder respectively are arranged on the transferring frame.

[0028] Preferably, the distance between the first rack and the second rack is equal to the distance between the feeding end and the carrying groove or the distance between the carrying groove and the discharging end.

[0029] Preferably, the driving mechanism comprises a push rod fixedly connected to the push plate and a second screw rod, a second nut is arranged on the second screw rod in a relative screwing manner, the second nut is rotationally connected to a push rod, and the other end of the push rod is rotationally connected to the push rod.

[0030] The second screw end is provided with a main gear, and the transfer frame bottom is provided with a second rack plate engaged with the main gear.

[0031] Preferably, the sliding processing table is provided with a U-shaped support, and the coating equipment is installed on the side of the U-shaped support facing the processing table.

[0032] Preferably, the push plate is oppositely provided with a first electrode sheet facing the direction of the bearing groove, and the bearing groove wall is correspondingly provided with a second electrode sheet.

[0033] A preparation method of an epitaxial wafer preparation device, comprising the following steps:

[0034] S1, when feeding, the first conveying belt moves the epitaxial wafer to the suction and feeding end of the suction cup;

[0035] S2, the transfer mechanism drives the material taking assembly to move above the feeding end, the first cylinder drives the suction cup to be attached to the epitaxial wafer, the vacuum equipment is started, and the epitaxial wafer is suctioned and fixed;

[0036] S3, the transfer mechanism moves the epitaxial wafer to the bearing groove and places it in the bearing groove;

[0037] S4, the third cylinder drives the U-shaped support to move to the bearing groove, the coating equipment performs coating treatment on the epitaxial wafer, after the coating is completed, the third cylinder drives the U-shaped support to move away from the bearing groove;

[0038] S5, the driving mechanism drives the push plate to rise to a preset height, and the transfer mechanism moves the material placing assembly to the bearing groove;

[0039] S6, the second cylinder drives the support plate to move to a preset position, the first motor drives the first screw to rotate, and the two first nuts are synchronously driven to move the clamping plate to the inside during the transfer on the first screw, so that the epitaxial wafer is clamped and fixed;

[0040] S7, the material placing assembly moves the coated epitaxial wafer to the material placing end of the second conveying belt, and the epitaxial wafer is conveyed out through the second conveying belt.

[0041] The beneficial effects of the present application are:

[0042] (1) The present application moves the epitaxial wafer to the bearing groove through the transfer mechanism, moves the epitaxial wafer to be plated into the bearing groove, and then starts the plating equipment to plate the epitaxial wafer, after the plating is completed, the driving mechanism drives the push plate to rise to a preset height, then the transfer mechanism moves the feeding assembly to the bearing groove, the second cylinder drives the clamping mechanism to move to a preset position, the clamping mechanism is positioned and fixed at both ends of the epitaxial wafer, and does not directly contact the epitaxial wafer, compared with the existing adsorption type feeding assembly, the epitaxial wafer is not directly contacted with the surface of the epitaxial wafer, and the plating layer of the epitaxial wafer is not affected, and after the plating is completed, the epitaxial wafer can be directly moved out, so that the next epitaxial wafer is plated, and the plating efficiency is improved;

[0043] (2) In the present application, when the material taking assembly is located on the first conveying belt, the feeding assembly is located on the bearing groove, when the material taking assembly is located on the bearing groove, the feeding assembly is located on the second conveying belt, so that the embodiment of the present application can realize the effect of synchronous material taking and placing, and the efficiency is higher. BRIEF DESCRIPTION OF DRAWINGS

[0044] The present application will be further described below with reference to the accompanying drawings.

[0045] Figure 1 is a structure diagram of a preparation device of an epitaxial wafer of the present application Figure 1 ;

[0046] Figure 2 is a structure diagram of a preparation device of an epitaxial wafer of the present application Figure 2 ;

[0047] Figure 3 is a structure diagram of a preparation device of an epitaxial wafer of the present application Figure 3 ;

[0048] Figure 4 is a structure diagram of a preparation device of an epitaxial wafer of the present application Figure 4 ;

[0049] Figure 5 is a structure diagram of a preparation device of an epitaxial wafer of the present application Figure 5 ;

[0050] Figure 6 is a structure diagram of a preparation device of an epitaxial wafer of the present application Figure 6 ;

[0051] Figure 7 is a structure diagram of a bearing groove in a preparation device of an epitaxial wafer of the present application;

[0052] Figure 8 is a structure diagram of a cylinder body in a preparation device of an epitaxial wafer of the present application.

[0053] In the figure: 1, processing table; 2, third cylinder; 3, transfer frame; 4, first rack; 5, push plate; 6, second rack plate; 7, movable plate; 8, negative pressure pipe; 101, second conveying belt; 102, first conveying belt; 201, U-shaped support; 202, coating equipment; 301, first rack plate; 302, half gear; 303, second motor; 401, first rack; 402, second cylinder; 403, first cylinder; 404, suction cup; 405, support plate; 406, first screw; 407, first nut; 408, clamping plate; 409, first motor; 501, adsorption hole; 502, bearing groove; 503, sliding groove; 504, second electrode sheet; 505, push seat; 601, L-shaped support; 602, main gear; 603, second nut; 604, second screw; 605, push rod; 701, piston plate; 702, cylinder body; 703, piston rod. DETAILED DESCRIPTION

[0054] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0055] Embodiment 1

[0056] Please refer to Figures 1-2 As shown in the figure, the present application is a preparation device for epitaxial wafer, which comprises a processing table 1, the processing table 1 is provided with a bearing groove 502 for bearing the epitaxial wafer, the bearing groove 502 is provided with a sliding groove 503 at the center end, and a push plate 5 is slidably arranged in the sliding groove 503, the push plate 5 is connected with a driving mechanism for driving the push plate 5 to lift, so as to push the epitaxial wafer out of the preset height;

[0057] Further comprising a material taking assembly and a material placing assembly arranged on the processing table 1, the material taking assembly is used for placing the epitaxial wafer in the bearing groove 502 for coating treatment, the material taking assembly comprises a first cylinder 403, the first cylinder 403 is connected with a suction mechanism at the telescopic end, the material placing assembly is used for moving the epitaxial wafer out of the bearing groove 502 after coating, and the material placing assembly comprises a second cylinder 402, the second cylinder 402 is connected with a clamping mechanism at the telescopic end;

[0058] Further comprising a transfer mechanism arranged on one side of the processing table 1, the transfer mechanism is connected with the material taking assembly and the material placing assembly, so as to adjust the positions of the material taking assembly and the material placing assembly;

[0059] The processing table 1 is further provided with a coating equipment 202, in an embodiment of the present application, the coating equipment 202 is a spraying type coating device, first, the material taking assembly is moved to above the epitaxial wafer by the moving mechanism, the first cylinder 403 drives the adsorption mechanism to be attached to the epitaxial wafer, the epitaxial wafer is adsorbed and fixed by the adsorption mechanism, then the epitaxial wafer is moved to the bearing groove 502 by the moving mechanism, the epitaxial wafer to be coated is moved to the bearing groove 502, then the coating equipment 202 is started to coat the epitaxial wafer, after coating, the driving mechanism drives the push plate 5 to rise to a preset height, secondly, the material placing assembly is moved to the bearing groove 502 by the moving mechanism, the second cylinder 402 drives the clamping mechanism to move to a preset position, the clamping mechanism is positioned and fixed at both ends of the epitaxial wafer without directly contacting the epitaxial wafer, compared with the existing adsorption type material placing assembly, the embodiment does not directly contact the surface of the epitaxial wafer, and does not affect the coating layer of the epitaxial wafer, and after coating, the epitaxial wafer can be directly moved out, so that the next epitaxial wafer is coated, and the coating efficiency is improved;

[0060] Please refer to Figures 3-4 The adsorption mechanism comprises a suction cup 404 fixedly connected with the output end of the first cylinder 403, and the suction cup 404 is connected with a vacuum equipment through a pipeline; it can be explained that, when the epitaxial wafer is adsorbed and fixed, first, the first cylinder 403 drives the suction cup 404 to be attached to the epitaxial wafer, and then the vacuum equipment is started to adsorb and fix the epitaxial wafer;

[0061] In addition, the clamping mechanism comprises a support plate 405 fixedly connected with the output end of the second cylinder 402, the support plate 405 is provided with a first screw rod 406 on the side facing the processing table 1, the screw threads on the two sides of the first screw rod 406 are opposite in rotation direction, the first screw rod 406 is fixedly connected with the output end of a first motor 409 arranged on one side of the support plate 405, wherein a first nut 407 fixedly connected with a clamping plate 408 is sleeved on the first screw rod 406; in the present embodiment, when the epitaxial wafer after coating is fixed, the second cylinder 402 drives the support plate 405 to move to a preset position, so that the clamping plate 408 is located at both ends of the epitaxial wafer, the first motor 409 is started to drive the first screw rod 406 to rotate, and the two first nuts 407 synchronously drive the clamping plate 408 to move towards the inside during the moving process on the first screw rod 406, so as to clamp and fix the epitaxial wafer;

[0062] Further, the processing table 1 is provided with a first conveying belt 102 for feeding on one side, and a second conveying belt 101 for feeding on the other side; it can be explained that, when feeding, the first conveying belt 102 moves the epitaxial wafer to the adsorption feeding end of the suction cup 404, when discharging, the material placing assembly moves the epitaxial wafer after coating to the discharging end of the second conveying belt 101, and then the epitaxial wafer is conveyed out by the second conveying belt 101;

[0063] As a further scheme of the embodiment of the present application, the transferring mechanism comprises a transferring frame 3 slidingly arranged on the processing table 1, and a first rack plate 301 is oppositely arranged on the inner end face of the transferring frame 3; wherein, a half gear 302 for engaging with the first rack plate 301 is rotationally arranged between the processing tables 1, and the half gear 302 is fixedly connected with the output end of a second motor 303, and a first rack 401 for mounting a first cylinder 403 and a second rack 4 for mounting a second cylinder 402 are respectively arranged on the transferring frame 3;

[0064] Please refer to Figure 5 In another embodiment, the distance between the first rack 401 and the second rack 4 is equal to the distance between the loading end and the bearing groove 502 or the distance between the bearing groove 502 and the discharging end; it can be explained that when the positions of the material taking assembly and the material discharging assembly are adjusted, the second motor 303 is started to drive the half gear 302 to rotate, and the half gear 302 drives the transferring frame 3 to reciprocate by intermittently engaging with the upper and lower first rack plates 301 during rotation, and the first rack 401 and the second rack 4 are synchronously driven to move by the transferring frame 3 during movement, when the material taking assembly is located on the first conveying belt 102, the material discharging assembly is located on the bearing groove 502, when the material taking assembly is located on the bearing groove 502, the material discharging assembly is located on the second conveying belt 101, thereby the embodiment of the present application can realize the effect of synchronous material taking and discharging, and the efficiency is higher;

[0065] Please refer to Figure 6 The driving mechanism comprises a push seat 505 fixedly connected with the push plate 5, and the driving mechanism further comprises a second screw 604 rotationally arranged at the bottom of the processing table 1, the screw threads on the two sides of the second screw 604 are opposite in rotation direction, a second nut 603 is screwingly arranged on the second screw 604, the second nut 603 is rotationally connected with a push rod 605, and the other end of the push rod 605 is rotationally connected with the push seat 505; wherein, a main gear 602 is arranged at the end of the second screw 604, a second rack plate 6 engaging with the main gear 602 is arranged at the bottom of the transferring frame 3, and the second rack plate 6 is fixedly connected with the transferring frame 3 through an L-shaped support 601; in an embodiment of the present application, the second rack plate 6 is located below the first rack 401 and the second rack 4; during the movement of the suction cup 404 from the bearing groove 502 to the loading end, the transferring frame 3 synchronously drives the second rack plate 6 to move, the second rack plate 6 drives the second screw 604 to rotate by engaging with the main gear 602, and the second nut 603 moves on the second screw 604 to drive the push seat 505 to rise through the push rod 605, so as to clamp the wafer from both ends; when the suction cup 404 moves from the loading end to the bearing groove 502, the second screw 604 reversely rotates to reset the push plate 5 and the push seat 505;

[0066] Please refer toFigures 7-8 The processing table 1 is slidably provided with a U-shaped support 201, a coating device 202 is installed on the side of the U-shaped support 201 facing the processing table 1, and a third cylinder 2 is fixedly connected to the U-shaped support 201; in this embodiment, after the suction cup 404 places the epitaxial wafer in the carrying groove 502, the third cylinder 2 drives the U-shaped support 201 to move to the carrying groove 502, and the epitaxial wafer is coated by the coating device 202; after the coating is completed, the third cylinder 2 drives the U-shaped support 201 to move away from the carrying groove 502;

[0067] Further, the push plate 5 is relatively arranged with a first electrode sheet facing the carrying groove 502, and a second electrode sheet 504 is arranged on the groove wall of the carrying groove 502; it can be explained that when the push plate 5 is retracted into the carrying groove 502, the first electrode sheet and the second electrode sheet 504 are electrically connected, and the electrical signal is sent to the third cylinder 2 through the controller, and the third cylinder 2 drives the U-shaped support 201 to move to the carrying groove 502;

[0068] Among them, the carrying groove 502 is also provided with a plurality of adsorption holes 501, the adsorption holes 501 are connected with the cylinder body 702 through the negative pressure pipe 8, the cylinder body 702 is provided with a piston, the piston is fixedly connected with the piston plate 701 through the piston rod 703, and the piston plate 701 is fixedly connected with the movable plate 7 arranged at the bottom of the U-shaped support 201; it can be explained that when the third cylinder 2 drives the U-shaped support 201 to move away from the carrying groove 502, the U-shaped support 201 drives the piston to slide in the cylinder body 702 through the movable plate 7 and the piston plate 701, and generates negative pressure at the adsorption hole 501 through the negative pressure pipe 8, so as to firmly adsorb the epitaxial wafer in the carrying groove 502; when the U-shaped support 201 moves reversely, the negative pressure effect disappears, so as to facilitate the push plate 5 to lift the epitaxial wafer.

[0069] Embodiment 2

[0070] A preparation method of an epitaxial wafer preparation device, comprising the following steps:

[0071] S1, when feeding, the first conveying belt 102 moves the epitaxial wafer to the adsorption feeding end of the suction cup 404;

[0072] S2, the moving mechanism drives the material taking assembly to move above the feeding end, the first cylinder 403 drives the suction cup 404 to be attached to the epitaxial wafer, and then the vacuum equipment is started, so as to realize the adsorption and fixation of the epitaxial wafer;

[0073] S3, the epitaxial wafer is moved to the carrying groove 502 by the moving mechanism, and the epitaxial wafer to be coated is moved to the carrying groove 502;

[0074] S4, the third cylinder 2 drives the U-shaped support 201 to move to the bearing groove 502, and the epitaxial wafer is plated by the plating equipment 202, after the plating is completed, the third cylinder 2 drives the U-shaped support 201 to move away from the bearing groove 502 direction;

[0075] S5, the driving mechanism drives the push plate 5 to rise to a preset height, and then the feeding assembly is moved to the bearing groove 502 by the moving mechanism;

[0076] S6, the second cylinder 402 drives the support plate 405 to move to a preset position, and the first motor 409 is started to drive the first screw rod 406 to rotate, and the two first nuts 407 are moved on the first screw rod 406, and the clamping plate 408 is synchronously driven to move towards the inner side in the moving process, and the epitaxial wafer is clamped and fixed;

[0077] S7, the feeding assembly moves the plated epitaxial wafer to the feeding end of the second conveying belt 101, and the epitaxial wafer is conveyed out by the second conveying belt 101.

[0078] In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, and a particular orientation configuration and operation, therefore, it cannot be understood as a limitation on the present application. In addition, "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0079] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, and it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0080] The above describes one embodiment of the present application in detail, but the content described is only the preferred embodiment of the present application, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application shall still belong to the patent scope of the present application.

Claims

1. An apparatus for preparing an epitaxial wafer, characterized in that, The processing table (1) comprises: a bearing groove (502) arranged on the processing table (1) and used for bearing an epitaxial wafer; a sliding groove (503) arranged at a center end of the bearing groove (502); a push plate (5) slidingly arranged in the sliding groove (503); a driving mechanism connected with the push plate (5) and used for driving the push plate (5) to ascend and descend, so that the epitaxial wafer is pushed out of a preset height by the push plate (5); The processing table (1) further comprises: a material taking assembly arranged on the processing table (1) and used for placing the epitaxial wafer in the bearing groove (502) for film coating treatment; the material taking assembly comprises: a first air cylinder (403); a suction mechanism connected with a telescopic end of the first air cylinder (403); a material discharging assembly arranged on the processing table (1) and used for discharging the epitaxial wafer from the bearing groove (502) after film coating treatment; the material discharging assembly comprises: a second air cylinder (402); a clamping mechanism connected with a telescopic end of the second air cylinder (402); a moving mechanism arranged on one side of the processing table (1) and connected with the material taking assembly and the material discharging assembly, and used for adjusting positions of the material taking assembly and the material discharging assembly. The clamping mechanism comprises a support plate (405) fixedly connected with an output end of the second air cylinder (402), a first screw rod (406) rotatably arranged on one side of the support plate (405) towards the processing table (1), and a first motor (409) arranged on one side of the support plate (405) and having an output end fixedly connected with the first screw rod (406), wherein a first nut (407) fixedly connected with a clamping plate (408) is sleeved on the first screw rod (406) in a screwing manner; when the epitaxial wafer after film coating treatment is fixed, the second air cylinder (402) drives the support plate (405) to move to a preset position, so that the clamping plate (408) is located at two ends of the epitaxial wafer, the first motor (409) is started to drive the first screw rod (406) to rotate, and the clamping plate (408) moves towards the inside in a synchronous manner in the process of moving of the two first nuts (407) on the first screw rod (406), so as to clamp and fix the epitaxial wafer. One side of the processing table (1) is provided with a first conveying belt (102) used for feeding, and the other side is provided with a second conveying belt (101) used for discharging. The suction mechanism comprises a suction disc (404) fixedly connected with an output end of the first air cylinder (403) and connected with a vacuum device through a pipeline.

2. The apparatus according to claim 1, wherein The moving mechanism comprises a moving frame (3) slidingly arranged on the processing table (1), and a first rack plate (301) oppositely arranged on an inner end surface of the moving frame (3).

3. The apparatus according to claim 2, wherein The processing table (1) is rotatably provided with a half gear (302) used for engaging with the first rack plate (301), and the moving frame (3) is respectively provided with a first rack (401) used for mounting the first air cylinder (403) and a second rack (4) used for mounting the second air cylinder (402). The distance between the first rack (401) and the second rack (4) is equal to the distance between the feeding end and the bearing groove (502) or the distance between the bearing groove (502) and the discharging end.

4. The apparatus according to claim 3, wherein ​ 5. The apparatus according to claim 4, wherein The driving mechanism comprises a push rod (505) fixedly connected with the push plate (5) and a second screw (604), the second screw (604) is sleeved with a second nut (603) in opposite screw, the second nut (603) is rotationally connected with the push rod (605), and the other end of the push rod (605) is rotationally connected with the push rod (505); Wherein, the second screw (604) is provided with a main gear (602) at the end, and the bottom of the transfer frame (3) is provided with a second rack plate (6) engaged with the main gear (602).

6. The apparatus according to claim 5, wherein The processing table (1) is slidably provided with a U-shaped support (201), and the coating equipment (202) is installed on the side of the U-shaped support (201) facing the processing table (1). The processing table (1) is also provided with a third cylinder (2) fixedly connected with the U-shaped support (201).

7. The apparatus according to claim 6, wherein The push plate (5) is oppositely provided with a first electrode sheet facing the bearing groove (502), and the groove wall of the bearing groove (502) is correspondingly provided with a second electrode sheet (504).

8. A production method of a production apparatus of an epitaxial wafer, characterized by, The method comprises the following steps: S1, when feeding, the first conveying belt (102) moves the epitaxial wafer to the suction feeding end of the suction cup (404); S2, the transfer mechanism drives the material taking assembly to move above the feeding end, the first cylinder (403) drives the suction cup (404) to be attached to the epitaxial wafer, the vacuum equipment is started, and the epitaxial wafer is suctioned and fixed; S3, the transfer mechanism moves the epitaxial wafer to the bearing groove (502) and places it in the bearing groove (502); S4, the third cylinder (2) drives the U-shaped support (201) to move to the bearing groove (502), the coating equipment (202) performs coating treatment on the epitaxial wafer, after the coating is completed, the third cylinder (2) drives the U-shaped support (201) to move away from the bearing groove (502); S5, the driving mechanism drives the push plate (5) to rise to a preset height, and the transfer mechanism moves the discharging assembly to the bearing groove (502); S6, the second cylinder (402) drives the support plate (405) to move to a preset position, the first motor (409) drives the first screw (406) to rotate, and the two first nuts (407) are synchronously driven to move the clamping plate (408) to the inner side during the transfer process on the first screw (406), and the epitaxial wafer is clamped and fixed; S7, the discharging assembly moves the coated epitaxial wafer to the discharging end of the second conveying belt (101), and the epitaxial wafer is conveyed out by the second conveying belt (101).

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