Electronic devices

Abstract

The present application discloses an electronic device, comprising: a first circuit board and a bracket; the first circuit board and the bracket are stacked; components are provided on a side of the first circuit board facing the bracket, the bracket has a conductive layer on a side facing the first circuit board, and the conductive layer has an annular protrusion on a side facing the first circuit board; wherein the annular protrusion is electrically connected to the first circuit board so that a shielding cavity is formed between the conductive layer and the first circuit board, and the components are arranged in the shielding cavity.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to an electronic device. Background Art

[0002] As user demands increase, electronic devices are equipped with more and more functional modules, which can make the electronic devices more and more functional to meet the diverse demands of users.

[0003] However, in the motherboard area of ​​electronic devices, multiple functional modules are usually installed in a stacked manner, and a gap is required between the functional modules of two adjacent layers. This assembly structure will cause the thickness of the electronic device to be larger and cannot meet the demand for electronic devices to develop in a thinner direction. Summary of the invention

[0004] The present application aims to provide an electronic device, which at least solves the problem of large thickness of existing electronic devices.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, comprising: a first circuit board and a bracket;

[0007] The first circuit board and the bracket are stacked; components are arranged on a side of the first circuit board facing the bracket, a conductive layer is arranged on a side of the bracket facing the first circuit board, and an annular protrusion is arranged on a side of the conductive layer facing the first circuit board;

[0008] The annular protrusion is electrically connected to the first circuit board, so that a shielding cavity is formed between the conductive layer and the first circuit board, and the components are arranged in the shielding cavity.

[0009] According to an electronic device proposed in an embodiment of the present application, the electronic device further includes a second circuit board and a back cover;

[0010] A functional module is provided on the second circuit board, and the second circuit board is electrically connected to the first circuit board through a first conductive member; the back cover is provided on a side of the bracket away from the first circuit board; the functional module includes at least one of an NFC module, a power device and a power management module.

[0011] According to an electronic device proposed in an embodiment of the present application, the bracket further includes a plastic layer;

[0012] The plastic layer is arranged on a side of the conductive layer away from the first circuit board; the plastic layer is provided with a first opening; at least a part of the second circuit board is arranged in the first opening, and the second circuit board is sandwiched between the conductive layer and the back cover.

[0013] According to an electronic device provided by an embodiment of the present application, a vertical projection of the first opening on the conductive layer is located within a region defined by the annular protrusion.

[0014] According to an electronic device provided in an embodiment of the present application, a second opening is provided in an area of ​​the conductive layer exposed from the first opening, and the second opening is connected to the shielding cavity;

[0015] The first conductive member is inserted into the second opening, and the first conductive member is sandwiched between the first circuit board and the second circuit board.

[0016] According to an electronic device provided in an embodiment of the present application, the first conductive member includes an elastic member, and the elastic member abuts against at least one of the first circuit board and the second circuit board.

[0017] According to an electronic device provided in an embodiment of the present application, the conductive layer and the plastic layer are an integrally formed structure.

[0018] According to an electronic device provided in an embodiment of the present application, the conductive layer includes a metal conductive layer, and the annular protrusion is formed on the metal conductive layer by stamping;

[0019] And / or, the conductive layer and the plastic layer are formed into one piece by injection molding.

[0020] According to an electronic device provided in an embodiment of the present application, the electronic device further includes foam, and the foam is sandwiched between the second circuit board and the back cover.

[0021] According to an electronic device proposed in an embodiment of the present application, the electronic device further includes a flash module and a second conductive member;

[0022] The flash module is arranged on a side of the second circuit board away from the conductive layer;

[0023] A third opening is provided in the area where the conductive layer is exposed from the first opening, and the third opening is connected to the shielding cavity;

[0024] The second conductive member is inserted into the third opening; the flash module is electrically connected to the second circuit board, and the second circuit board is electrically connected to the first circuit board via the second conductive member.

[0025] In the embodiment of the present application, by providing a conductive layer on the bracket and providing an annular protrusion on one side of the conductive layer facing the first circuit board, after the bracket and the first circuit board are stacked, a shielding cavity can be formed in the area defined by the annular protrusion to achieve the purpose of electromagnetic shielding of the components on the first circuit board. In this way, compared with the prior art, the present application realizes the integrated design of the motherboard bracket and the shielding cover in the existing electronic device, which can save the thickness of the shielding cover, and there is no need to set a gap between the motherboard bracket and the shielding cover, so that the bracket of the present application does not occupy too much thickness space of the electronic device, which is conducive to the realization of a light and thin design of the electronic device.

[0026] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0028] Figure 1 is one of the cross-sectional views of an electronic device according to an embodiment of the present application;

[0029] Figure 2 is a second cross-sectional view of an electronic device according to an embodiment of the present application;

[0030] Figure 3 According to the embodiment of the present application Figure 1 Schematic diagram of the structure of the middle bracket.

[0031] Reference numerals:

[0032] 1. First circuit board; 2. Bracket; 21. Conductive layer; 22. Plastic layer; 201. First opening; 202. Second opening; 203. Third opening; 204. Fourth opening; 211. Annular protrusion; 221. Shielding cavity; 3. Second circuit board; 4. Foam; 5. Back cover; 6. Flash module; 7. Camera module; 8. First conductive member; 9. Second conductive member. DETAILED DESCRIPTION

[0033] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0034] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0035] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] Combine the following Figure 1-Figure 3 , the electronic device provided in the embodiment of the present application is described in detail through specific embodiments and their application scenarios.

[0038] like Figure 1 and Figure 3 As shown, the electronic device according to some embodiments of the present application includes: a first circuit board 1 and a bracket 2.

[0039] The first circuit board 1 and the bracket 2 are stacked; components are arranged on the side of the first circuit board 1 facing the bracket 2, the bracket 2 has a conductive layer 21 on the side facing the first circuit board 1, and the conductive layer 21 has an annular protrusion 211 on the side facing the first circuit board 1.

[0040] The annular protrusion 211 is electrically connected to the first circuit board 1 , so that a shielding cavity 221 is formed between the conductive layer 21 and the first circuit board 1 , and components are arranged in the shielding cavity 221 .

[0041] It is understandable that the first circuit board 1 may be a printed circuit board (PCB) known in the art, and the components arranged on the first circuit board 1 may include capacitors, resistors, processors, power semiconductor devices, etc.

[0042] At the same time, since the annular protrusion 211 is electrically connected to the first circuit board 1 and a circuit structure is disposed inside the first circuit board 1 , the conductive layer 21 and the first circuit board 1 form a shielding cavity 221 in the area corresponding to the annular protrusion 211 .

[0043] In this embodiment, the area where the annular protrusion 211 is disposed on the conductive layer 21 can be determined according to the distribution area of ​​the components on the first circuit board 1. Optionally, the annular protrusion 211 can be disposed to extend along the circumference of the distribution area.

[0044] Optionally, the conductive layer 21 may be made of metal materials such as copper, iron, aluminum, etc., or may be made of graphite, which is not specifically limited.

[0045] like Figure 1 As shown, one end of the annular protrusion 211 of the present embodiment facing the first circuit board 1 contacts the surface of the first circuit board 1 , so that the bracket 2 is supported on the upper side of the first circuit board 1 .

[0046] Since the annular protrusion 211 protrudes from the side of the conductive layer 21 facing the first circuit board 1, the side of the conductive layer 21 facing the first circuit board 1 forms a cover structure for covering the above-mentioned components, and the setting height of the annular protrusion 211 determines the height of the cover structure covering the components.

[0047] In practical applications, the annular protrusion 211 can be electrically connected to the ground terminal on the first circuit board 1, so that a shielding cavity 221 is formed between the conductive layer 21 and the first circuit board 1 based on the above-mentioned cover structure and the circuit inside the first circuit board 1. Since the components are arranged in the shielding cavity 221, the present application can not only perform electromagnetic shielding on the components on the first circuit board 1 based on the shielding cavity 221, but also form better physical protection for the components.

[0048] It can be seen from the above that compared with the prior art, the present application improves the above-mentioned bracket 2, and based on the mutual cooperation between the bracket 2 and the first circuit board 1, realizes the integrated design of the mainboard bracket and the shielding cover in the existing electronic device, which can save the thickness of the shielding cover, and there is no need to set a gap between the mainboard bracket and the shielding cover, so that the bracket 2 of the present application does not occupy too much thickness space of the electronic device, which is conducive to realizing a lightweight design of the electronic device.

[0049] It should be pointed out here that in the embodiments of the present application, the above-mentioned electronic device can be a mobile terminal, such as: a smart phone, a tablet computer (Tablet Personal Computer), a laptop computer (Laptop Computer), a personal digital assistant (personal digital assistant, PDA), a mobile Internet device (Mobile Internet Device, MID) or a wearable device (Wearable Device), etc., and can also be other electronic devices, such as digital cameras, e-books, navigators, etc.

[0050] In some embodiments, Figure 1 and Figure 3 As shown, the electronic device of the embodiment of the present application further includes a second circuit board 3 and a back cover 5 .

[0051] The second circuit board 3 is provided with a functional module, and the second circuit board 3 is electrically connected to the first circuit board 1 via a first conductive member 8 ; the rear cover 5 is provided on a side of the bracket 2 away from the first circuit board 1 .

[0052] It is understandable that the second circuit board 3 may be a printed circuit board known in the art, and the functional modules are integrated on the second circuit board 3 .

[0053] Since the second circuit board 3 is electrically connected to the first circuit board 1 through the first conductive member 8, the functional module that is arranged on the first circuit board 1 in the prior art is arranged on the second circuit board 3, thereby realizing functional expansion of the first circuit board 1 based on the second circuit board 3, and then the electronic device of the embodiment of the present application realizes fixing the second circuit board 3 between the first circuit board 1 and the back cover 5, and realizing installation of the functional module based on the second circuit board 3.

[0054] Optionally, the functional module may be at least one of an NFC module, a power device and a power management module.

[0055] In the case where the functional module is an NFC module, the NFC module may be specifically an NFC antenna or an NFC coil. NFC is the abbreviation of Near Field Communication, i.e., short-range wireless communication technology.

[0056] Since the NFC module is arranged on the second circuit board 3, and the second circuit board 3 is electrically connected to the first circuit board 1 through the first conductive member 8, in practical applications, the signal on the NFC module can be transmitted to the first circuit board 1 through the second circuit board 3 and the first conductive member 8 in turn, so that the first circuit board 1 receives the signal from the NFC module and realizes the corresponding communication function in turn.

[0057] Optionally, when the functional module is a power device, the power device may be an IGBT module and a related radio frequency circuit module. In practical applications, the antenna of the electronic device may be connected to the power device, and since the second circuit board 3 is electrically connected to the first circuit board 1 through the first conductive member 8, the signal of the antenna may be transmitted to the processing module on the first circuit board 1 under the control of the power device.

[0058] Optionally, in the case where the functional module is a power management module, the power management module may include an IC chip and a voltage sampling circuit and a current sampling circuit connected to the IC chip. The power management module may be connected to a power module in an electronic device to manage the charging status of the power module.

[0059] In some embodiments, Figure 1 and Figure 3 As shown, the bracket 2 of the embodiment of the present application further includes a plastic layer 22 . The plastic layer 22 is disposed on a side of the conductive layer 21 away from the first circuit board 1 .

[0060] Specifically, the present application provides a plastic layer 22 on the bracket 2 , and can prevent the heat generated by the components on the first circuit board 1 from being conducted to the side of the conductive layer 21 away from the first circuit board 1 through the plastic layer 22 .

[0061] Since the back cover 5 of the electronic device is usually arranged on the side of the bracket 2 away from the first circuit board 1, the heat-blocking effect of the plastic layer 22 is helpful to prevent the back cover 5 of the electronic device from overheating during use.

[0062] Furthermore, the plastic layer 22 is provided with a first opening 201 ; at least a portion of the second circuit board 3 is disposed in the first opening 201 , and the second circuit board 3 is sandwiched between the conductive layer 21 and the back cover 5 .

[0063] It is understandable that the embodiment of the present application can not only position the second circuit board 3 circumferentially based on the first opening 201 , but also reduce the thickness space occupied by the second circuit board 3 in the electronic device by disposing at least part of the second circuit board 3 in the first opening 201 .

[0064] According to actual needs, in this embodiment, the thickness of the second circuit board 3 can be set to be smaller than the thickness of the plastic layer 22 , or the thickness of the second circuit board 3 can be set to be larger than the thickness of the plastic layer 22 .

[0065] In some embodiments, in order to ensure the structural stability of the bracket 2 and prevent the conductive layer 21 and the plastic layer 22 of the bracket 2 from being separated, the conductive layer 21 and the plastic layer 22 of the embodiment of the present application are configured as an integrally formed structure.

[0066] In some examples, in order to facilitate the construction of the annular protrusion 211 on the conductive layer 21 and ensure the structural strength of the annular protrusion 211, the conductive layer 21 of the embodiment of the present application may be a metal conductive layer, and the annular protrusion 211 is formed by stamping on the metal conductive layer.

[0067] Optionally, the metal conductive layer in this embodiment may be a copper conductive layer or an aluminum conductive layer.

[0068] Of course, in this embodiment, the metal conductive layer having the annular protrusion 211 may also be constructed by casting.

[0069] In some examples, in order to ensure the bonding degree between the plastic layer 22 and the conductive layer 21 , and further ensure the structural strength of the bracket 2 , the embodiments of the present application may form the conductive layer 21 and the plastic layer into one piece by injection molding.

[0070] Among them, since the plastic layer has insulating properties, the present application can also ensure that the side of the bracket 2 facing away from the first circuit board 1 is electrically isolated from other electrical components based on the setting of the plastic layer.

[0071] In some embodiments, Figure 1 and Figure 2 As shown, in order to facilitate the connection of the functional module with the first circuit board 1 via the second circuit board 3 , the electronic device of the embodiment of the present application further includes a first conductive member 8 .

[0072] Specifically, a second opening 202 is provided in the area where the conductive layer 21 is exposed from the first opening 201 , and the second opening 202 is connected to the shielding cavity 221 ; the first conductive member 8 is passed through the second opening 202 , and the first conductive member 8 is sandwiched between the first circuit board 1 and the second circuit board 3 .

[0073] Based on the above configuration, the present embodiment can make full use of the space corresponding to the shielding cavity 221 to realize the layout of the first conductive member 8. Since the first conductive member 8 is sandwiched between the first circuit board 1 and the second circuit board 3, the second circuit board 3 and the first conductive member 8 are electrically connected, and the first conductive member 8 and the first circuit board 1 are electrically connected. In this way, based on the circuit structure on the second circuit board 3, the functional module can conveniently establish an electrical connection with the first circuit board 1 through the first conductive member 8, and this circuit connection structure does not occupy the thickness space of the electronic device.

[0074] Optionally, in this embodiment, the first conductive member 8 can be disposed on the side of the second circuit board 3 facing the first circuit board 1 , or on the side of the first circuit board 1 facing the second circuit board 3 , which is not specifically limited.

[0075] In some embodiments, the first conductive member 8 of the embodiment of the present application may be an elastic member, and the elastic member abuts against at least one of the first circuit board 1 and the second circuit board 3 .

[0076] It is understandable that the elastic member may be a spring or a spring. Thus, in this embodiment, by setting the first conductive member 8 as an elastic member, after the second circuit board 3 is sandwiched between the conductive layer 21 and the back cover 5, it is ensured that the first circuit board 1 is directly and reliably connected to the second circuit board 3 through the first conductive member 8, without the need for other wiring operations, and the operation is simple and convenient.

[0077] In some embodiments, Figure 1 and Figure 2 As shown, in order to ensure stable support for the second circuit board 3 based on the bracket 2 and to facilitate the layout of the above-mentioned first conductive member 8, the embodiment of the present application can set the vertical projection of the first opening 201 on the conductive layer 21 to be located within the area defined by the annular protrusion 211.

[0078] Optionally, in this embodiment, the projection area of ​​the vertical projection of the first opening 201 on the conductive layer 21 may be set to be smaller than the area defined by the annular protrusion 211 .

[0079] In some embodiments, Figure 1 and Figure 2 As shown, the electronic device of the embodiment of the present application further includes foam 4 , which is sandwiched between the second circuit board 3 and the back cover 5 .

[0080] Specifically, in this embodiment, by disposing the foam 4 between the second circuit board 3 and the back cover 5 , it is possible to ensure flexible contact between the second circuit board 3 and the back cover 5 , thereby preventing the back cover 5 from clamping and damaging the second circuit board 3 .

[0081] Since the foam 4 will deform when squeezed, the foam 4 is arranged between the second circuit board 3 and the back cover 5 in this embodiment, so that the second circuit board 3 can be better fixed without occupying too much thickness space of the electronic device.

[0082] In some embodiments, Figure 2 As shown, in order to realize the fill light and lighting functions of the electronic device, the electronic device of the embodiment of the present application is further provided with a flash module 6 and a second conductive member 9.

[0083] Specifically, the flash module 6 is arranged on the side of the second circuit board 3 away from the conductive layer 21; the area of ​​the conductive layer 21 exposed from the first opening 201 is provided with a third opening 203, and the third opening 203 is connected to the shielding cavity 221; the second conductive member 9 is passed through the third opening 203 and is located between the first circuit board 1 and the second circuit board 3; the flash module 6, the second circuit board 3, the second conductive member 9 and the first circuit board 1 are connected in sequence.

[0084] Among them, since the flash module 6 is usually exposed from the back cover 5 of the electronic device, in order to facilitate the layout of the flash module 6, a first avoidance opening corresponding to the flash module 6 is provided on the back cover 5.

[0085] It is understandable that, compared with the original solution of connecting the first circuit board to the flash module through a flexible circuit board, since the second circuit board 3 of this embodiment is a hard board, the flash module 6 can be installed and arranged and the corresponding control circuit can be designed based on the second circuit board 3.

[0086] Furthermore, this embodiment can make full use of the space corresponding to the shielding cavity 221 to realize the layout of the second conductive component 9. Based on the circuit structure on the second circuit board 3, the flash module 6 can easily establish an electrical connection with the first circuit board 1 through the second conductive component 9, and this circuit connection structure will not occupy the thickness space of the electronic device.

[0087] Optionally, in this embodiment, the second conductive member 9 can be disposed on the side of the second circuit board 3 facing the first circuit board 1 , or on the side of the first circuit board 1 facing the second circuit board 3 , which is not specifically limited.

[0088] Optionally, the second conductive member 9 may be an elastic member. For example, the elastic member may be a spring or a spring. In this way, by setting the second conductive member 9 as an elastic member, the embodiment can ensure that the first circuit board 1 is reliably connected to the second circuit board 3 through the second conductive member 9 after the second circuit board 3 is sandwiched between the conductive layer 21 and the back cover 5, without the need for other wiring operations, and the operation is simple and convenient.

[0089] In this way, when the electronic device needs to use the flash module 6 for lighting or fill lighting, the operator can input a control instruction to the electronic device, and the first circuit board 1 will respond to the control instruction and send the control signal to the flash module 6 through the second conductive member 9 and the second circuit board 3 in sequence, thereby controlling the working state of the flash module 6.

[0090] In some embodiments, Figure 2 As shown, in order to realize the camera function of the electronic device, the electronic device of the embodiment of the present application is also provided with a camera module 7.

[0091] Specifically, the bracket 2 is provided with a fourth opening 204 , the camera module 7 is provided on a side of the first circuit board 1 facing the bracket 2 , and the camera module 7 passes through the fourth opening 204 .

[0092] It is understandable that, since the bracket 2 includes a conductive layer 21 and a plastic layer 22 which are stacked, the fourth opening 204 of this embodiment penetrates the conductive layer 21 and the plastic layer 22 .

[0093] At the same time, since the camera module 7 is usually exposed from the back cover 5 of the electronic device, in order to facilitate the layout of the camera module 7, a second avoidance opening corresponding to the camera module 7 is provided on the back cover 5.

[0094] In this way, when the camera module 7 is actually arranged, this embodiment can pre-install the camera module 7 on the side of the first circuit board 1 facing the bracket 2, and then the camera module 7 first passes through the fourth opening 204 and the second avoidance opening in sequence, and then is exposed from the back cover 5 of the electronic device.

[0095] It should be noted that the camera module 7 of this embodiment generally includes a housing and a lens assembly and an image sensor installed in the housing, and the lens assembly and the image sensor are arranged relative to each other. In this embodiment, the image sensor can be arranged on the first circuit board 1.

[0096] At the same time, in order to ensure the camera effect of the electronic device in a dim environment, the flash module 6 can also be set on one side of the camera module 7 in this embodiment, so that when the camera module 7 takes a photo of the target object, the flash module 6 can be used to fill in the light of the target object and its environment.

[0097] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0098] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: a first circuit board and a bracket; The first circuit board and the bracket are stacked; components are arranged on a side of the first circuit board facing the bracket, a conductive layer is arranged on a side of the bracket facing the first circuit board, and an annular protrusion is arranged on a side of the conductive layer facing the first circuit board; the conductive layer includes a metal conductive layer, and the annular protrusion is formed by stamping on the metal conductive layer; The annular protrusion is electrically connected to the first circuit board, so that a shielding cavity is formed between the conductive layer and the first circuit board, and the components are arranged in the shielding cavity.

2. The electronic device according to claim 1, characterized in that: The electronic device further comprises a second circuit board and a back cover; The second circuit board is provided with a functional module, and the second circuit board is electrically connected to the first circuit board through a first conductive member; the back cover is provided on a side of the bracket away from the first circuit board; The functional module includes at least one of an NFC module, a power device and a power management module.

3. The electronic device according to claim 2, characterized in that: The support also includes a plastic layer; The plastic layer is arranged on a side of the conductive layer away from the first circuit board; the plastic layer is provided with a first opening; at least a part of the second circuit board is arranged in the first opening, and the second circuit board is sandwiched between the conductive layer and the back cover.

4. The electronic device according to claim 3, characterized in that: A vertical projection of the first opening on the conductive layer is located within a region defined by the annular protrusion.

5. The electronic device according to claim 3, characterized in that: A second opening is provided in the area of ​​the conductive layer exposed from the first opening, and the second opening is communicated with the shielding cavity; The first conductive member is inserted into the second opening, and the first conductive member is sandwiched between the first circuit board and the second circuit board.

6. The electronic device according to claim 5, characterized in that: The first conductive member includes an elastic member, and the elastic member abuts against at least one of the first circuit board and the second circuit board.

7. The electronic device according to claim 3, characterized in that: The conductive layer and the plastic layer are an integrally formed structure.

8. The electronic device according to claim 7, characterized in that: The conductive layer and the plastic layer are formed into one piece by injection molding.

9. The electronic device according to any one of claims 2 to 8, characterized in that: The electronic device further comprises foam, and the foam is sandwiched between the second circuit board and the back cover.

10. The electronic device according to any one of claims 3 to 8, characterized in that: The electronic device further comprises a flash module and a second conductive member; The flash module is arranged on a side of the second circuit board away from the conductive layer; A third opening is provided in the area where the conductive layer is exposed from the first opening, and the third opening is connected to the shielding cavity; The second conductive member is inserted into the third opening; the flash module is electrically connected to the second circuit board, and the second circuit board is electrically connected to the first circuit board via the second conductive member.

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