A multi-point sensor chip ATE automatic testing method, system and equipment

Abstract

The present invention relates to the field of multi-point automatic testing technology for sensor chips, and more specifically, to a multi-point sensor chip ATE automatic testing method, system and equipment. The scheme includes a test machine setting the current temperature measurement mode in real time, and sending the temperature measurement mode to the chip channel selection switch through communication and acquisition longitudinally; the chip channel selection switch selects the enabled part of the temperature measurement sensor according to the temperature measurement mode; the test machine sends a control command to the chip channel selection switch through a sending bus in real time; the chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command; the internal temperature data of the sensor chip is controlled and compensated in combination with the temperature curve, and sent to the temperature control box to complete real-time temperature control. The scheme provides a device and method for temperature measurement and compensation, a single-point temperature acquisition method, each chip under test corresponds to a standard temperature, and the parameters of the chip under test are compensated according to the standard temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-point automatic testing of sensor chips, and more specifically, to a multi-point sensor chip ATE automatic testing method, system and equipment. Background Art

[0002] The traditional chip temperature testing method is not accurate enough. The ambient temperature difference is about 0.5°C and the difference around the box is 1°C, which will cause the temperature curve obtained by the chip to be not accurate enough.

[0003] Prior to the present invention, the existing chip temperature testing method had a relatively long simulation parameter adjustment and test cycle, did not support online adjustment, and did not support bus test mode. Summary of the invention

[0004] In view of the above problems, the present invention proposes a multi-point sensor chip ATE automatic testing method, system and equipment, provides a device and method for temperature measurement and compensation, a single-point temperature acquisition mode, each chip under test corresponds to a standard temperature, and the parameters of the chip under test are compensated according to the standard temperature.

[0005] According to a first aspect of an embodiment of the present invention, a multi-point sensor chip ATE automatic testing method is provided.

[0006] In one or more embodiments, preferably, the multi-point sensor chip ATE automatic testing method includes:

[0007] The test machine sets the current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch through communication and acquisition;

[0008] The chip channel selection switch selects the temperature measurement sensor of the enabled part according to the temperature measurement mode;

[0009] The test machine sends a control command to the chip channel selection switch via a transmission bus in real time;

[0010] The chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command;

[0011] The temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the test machine via a feedback bus;

[0012] The test machine obtains real-time temperature data and displays it on the host computer. It controls the internal temperature data of the compensation sensor chip in combination with the temperature curve and sends it to the temperature control box to complete real-time temperature control.

[0013] In one or more embodiments, preferably, the test machine sets the current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch through communication and acquisition, specifically including:

[0014] The tester is connected to the chip channel selection switch via an IO pin;

[0015] The test machine is set to test the chip, and then outputs a high level through the IO pin;

[0016] The chip channel selection switch obtains the chip to be tested corresponding to the high level in real time.

[0017] In one or more embodiments, preferably, the chip channel selection switch selects the temperature measurement sensors of the enabled part according to the temperature measurement mode, specifically including:

[0018] After the chip channel selection switch obtains the corresponding high-level signal, the corresponding analog switch is automatically matched and enabled;

[0019] The analog switch starts to select the chip under test, thereby enabling part of the temperature measurement sensors.

[0020] In one or more embodiments, preferably, the test machine sends a control command to the chip channel selection switch via a sending bus in real time, specifically including:

[0021] Setting the test machine to enter bus test mode;

[0022] The current feedback is obtained online by inspecting each temperature sensor one by one, and then the corresponding control signal is formed;

[0023] The control signal is transmitted to the chip channel selection switch via the transmission bus through a preset protocol.

[0024] In one or more embodiments, preferably, the chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command, specifically including:

[0025] The chip channel selection switch automatically enables the corresponding temperature measurement sensor after receiving the signal from the transmission bus;

[0026] The bus command in the preset protocol format is sent to the corresponding temperature measuring sensor.

[0027] In one or more embodiments, preferably, the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the tester through a feedback bus, specifically including:

[0028] After the temperature measuring sensor receives the bus command, it automatically collects feedback code information as the feedback information;

[0029] During the collection process, the feedback information is fed back through the feedback bus at fixed intervals and set to a bus test mode, and the test machine performs automatic analysis.

[0030] In one or more embodiments, preferably, the test machine obtains real-time temperature data and displays it on the host computer, combines the temperature curve to control the internal temperature data of the compensation sensor chip, and sends it to the temperature control box to complete real-time temperature control, specifically including:

[0031] The test machine obtains the accurate temperature of the chip at the corresponding moment in the historical data on the current test board, sets the PN junction forward current and PN junction forward voltage drop calculation curves according to the first calculation formula and the second calculation formula, and reversely obtains the current PN junction forward current and voltage data according to the preset data;

[0032] Assuming that the current PN junction forward current obtained by reverse deduction remains unchanged, the second calculation formula is fitted into a third calculation formula form on the test machine as a calculation method for the measured forward voltage drop of the PN junction;

[0033] A calculation method for setting a predicted value of a forward voltage drop of a PN junction according to a fourth calculation formula;

[0034] Obtain all historical test data, and calculate the first target compensation coefficient and the second target compensation coefficient using the fifth calculation formula;

[0035] Utilize the sixth calculation formula to calculate the measured temperature;

[0036] The difference between the measured temperature and the standard temperature data is used as the internal temperature data of the compensation sensor chip, and sent to the temperature control box to complete real-time temperature control;

[0037] The first calculation formula is:

[0038]

[0039] Where I is the forward current of the PN junction, B is the area of ​​the emitter surface, T is the absolute temperature, η is a constant related to materials and processes, K is the Boltzmann constant, q is the electron charge, U is the forward voltage drop of the PN junction, and U 0 is the potential difference between the bottom of the conduction band and the top of the valence band at absolute zero;

[0040] The second calculation formula is:

[0041]

[0042] The third calculation formula is:

[0043] U C =f(T)

[0044] Among them, U C is the measured forward voltage drop of the PN junction;

[0045] The fourth calculation formula is:

[0046] U P =AT'+B

[0047] Among them, U P is the predicted value of the forward voltage drop of the PN junction, A is the first compensation coefficient, B is the second compensation coefficient, and T' is the temperature feedback from the temperature sensor obtained at the corresponding moment in the historical data;

[0048] The fifth calculation formula is:

[0049] (Am, Bm) = Arg min [Σ (U c_i -U P_i )]

[0050] Among them, Am is the first target compensation coefficient, Bm is the second target compensation coefficient, Arg min() is the function of the first compensation coefficient and the second compensation coefficient corresponding to the minimum comprehensive error of the forward voltage drop, U C_i is the measured forward voltage drop of the PN junction corresponding to the i-th chip, U P_i is the predicted value of the forward voltage drop of the PN junction corresponding to the i-th chip;

[0051] The sixth calculation formula is:

[0052] T C =(U P -Bm) / Am

[0053] Among them, T C is the measured temperature.

[0054] According to a second aspect of an embodiment of the present invention, a multi-point sensor chip ATE automatic testing system is provided.

[0055] In one or more embodiments, preferably, the multi-point sensor chip ATE automatic test system includes:

[0056] The mode selection module is used for the test machine to set the current temperature measurement mode in real time, and send the temperature measurement mode to the chip channel selection switch through communication and acquisition;

[0057] An acquisition chip selection module, used for the chip channel selection switch to select the temperature measurement sensor of the enabled part according to the temperature measurement mode;

[0058] A bus sending module, used for the test machine to send a control command to the chip channel selection switch via a sending bus in real time;

[0059] An information chip selection module, used for the chip channel selection switch to send a bus command to the corresponding temperature measurement sensor according to the control command;

[0060] An information feedback module, used for the temperature measuring sensor to read feedback information in real time according to the transmission information, and send the feedback information to the test machine through a feedback bus;

[0061] The temperature compensation module is used for the test machine to obtain real-time temperature data and display it on the host computer. It combines the temperature curve control to compensate the internal temperature data of the sensor chip and sends it to the temperature control box to complete real-time temperature control.

[0062] According to a third aspect of an embodiment of the present invention, there is provided a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by a processor, the method as described in any one of the first aspect of the embodiment of the present invention is implemented.

[0063] According to a fourth aspect of an embodiment of the present invention, there is provided an electronic device, comprising a memory and a processor, wherein the memory is used to store one or more computer program instructions, wherein the one or more computer program instructions are executed by the processor to implement any one of the methods described in the first aspect of the embodiment of the present invention.

[0064] The technical solution provided by the embodiments of the present invention may have the following beneficial effects:

[0065] In the scheme of the present invention, the switching mode of the switch channel is controlled by ATE, the analog switch is enabled, the chip under test is selected, and the analog parameters of different temperatures and the online adjustment function are tested in conjunction with the high and low temperature box to complete the standard temperature compensation of the chip under test parameters.

[0066] In the solution of the present invention, by enabling the corresponding analog switch and selecting the chip under test, the purpose of testing multiple chips on one board is achieved, thereby increasing the test efficiency.

[0067] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0068] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0070] Figure 1 The present invention is a flowchart of a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention.

[0071] Figure 2 It is a flow chart of a test machine in a multi-point sensor chip ATE automatic test method according to an embodiment of the present invention setting the current temperature measurement mode in real time and sending the temperature measurement mode to the chip channel selection switch through communication and acquisition.

[0072] Figure 3 It is a flow chart of the chip channel selection switch in a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention selecting the temperature measurement sensor of the enabled part according to the temperature measurement mode.

[0073] Figure 4 The present invention is a flowchart of a method for automatically testing a multi-point sensor chip ATE in which the test machine sends a control command to the chip channel selection switch via a sending bus in real time.

[0074] Figure 5 It is a flow chart of a chip channel selection switch in a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention sending a bus command to a corresponding temperature measurement sensor according to the control command.

[0075] Figure 6 It is a flowchart of a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention, in which the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the test machine through a feedback bus.

[0076] Figure 7 The test machine in a multi-point sensor chip ATE automatic testing method of an embodiment of the present invention obtains real-time temperature data and displays it on a host computer, combines the temperature curve control to compensate the internal temperature data of the sensor chip, and sends it to a temperature control box to complete the flowchart of real-time temperature control.

[0077] Figure 8 It is a structural diagram of a multi-point sensor chip ATE automatic test system according to an embodiment of the present invention.

[0078] Fig. 9It is a structural diagram of an electronic device in one embodiment of the present invention. DETAILED DESCRIPTION

[0079] In some of the processes described in the specification and claims of the present invention and the above-mentioned figures, multiple operations that appear in a specific order are included, but it should be clearly understood that these operations may not be executed in the order in which they appear in this article or executed in parallel. The serial numbers of the operations, such as 101, 102, etc., are only used to distinguish different operations, and the serial numbers themselves do not represent any execution order. In addition, these processes may include more or fewer operations, and these operations may be executed in sequence or in parallel. It should be noted that the descriptions of "first", "second", etc. in this article are used to distinguish different messages, devices, modules, etc., do not represent the order of precedence, and do not limit the "first" and "second" to be different types.

[0080] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0081] The traditional chip temperature testing method is not accurate enough. The ambient temperature difference is about 0.5°C and the difference around the box is 1°C, which will cause the temperature curve obtained by the chip to be not accurate enough.

[0082] Prior to the present invention, the existing chip temperature testing method had a relatively long simulation parameter adjustment and test cycle, did not support online adjustment, and did not support bus test mode.

[0083] In the embodiment of the present invention, a multi-point sensor chip ATE automatic test method, system and equipment are provided. The scheme provides a device and method for temperature measurement and compensation, a single-point temperature acquisition method, each chip under test corresponds to a standard temperature, and the parameters of the chip under test are compensated according to the standard temperature.

[0084] According to a first aspect of an embodiment of the present invention, a multi-point sensor chip ATE automatic testing method is provided.

[0085] Figure 1 The present invention is a flowchart of a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention.

[0086] In one or more embodiments, preferably, the multi-point sensor chip ATE automatic testing method includes:

[0087] S101, the test machine sets the current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch through communication and acquisition;

[0088] S102, the chip channel selection switch selects the temperature measurement sensor of the enabled part according to the temperature measurement mode;

[0089] S103, the test machine sends a control command to the chip channel selection switch via a sending bus in real time;

[0090] S104, the chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command;

[0091] S105, the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the test machine via a feedback bus;

[0092] S106, the test machine obtains real-time temperature data and displays it on the host computer, combines the temperature curve to control the internal temperature data of the compensation sensor chip, and sends it to the temperature control box to complete real-time temperature control.

[0093] In the embodiment of the present invention, in order to realize the system, it is necessary to include a test machine, two bus communication circuits (including sending and receiving buses, used to set the test machine to select to enter the bus test mode, and can match the address through the single-point inspection function, and adjust the return code current and other analog signal functions online), a multi-channel chip test board (for placing all chips), a standard temperature acquisition circuit (for collecting and feedback of chip temperature), a chip channel selection circuit (for enabling the corresponding analog switch to select the chip under test), a host computer, and a temperature control box. Then, through the switching mode of the control switch channel of the test machine, the analog switch is enabled, the chip under test is selected, and the high and low temperature boxes are used to test the analog parameters and online adjustment functions of different temperatures.

[0094] Figure 2 It is a flow chart of a test machine in a multi-point sensor chip ATE automatic test method according to an embodiment of the present invention setting the current temperature measurement mode in real time and sending the temperature measurement mode to the chip channel selection switch through communication and acquisition.

[0095] like Figure 2 As shown, in one or more embodiments, preferably, the test machine sets the current temperature measurement mode in real time, and sends the temperature measurement mode to the chip channel selection switch through communication and acquisition, specifically including:

[0096] S201, the test machine is connected to the chip channel selection switch through an IO pin;

[0097] S202, the test machine is set to test the chip, and outputs a high level through the IO pin;

[0098] S203, the chip channel selection switch obtains the chip to be tested corresponding to the high level in real time.

[0099] In the embodiment of the present invention, different sensor chips can be tested according to different Sockets, and only the IO pin functions on the tester need to be modified to match the pins of the chip under test.

[0100] Figure 3 It is a flow chart of the chip channel selection switch in a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention selecting the temperature measurement sensor of the enabled part according to the temperature measurement mode.

[0101] like Figure 3 As shown, in one or more embodiments, preferably, the chip channel selection switch selects the temperature measurement sensors of the enabled part according to the temperature measurement mode, specifically including:

[0102] S301, after the chip channel selection switch obtains a corresponding high level signal, automatically matching and enabling a corresponding analog switch;

[0103] S302: The analog switch starts to select the chip under test, thereby enabling part of the temperature measurement sensors.

[0104] In the embodiment of the present invention, the chip channel selection circuit enables the corresponding analog switch to select the chip under test, thereby achieving the purpose of testing multiple chips on one board and increasing the test efficiency.

[0105] Figure 4 The present invention is a flowchart of a method for automatically testing a multi-point sensor chip ATE in which the test machine sends a control command to the chip channel selection switch via a sending bus in real time.

[0106] like Figure 4 As shown, in one or more embodiments, preferably, the test machine sends a control command to the chip channel selection switch via a sending bus in real time, specifically including:

[0107] S401, setting the test machine to enter bus test mode;

[0108] S402, obtaining current feedback online by inspecting each temperature sensor one by one, thereby forming a corresponding control signal;

[0109] S403: Transmit the control signal to the chip channel selection switch via the transmission bus according to a preset protocol.

[0110] In the embodiment of the present invention, the preset transmission protocol at least includes an enable number, a clock signal, an SPI communication protocol, a digital quantity, an analog quantity and standard temperature data, and the remaining positions can be configured according to actual conditions.

[0111] Figure 5 It is a flow chart of a chip channel selection switch in a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention sending a bus command to a corresponding temperature measurement sensor according to the control command.

[0112] like Figure 5 As shown, in one or more embodiments, preferably, the chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command, specifically including:

[0113] S501, after receiving the signal from the sending bus, the chip channel selection switch automatically enables the corresponding temperature measurement sensor;

[0114] S502: Send the bus command in the preset protocol format to the corresponding temperature measurement sensor.

[0115] In an embodiment of the present invention, the control command received by the temperature sensor includes configuring the output register value, the voltage reference value and current reference value output by the Analog pin, and the clock signal output by the digital pin. Then, the analog and clock signals can be read by the board of the test machine and compared with the standard values, and the corresponding register values ​​can be configured to complete the online adjustment function of the signal.

[0116] Figure 6 It is a flowchart of a multi-point sensor chip ATE automatic testing method according to an embodiment of the present invention, in which the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the test machine through a feedback bus.

[0117] like Figure 6 As shown, in one or more embodiments, preferably, the temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the tester through a feedback bus, specifically including:

[0118] S601, after the temperature measuring sensor receives the bus command, automatically collects feedback code information as the feedback information;

[0119] S602: During the collection process, the feedback information is fed back through the feedback bus at fixed intervals and set to a bus test mode, and the test machine performs automatic analysis.

[0120] In the embodiment of the present invention, the bus test mode adopts the access method of the two-bus communication protocol to test and adjust the return code current, pulse width and other parameters of the chip under test, and verify the product functions, such as the differential temperature alarm function.

[0121] Figure 7 The test machine in a multi-point sensor chip ATE automatic testing method of an embodiment of the present invention obtains real-time temperature data and displays it on a host computer, combines the temperature curve control to compensate the internal temperature data of the sensor chip, and sends it to a temperature control box to complete the flowchart of real-time temperature control.

[0122] like Figure 7 As shown, in one or more embodiments, preferably, the test machine obtains real-time temperature data and displays it on the host computer, combines the temperature curve to control the internal temperature data of the compensation sensor chip, and sends it to the temperature control box to complete real-time temperature control, specifically including:

[0123] S701, obtaining the accurate temperature of the chip at the corresponding moment in the historical data on the current test board obtained by the test machine, setting the PN junction forward current and PN junction forward voltage drop calculation curve according to the first calculation formula and the second calculation formula, and obtaining the current PN junction forward current and voltage data by reverse calculation according to the preset data;

[0124] S702, assuming that the current PN junction forward current obtained by reverse deduction remains unchanged, fitting the second calculation formula into a third calculation formula form on the test machine as a calculation method for the measured forward voltage drop of the PN junction;

[0125] S703, setting a calculation method for the predicted value of the forward voltage drop of the PN junction according to the fourth calculation formula;

[0126] S704, obtaining all historical test data, and calculating the first target compensation coefficient and the second target compensation coefficient using the fifth calculation formula;

[0127] S705, calculating the measured temperature using the sixth calculation formula;

[0128] S706, taking the difference between the measured temperature and the standard temperature data as the internal temperature data of the compensation sensor chip, and sending it to the temperature control box to complete the real-time temperature control;

[0129] The first calculation formula is:

[0130]

[0131] Where I is the forward current of the PN junction, B is the area of ​​the emitter surface, T is the absolute temperature, η is a constant related to materials and processes, K is the Boltzmann constant, q is the electron charge, U is the forward voltage drop of the PN junction, and U 0is the potential difference between the bottom of the conduction band and the top of the valence band at absolute zero;

[0132] The second calculation formula is:

[0133]

[0134] The third calculation formula is:

[0135] U C =f(T)

[0136] Among them, U C is the measured forward voltage drop of the PN junction;

[0137] The fourth calculation formula is:

[0138] U P =AT'+B

[0139] Among them, U P is the predicted value of the forward voltage drop of the PN junction, A is the first compensation coefficient, B is the second compensation coefficient, and T' is the temperature feedback from the temperature sensor obtained at the corresponding moment in the historical data;

[0140] The fifth calculation formula is:

[0141] (Am, Bm) = Arg min [Σ (U c_i -U P_i )]

[0142] Among them, Am is the first target compensation coefficient, Bm is the second target compensation coefficient, Arg min() is the function of the first compensation coefficient and the second compensation coefficient corresponding to the minimum comprehensive error of the forward voltage drop, U C_i is the measured forward voltage drop of the PN junction corresponding to the i-th chip, U P_i is the predicted value of the forward voltage drop of the PN junction corresponding to the i-th chip;

[0143] The sixth calculation formula is:

[0144] T C =(U P -Bm) / Am

[0145] Among them, T C is the measured temperature.

[0146] In an embodiment of the present invention, after a standard temperature data is obtained in real time, a correction is performed on the corresponding measured temperature. The goal of the correction is to minimize the voltage error between the measured data and the predicted data. Finally, the most accurate measured temperature is deduced in real time based on this formula, and compensation is performed based on the difference between the standard value and the measured value, and the compensation is completed through the corresponding temperature box.

[0147] According to a second aspect of an embodiment of the present invention, a multi-point sensor chip ATE automatic testing system is provided.

[0148] Figure 8 It is a structural diagram of a multi-point sensor chip ATE automatic test system according to an embodiment of the present invention.

[0149] In one or more embodiments, preferably, the multi-point sensor chip ATE automatic test system includes:

[0150] Mode selection module 801, used for the test machine to set the current temperature measurement mode in real time, and send the temperature measurement mode to the chip channel selection switch through communication and acquisition;

[0151] The chip acquisition and selection module 802 is used for the chip channel selection switch to select the temperature measurement sensor of the enabled part according to the temperature measurement mode;

[0152] A bus sending module 803, used for the test machine to send a control command to the chip channel selection switch via a sending bus in real time;

[0153] Information chip selection module 804, used for the chip channel selection switch to send a bus command to the corresponding temperature measurement sensor according to the control command;

[0154] An information feedback module 805, which is used for the temperature measuring sensor to read feedback information in real time according to the transmission information, and send the feedback information to the test machine via a feedback bus;

[0155] The temperature compensation module 806 is used for the test machine to obtain real-time temperature data and display it on the host computer. It controls and compensates the internal temperature data of the sensor chip in combination with the temperature curve and sends it to the temperature control box to complete real-time temperature control.

[0156] In the embodiment of the present invention, a system suitable for different structures is realized through a series of modular designs. The system can achieve closed-loop, reliable and efficient execution through collection, analysis and control.

[0157] According to a third aspect of an embodiment of the present invention, there is provided a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by a processor, the method as described in any one of the first aspect of the embodiment of the present invention is implemented.

[0158] According to a fourth aspect of an embodiment of the present invention, an electronic device is provided. Fig. 9 It is a structural diagram of an electronic device in one embodiment of the present invention. Fig. 9 The electronic device shown is a general purpose multi-point sensor chip ATE automatic test device. Fig. 9As shown, the electronic device 900 includes a central processing unit (CPU) 901, which can perform various appropriate actions and processes according to computer program instructions stored in a read-only memory (ROM) 902 or computer program instructions loaded from a storage unit 908 into a random access memory (RAM) 903. In the RAM 903, various programs and data required for the operation of the electronic device 900 can also be stored. The CPU 901, the ROM 902, and the RAM 903 are connected to each other via a bus 904. An input / output (I / O) interface 905 is also connected to the bus 904.

[0159] Multiple components in the electronic device 900 are connected to the I / O interface 905, including: an input unit 906, an output unit 907, a storage unit 908, and the processing unit 901 performs the various methods and processes described above, such as the method described in the first aspect of the embodiment of the present invention. For example, in some embodiments, the method described in the first aspect of the embodiment of the present invention may be implemented as a computer software program, which is stored in a machine-readable medium, such as the storage unit 908. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 900 via the ROM 902 and / or the communication unit 909. When the computer program is loaded into the RAM 903 and executed by the CPU 901, one or more operations of the method described in the first aspect of the embodiment of the present invention may be performed. Alternatively, in other embodiments, the CPU 901 may be configured as one or more actions of the method described in the first aspect of the embodiment of the present invention by any other appropriate means (e.g., by means of firmware).

[0160] The technical solution provided by the embodiments of the present invention may have the following beneficial effects:

[0161] In the scheme of the present invention, the switching mode of the switch channel is controlled by ATE, the analog switch is enabled, the chip under test is selected, and the analog parameters of different temperatures and the online adjustment function are tested in conjunction with the high and low temperature box to complete the standard temperature compensation of the chip under test parameters.

[0162] In the solution of the present invention, by enabling the corresponding analog switch and selecting the chip under test, the purpose of testing multiple chips on one board is achieved, thereby increasing the test efficiency.

[0163] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage and optical storage, etc.) containing computer-usable program code.

[0164] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0165] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0166] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0167] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A multi-point sensor chip ATE automatic testing method, characterized in that: The method includes: The test machine sets the current temperature measurement mode in real time and sends the temperature measurement mode to the chip channel selection switch; The chip channel selection switch selects the temperature measurement sensor of the enabled part according to the temperature measurement mode; The test machine sends a control command to the chip channel selection switch via a transmission bus in real time; The chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command; The temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the test machine via a feedback bus; The test machine obtains real-time temperature data and displays it on the host computer. It controls the internal temperature data of the compensation sensor chip in combination with the temperature curve and sends it to the temperature control box to complete real-time temperature control. The test machine obtains real-time temperature data and displays it on the host computer. It controls the internal temperature data of the compensation sensor chip in combination with the temperature curve and sends it to the temperature control box to complete real-time temperature control, which specifically includes: The test machine obtains the accurate temperature of the chip at the corresponding time in the historical data, and sets the temperature according to the first calculation formula and the second calculation formula. PN Junction forward current and PN The forward voltage drop calculation curve of the junction is reversed according to the preset data to obtain the current PN Junction forward current and forward voltage drop of PN junction; Assume that the current PN When the junction forward current remains unchanged, the second calculation formula is fitted into the third calculation formula form on the test machine as the measured PN How to calculate the forward voltage drop of the junction; According to the fourth calculation formula, PN How to calculate the predicted value of the forward voltage drop of the junction; Obtain all historical test data, and calculate the first target compensation coefficient and the second target compensation coefficient using the fifth calculation formula; Calculate the measured temperature using the sixth calculation formula; The measured temperature is subtracted from the standard temperature data as the internal temperature data of the compensation sensor chip, and is sent to the temperature control box to complete real-time temperature control; The first calculation formula is: ； in, I for PN Junction forward current, FS is the emitting surface area, T is the absolute temperature, is a constant related to materials and processes, K is the Boltzmann constant, q is the electron charge, U yes PN The forward voltage drop of the junction, U 0 is the potential difference between the bottom of the conduction band and the top of the valence band at absolute zero; The second calculation formula is: ； The third calculation formula is: ； in, U C For the measured PN The forward voltage drop of the junction; The fourth calculation formula is: ； in, U P for PN The predicted forward voltage drop across the junction, A is the first compensation coefficient, B is the second compensation coefficient, T’ The temperature fed back by the temperature sensor at the corresponding moment in the historical data; The fifth calculation formula is: ； in, Am is the first target compensation coefficient, Bm is the second target compensation coefficient, Argmin () is the function for extracting the first compensation coefficient and the second compensation coefficient corresponding to the minimum comprehensive error of the forward voltage drop, U C_i For the i Chip corresponding to the actual measurement PN The forward voltage drop of the junction, U P_i For the i Chip corresponding PN Predicted value of the forward voltage drop of the junction; The sixth calculation formula is: T C =（ U P - Bm ） / Am; in, T C is the measured temperature.

2. A multi-point sensor chip ATE automatic testing method as claimed in claim 1, characterized in that: The test machine sets the current temperature measurement mode in real time and sends the temperature measurement mode to the chip channel selection switch, specifically including: The tester is connected to the chip channel selection switch via an IO pin; The tester is provided with a chip to be tested, and outputs a high level through an IO pin; The chip channel selection switch obtains the chip to be tested corresponding to the high level in real time.

3. A multi-point sensor chip ATE automatic testing method as claimed in claim 2, characterized in that: The chip channel selection switch selects the temperature measurement sensor of the enabled part according to the temperature measurement mode, specifically including: After the chip channel selection switch obtains the corresponding high-level signal, the corresponding analog switch is automatically matched and enabled; The analog switch starts to select the chip under test, thereby enabling part of the temperature measurement sensors.

4. A multi-point sensor chip ATE automatic testing method as claimed in claim 1, characterized in that: The test machine sends a control command to the chip channel selection switch via a sending bus in real time, specifically including: Setting the test machine to enter bus test mode; The current feedback is obtained online by inspecting each temperature sensor one by one, and then the corresponding control signal is formed; The control signal is transmitted to the chip channel selection switch via the transmission bus through a preset protocol.

5. A multi-point sensor chip ATE automatic testing method as claimed in claim 4, characterized in that: The chip channel selection switch sends a bus command to the corresponding temperature measurement sensor according to the control command, specifically including: The chip channel selection switch automatically enables the corresponding temperature measurement sensor after receiving the signal from the transmission bus; The bus command in the preset protocol format is sent to the corresponding temperature measuring sensor.

6. A multi-point sensor chip ATE automatic testing method as claimed in claim 5, characterized in that: The temperature measuring sensor reads feedback information in real time according to the transmission information, and sends the feedback information to the test machine through the feedback bus, specifically including: After the temperature measuring sensor receives the bus command, it automatically collects feedback code information as the feedback information; During the collection process, information is fed back through the feedback bus at fixed intervals and set to a bus test mode, and the test machine performs automatic analysis.

7. A multi-point sensor chip ATE automatic test system, characterized in that: The system is used to implement the method according to any one of claims 1 to 6, and the system comprises: The mode selection module is used for the test machine to set the current temperature measurement mode in real time and send the temperature measurement mode to the chip channel selection switch; An acquisition chip selection module, used for the chip channel selection switch to select the temperature measurement sensor of the enabled part according to the temperature measurement mode; A bus sending module, used for the test machine to send a control command to the chip channel selection switch via a sending bus in real time; An information chip selection module, used for the chip channel selection switch to send a bus command to the corresponding temperature measurement sensor according to the control command; An information feedback module, used for the temperature measuring sensor to read feedback information in real time according to the transmission information, and send the feedback information to the test machine through a feedback bus; The temperature compensation module is used for the test machine to obtain real-time temperature data and display it on the host computer. It combines the temperature curve control to compensate the internal temperature data of the sensor chip and sends it to the temperature control box to complete real-time temperature control.

8. A computer-readable storage medium storing computer program instructions, characterized in that: The computer program instructions implement the method according to any one of claims 1 to 6 when executed by a processor.

9. An electronic device, comprising a memory and a processor, characterized in that: The memory is used to store one or more computer program instructions, wherein the one or more computer program instructions are executed by the processor to implement the method according to any one of claims 1-6.

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