Glue removal device

Abstract

The present application relates to the technical field of semiconductor production equipment, and an embodiment of the present application provides a degumming device. In the above-mentioned degumming device, the degumming device at least includes a base, a clamping mechanism and a degumming mechanism, by placing a plurality of packages in a receiving groove of the base, and fixing the plurality of packages placed in the receiving groove with the help of the clamping mechanism, and then using the degumming mechanism to degumming the plurality of packages. Thus, the cleaning efficiency and cleaning effectiveness are improved, and the appearance quality of the package is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor production equipment, and in particular to a glue removal device. Background Art

[0002] In the related art, a semiconductor power device is usually encapsulated in a lead frame by means of a plastic encapsulation mold to form a package. Plastic encapsulation glue will remain on one end of the lead frame. After the package is demolded, the remaining plastic encapsulation glue will come out with the lead frame. The plastic encapsulation glue remaining on the lead frame is usually cleaned manually. As a result, the cleaning efficiency is low and it is difficult to clean it up, which makes the package have a high appearance quality risk. Summary of the invention

[0003] Based on this, it is necessary to provide a degumming device to improve the cleaning efficiency and cleaning effectiveness and improve the appearance quality of the package.

[0004] The embodiment of the present application provides a glue removal device for removing residual glue on a package, wherein the package includes a plurality of packaging units connected in sequence along a first direction, each packaging unit includes a lead frame and a semiconductor power device packaged in the lead frame, and the lead frame has a connection portion and a pin portion arranged on both sides of the semiconductor power device relatively along a second direction;

[0005] The glue removal device comprises:

[0006] A base, wherein the base is provided with a receiving groove, the receiving groove is used to receive a plurality of packages arranged along a third direction, and the connecting portion of the lead frame is exposed from a notch of the receiving groove;

[0007] A clamping mechanism is disposed on the base; the clamping mechanism is used to provide a clamping force acting on the plurality of packages along the third direction to limit the plurality of packages to be located in the containing groove; and

[0008] A glue removal mechanism is disposed on the base; the glue removal mechanism is configured to be able to reciprocate along the third direction to remove residual glue located at the connecting portion of the lead frame;

[0009] The first direction, the second direction and the third direction are perpendicular to each other.

[0010] In one embodiment, the adhesive removal mechanism comprises:

[0011] A mounting seat, movably disposed on the base along the third direction;

[0012] A plurality of cutting tools, all of which are spaced apart along the first direction on a side of the mounting seat facing the base, and the cutting tools are configured to match the connecting portion of the lead frame.

[0013] In one of the embodiments, the adhesive removal mechanism further includes a guide assembly;

[0014] The guide assembly is connected between the mounting seat and the base, and is used for guiding the movement of the mounting seat.

[0015] In one of the embodiments, the guide assembly includes a guide member disposed on the base and a sliding member connected to the mounting seat, and the sliding member is movably disposed on the guide member along the third direction.

[0016] In one embodiment, the adhesive removal mechanism further includes a first operating member; the first operating member is connected to the mounting seat and is used as an operating member when an external force is applied; and / or

[0017] A gap is formed between the connecting portions of two adjacent lead frames, and the outer contour of the tool is configured to match the contour of the gap.

[0018] In one embodiment, the clamping mechanism comprises:

[0019] A clamping member and a limiting member are arranged at intervals along the third direction, wherein the clamping member is located in the receiving groove, and the limiting member is located at one side of the base along the third direction;

[0020] A connecting member, one end of which is connected to the clamping member, and the other end of which passes through the base and is connected to the limiting member;

[0021] Wherein, the limiting member can drive the clamping member to reciprocate along the third direction with the help of the connecting member in response to an external force.

[0022] In one of the embodiments, the clamping mechanism further includes an elastic member;

[0023] The elastic member is in contact with the clamping member and the groove wall of the accommodating groove, and is used to provide elastic force that causes the clamping member to move away from the limiting member.

[0024] In one embodiment, the elastic member is sleeved on one end of the connecting member located in the accommodating groove.

[0025] In one of the embodiments, the clamping mechanism further includes a second operating member;

[0026] The second operating member is connected to the limiting member and is used as an acting member when an external force is applied.

[0027] In one of the embodiments, the adhesive removal device further includes a buffer mechanism;

[0028] The buffer mechanism is arranged on the base and is located on the moving path of the glue removal mechanism, and is used for buffering the movement of the glue removal mechanism.

[0029] In the above-mentioned degumming device, the degumming device at least includes a base, a clamping mechanism and a degumming mechanism, and multiple packages are placed in the receiving groove of the base, and the multiple packages placed in the receiving groove are fixed by the clamping mechanism, and then the degumming mechanism is used to remove the glue from the multiple packages. Thus, the cleaning efficiency and cleaning effectiveness are improved, and the appearance quality of the packages is improved.

[0030] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] By reading the detailed description of the following embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the embodiments and are not considered to be limitations of the present application. In addition, the same reference numerals are used throughout the drawings to represent the same components.

[0032] In the attached picture:

[0033] Figure 1 This is a schematic diagram of the structure of a package in one embodiment of the present application;

[0034] Figure 2 This is a schematic diagram of the structure of a packaging unit in an embodiment of the present application;

[0035] Figure 3 This is a schematic diagram of the structure of a glue removal device at a viewing angle in one embodiment of the present application;

[0036] Figure 4 This is a schematic diagram of the structure of the adhesive removal device in another viewing angle in one embodiment of the present application;

[0037] Figure 5 This is a schematic structural diagram of a glue removal device in another viewing angle in one embodiment of the present application;

[0038] Figure 6 for Figure 3 A schematic diagram of the local enlarged structure at point A in the middle;

[0039] Figure 7 for Figure 6 A schematic diagram of the local enlarged structure at B in the middle;

[0040] Figure 8 for Figure 6 A schematic diagram of the local enlarged structure at C in the middle;

[0041] Fig. 9 This is a partial structural schematic diagram of a glue removal mechanism in one embodiment of the present application;

[0042] Fig.10 It is a schematic cross-sectional view of the local structure of the cooperation among the clamping member, the limiting member and the elastic member in one embodiment of the present application.

[0043] The reference numerals in the specific implementation manner are as follows:

[0044] Glue removal device 100, base 110, accommodating groove 111, opening 111a, clamping mechanism 120, clamping member 121, limiting member 122, connecting member 123, elastic member 124, second operating member 125, glue removal mechanism 130, mounting seat 131, tool 132, second chamfering portion s2, guide assembly 133, guide member 133a, sliding member 133b, first operating member 134, buffer mechanism 140, mounting member 150;

[0045] Package 200, package unit 210, lead frame 211, connection portion 211a, first chamfered portion s1, lead portion 211b, tail rib 211c, semiconductor power device 212, colloid 213, gap g;

[0046] The first direction F1, the second direction F2, and the third direction F3. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and easy to understand, the specific implementation of the embodiment of the present application is described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the embodiment of the present application. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. The embodiment of the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the embodiment of the present application is not limited by the specific embodiments disclosed below.

[0048] It is understood that the terms "first", "second", etc. used in this application can be used in this article to describe various professional terms, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. However, unless otherwise specified, these professional terms are not limited by these terms. These terms are only used to distinguish one professional term from another professional term. For example, without departing from the scope of this application, the first operating member and the second operating member are different operating members. In the description of the embodiments of the present application, the meaning of "multiple" and "several" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0050] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0051] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0052] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this application and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0053] At present, semiconductor power devices are mainly packaged using plastic encapsulation technology. After plastic encapsulation molding, the semiconductor power device, colloid and lead frame constitute a package, and plastic encapsulation glue will remain on the top chamfer of the lead frame. After the package is demolded, the residual plastic encapsulation glue will come out with the lead frame. Usually, the plastic encapsulation glue remaining on the lead frame is cleaned one by one manually. As a result, the cleaning efficiency is low and it is difficult to clean it up, which makes the package have a high appearance quality risk. At the same time, it is also difficult to solve the above-mentioned residual glue problem by improving the structure of the mold.

[0054] Based on this, the embodiments of the present application provide a glue removal device to at least partially solve the above problems. The structures of various parts of the glue removal device in some embodiments are described below in conjunction with relevant drawings and some embodiments.

[0055] Figure 1 A schematic structural diagram of a package 200 in an embodiment of the present application is shown; Figure 2 A schematic diagram of the structure of the packaging unit 210 in one embodiment of the present application is shown; Figure 3 A schematic diagram of the structure of the adhesive removal device 100 in one viewing angle in one embodiment of the present application is shown; Figure 4 A schematic structural diagram of the adhesive removal device 100 in another viewing angle in one embodiment of the present application is shown; Figure 5 A schematic structural diagram of the adhesive removal device 100 at another viewing angle in an embodiment of the present application is shown; for ease of explanation, only the contents related to the embodiment of the present application are shown. Figure 3 One of the perspectives is the forward-looking stereoscopic perspective. Figure 4 Another perspective in the game is the rear-view stereo perspective. Figure 5 Another perspective in the game is the bird's-eye view.

[0056] In some embodiments, please refer to Figures 1 to 5 The embodiment of the present application provides a glue removal device 100 for removing residual glue on a package 200. To facilitate the description of the relevant structure of the glue removal device 100, the package 200 involved in the embodiment of the present application is first described.

[0057] like Figure 1 and Figure 2 As shown, the package 200 includes a plurality of package units 210 connected in sequence along a first direction F1, each package unit 210 includes a lead frame 211 and a semiconductor power device 212 packaged in the lead frame 211, and the lead frame 211 has a connection portion 211a and a pin portion 211b arranged on both sides of the semiconductor power device 212 along a second direction F2. Since the semiconductor power device 212 is packaged in the lead frame 211 by means of a colloid 213, Figure 2The dotted line portion shown in the figure is the portion wrapped by the colloid 213 , which is shown as a semiconductor power device 212 . The semiconductor power device 212 can be an electronic component such as a chip. Each packaging unit 210 includes at least one semiconductor power device 212 . Figure 1 and Figure 2 The schematic diagram shows a situation where each packaging unit 210 includes two semiconductor power devices 212, which can be set according to actual usage conditions, and the embodiments of the present application do not impose specific restrictions on this. When the packaging unit 210 includes two semiconductor power devices 212, the connection portions 211a of the lead frames 211 corresponding to the two semiconductor power devices 212 are connected together. Optionally, the pin portions 211b of the lead frame 211 are connected by tail ribs 211c. After removing the residual glue on the connection portion 211a with the help of the degumming device 100, the tail ribs 211c can be separated from the pin portion 211b by a punching process.

[0058] like Figures 3 to 5 As shown, the glue removal device 100 includes a base 110, a clamping mechanism 120 and a glue removal mechanism 130. The base 110 is provided with a receiving groove 111, and the receiving groove 111 is used to receive a plurality of packages 200 arranged along a third direction F3. The connection portion 211a of the lead frame 211 is exposed by the notch of the receiving groove 111. The clamping mechanism 120 is provided on the base 110, and is used to provide a clamping force acting on the plurality of packages 200 along the third direction F3, so as to limit the plurality of packages 200 in the receiving groove 111. The glue removal mechanism 130 is provided on the base 110, and is configured to be able to reciprocate along the third direction F3, and is used to remove the residual glue located at the connection portion 211a of the lead frame 211. Among them, the first direction F1, the second direction F2 and the third direction F3 are perpendicular to each other.

[0059] Therefore, by placing multiple packages 200 in the receiving groove 111 of the base 110, and fixing the multiple packages 200 placed in the receiving groove 111 with the help of the clamping mechanism 120, and then using the degumming mechanism 130 to degumming the multiple packages 200, the residual glue of multiple packages 200 can be cleaned in one degumming operation, thereby improving the cleaning efficiency and cleaning effectiveness and improving the appearance quality of the package 200.

[0060] Figure 6 Shows Figure 3 A schematic diagram of the local enlarged structure at point A in the figure; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0061] In some embodiments, please refer to Figure 3 , and combined with reference Figure 6The adhesive removal mechanism 130 includes a mounting seat 131 and a plurality of cutters 132. The mounting seat 131 is movably disposed on the base 110 along the third direction F3. All the cutters 132 are disposed at intervals along the first direction F1 on the side of the mounting seat 131 facing the base 110, and the cutters 132 are configured to match the connection portion 211a of the lead frame 211. By providing the cutters 132 that match the connection portion 211a of the lead frame 211, the cutters 132 can move along the third direction F3 under the drive of the mounting seat 131 to scrape off the residual adhesive on the connection portion 211a of the lead frame 211.

[0062] In some embodiments, please refer to Figures 3 to 5 The glue removal mechanism 130 further includes a guide assembly 133. The guide assembly 133 is connected between the mounting seat 131 and the base 110, and is used to guide the movement of the mounting seat 131. In this way, by providing the guide assembly 133, the cutter 132 can more stably reciprocate along the third direction F3 when performing glue removal.

[0063] In some embodiments, please refer to Figures 3 to 5 The guide assembly 133 includes a guide member 133a provided on the base 110 and a sliding member 133b connected to the mounting seat 131, and the sliding member 133b is movably provided on the guide member 133a along the third direction F3. Optionally, the guide member 133a can be set as a rod-shaped structure. Thus, through the cooperation between the sliding member 133b and the guide member 133a, the sliding member 133b can move along the third direction F3 under the guidance of the guide member 133a under the drive of the mounting seat 131, thereby enabling the mounting seat 131 to reciprocate along the third direction F3, thereby enabling the tool 132 to reciprocate along the third direction F3.

[0064] In some embodiments, please refer to Figures 3 to 5 The adhesive removal mechanism 130 further includes a first operating member 134. The first operating member 134 is connected to the mounting seat 131 and is used as an operating member when an external force is applied. That is, when in use, the operator can hold the first operating member 134 and use the first operating member 134 to drive the mounting seat 131 to move.

[0065] Figure 7 Shows Figure 6 A schematic diagram of the local enlarged structure at B in the middle; Figure 8 Shows Figure 6 A schematic diagram of the local enlarged structure at point C in the middle; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0066] In some embodiments, please refer to Figures 6 to 8 , and combined with reference Figure 1 and Figure 2A gap g is formed between the connecting portions 211a of two adjacent lead frames 211, and the outer contour of the cutter 132 is configured to match the contour of the gap g. Figure 2 and Figure 8 For example, the connection portion 211a on the lead frame 211 in each packaging unit 210 is provided with a first chamfered portion s1 on both sides along the first direction F1. A gap g is formed between the two first chamfered portions s1 facing each other on the connection portion 211a of two adjacent lead frames 211. It can be understood that the gap g formed by the two adjacent first chamfered portions s1 arranged at intervals is too small to be removed manually. Each tool 132 corresponds to a gap g, and the tool 132 is provided with a second chamfered portion s2 on both sides along the first direction F1. The first chamfered portion s1 and the second chamfered portion s2 are adapted. When the tool 132 moves along the third direction F3, the second chamfered portion s2 can act on the first chamfered portion s1, thereby scraping off the residual glue located on the first chamfered portion s1. It should be noted that the outer contour structure of the tool 132 and the contour of the gap g can be set according to actual usage, and the embodiment of the present application does not impose specific restrictions on this.

[0067] Fig. 9 A partial structural schematic diagram of a glue removal mechanism 130 in an embodiment of the present application is shown; for ease of explanation, only the contents related to the embodiment of the present application are shown.

[0068] In some embodiments, please refer to Fig. 9 , and combined with reference Figures 6 to 8 There are multiple cutters 132, and all the cutters 132 are arranged in multiple rows along the first direction F1 and in multiple columns along the third direction F3. In this way, when the degumming mechanism 130 reciprocates along the third direction F3, it can simultaneously perform degumming on multiple packages 200, which can not only improve the cleaning efficiency, but also perform degumming on the same package 200 multiple times, thereby improving the cleaning efficiency.

[0069] Therefore, by arranging the position of the cutter 132 and constructing the structure of the cutter 132 , the cutter 132 can correspondingly scrape off the residual glue on the connecting portion 211 a of the lead frame 211 .

[0070] In some embodiments, please refer to Figures 3 to 5The clamping mechanism 120 includes a clamping member 121, a limiting member 122 and a connecting member 123. The clamping member 121 and the limiting member 122 are arranged at intervals along the third direction F3, the clamping member 121 is located in the accommodating groove 111, and the limiting member 122 is located on one side of the base 110 along the third direction F3. One end of the connecting member 123 is connected to the clamping member 121, and the other end of the connecting member 123 passes through the base 110 and is connected to the limiting member 122. Among them, the limiting member 122 can drive the clamping member 121 to reciprocate along the third direction F3 with the help of the connecting member 123 in response to an external force. That is, the clamping mechanism 120 has an initial state and a clamping state. The clamping mechanism 120 is in the initial state, and the limiting member 122 abuts against one side of the base 110 along the third direction F3, which can limit the entire clamping mechanism 120. The clamping mechanism 120 is in a clamping state, and the limiting member 122 is away from the base 110 and a gap is formed between the base 110, thereby driving the gap between the clamping member 121 and the corresponding groove wall of the receiving groove 111 to become larger, so as to clamp the corresponding package 200. The distance of the limiting member 122 away from the base 110 is determined according to the number of packages 200 to be clamped. In this way, since the clamping member 121 is located in the receiving groove 111 and can reciprocate along the third direction F3 driven by the limiting member 122, the required clamping space can be formed in the receiving groove 111 to clamp the package 200 to be clamped, thereby facilitating the degumming of the degumming mechanism 130.

[0071] Fig.10 A schematic cross-sectional view of the local structure of the clamping member 121, the limiting member 122 and the elastic member 124 cooperating with each other in an embodiment of the present application is shown; for ease of explanation, only the content related to the embodiment of the present application is shown.

[0072] In some embodiments, please refer to Fig.10 , and combined with reference Figures 3 to 5 , the clamping mechanism 120 also includes an elastic member 124. The elastic member 124 abuts between the clamping member 121 and the groove wall of the accommodating groove 111, and is used to provide an elastic force that makes the clamping member 121 have a tendency to move away from the limiting member 122. In this way, the elastic force of the elastic member 124 can be used to further cooperate with the limiting member 122 to achieve the clamping of the package 200 that needs to be clamped, so that the overall clamping process of the clamping mechanism 120 is more convenient. Of course, in other embodiments, a corresponding retaining member can also be provided to act on the limiting member 122 to keep the limiting member 122 in the required position. It can be set according to the specific implementation situation, and the embodiments of the present application do not impose specific restrictions on this.

[0073] In some embodiments, please refer to Fig.10 , and combined with reference Figures 3 to 5The elastic member 124 is sleeved on one end of the connecting member 123 located in the receiving groove 111. In this way, not only can the clamping force be further provided, but also the action process of the clamping member 121 can be made more stable.

[0074] In some embodiments, please refer to Fig.10 , and combined with reference Figures 3 to 5 The clamping member 121 and the limiting member 122 can be set as longitudinal members, and the longitudinal extension direction of the clamping member 121 and the longitudinal extension direction of the limiting member 122 are respectively parallel to the first direction F1. In this way, the structural characteristics of the package 200 can be better matched, so that each part of the package 200 can be clamped and fixed, thereby facilitating the glue removal action of the glue removal mechanism 130.

[0075] In some embodiments, please refer to Figures 3 to 5 The clamping mechanism 120 further includes a second operating member 125. The second operating member 125 is connected to the limiting member 122 and is used as an operating member when an external force is applied. In this way, the user can use the second operating member 125 to drive the limiting member 122 to move, which is convenient for the user to operate.

[0076] In some embodiments, please refer to Figures 3 to 5 , the degumming device 100 also includes a buffer mechanism 140. The buffer mechanism 140 is arranged on the base 110 and is located on the moving path of the degumming mechanism 130, and is used to buffer the movement of the degumming mechanism 130. Since the residual glue conditions of different connecting parts 211a on the package 200 are different, the required degumming force is also different. If the degumming is directly performed with the help of the tool 132 of the degumming mechanism 130, the force generated by the tool 132 of the degumming mechanism 130 is relatively uniform, and there will be a problem that the residual glue of some connecting parts 211a on the package 200 can be removed, while the residual glue of some connecting parts 211a is not removed cleanly. If the degumming force of the degumming mechanism 130 is further increased, it may cause damage to the connecting part 211a. Therefore, by setting the buffer mechanism 140, the degumming force generated by the degumming mechanism 130 can be buffered, reducing the damage to the connecting part 211a. Optionally, the buffer mechanism 140 can be configured as a hydraulic buffer, which can use hydraulic damping to buffer and decelerate to a stop, play a certain degree of protection, and prevent damage caused by hard collision during the glue removal process.

[0077] For specific embodiments, please continue to refer to Figures 3 to 5, the buffer mechanism 140 can be arranged on the guide path of the guide mechanism. That is, the guide member 133a is installed on the base 110 by means of the mounting member 150, and the buffer mechanism 140 is arranged between the mounting member 150 and the sliding member 133b. The buffer mechanism 140 can buffer the movement of the sliding member 133b, and then can buffer the movement of the mounting seat 131 connected to the sliding member 133b, thereby achieving buffering of the movement of the tool 132. Optionally, as Figure 4 and Figure 5 As shown, two buffer mechanisms 140 may be provided to buffer the reciprocating movement of the sliding member 133b along the third direction F3, that is, the movement of the sliding member 133b can be buffered on both sides of the sliding member 133b along the third direction F3. The buffer mechanism 140 may be provided according to actual use, and the embodiment of the present application does not impose any specific limitation on this.

[0078] The following is an illustrative description of the working process of the adhesive removal device 100 provided in the embodiment of the present application in combination with the contents in some of the above embodiments.

[0079] During operation, firstly, the tool 132 of the glue removal mechanism 130 is pushed to the buffer mechanism 140 with the help of the first operating member 134, and the multiple packages 200 are placed in the opening 111a of the receiving groove 111 of the base 110 along the first direction F1. At the same time, the second operating member 125 is used to make the limiting member 122 away from the base 110 along the third direction F3. Secondly, the multiple packages 200 can be pushed into the receiving groove 111 of the base 110 along the first direction F1. Then, the limiting member 122 is moved close to the base 110 with the help of the second operating member 125, so that the clamping member 121 presses the multiple packages 200. Subsequently, the mounting seat 131 is reciprocated along the third direction F3 with the help of the first operating member 134, so as to drive the tool 132 to scrape back and forth the overflow (i.e., residual glue) at the gap g formed by the first chamfered portion s1 of the connecting portion 211a of the package 200. Finally, after the cleaning is completed, the tool 132 of the glue removal mechanism 130 is pushed to the buffer mechanism 140 with the help of the first operating member 134, and the limiting member 122 is moved away from the base 110 along the third direction F3 with the help of the second operating member 125, so that the clamping member 121 releases the package 200, and the package 200 can be taken out. In this process, since the user can control the action of the glue removal mechanism 130 with the help of the first operating member 134, when the tool 132 contacts the residual glue, the user can feel the obstruction of the tool 132 with the help of the glue removal mechanism 130. At the same time, due to the action of the buffer mechanism 140, when the tool 132 applies the glue removal force to the residual glue, it avoids the damage of the connecting part 211a caused by excessive force. On this basis, the user can use the first operating member 134 to make the mounting seat 131 reciprocate along the third direction F3, thereby realizing the process of gradually cleaning the residual glue.

[0080] In summary, in the degumming device 100 provided in the embodiment of the present application, the degumming device 100 at least includes a base 110, a clamping mechanism 120 and a degumming mechanism 130. By placing a plurality of packages 200 in the receiving groove 111 of the base 110, and fixing the plurality of packages 200 placed in the receiving groove 111 with the help of the clamping mechanism 120, the degumming mechanism 130 is used to degumming the plurality of packages 200. At the same time, by setting the guide component 133, the action of the degumming mechanism 130 can be guided to improve the stability; by setting the elastic member 124 in the clamping mechanism 120, the clamping stability can be further improved; by setting the buffer mechanism 140, the process of gradually cleaning the residual glue can be realized, which can not only clean the residual glue more effectively, but also avoid damage to the package 200 and the cutter 132. Therefore, through the mutual cooperation between the above-mentioned components, the cleaning efficiency and cleaning effectiveness are improved, and the appearance quality of the package 200 is improved.

[0081] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A glue removal device for removing residual glue on a package, characterized in that: The package comprises a plurality of package units connected in sequence along a first direction, each package unit comprises a lead frame and a semiconductor power device packaged in the lead frame, and the lead frame has a connection portion and a pin portion arranged on two sides of the semiconductor power device in a second direction; The glue removal device comprises: A base, wherein the base is provided with a receiving groove, the receiving groove is used to receive a plurality of packages arranged along a third direction, and the connecting portion of the lead frame is exposed from a notch of the receiving groove; a clamping mechanism disposed on the base; the clamping mechanism is used to provide a clamping force acting on the plurality of packages along the third direction to limit the plurality of packages to be located in the containing groove; and A glue removal mechanism is disposed on the base; the glue removal mechanism is configured to be able to reciprocate along the third direction to remove residual glue located at the connecting portion of the lead frame; Wherein, the first direction, the second direction and the third direction are perpendicular to each other; The adhesive removal mechanism comprises: a mounting seat, a plurality of cutting tools arranged on the mounting seat, and a first operating member; the mounting seat is movably arranged on the base along the third direction; the first operating member is connected to the mounting seat and is used as an operating member when an external force is applied; The glue removal device also includes a buffer mechanism; The buffer mechanism is arranged on the base and is located on the moving path of the glue removal mechanism, and is used for buffering the movement of the glue removal mechanism.

2. The adhesive removal device according to claim 1, characterized in that: All of the cutting tools are arranged at intervals along the first direction on a side of the mounting seat facing the base, and the cutting tools are configured to be matched with the connecting portion of the lead frame.

3. The adhesive removal device according to claim 2, characterized in that: The glue removal mechanism also includes a guide assembly; The guide assembly is connected between the mounting seat and the base, and is used for guiding the movement of the mounting seat.

4. The adhesive removal device according to claim 3, characterized in that: The guide assembly comprises a guide member arranged on the base and a sliding member connected to the mounting seat, and the sliding member is movably arranged on the guide member along the third direction.

5. The adhesive removal device according to claim 2, characterized in that: A gap is formed between the connecting portions of two adjacent lead frames, and the outer contour of the tool is configured to match the contour of the gap.

6. The adhesive removal device according to any one of claims 1 to 5, characterized in that: The clamping mechanism comprises: A clamping member and a limiting member are arranged at intervals along the third direction, wherein the clamping member is located in the receiving groove, and the limiting member is located at one side of the base along the third direction; A connecting member, one end of which is connected to the clamping member, and the other end of which passes through the base and is connected to the limiting member; Wherein, the limiting member can drive the clamping member to reciprocate along the third direction with the help of the connecting member in response to an external force.

7. The adhesive removal device according to claim 6, characterized in that: The clamping mechanism also includes an elastic member; The elastic member is in contact with the clamping member and the groove wall of the accommodating groove, and is used to provide elastic force that causes the clamping member to move away from the limiting member.

8. The adhesive removal device according to claim 7, characterized in that: The elastic member is sleeved on one end of the connecting member located in the accommodating groove.

9. The adhesive removal device according to claim 6, characterized in that: The clamping mechanism further includes a second operating member; The second operating member is connected to the limiting member and is used as an acting member when an external force is applied.

10. The adhesive removal device according to claim 1, characterized in that: The buffer mechanism is configured as a hydraulic buffer.

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