Method and system for automatically detecting incoming wafers

Abstract

Embodiments of the present application relate to a kind of automatic detection incoming wafer detection method and detection system.The detection method comprises: any incoming batch wafer is as batch wafer to be detected, batch wafer to be detected has corresponding batch number;Batch wafer to be detected is placed into wafer transport box, and the cassette number of wafer transport box is acquired;According to cassette number, batch number and process menu, corresponding first test instruction is generated;Wherein, process menu corresponds to batch number;When meeting preset condition, batch wafer to be detected is transferred to target detection position according to cassette number;According to first test instruction, batch wafer to be detected is tested to determine the quality of batch wafer to be detected.Reduce the risk of personnel misoperation caused by manual detection, improve the detection efficiency of detection personnel, save the labor cost of inspection, improve the quality of production wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing, and in particular to an automatic inspection method and system for inspecting incoming wafers. Background Technology

[0002] Incoming Quality Control (IQC) refers to the quality confirmation and verification of purchased raw materials, components, or products. It involves sampling and inspecting the products when suppliers deliver them, ultimately determining whether to accept or return the batch. IQC is the first quality control checkpoint before production. Introducing substandard materials into the manufacturing process can lead to defects in the process or the final product, resulting in significant losses. IQC not only affects the quality of the company's final products but also impacts various direct and indirect costs.

[0003] Incoming wafer inspection in semiconductor factories is done manually by offline quality inspectors, which is time-consuming and labor-intensive. When the factory's production capacity increases, even more manpower will be needed for machine inspection operations. In addition, manual inspection is subject to the risk of human error and inspection efficiency issues. How to reduce human error, ensure the quality of produced wafers, and improve inspection efficiency has become an urgent problem to be solved. Summary of the Invention

[0004] This application provides an automatic inspection method and system for incoming wafers, which can optimize the incoming wafer inspection, reduce human error in the incoming wafer inspection process, ensure the quality of produced wafers, and improve inspection efficiency.

[0005] This application provides an automatic inspection method for incoming wafers, including:

[0006] Any batch of incoming wafers is used as the batch to be inspected, and the batch to be inspected has a corresponding batch number.

[0007] Place the batch of wafers to be inspected into the wafer transfer box and obtain the wafer box number;

[0008] The first test instruction is generated based on the cartridge number, batch number, and process menu; the process menu corresponds to the batch number.

[0009] When the preset conditions are met, the batch of wafers to be inspected is transferred to the target inspection position according to the wafer cassette number;

[0010] The wafers to be tested are tested according to the first test instruction to determine the quality of the wafers to be tested.

[0011] In one embodiment, the first test instruction includes a particle test instruction; testing the batch of wafers to be tested according to the first test instruction to determine the quality of the batch of wafers to be tested includes:

[0012] Perform particle testing on the batch of wafers to be tested according to the particle testing instructions;

[0013] The quality of the wafers to be tested is determined based on the particle test data of the batch to be tested and the preset particle data.

[0014] In one embodiment, particle test data includes the number of particles, preset particle data includes a preset number of particles, and the quality of the batch of wafers to be tested is determined based on the particle test data and the preset particle data, including:

[0015] If the number of particles is less than or equal to the preset number of particles, the batch of wafers to be tested is determined to be a qualified batch of wafers.

[0016] In one embodiment, if the number of particles is less than or equal to a preset number of particles, the process before determining that the batch of wafers to be tested is a qualified batch of wafers further includes:

[0017] Obtain the probability distribution of particle test data;

[0018] If the probability distribution satisfies the preset probability distribution, then compare the number of particles with the preset number of particles.

[0019] In one embodiment, the particle test data includes particle location distribution information, and the automatic inspection method for incoming wafers further includes:

[0020] When the particle position distribution information meets the preset position distribution conditions, the batch of wafers to be tested is determined to be a qualified batch of wafers.

[0021] In one embodiment, the first test instruction includes first position information corresponding to the wafers to be tested in the batch of wafers to be tested and a first preset number of wafers to be tested; the automatic detection method for incoming wafers further includes:

[0022] When the particle position distribution information does not meet the preset position distribution conditions, a second test instruction is generated. The second test instruction includes the second position information corresponding to the test wafer in the batch of wafers to be tested and the second preset number of test wafers.

[0023] In one embodiment, the particle test data includes particle number and particle location distribution information, and the preset particle data includes a preset particle number.

[0024] If only the number of particles meets the requirement of being less than or equal to the preset number of particles, the batch of wafers to be tested is determined to be a first-level qualified batch of wafers;

[0025] If the number of particles is less than or equal to the preset number of particles and the particle position distribution information meets the preset position distribution conditions, the batch of wafers to be tested is determined to be a second-level qualified batch of wafers.

[0026] Among them, the quality of the first-level qualified batch of wafers is lower than that of the second-level qualified batch of wafers.

[0027] In one embodiment, the process before the incoming batch of wafers is designated as the batch to be inspected further includes:

[0028] Generate an incoming material inspection list, which includes production data for each batch of incoming materials.

[0029] If the production data of each wafer in the incoming batch meets the feeding conditions, then the incoming batch is regarded as the incoming batch of wafers.

[0030] In one embodiment, the production data includes the number of incoming particles, and the automatic detection method for incoming wafers further includes:

[0031] If the difference between the number of particles and the number of incoming particles is less than or equal to the preset difference, then the qualified batch of wafers will be used as the production batch of wafers.

[0032] In one embodiment, after selecting any incoming batch of wafers as the batch to be inspected, the method further includes:

[0033] Set the batch number and process menu for the batch of wafers to be tested.

[0034] This application also provides an automatic inspection system for incoming wafers, including:

[0035] The setting module is used to set any incoming batch of wafers as the batch to be inspected, and the batch to be inspected has a corresponding batch number.

[0036] The transfer module is used to place the batch of wafers to be inspected into the wafer transfer box;

[0037] The control module is used to obtain the wafer cassette number, batch number, and process menu of the wafer transfer box, and then generate the corresponding first test instruction. The process menu corresponds to the batch number.

[0038] The transmission module is also used to transfer the batch of wafers to be inspected to the target inspection position according to the wafer cassette number when preset conditions are met;

[0039] The testing module is used to test the batch of wafers to be tested according to the first test instruction in order to determine the quality of the batch of wafers to be tested.

[0040] In one embodiment, the first test instruction includes a particle test instruction, and the test module is used to perform particle testing on the batch of wafers to be tested according to the particle test instruction; the testing system further includes:

[0041] The judgment module is used to determine the quality of the wafers in the batch to be inspected based on the particle test data and preset particle data.

[0042] In one embodiment, the particle test data includes the number of particles, the preset particle data includes the preset number of particles, and the determination module is used to determine that the batch of wafers to be tested is a qualified batch of wafers when the number of particles is less than or equal to the preset number of particles.

[0043] In one embodiment, the determination module is further configured to obtain the probability distribution of particle test data, and when the probability distribution satisfies the preset probability distribution, compare the number of particle tests with the preset number of particles.

[0044] In one embodiment, the particle test data includes particle position distribution information, and the determination module is further used to determine that the batch of wafers to be tested is a qualified batch of wafers when the particle position distribution information meets the preset position distribution conditions.

[0045] In one embodiment, the first test instruction includes first position information corresponding to the test wafer in the batch of wafers to be tested and a first preset number of test wafers; the determination module is further configured to generate a second test instruction when the particle position distribution information does not meet the preset position distribution conditions, the second test instruction including second position information corresponding to the test wafer in the batch of wafers to be tested and a second preset number of test wafers.

[0046] In one embodiment, the automated inspection system for incoming wafers further includes:

[0047] The supplier module is used to generate an incoming material inspection list, which includes production data for each batch of incoming materials.

[0048] The determination module is also used to determine the incoming batch of wafers as incoming batch wafers when the production data of each wafer in the incoming batch all meet the feeding conditions.

[0049] In one embodiment, the production data includes the number of incoming particles, and the determination module is further configured to identify the qualified batch of wafers as the production batch when the difference between the number of particles and the number of incoming particles is less than or equal to a preset difference.

[0050] In one embodiment, the setting module is also used to set the batch number and process menu of the batch of wafers to be tested.

[0051] This application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the detection method described in any of the above claims.

[0052] The aforementioned automatic inspection method for incoming wafers includes: taking any batch of incoming wafers as the batch to be inspected, each batch having a corresponding batch number; placing the batch to be inspected into a wafer transfer box and obtaining the cassette number of the wafer transfer box; generating a corresponding first test instruction based on the cassette number, the batch number, and the process menu; wherein the process menu corresponds to the batch number; when preset conditions are met, transferring the batch to be inspected to the target inspection position according to the cassette number; and testing the batch to be inspected according to the first test instruction to determine the quality of the batch to be inspected. In the inspection method of this application, the incoming batch of wafers to be inspected is taken as the batch of wafers to be inspected, and then placed in a wafer transfer cassette with a fixed cassette number. A first test instruction is generated according to the batch number of the batch of wafers to be inspected, the cassette number, and the process menu corresponding to the batch number. When the preset conditions are met, the batch of wafers to be inspected is transferred to the target inspection position according to the cassette number. Then, the batch of wafers to be inspected is tested according to the first test instruction to determine the quality of the batch of wafers to be inspected. This reduces the risk of human error (MO) caused by manual inspection, improves the inspection efficiency of inspection personnel, saves labor costs for inspection, and improves the quality of produced wafers.

[0053] The aforementioned automatic inspection system for incoming wafers includes a setting module for setting any batch of incoming wafers as the batch to be inspected, wherein the batch to be inspected has a corresponding batch number; a transmission module for placing the batch to be inspected into a wafer transfer box; a control module for acquiring the wafer box number, batch number, and process menu of the wafer transfer box, and generating a corresponding first test instruction, wherein the process menu corresponds to the batch number; the transmission module is also used to transmit the batch to be inspected to the target inspection position according to the wafer box number when preset conditions are met; and a testing module for testing the batch to be inspected according to the first test instruction to determine the quality of the batch to be inspected. The inspection system of this application sets the incoming batch of wafers to be inspected as the batch of wafers to be inspected through a setting module, and places the batch of wafers to be inspected into a wafer transfer cassette with a fixed cassette number through a transmission module. The control module obtains the cassette number, the batch number of the batch of wafers to be inspected, and the process menu corresponding to the batch number, and generates a corresponding first test instruction. When the preset conditions are met, the transmission module transmits the batch of wafers to be inspected to the target inspection position according to the cassette number. The testing module tests the batch of wafers to be inspected at the target inspection position according to the first test instruction to determine the quality of the batch of wafers to be inspected. This reduces the risk of human error (MO) caused by manual inspection, improves the inspection efficiency of inspection personnel, saves labor costs for inspection, and improves the quality of produced wafers. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1 This is a flowchart illustrating an automatic inspection method for incoming wafers in one embodiment;

[0056] Figure 2 This is a flowchart illustrating step S110 in one embodiment;

[0057] Figure 3 This is a flowchart illustrating an automatic inspection method for incoming wafers in another embodiment;

[0058] Figure 4 This is a flowchart illustrating an automatic inspection method for incoming wafers in another embodiment;

[0059] Figure 5 This is a schematic diagram illustrating an example of an automatic inspection method for incoming wafers in one embodiment;

[0060] Figure 6 This is a structural block diagram of an automatic inspection system for incoming wafers in one embodiment;

[0061] Figure 7 This is a structural block diagram of an automatic inspection system for incoming wafers in another embodiment.

[0062] Explanation of reference numerals in the attached figures:

[0063] 102. Setting Module; 104. Transmission Module; 106. Control Module; 108. Testing Module; 110. Judgment Module; 112. Supplier Module. Detailed Implementation

[0064] To facilitate understanding of the embodiments of this application, a more comprehensive description of the embodiments of this application will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the embodiments of this application. However, the embodiments of this application can be implemented in many different forms and are not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the embodiments of this application more thorough and complete.

[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this application belong. The terminology used herein in the description of embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0066] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the method or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0067] It is understood that the terms "first," "second," etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first test instruction may be referred to as a second test instruction, and similarly, a second test instruction may be referred to as a first test instruction. Both the first test instruction and the second test instruction are test instructions, but they are not the same test instruction.

[0068] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of this application, "several" means at least one, such as one, two, etc., unless otherwise explicitly specified.

[0069] Semiconductor factories use wafers supplied by wafer suppliers to manufacture semiconductor devices. Only wafers that pass quality inspection are used as production wafers and circulated among various processing sites. Typically, incoming wafer quality inspection is carried out manually offline by quality inspectors using testing equipment. During the manual handling of wafers, collisions or other human errors may occur, causing wafer damage or other unpredictable risks. Furthermore, manual operation carries the risk of human error (MO), resulting in low inspection efficiency, high labor costs, and low utilization of testing equipment.

[0070] Figure 1This is a flowchart illustrating an automatic inspection method for incoming wafers in one embodiment, as shown below. Figure 1 As shown, in this embodiment, an automatic inspection method for incoming wafers is provided, including:

[0071] S102, any incoming batch of wafers is taken as the batch to be inspected, and the batch to be inspected has a corresponding batch number.

[0072] Specifically, according to the specifications of the semiconductor factory, the wafer supplier provides several batches of incoming materials to the semiconductor factory. All batches of incoming materials, or batches that initially meet the requirements, are considered as incoming batch wafers. Quality inspectors select any batch of wafers as the batch to be inspected. For example, a certain number of wafers from any batch are randomly selected as the batch to be inspected. For instance, to improve the speed of quality inspection, incoming batch wafers are sampled by batch. For example, 1 / 3 of the batch number is sampled as the batch to be inspected. When the batch number is 3, 1 batch is sampled as the batch to be inspected; when the batch number is 9, 3 batches are sampled as the batch to be inspected. In some embodiments, to eliminate the impact of incoming batch wafers on the performance of semiconductor devices, all incoming batch wafers are considered as the batch to be inspected. In practical applications, the batch number and sampling rules for the batch to be inspected can be set as needed. Each batch of wafers to be tested has a corresponding batch number (lot ID), meaning that the batch number and the wafers to be tested are in one-to-one correspondence, and different batches of wafers to be tested have different batch numbers.

[0073] S104: Place the batch of wafers to be inspected into the wafer transfer box and obtain the wafer box number.

[0074] Different wafer transfer cassettes (FOUPs) have different cassette numbers (FOUP IDs). Using wafer transfer methods commonly used by those skilled in the art, such as manual transfer or mechanical transfer, the batch of wafers to be inspected is placed into the wafer transfer cassette, and the cassette number of the wafer transfer cassette is obtained. The cassette number corresponds one-to-one with the batch of wafers to be inspected. At this time, each batch of wafers to be inspected has a unique batch number and a unique cassette number.

[0075] S106, generate the corresponding first test instruction based on the cartridge number, batch number and process menu.

[0076] The first test instruction contains test information where the process menu corresponds to the batch number. Each batch number has a corresponding process menu, and the process menus for different batch numbers can be the same or different. Based on the wafer cassette number, batch number, and process menu corresponding to the batch of wafers to be tested, a first test instruction corresponding to the batch of wafers to be tested is generated. The process menu can be set during the process of generating the first test instruction or before generating the first test instruction. For example, after selecting any incoming batch of wafers as the batch of wafers to be tested, the corresponding process menu is set according to the batch number of the batch of wafers to be tested. After obtaining the wafer cassette number of the wafer transport box, the process menu corresponding to the batch of wafers to be tested is set. The process menu (recipe) refers to the program that runs when testing the batch of wafers to be tested, including various parameters corresponding to the test.

[0077] S108, when the preset conditions are met, the batch of wafers to be inspected is transferred to the target inspection position according to the wafer cassette number.

[0078] Specifically, when the preset conditions are met, the corresponding batch of wafers to be tested is transferred to the target testing position according to the wafer cassette number. The preset conditions can be that the target testing position is in an idle state or that a preset time has been reached. The preset time can be a manually set time for testing the batch of wafers to be tested. In practical applications, the preset conditions for transferring the batch of wafers to be tested to the target testing position can be set as needed.

[0079] S110, according to the first test instruction, test the batch of wafers to be tested in order to determine the quality of the batch of wafers to be tested.

[0080] After detecting that there are wafers of the batch to be inspected at the target inspection location, the corresponding first test instruction is obtained according to the wafer cassette number of the wafers of the batch to be inspected. Based on the process menu information contained in the first test instruction, the wafers of the batch to be inspected at the target inspection location are tested to obtain test data. Then, the quality of the wafers of the batch to be inspected is judged based on the test data.

[0081] The aforementioned automatic inspection method for incoming wafers includes: taking any batch of incoming wafers as the batch to be inspected, each batch having a corresponding batch number; placing the batch to be inspected into a wafer transfer cassette and obtaining the cassette number; generating a corresponding first test instruction based on the cassette number, batch number, and process menu; wherein the process menu corresponds to the batch number; when preset conditions are met, transferring the batch to be inspected to the target inspection position according to the cassette number; and testing the batch to be inspected according to the first test instruction to determine the quality of the batch to be inspected. In this application's inspection method, the incoming batch of wafers to be inspected is taken as the batch to be inspected, then placed into a wafer transfer cassette with a fixed cassette number, and a first test instruction is generated based on the batch number, cassette number, and process menu corresponding to the batch number. When preset conditions are met, the batch to be inspected is transferred to the target inspection position according to the cassette number, and then the batch to be inspected is tested according to the first test instruction to determine the quality of the batch to be inspected. It reduces the risk of human error caused by manual inspection, improves the inspection efficiency of inspectors, saves labor costs for inspection, and improves the quality of produced wafers.

[0082] Figure 2 This is a flowchart illustrating step S110 in one embodiment, as follows: Figure 2 As shown, in one embodiment, the first test instruction includes a particle test instruction, and step S110 includes:

[0083] S202, Perform particle testing on the batch of wafers to be tested according to the particle testing instruction.

[0084] S204, determine the quality of the wafers in the batch to be tested based on the particle test data and the preset particle data.

[0085] Particle contamination has a significant impact on the yield of semiconductor devices. To avoid the impact of particles in the incoming batches of wafers provided by suppliers on the yield of semiconductor devices, the first test instruction includes a particle test instruction. After the batch of wafers to be tested is transferred to the target test location, particle testing is performed on the batch of wafers to be tested according to the particle test instruction to obtain particle test data. Then, the particle test data is compared with preset particle data to determine the quality of the batch of wafers to be tested. The preset particle data here refers to the particle data that the quality inspectors have determined to meet the production requirements, that is, the particle test data that meets the specifications.

[0086] In one embodiment, the particle test data includes the number of particles, and the preset particle data includes a preset number of particles. Step S204 includes: if the number of particles is less than or equal to the preset number of particles, the batch of wafers to be tested is determined to be a qualified batch of wafers. It can be understood that the particle test data includes the number of particles, and the preset particle data includes a preset number of particles. When the number of particles is less than or equal to the preset number of particles, it is determined that the number of particles on the surface of the batch of wafers to be tested is within the specification range, meeting production requirements. Therefore, the batch of wafers to be tested is a qualified batch of wafers. This method can avoid the impact of particles in the incoming batch of wafers on the yield of semiconductor devices.

[0087] In one embodiment, step S204 further includes: if the number of particles is greater than a preset number of particles, determining that the batch of wafers to be tested is an abnormal batch of wafers, and then returning or otherwise processing the abnormal batch of wafers.

[0088] Figure 3 This is a flowchart illustrating an automatic inspection method for incoming wafers in another embodiment, as shown below. Figure 3 As shown, in one embodiment, before determining that the batch of wafers to be tested is a qualified batch of wafers if the number of particles is less than or equal to a preset number of particles, the following steps are also included:

[0089] S302, Obtain the probability distribution of particle test data.

[0090] S304. If the probability distribution satisfies the preset probability distribution, then compare the number of particles with the preset number of particles.

[0091] Specifically, after obtaining the particle test data of the batch of wafers to be inspected, the corresponding probability distribution is obtained based on the particle test data. For example, the probability distribution of the number of particles is obtained. If the probability distribution meets the preset probability distribution, such as the probability distribution meeting the normal distribution, the particle data is compared with the preset number of particles. This setting can eliminate the impact of wafer material abnormalities on the yield of semiconductor devices and improve the inspection efficiency.

[0092] In one embodiment, if the probability distribution does not meet the preset probability distribution, the batch of wafers to be tested is determined to be an abnormal batch of wafers, and then the abnormal batch of wafers is returned or otherwise processed.

[0093] In one embodiment, the particle test data includes particle location distribution information. The automatic inspection method for incoming wafers further includes: determining that the batch of wafers to be inspected is a qualified batch of wafers when the particle location distribution information meets the preset location distribution conditions. Specifically, the particle test data includes particle location distribution information on the wafer (e.g., a MAP map of particles on the wafer). If the particle location distribution on the wafer meets the preset location distribution conditions, the batch of wafers to be inspected is determined to be a qualified batch of wafers. It is understood that the number of particles in a qualified batch of wafers needs to be less than or equal to a preset number of particles. By comparing the particle location distribution information on the wafer, the impact of abnormal particle distribution, such as local concentration or local distribution of particles on the wafer, on the yield of semiconductor devices can be avoided, that is, the impact of abnormal incoming wafers on the yield of semiconductor devices can be eliminated, while reducing production costs and improving inspection efficiency.

[0094] In one embodiment, the first test instruction includes first position information corresponding to the test wafers in the batch of wafers to be tested and a first preset number of test wafers. The automatic inspection method for incoming wafers further includes: when the particle position distribution information does not meet the preset position distribution conditions, generating a second test instruction, which includes second position information corresponding to the test wafers in the batch of wafers to be tested and a second preset number of test wafers. Specifically, each batch of wafers to be tested has several wafers. To improve inspection efficiency, several wafers can be randomly selected from each batch of wafers to be tested as test wafers. The quality of the batch of wafers to be tested is determined by testing the test wafers. In this case, the first test instruction includes first position information of the test wafers in the wafer transfer cassette and a first preset number of test wafers in the batch of wafers to be tested. In some embodiments, wafers are extracted as test wafers from the front, middle, and rear parts of the wafer transfer cassette, respectively. Test wafers extracted in this way can more accurately display the quality of the batch of wafers to be tested. For example, when the batch of wafers to be tested includes 25 wafers, the first preset quantity is 6, and the first position information of the wafers in the wafer transfer cassette is slot1, slot2, slot11, slot12, slot23, and slot24, respectively. In order to eliminate the influence of the external environment (such as the wafer transfer cassette or the transfer process) on the test, when the particle position distribution information in the particle test data obtained according to the first test instruction does not meet the preset position distribution conditions, a second test instruction is generated. The second test instruction includes the second position information corresponding to the wafers to be tested in the batch of wafers to be tested and the second preset quantity of wafers to be tested. The second position information and the second preset quantity can be set as needed, thereby achieving the purpose of eliminating the influence of the external environment (such as the wafer transfer cassette or the transfer process) on the particle test data.

[0095] In one embodiment, the particle test data includes particle quantity and particle position distribution information, and the preset particle data includes a preset particle quantity. If only the particle quantity is less than or equal to the preset particle quantity, the batch of wafers to be tested is determined to be a first-level qualified batch of wafers. If the particle quantity is less than or equal to the preset particle quantity and the particle position distribution information meets the preset position distribution conditions, the batch of wafers to be tested is determined to be a second-level qualified batch of wafers. The quality of the first-level qualified batch of wafers is lower than that of the second-level qualified batch of wafers. In practical applications, first-level or second-level qualified batch wafers can be selected as production wafers according to the needs of the semiconductor device. This method can eliminate the impact of abnormal particle position distribution on the yield of semiconductor devices that are highly susceptible to particle influence, while simultaneously obtaining qualified batch wafers.

[0096] Figure 4 This is a flowchart illustrating an automatic inspection method for incoming wafers in another embodiment, as shown below. Figure 4 As shown, in one embodiment, before selecting any incoming batch of wafers as the batch to be inspected, the process further includes:

[0097] S402, Generate incoming material inspection list, which includes production data for each batch of incoming materials.

[0098] S404. If the production data of each wafer in the incoming batch meets the feeding conditions, then the incoming batch is regarded as the incoming batch wafer.

[0099] Specifically, an incoming material inspection list is generated based on the material specifications provided by the supplier. This list includes production data for each incoming batch and may also include the production batch number. The incoming material inspection list can be entered by the supplier or by quality control personnel based on information provided by the supplier. If the production data for each wafer in an incoming batch meets the acceptance conditions, that batch is considered an accepted batch of wafers; otherwise, it is considered an abnormal batch. Acceptance conditions refer to the wafer parameters set by the factory to meet various production requirements.

[0100] In one embodiment, the production data includes the number of incoming particles. The automatic detection method for incoming wafers further includes: if the difference between the number of particles and the number of incoming particles is less than or equal to a preset difference, then the qualified batch of wafers is taken as the production batch of wafers. The preset difference refers to the acceptable difference between the number of particles and the number of incoming particles. By comparing the difference between the number of particles and the number of incoming particles, the influence of the external environment on the detection of incoming wafers can be eliminated.

[0101] In one embodiment, after selecting any incoming batch of wafers as the batch to be inspected, the method further includes setting the batch ID and recipe for the batch to be inspected. In other embodiments, the production batch number of the batch to be inspected can be used as the batch ID.

[0102] Figure 5 This is a schematic diagram illustrating an example of an automatic inspection method for incoming wafers in one embodiment, such as... Figure 5As shown below, the automatic inspection method for incoming wafers is illustrated. After receiving the X0 batch of incoming wafers from the supplier, the X1 batch of incoming wafers that meets the feeding conditions is selected as the incoming batch wafers. Then, the X2 batch of incoming wafers from the X1 batch is selected as the batch wafers to be inspected. A batch number (lotID) is set for each batch wafer to be inspected. Then, the batch wafers to be inspected are placed into different wafer transfer cassettes (FOUP), and the cassette number (FOUP ID) of each wafer transfer cassette is obtained. At this time, each batch of wafers to be inspected has a corresponding batch number (lot ID) and cassette number (FOUP ID).Quality control personnel manually place wafer cassettes into the Stocker (a storage container used to store FOUPs containing wafers of the batch to be inspected). They then send the wafer cassette number corresponding to each batch to be inspected to the MES via the OPI (Operator Interface - MES manual operation page, customer terminal), thus adding the wafers to the automatic inspection queue and awaiting machine reservation. The FOUP sends an NPW reserve instruction (Non-Product Wafer reserve) to the MES (Manufacturing Execution System) via CDP / RTD (Cohesion Dispatch Platform / Realtime Dispatch), enabling information exchange between the MES and AMHS (Automatic Material Handling System), and the FOUP enters the automatic handling process. Simultaneously, the OPI generates a first test instruction corresponding to the batch of wafers to be inspected based on the wafer cassette number, batch number, and process menu. This first test instruction is then transmitted via the MES to the TCS / EAP (Tool Control System / Equipment Automation). The program (equipment automation program) allows the TCS to obtain the process menu (Recipe) corresponding to the batch of wafers to be inspected based on the first test command. When preset conditions are met (e.g., the test machine is idle or the scheduled time is approaching), the AMHS (Advanced Inspection and Quarantine System) transfers the batch of wafers to be inspected to the target inspection position (inspection machine) via the wafer transfer cassette. Simultaneously, the Stocker uses the MCS (Material Control System) to identify the wafer cassette number (transferred to the target inspection position) in the automatic inspection queue. Then, the CDP / RTD sends the wafer cassette number to the MES system. The TCS connects to the inspection machine to perform the corresponding inspection operation on the batch of wafers to be inspected according to the first test command. After inspection, the AMHS returns the FOUP containing the batch of wafers to be inspected to its original position. Subsequently, the inspection data (test data) is automatically imported into EDA / M2M (Engineering Data Analysis Tool Box System). Data analysis is performed on the map (from distribution map to distribution map), and the data and analysis results are transmitted to the computer. After interpretation by IQC quality inspectors, IQC performs quality checkpoint result determination in the SAP system, that is, determines the quality of the batch of wafers to be inspected.

[0103] Figure 6 This is a structural block diagram of an automatic inspection system for incoming wafers in one embodiment, as shown below. Figure 6As shown, this embodiment provides an automatic inspection system for incoming wafers, including: a setting module 102, a transmission module 104, a control module 106, and a testing module 108. The setting module 102 is used to set any batch of incoming wafers as a batch of wafers to be inspected, and the batch of wafers to be inspected has a corresponding batch number. Specifically, according to the specifications of the semiconductor factory, the wafer supplier provides several batches of incoming wafers to the semiconductor factory. All batches of incoming wafers or batches that initially meet the incoming requirements are taken as incoming wafer batches. Quality inspectors set the module... Block 102 uses any batch of incoming wafers as the batch to be inspected. For example, a certain number of incoming wafers are randomly selected as the batch to be inspected based on the batch quantity. For instance, to improve the quality inspection rate, incoming wafers are sampled batch by batch. For example, 1 / 3 of the batch quantity is sampled as the batch to be inspected. When the batch quantity is 3, 1 batch is sampled as the batch to be inspected; when the batch quantity is 9, 3 batches are sampled as the batch to be inspected. In some embodiments, to eliminate the impact of incoming wafer batches on semiconductor device performance, all incoming wafer batches are used as the batch to be inspected. In practical applications, the batch quantity and sampling rules for the batch to be inspected can be set as needed. Each batch of wafers to be inspected has a corresponding batch number, meaning there is a one-to-one correspondence between the batch number and the wafers to be inspected, and different batches of wafers to be inspected have different batch numbers. The transfer module 104 is used to place the batch of wafers to be inspected into the wafer transfer cassette. Different wafer transfer cassettes (FOUPs) have different cassette numbers (FOUP IDs), and the cassette number corresponds one-to-one with the batch of wafers to be inspected. At this time, each batch of wafers to be inspected has a unique batch number and a unique cassette number. The control module 106 is used to acquire the cassette number (FOUP ID) and batch number (lot) of the wafer transfer cassette (FOUP). After obtaining the ID and process menu (recipe), a corresponding first test instruction is generated. The test information contained in the first test instruction corresponds to the process menu and the batch number. Each batch number has a corresponding process menu, and the process menus of different batch numbers can be the same or different. The process menu can be set directly in the control module 106 during the process of generating the first test instruction, or it can be set before generating the first test instruction, for example, by setting the wafer to be tested in the setting module 102 at the same time. For example, after setting any incoming batch wafer as the wafer to be tested in the setting module 102, the corresponding process menu is set according to the batch number of the wafer to be tested. After obtaining the wafer cassette number, the process menu corresponding to the wafer to be tested is set in the control module 106.The transmission module 104 is also used to transmit the batch of wafers to be inspected to the target inspection position according to the wafer cassette number when preset conditions are met. Specifically, when preset conditions are met, the transmission module 104 transmits the corresponding batch of wafers to be inspected to the target inspection position according to the wafer cassette number of the wafer transfer cassette. The preset conditions can be that the target inspection position is in an idle state or that a preset time has been reached. In practical applications, the preset conditions for transmitting the batch of wafers to be inspected to the target inspection position can be set as needed. The testing module 108 is used to test the batch of wafers to be inspected according to the first test instruction to determine the quality of the batch of wafers to be inspected. After detecting that there are batch of wafers to be inspected at the target inspection position, the testing module 108 obtains the corresponding first test instruction according to the wafer cassette number of the batch of wafers to be inspected, and tests the batch of wafers to be inspected at the target inspection position according to the process menu information included in the first test instruction to obtain test data, so as to determine the quality of the batch of wafers to be inspected based on the test data.

[0104] For example, the setting module 102 includes a client operation terminal of a memory or a microcontroller. By executing a computer program stored in the memory or microcontroller, any incoming batch of wafers can be set as the batch of wafers to be inspected. The batch of wafers to be inspected has a corresponding batch number. The transmission module 104 includes an automated material handling system. The mechanical parts of the automated material handling system can place the batch of wafers to be inspected into a wafer transfer box. Alternatively, when preset conditions are met, the overhead crane can transport the batch of wafers to be inspected corresponding to certain box numbers to the target inspection position by running on a track. The control module 106 includes a memory, a microcontroller, or a comparator. By executing a computer program stored in the memory, microcontroller, or comparator, it can obtain the box number (FOUP ID), batch number (lot ID), and process menu (recipe) of the wafer transfer box (FOUP) and generate a corresponding first test instruction. The testing module 108 includes an inspection machine. The inspection machine can test the batch of wafers to be inspected according to the first test instruction to determine the quality of the batch of wafers to be inspected.

[0105] The aforementioned automatic inspection system for incoming wafers includes a setting module for setting any batch of incoming wafers as the batch to be inspected, wherein the batch to be inspected has a corresponding batch number; a transmission module for placing the batch to be inspected into a wafer transfer box; a control module for acquiring the wafer box number, batch number, and process menu of the wafer transfer box, and generating a corresponding first test instruction, wherein the process menu corresponds to the batch number; the transmission module is also used to transmit the batch to be inspected to the target inspection position according to the wafer box number when preset conditions are met; and a testing module for testing the batch to be inspected according to the first test instruction to determine the quality of the batch to be inspected. The inspection system of this application sets the incoming batch of wafers to be inspected as the batch of wafers to be inspected through a setting module. The batch of wafers to be inspected is placed into a wafer transfer cassette with a fixed cassette number through a transmission module. The control module obtains the cassette number, the batch number of the batch of wafers to be inspected, and the process menu corresponding to the batch number, and generates a corresponding first test instruction. When the preset conditions are met, the transmission module transmits the batch of wafers to be inspected to the target inspection position according to the cassette number. The testing module tests the batch of wafers to be inspected at the target inspection position according to the first test instruction to determine the quality of the batch of wafers to be inspected. This reduces the risk of human error, improves the inspection efficiency of inspection personnel, saves labor costs for inspection, and improves the quality of produced wafers.

[0106] Figure 7 This is a structural block diagram of an automatic inspection system for incoming wafers in another embodiment, as shown below. Figure 7 As shown, in one embodiment, the first test instruction includes a particle test instruction. The test module 108 is used to perform particle testing on the batch of wafers to be tested according to the particle test instruction. The testing system also includes a judgment module 110, which is used to determine the quality of the batch of wafers to be tested based on the particle test data and preset particle data. Particle contamination has a significant impact on the yield of semiconductor devices. To avoid the impact of particles in the incoming batch of wafers provided by the supplier on the yield of semiconductor devices, the first test instruction includes a particle test instruction. After the batch of wafers to be tested is transferred to the target testing location, the test module 108 performs particle testing on the batch of wafers to be tested according to the particle test instruction to obtain particle test data. The judgment module 110 compares the particle test data with the preset particle data to determine the quality of the batch of wafers to be tested. Here, the preset particle data refers to particle data that quality inspectors have determined to meet production requirements, i.e., particle test data that meets specifications.

[0107] In one embodiment, the particle test data includes the number of particles, and the preset particle data includes a preset number of particles. The determination module 110 is used to determine that the batch of wafers to be tested is a qualified batch of wafers when the number of particles is less than or equal to the preset number of particles. It can be understood that the particle test data includes the number of particles, the preset particle data includes a preset number of particles, and the determination module 110 determines that the number of particles on the surface of the batch of wafers to be tested is within the specification range when the number of particles is less than or equal to the preset number of particles, meeting production requirements. Therefore, the batch of wafers to be tested is a qualified batch of wafers. This method can avoid the impact of particles in the incoming batch of wafers on the yield of semiconductor devices.

[0108] In one embodiment, when the number of particles is greater than a preset number of particles, the determination module 110 determines that the batch of wafers to be tested is an abnormal batch of wafers, and then returns or otherwise processes the abnormal batch of wafers.

[0109] In one embodiment, the determination module 110 is further configured to acquire the probability distribution of particle test data, and when the probability distribution satisfies a preset probability distribution, compare the particle test quantity with a preset particle quantity. Specifically, after acquiring the particle test data of the batch of wafers to be inspected, the determination module 110 obtains the corresponding probability distribution based on the particle test data, for example, obtaining the probability distribution of the particle quantity; and when the probability distribution satisfies a preset probability distribution, such as the probability distribution satisfying a normal distribution, compares the particle data with the preset particle quantity. This setting can eliminate the impact of wafer incoming material abnormalities on the yield of semiconductor devices, and at the same time improve the inspection efficiency.

[0110] In one embodiment, when the probability distribution does not meet the preset probability distribution, the determination module 110 determines that the batch of wafers to be detected is an abnormal batch of wafers, and then returns or otherwise processes the abnormal batch of wafers.

[0111] In one embodiment, the particle test data includes particle position distribution information. The determination module 110 is further configured to determine that the batch of wafers to be tested is a qualified batch of wafers when the particle position distribution information meets the preset position distribution conditions. Specifically, the particle test data includes particle position distribution information on the wafer (e.g., a MAP map of particles on the wafer). The determination module 110 determines that the batch of wafers to be tested is a qualified batch of wafers when the particle position distribution on the wafer meets the preset position distribution conditions. It is understood that the number of particles in a qualified batch of wafers needs to be less than or equal to a preset number of particles. By comparing the particle position distribution information on the wafer, the impact of abnormal particle distribution, such as local concentration or local distribution of particles on the wafer, on the yield of semiconductor devices can be avoided, that is, the impact of abnormal incoming wafers on the yield of semiconductor devices can be eliminated. At the same time, production costs can be reduced and testing efficiency can be improved.

[0112] In one embodiment, the first test instruction includes first position information corresponding to the test wafers in the batch of wafers to be tested and a first preset number of test wafers; the determination module 110 is further configured to generate a second test instruction when the particle position distribution information does not meet the preset position distribution conditions. The second test instruction includes second position information corresponding to the test wafers in the batch of wafers to be tested and a second preset number of test wafers. Specifically, each batch of wafers to be tested has several wafers. To improve testing efficiency, several wafers can be randomly selected from each batch of wafers to be tested as test wafers. The quality of the batch of wafers to be tested is determined by testing the test wafers. In this case, the first test instruction includes first position information of the test wafers in the wafer transfer cassette and a first preset number of test wafers in the batch of wafers to be tested. In some embodiments, wafers are extracted as test wafers from the front, middle, and rear parts of the wafer transfer cassette, respectively. Test wafers extracted in this way can more accurately display the quality of the batch of wafers to be tested. For example, when the batch of wafers to be tested includes 25 wafers, the first preset quantity is 6, and the first position information of the wafers in the wafer transfer cassette is slot1, slot2, slot11, slot12, slot23, and slot24, respectively. In order to eliminate the influence of the external environment (such as the wafer transfer cassette or the transfer process) on the test, when the particle position distribution information in the particle test data obtained according to the first test instruction does not meet the preset position distribution conditions, a second test instruction is generated. The second test instruction includes the second position information corresponding to the wafers to be tested in the batch of wafers to be tested and the second preset quantity of wafers to be tested. The second position information and the second preset quantity can be set as needed, thereby achieving the purpose of eliminating the influence of the external environment (such as the wafer transfer cassette or the transfer process) on the particle test data.

[0113] In one embodiment, the particle test data includes particle quantity and particle position distribution information, and the preset particle data includes a preset particle quantity. The determination module 110 determines the batch of wafers to be tested as a first-level qualified batch when only the particle quantity is less than or equal to the preset particle quantity. The determination module 110 determines the batch of wafers to be tested as a second-level qualified batch when the particle quantity is less than or equal to the preset particle quantity and the particle position distribution information meets the preset position distribution conditions. The quality of the first-level qualified batch of wafers is lower than that of the second-level qualified batch of wafers. In practical applications, first-level or second-level qualified batch wafers can be selected as production wafers according to the needs of the semiconductor device. This method can eliminate the impact of abnormal particle position distribution on the yield of semiconductor devices that are highly susceptible to particle influence, while simultaneously obtaining qualified batch wafers.

[0114] Continue to refer to Figure 7In one embodiment, the automatic inspection system for incoming wafers further includes: a supplier module 112, which generates an incoming inspection list, including production data for each incoming batch; and a judgment module 110, which determines the incoming batch as an incoming batch of wafers when the production data of each wafer in the incoming batch meets the acceptance conditions. Specifically, the supplier module 112 generates an incoming inspection list based on the material specifications provided by the supplier. The incoming inspection list includes production data for each incoming batch and may also include the production batch number for each incoming batch. The supplier or quality control personnel input the incoming inspection list through the supplier module 112. The judgment module 110 determines the incoming batch as an incoming batch of wafers when the production data of each wafer in the incoming batch meets the acceptance conditions; otherwise, it determines it as an abnormal batch of wafers. The acceptance conditions refer to the wafer parameters set by the factory to meet various production requirements.

[0115] In one embodiment, the production data includes the number of incoming particles. The determination module 110 is further configured to classify the qualified batch of wafers as the production batch when the difference between the particle count and the incoming particle count is less than or equal to a preset difference. The preset difference refers to the acceptable difference between the particle count and the incoming particle count. By comparing the particle count with the incoming particle count, the influence of the external environment on the inspection of incoming wafers can be eliminated.

[0116] In one embodiment, the setting module 102 is further configured to set the batch number and process menu of the wafer batch to be inspected. In other embodiments, the setting module 102 uses the production batch number of the wafer batch to be inspected as the batch number.

[0117] This application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the detection method described in any of the above claims.

[0118] This application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method described in any of the preceding claims.

[0119] It should be understood that, although Figure 1 , Figure 2 , Figure 3 , Figure 4 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 1 , Figure 2 , Figure 3 , Figure 4At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0120] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The above-described embodiments are merely illustrative of several implementation methods of the embodiments of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the embodiments of this application, and these all fall within the protection scope of the embodiments of this application. Therefore, the protection scope of the patent for the embodiments of this application should be determined by the appended claims.

Claims

1. A detection method for automatically detecting a wafer-in-process, characterized by, The method comprises the following steps: Any incoming wafer batch is taken as a wafer batch to be detected, which has a corresponding batch number; The wafer batch to be detected is placed in a wafer transport box, and a cassette number of the wafer transport box is obtained; A first test instruction is generated according to the cassette number, the batch number and a process menu, wherein the process menu corresponds to the batch number; When a preset condition is met, the wafer batch to be detected is transported to a target detection position according to the cassette number; The wafer batch to be detected is tested according to the first test instruction to determine the quality of the wafer batch to be detected; The first test instruction comprises a particle test instruction; the testing of the wafer batch to be detected according to the first test instruction to determine the quality of the wafer batch to be detected comprises: The wafer batch to be detected is subjected to particle testing according to the particle test instruction; The quality of the wafer batch to be detected is determined according to particle test data of the wafer batch to be detected and preset particle data.

2. The detection method according to claim 1, characterized in that, The particle test data comprises a particle number, the preset particle data comprises a preset particle number, and the quality of the wafer batch to be detected is determined according to the particle test data of the wafer batch to be detected and the preset particle data. If the particle number is less than or equal to the preset particle number, the wafer batch to be detected is determined as a qualified wafer batch.

3. The detection method according to claim 2, characterized in that, Before determining the wafer batch to be detected as a qualified wafer batch if the particle number is less than or equal to the preset particle number, the following steps are further included: The probability distribution of the particle test data is obtained; If the probability distribution meets a preset probability distribution, the particle number and the preset particle number are compared.

4. The method of claim 1, wherein The particle test data comprises particle position distribution information, and the detection method further comprises: If the particle position distribution information meets a position distribution preset condition, the wafer batch to be detected is determined as a qualified wafer batch.

5. The detection method according to claim 4, characterized in that, The first test instruction comprises first position information corresponding to a detection wafer in the wafer batch to be detected and a first preset number of detection wafers; The detection method further comprises: If the particle position distribution information does not meet the position distribution preset condition, a second test instruction is generated, which comprises second position information corresponding to a detection wafer in the wafer batch to be detected and a second preset number of detection wafers.

6. The method of claim 1, wherein, The particle test data comprises a particle number and particle position distribution information, and the preset particle data comprises a preset particle number; If only the particle number meets the condition of being less than or equal to the preset particle number, the wafer batch to be detected is determined as a first-level qualified wafer batch; If the particle number meets the condition of being less than or equal to the preset particle number and the particle position distribution information meets the position distribution preset condition, the wafer batch to be detected is determined as a second-level qualified wafer batch; The quality of the first-level qualified wafer batch is lower than that of the second-level qualified wafer batch.

7. The method of claim 2, wherein Before taking the incoming wafer batch as the wafer batch to be detected, the following steps are further included: A incoming inspection list is generated, which comprises production data of each incoming wafer batch; If the production data of each wafer in the incoming batch meets the incoming condition, the incoming batch is taken as the incoming batch wafer.

8. The detection method according to claim 7, characterized in that, The production data includes the incoming particle quantity, and the detection method further includes: If the difference between the particle quantity and the incoming particle quantity is less than or equal to a preset difference, the qualified batch wafer is taken as the production batch wafer.

9. The method of claim 1, wherein, After taking any incoming batch wafer as the batch wafer to be detected, the method further includes: Setting the batch number and process menu of the batch wafer to be detected.

10. An automatic inspection system for incoming wafers, characterized in that, Including: A setting module is configured to set any incoming batch wafer as a batch wafer to be detected, and the batch wafer to be detected has a corresponding batch number; A transmission module is configured to place the batch wafer to be detected into a wafer transfer box; A control module is configured to obtain a cassette number of the wafer transfer box, the batch number, and a process menu, and then generate a corresponding first test instruction, wherein the process menu corresponds to the batch number; The transmission module is further configured to, when a preset condition is met, transfer the batch wafer to be detected to a target detection position according to the cassette number; A test module is configured to test the batch wafer to be detected according to the first test instruction to determine the quality of the batch wafer to be detected; The first test instruction includes a particle test instruction, and the test module is configured to perform particle testing on the batch wafer to be detected according to the particle test instruction; The detection system further includes: A determination module is configured to determine the quality of the batch wafer to be detected according to particle test data of the batch wafer to be detected and preset particle data.

11. The detection system of claim 10, further characterized in that the particle test data includes a particle quantity, the preset particle data includes a preset particle quantity, and the determination module is configured to determine the batch wafer to be detected as a qualified batch wafer when the particle quantity is less than or equal to the preset particle quantity.

12. The detection system of claim 11, wherein, The determination module is further configured to obtain a probability distribution of the particle test data, and compare the particle test quantity and the preset particle quantity when the probability distribution meets a preset probability distribution.

13. The detection system of claim 10, wherein, The particle test data includes particle position distribution information, and the determination module is further configured to determine the batch wafer to be detected as a qualified batch wafer when the particle position distribution information meets a position distribution preset condition.

14. The detection system of claim 13, wherein, The first test instruction includes first position information corresponding to a detection wafer in the batch wafer to be detected and a first preset quantity of detection wafers; The determination module is further configured to generate a second test instruction when the particle position distribution information does not meet the position distribution preset condition, and the second test instruction includes second position information corresponding to a detection wafer in the batch wafer to be detected and a second preset quantity of detection wafers.

15. The detection system of claim 11, wherein, The detection system further includes: A supplier module is configured to generate an incoming inspection list, and the incoming inspection list includes production data of each incoming batch; The determination module is further configured to take the incoming batch as an incoming batch wafer when the production data of each wafer in the incoming batch meets the incoming condition.

16. The detection system of claim 15, wherein, The production data includes a quantity of incoming particles, and the determination module is further configured to determine the qualified batch wafer as a production batch wafer when a difference between the quantity of particles and the quantity of incoming particles is less than or equal to a preset difference.

17. The detection system of claim 10, wherein, The setting module is further configured to set a batch number and a process menu of the batch wafer to be detected. 18.A computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer device is configured to perform the method according to any one of claims 1-17. The processor, when executing the computer program, implements the steps of the detection method in any one of claims 1 to 9.

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