Wafer Fixing Device

Abstract

The present invention provides a wafer fixing device, which relates to the technical field of semiconductor preparation. The wafer fixing device comprises: a fixing plate, the front side of the fixing plate is provided with a first clamping part, a second clamping part opposite to the first clamping part is slidably connected to the fixing plate, and the second clamping part can move toward or away from the first clamping part; the second clamping part comprises a base and an elastomer, and the two ends of the elastomer are respectively connected to the base; along the up and down directions, the elastomer comprises a first surface facing the first clamping part, and a second surface facing away from the first clamping part, and the first surface is an arc-shaped surface convex toward the first clamping part; the elastomer comprises an abutting part located in the middle part of the arc-shaped surface, and connecting parts located at the left and right ends, a transition part is connected between the connecting part and the abutting part, and a plurality of holes are provided on the transition part, and the holes penetrate the elastomer along the front and back directions.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor preparation, and in particular to a wafer fixing device. Background Art

[0002] Vacuum coating is widely used in semiconductor, optics, machinery and other fields. Electron beam thermal evaporation technology is the most important vacuum coating technology. The electron beam irradiates the evaporation source, and the solid evaporation source absorbs the energy of the electron beam and evaporates, and is adsorbed and deposited on the product. The product can be a wafer, optical device, etc. In order to prepare a uniform thin film, the substrate needs to be rotated, and the planetary rotation technology is a commonly used substrate rotation technology. In the planetary rotation technology, the product needs to be loaded on the wafer fixture of the planetary frame.

[0003] However, thicker wafers are prone to falling and breaking due to insufficient holding force, while thinner wafers are prone to being crushed due to excessive holding force. Summary of the invention

[0004] The purpose of the present invention is to provide a wafer fixing device to alleviate the technical problem that the wafer is easily broken during the wafer clamping process.

[0005] A wafer fixing device provided by an embodiment of the present invention comprises: a fixing plate, the front surface of the fixing plate having a first clamping portion, the fixing plate being slidably connected to a second clamping portion opposite to the first clamping portion, the second clamping portion being able to move toward or away from the first clamping portion;

[0006] The second clamping portion includes a base and an elastic body, and the two ends of the elastic body are respectively connected to the base; along the up-down direction, the elastic body includes a first surface facing the first clamping portion, and a second surface facing away from the first clamping portion, and the first surface is an arc-shaped surface convex toward the first clamping portion; the elastic body includes an abutment portion located in the middle part of the arc-shaped surface, and connecting portions located at the left and right ends, a transition portion is connected between the connecting portion and the abutment portion, and the transition portion has a plurality of holes, and the holes penetrate the elastic body along the front-back direction;

[0007] The back side of the fixed disk has a spring and a push-pull mechanism, the first end of the spring is connected to the second clamping part, and the second end of the spring is connected to the push-pull mechanism, and the push-pull mechanism is used to drive the second end toward or away from the second clamping part to change the elastic force applied by the spring on the second clamping part.

[0008] Furthermore, when the volume of the hole remains unchanged, the number of voids per unit volume gradually increases along the arc direction from the abutting portion to the connecting portion; and gradually increases along the radial direction from the first surface to the second surface.

[0009] Furthermore, when the number of cavities per unit volume remains unchanged, the volume of the cavities gradually increases along the arc direction from the abutting portion toward the connecting portion; and gradually increases along the radial direction from the first surface toward the second surface.

[0010] Furthermore, the volume of all holes in the portion between the first surface and the second surface of the elastomer accounts for 60%-80% of the volume of the portion between the first surface and the second surface.

[0011] Furthermore, the wafer fixing device includes a connecting plate, and the connecting plate is connected to the back side of the fixing plate by screws;

[0012] The push-pull mechanism is connected to the connecting plate.

[0013] Furthermore, a nut is provided on the back side of the connecting plate, an adjusting bolt is connected to the inner thread of the nut, and the adjusting bolt extends in the up-and-down direction, which is consistent with the movement direction of the second clamping part; the end of the adjusting bolt is connected to the spring.

[0014] Further, the adjusting bolt comprises a screw portion, a scale portion and a torsion portion which are connected in sequence, and the screw portion is threadedly connected to the nut;

[0015] The scale portion has a plurality of scale lines arranged at equal intervals in the vertical direction, and each scale line surrounds the scale portion;

[0016] The connection plate has a reference line for aligning with the scale line, and the reference line is parallel to the scale line.

[0017] Furthermore, the fixed plate has a slide rail, and the second clamping portion is slidably connected to the slide rail, so that the second clamping portion only moves in the up and down directions.

[0018] Further, the base includes a rear plate and an upper plate connected vertically, the rear plate is connected to a spring, and the elastic body is connected to the upper plate;

[0019] A first connecting plate perpendicular to the surface of the upper plate facing the first clamping portion is provided, and the number of the first connecting plates is two, and the two first connecting plates are arranged at intervals; second connecting plates extending in the direction of each other are provided on the surfaces of the two first connecting plates facing each other, and a gap is formed between the two second connecting plates, and there is a gap between the second connecting plates and the upper plate, and the connecting part of the elastomer is fixed in the gap between the second connecting plate and the upper plate, and the top of the elastomer is exposed from the gap, and the top of the elastomer is higher than the second connecting plate.

[0020] Furthermore, a cover plate is connected to the base, the cover plate is connected to the upper plate, and the cover plate and the rear plate are respectively located at the front and rear sides of the upper plate;

[0021] The projection of the cover plate on the rear plate at least covers the projection of the elastic body on the rear plate.

[0022] The wafer fixing device provided by the embodiment of the present invention includes: a fixing plate, the front side of the fixing plate has a first clamping part, the fixing plate is slidably connected with a second clamping part opposite to the first clamping part, and the second clamping part can move toward or away from the first clamping part; the second clamping part includes a base and an elastic body, and the two ends of the elastic body are respectively connected to the base; along the up and down direction, the elastic body includes a first surface facing the first clamping part, and a second surface facing away from the first clamping part, and the first surface is an arc-shaped surface convex toward the first clamping part; the elastic body includes an abutment part located in the middle part of the arc-shaped surface, and connecting parts located at left and right ends, a transition part is connected between the connecting part and the abutment part, and a plurality of holes are provided on the transition part, and the holes penetrate the elastic body along the front and back direction; the back side of the fixing plate has a spring and a push-pull mechanism, the first end of the spring is connected to the second clamping part, and the second end of the spring is connected to the push-pull mechanism, and the push-pull mechanism is used to drive the second end toward or away from the second clamping part to change the elastic force applied by the spring on the second clamping part. When the wafer fixing device provided by the embodiment of the present invention is used to clamp and fix the wafer, the clamping force of the second clamping part can be adjusted in advance according to the thickness of the wafer. Specifically, the user pushes and pulls the mechanism to adjust the distance between the first end and the second end of the spring. After the expansion length of the spring changes, the tension of the spring on the second clamping part changes, thereby changing the force applied by the second clamping part on the side of the wafer, so as to better adapt to wafers of different thicknesses. Furthermore, the elastic body on the second clamping part can be in uniform contact with the side wall of the wafer. Because, under the action of the spring, the top end of the elastomer abuts against the side wall of the wafer, and a transition portion with holes is arranged between the abutting portion and the connecting portion of the elastomer. The holes in the transition portion can reduce the elastic force of the transition portion, thereby making it easier for the abutting portion to deform toward the connecting portion. In other words, after the abutting portion abuts against the side wall of the wafer, the abutting portion protruding toward one side of the wafer can be more easily deformed outward and become an arc-shaped surface protruding away from the wafer, thereby forming a surface contact between the abutting portion and the side wall of the wafer, reducing the pressure on the side of the wafer exerted by the second clamping portion, which is beneficial to prevent the thinner wafer from breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A rear view of a wafer fixing device provided by an embodiment of the present invention;

[0025] Figure 2 A side view of a wafer fixing device provided by an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of a second clamping portion of a wafer fixing device provided in an embodiment of the present invention (the cover plate is omitted);

[0027] Figure 4 A diagram showing a process of abutting between an elastic body and a wafer in a wafer fixing device provided in an embodiment of the present invention.

[0028] Icons: 100 - fixed plate; 110 - first clamping part; 120 - nut; 130 - adjusting bolt; - screw part; 140 - slide rail;

[0029] 200 - second clamping portion; 211 - rear plate; 212 - upper plate; 213 - first connecting plate; 214 - second connecting plate;

[0030] 220 - elastic body; 221 - abutment portion; 222 - connection portion; 223 - transition portion; 2231 - hole;

[0031] 300 - spring;

[0032] 400 - positioning column; 500 - connecting column; 600 - connecting plate. DETAILED DESCRIPTION

[0033] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] like Figure 1 - Figure 4As shown, the wafer fixing device provided by the embodiment of the present invention includes: a fixing plate 100, the front side of the fixing plate 100 has a first clamping portion 110, the fixing plate 100 is slidably connected with a second clamping portion 200 opposite to the first clamping portion 110, the second clamping portion 200 can move toward or away from the first clamping portion 110, and the wafer is clamped and fixed by the first clamping portion 110 and the second clamping portion 200.

[0035] The second clamping portion 200 includes a base and an elastic body 220, both ends of the elastic body 220 are connected to the base, and the material of the elastic body 220 can be rubber. In the vertical direction, the elastic body 220 includes a first surface facing the first clamping portion 110 and a second surface facing away from the first clamping portion 110, and the first surface is an arc-shaped surface convex toward the first clamping portion 110, and the middle position of the first surface is vertically aligned with the middle position of the first clamping portion 110. The elastomer 220 includes an abutment portion 221 located in the middle part of the arc-shaped surface, and a connecting portion 222 located at the left and right ends. A transition portion 223 is connected between the connecting portion 222 and the abutment portion 221. The transition portion 223 has a plurality of holes 2231. The holes 2231 penetrate the elastomer 220 in the front-to-back direction. The arrangement of the holes 2231 facilitates the deformation of the elastomer 220. The arrangement of the holes 2231 can reduce the elasticity of the transition portion 223. The abutment portion 221 directly connected to the transition portion 223 is more likely to deform when subjected to the pressure of the wafer, thereby making it easier to change from line contact to surface contact.

[0036] The back of the fixed plate 100 has a spring 300 and a push-pull mechanism, the first end of the spring 300 is connected to the second clamping part 200, and the second end of the spring 300 is connected to the push-pull mechanism, and the push-pull mechanism is used to drive the second end toward or away from the second clamping part 200 to change the elastic force applied by the spring 300 on the second clamping part 200. When the wafer fixing device provided by the embodiment of the present invention is used to clamp and fix the wafer, the clamping force of the second clamping part 200 can be adjusted in advance according to the thickness of the wafer. Specifically, the user uses the push-pull mechanism to adjust the distance between the first end and the second end of the spring 300. After the telescopic length of the spring 300 changes, the tension of the spring 300 on the second clamping part 200 changes, thereby changing the force applied by the second clamping part 200 on the side of the wafer, so as to better adapt to wafers of different thicknesses. Further, the elastic body 220 on the second clamping part 200 can be in uniform contact with the side wall of the wafer. Because, under the action of the spring 300, the top end of the elastomer 220 abuts against the side wall of the wafer, and a transition portion 223 with a hole 2231 is provided between the abutting portion 221 and the connecting portion 222 of the elastomer 220. The hole 2231 in the transition portion 223 can reduce the elastic force of the transition portion 223, thereby making it easier for the abutting portion 221 to deform toward the connecting portion 222. That is to say, after the abutting portion 221 abuts against the side wall of the wafer, the abutting portion 221 protruding toward one side of the wafer can be more easily deformed outward and become an arc-shaped surface protruding away from the wafer, so that the abutting portion 221 forms a surface contact with the side wall of the wafer, reducing the pressure on the side of the wafer exerted by the second clamping portion, which is beneficial to prevent the thinner wafer from breaking.

[0037] In an operative solution, when the volume of the holes 2231 remains unchanged, the number of holes per unit volume gradually increases along the arc direction from the abutting portion 221 to the connecting portion 222, and gradually increases along the radial direction from the first surface to the second surface. Specifically, along the arc direction from the abutting portion 221 to the connecting portion 222, a plurality of rows of hole groups are arranged on the transition portion 223, and the plurality of holes 2231 in the hole groups are arranged radially, and the number of holes 2231 in each hole group is at least one. Specifically, in this embodiment, the number of holes 2231 in the hole group closest to the abutting portion 221 is five, and along the arc direction, from the middle to the bottom, the number of holes 2231 in the hole group increases by two step by step, and along the radial direction, from the first surface to the second surface, the density of the holes 2231 in each hole group gradually increases. Thus, the elastic force distribution on the transition portion 223 can be gradually reduced from the middle to the bottom and from the first surface to the second surface, and the elastic deformation is more and more likely to occur from the middle to the bottom and from the first surface to the second surface, so that the abutment portion 221 can be deformed and fit to the circumferential side wall of the wafer. Similarly, in another feasible scheme, when the number of voids in a unit volume remains unchanged, the volume of the voids gradually increases along the arc direction from the abutment portion 221 to the connection portion 222; and gradually increases along the radius direction from the first surface to the second surface. Thus, the elastic force distribution on the transition portion 223 can be gradually reduced from the middle to the bottom and from the first surface to the second surface, and the elastic deformation is more and more likely to occur from the middle to the bottom and from the first surface to the second surface, so that the abutment portion 221 can be deformed and fit to the circumferential side wall of the wafer.

[0038] The volume of all the holes 2231 in the portion between the first surface and the second surface of the elastic body 220 accounts for 60% to 80% of the volume of the portion between the first surface and the second surface.

[0039] The area of ​​the arc surface of the abutting portion 221 is approximately 20% of the overall area of ​​the arc surface. The volume of all holes 2231 in the portion between the first surface and the second surface of the elastic body 220 accounts for 60%-80% of the volume of the portion between the first surface and the second surface. The proportion of the holes 2231 affects the ease with which the abutting portion 221 is deformed. Setting the proportion of the volume of the holes 2231 between 60% and 80% can ensure that the abutting portion 221 is relatively easy to deform upwardly concave, and the abutting portion 221 will not fail to restore its original shape after the wafer is removed.

[0040] The wafer fixing device includes a connecting plate 600, and the connecting plate 600 is connected to the back of the fixing plate 100 by screws; the push-pull mechanism is connected to the connecting plate 600. The connection between the push-pull mechanism and the fixing plate 100 is realized by the connecting plate 600, which facilitates the modification of the existing fixing plate 100 and saves costs.

[0041] The back of the fixing plate 100 is provided with a nut 120, which is relatively fixed to the connecting plate 600. The inner thread of the nut 120 is connected with an adjusting bolt 130, and the adjusting bolt 130 extends in the up-down direction, which is consistent with the movement direction of the second clamping part 200. Figure 1 By rotating the adjusting bolt 130 in the up and down direction, the adjusting bolt 130 can be moved toward or away from the second clamping part 200. The end of the adjusting bolt 130 close to the second clamping part 200 is connected to the spring 300. When the wafer fixing device clamps and fixes the wafer, the clamping force of the second clamping part 200 can be adjusted in advance according to the thickness of the wafer. Specifically, the user rotates the adjusting bolt 130 forward or reversely, and the adjusting bolt 130 moves forward and backward in the up and down direction. After the telescopic length of the spring 300 changes, the tension of the spring 300 on the second clamping part 200 changes, thereby changing the force applied by the second clamping part 200 on the side of the wafer, so as to better adapt to wafers of different thicknesses.

[0042] During the use of the above-mentioned wafer fixing device, after the front-line workers or technical engineers load the wafer into the fixture, they can adjust the tension of the spring 300 by rotating the adjusting bolt to move the screw forward and backward according to the thickness and material of the wafer. Therefore, the pressing force of the second clamping part on the wafer can be adjusted according to the thickness and material of the wafer. Therefore, the wafer fixing device can not only prevent thicker wafers from falling off the planetary frame and breaking due to insufficient pressing force; at the same time, it can also prevent thinner wafers from breaking due to excessive pressing force.

[0043] The adjusting bolt 130 includes a screw portion, a scale portion and a torsion portion which are connected in sequence, and the screw portion is threadedly connected to the nut 120; the scale portion has a plurality of scale lines which are evenly spaced in the up and down directions, and each scale line surrounds the scale portion; the connecting plate 600 has a reference line for aligning with the scale lines, and the reference line is parallel to the scale lines.

[0044] The user holds the twisting part and then rotates the twisting part, and the adjusting bolt 130 rotates as a whole. The scale lines on the scale part can always be parallel to the reference line during the rotation process, which is convenient for the user to check the degree, which directly reflects the distance the adjusting bolt 130 moves relative to the initial position (the position where the tension of the spring 300 is 0). Therefore, the tension of the second clamping part of the spring 300 can be quantified through the scale lines, thereby realizing the quantification of the clamping force of the chuck on the edge of the wafer.

[0045] In an practicable solution, in order to avoid accidental operation of the rotating adjustment bolt 130 after the elastic force of the spring 300 is adjusted, the torsion part and the scale part can be set to a detachable connection mode. Specifically, the torsion part includes a hexagonal plug rod extending in the up-down direction, and the end surface of the scale part has a hexagonal hole corresponding to the hexagonal plug rod. When adjustment is required, the hexagonal plug rod on the torsion part is inserted into the hexagonal hole on the scale part, and then the screw part is rotated; and after the adjustment is completed, the torsion part is pulled out to avoid accidental contact, which causes the elastic force of the spring 300 to change.

[0046] The fixed plate 100 has a slide rail 140, and the second clamping part 200 is slidably connected in the slide rail 140 so that the second clamping part 200 only moves in the up and down direction, thereby preventing the second clamping part 200 from deviating to the left and right directions when moving in the up and down direction, thereby affecting the force applied by the elastomer 220 on the side wall of the wafer.

[0047] The base includes a rear plate 211 and an upper plate 212 that are vertically connected. The base is slidably connected in a slide rail 140 that runs through the front and rear surfaces of the fixed plate 100. The rear plate 211 is located on the rear side of the fixed plate 100. The rear plate 211 is fixedly connected to the spring 300. The elastomer 220 is connected to the upper plate 212, and the arc surface of the elastomer 220 faces downward. A first connecting plate 213 perpendicular to the surface of the upper plate 212 facing the first clamping portion 110 is provided, and the number of the first connecting plates 213 is two, and the two first connecting plates 213 are arranged at intervals; second connecting plates 214 extending in the direction of each other are provided on the surfaces facing each other of the two first connecting plates 213, and a gap is formed between the two second connecting plates 214, and there is a gap between the second connecting plates 214 and the upper plate 212, and the connecting portion 222 of the elastomer 220 is fixed in the gap between the second connecting plate 214 and the upper plate 212, and the top of the elastomer 220 is exposed from the gap, and the top of the elastomer 220 is higher than the second connecting plate 214, so that the top of the elastomer 220 can abut against the side wall of the wafer.

[0048] The base is connected with a cover plate, which is connected to the upper plate 212, and the cover plate and the rear plate 211 are respectively located at the front and rear sides of the upper plate 212; the projection of the cover plate on the rear plate 211 at least covers the projection of the elastic body 220 on the rear plate 211. In addition to limiting the elastic body 220 between the first connecting plate 213 and the second connecting plate 214, the cover plate can also limit the wafer. The lower edge of the cover plate extends downward to below the top of the elastic body 220. After the wafer abuts against the elastic body 220, the cover plate can prevent the wafer from tilting forward, thereby protecting the wafer.

[0049] The back side of the fixed disk 100 has a connecting column 500 connected to the planet carrier. The spring 300 may be an annular spring 300 , and the connecting column 500 is located inside the circle of the annular spring 300 .

[0050] Both ends of the spring 300 have metal wires extending axially outward; two positioning columns 400 are provided on the back of the fixed plate 100, and the metal wire between the spring 300 and the second clamping part 200 passes through one of the positioning columns 400, and the metal wire between the spring 300 and the adjusting bolt 130 passes through the other positioning column 400.

[0051] The main body of the spring 300 extends in the up-down direction and is located between the adjusting bolt 130 and the second clamping portion 200. Two metal wires are led out from both ends of the spring 300. The metal wires pass through the holes on the positioning column 400, and the metal wires can move in the up-down direction relative to the positioning column 400. The positioning column 400 can position the spring 300 to prevent the position of the spring 300 from changing during the adjustment process.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer fixing device, characterized in that: include: A fixed plate (100), wherein the front side of the fixed plate (100) has a first clamping portion (110), and the fixed plate (100) is slidably connected with a second clamping portion (200) opposite to the first clamping portion (110), and the second clamping portion (200) can move toward or away from the first clamping portion (110); The second clamping portion (200) comprises a base and an elastic body (220), and two ends of the elastic body (220) are respectively connected to the base; Along the up-down direction, the elastic body (220) comprises a first surface facing the first clamping portion (110), and a second surface facing away from the first clamping portion (110), and the first surface is an arcuate surface convex toward the first clamping portion (110); the elastic body (220) comprises an abutting portion (221) located in the middle part of the arcuate surface, and connecting portions (222) located at left and right ends, a transition portion (223) is connected between the connecting portion (222) and the abutting portion (221), and the transition portion (223) has a plurality of holes (2231), and the holes (2231) penetrate the elastic body (220) along the front-back direction; wherein the up-down direction is the direction from the second clamping portion (200) to the first clamping portion (110); and the front-back direction is the direction perpendicular to the fixing plate (100); The back side of the fixed disk (100) is provided with a spring (300) and a push-pull mechanism, wherein the first end of the spring (300) is connected to the second clamping portion (200), and the second end of the spring (300) is connected to the push-pull mechanism, and the push-pull mechanism is used to drive the second end toward or away from the second clamping portion (200) to change the elastic force applied by the spring (300) on the second clamping portion (200).

2. The wafer fixing device according to claim 1, characterized in that: When the volume of the hole (2231) remains unchanged, the number of cavities within a unit volume gradually increases along the arc direction from the abutment portion (221) toward the connection portion (222); and gradually increases along the radial direction from the first surface toward the second surface.

3. The wafer fixing device according to claim 1, characterized in that: When the number of cavities per unit volume remains unchanged, the volume of the cavities gradually increases along the arc direction from the abutting portion (221) toward the connecting portion (222); and gradually increases along the radial direction from the first surface toward the second surface.

4. The wafer fixing device according to claim 1, characterized in that: The volume of all holes (2231) in the portion between the first surface and the second surface of the elastomer (220) accounts for 60% to 80% of the volume of the portion between the first surface and the second surface.

5. The wafer fixing device according to claim 1, characterized in that: The wafer fixing device comprises a connecting plate (600), and the connecting plate (600) is connected to the back side of the fixing plate (100) via screws; The push-pull mechanism is connected to the connecting plate (600).

6. The wafer fixing device according to claim 5, characterized in that: A nut (120) is provided on the back side of the connecting plate (600), and an adjusting bolt (130) is connected to the inner thread of the nut (120). The adjusting bolt (130) extends in an up-down direction, and the up-down direction is consistent with the movement direction of the second clamping part (200); the end of the adjusting bolt is connected to the spring.

7. The wafer fixing device according to claim 6, characterized in that: The adjusting bolt (130) comprises a screw portion, a scale portion and a torsion portion which are connected in sequence, and the screw portion is threadedly connected to the nut (120); The scale portion has a plurality of scale lines arranged at equal intervals in the vertical direction, and each scale line surrounds the scale portion; The connection plate (600) has a reference line for aligning with the scale line, and the reference line is parallel to the scale line.

8. The wafer fixing device according to claim 1, characterized in that: The fixed plate (100) is provided with a slide rail (140), and the second clamping portion (200) is slidably connected in the slide rail (140) so that the second clamping portion (200) moves only in the up and down directions.

9. The wafer fixing device according to claim 1, characterized in that: The base comprises a rear plate (211) and an upper plate (212) which are vertically connected, the rear plate (211) is connected to a spring (300), and the elastic body (220) is connected to the upper plate (212); A first connecting plate (213) perpendicular to a surface of the upper plate (212) facing the first clamping portion (110) is provided, and the number of the first connecting plates (213) is two, and the two first connecting plates (213) are arranged at intervals; second connecting plates (214) extending in the direction of each other are provided on the surfaces of the two first connecting plates (213) facing each other, and a gap is formed between the two second connecting plates (214), and a gap is provided between the second connecting plates (214) and the upper plate (212); the connecting portion (222) of the elastic body (220) is fixed in the gap between the second connecting plate (214) and the upper plate (212), and the surface of the elastic body (220) facing away from the upper plate (212) has a portion exposed from the gap, and the portion of the elastic body (220) exposed from the gap is higher than the second connecting plate (214).

10. The wafer fixing device according to claim 9, characterized in that: A cover plate is connected to the base, the cover plate is connected to the upper plate (212), and the cover plate and the rear plate (211) are respectively located at the front and rear sides of the upper plate (212); The projection of the cover plate on the rear plate (211) at least covers the projection of the elastic body (220) on the rear plate (211).

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