Three-dimensional heat transfer device

Abstract

A three-dimensional heat transfer device includes a first heat conducting shell, a second heat conducting shell, at least one heat conducting bump, at least one first capillary structure, at least one second capillary structure, and at least one first heat pipe. The second heat conducting shell has at least one first through hole, and the second heat conducting shell is arranged on the first heat conducting shell so that the first heat conducting shell and the second heat conducting shell jointly form a liquid-tight chamber. The at least one heat conducting bump protrudes from the first heat conducting shell. The at least one first capillary structure is stacked on the first heat conducting shell. The at least one second capillary structure is stacked on the at least one heat conducting bump and is thermally coupled to the at least one first capillary structure. The at least one first heat pipe is inserted into the at least one first through hole and abuts against the at least one second capillary structure.

Description

Technical Field

[0001] This invention relates to a heat transfer device, and more particularly to a three-dimensional heat transfer device. Background Technology

[0002] The technical principle of a vapor chamber is similar to that of a heat pipe, but the heat conduction method differs. A heat pipe uses one-dimensional linear heat conduction, while heat in a vapor chamber is conducted over a two-dimensional surface, resulting in higher efficiency. Specifically, a vapor chamber mainly consists of a cavity and a capillary structure. The cavity contains a hollow chamber for filling with a working fluid. The capillary structure is arranged within the hollow chamber. The heated portion of the cavity is called the evaporation zone. The heat dissipation portion is called the condensation zone. The working fluid absorbs heat and vaporizes in the evaporation zone, rapidly expanding throughout the cavity. In the condensation zone, it releases heat and condenses into a liquid state. Then, the liquid working fluid returns to the evaporation zone through the capillary structure, forming a cooling cycle.

[0003] However, current vapor chambers and heat pipes operate independently, resulting in heat transfer being only planar or linear in nature for each vapor chamber or heat pipe, rather than holistic three-dimensional heat transfer. Summary of the Invention

[0004] The present invention provides a three-dimensional heat transfer device to improve the heat dissipation efficiency of the three-dimensional heat transfer device.

[0005] An embodiment of the present invention discloses a three-dimensional heat transfer device comprising a first heat-conducting shell, a second heat-conducting shell, at least one heat-conducting bump, at least one first capillary structure, at least one second capillary structure, and at least one first heat pipe. The second heat-conducting shell has at least one first perforation and is mounted on the first heat-conducting shell such that the first and second heat-conducting shells together form a liquid-tight chamber. At least one heat-conducting bump protrudes from the first heat-conducting shell. At least one first capillary structure is stacked on the first heat-conducting shell. At least one second capillary structure is stacked on the at least one heat-conducting bump and thermally coupled to the at least one first capillary structure. At least one first heat pipe passes through the at least one first perforation and abuts against the at least one second capillary structure.

[0006] According to the three-dimensional heat transfer device of the above embodiment, by designing the first heat pipe to abut against the second capillary structure stacked on the heat-conducting protrusion, on the one hand, it can avoid opening a clearance structure on the heat-conducting protrusion for the first heat pipe to pass through, and on the other hand, it can shorten the return water distance of the heat pipe, thereby increasing the heat dissipation efficiency of the three-dimensional heat transfer device.

[0007] The above description of the invention and the following description of the embodiments are used to demonstrate and explain the principles of the invention, and to provide a further explanation of the claims of the invention. Attached Figure Description

[0008] Figure 1This is a perspective view of the three-dimensional heat transfer device according to the first embodiment of the present invention.

[0009] Figure 2 for Figure 1 The exploded diagram.

[0010] Figure 3 for Figure 1 Another perspective of the exploded view.

[0011] Figure 4 for Figure 1 Cross-sectional view.

[0012] The accompanying figure is labeled as follows:

[0013] 10 Three-dimensional heat transfer devices

[0014] 100 First heat-conducting shell

[0015] 110 base plate

[0016] 111 inner surface

[0017] 120 circumferential side plate

[0018] 121 inner surface

[0019] 130 First convex hull structure

[0020] 131 inner surface

[0021] 140 Second Convex Hull Structure

[0022] 141 inner surface

[0023] 142 outer surface

[0024] 200 Second heat-conducting shell

[0025] 210 First perforation

[0026] 220 Second Perforation

[0027] 300 thermal bumps

[0028] 310 First Surface

[0029] 320 Second Surface

[0030] 400 First capillary structure

[0031] 500 Second Capillary Structure

[0032] 510 top surface

[0033] 550 Third Capillary Structure

[0034] 600 First Heat Pipe

[0035] 610 First Heat Pipe Chamber

[0036] 620 gap

[0037] 700 Second Heat Pipe

[0038] 710 Second Heat Pipe Chamber

[0039] 800 support structure

[0040] C Zhouyuan

[0041] D1 First Distance

[0042] D2 Second Distance

[0043] L1, L2 return water length

[0044] S-Liquid-Tight Chamber Detailed Implementation

[0045] Please see Figures 1 to 4 . Figure 1 This is a perspective view of the three-dimensional heat transfer device according to the first embodiment of the present invention. Figure 2 for Figure 1 The exploded diagram. Figure 3 for Figure 1 Another perspective of the exploded view. Figure 4 for Figure 1 Cross-sectional view.

[0046] The three-dimensional heat transfer device 10 of this embodiment includes a first heat-conducting shell 100, a second heat-conducting shell 200, a plurality of heat-conducting protrusions 300, a first capillary structure 400, a plurality of second capillary structures 500, a plurality of third capillary structures 550, a plurality of first heat pipes 600 and a plurality of second heat pipes 700.

[0047] The first heat-conducting shell 100 and the second heat-conducting shell 200 are made of, for example, metal and are made by sheet metal stamping. The second heat-conducting shell 200 is mounted on the first heat-conducting shell 100 so that the first heat-conducting shell 100 and the second heat-conducting shell 200 together form a liquid-tight chamber S.

[0048] The first heat-conducting shell 100 includes a base plate 110, an annular side plate 120, a first convex structure 130, and a second convex structure 140. The annular side plate 120 is connected to the periphery of the base plate 110. The first convex structure 130 protrudes from the base plate 110 in a direction away from the second heat-conducting shell 200. The second convex structure 140 protrudes from the first convex structure 130 in a direction away from the second heat-conducting shell 200. The second convex structure 140 has an inner surface 141 and an outer surface 142. The outer surface 142 faces away from the inner surface 141 and is used to contact a heat source (not shown). The heat source is, for example, a central processing unit or an image processor. The second heat-conducting shell 200 has a plurality of first through holes 210 and a plurality of second through holes 220.

[0049] These thermally conductive bumps 300 are made of, for example, metal. These thermally conductive bumps 300 protrude from the inner surface 141 of the second convex structure 140 of the first thermally conductive shell 100. Furthermore, these thermally conductive bumps 300 have a first surface 310 and a second surface 320. The first surface 310 faces away from the outer surface 142 of the second convex structure 140. The second surface 320 connects the first surface 310 and the inner surface 141 of the second convex structure 140.

[0050] In this embodiment, these thermally conductive bumps 300 are, for example, rectangular bodies of different lengths, but are not limited thereto. In other embodiments, the thermally conductive bumps may also be non-rectangular bodies, as long as they can provide the required vapor pressure drop in the liquid-tight chamber S and reduce the high liquid pressure drop caused by the capillary action of the powder sintering capillary structure.

[0051] In this embodiment, the thermally conductive bumps 300 are parallel to each other, but this is not a limitation. In other embodiments, the thermally conductive bumps may also be arranged radially.

[0052] The first capillary structure 400 and the second capillary structures 500 are selected from the group consisting of metal mesh, powder sintered body, and ceramic sintered body. The first capillary structure 400 is stacked on at least a portion of the inner surface 111 of the base plate 110 of the first heat-conducting shell 100, at least a portion of the inner surface 121 of the annular side plate 120, at least a portion of the inner surface 131 of the first convex structure 130, and at least a portion of the inner surface 141 of the second convex structure 140. The second capillary structure 500 is stacked on the first surface 310 of the heat-conducting bump 300. The third capillary structure 550 is stacked on the second surface 320 of the heat-conducting bump 300 and connects the first capillary structure 400 and the second capillary structure 500.

[0053] In this embodiment, the second capillary structure 500 is disposed on the first surface 310 of the thermally conductive bump 300, making the second capillary structure 500 closer to the second thermally conductive shell 200 than the first capillary structure 400 located on the second bulge structure, rather than directly increasing the thickness of the second capillary structure 500. This is because a thinner capillary results in a lower evaporation thermal resistance. Therefore, by raising the second capillary structure 500 with the thermally conductive bump 300, the thickness of the second capillary structure 500 can be reduced, thereby lowering its thermal resistance. Calculations show that when the thickness of the second capillary structure 500 is reduced from 0.6 mm to 0.4 mm, the thermal resistance also changes from 0.0333 °C / W to 0.0222 °C / W.

[0054] In this embodiment, the second capillary structure 500 has a top surface 510 facing away from the second convex structure 140. The top surface 510 maintains a first distance D1 with the inner surface 141 of the second convex structure 140. A vapor channel is formed between the inner surface 141 of the second convex structure 140 and the two heat-conducting shells 200, and a second distance D2 is maintained between the inner surface 141 of the second convex structure 140 and the second heat-conducting shell 200. The ratio of the first distance D1 to the second distance D2 is, for example, between 60% and 65% and 35% and 40%.

[0055] The first heat pipe 600 and the second heat pipe 700 are distinguished, for example, by their placement. The projection of the first heat pipe 600 onto the outer surface 142 and its extension of the second convex structure 140 lies within the outer surface 142. "The projection lies within the outer surface 142" means that the projection lies within the area enclosed by the contour C of the outer surface 142. The projection of the second heat pipe 700 onto the outer surface 142 and its extension of the second convex structure 140 lies outside the outer surface 142. "The projection lies outside the outer surface 142" means that the projection lies outside the area enclosed by the contour C of the outer surface 142.

[0056] These first heat pipes 600 are respectively inserted through these first perforations 210, and these first heat pipes 600 respectively abut against the second capillary structure 500 stacked on the first surface 310 of the heat-conducting bump 300, so that the first heat pipes 600 are separated from the first capillary structure 400 stacked on the inner surface 141 of the second bulge structure 140.

[0057] Furthermore, the first heat pipe 600 has a first heat pipe chamber 610 and a notch 620. The first heat pipe chamber 610 is connected to the liquid-tight chamber S through the notch 620. The notch 620 is used to allow the working fluid to flow through. The working fluid is, for example, vapor.

[0058] In this embodiment, the first heat pipe chamber 610 is connected to the liquid-tight chamber S through a notch 620. However, since the first heat pipe 600 abuts against the second capillary structure 500, and the first heat pipe chamber 610 is partially exposed by the second capillary structure 500, in other embodiments, the first heat pipe may not have a notch 620. That is, in other embodiments, the first heat pipe chamber 610 may be directly connected to the liquid-tight chamber S through a gap not covered by the second capillary structure 500.

[0059] In this embodiment, the capillary structures (not shown in the figure) of the first heat pipes 600 are connected to the second capillary structures 500 by means of metallic bonding, for example, but this is not a limitation. In other embodiments, the capillary structures of the first heat pipes may simply abut against the second capillary structures. The phrase "the capillary structures of the first heat pipes 600 (not shown in the figure) are connected to the second capillary structures 500 by means of metallic bonding" means, for example, that the capillary structures of the first heat pipes 600 and the second capillary structures 500 are connected by a sintering process to increase the fluid transfer speed between the capillary structures of the first heat pipes 600 and the second capillary structures 500, thereby improving the heat dissipation efficiency of the three-dimensional heat transfer device 10.

[0060] These second heat pipes 700 are respectively inserted through these second perforations 220, and these second heat pipes 700 are respectively separated from the first capillary structure 400. In addition, the second heat pipe 700 has, for example, a closed second heat pipe chamber 710, and the second heat pipe chamber 710 is not connected to the liquid-tight chamber S.

[0061] One end of these support structures 800 is connected to the first heat-conducting shell 100, and the other end of these support structures 800 is connected to the second heat-conducting shell 200, thereby improving the structural strength of the three-dimensional heat transfer device 10. In this embodiment, the support structure 800 and the heat-conducting bump 300 are integrally formed, for example by stamping, CNC milling, or other methods, but are not limited thereto. In other embodiments, the support structure and the heat-conducting bump can also be coupled to the first heat-conducting shell using joining techniques such as welding, diffusion bonding, thermal pressing, soldering, brazing, and adhesives.

[0062] In this embodiment, the thermally conductive bumps 300 are connected to at least a portion of the support structures 800, but are not limited thereto. In other embodiments, the thermally conductive bumps 300 may also be detached from the support structures 800.

[0063] In this embodiment, the number of thermally conductive bumps 300, second capillary structures 500, first heat pipes 600, and second heat pipes 700 is multiple, but not limited to this. In other embodiments, the number of thermal bumps, second capillary structures, first heat pipes, and second heat pipes may be changed to a single one.

[0064] In this embodiment, the three-dimensional heat transfer device 10 is provided with both a first heat pipe 600 and a second heat pipe 700, but this is not a limitation. In other embodiments, the three-dimensional heat transfer device may only provide a first heat pipe.

[0065] In this embodiment, the first heat pipe 600 abuts against the second capillary structure 500 stacked on the first surface of the heat-conducting bump 300, rather than the first capillary structure 400 stacked on the second convex structure 140 of the first heat-conducting shell 100. This eliminates the need for a clearance structure in the heat-conducting bump 300 for the first heat pipe 600 to pass through, thus allowing for a further increase in the volume of the heat-conducting bump 300 and consequently, an increase in the area of ​​the second capillary structure 500. Furthermore, it shortens the return water distance of the heat pipe 600 from L2 to L1, thereby increasing the heat dissipation efficiency of the three-dimensional heat transfer device 10.

[0066] According to the three-dimensional heat transfer device of the above embodiment, by designing the first heat pipe to abut against the second capillary structure stacked on the heat-conducting protrusion, on the one hand, it can avoid opening a clearance structure on the heat-conducting protrusion for the first heat pipe to pass through, and on the other hand, it can shorten the return water distance of the heat pipe, thereby increasing the heat dissipation efficiency of the three-dimensional heat transfer device.

[0067] Furthermore, in some embodiments, compared to simply relying on the heat pipe capillary structure and the second capillary structure, the heat pipe capillary structure and the second capillary structure with metal bonding can increase the speed at which fluid is transferred from the capillary structure of the heat pipe to the second capillary structure, thereby further improving the heat dissipation efficiency of the three-dimensional heat transfer device.

Claims

1. A three-dimensional heat transfer device, characterized in that, The three-dimensional heat transfer device includes: First heat-conducting shell; A second heat-conducting shell has at least one first perforation, and the second heat-conducting shell is installed on the first heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber; At least one thermally conductive bump protrudes from the first thermally conductive shell; At least one first capillary structure is stacked on the first heat-conducting shell; At least one second capillary structure is stacked on the at least one thermally conductive bump and thermally coupled to the at least one first capillary structure; and At least one first heat pipe is inserted through the at least one first perforation and abuts against the at least one second capillary structure; The first heat-conducting shell includes a base plate, a first convex structure and a second convex structure. The first convex structure protrudes from the base plate in a direction away from the second heat-conducting shell, and the second convex structure protrudes from the first convex structure in a direction away from the second heat-conducting shell. At least one heat-conducting bump protrudes from the inner surface of the second convex structure, and at least one first capillary structure is stacked on the inner surface of the base plate, the inner surface of the first convex structure and the inner surface of the second convex structure. The thermally conductive bump has a first surface and a second surface. The first surface faces away from the outer surface of the second convex structure, and the second surface connects the first surface and the inner surface of the second convex structure. At least one second capillary structure is stacked on the first surface of the at least one thermally conductive bump. At least one first heat pipe abuts against the second capillary structure stacked on the first surface of the thermally conductive bump. The first heat pipe is separated from the first capillary structure stacked on the inner surface of the second convex structure. At the same time, the second capillary structure is disposed on the first surface of the thermally conductive bump so that the second capillary structure is closer to the second thermally conductive shell than the first capillary structure located on the second convex structure, so that the thickness of the second capillary structure is reduced by raising the second capillary structure through the thermally conductive bump.

2. The three-dimensional heat transfer device as described in claim 1, characterized in that, The first heat-conducting shell also includes an annular side plate connected to the periphery of the base plate, and the at least one first capillary structure is also stacked on the inner surface of the annular side plate.

3. The three-dimensional heat transfer device as described in claim 2, characterized in that, It further includes at least one third capillary structure, which is stacked on the second surface of the at least one thermally conductive bump and connects the at least one first capillary structure and the at least one second capillary structure.

4. The three-dimensional heat transfer device as described in claim 2, characterized in that, The at least one second capillary structure has a top surface facing away from the second convex structure. The top surface maintains a first distance from the inner surface of the second convex structure. A vapor channel is formed between the inner surface of the second convex structure and the second heat-conducting shell. The inner surface of the second convex structure maintains a second distance from the second heat-conducting shell. The ratio of the first distance to the second distance is between 60% and 65% and 35% and 40%, respectively.

5. The three-dimensional heat transfer device as described in claim 1, characterized in that, It further includes multiple support structures, one end of which is connected to the first heat-conducting shell and the other end of which is connected to the second heat-conducting shell.

6. The three-dimensional heat transfer device as described in claim 5, characterized in that, At least one thermally conductive bump is connected to at least a portion of the support structure.

7. The three-dimensional heat transfer device as described in claim 1, characterized in that, The number of at least one thermally conductive bump is multiple, and these thermally conductive bumps are parallel to each other.

8. The three-dimensional heat transfer device as described in claim 1, characterized in that, At least one thermally conductive bump is separated from the second thermally conductive shell.

9. The three-dimensional heat transfer device as described in claim 1, characterized in that, It further includes at least one second heat pipe, the second heat-conducting shell having at least one second perforation, the at least one second heat pipe being installed in the at least one second perforation, and the at least one second heat pipe being separate from the first heat-conducting shell.

10. The three-dimensional heat transfer device as described in claim 9, characterized in that, The first heat pipe has a first heat pipe chamber, which is connected to the liquid-tight chamber.

11. The three-dimensional heat transfer device as described in claim 10, characterized in that, The second heat pipe has a second heat pipe chamber that is not connected to the liquid-tight chamber.

12. The three-dimensional heat transfer device as described in claim 1, characterized in that, The at least one first capillary structure and the at least one second capillary structure are selected from the group consisting of metal mesh, powder sintered body and ceramic sintered body.

13. The three-dimensional heat transfer device as described in claim 1, characterized in that, The capillary structure of the first heat pipe is connected to the at least one second capillary structure.

14. The three-dimensional heat transfer device as described in claim 1, characterized in that, The capillary structure of the first heat pipe is connected to the at least one second capillary structure by metallic bonding.

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