A ceramic repair process

By painting dark hole conductors and dark hole lines on the outer wall of the ceramic and injecting tin to connect the ceramic fragments and body, the problem of secondary damage in the existing ceramic repair process is solved, and the process flow is simplified and the repair is improved. rate effect.

CN116655398BActive Publication Date: 2025-02-18李伟
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202310665136.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-06
Publication Date
2025-02-18
Estimated Expiration
2043-06-06

Smart Images

  • Figure CN116655398B_ABST
    Figure CN116655398B_ABST
Patent Text Reader

Abstract

The invention relates to a ceramic repair process, belonging to the field of ceramic processing, comprising drawing blind hole wires on the outer side wall of the ceramic fragment and the outer side wall of the ceramic body; drawing a first blind hole line and a second blind hole line respectively along the blind hole wires at the cross sections of the ceramic fragment and the ceramic body; drilling a first blind hole at the first blind hole line, and drilling a second blind hole at the second blind hole line; injecting molten tin into the first blind hole and the second blind hole, placing the ceramic fragment again on the notch of the ceramic body so that the cross section of the ceramic fragment fits the cross section of the ceramic body; opening a first groove on the outer side wall of the ceramic fragment, and opening a second groove on the outer side wall of the ceramic body, the first groove being connected to the first blind hole, the second groove being connected to the second blind hole, and injecting molten tin into the first groove and the second groove.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of ceramic processing, and more particularly to a ceramic repairing process. Background Art

[0002] Ceramics are hard and wear-resistant and can be used for a long time. However, the fatal weakness of ceramics is that they are fragile. Whenever a piece of ceramic is broken, its use value drops significantly. With the development of modern chemical technology, various methods of ceramic repair have emerged. Among them, the traditional craft of repairing ceramics with rivets is very popular among the people because the repaired ceramics are more beautiful, such as the patent application number 202110357828.2. However, the process of repairing ceramics with rivets is more complicated, and when the rivets are hammered into the ceramics, it is easy to cause the ceramics to crack or the hammer is directly hit on the ceramics, causing damage to the ceramics. Summary of the invention

[0003] The technical problem to be solved by the present invention is to prevent secondary damage caused when repairing ceramics. In view of the above-mentioned defects of the prior art, a ceramic repair process is provided.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] A ceramic repair process is constructed, the ceramic repair process comprising the following steps:

[0006] S1, placing the ceramic fragments at the notch of the ceramic body so that the cross section of the ceramic fragments fits the cross section of the ceramic body;

[0007] S2. Draw a first blind hole wire and a second blind hole wire on the outer wall of the ceramic fragment and the outer wall of the ceramic body respectively, the first blind hole wire is in contact with the cross-section of the ceramic fragment, the second blind hole wire is in contact with the cross-section of the ceramic body, and one or more first blind hole wires and second blind hole wires are provided.

[0008] S3, separating the ceramic fragments from the ceramic body;

[0009] S4, drawing a first dark hole line and a second dark hole line along the dark hole wire at the cross section of the ceramic fragment and the ceramic body respectively;

[0010] S5, drilling a first hidden hole at the first hidden hole line, and drilling a second hidden hole at the second hidden hole line;

[0011] S6, injecting molten tin into the first blind hole and the second blind hole;

[0012] S7. A first groove is opened on the outer wall of the ceramic fragment, and a second groove is opened on the outer wall of the ceramic body, the first groove is connected with the first dark hole, and the second groove is connected with the second dark hole, and molten tin is injected into the first groove and the second groove, and the tin at the openings of the first groove and the second groove is polished after the tin cools down.

[0013] Preferably, a plurality of the first blind hole conductors and the second blind hole conductors are provided according to the lengths of the ceramic fragments and the ceramic body, and one or more rows of the first blind holes and the second blind holes are provided according to the widths of the cross sections of the ceramic fragments and the ceramic body.

[0014] Preferably, before step S1, clean water may be applied to the cross-sections of the ceramic fragments and the ceramic body.

[0015] Preferably, after the tin cools down, the tin at the openings of the first groove and the second groove is directly polished with a polishing rod, or the tin at the openings of the first groove and the second groove is polished with sandpaper dipped in clean water and / or alcohol.

[0016] Preferably, the angle between the hidden hole and the cross section of the ceramic fragments and the ceramic body is 80-100°.

[0017] Preferably, the first groove is communicated with the cross section of the ceramic fragment, and the second groove is communicated with the cross section of the ceramic body.

[0018] The beneficial effects of the present invention are as follows: the present invention draws the first blind hole wire and the second blind hole wire on the outer wall of the ceramic fragment and the ceramic body respectively, then draws the first blind hole line and the second blind hole line at the cross section of the ceramic fragment and the ceramic body through the first blind hole wire and the second blind hole wire, determines the number of the first blind holes on the first blind hole line and the number of the second blind holes on the second blind hole line according to the thickness of the ceramic fragment and the ceramic body, injects tin into the first blind holes and the second blind holes, and after the tin is cooled, opens a first groove on the outer wall of the ceramic fragment, the first groove is connected with the first blind hole and the cross section of the ceramic fragment, and opens a second groove on the outer wall of the ceramic body The first groove is connected with the second dark hole and the cross-section of the ceramic body, and the ceramic fragments are placed at the notch of the ceramic body. At this time, the first dark hole is opposite to the second dark hole, and tin is injected into the first groove to make the tin in the first groove and the tin in the first dark hole fuse together. Tin is injected into the second groove, and the tin in the second groove fuses with the tin in the second inner hole, so as to connect the ceramic fragments to the ceramic body, and finally the tin at the openings of the first groove and the second groove is polished. The present invention does not need to embed rivets at the cross-section of the ceramic, simplifies the process of repairing ceramics, prevents damage to the ceramics when embedding rivets, and increases the success rate of ceramic repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work:

[0020] Figure 1 It is an axonometric schematic diagram of a ceramic repair process according to a preferred embodiment of the present invention.

[0021] Figure 2 It is a bottom view schematic diagram of a ceramic body of a ceramic repair process according to a preferred embodiment of the present invention.

[0022] Figure 3 It is a top view schematic diagram of ceramic fragments in a ceramic repair process according to a preferred embodiment of the present invention.

[0023] Figure 4 It is an overall side schematic diagram of a ceramic repair process according to a preferred embodiment of the present invention.

[0024] Figure 5 It is another side view schematic diagram of a ceramic repair process according to a preferred embodiment of the present invention.

[0025] Figure 6 It is another side schematic diagram of a ceramic repair process according to a preferred embodiment of the present invention.

[0026] The figures are marked as follows: 1. ceramic body; 2. ceramic fragments; 3. first blind hole wire; 4. second blind hole wire; 5. first blind hole line; 6. second blind hole line; 7. first blind hole; 8. second blind hole; 9. first groove; 10. second groove. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0029] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0031] Example 1: Figure 1-Figure 6As shown, the ceramic repair process includes the following steps: applying clean water to the cross-section of the ceramic body 1 and the ceramic fragment 2 respectively to play a lubricating role, placing the ceramic fragment 2 at the notch of the ceramic body 1 so that the cross-section of the ceramic fragment 2 fits the cross-section of the ceramic body 1, and then drawing the first hidden hole wire 3 and the second hidden hole wire 4 on the outer wall of the ceramic fragment 2 and the outer wall of the ceramic body 1 respectively, the first hidden hole wire 3 contacts the cross-section of the ceramic fragment 2, the second hidden hole wire 4 contacts the cross-section of the ceramic body 1, and the angle between the first hidden hole wire 3 and the cross-section of the ceramic fragment 2 is 90°, and the angle between the second blind hole wire 4 and the cross section of the ceramic body 1 is 90°, the ceramic fragment 2 is separated from the ceramic body 1, and the first blind hole line 5 is drawn at the cross section of the ceramic fragment 2 according to the first blind hole wire 3, and the second blind hole line 6 is drawn according to the second blind hole wire 4 and the cross section of the ceramic body 1, and then one or more first blind holes 7 are drilled on the first blind hole line 5 according to the thickness of the ceramic fragment 2. In this embodiment, there are two first blind holes 5, and the angle between the first blind hole 7 and the cross section of the ceramic fragment 2 is 80-100°. One or more first blind holes 7 are drilled on the second blind hole line 6 according to the thickness of the ceramic body 1. Second dark hole 8, in this embodiment, there are two second dark holes 8, the angle between the second dark hole 8 and the cross section of the ceramic body 1 is 80-100°, and molten tin is injected into the first dark hole 7 and the second dark hole 8 by a soldering iron, and a first groove 9 and a second groove 10 are respectively opened on the outer wall of the ceramic fragment 2 and the outer wall of the ceramic body 1, the bottom of the first groove 9 is connected to the first dark hole 7, one side of the first groove 9 is connected to the cross section of the ceramic fragment 2, and one side of the second groove 10 is connected to the cross section of the ceramic body 1, and then the ceramic fragment 2 is placed on the notch of the ceramic body 1 again so that the The cross-section of the ceramic fragment 2 fits with the cross-section of the ceramic body 1. At this time, the first dark hole 7 is opposite to the second dark hole 8, and molten tin is injected into the first groove 9 and the second groove 10. When the molten tin is injected into the first groove 9 and the second groove 10, the tin in the first dark hole 7 is melted with the tin in the first groove 9, and the tin in the second dark hole 8 is melted with the tin in the second groove 10. After the tin cools down, the tin at the opening of the first groove 9 and the second groove 10 is polished with sandpaper dipped in clean water and / or alcohol. Furthermore, in this embodiment, the ceramic fragment 2 is the base of the teapot, and the ceramic body 1 is the teapot body.

[0032] Example 2: Figure 1-Figure 6As shown, the ceramic repair process includes the following steps: applying clean water to the cross-section of the ceramic body 1 and the ceramic fragment 2 respectively to play a lubricating role, placing the ceramic fragment 2 at the notch of the ceramic body 1 so that the cross-section of the ceramic fragment 2 fits the cross-section of the ceramic body 1, and then drawing the first hidden hole wire 3 and the second hidden hole wire 4 on the outer wall of the ceramic fragment 2 and the outer wall of the ceramic body 1 respectively, the first hidden hole wire 3 contacts the cross-section of the ceramic fragment 2, and the second hidden hole wire 4 contacts the cross-section of the ceramic body 1, and the ceramic fragment 2 is separated from the ceramic body 1. According to the first blind hole wire 3, a first blind hole line 5 is drawn at the cross section of the ceramic fragment 2, and according to the second blind hole wire 4 and the cross section of the ceramic body 1, a second blind hole line 6 is drawn, and then one or more first blind holes 7 are drilled on the first blind hole line 5 according to the thickness of the ceramic fragment 2. In this embodiment, two first blind holes 7 are drilled, and the angle between the first blind hole 7 and the cross section of the ceramic fragment 2 is 90°. According to the thickness of the ceramic body 1, one or more second blind holes 8 are drilled on the second blind hole line 6. In this embodiment, two second blind holes 8 are drilled, and the angle between the second blind hole 8 and the cross section of the ceramic body 1 is 90°. The angle is 90°, and a molten tin-silver alloy is injected into the first dark hole 7 and the second dark hole 8 by a soldering iron, and a first groove 9 and a second groove 10 are respectively opened on the outer wall of the ceramic fragment 2 and the outer wall of the ceramic body 1. The bottom of the first groove 9 is connected to the first dark hole 7, and one side of the first groove 9 is connected to the cross section of the ceramic fragment 2, and one side of the second groove 10 is connected to the cross section of the ceramic body 1. Then, the ceramic fragment 2 is placed on the body of the ceramic notch again so that the cross section of the ceramic fragment 2 fits the cross section of the ceramic body 1. At this time, the first dark hole 7 Facing the second dark hole 8, molten tin-silver alloy is injected into the first groove 9 and the second groove 10. When the molten tin-silver alloy is injected into the first groove 9 and the second groove 10, the tin-silver alloy in the first dark hole 7 is melted with the tin-silver alloy in the first groove 9, and the tin-silver alloy in the second dark hole 8 is melted with the tin-silver alloy in the second groove 10. After the tin-silver alloy is cooled, the tin-silver alloy at the opening of the first groove 9 and the second groove 10 is polished with sandpaper dipped in clean water and / or alcohol. Furthermore, in this embodiment, the ceramic fragments 2 are the base of the teapot, and the ceramic body 1 is the teapot body.

[0033] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. A ceramic repair process, characterized in that: The ceramic repair process comprises the following steps: S1, placing the ceramic fragment (2) at the notch of the ceramic body (1) so that the cross section of the ceramic fragment (2) fits the cross section of the ceramic body (1); S2, drawing a first blind hole wire (3) and a second blind hole wire (4) on the outer wall of the ceramic fragment (2) and the outer wall of the ceramic body (1), respectively, the first blind hole wire (3) is in contact with the cross section of the ceramic fragment (2), the second blind hole wire (4) is in contact with the cross section of the ceramic body (1), and one or more of the first blind hole wire (3) and the second blind hole wire (4) are provided; S3, separating the ceramic fragments (2) from the ceramic body (1); S4, drawing a first dark hole line (5) and a second dark hole line (6) along the dark hole guide wire at the cross-section of the ceramic fragment (2) and the ceramic body (1); S5, drilling a first hidden hole (7) at the first hidden hole line (5), and drilling a second hidden hole (8) at the second hidden hole line (6); S6, injecting molten tin into the first blind hole (7) and the second blind hole (8); S7, a first groove (9) is formed on the outer wall of the ceramic fragment (2), and a second groove (10) is formed on the outer wall of the ceramic body (1), wherein the first groove (9) is connected to the first blind hole (7), and the second groove (10) is connected to the second blind hole (8), molten tin is injected into the first groove (9) and the second groove (10), and the tin at the openings of the first groove (9) and the second groove (10) is polished after the tin cools down; After the tin cools down, the tin at the opening of the first groove (9) and the second groove (10) is directly polished with a polishing rod, or the tin at the opening of the first groove (9) and the second groove (10) is polished with sandpaper dipped in clean water and / or alcohol; The first groove (9) is connected to the cross section of the ceramic fragment (2), and the second groove (10) is connected to the cross section of the ceramic body (1); The angle between the blind hole and the cross section of the ceramic fragment (2) and the ceramic body (1) is 80-100°.

2. A ceramic repair process according to claim 1, characterized in that: A plurality of the first blind hole conductors (3) and the second blind hole conductors (4) are provided according to the lengths of the ceramic fragments (2) and the ceramic body (1), and one or more rows of the first blind holes (7) and the second blind holes (8) are provided according to the widths of the cross sections of the ceramic fragments (2) and the ceramic body (1).

3. A ceramic repair process according to claim 1, characterized in that: Before step S1, clean water may be applied to the cross-sections of the ceramic fragments (2) and the ceramic body (1).

Citation Information

Patent Citations

  • Method for mending chinaware by using jade

    CN112898039A

  • Porcelain splicing repair technology

    CN108658625A

  • Method for repairing pottery product

    CN109867531A