Thermal management device

Abstract

A thermal management device includes a control component, a compression component, and a thermal management component. The control component is electrically connected to the compression component and to the thermal management component. The control component includes a cooling component and multiple heating elements. The control component has a mounting cavity, with the cooling component at least partially located in the mounting cavity, and the heating elements located in the mounting cavity. The heating elements are thermally connected to the cooling component. In this application, the control component is electrically connected to both the compression component and the thermal management component. The cooling component is at least partially located in the mounting cavity of the control component, and the heating elements are thermally connected to the cooling component. The cooling component dissipates heat from the heating elements, achieving a heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, and more particularly to a thermal management device. Background Technology

[0002] The vehicle thermal management system includes a compressor with integrated electronic control components and a thermal management device integrating components such as an expansion valve and a water pump. The electronic control components of the thermal management device generate relatively little heat and can meet cooling requirements through natural heat dissipation. The electronic control components of the compressor contain several heat-generating elements, and overheating of these elements can lead to their damage and failure. Therefore, the compressor is equipped with cooling channels for cooling. In related technologies, the electronic control components of the compressor and the thermal management device are integrated together. The integrated control component has a significant heat generation problem and requires heat dissipation. Summary of the Invention

[0003] In view of the above-mentioned problems existing in the related technologies, this application provides a thermal management device with heat dissipation effect.

[0004] To achieve the above objectives, this application adopts the following technical solution: a thermal management device, comprising a control component, a compression component, and a thermal management component, wherein the control component is electrically connected to the compression component and the thermal management component; the control component includes a cooling component and a plurality of heating elements, the control component has a mounting cavity, the cooling component is at least partially located in the mounting cavity, the heating elements are located in the mounting cavity, and the heating elements are thermally conductively connected to the cooling component.

[0005] In this application, the control component is electrically connected to both the compression component and the thermal management component. The cooling component is located at least partially in the mounting cavity of the control component. The heating element is thermally connected to the cooling component, and the cooling component is used to dissipate heat from the heating element to achieve a heat dissipation effect. Attached Figure Description

[0006] Figure 1 This is a perspective view of an embodiment of the thermal management device of this application;

[0007] Figure 2 This is an exploded view of an embodiment of the thermal management device of this application;

[0008] Figure 3 This is a further exploded view of an embodiment of the thermal management device of this application;

[0009] Figure 4 This is an exploded schematic diagram of the assembly structure of the cooling components and heating elements of this application;

[0010] Figure 5 This is an exploded schematic diagram of the assembly structure of the cooling components and heating elements of this application;

[0011] Figure 6 This is a cross-sectional schematic diagram of an embodiment of the thermal management device of this application;

[0012] Figure 7 yes Figure 6 A partially enlarged schematic diagram of part A is shown;

[0013] Figure 8 This is an exploded view of another embodiment of the control component of this application;

[0014] Figure 9 yes Figure 8 A cross-sectional schematic diagram of the control components is shown;

[0015] Figure 10 yes Figure 9 A partially enlarged schematic diagram of B is shown;

[0016] Figure 11 This is a perspective view of another embodiment of the thermal management device of this application;

[0017] Figure 12 This is a schematic diagram of the electrical control connection of the thermal management device of this application. Detailed Implementation

[0018] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0019] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0020] It should be understood that the terms "first," "second," and similar terms used in this application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one; "multiple" indicates two or more. Unless otherwise stated, terms such as "front," "rear," "lower," and / or "upper" are for illustrative purposes only and are not limited to a location or spatial orientation. Terms such as "comprising" or "including" indicate that the elements or objects preceding "comprising" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects.

[0021] The thermal management device of an exemplary embodiment of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can complement or combine with each other.

[0022] The vehicle thermal management system is primarily used to manage cooling and heating to meet the overall cooling and heating needs of the vehicle, such as the cooling / heating requirements of the cabin, the cooling requirements of the motor, and the heating / cooling requirements of the battery. A portion of the cooling / heating is supplied through methods such as operating the refrigerant circulation loop, starting the heater, and utilizing the cooling capacity carried by the coolant itself; another portion of the heating is obtained by recovering cooling / heat from other parts of the vehicle. Integrating a portion of the components within the vehicle thermal management system creates a thermal management device. It is understood that the components and their positions within the thermal management device can be adjusted according to actual needs without affecting the functionality of the component.

[0023] According to one possible embodiment of the thermal management device of this application, such as Figures 1 to 7 As shown, the thermal management device includes a control component 1, a compression component 2, and a thermal management component 3, with the control component 1 electrically connected to the compression component 2 and the thermal management component 3 respectively.

[0024] The thermal management assembly 3 includes a flow channel plate and multiple thermal management components (not shown in the figure). All thermal management components are mounted on the flow channel plate, which has multiple flow channels (not shown in the figure). At least some of the internal cavities of the thermal management components are connected through these flow channels. It is understood that the thermal management components can be components used to control the opening and closing of the flow channels, components used to control the flow rate changes between two flow channels, components used to provide power for fluid flow, components used to separate the gaseous and liquid states of the fluid, components used to switch the direction of fluid flow, components whose internal cavities are connected to the flow channels and used to achieve heat exchange, and components whose internal cavities are not connected to the flow channels but are mounted on the flow channel plate. The type of thermal management component can be selected according to the needs of the thermal management system; this application does not impose any restrictions.

[0025] In one possible embodiment, the flow channel plate includes a first flow channel plate 31 having a first channel and a second flow channel plate 32 having a second channel. The first flow channel plate 31 and the second flow channel plate 32 are mounted together. The first channel is used for refrigerant flow, and the second channel is used for coolant flow. The first channel and the second channel are isolated from each other and are not connected. The thermal management components include a first thermal management component mounted on the first flow channel plate 31 and a second thermal management component mounted on the second flow channel plate 32. At least a portion of the internal cavities of the first thermal management component are connected through the first channel, and at least a portion of the internal cavities of the second thermal management component are connected through the second channel. By using flow channel plates, the piping in the thermal management system can be reduced, flow resistance can be lowered, and the complexity of the thermal management system can be reduced.

[0026] It should be explained that the flow channels of the flow plate and the cavities for mounting thermal management components are not shown in the accompanying drawings of this application, and the thermal management components are not shown either. This is for the purpose of simplifying the drawings and should not be construed as meaning that the flow plate cannot have flow channels and cavities, or that the flow plate cannot mount thermal management components.

[0027] Reference Figures 1 to 3 The compression assembly 2 includes a housing 22, a compression component 23, and a drive component 24, with the compression component 23 and drive component 24 located within the inner cavity of the housing 22. The drive component 24 receives control signals from an external source and drives the compression component 23 to move according to the control signals, thereby compressing the refrigerant. The compressed refrigerant is then discharged from the housing 22. Simultaneously, the drive component 24 can also send feedback signals to the outside to reflect its own operating status, thus protecting the compression assembly 2 and adjusting it to a better working condition.

[0028] The outer casing 22 is mounted together with the first flow channel plate 31, and the inner cavity of the compression component 23 communicates with the first channel. In some other embodiments, the outer casing 22 and the first flow channel plate 31 are an integral structure. In some other embodiments, the outer casing 22 and the first flow channel plate 31 are each formed independently, and the two are directly mounted together or mounted together through a bracket.

[0029] The control assembly 1 includes a housing and a circuit board 13. The housing includes a first shell 11 and a second shell 12, which are mounted together. The control assembly 1 has a mounting cavity 10 located between the first shell 11 and the second shell 12, and the circuit board 13 is located in the mounting cavity 10. The circuit board 13 is electrically connected to the drive component 24 and the thermal management component, respectively, for adjusting the operating states of the drive component 24 and the thermal management component.

[0030] In this application, neither the thermal management component 3 nor the compression component 2 includes an electrical control section, but only a mechanical section. The control component 1 is electrically connected to the thermal management component 3 and the compression component 2, and the control component 1 controls the operation of the thermal management component and the drive component 24. It is understood that the compression component includes the mechanical section of a compressor in the related art, and the control component includes the electrical control section of a compressor in the related art. The electrical control sections of the compressor and the thermal management component are integrated in the control component 1.

[0031] In one possible embodiment, refer to Figure 3 The compression assembly 2 includes a first connector 21, a portion of which is located in the mounting cavity 10. The first connector 21 includes a plurality of pins 211, one end of which is fixed to the housing 22 and electrically connected to the drive component 24, and the other end of which is fixed to the first housing 11 and electrically connected to the circuit board 13. Optionally, the pins 211 are made of metal.

[0032] The outer wall of the housing 22 is in contact with the outer wall of the control component 1. One part of the pin 211 is located inside the compression component 2, and the other part is located inside the control component 1. The pin 211 is not exposed to the air, which reduces the risk of leakage and the risk of damage to the pin 211.

[0033] The first housing 11 includes a first mounting hole 111, which corresponds one-to-one with a pin 211. A portion of each pin 211 is located within the cavity of the first mounting hole 111, and the pin 211 is sealed to the wall of the first mounting hole 111. The circuit board 13 includes a second mounting hole 131, with a portion of each pin 211 located within the cavity of the second mounting hole 131. The pin 211 is fixedly connected to the circuit board 13, and the pin 211 is electrically connected to the circuit of the circuit board 13. Optionally, the first housing 11 may have a fixing structure to ensure the stability of the pin 211 within the mounting cavity 10.

[0034] In another possible embodiment, refer to Figure 11 The compression component 2 includes a second connector 25, and the control component 1 includes a third connector 17. The second connector 25 and the third connector 17 cooperate with each other and are electrically connected. The second connector 25 is fixedly connected to the housing 22 or is an integral structure with the housing 22, and is electrically connected to the drive component 24. The third connector 17 is fixedly connected to the first housing 11 or is an integral structure with the first housing 11, and is electrically connected to the circuit board 13. Optionally, the second connector 25 and the third connector 17 have a concave-convex mating structure. Specifically, one of the second connector 25 and the third connector 17 has a mounting groove, and the other has a portion located in the mounting groove.

[0035] Reference Figure 12 The control component 1 includes a compression control module and a thermal management control module. The compression control module is electrically connected to the drive component 24. The compressor control module sends control signals to the compression component 24 to adjust the working state of the drive component 24. The thermal management control module is electrically connected to the thermal management component. The thermal management control module sends signals to the thermal management component to adjust the working state of the thermal management component.

[0036] Both the compression control module and the thermal management control module are located between the first housing 11 and the second housing 12. Optionally, the compression control module and the thermal management control module are located on the same circuit board 13.

[0037] In some embodiments, the thermal management device includes a heating device for heating a fluid, the fluid being at least one of a coolant, a refrigerant, and air. The control component 1 includes a heating control module electrically connected to the heating device, which sends control signals to the heating device to adjust its operating state. Optionally, the heating device is mounted on a flow channel plate.

[0038] The heating control module is located between the first housing 11 and the second housing 12. Optionally, the heating control module, the compression control module, and the thermal management control module are located on the same circuit board 13.

[0039] The adjustment of the working state includes at least one of the following: opening component, closing component, speed adjustment, opening degree adjustment, and power adjustment.

[0040] The control component 1 includes a cooling component 15 and multiple heating elements 14. The cooling component 15 is at least partially located in the mounting cavity 10, and the heating elements 14 are located in the mounting cavity 10. The heating elements 14 are thermally connected to the cooling component 15 and electrically connected to the circuit board 13. It should be understood that the heating element 14 refers to an electronic component that generates a large amount of heat during use, or it can be an electronic component that requires cooling. Optionally, the multiple heating elements 14 include at least one of the following: insulated-gate bipolar transistors, discharge resistors, film capacitors, and common-mode inductors. It should be understood that the thermally conductive connection between the heating element 14 and the cooling component 15 means that heat exchange can occur between them. They can be directly attached to each other, or they can be separated by other components, as long as heat exchange can be achieved.

[0041] Each heating element 14 includes a body and a connecting part. The connecting part is fixed to and electrically connected to the circuit board 14, and the connecting part is fixed to the body and electrically connected to the circuitry within the body. The body is fixed to or thermally connected to the cooling component 15. Multiple heating elements 14 are arranged along the length of the cooling component 15, allowing for sufficient heat conduction between the body of each heating element 14 and the cooling component 15, achieving a better cooling effect. It can be understood that when the heating element 14 is a plug-in structure, the connecting part is a pin; when the heating element 14 is a surface-mount structure, the connecting part is an electrode.

[0042] The main body and the cooling component 15 are fixedly connected by screws, tooling fixtures, or adhesive.

[0043] The heat-generating elements 14 that generate significant heat are grouped together, and the bodies of the heat-generating elements 14 are mounted on the cooling component 15 for centralized cooling. This improves upon the problem in the prior art where multiple heat-generating elements 14 are scattered, resulting in a complex cooling structure and poor heat dissipation. In some cases, the bodies of the heat-generating elements 14 are positioned at a certain distance from the circuit board 13, which can also protect other electronic components on the circuit board 13.

[0044] In this embodiment, the body of the heating element 14 is located between the circuit board 13 and the cooling component 15, which can make full use of the space of the mounting cavity 10 and facilitate the miniaturization of the control component 1. In other embodiments, the positional relationship between the three can be arranged according to the requirements, which is not limited in this application.

[0045] The cooling component 15 has a cooling chamber 20. The cooling component 15 includes an inlet 153 and an outlet 154. The inner cavities of the inlet 153 and the outlet 154 are respectively connected to the cooling chamber 20. The inner cavities of the inlet 153 and the outlet 154 are respectively connected to the external space of the control component 1. Parts of the inlet 153 and the outlet 154 extend out of the control component 1, facilitating connection and communication with other components. Coolant flows through the cooling chamber 20. The coolant enters the cooling chamber 20 from the inner cavity of the inlet 153, exchanges heat with the heating element 14 during its flow, and cools the heating element 14. Then, it flows out from the inner cavity of the outlet 154. Optionally, the cooling chamber 20 is connected to a second channel, using coolant to cool the heating element 14. The heat carried away by the coolant can be recovered and reused, improving the energy efficiency of the thermal management system.

[0046] In this embodiment, refer to Figures 4 to 7 The inlet 153 and outlet 154 are located on the same side of the length of the cooling component 15. The coolant flows through two channels, roughly in a U-shape, which can extend the flow path length and improve the heat exchange effect. Specifically, the cooling component 15 includes a partition 156, and the cooling chamber 20 includes a first chamber 30 and a second chamber 40. The partition 156 is located between the first chamber 30 and the second chamber 40. The inner cavity of the inlet 153 communicates with the first chamber 30, and the inner cavity of the outlet 154 communicates with the second chamber 40. One end of the partition 156 along its length is sealed to the inner wall of the cooling component 15, thus isolating the inlet 153 and the outlet 154 from each other. The other end of the partition 156 along its length is spaced a certain distance from the inner wall of the cooling component 15, allowing the first chamber 30 and the second chamber 40 to communicate.

[0047] In some other embodiments, the opposite ends of the partition 156 along its length are respectively sealed to the inner wall of the cooling component 15, and the partition 156 is provided with an opening or notch so that the first cavity 30 and the second cavity 40 are in communication.

[0048] Reference Figure 5 and 7 The cooling component 15 includes fins 157, which are located in the cooling chamber 20. The fins 157 are used to disrupt the flow direction of the coolant and increase the heat exchange area, thereby making the heat exchange between the coolant and the heating element 14 more complete and further improving the heat exchange effect.

[0049] The cooling component 15 has a guide surface 155, which is inclined relative to the partition 156 and faces the connection between the first cavity 30 and the second cavity 40. The guide surface 155 is located at the end of the first cavity 30 away from the inlet 153, or at the end of the second cavity 40 away from the outlet 154, for redistributing the flow of coolant and improving heat exchange efficiency. Optionally, the angle between the guide surface 155 and the length of the partition 156 is 30 degrees, making the flow of coolant smoother.

[0050] In some other embodiments, reference is made to Figure 8 and Figure 9 The inlet 153 and outlet 154 are located on opposite sides of the length of the cooling component 15, and the coolant flow path is a single flow.

[0051] In some other embodiments, the cooling component 15 may be provided with multiple baffles 156, so that the cooling chamber 20 is divided into multiple parts, and the coolant flow path is a continuous S-shape, thereby increasing the flow path of the coolant and improving the heat exchange effect.

[0052] In this embodiment, refer to Figure 4 and Figure 5 The cooling component 15 includes a cover portion 151 and a cavity portion 152, which are independently formed. The cover portion 151 and the cavity portion 152 are sealed together. The cooling cavity 20 is located between the cover portion 151 and the cavity portion 152. The inlet portion 153 and the outlet portion 154 are located in the cavity portion 152 and are sealed together with the first shell 11. The guide surface 155 is provided in the cavity portion 152. The cover portion 151 is made of a material with good thermal conductivity, such as metal.

[0053] In some embodiments, both the partition 156 and the fins 157 are fixedly connected to the cover portion 151. Optionally, the partition 156, the fins 157, and the cover portion 151 are an integral structure.

[0054] In some embodiments, both the partition 156 and the fin 157 are fixedly connected to the cavity portion 152. Optionally, the partition 156, the fin 157, and the cavity portion 152 are an integral structure.

[0055] In some other embodiments, the cooling component 15 is an integral structure, and the cooling component 15 is installed together with the first housing 11, with the inlet 153 and the outlet 154 respectively sealed to the first housing 11. Optionally, the cooling component 15 is manufactured using a casting or die-casting process.

[0056] In some other embodiments, reference is made to Figures 8 to 9 The cavity 152 and the first shell 11 are an integral structure, and the cover 151 is installed together with the cavity 152.

[0057] In this application, the cover portion 151 and the cavity portion 152 are installed together, and the cover portion 151 and the cavity portion 152 are sealed together. The two can be installed by means of brazing, gluing, snap-fitting or fasteners.

[0058] When the cover portion 151 and the cavity portion 152 are snapped together, refer to Figure 7 One of the cover portion 151 and the cavity portion 152 is provided with an elastic hook 159, and the other is provided with a limiting portion 158. When the cover portion 151 and the cavity portion 152 are installed together by fasteners, both the cover portion 151 and the cavity portion 152 are provided with mounting holes for accommodating the fasteners. Optionally, the fasteners are bolts, the wall of the mounting holes is provided with internal threads, and the bolts are provided with external threads, and the two cooperate to achieve installation.

[0059] To ensure better thermal conductivity between the heating element 14 and the cover portion 151, the control assembly 1 includes a thermally conductive pad 16. The thermally conductive pad 16 is disposed between the heating element 14 and the cover portion 151, which improves the thermal conductivity between the two parts and also ensures insulation between them, enhancing safety. The thermally conductive pad 16 is generally plate-shaped, with one side of its thickness direction adhering to the cover portion 151 and the other side adhering to the heating element 14. On a plane perpendicular to the thickness direction of the thermally conductive pad 16, the projection of the thermally conductive pad 16 coincides with the projection of the cover portion 151, ensuring sufficient contact between the thermally conductive pad 16 and the cover portion 151, resulting in better thermal conductivity and thus achieving a better cooling effect.

[0060] In this application, multiple heat-generating elements 14 are grouped together for heat dissipation, improving the problem of complex arrangement of cooling components 15 caused by the scattered distribution of heat-generating elements 14, and more effectively and conveniently dissipating heat from multiple heat-generating elements 14. It also protects other electronic components on the circuit board 13 and reduces the impact of high temperatures from the heat-generating elements 14. Furthermore, the flow path of the coolant is optimized using partitions 156 and fins 157, and the uniformity of the coolant is optimized using guide surfaces 155, thereby improving the cooling effect. Optimizing the coolant flow path using partitions 156 and fins 157 allows for better cooling performance with relatively small cooling components 15, facilitating the miniaturization of the control assembly 1. By concentrating the control parts of multiple components in the thermal management system into the control assembly 1 and using connectors for electrical connection, the number of wiring harnesses in the thermal management system is reduced, installation complexity is lowered, and product reliability is improved.

[0061] It should be understood that the integral structure in this application refers to a component manufactured using a single piece of material through processes such as stamping, extrusion, and machining, without the use of brazing, gluing, or other joining processes. The methods of fixing and installing the components together in this application include, but are not limited to, at least one of brazing, gluing, or bracket fixing.

[0062] The above description is merely a preferred embodiment of this application and is not intended to limit this application in any way. Although this application has disclosed the preferred embodiment as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the content of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A thermal management device, characterized in that, It includes a control component, a compression component, and a thermal management component, wherein the control component is electrically connected to the compression component and the thermal management component; The control assembly includes a cooling component and a plurality of heating elements. The control assembly has a mounting cavity, in which the cooling component is at least partially located, and the heating elements are located in the mounting cavity. The heating elements are thermally connected to the cooling component. The control component integrates the electronic control portion of the compression component and the electronic control portion of the thermal management component. The control component includes a housing, and the electronic control portions of the compression component and the thermal management component are located within the same housing.

2. The thermal management device as described in claim 1, characterized in that, The cooling component has a cooling cavity, which includes an inlet and an outlet. The inner cavities of the inlet and the outlet are both connected to the cooling cavity, and the inner cavities of the inlet and the outlet are both connected to the external space of the control component.

3. The thermal management device as described in claim 2, characterized in that, The cooling component includes a partition, the inlet and the outlet are located on opposite sides of the partition in the thickness direction, and the inlet and the outlet are located on the same side of the cooling component. The cooling chamber includes a first chamber and a second chamber, with a partition located between the first chamber and the second chamber. The inner cavity of the inlet is connected to the first chamber, and the inner cavity of the outlet is connected to the second chamber. On the side away from the inlet and the outlet, the first chamber and the second chamber are connected.

4. The thermal management device as described in claim 3, characterized in that, The cooling component has a guide surface that is inclined relative to the partition and faces the connection between the first cavity and the second cavity. The guide surface is located at the end of the first cavity away from the inlet, or at the end of the second cavity away from the outlet.

5. The thermal management device as described in claim 3, characterized in that, The control assembly includes a first housing and a second housing, the first housing and the second housing are mounted together, and the mounting cavity is located between the first housing and the second housing; The cooling component includes a cover portion and a cavity portion, the cooling cavity being located between the cover portion and the cavity portion, the inlet portion and the outlet portion being located in the cavity portion, and the cover portion and the cavity portion being sealed together.

6. The thermal management device as described in claim 5, characterized in that, The cooling component is an integral structure, and it is installed together with the first shell. The inlet and the outlet are respectively sealed and connected to the first shell.

7. The thermal management device as described in claim 5, characterized in that, The cavity portion and the first shell are integrally formed, and the cover portion is installed together with the cavity portion; or... The first shell, the cover portion, and the cavity portion are each formed independently, and the first shell, the cover portion, and the cavity portion are installed together. The inlet portion and the outlet portion are respectively sealed and connected to the first shell.

8. The thermal management device as described in claim 5, characterized in that, The partition is integral with the cover or the cavity. The cooling component includes fins located in the cooling cavity. The fins are used to disturb the fluid flow direction and increase the heat exchange area. The fins are connected to the cover or the cavity.

9. The thermal management device as claimed in claim 2, characterized in that, The thermal management assembly includes a first flow channel plate having a first channel, a second flow channel plate having a second channel, a plurality of first thermal management components mounted on the first flow channel plate, and a plurality of second thermal management components mounted on the second flow channel plate. The cavities of the plurality of first thermal management components are connected to each other through the first channel, and the cavities of the plurality of second thermal management components are connected to each other through the second channel. The first flow channel plate and the second flow channel plate are mounted together. The first channel is used for the flow of refrigerant, and the second channel is used for the flow of coolant. The control component is installed together with the thermal management component, and the control component is electrically connected to both the first thermal management component and the second thermal management component. The cooling chamber is connected to the second channel. The compression assembly includes a compression component and a driving component. The driving component drives the compression component to compress the refrigerant. The compression assembly is connected to the thermal management component or the control component. The control component is electrically connected to the driving component. The inner cavity of the compression assembly is in communication with the first channel. The control component includes a compression control module and a thermal management control module. The compression control module is electrically connected to the drive component and is used to adjust the working state of the drive component. The thermal management control module is electrically connected to the thermal management component and is used to adjust the working state of the thermal management component. The control component and the compression component are separately disposed, and the control component and the thermal management component are separately disposed. The compression control module and the thermal management control module are located in the same housing.

10. The thermal management device as claimed in claim 1, characterized in that, The control component includes a circuit board located in the mounting cavity. Each heating element includes a body and a connecting portion. The connecting portion is fixed to and electrically connected to the circuit board and the connecting portion is fixed to and electrically connected to the body. A portion of the outer surface of the body is thermally connected to the cooling component. The plurality of heating elements include at least one of the following: insulated gate bipolar transistors, discharge resistors, thin film capacitors, and common mode inductors; The control component is separate from the compression component, and the control component is separate from the thermal management component.

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