A circuit board encapsulation device

Abstract

The present invention relates to a circuit board encapsulation device, and belongs to the technical field of circuit board encapsulation. The circuit board encapsulation device comprises a workbench, on which a circuit board front encapsulation mechanism and a circuit board back encapsulation mechanism are arranged, the circuit board front encapsulation mechanism comprises a pressing plate, a encapsulation box and a base arranged in sequence from top to bottom, a plurality of inwardly recessed bosses are arranged around the bottom of the encapsulation box, a first mounting hole for fixing the circuit board is arranged on the boss, elastic sealing support columns corresponding to the plurality of first mounting holes and used to support the encapsulation box and block the first mounting holes are arranged around the top of the base, second mounting holes corresponding to the plurality of first mounting holes are arranged around the circuit board, and a encapsulation opening is arranged in the middle of the pressing plate. Beneficial effects: the front and back sides of the circuit board can be quickly encapsulated, and the elastic sealing support columns can be used to ensure that the circuit board is evenly stressed during the front encapsulation process, and the gap between the bolts and the mounting holes can be blocked to prevent the leakage of sealant.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board encapsulation, and in particular relates to a circuit board encapsulation device. Background Art

[0002] As the main power of trackless auxiliary transport vehicles, explosion-proof diesel engines are widely used in large and medium-sized coal mines in China. At present, explosion-proof diesel engines use self-developed circuit boards to convert the circuits of electrical control systems into intrinsically safe and non-intrinsically safe ones. The working environment of coal mines is relatively humid and dusty, so it is necessary to use a double-sided sealing process for the circuit boards to achieve the purpose of reinforcement, moisture-proofing and sealing. At the beginning, the sealing process required two people to work together. Fixing, pouring glue, and drying were troublesome, time-consuming and labor-intensive, and the sealant spilled a lot. In order to reduce labor and improve efficiency, a circuit board sealing device was designed. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a circuit board sealing device, which can quickly seal the front and back sides of the circuit board. During the front side sealing process, the elastic sealing support column can ensure that the circuit board is evenly stressed and can block the gap between the bolts and the mounting holes to prevent sealant leakage.

[0004] The technical solution of the present invention for solving the above-mentioned technical problems is as follows: a circuit board encapsulation device comprises: a workbench, on the surface of which a circuit board front side encapsulation mechanism and a circuit board back side encapsulation mechanism are arranged, the circuit board front side encapsulation mechanism comprises a pressing plate, a encapsulation box and a base arranged in sequence from top to bottom, a encapsulation opening is arranged in the middle of the pressing plate, a plurality of inwardly recessed bosses are arranged around the bottom of the encapsulation box, a first mounting hole for fixing the circuit board is arranged on the boss, elastic sealing support columns corresponding to the plurality of first mounting holes and used for supporting the encapsulation box and blocking the first mounting holes are arranged around the top of the base, and second mounting holes corresponding to the plurality of first mounting holes are arranged around the circuit board.

[0005] Beneficial effects:

[0006] 1. It can quickly cast the front and back sides of the circuit board;

[0007] 2. During the front encapsulation process, the elastic sealing support column can ensure that the circuit board is evenly stressed;

[0008] 3. It can block the gap between the bolt and the mounting hole to prevent the sealant from leaking;

[0009] 4. Reduce manpower and improve work efficiency.

[0010] Preferably, the elastic sealing support column is a cylindrical rubber column, and the height of the rubber column protruding from the base is higher than the height of the boss.

[0011] Beneficial effect: There is a certain amount of expansion and contraction to ensure that when the pressure plate is locked with a spring lock, the eight rubber columns are stressed to support the circuit board casting box, and at the same time block the eight process holes between the circuit board and the casting box to prevent the sealant from flowing out of the holes when gluing from above.

[0012] Preferably, the pressing plate and the base are locked by a locking member.

[0013] Beneficial effect: It is convenient to fix the pressing plate on the base.

[0014] Preferably, the locking member comprises a lock hook arranged on the pressure plate and a spring lock body arranged on the base, and the spring lock body is in locking cooperation with the lock hook.

[0015] Beneficial effects: The lock hook is tightly connected to the spring lock body, with good fixing effect and easy assembly and disassembly.

[0016] Preferably, the circuit board back side encapsulation mechanism includes a glue pouring bracket, a support frame and a glue pouring funnel, the support frame for fixing the circuit board in a vertical state is provided vertically below the glue pouring bracket, the top of the glue pouring bracket is provided with a placement hole for placing the glue pouring funnel, and a glue pouring hole is provided on the back of the circuit board.

[0017] Beneficial effect: a glue pouring funnel is arranged on the glue pouring bracket, a support frame for fixing the circuit board in a vertical state is arranged below the glue pouring bracket, and glue is injected into the pouring hole of the circuit board through the glue pouring funnel to realize the pouring sealing of the back of the circuit board.

[0018] Preferably, the support frame comprises a support platform, a clamping body arranged at one end of the support platform and a limiting body at the other end, there are two clamping bodies, and the gap between the two clamping bodies is used to clamp the circuit board.

[0019] Beneficial effects: the two clamping bodies can effectively clamp the circuit board, and the limiting body can limit the lateral displacement of the circuit board.

[0020] Preferably, the cross sections of the clamping body and the limiting body are both L-shaped.

[0021] Beneficial effects: The structure is simple and easy to install on the support table.

[0022] Preferably, the exterior of the glue pouring funnel is sleeved on a limiting platform, and the width of the limiting platform is greater than the width of the placement hole.

[0023] Beneficial effect: It can prevent the glue pouring funnel from falling off the glue pouring bracket.

[0024] Preferably, multiple layers of partitions are arranged on the workbench in parallel and at intervals, and multiple groups of the circuit board front side encapsulation mechanisms and the circuit board back side encapsulation mechanisms are arranged on the partitions.

[0025] Beneficial effect: A plurality of circuit board front side sealing mechanisms and circuit board back side sealing mechanisms are arranged on the multi-layer partition board, which can simultaneously perform front and back side sealing of a plurality of circuit boards without affecting each other, thereby improving work efficiency.

[0026] Preferably, the bottom of the workbench is provided with moving wheels.

[0027] Beneficial effects: easy to move to a suitable working position, saving time and effort. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the position state of the circuit board front side encapsulation mechanism and the circuit board of the present invention;

[0030] Figure 3 It is a structural schematic diagram of the circuit board and the circuit board front side encapsulation mechanism after installation;

[0031] Figure 4 yes Figure 3 A front view of

[0032] Figure 5 yes Figure 3 A top view of

[0033] Figure 6 It is a schematic diagram of the structure of the base 22 of the present invention;

[0034] Figure 7 It is a structural schematic diagram of a pressing plate of the present invention;

[0035] Figure 8 It is a schematic diagram of the installation state of the circuit board and the encapsulation box of the present invention;

[0036] Fig. 9 This is a schematic diagram of the structure of the circuit board backside encapsulation mechanism of the present invention.

[0037] Fig.10 It is an exploded schematic diagram of the circuit board back side encapsulation mechanism of the present invention;

[0038] Fig.11 It is a schematic diagram of the structure of the circuit board of the present invention;

[0039] Fig.12 It is a structural schematic diagram of the support frame of the present invention.

[0040] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0041] 1. Workbench; 11. Partition; 12. Moving wheel; 2. Front side sealing mechanism of circuit board; 21. Sealing box; 211. Boss; 22. Base; 221. Spring lock body; 222. Elastic sealing support column; 23. Pressing plate; 231. Sealing port; 232. Lock hook; 3. Back side sealing mechanism of circuit board; 31. Glue pouring bracket; 311. Mounting hole; 32. Support frame; 321. Clamping body; 322. Limiting body; 33. Glue pouring funnel; 331. Limiting platform; 4. Circuit board; 41. Glue pouring hole. DETAILED DESCRIPTION

[0042] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0043] Example

[0044] like Figure 1-12 As shown, this embodiment provides a circuit board encapsulation device, including: a rectangular workbench 1, the workbench 1 includes a fixed frame, and four layers of partitions 11 are arranged on the fixed frame in parallel and at intervals, one layer of the partitions 11 is evenly arranged with a plurality of the circuit board front side encapsulation mechanisms 2 along the length direction, and another layer of the partitions 11 is evenly arranged with a plurality of the circuit board back side encapsulation mechanisms 3 along the length direction.

[0045] Preferably, the circuit board front casting mechanism 2 includes a pressing plate 23, a casting box 21 and a base 22 which are arranged in sequence from top to bottom, and eight inwardly recessed bosses 211 are arranged around the bottom of the casting box 21, three bosses 211 are arranged on the left and right of the casting box 21, and one boss 211 is symmetrically arranged in the middle position, and the boss 211 is provided with a first mounting hole for fixing the circuit board 4, and elastic sealing support columns 222 corresponding to the eight first mounting holes and used to support the casting box 21 and block the first mounting holes are arranged around the top of the base 22, and the elastic sealing support columns 222 are fastened to the base 22 by nuts, and second mounting holes corresponding to the eight first mounting holes are arranged around the circuit board 4, and the circuit board 4 and the casting box 21 are connected by bolts, and a casting opening 231 is provided in the middle of the pressing plate 23, and the casting opening 231 is a rectangular through-hole structure for facilitating the pouring of sealant.

[0046] Preferably, the pressure plate 23 and the base 22 are locked by a locking member, and the locking member includes a locking hook 232 arranged on the pressure plate 23 and a spring lock body 221 arranged on the base 22. The spring lock body 221 is locked with the locking hook 232, which is convenient for assembly and disassembly and has a good fixing effect.

[0047] Preferably, the elastic sealing support column 222 is a cylindrical rubber column with a certain amount of expansion and contraction, ensuring that when the pressure plate 23 is locked with a spring lock, the eight rubber columns are subjected to force to support the circuit board 4 and the casting box 21, and at the same time block the eight second mounting holes of the circuit board 4 and the eight first mounting holes of the casting box 21 to prevent the sealant from flowing out of the holes when gluing from above.

[0048] Preferably, the circuit board back side encapsulation mechanism 3 includes a glue pouring bracket 31, a support frame 32 and a glue pouring funnel 33. The glue pouring bracket 31 is placed on the workbench 1 and can move on the platform. The support frame 32 for fixing the circuit board 4 in a vertical state is provided vertically below the glue pouring bracket 31. The circuit board 4 is provided with two upward-facing glue pouring holes 41. The top of the glue pouring bracket 31 is provided with a placement hole 311 for placing the glue pouring funnel 33. The nozzle of the glue pouring funnel 33 is aligned with the glue pouring hole 41, so that the back side of the circuit board can be encapsulated.

[0049] Preferably, the support frame 32 includes a support platform and a first clamping body 321 arranged at one end of the support platform and a limiting body 322 at the other end. There are two first clamping bodies 321, and the gap between the two first clamping bodies 321 is used to clamp the circuit board 4. The cross-sections of the first clamping body 321 and the limiting body 322 are both L-shaped, ensuring that the circuit board 4 is always in a stable state during the back-side encapsulation process.

[0050] Preferably, the outer part of the glue pouring funnel 33 is sleeved on the limiting platform 331, and the width of the limiting platform 331 is greater than the width of the mounting hole 311, which plays a limiting role on the glue pouring funnel 33, and the position of the glue pouring funnel 33 can be changed at will by hand to facilitate alignment with the glue pouring hole 41.

[0051] Preferably, the bottom of the workbench 1 is provided with moving wheels 12 to facilitate the movement of the device, saving time and effort.

[0052] Working principle:

[0053] Positive sealing of circuit board: Figure 2As shown, the circuit board 4 is installed together with the casting box 21, and the casting box 21 has a boss 211 to prevent the circuit board 4 from falling out; the elastic sealing support column 222 is fastened to the base 22 with a nut; the spring lock body 221 is also installed on the base 22, and the mounting hole on the base 22 is a long hole, and the clamping force can be adjusted by the position of the lock body; the lock hook 232 is installed on the pressure plate 23; after the circuit board 4 and the casting box 21 are installed, they are first placed on the base 22, and the eight rubber columns correspond to the eight first mounting holes of the casting box, and the height of the rubber columns protruding from the upper surface of the base 22 is higher than the eight first mounting holes of the casting box 21 The boss 211 at the hole allows a gap of more than 2 mm between the bottom surface of the casting box 21 and the upper surface of the base 22, ensuring a certain amount of deformation space; the elastic sealing support column 222 is made of rubber and has a certain amount of expansion and contraction, ensuring that when the pressure plate 23 is locked with a spring lock, the eight rubber columns are stressed to support the casting box 21, and at the same time, the eight mounting holes of the circuit board 4 and the casting box 21 are blocked to prevent the sealant from flowing out of the holes when the glue is applied from above; the pressure plate 23 presses the mounting strips on the four sides of the circuit board 4, with a large contact area, and the spring lock is located in the middle of the four directions, so that the circuit board 4 can be evenly stressed.

[0054] Back side sealing of circuit board: Figure 6 As shown, the circuit board with the front side encapsulated is placed on the glue potting bracket 31, with the glue potting hole 41 facing upwards; the glue potting bracket 31 can be moved on the platform, and the glue potting funnel 33 is placed on the glue potting bracket 31, with the nozzle below the funnel aligned with the glue potting hole 41 of the circuit board, so that the back side of the circuit board 4 can be encapsulated.

[0055] In the description of the present invention, it is necessary to understand that the terms "center", "length", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "inside", "outside", "peripheral", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred system or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0056] In the description of the present invention, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board encapsulation device, characterized in that: include: A workbench (1), wherein a circuit board front side encapsulation mechanism (2) and a circuit board back side encapsulation mechanism (3) are provided on the workbench (1), wherein the circuit board front side encapsulation mechanism (2) comprises a pressing plate (23), an encapsulation box (21) and a base (22) which are arranged in sequence from top to bottom, wherein a encapsulation opening (231) is provided in the middle of the pressing plate (23), wherein a plurality of inwardly recessed bosses (211) are arranged around the bottom of the encapsulation box (21), wherein the bosses (211) are provided with first mounting holes for fixing a circuit board (4), wherein elastic sealing support columns (222) corresponding to the plurality of first mounting holes and used for supporting the encapsulation box (21) and blocking the first mounting holes are arranged around the top of the base (22), and wherein second mounting holes corresponding to the plurality of first mounting holes are arranged around the circuit board (4).

2. The circuit board encapsulation device according to claim 1, characterized in that: The elastic sealing support column (222) is a cylindrical rubber column, and the height of the rubber column protruding from the base (22) is higher than the height of the boss (211).

3. The circuit board encapsulation device according to claim 1, characterized in that: The pressing plate (23) and the base (22) are locked by a locking piece.

4. The circuit board encapsulation device according to claim 3, characterized in that: The locking member comprises a locking hook (232) arranged on the pressure plate (23) and a spring lock body (221) arranged on the base (22); the spring lock body (221) is locked and matched with the locking hook (232).

5. The circuit board encapsulation device according to claim 1, characterized in that: The circuit board back side encapsulation mechanism (3) comprises a glue pouring bracket (31), a support bracket (32) and a glue pouring funnel (33); the support bracket (32) for fixing the circuit board (4) in a vertical state is arranged vertically below the glue pouring bracket (31); a placement hole (311) for placing the glue pouring funnel (33) is arranged at the top of the glue pouring bracket (31); and a glue pouring hole (41) is arranged on the back side of the circuit board (4).

6. The circuit board encapsulation device according to claim 5, characterized in that: The support frame (32) comprises a support platform, a clamping body (321) arranged at one end of the support platform, and a limiting body (322) at the other end. There are two clamping bodies (321), and the gap between the two clamping bodies (321) is used to clamp the circuit board (4).

7. The circuit board encapsulation device according to claim 6, characterized in that: The cross sections of the clamping body (321) and the limiting body (322) are both L-shaped.

8. The circuit board encapsulation device according to claim 6, characterized in that: The glue pouring funnel (33) is externally sleeved with a limiting platform (331), and the width of the limiting platform (331) is greater than the width of the placement hole (311).

9. The circuit board encapsulation device according to any one of claims 1 to 8, characterized in that: Multiple layers of partitions (11) are arranged in parallel and at intervals on the workbench (1), and multiple groups of circuit board front side encapsulation mechanisms (2) and circuit board back side encapsulation mechanisms (3) are arranged on the multiple layers of partitions (11).

10. The circuit board encapsulation device according to any one of claims 1 to 8, characterized in that: The bottom of the workbench (1) is provided with moving wheels (12).

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