A method and system for repairing solder balls

Abstract

This invention relates to the field of surface mount technology (SMT) and discloses a method and system for repairing solder balls. The method first uses an artificial intelligence model to intelligently identify defects on the chip components. If defects are found, a 3D printing head is used to increase the volume of the solder ball to a preset value, or a laser is used to vaporize the solder ball to the preset value. Then, the laser melts and sintersects the solder ball into a qualified solder ball. The 3D printing head and the laser work together to perform corresponding repair operations on the solder balls at the solder joints. This method is simple, convenient, and improves production efficiency.

Description

Technical Field

[0001] This invention relates to the field of surface mount technology, and in particular to a method and system for repairing solder balls. Background Technology

[0002] Surface Mount Technology (SMT) is one of the most popular technologies and processes in the electronics assembly industry. It is a circuit assembly technology that mounts leadless or short-lead surface mount components (SMC / SMD, also known as chip components) onto the surface of a printed circuit board (PCB) or other substrates, and then assembles them by reflow soldering or dip soldering.

[0003] In existing technologies, surface mount technology (SMT) generally involves printing solder paste, mounting chip components, cleaning, and inspection. This process mounts the chip components onto a PCB board, establishing an electrical connection between the component and the PCB. However, in actual manufacturing processes, defects may exist in the solder joints of the chip components during processing, such as… Figure 1 As shown, the chip component 100 is prone to... Figure 1 The blank solder joint (missing) shown in A is... Figure 1 The problem of poor soldering (deformation) shown in Figure B occurs when the chip component 100 is soldered onto the PCB board 200, such as... Figure 2 As shown, some solder joints may fail to connect correctly with the solder paste 201 on the PCB board 200, resulting in the inability to transmit the corresponding signals. Summary of the Invention

[0004] The main objective of this invention is to solve the problem of repairing solder balls when defects such as cold solder joints or empty solder joints occur on chip components.

[0005] The first aspect of the present invention provides a method for repairing solder balls, the method comprising:

[0006] Acquire the original image of the chip component;

[0007] Acquire the original image of the chip component;

[0008] The original image is input into an artificial intelligence model for recognition to determine whether there are defects at each solder joint on the sheet component;

[0009] If the solder joint has a defect, the location of the solder joint is obtained, and the volume of the solder ball on the solder joint is estimated.

[0010] If the volume value is within a preset range, the welding ball is melted and sintered into a qualified welding ball using a laser.

[0011] If the volume value is less than the lower limit threshold of the preset range, the volume of the welding ball is increased to the preset value by the 3D printing head, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

[0012] If the volume value is greater than the upper limit threshold of the preset range, the volume of the solder ball is vaporized to the preset value using a laser, and then the solder ball is melted and sintered into a qualified solder ball using the laser.

[0013] Optionally, in one implementation, the preset value is any pre-set qualified solder ball volume value; or

[0014] The preset value is the average value of the qualified solder ball volume obtained by the artificial intelligence model during the identification process.

[0015] Optionally, in one implementation, the preset value is a value located within the preset range.

[0016] Optionally, in one implementation, the step of increasing the volume of the solder ball to a preset value using a 3D printing head if the volume value is less than a lower threshold, and then melting and sintering the solder ball into a qualified solder ball using a laser, includes:

[0017] If the volume value is less than the lower threshold;

[0018] First, the solder ball is melted and sintered at the solder joint using a laser to make its surface smooth;

[0019] The volume of the solder ball is then increased to a preset value using a 3D printing head;

[0020] The solder balls are then melted and sintered into qualified solder balls using the laser.

[0021] Optionally, in one implementation, the step of increasing the volume of the solder ball to a preset value using a 3D printing head if the volume value is less than a lower threshold, and then melting and sintering the solder ball into a qualified solder ball using a laser, includes:

[0022] If the volume value is less than the lower threshold;

[0023] First, the solder balls are completely vaporized using a laser;

[0024] Then, the volume of a new solder ball is printed at the solder joint using a 3D printing head to the preset value;

[0025] The new solder balls are then melted and sintered into qualified solder balls using the laser.

[0026] Optionally, in one implementation, the solder ball repair method further includes:

[0027] If the solder joint has a defect, then the location of the solder joint is obtained;

[0028] First, the solder balls on the solder joint are completely vaporized using a laser;

[0029] Then, the volume of a new solder ball is printed at the solder joint using a 3D printing head to the preset value;

[0030] The new solder balls are then melted and sintered into qualified solder balls using the laser.

[0031] Optionally, in one implementation, the solder piles printed by the 3D printing head are stacked in layers, with the cross-sectional area of ​​each layer decreasing from bottom to top.

[0032] Optionally, in one implementation, the solder material of the solder pile is tin powder or indium powder.

[0033] Optionally, in one implementation, the solder ball repair method further includes:

[0034] The artificial intelligence model processes the input original image using denoising, transformation, and smoothing operations to increase the weight of important features of the original image.

[0035] Optionally, in one implementation, before performing solder ball repair, the following steps are also included:

[0036] Using images of sheet-like components with information tags as training samples, a deep learning algorithm is used to train and build an artificial intelligence model.

[0037] The information markers include the condition of the solder joint, the height of the solder ball, and the volume of the solder ball.

[0038] A second aspect of the present invention provides a solder ball repair system, the solder ball repair system being used to implement any of the solder ball repair methods described above, the solder ball repair system comprising:

[0039] A camera module is used to acquire raw images of sheet-like components;

[0040] 3D printing head, used to print solder piles;

[0041] A laser, used to emit laser light;

[0042] The processing module is used to input the original image into an artificial intelligence model for recognition in order to determine whether there are defects in each solder joint on the sheet component;

[0043] If the solder joint has a defect, the location of the solder joint is obtained, and the volume of the solder ball on the solder joint is estimated.

[0044] If the volume value is within a preset range, the welding ball is melted and sintered into a qualified welding ball using a laser.

[0045] If the volume value is less than the lower threshold, the volume of the solder ball is increased to the preset value by the 3D printing head, and then the solder ball is melted and sintered into a qualified solder ball by the laser.

[0046] If the volume value is greater than the upper limit threshold, the volume of the welding ball is vaporized to the preset value by a laser, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

[0047] Optionally, in one implementation, the processing module further includes:

[0048] The original image is input into an artificial intelligence model for recognition to determine whether there are defects at each solder joint on the sheet component;

[0049] If the solder joint has a defect, then the location of the solder joint is obtained;

[0050] First, the solder balls on the solder joint are completely vaporized using a laser;

[0051] Then, the volume of a new solder ball is printed at the solder joint using a 3D printing head to the preset value;

[0052] The new solder balls are then melted and sintered into qualified solder balls using the laser.

[0053] In the technical solution provided by this invention, an artificial intelligence model is first used to intelligently identify whether there are defects on the sheet-like components. If defects are found, the volume of the solder ball is increased to a preset value using a 3D printing head or the volume of the solder ball is vaporized to the preset value using a laser. Then, the solder ball is melted and sintered into a qualified solder ball using a laser. By cooperating with the 3D printing head and the laser, the corresponding repair operation is performed on the solder ball at the solder joint. This method is simple, convenient, and improves production efficiency. Attached Figure Description

[0054] Figure 1 A schematic diagram illustrating defects such as cold solder joints and open solder joints in chip components;

[0055] Figure 2 This diagram illustrates the connection between a chip component and a PCB board when the solder joints have defects such as cold solder joints and open solder joints.

[0056] Figure 3 This is a schematic diagram illustrating the process principle of a solder ball repair method according to Embodiment 1 of the present invention;

[0057] Figure 4 This is a schematic diagram of an embodiment of the present invention, showing a 3D printing head printing solder piles on a sheet component;

[0058] Figure 5 This is a schematic diagram of an embodiment of the present invention in which a laser emits laser light onto a solder pile on a chip component;

[0059] Figure 6 This is a schematic diagram of an embodiment of the present invention in which a laser emits laser light onto solder balls on a sheet component;

[0060] Figure 7 This is a schematic diagram illustrating the process principle of a solder ball repair method according to Embodiment 2 of the present invention;

[0061] Figure 8 This is a schematic diagram of one embodiment of the solder ball repair system of the present invention.

[0062] In the picture:

[0063] 100 - Sheet components; 200 - PCB board; 201 - Solder paste; 10 - Detection camera module; 20 - 3D printing head; 21 - Solder pile; 30 - Laser; 40 - Processing module. Detailed Implementation

[0064] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” or “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0065] For ease of understanding, the specific process of the embodiments of the present invention will be described below.

[0066] Example 1

[0067] Reference Figure 3 One solder ball repair method in this embodiment includes:

[0068] S11. Obtain the original image of the chip component;

[0069] It is understood that the executing entity of this invention can be a solder ball repair device, a terminal, or an operating console; no specific limitation is made here. This embodiment of the invention will be described using an operating console as an example.

[0070] S12. Input the original image into an artificial intelligence model for recognition to determine whether there are defects in each solder joint on the sheet component;

[0071] The host computer on the control panel is equipped with a recognition program. An artificial intelligence model trained on a preset image library is integrated into this program, enabling it to identify defects in the original images. Defects in chip components include missing solder balls on solder joints and abnormal solder ball shapes. Further image processing is only required to determine the type of defect when a defect is found in the original image of the chip component. If no defect is found, the current repair process can be terminated directly, improving efficiency. Specifically, if the artificial intelligence model determines that a defect exists, step S13 is executed; if the model determines that no defect exists, the solder ball identification and repair process for the current chip component ends, and the process begins for the next chip component.

[0072] S13. If a defect exists, obtain the location of the solder joint and estimate the volume of the solder ball on the solder joint.

[0073] The volume of a normal solder ball is a range [a, b], including the lower threshold a and the upper threshold b. Based on the volume and shape of the solder ball (such as the condition of the solder joint, the height of the solder ball, etc.), it can be determined whether the defect is a cold solder joint or an empty solder joint. Then, depending on the different situations, one of the corresponding methods in S14-S16 can be selected for repair.

[0074] S14. If the volume value is within a preset range, the welding ball is melted and sintered into a qualified welding ball using a laser.

[0075] When a solder ball on a solder joint has a defect and its volume value is within a preset range (i.e., the volume is the same, but the shape is different from other normal solder balls), it can be judged as a cold solder joint. Therefore, a laser can be used to focus high temperature to remelt the deformed solder ball. The melted solder ball will automatically approach a spherical (or hemispherical) shape and match the shape of a normal qualified solder ball to complete the repair.

[0076] S15. If the volume value is less than the lower limit threshold of the preset range, the volume of the welding ball is increased to the preset value by the 3D printing head, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

[0077] When the volume of the solder ball is less than the lower threshold of the preset range and is not zero, it can be judged as a cold solder joint, that is, the volume of the solder ball is less than the volume of a normal solder ball. In this case, a solder pile is printed at the solder joint using a 3D printing head, making the sum of the solder ball volume and the solder pile volume equal to the preset value. Then, the solder pile is melted and sintered using a laser to form a qualified solder ball. When the volume of the solder ball is 0, it can be judged as an empty solder joint, that is, there is no solder ball at the solder joint location. In this case, the volume of the solder pile can be directly printed to the preset value using a 3D printing head, and then the solder pile is melted and sintered using a laser to form a qualified solder ball. Figure 3-4 As shown, 100 represents sheet components, 20 represents a 3D printing head, 21 represents a solder pile, and 30 represents a laser. The 3D printing head 20 prints a solder pile 21 of a certain volume at the solder joint. After the solder pile 21 is printed, the laser 30 emits a laser to melt and sinter the solder pile 21 to form a qualified solder ball.

[0078] S16. If the volume value is greater than the upper limit threshold of the preset range, the volume of the welding ball is vaporized to the preset value by a laser, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

[0079] When the volume value of a solder ball exceeds the upper limit of a preset range, that is, when the volume value of the solder ball is greater than the volume value of a normal solder ball. For example... Figure 6 As shown, 100 represents a chip component and 30 represents a laser. The laser 30 can be used to emit a laser at the solder joint to partially vaporize the solder ball, so that the volume of the remaining solder ball is equal to the preset value to form a qualified solder ball, thus completing the repair. It is simple and convenient.

[0080] In this embodiment, step S15 can be divided into the following three specific execution methods:

[0081] The first type:

[0082] S151. If the volume value is less than the lower threshold of the preset interval,

[0083] The volume of the solder ball is increased to a preset value directly through the 3D printing head.

[0084] The solder balls are then melted and sintered into qualified solder balls using a laser.

[0085] The second type:

[0086] S152. If the volume value is less than the lower threshold;

[0087] First, the solder ball is melted and sintered at the solder joint using a laser to make its surface smooth;

[0088] The volume of the solder ball is then increased to a preset value using a 3D printing head;

[0089] The solder balls are then melted and sintered into qualified solder balls using the laser.

[0090] In this step, since the surface of the solder ball may be rough and uneven, a laser can be used to melt the poorly soldered solder ball first to make its surface smooth. Then, a 3D printing head is used to print the solder pile. The stacking of the solder pile is simpler and easier. Finally, the laser is used to melt and sinter the solder pile to form a qualified solder ball.

[0091] The third type:

[0092] S153. If the volume value is less than the lower threshold;

[0093] First, the solder balls are completely vaporized using a laser;

[0094] Then, the volume of a new solder ball is printed at the solder joint using a 3D printing head to the preset value;

[0095] The new solder balls are then melted and sintered into qualified solder balls using the laser.

[0096] In this step, when the volume of the solder ball is less than the preset value, the malfunctioning solder ball can be completely vaporized and treated as an empty solder ball. The 3D printing head can then directly print a solder pile of the same volume as the qualified solder ball, avoiding the need to further calculate the volume of the solder pile that needs to be compensated and simplifying the repair steps.

[0097] In this embodiment, the preset value is a value within the preset range. Specifically, the preset value is any pre-set qualified solder ball volume value; or, the preset value is the average value of qualified solder ball volume values ​​estimated by the artificial intelligence model during the identification process.

[0098] In this embodiment, the solder pile printed by the 3D printing head is layered, with the cross-sectional area of ​​each layer decreasing from bottom to top. The solder material of the solder pile is tin powder or indium powder. In the prior art, using an inkjet printhead to spray solder balls for solder ball repair results in difficulty controlling the volume of the solder balls. Moreover, when the inkjet printhead sprays liquefied solder balls, the contact of the inkjet printhead itself can easily cause deformation of the solder balls that are still solidifying. However, the present invention uses a 3D printing head to print solder piles at designated locations and can precisely control the volume of the solder pile, which can be quickly obtained by the ejection volume of the 3D printing head. On the other hand, when 3D printing the solder pile, it is not necessary to print the shape of the solder pile into a spherical shape corresponding to other solder balls. Instead, multiple solder layers can be stacked, each solder layer exhibiting a simple geometric shape. This allows the 3D printing head to accelerate the printing speed of the solder, without pursuing the uniformity of the solder ball shape, and the cross-sectional area of ​​each layer decreases from bottom to top. When the solder pile is melted and sintered using a laser, the top layer of solder can be melted directly first, thus ensuring that the solder balls fall into the correct position during the solder pile melting and sintering process.

[0099] In this embodiment, when solder joints and solder balls need to be repaired, the location of the solder joint can be established in a three-dimensional coordinate system based on the obtained original image and existing known parameters (such as the size of the fixture for placing the sheet component, the height of the detection camera acquiring the original image of the sheet component, the laser emitting the laser, the 3D printing head, etc., relative to the fixture, the focal point of the laser, etc.). This three-dimensional coordinate system mainly facilitates the operation and positioning of the laser and the 3D printing head. In the three-dimensional coordinate system, the 3D printing head and / or the laser can be positioned at the location of the solder pile (or the 3D printing head and the laser can be fixed, and the angle and optimal focal length of the laser can be adjusted according to the position coordinates of the solder joint). The 3D printing head prints the solder pile, and the laser emits a laser to melt and sinter the solder pile to form a qualified solder ball shape, thus completing the repair operation.

[0100] In this embodiment, the artificial intelligence model processes the input original image using denoising, transformation, and smoothing operations to increase the weight of important features in the original image. In images with multiple important features, specific features are identified and separated using a certain method. Based on preset recognition rules, the artificial intelligence model can extract special features from the original image, and by recognizing these special features, ultimately achieve the evaluation and confirmation of the original image.

[0101] In this embodiment, before performing solder ball repair, the following steps are also included:

[0102] S10. Using images of sheet-like components with information tags as training samples, a deep learning algorithm is used for training to build an artificial intelligence model;

[0103] The information markers include the condition of the solder joint, the height of the solder ball, and the volume of the solder ball.

[0104] The deep learning algorithm can be a CNN convolutional neural network model. It is worth noting that building artificial intelligence models trained on a large amount of data using deep learning is a relatively mature technology in the current field, and will not be described in detail in this specification.

[0105] Example 2

[0106] Reference Figure 7 Similar to the method in Embodiment 1, this embodiment also provides another solder ball repair method, which includes:

[0107] S21. Obtain the original image of the chip component;

[0108] It is understood that the executing entity of this invention can be a solder ball repair device, a terminal, or a server; no specific limitation is made here. This embodiment of the invention will be described using a server as an example.

[0109] S22. Input the original image into an artificial intelligence model for recognition to determine whether there are defects in each solder joint on the sheet component;

[0110] Specifically, when the artificial intelligence model determines that there is a defect, operation step S23 can be executed; when the artificial intelligence model determines that there is no defect, the current solder ball identification and repair process of the chip component ends, and the identification and repair process of the next chip component begins.

[0111] S23. If a defect exists, obtain the location of the solder joint;

[0112] S24. First, the solder balls on the solder joint are completely vaporized using a laser.

[0113] S25. Then, use the 3D printing head to print the volume of the new solder ball at the solder joint to the preset value;

[0114] S26. Then, the new solder ball is melted and sintered into a qualified solder ball using the laser.

[0115] It is worth noting that if the solder joint has defects and the artificial intelligence model does not detect the presence of solder balls, step S24 can be omitted, and the operation of step S25 can be performed directly. The other steps are the same as or similar to those in Embodiment 1 above, and will not be described again here.

[0116] In this embodiment, if a defect is detected, the solder ball is directly vaporized using a laser, and then processed as an empty soldering operation. This eliminates the step of estimating the volume of the solder ball as in Embodiment 1, making it simpler and more convenient, and further improving production efficiency.

[0117] The solder ball repair method in the embodiments of the present invention has been described above. (Refer to...) Figure 8 The solder ball repair system of the present invention is described below. One embodiment of the solder ball repair system is used to perform the method in Embodiment 1 above. The system includes:

[0118] The camera module 10 is used to acquire the original image of the sheet-like component;

[0119] 3D printing head 20, used for printing solder piles;

[0120] Laser 30 is used to emit laser light;

[0121] The processing module 40 is used to input the original image into an artificial intelligence model for recognition, so as to determine whether there are defects in each solder joint on the sheet component;

[0122] If the solder joint has a defect, the location of the solder joint is obtained, and the volume of the solder ball on the solder joint is estimated.

[0123] If the volume value is within a preset range, the welding ball is melted and sintered into a qualified welding ball using a laser.

[0124] If the volume value is less than the lower threshold, the volume of the solder ball is increased to the preset value by the 3D printing head, and then the solder ball is melted and sintered into a qualified solder ball by the laser.

[0125] If the volume value is greater than the upper limit threshold, the volume of the welding ball is vaporized to the preset value by a laser, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

[0126] Similar to the solder ball repair system in the above embodiments, the present invention also provides a solder ball repair system for performing the method in Embodiment 2 above, the system comprising:

[0127] A camera module is used to acquire raw images of sheet-like components;

[0128] 3D printing head, used to print solder piles;

[0129] A laser, used to emit laser light;

[0130] The processing module is used to input the original image into an artificial intelligence model for recognition in order to determine whether there are defects in each solder joint on the sheet component;

[0131] If the solder joint has a defect, then the location of the solder joint is obtained;

[0132] First, the solder balls on the solder joint are completely vaporized using a laser;

[0133] Then, the volume of a new solder ball is printed at the solder joint using a 3D printing head to the preset value;

[0134] The new solder balls are then melted and sintered into qualified solder balls using the laser.

[0135] In this invention, an artificial intelligence model is first used to intelligently identify whether there are defects on the sheet-like components. If defects are found, the volume of the solder ball is increased to a preset value using a 3D printing head or the volume of the solder ball is vaporized to the preset value using a laser. Then, the solder ball is melted and sintered into a qualified solder ball using a laser. By cooperating with the 3D printing head and the laser, the corresponding repair operation is performed on the solder ball at the solder joint. This method is simple, convenient, and improves production efficiency.

[0136] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0137] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0138] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for repairing solder balls, characterized in that, include: Acquire the original image of the chip component; The original image is input into an artificial intelligence model for recognition to determine whether there are defects at each solder joint on the sheet component; If the solder joint has a defect, the location of the solder joint is obtained, and the volume of the solder ball on the solder joint is estimated. If the volume value is within a preset range, the welding ball is melted and sintered into a qualified welding ball using a laser. If the volume value is less than the lower limit threshold of the preset range, the volume of the solder ball is increased to the preset value by the 3D printing head, and then the solder ball is melted and sintered into a qualified solder ball by the laser; wherein, the solder pile obtained by the 3D printing head is layered and the solder pile exhibits a simple geometric shape, with the cross-sectional area of ​​each layer decreasing from bottom to top. If the volume value is greater than the upper limit threshold of the preset range, the volume of the welding ball is vaporized to the preset value by a laser, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

2. The solder ball repair method according to claim 1, characterized in that, The preset value is any pre-defined qualified solder ball volume value; or The preset value is the average value of the qualified solder ball volume obtained by the artificial intelligence model during the identification process.

3. The solder ball repair method according to claim 2, characterized in that, The preset value is a value that is located within the preset range.

4. The solder ball repair method according to claim 1, characterized in that, The step of increasing the volume of the solder ball to a preset value using a 3D printing head if the volume value is less than a lower threshold, and then melting and sintering the solder ball into a qualified solder ball using a laser, includes: If the volume value is less than the lower limit Threshold; First, the solder ball is melted and sintered at the solder joint using a laser to make its surface smooth; The volume of the solder ball is then increased to a preset value using a 3D printing head; The solder balls are then melted and sintered into qualified solder balls using the laser.

5. The solder ball repair method according to claim 1, characterized in that, The step of increasing the volume of the solder ball to a preset value using a 3D printing head if the volume value is less than a lower threshold, and then melting and sintering the solder ball into a qualified solder ball using a laser, includes: If the volume value is less than the lower threshold; First, the solder balls are completely vaporized using a laser; Then, the volume of a new solder ball is printed at the solder joint using a 3D printing head to the preset value; The new solder balls are then melted and sintered into qualified solder balls using the laser.

6. The solder ball repair method according to claim 1, characterized in that, The solder material of the solder pile is tin powder or indium powder.

7. The solder ball repair method according to claim 1, characterized in that, The solder ball repair method also includes: The artificial intelligence model processes the input original image using denoising, transformation, and smoothing operations to increase the weight of important features of the original image.

8. The solder ball repair method according to any one of claims 1-7, characterized in that, Before performing solder ball repair, the following is also included: Using images of sheet-like components with information tags as training samples, a deep learning algorithm is used to train and build an artificial intelligence model. The information markers include the condition of the solder joint, the height of the solder ball, and the volume of the solder ball.

9. A solder ball repair system, characterized in that, The solder ball repair system is used to implement the solder ball repair method according to any one of claims 1-8, and the solder ball repair system comprises: A camera module is used to acquire raw images of sheet-like components; 3D printing head, used to print solder piles; A laser, used to emit laser light; The processing module is used to input the original image into an artificial intelligence model for recognition, so as to determine whether there are defects in each solder joint on the sheet component; If the solder joint has a defect, the location of the solder joint is obtained, and the volume of the solder ball on the solder joint is estimated. If the volume value is within a preset range, the welding ball is melted and sintered into a qualified welding ball using a laser. If the volume value is less than the lower threshold, the volume of the solder ball is increased to the preset value by the 3D printing head, and then the solder ball is melted and sintered into a qualified solder ball by the laser; wherein, the solder pile printed by the 3D printing head is layered and the solder pile exhibits a simple geometric shape, with the cross-sectional area of ​​each layer decreasing from bottom to top; If the volume value is greater than the upper limit threshold, the volume of the welding ball is vaporized to the preset value by a laser, and then the welding ball is melted and sintered into a qualified welding ball by the laser.

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