A single wafer automatic spin coater and a coating method thereof

Abstract

The application provides a kind of single wafer automatic glue uniform device and its glue coating method, it is related to the technical field of glue uniform device.This kind of single wafer automatic glue uniform device, including the casing, the outer surface of the casing is equipped with inlet and outlet, the inner wall of the casing is fixedly connected with fixed seat at inlet and outlet, the top of two fixed seats is equipped with wafer placement basket positioning groove.Through the setting of grabbing component, moving component, fixed seat and wafer placement basket positioning groove, the automatic feeding and automatic discharging of single wafer can be realized without manual operation, then through the column, push cylinder, rotating component, lifting assembly, glue supply component, heating pipe, glue dropping head, glue uniform cover, rotating disc, drying cover, vacuum component, metal mounting rod and vacuum suction seat, the integration design of glue coating and drying is realized, so that the wafer gluing is completed, and drying treatment can be directly carried out without handling, with good continuity, reduces manual intervention, improves the efficiency of glue uniform.

Description

Technical Field

[0001] This invention relates to the field of coating apparatus technology, specifically to an automatic coating apparatus for single wafers and its coating method. Background Technology

[0002] Monocrystalline silicon is a relatively reactive non-metallic element and an important component of crystalline materials, placing it at the forefront of new material development. Its main applications are as a semiconductor material and in solar photovoltaic power generation and heating. In semiconductor photolithography, the purpose of coating a single-crystal wafer with photoresist is to obtain a uniformly distributed photoresist film of a certain thickness on the silicon wafer surface.

[0003] Traditional single-wafer coating is mostly done manually, which is inefficient and cannot guarantee uniform coating. Currently, the most widely used methods for single-wafer coating are spin coating and automatic spray coating. In actual operation, the single wafer needs to be placed manually, and after coating, it needs to be manually transported to the drying station for drying, and then transported to the unloading station. The overall continuity is poor, and there is a lot of manual intervention, resulting in low processing efficiency.

[0004] To address this, we have developed a new automatic single-wafer coating device and its coating method. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides an automatic single-wafer coating device and coating method, which solves the problems of poor continuity in single-wafer coating and excessive manual intervention, resulting in low processing efficiency.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides an automatic single-wafer coating device, comprising a housing, an inlet and an outlet on the outer surface of the housing, and fixed seats fixedly connected to the inner wall of the housing at both the inlet and outlet. A wafer placement basket positioning groove is formed on the top of each of the two fixed seats. Two mutually perpendicular moving components are mounted on the top of the housing, and a gripping component is mounted between the movable ends of the two moving components and the housing. Mounting plates are fixedly connected to the inner walls of both sides of the housing, and lifting components are fixedly mounted at the ends of the two mounting plates. A drying hood and a coating hood are respectively fixedly mounted on the movable ends of the two lifting components. A heating element is fixedly mounted on the inner top of the drying hood. The tube has a glue-dispensing head fixedly installed on the inner top of the glue-spreading cover. A glue-supplying assembly is installed between the glue-dispensing head and the machine housing. A push cylinder is fixedly connected to the bottom of the machine housing. A rotating assembly is fixedly installed on the movable end of the push cylinder. A column is rotatably connected to the inner bottom of the machine housing. A turntable is fixedly connected to the top of the column. The top of the turntable has four through-holes extending to the bottom. The inner wall of each of the four mounting holes has an annular groove. A metal mounting rod is rotatably connected to each of the four annular grooves, and the opening of the metal mounting rod is located inside the annular groove. A vacuum adsorption seat is fixedly connected to the top of each of the four metal mounting rods. A vacuum assembly is installed between the four annular grooves and the turntable. A workstation switching assembly is installed between the column and the machine housing.

[0009] Furthermore, both of the moving components include a moving motor, and the driving end of the moving motor is fixedly connected to a lead screw that is rotatably connected to the housing. A slide block is threaded onto the outer surface of the lead screw, and a slide rail fixedly connected to the housing is slidably connected to the top of the slide block. A lifting cylinder is fixedly connected to the bottom of the slide block, and a first slide rod is provided on one side of the outer surface of the lifting cylinder. A first sleeve plate fixedly connected to the lifting cylinder is slidably sleeved onto the outer surface of the first slide rod.

[0010] Furthermore, the gripping component includes a first vacuum pump, which is fixedly connected to the housing. The output end of the first vacuum pump is fixedly connected to two first three-way solenoid valves. One of the connection ports of the two first three-way solenoid valves is fixedly connected to a first flexible hose. The ends of the two first flexible hoses are fixedly connected to suction cups, and the suction cups are fixedly connected to the bottom of the adjacent first slide rod and the movable end of the lifting cylinder.

[0011] Furthermore, both of the lifting components include a lifting cylinder, and the lifting cylinder is fixedly connected to the mounting plate. The movable end of the lifting cylinder is fixedly connected to the adjacent drying hood and the uniform coating hood. A sliding plate is provided on one side of the outer surface of the lifting cylinder, which is slidably connected to the mounting plate, and the sliding plate is fixedly connected to the adjacent drying hood and the uniform coating hood.

[0012] Furthermore, the glue supply assembly includes a glue tank, which is fixedly installed at the bottom of the machine housing. A pump body is fixedly connected to the top of the glue tank, and the input end of the pump body is connected to the glue tank. A second hose is fixedly connected to the output end of the pump body, and the end of the second hose is fixedly connected to the glue dispensing head.

[0013] Furthermore, the rotating assembly includes a movable plate, which is fixedly connected to the movable end of the pushing cylinder. A second slide rod is fixedly connected to the bottom of the movable plate, and a second sleeve plate fixedly connected to the pushing cylinder is slidably sleeved on the outer surface of the second slide rod. A rotary motor is fixedly passed through the top of the movable plate, and a first gear is fixedly connected to the drive end of the rotary motor. A second gear is meshed with one side of the outer surface of the first gear, and the second gear is rotatably connected to the movable plate. An electromagnet is fixedly connected to the top of the mounting shaft of the second gear.

[0014] Furthermore, the vacuum assembly includes a second vacuum pump, which is fixedly installed at the bottom of the turntable. Four third hoses are fixedly connected to the input end of the second vacuum pump. The ends of the four third hoses are all fixedly connected to a second three-way solenoid valve that is fixedly connected to the turntable. One of the ports of the second three-way solenoid valve is connected to an adjacent annular groove by a connecting pipe.

[0015] Furthermore, the workstation switching assembly includes a switching motor, which is fixedly installed at the bottom of the machine housing. A third gear is fixedly connected to the drive end of the switching motor, and a fourth gear is meshed with one side of the outer surface of the third gear, which is fixedly sleeved on the outer surface of the column.

[0016] A method for applying adhesive using an automated single-wafer coating apparatus includes the following specific steps:

[0017] S1. First, place the wafer placement basket containing the single wafer on the wafer placement basket positioning slot at the inlet, and at the same time place the empty wafer placement basket on the wafer placement basket positioning slot at the outlet.

[0018] S2. During equipment operation, the moving component, in conjunction with the gripping component, places the single crystal onto the vacuum adsorption seat at the loading station. Then, the vacuum component, along with the annular groove, metal mounting rod, and vacuum adsorption seat, adsorbs and fixes the single crystal.

[0019] S3. Then, the station switching component, together with the column and turntable, switches the station and moves the single wafer to the coating station.

[0020] S4. The lifting component lowers the glue coating cover to cover the single crystal, and then the glue supply component supplies glue to the glue dispensing head. The glue drips onto the single crystal through the glue dispensing head. At the same time, the cylinder pushes the rotating component to rise. The rotating component, together with the metal mounting rod and vacuum adsorption seat, drives the single crystal to rotate, so that the glue is evenly coated on the surface of the single crystal under the action of centrifugal force.

[0021] S5. After the adhesive is applied, the coating cover and the rotating component are reset. Then the station switching component switches the station and slowly moves the coated single crystal to the drying station. Then the lifting component drives the drying cover to the designated position, and then the heating tube heats the single crystal to dry it.

[0022] S6. After drying is completed, the workstation is switched, and the dried single crystal is moved to the unloading station. At this time, the vacuum component releases its adsorption on the single crystal.

[0023] S7. Finally, the moving component and the gripping component work together to place the single chip into the empty chip placement basket to complete the unloading.

[0024] Working principle: First, the wafer placement basket containing the single wafer is placed on the wafer placement basket positioning slot at the inlet, and the empty wafer placement basket is placed on the wafer placement basket positioning slot at the outlet. Then, the lifting cylinder drives the suction cup to descend until the suction cup contacts the top single wafer. The first vacuum pump and the first three-way solenoid valve are then activated. The first three-way solenoid valve connects the first hose to the first vacuum pump, allowing the suction cup to be vacuumed and the single wafer to be adsorbed and fixed. Then, the moving motor drives the lead screw to rotate, which moves the slide along the slide rail, thus removing the single wafer until it is directly above the vacuum adsorption seat at the loading station. Finally, the lifting cylinder drives the suction cup... The device descends until the single crystal is placed on the vacuum adsorption holder. At this point, the second vacuum pump and four second three-way solenoid valves at the bottom are activated. The second three-way solenoid valves connect the second hose to the connecting pipe located at the loading station, allowing the vacuum pump to evacuate the vacuum adsorption holder and thus adsorb and fix the single crystal. Simultaneously, the first three-way solenoid valve disconnects the first hose connected to the single crystal adsorption cup from the first vacuum pump, connecting the first hose to the unconnected interface. This allows air to enter the cup through the first hose, contacting the cup and adsorbing the single crystal. The moving assembly then resets, and the switching motor starts, driving the third gear to rotate. The third gear then drives the fourth gear to rotate. The column rotates, which in turn rotates the turntable. This, in turn, moves the vacuum adsorption seat via the metal mounting rod, until the single crystal is moved to the coating station. A lifting cylinder lowers the coating cover until it covers the single crystal. The pump then delivers the adhesive from the adhesive tank to the second hose, and then to the dispensing head, where it drips onto the single crystal. Simultaneously, a cylinder pushes the movable plate upwards, which in turn raises the second gear until the electromagnet contacts the metal mounting rod. The electromagnet then activates, causing the second gear to adhere and fix to the metal mounting rod. Next, a rotary motor drives the first gear to rotate, which in turn drives the second gear to rotate, thus... A magnet drives a metal mounting rod to rotate, which in turn drives the single-chip wafer to rotate via a vacuum adsorption base, ensuring that the adhesive is evenly applied to the surface of the single-chip wafer. The adhesive coating cover and rotating assembly then reset. Next, a station switching assembly switches stations, slowly moving the coated single-chip wafer to the drying station. A lifting assembly lowers the drying cover to a designated position, where a heating element heats the wafer, drying it. After drying, the drying cover resets under the action of the lifting assembly. The station switching assembly, in conjunction with the column, turntable, metal mounting rod, and vacuum adsorption base, moves the dried single-chip wafer to the unloading station. Finally, a moving assembly and a gripping assembly work together to place the single-chip wafer into an empty wafer placement basket, completing the unloading process.

[0025] (III) Beneficial Effects

[0026] This invention provides an automatic coating apparatus for single-wafer wafers and a coating method thereof. It has the following beneficial effects:

[0027] 1. This automatic single-wafer coating device, through the setting of gripping components, moving components, fixed base and wafer placement basket positioning slot, can realize automatic loading and unloading of single wafers without manual operation. Then, through the column, pushing cylinder, rotating component, lifting component, glue supply component, heating tube, dispensing head, coating cover, turntable, drying cover, vacuum component, metal mounting rod and vacuum adsorption seat, the coating and drying are integrated into one design, so that the wafer can be directly dried after coating, without handling, with good continuity, reduced manual intervention and improved coating efficiency;

[0028] 2. This single-wafer automatic coating device, through the set push cylinder, rotating component and metal mounting rod, can provide centrifugal force during the coating process of the single wafer, so as to ensure that the adhesive can be evenly applied to the surface of the single wafer. Attached Figure Description

[0029] Figure 1 This is a perspective view of the present invention;

[0030] Figure 2 This is a first sectional view of the present invention;

[0031] Figure 3 This is a second sectional view of the present invention;

[0032] Figure 4 This is a cross-sectional view of the turntable of the present invention;

[0033] Figure 5 This is a schematic diagram of the rotating component structure of the present invention;

[0034] Figure 6 This is a schematic diagram of the mobile component structure of the present invention;

[0035] Figure 7 This is a cross-sectional view of the uniform coating of the present invention.

[0036] The components include: 1. Housing; 2. Mounting base; 3. Wafer placement basket positioning slot; 4. Lead screw; 5. First flexible hose; 6. Moving motor; 7. First three-way solenoid valve; 8. First vacuum pump; 9. Suction cup; 10. Mounting plate; 11. Drying hood; 12. Pump body; 13. Fourth gear; 14. Switching motor; 15. Third gear; 16. Slide plate; 17. Lifting cylinder; 18. Second flexible hose; 19. Push cylinder; 20. Connecting pipe; 21. Metal fitting. 21. Mounting rod; 22. Second three-way solenoid valve; 23. Column; 24. Third hose; 25. Electromagnet; 26. Second gear; 27. First gear; 28. Rotary motor; 29. ​​Movable plate; 30. Second slide rod; 31. Slide seat; 32. First slide rod; 33. Lifting cylinder; 34. First sleeve plate; 35. Slide rail; 36. Second vacuum pump; 37. Dispensing head; 38. Spreading cover; 39. Turntable; 40. Vacuum adsorption seat; 41. Glue box. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] like Figures 1-7As shown, this embodiment of the invention provides an automatic single-wafer coating device, including a housing 1. The outer surface of the housing 1 has an inlet and an outlet. Fixed bases 2 are fixedly connected to the inner wall of the housing 1 at both the inlet and outlet. A wafer placement basket positioning groove 3 is formed on the top of each of the two fixed bases 2. Two mutually perpendicular moving components are mounted on the top of the housing 1. A gripping component is installed between the movable ends of the two moving components and the housing 1. Mounting plates 10 are fixedly connected to the inner walls of both sides of the housing 1. Lifting components are fixedly mounted at the ends of the two mounting plates 10. A drying hood 11 and a coating hood 38 are fixedly mounted on the movable ends of the two lifting components, respectively. A heating tube is fixedly mounted on the inner top of the drying hood 11, and a coating hood 38 is fixedly mounted on the inner top of the coating hood 38. There is a dispensing head 37, and a dispensing assembly is installed between the dispensing head 37 and the housing 1. A push cylinder 19 is fixedly connected to the bottom of the housing 1. A rotating assembly is fixedly installed at the movable end of the push cylinder 19. A column 23 is rotatably connected to the inner bottom of the housing 1. A turntable 39 is fixedly connected to the top of the column 23. The top of the turntable 39 has four through-holes extending to the bottom. The inner wall of each of the four mounting holes has an annular groove. A metal mounting rod 21 is rotatably connected to each of the four annular grooves, and the opening of the metal mounting rod 21 is located inside the annular groove. A vacuum adsorption seat 40 is fixedly connected to the top of each of the four metal mounting rods 21. A vacuum assembly is installed between the four annular grooves and the turntable 39. A workstation switching assembly is installed between the column 23 and the housing 1.

[0039] Figure 2 and Figure 3 As shown, both lifting components include a lifting cylinder 17, and the lifting cylinder 17 is fixedly connected to the mounting plate 10. The movable end of the lifting cylinder 17 is fixedly connected to the adjacent drying hood 11 and the uniform coating hood 38. A sliding plate 16 is provided on one side of the outer surface of the lifting cylinder 17 and is slidably connected to the mounting plate 10. The sliding plate 16 is fixedly connected to the adjacent drying hood 11 and the uniform coating hood 38.

[0040] When using the above solution, the lifting cylinder 17 can drive the drying hood 11 or the uniform coating hood 38 connected to it to descend.

[0041] The slide plate 16 limits the position of the drying hood 11 or the uniform coating hood 38 connected to it, ensuring the stability of its descent.

[0042] The glue supply assembly includes a glue tank 41, which is fixedly installed at the bottom of the housing 1. A pump body 12 is fixedly connected to the top of the glue tank 41, and the input end of the pump body 12 is connected to the glue tank 41. A second hose 18 is fixedly connected to the output end of the pump body 12, and the end of the second hose 18 is fixedly connected to the glue dispensing head 37.

[0043] When using the above solution, the pump body 12 can extract the glue from the glue tank 41 and then deliver it to the dispensing head 37 through the second hose 18.

[0044] Figure 2 , Figure 3 and Figure 6 As shown, both moving components include a moving motor 6, and the driving end of the moving motor 6 is fixedly connected to a lead screw 4 that is rotatably connected to the housing 1. A slide block 31 is threaded onto the outer surface of the lead screw 4. A slide rail 35 that is fixedly connected to the housing 1 is slidably connected to the top of the slide block 31. A lifting cylinder 33 is fixedly connected to the bottom of the slide block 31. A first slide rod 32 is provided on one side of the outer surface of the lifting cylinder 33. A first sleeve plate 34 that is fixedly connected to the lifting cylinder 33 is slidably sleeved onto the outer surface of the first slide rod 32.

[0045] When using the above solution, the moving motor 6 drives the lead screw 4 to rotate. While the lead screw 4 is rotating, it drives the slide 31 to move, thereby driving the lifting cylinder 33 to move. Then, the lifting cylinder 33 can drive the suction cup 9 to move, and the lifting cylinder 33 itself can drive the suction cup 9 to rise or fall.

[0046] The first slide bar 32 and the first sleeve plate 34 work together to limit the movement of the suction cup 9, ensuring the stability of the suction cup 9's lifting and lowering movement.

[0047] The slide rail 35 has a limiting function on the slide block 31, ensuring the stability of the movement of the slide block 31.

[0048] The gripping assembly includes a first vacuum pump 8, which is fixedly connected to the housing 1. The output end of the first vacuum pump 8 is fixedly connected to two first three-way solenoid valves 7. One of the connection ports of the two first three-way solenoid valves 7 is fixedly connected to a first flexible hose 5. The ends of the two first flexible hoses 5 are fixedly connected to a suction cup 9. The suction cup 9 is fixedly connected to the bottom of the adjacent first slide bar 32 and the movable end of the lifting cylinder 33.

[0049] When using the above scheme, the first vacuum pump 8 is started, and the suction cup 9 can be evacuated through the first three-way solenoid valve 7 and the first hose 5.

[0050] The first three-way solenoid valve 7 can control whether it is connected to the first vacuum pump 8 or to an interface of an unconnected pipeline.

[0051] Figure 2 and Figure 4 As shown, the workstation switching assembly includes a switching motor 14, which is fixedly installed at the bottom of the housing 1. A third gear 15 is fixedly connected to the drive end of the switching motor 14. A fourth gear 13 is meshed on one side of the outer surface of the third gear 15, and the fourth gear 13 is fixedly sleeved on the outer surface of the column 23.

[0052] When using the above solution, starting the switching motor 14 can drive the third gear 15 to rotate, the third gear 15 drives the fourth gear 13 to rotate, thereby driving the column 23 to rotate, and the column 23 drives the turntable 39 to rotate, thus realizing the workstation switching.

[0053] Figure 4 As shown, the vacuum assembly includes a second vacuum pump 36, which is fixedly installed at the bottom of the turntable 39. Four third hoses 24 are fixedly connected to the input end of the second vacuum pump 36. The ends of the four third hoses 24 are all fixedly connected to a second three-way solenoid valve 22 that is fixedly connected to the turntable 39. One of the interfaces of the second three-way solenoid valve 22 is connected to the adjacent annular groove by a connecting pipe 20.

[0054] When using the above scheme, the second vacuum pump 36 is started, and the annular groove can be evacuated through the third hose 24, the second three-way solenoid valve 22 and the connecting pipe 20.

[0055] The second three-way solenoid valve 22 can control whether the connecting pipe 20 is connected to the third flexible hose 24 or to an interface of an unconnected pipe.

[0056] Figure 5 As shown, the rotating assembly includes a movable plate 29, which is fixedly connected to the movable end of the push cylinder 19. A second slide rod 30 is fixedly connected to the bottom of the movable plate 29. A second sleeve plate fixedly connected to the push cylinder 19 is slidably sleeved on the outer surface of the second slide rod 30. A rotary motor 28 is fixedly passed through the top of the movable plate 29. A first gear 27 is fixedly connected to the drive end of the rotary motor 28. A second gear 26 is meshed with one side of the outer surface of the first gear 27, and the second gear 26 is rotatably connected to the movable plate 29. An electromagnet 25 is fixedly connected to the top of the mounting shaft of the second gear 26.

[0057] When using the above scheme, the rotary motor 28 is started, and the rotary motor 28 drives the first gear 27 to rotate. The first gear 27 can drive the second gear 26 to rotate, thereby driving the electromagnet 25 to rotate.

[0058] When the electromagnet 25 is activated, it can be fixedly connected to the metal mounting rod 21 by magnetic force. When the electromagnet 25 rotates, it can drive the metal mounting rod 21 to rotate.

[0059] A method for applying adhesive using an automated single-wafer coating apparatus includes the following specific steps:

[0060] S1. First, place the wafer placement basket containing the single wafer on the wafer placement basket positioning slot 3 at the feed port, and at the same time place the empty wafer placement basket on the wafer placement basket positioning slot 3 at the discharge port.

[0061] S2. The equipment is running. The moving component, together with the gripping component, places the single crystal on the vacuum adsorption seat 40 at the loading station. Then, the vacuum component, the ring groove, the metal mounting rod 21 and the vacuum adsorption seat 40 adsorb and fix the single crystal.

[0062] S3. Then, the station switching component, together with the column 23 and the turntable 39, switches the station and moves the single crystal to the coating station.

[0063] S4. The lifting component drives the glue coating cover 38 to descend and cover the single crystal. Then the glue supply component supplies glue to the glue dispensing head 37. The glue drips onto the single crystal through the glue dispensing head 37. At the same time, the cylinder 19 pushes the rotating component to rise. The rotating component, together with the metal mounting rod 21 and the vacuum adsorption seat 40, drives the single crystal to rotate, so that the glue is evenly coated on the surface of the single crystal under the action of centrifugal force.

[0064] S5. After the adhesive is applied, the adhesive coating cover 38 and the rotating component are reset. Then the station switching component switches the station and slowly moves the coated single crystal to the drying station. Then the lifting component drives the drying cover 11 to descend to the designated position. Then the heating tube heats the single crystal to dry it.

[0065] S6. After drying is completed, the workstation is switched, and the dried single crystal is moved to the unloading station. At this time, the vacuum component releases its adsorption on the single crystal.

[0066] S7. Finally, the moving component and the gripping component work together to place the single chip into the empty chip placement basket to complete the unloading.

[0067] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single wafer automatic spin coater comprising a housing (1), characterized in that: The outer surface of the shell (1) is provided with an inlet and an outlet, the inner wall of the shell (1) is fixedly connected with a fixed seat (2) at the inlet and the outlet, the top of the two fixed seats (2) is provided with a wafer placing basket positioning groove (3), the top of the shell (1) is provided with two mutually perpendicular moving assemblies, the movable ends of the two moving assemblies are jointly connected with a grabbing assembly, the inner walls of the two sides of the shell (1) are fixedly connected with mounting plates (10), the ends of the two mounting plates (10) are fixedly connected with lifting assemblies, the movable ends of the two lifting assemblies are fixedly connected with a drying cover (11) and a glue uniformizing cover (38) respectively, the inner top of the drying cover (11) is fixedly connected with a heating pipe, the inner top of the glue uniformizing cover (38) is fixedly connected with a glue dropping head (37), the glue dropping head (37) and the shell (1) are jointly connected with a glue supply assembly, the bottom of the shell (1) is fixedly connected with a push air cylinder (19), the movable end of the push air cylinder (19) is fixedly connected with a rotating assembly, the inner bottom of the shell (1) is rotatably connected with a stand column (23), the top of the stand column (23) is fixedly connected with a rotating disc (39), the top of the rotating disc (39) is provided with four mounting holes penetrating through the bottom, the inner walls of the four mounting holes are provided with annular grooves, the inner sides of the four annular grooves are rotatably connected with metal mounting rods (21), and the openings of the metal mounting rods (21) are located in the annular grooves, the tops of the four metal mounting rods (21) are fixedly penetrated with vacuum suction seats (40), the four annular grooves and the rotating disc (39) are jointly connected with a vacuum assembly, and the stand column (23) and the shell (1) are jointly connected with a station switching assembly. The rotating assembly comprises a movable plate (29), and the movable plate (29) is fixedly connected with the movable end of the push air cylinder (19), the bottom of the movable plate (29) is fixedly connected with a second sliding rod (30), the outer surface of the second sliding rod (30) is slidably sleeved with a second sleeve plate fixedly connected with the push air cylinder (19), the top of the movable plate (29) is fixedly penetrated with a rotating motor (28), the driving end of the rotating motor (28) is fixedly connected with a first gear (27), one side of the outer surface of the first gear (27) is meshedly connected with a second gear (26), and the second gear (26) is rotatably connected with the movable plate (29), and the top of the mounting shaft of the second gear (26) is fixedly connected with an electromagnet (25).

2. The apparatus according to claim 1, wherein: Both the mobile assemblies comprise a mobile motor (6), and the driving end of the mobile motor (6) is fixedly connected with a screw rod (4) which is rotationally connected with the shell (1), the outer surface of the screw rod (4) is threadedly sleeved with a sliding seat (31), the top of the sliding seat (31) is slidably connected with a sliding rail (35) which is fixedly connected with the shell (1), the bottom of the sliding seat (31) is fixedly connected with a lifting air cylinder (33), one side of the outer surface of the lifting air cylinder (33) is provided with a first sliding rod (32), the outer surface of the first sliding rod (32) is slidably sleeved with a first sleeve plate (34) which is fixedly connected with the lifting air cylinder (33).

3. The apparatus according to claim 2, wherein: The grabbing assembly comprises a first vacuum pump (8), and the first vacuum pump (8) is fixedly connected between the shell (1), the output end of the first vacuum pump (8) is fixedly penetrated with two first three-way electromagnetic valves (7), one of the connecting ports of the two first three-way electromagnetic valves (7) is fixedly penetrated with a first hose (5), the distal end of the two first hoses (5) is fixedly penetrated with a suction cup (9), and the suction cup (9) is fixedly connected between the bottom of the adjacent first sliding rod (32) and the movable end of the lifting air cylinder (33).

4. The apparatus according to claim 1, wherein: Both the lifting assemblies comprise a lifting air cylinder (17), and the lifting air cylinder (17) is fixedly connected between the mounting plate (10), the movable end of the lifting air cylinder (17) is fixedly connected between the adjacent drying cover (11) and the glue uniformizing cover (38), one side of the outer surface of the lifting air cylinder (17) is provided with a sliding plate (16) which is slidably connected with the mounting plate (10), and the sliding plate (16) is fixedly connected between the adjacent drying cover (11) and the glue uniformizing cover (38).

5. The apparatus according to claim 1, wherein: The glue supply assembly comprises a glue tank (41), and the glue tank (41) is fixedly installed at the inner bottom of the shell (1), the top of the glue tank (41) is fixedly connected with a pump body (12), the input end of the pump body (12) is in communication with the glue tank (41), the output end of the pump body (12) is fixedly penetrated with a second hose (18), and the distal end of the second hose (18) is fixedly penetrated with a glue dropping head (37).

6. The apparatus according to claim 1, wherein: The vacuum assembly comprises a second vacuum pump (36), and the second vacuum pump (36) is fixedly installed at the bottom of the rotating disc (39), the input end of the second vacuum pump (36) is fixedly penetrated with four third hoses (24), the distal end of the four third hoses (24) is fixedly penetrated with a second three-way electromagnetic valve (22) which is fixedly connected with the rotating disc (39), one of the interfaces of the second three-way electromagnetic valve (22) and the adjacent annular groove are in common communication with a connecting pipe (20).

7. The apparatus according to claim 1, wherein: The station switching assembly comprises a switching motor (14), and the switching motor (14) is fixedly installed at the inner bottom of the shell (1), the driving end of the switching motor (14) is fixedly connected with a third gear (15), one side of the outer surface of the third gear (15) is meshingly connected with a fourth gear (13), and the fourth gear (13) is fixedly sleeved on the outer surface of the stand column (23).

8. The method of claim 1-7, wherein the method further comprises, The following specific steps are included: S1, first, the wafer containing a single crystal is placed in the wafer placing basket at the inlet of the wafer placing basket positioning groove (3), and the empty wafer placing basket is placed at the outlet of the wafer placing basket positioning groove (3); S2, the equipment is operated, the moving assembly cooperates with the grabbing assembly to place the single crystal wafer on the vacuum suction seat (40) at the feeding station, and then the vacuum assembly cooperates with the ring groove, the metal mounting rod (21) and the vacuum suction seat (40) to adsorb and fix the single crystal wafer; S3, then the station switching assembly cooperates with the stand (23) and the turntable (39) to switch the station, and moves the single crystal wafer to the glue uniformizing station; S4, the lifting assembly drives the glue uniformizing cover (38) to descend, covers the single crystal wafer, then the glue supply assembly supplies glue for the glue dropping head (37), the glue drops on the single crystal wafer through the glue dropping head (37), at the same time, the air cylinder (19) pushes the rotating assembly to ascend, the rotating assembly cooperates with the metal mounting rod (21) and the vacuum suction seat (40) to drive the single crystal wafer to rotate, so that the glue is uniformly coated on the surface of the single crystal wafer under the action of centrifugal force; S5, after the glue coating is completed, the glue uniformizing cover (38) and the rotating assembly are reset, then the station switching assembly switches the station, slowly moves the single crystal wafer after the glue coating to the drying station, then the lifting assembly drives the drying cover (11) to descend to the specified position, and then the heating pipe is heated, so as to dry the single crystal wafer; S6, after the drying is completed, the station is switched, the single crystal wafer after the drying is moved to the discharging station, and the vacuum assembly releases the adsorption of the single crystal wafer at this time; S7, finally, the moving assembly cooperates with the grabbing assembly to place the single crystal wafer in the empty wafer placing basket, and the discharging is completed.

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