A heating device for curing a substrate

Abstract

The present invention discloses a heating device for curing a substrate, the heating device comprises a plurality of heating modules for heating and curing the substrate, the heating modules comprise two heating components, a heating channel is formed between the two heating components, a track component for assisting the movement of the substrate is arranged in the heating channel, both of the two heating components spray hot air toward the heating channel, and the hot air is sprayed evenly on the substrate. The input gas is heated by the heating component, and the heated gas is introduced into the heating channel, so that when the substrate disposed on the track component is heated, the temperature difference at different points of the heated surface is kept within a certain range. This solves the problem that when the substrate is directly heated by a heating rod, the temperature difference at different positions on the heated surface of the substrate is large.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a heating device for solidifying a substrate. Background Art

[0002] Surface Mount Technology (SMT) is the most popular technology and process in the electronic assembly industry. It can mount leadless or short-lead surface mount components on the surface of a substrate (Printed Circuit Board, PCB) or other substrates.

[0003] In the existing surface mounting technology, a screen printer is usually used to print epoxy resin on a substrate, and then a dispensing machine is used to drop patch glue on the substrate, and the chip is placed on the substrate by a patch machine. The substrate is then sent into a curing furnace, and the high temperature is used to melt the patch glue to bond the chip to the substrate, and the high temperature is used to melt the epoxy resin to bond the chip to the substrate.

[0004] In the process of curing the substrate to make the chip and the substrate firmly bonded, the curing furnace generally directly heats the substrate through a heating rod to meet the heating temperature requirements of the substrate. However, this heating method easily causes uneven heating areas on the substrate, resulting in large temperature differences at different positions of the substrate.

[0005] Therefore, it is necessary to propose a heating device for curing a substrate to improve the above-mentioned problems. Summary of the invention

[0006] In order to overcome the deficiencies of the prior art, the present invention provides a heating device for curing a substrate.

[0007] The technical solution of the present invention is as follows:

[0008] A heating device for curing a substrate, the heating device comprising a plurality of heating modules for heating and curing the substrate, the heating modules comprising: two heating components, a heating channel formed between the two heating components, a track component for assisting the movement of the substrate being arranged in the heating channel, the two heating components both spray hot air toward the heating channel, and the hot air is sprayed evenly onto the substrate.

[0009] In a possible implementation, both of the two heating components include a temperature control component and a heating component disposed in the temperature control component, an air duct group is disposed in the temperature control component, and the heating component is used to heat the gas flowing in the air duct group.

[0010] In one possible implementation, the heating component also includes a diverter, which abuts against the lower end surface of the temperature control component, and the lower end surface of the temperature control component is recessed to form a reflux chamber, the air duct group is connected to the reflux chamber, and the reflux chamber is used to collect the gas that has completed heating.

[0011] In a possible implementation, the air duct group includes an odd number of first air ducts not less than 3, an even number of second air ducts not less than 2, and 2 or 4 vertical air ducts for connecting the first air ducts and the second air ducts;

[0012] One end of the vertical air duct is communicated with the first air duct, and the other end of the vertical air duct is communicated with the second air duct, and the first air duct, the second air duct and the vertical air duct are arranged around the heating element.

[0013] In a possible implementation, a first flow-aiding block is provided at each corner of the first air duct, and the first flow-aiding block is used to reduce the loss of gas flow velocity at the corner of the first air duct.

[0014] In one possible implementation, a second flow-aiding block is provided at the connection between the first air duct and the vertical air duct, and a second flow-aiding block is provided at the connection between the second air duct and the vertical air duct, and the second flow-aiding block is used to reduce the resistance encountered when the gas converges or diverges.

[0015] In a possible implementation, a plurality of reflux holes are provided on the lower end surface of the temperature control member, and the reflux holes are used to connect the second air duct with the reflux chamber;

[0016] A first temperature sensor is disposed in the reflux hole, and the first temperature sensor is used to detect the temperature of the gas flowing into the reflux cavity.

[0017] In one possible implementation, a flow control member is arranged below the diverter member, the flow control member is connected to the diverter member, the diverter member is provided with a plurality of diverter holes penetrating the two end surfaces of the diverter member, the flow control member is provided with flow control holes matching the diverter holes, and the flow control holes are used to guide the gas to be sprayed toward the substrate in the heating channel.

[0018] In a possible implementation, a regulating member and a flow sensor are provided in the diverter hole, the regulating member is used to regulate the gas flow through the diverter hole, and the flow sensor is used to monitor the gas flow through the diverter hole;

[0019] A second temperature sensor is provided in the flow control hole, and the second temperature sensor is used to detect the temperature of the gas entering the heating channel.

[0020] In one possible implementation, the heating component also includes an insulation component, which has an insulation cavity formed inside and opening toward the lower end surface. The temperature control component, heating component, diverter component and reflux cavity are all located in the insulation cavity, and the lower end of the insulation component is connected to the flow control component.

[0021] According to the present invention of the above scheme, its beneficial effect lies in a heating device for curing a substrate, wherein the heating module includes two heating components, and a heating channel is provided between the two heating components, and the substrate is movably provided on a track component located in the heating channel. The input gas is heated by the heating component, and the heated gas is introduced into the heating channel, so that the gas uniformly heats the substrate and increases the basic temperature, thereby heating and curing the connection structure between the substrate and the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the overall structure of several heating modules in this embodiment;

[0023] Figure 2 Schematic diagram of the structure of the heating assembly in this embodiment;

[0024] Figure 3 This is an exploded view of the structure of the heating assembly in this embodiment;

[0025] Figure 4 Schematic diagram of the structure of the temperature control component, the flow diversion component, the flow control component and the heat preservation component in this embodiment;

[0026] Figure 5 For this embodiment Figure 4 Schematic diagram of the AA section structure;

[0027] Figure 6 Schematic diagram of the structure of the temperature control component in this embodiment;

[0028] Figure 7 For this implementation Figure 6 Cross-section of the middle BB;

[0029] Figure 8 For this implementation Figure 6 Cross-section of the middle CC;

[0030] Fig. 9 For this implementation Figure 6 Cross-section of the middle DD;

[0031] Fig.10 is a schematic structural diagram of the first flow-aiding block in this embodiment;

[0032] Fig.11 is a schematic structural diagram of the second flow-aiding block in this embodiment;

[0033] Fig.12 Schematic diagram of gas flow in the first air duct, the second air duct and the third air duct in this embodiment;

[0034] Fig.13 This is another schematic diagram of gas flow in the first air duct, the second air duct and the third air duct in this embodiment.

[0035] In the figure:

[0036] 100, heating module; 10, heating component; 11, temperature control component; 111, reflux chamber; 112, temperature controller; 113, reflux hole; 12, heating component; 13, air duct group; 131, first air duct; 132, second air duct; 133, vertical air duct; 134, first flow-aiding block; 135, second flow-aiding block; 14, diverter component; 141, diverter hole; 1411, diverter channel; 1412, conical cavity; 142, adjusting component; 143, flow sensor; 15, flow control component; 151, flow control hole; 16, insulation component; 161, insulation chamber; 20, heating channel; 30, track component; 40, pulley component; 50, drive component; 60, air intake component. DETAILED DESCRIPTION

[0037] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0038] It should be noted that the substrate is heated and cured in the die bonder so that the epoxy resin strengthens the bond between the substrate and the chip. The heating device in the die bonder heats the substrate directly using a heating rod, which can easily cause uneven heating of the substrate by the heating rod. Different positions on the substrate are subjected to large temperature differences. For example, the position close to the heating rod on the substrate is higher than the position far from the heating rod. This causes some positions on the substrate to be too high in temperature and some positions to be too low in temperature. The heating temperature of the substrate cannot be controlled within a small range, resulting in uneven heating of the substrate when the substrate is directly heated by a heating rod. In order to adjust and modify the above-mentioned defects, it is necessary to propose a heating device for curing the substrate.

[0039] like Figures 1 to 12As shown, the present invention discloses a heating device for curing a substrate, the heating device comprises a plurality of heating modules 100 for heating and curing the substrate, the plurality of heating modules 100 are arranged linearly, pulley assemblies 40 are arranged at both ends of the plurality of heating modules 100, the substrate passes through the pulley assemblies 40 at both ends and the plurality of heating modules 100 are movably arranged at the same time, and the ends of the plurality of heating assemblies 10 are arranged at a driving assembly 50, the driving assembly 50 drives the substrate to move toward the end, so that the substrate moves in the plurality of heating modules 100, wherein the heating module 100 comprises two heating assemblies 10, the two heating assemblies 10 are both externally connected to an air intake assembly 60, and a heating channel 20 is formed between the two heating assemblies 10, a track assembly 30 for assisting the movement of the substrate is arranged in the heating channel 20, the two heating assemblies 10 both spray hot air toward the heating channel 20, and the hot air is sprayed evenly on the substrate. The gas entering the heating component 10 is heated, and the heated gas is directed toward the heating channel 20 so that the hot gas is sprayed evenly onto the substrate. During the heating process of the substrate, the heating temperatures of various positions of the substrate part within the heating module 100 are less different.

[0040] In this embodiment, reference Figure 1-Figure 3 The heating device includes 10 heating modules 100, and the 10 heating modules 100 are arranged in a linear shape. Each heating module 100 includes two heating components 10 arranged opposite to each other up and down, and a heating channel 20 is formed between the two heating components 10. The two heating components 10 are respectively connected to the air intake component 60, so that the air intake component 60 is introduced into the heating component 10, and the heating component 10 heats the gas introduced into it. After the heating component 10 heats the introduced gas, the gas is guided into the heating channel 20 through the internal air duct and evenly sprayed on the substrate moving on the track component 30, so as to heat and solidify the substrate.

[0041] In addition, in this embodiment, 10 linearly arranged heating modules 100 form three temperature zones: a preheating zone, a high temperature zone, and a cooling zone. The preheating zone includes 3 heating modules 100, the high temperature zone includes 4 heating modules 100, and the cooling zone includes 3 heating modules 100. The temperature of the heating zone varies from 0°C to 350°C, the temperature of the high temperature zone varies from 360°C to 400°C, and the temperature of the cooling zone varies from 400°C to 0°C.

[0042] In some embodiments, the preheating zone, high temperature zone, and cooling zone may include 2, 4, and 5 heating modules 100, respectively. By changing the time for the temperature zone to be heated to the target temperature range, and thereby changing the rate of temperature rise or decrease in the temperature zone, a temperature adaptation process is provided for the bonding structure of the substrate and the chip, thereby adjusting the rate of temperature rise or decrease in the curing process of the substrate and the chip.

[0043] For further reference, Figure 1-Figure 3 The two heating components 10 each include a temperature control component 11 and a heating component 12, and the heating component 12 is arranged in the temperature control component 11, wherein an air duct group 13 is arranged in the temperature control component 11, and the air duct group 13 is arranged around the heating component 12, and the air intake component 60 is connected to the air duct group 13, and the air intake component blows hot gas into the air duct group 13 of the temperature control component 11, and controls the heating of the heating component 12 in combination with the control end, thereby heating the gas in the air duct group 13.

[0044] It needs to be explained that a temperature controller 112 is provided on the temperature control component 11, and the temperature controller 112 is connected to the control end. The temperature controller 112 is used to detect the temperature control component 11 and regulate the heating temperature output power of the heating component 12 in combination with the control end, thereby heating the gas flowing in the air duct group 13 in the temperature control component 11.

[0045] For further reference, Figure 2-Figure 5 The heating assembly 10 also includes a diverter 14, which abuts against the lower end surface of the temperature control component 11 and is fixed by bolts, wherein the lower end surface of the temperature control component 11 is recessed to form a reflux chamber 111, and the reflux chamber 111 is connected to the air duct group 13. When the gas in the air duct group 13 in the temperature control component 11 is heated by the heating component 12, the heated gas can be introduced into the reflux chamber 111, thereby collecting and caching the heated gas, so as to facilitate the subsequent introduction of the heated gas into the heating channel 20.

[0046] For further reference, Figure 5-Figure 9 , Fig.12 The air duct group 13 includes an odd number of first air ducts 131 not less than 3, an even number of second air ducts 132 not less than 2, and 2 or 4 vertical air ducts 133 for connecting the first air ducts 131 and the second air ducts 132.

[0047] In this embodiment, reference Figure 6-Figure 9 , Fig.13The air duct group 13 includes three first air ducts 131, two second air ducts, and two second air ducts 132, wherein the three first air ducts 131 are arranged in the same plane at equal intervals, and the three first air ducts 131 are parallel to the length direction of the temperature control component 11, and the two second air ducts 132 are also arranged in another plane at equal intervals, and the two second air ducts 132 are also parallel to the length direction of the temperature control component 11. It should be explained that the three first air ducts 131 are located above the two second air ducts 132, wherein the two ends of the three first air ducts 131 are respectively connected, and the middle part of the first air duct 131 arranged in the middle is connected to the air inlet component, so that the air inlet component introduces the gas into the first air duct 131, and the first air duct 131 in the middle introduces the gas The flow is guided from the middle to the two ends, so that the airflow is divided into two flows at the two ends of the middle first air duct 131 and enters the two first air ducts 131 on both sides respectively. In addition, one end of a vertical air duct 133 is connected with the middle of the first air duct 131 on one side, and the other end is connected with the middle of the second air duct 132 below one side. One end of another vertical air duct 133 is connected with the middle of the first air duct 131 on the other side, and the other end is connected with the second air duct 132 below the other side. The airflow in the first air ducts 131 on both sides is merged from the two ends to the middle and enters the vertical air duct 133, and the gas is introduced into the middle position of the second air ducts 132 on both sides through the vertical air duct 133, and then it is divided into two flows from the middle of the second air duct 132 to flow to the two ends of the second air duct 132. It should be noted that in the present embodiment, the gas input by the air inlet assembly enters the vertical air duct 133 by means of diversion-merging after being diverted by the first air duct 131, thereby reducing the number of vertical air ducts 133, and further reducing the time for the heating element 12 to heat the gas, so that the gas matches the substrate with a lower curing temperature requirement.

[0048] It should be explained that the heating element 12 can be a heating rod, and the heating element 12 is located in the middle of the surface where the first air duct 131 and the surface where the second air duct 132 are located, and is also located in the middle of the two vertical air ducts 133. Therefore, by providing the first air duct 131, the second air duct 132 and the vertical air duct 133 in the temperature control element 11, and the heating element 12 is located in the middle of the three, the heating element 12 heats the gas flowing through the three. At the same time, through the connection relationship and relative position of the first air duct 131, the second air duct 132 and the vertical air duct 133, combined with the diversion and convergence of the gas, when the gas enters the first air duct 131 and is discharged from the second channel, the gas of the air duct group 13 entering at the same time can leave at the same time, so that the same batch of gases are heated for the same time, and the gas converged in the vertical air duct 133 will not have a temperature difference due to different heating times, resulting in a situation where high temperature and low temperature neutralization of two gases with a large temperature difference occurs, which greatly reduces energy loss.

[0049] In some embodiments, reference Fig.13 , the air duct group 13 includes 5 first air ducts 131, 2 second air ducts 132 and 4 vertical air ducts 133, wherein the 5 first air ducts 131 are also arranged in an equidistant manner, and the 2 second air ducts 132 are located below the 2 first air ducts 131 on both sides. Specifically, the middle first air duct 131 is connected to the air inlet assembly, the first air duct 131 is used to split the gas into 1:2, and continue to split the gas into 1:2 at both ends of the first air duct 131, and make a quarter of the gas flow into the two first air ducts 131 set in the middle, and is used to merge 1 / 4 of the gas into 1 / 2 gas and introduce it into the first air ducts 131 on both sides, and the first air ducts 131 on both sides are used to split the 1 / 2 gas again to form 1 / 4 gas, and introduce it into the vertical air ducts 133 from both ends, and the vertical air ducts 133 continue to guide the 1 / 4 gas and introduce it into the second air ducts 132. By changing the number, relative position, and connection relationship of the first air duct 131, the second air duct 132, and the vertical air duct 133, the flow time of the gas in the temperature control component 11 is increased, and at the same time, the heating time of the gas by the heating component 12 is increased. In addition, the gas enters the vertical air duct 133 by a diversion-confluence-diversion method, and the number of vertical air ducts 133 is increased, thereby increasing the heating time of the gas by the heating component 12, so that the gas matches the substrate with a higher curing temperature requirement.

[0050] For further reference, Fig.10 and Fig.12 The first air duct 131 is provided with a first flow-aiding block 134 at each corner. The inner side of the first flow-aiding block 134 is provided with a curved surface, so that when the airflow passes through the turning point, the loss of the air duct to the airflow velocity can be reduced when the airflow passes through the corner of the air duct.

[0051] For further reference, Fig.11 and Fig.12 A second flow-assisting block 135 is provided at the connection between the first air duct 131 and the second air duct 132. The second flow-assisting block 135 is provided at the point where the airflow is split and converged, so that the airflow is split into two by the second flow-assisting block when it is split, thereby reducing the problem of the airflow directly colliding with the inner wall of the air duct and causing the flow velocity to decrease. In addition, when the airflow converges and flows in another direction, the second flow-assisting block is used to control the two airflows to flow in the same direction, thereby avoiding the two airflows to collide with each other and then change the flow direction only after forming a local vortex, thereby reducing the gas flow velocity loss caused by the airflow collision. At the same time, through the structural settings of the first flow-assisting block 134 and the second flow-assisting block 135, the flow direction of the gas can be effectively adjusted, thereby reducing the vibration and noise caused by the collision of the gas with the air duct when the flow direction changes.

[0052] For further reference, Fig. 9A plurality of reflux holes 113 are provided on the lower end surface of the temperature control member 11. The reflux holes 113 are used to connect the second air duct 132 with the reflux chamber 111, so that the heated gas in the second air duct 132 can flow into the reflux chamber 111. In addition, a first temperature sensor (not shown in the figure) is provided in the reflux hole 113. The first temperature sensor (not shown in the figure) is connected to the control end and sends the detected temperature information to the control end, so that the control end can obtain the temperature information of the gas entering the reflux chamber 111 after being heated by the air duct group 13.

[0053] For further reference, Figure 3 and Figure 5 A flow control member 15 is provided under the diverter member 14, and the flow control member 15 is bolted and fixed to the diverter member 14. The diverter member 14 is provided with a plurality of diverter holes 141, and the flow control member 15 is provided with flow control holes 151 matching the diverter holes 141. The flow control holes 151 are used to guide the gas to spray toward the substrate in the heating channel 20.

[0054] In this embodiment, reference Figure 5 , a plurality of diverter holes 141 are arranged in an array, and the diverter holes 141 include a diverter channel 1411 and a conical cavity 1412 connected to the diverter channel 1411, wherein one end of the diverter channel 1411 is connected to the reflux chamber 111, and the other end is connected to the conical cavity 1412. Through the structural design of the conical cavity 1412, the gas flow rate of the gas in the reflux chamber 111 after passing through the diverter channel 1411 can be effectively slowed down, and the gas with a strong flow rate can be prevented from being directly sprayed on the substrate. In addition, a flow control hole 151 adapted to the diverter hole 141 is provided on the flow control member 15, and the flow control hole 151 is used to guide the gas to be sprayed toward the substrate in the heating channel 20, wherein the upper end face of the flow control member 15 abuts against the lower end face of the diverter member 14. By staggering and overlapping the flow control hole 151 and the diversion hole 141, the gas flow rate flowing from the conical cavity 1412 through the flow control hole 151 into the heating channel 20 is regulated, so that the gas flow rate flowing out from each flow control hole 151 is equal, and the injection force of the heating gas sprayed on the substrate is equal.

[0055] For further reference, Figure 5, a regulating member 142 and a flow sensor 143 are provided in the diverter hole 141, and the regulating member 142 and the flow sensor 143 are respectively connected to the control end, and the flow sensor 143 is located in the conical cavity 1412. The flow sensor 143 is used to monitor the gas flow through the diverter hole 141, and transmit the detected flow information to the control end, and the control end controls the regulating member 142 to regulate the gas flow through the diverter hole 141. Through the structural arrangement of the regulating member 142 and the flow sensor 143, the flow of the heating gas flowing from the reflux cavity 111 through the diverter hole 141 and the flow control hole 151 into the heating channel 20 can be controlled, thereby reducing the waste of the heating gas to a certain extent, thereby achieving the effect of energy saving.

[0056] In addition, a second temperature sensor (not shown in the figure) is provided in the flow control hole 151, and the second temperature sensor (not shown in the figure) is connected to the control end. The second temperature sensor (not shown in the figure) is used to detect the temperature of the gas entering the heating channel 20 and send the detection information to the control end, wherein the drive component 50 is connected to the control end. When the gas temperature is lower than the preset temperature range, the output efficiency of the drive component 50 is controlled by the control end to reduce the moving speed of the substrate in the heating channel 20, thereby increasing the heating and curing time of the substrate. Through the structural setting of the second temperature sensor (not shown in the figure), the heating temperature of the substrate is directly monitored, which increases the control of the heating temperature of the substrate and reduces the product loss rate caused by the heating and curing temperature of the substrate not meeting the preset temperature range to a certain extent.

[0057] For further reference, Figure 2 and Figure 3 The heating assembly 10 further includes a heat preservation member 16, wherein a heat preservation chamber 161 is formed inside the heat preservation member 16 and is open toward the lower end. The temperature control member 11, the heating member 12, the flow diverter 14, and the reflux chamber 111 are located in the heat preservation chamber 161, and the lower end of the heat preservation member 16 is bolted and fixed to the flow control member 15. The heat preservation member 16 is structurally arranged to keep the heated gas warm and prevent heat loss.

[0058] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

[0059] The above is an exemplary description of the present invention in conjunction with the accompanying drawings. It is obvious that the implementation of the present invention is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A heating device for curing a substrate, characterized in that: The heating device comprises a plurality of heating modules for heating and curing the substrate, wherein the heating modules comprise: two heating components, a heating channel is formed between the two heating components, a track component for assisting the movement of the substrate is arranged in the heating channel, and the two heating components both spray hot air toward the heating channel, and the hot air is evenly sprayed on the substrate; The two heating components each include a temperature control component and a heating component disposed in the temperature control component, wherein an air duct group is disposed in the temperature control component, and the heating component is used to heat the gas flowing in the air duct group; The heating assembly further includes a flow divider, the flow divider abuts against the lower end surface of the temperature control component, and the lower end surface of the temperature control component is concave to form a reflux cavity, the air duct group is connected to the reflux cavity, and the reflux cavity is used to collect the heated gas; The air duct group includes an odd number of first air ducts not less than 3, an even number of second air ducts not less than 2, and 2 or 4 vertical air ducts for connecting the first air ducts and the second air ducts; One end of the vertical air duct is communicated with the first air duct, and the other end of the vertical air duct is communicated with the second air duct, and the first air duct, the second air duct and the vertical air duct are arranged around the heating element; A first flow-aiding block is provided at each corner of the first air duct, and the first flow-aiding block is used to reduce the loss of gas flow velocity at the corner of the first air duct; A second flow-aiding block is provided at the connection between the first air duct and the vertical air duct, and a second flow-aiding block is provided at the connection between the second air duct and the vertical air duct, and the second flow-aiding block is used to reduce the resistance encountered when the gas converges or diverges; A plurality of reflux holes are provided on the lower end surface of the temperature control member, and the reflux holes are used to connect the second air duct with the reflux chamber; A first temperature sensor is provided in the reflux hole, and the first temperature sensor is used to detect the temperature of the gas flowing into the reflux cavity; A flow control member is arranged below the flow diverter member, and the flow control member is connected to the flow diverter member. The flow diverter member is provided with a plurality of flow diverter holes penetrating the two end surfaces of the flow diverter member, and the flow control member is provided with flow control holes matching the flow diverter holes, and the flow control holes are used to guide the gas to be sprayed toward the substrate in the heating channel; the plurality of flow diverter holes are arranged in an array, and the flow diverter holes include a flow diverter channel and a conical cavity connected to the flow diverter channel, wherein one end of the flow diverter channel is connected to the reflux cavity, and the other end of the flow diverter channel is connected to the conical cavity, and the upper end surface of the flow control member abuts against the lower end surface of the flow diverter member, and the flow control holes are staggered and overlapped with the flow diverter holes to regulate the gas flow rate flowing from the conical cavity through the flow control holes into the heating channel, so that the gas flow rate flowing out after each of the flow control holes is equal, thereby making the injection force of the heating gas sprayed on the substrate equal.

2. A heating device for curing a substrate according to claim 1, characterized in that: The diverter hole is provided with an adjusting member and a flow sensor, the adjusting member is used to adjust the gas flow through the diverter hole, and the flow sensor is used to monitor the gas flow through the diverter hole; A second temperature sensor is provided in the flow control hole, and the second temperature sensor is used to detect the temperature of the gas entering the heating channel.

3. A heating device for curing a substrate according to claim 2, characterized in that: The heating assembly also includes a heat preservation component, a heat preservation cavity opened toward the lower end surface is formed inside the heat preservation component, the temperature control component, the heating component, the flow diversion component and the reflux cavity are all located in the heat preservation cavity, and the lower end of the heat preservation component is connected to the flow control component.

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