An imaging electrical dual-mode detection chip based on heterogeneous packaging

Abstract

The application discloses an imaging electrical dual-mode detection chip based on heterogeneous packaging, characterized in that the imaging electrical dual-mode detection chip comprises an imaging chip, a microelectrode array, a lead wire, a contact and a packaging tube shell; the contact of the imaging chip and the microelectrode array is connected to the packaging tube shell in a heterogeneous packaging mode. The significant advantage of the imaging electrical dual-mode detection chip is that the complex processes of tape-out design and secondary processing are avoided, and meanwhile, the flexibility of the packaging makes it possible to adjust the size, layout and spacing of the microelectrode array according to the requirements of application scenes, so that the requirements can be better met.

Description

A dual-mode imaging electrical detector chip based on heterogeneous packaging Technical Field

[0001] This invention is an imaging electrical dual-mode detection chip based on heterogeneous packaging, which involves cross-applications in multiple fields such as biomedical engineering, cell biology, optical imaging and electrical detection. Background Technology

[0002] In biomedical research and cell biology, accurate and efficient acquisition of cellular information is crucial. Traditionally, optical imaging and electrical detection are two commonly used methods. Optical imaging provides high-resolution images of cell structure and function, while electrical detection can monitor cellular electrical activity in real time, such as changes in cell membrane potential and intracellular ion concentration. In existing optoelectronic integrated devices, optical imaging chips and microelectrode arrays are integrated through tape-out design, which has some limitations. First, secondary processing is required to meet biocompatibility requirements, increasing manufacturing complexity and cost. Second, due to the fixed structure of the tape-out design, the size, layout, and spacing of the microelectrode array cannot be adjusted according to the needs of the application scenario.

[0003] To address the shortcomings of existing technologies, this invention proposes a dual-mode imaging and electrical detection chip technology based on heterogeneous packaging. This technology highlights the need to integrate optical imaging and electrical detection functions onto the same chip, providing a simpler, more efficient, and flexible solution. Summary of the Invention

[0004] This invention addresses the problems of non-reusable optical imaging chips and difficult-to-replace microelectrode array substrates in existing methods of combining optical imaging chips and microelectrode arrays. It proposes a dual-mode imaging electrical detector chip based on heterogeneous packaging. This invention tightly integrates a portable microelectrode array and an optical imaging chip through heterogeneous packaging. While maintaining the original performance of both the optical imaging chip and the microelectrode array, the microelectrode array can be replaced according to the characteristics of the target being detected, such as cell size and spacing, to adapt to different experimental needs.

[0005] To achieve the above objectives, the present invention employs the following techniques and solutions:

[0006] An imaging electrical dual-mode detection chip based on heterogeneous packaging includes an imaging chip, a microelectrode array, leads, contacts, and a package shell; the contacts of the imaging chip and the microelectrode array are connected to the package shell through heterogeneous packaging.

[0007] Furthermore, the imaging chip integrates a photosensitive element array and a readout circuit to capture incident light and focus it onto the photosensitive element. It can be fabricated using any fabrication process, has high resolution, and can achieve cell-level imaging of biological tissues.

[0008] Furthermore, the imaging electrical dual-mode detection chip based on heterogeneous packaging has custom markings on the imaging chip for alignment with the microelectrode array.

[0009] Furthermore, the substrate used for the microelectrode array is BF33, a biocompatible material, ensuring its compatibility with the cell culture environment to facilitate cell contact and the acquisition of weak electrical signals (nV to mV). The thickness of BF33 is 100 to 300 μm, which has excellent optical transmittance and will not hinder the effective detection of optical signals. The conductive thin film material used is Ti-Au or Cr-Au, with Ti or Cr as the intermediate layer, which allows Au to adhere well to the substrate surface. The thickness of Ti or Cr is 5 to 20 nm, and the thickness of Au is 100 to 300 nm.

[0010] Furthermore, the microelectrode array uses a conductive thin film material with a surface insulating layer on top. The insulating layer is made of silicon oxide and is deposited on top of the conductive thin film material by plasma-enhanced chemical vapor deposition. The thickness of the insulating layer is 100-500 nm.

[0011] Furthermore, the microelectrode array has a typical size of 1 to 100 μm for a single microelectrode and a typical spacing of 1 μm to 1 mm between electrodes, which are connected to contacts at the edge via metal leads.

[0012] Furthermore, the size, dimensions, spacing, and arrangement of the microelectrode array and microelectrode units can be adjusted as needed to meet the requirements of different experimental scenarios and the targets being detected.

[0013] Furthermore, the microelectrode array has the same custom markings as the imaging chip for alignment with the imaging chip.

[0014] Furthermore, the heterogeneous packaging includes the following steps:

[0015] 1) Attach the imaging chip to the center of the packaged tube substrate and make an opening at the top of the packaged tube to ensure that it does not obstruct the detection of optical signals;

[0016] 2) Position the microelectrode array above the imaging chip according to the designed markings, ensuring that they are vertically aligned;

[0017] 3) Connect the aligned imaging chip and microelectrode array contacts to the pins inside the package via leads;

[0018] 4) Wrap the leads with epoxy resin, leaving space above the imaging chip to ensure that the leads inside the epoxy resin are isolated from the external environment;

[0019] 5) Remove excess adhesive residue, wait for the epoxy resin to cure, and cut off any unnecessary connections.

[0020] This invention proposes a dual-mode imaging electrical detector chip based on heterogeneous packaging. Compared with existing technologies, this invention tightly integrates a portable microelectrode array and an optical imaging chip through heterogeneous packaging, avoiding the complex processes of chip fabrication and secondary processing. Furthermore, the packaging flexibility allows for adjustments to the size, layout, and spacing of the microelectrode array according to the needs of the application scenario, thus better adapting to specific requirements. Attached Figure Description

[0021] Figure 1 is a schematic diagram of the imaging electrical dual-mode detection chip based on heterogeneous packaging according to the present invention.

[0022] Figure 2 is a physical image of the imaging electrical dual-mode detection chip based on heterogeneous packaging according to the present invention.

[0023] Figure 3 shows a physical image of the optical imaging chip.

[0024] Figure 4 shows a physical image of the microelectrode array. Detailed Implementation

[0025] A dual-mode imaging electrical detector chip based on heterogeneous packaging is shown in Figure 1 and in Figure 2. It includes an imaging chip, a microelectrode array, leads, contacts, and a packaging shell. The contacts of the imaging chip and the microelectrode array are connected to the packaging shell through heterogeneous packaging.

[0026] Furthermore, the imaging chip integrates a photosensitive element array and a readout circuit to capture incident light and focus it onto the photosensitive element. This chip is a dedicated optical imaging chip developed based on existing integrated circuit technology, with a pixel scale of 400 million and a single pixel size of 0.5μm, which can achieve single-cell level imaging detection. The optical imaging chip is a square with a side length of 1cm and a thickness of 300μm, as shown in Figure 3.

[0027] Furthermore, the imaging electrical dual-mode detection chip based on heterogeneous packaging has four cross-shaped marks distributed at the four corners of the imaging chip for alignment with the microelectrode array.

[0028] Furthermore, the substrate used for the microelectrode array is BF33, a biocompatible material, ensuring its compatibility with the cell culture environment so as to facilitate cell contact and the acquisition of weak electrical signals (μV). The thickness of BF33 is 200μm, which has good optical transparency and will not hinder the effective detection of optical signals. The conductive thin film material used is Ti-Au, with Ti as an intermediate layer to allow Au to adhere well to the substrate surface. The thickness of Ti or Cr is 100nm, and the thickness of Au is 100nm.

[0029] Furthermore, the microelectrode array uses a conductive thin film material with a surface insulating layer on top. The insulating layer is square and is used to isolate the electrode leads on the microelectrode array from the top to prevent crosstalk between the electrode leads. The insulating layer is made of silicon oxide and is processed onto the conductive thin film material by plasma-enhanced chemical vapor deposition. Its thickness is 300 nm.

[0030] Furthermore, the microelectrode array is used to detect nerve fiber cells. Its physical form is shown in Figure 4. The microelectrodes are evenly distributed around the imaging chip. Each microelectrode is a square with a diameter of 100 μm. They are connected to the contact points on the edge of the microelectrode array through metal leads on the microelectrode array. The center-to-center distance between adjacent microelectrodes is 500 μm.

[0031] Furthermore, the microelectrode array has the same custom markings as the imaging chip, which are cross-shaped and used for alignment with the imaging chip.

[0032] Furthermore, the heterogeneous packaging includes the following steps:

[0033] 1) Attach the imaging chip to the center of the packaged tube substrate and make an opening at the top of the packaged tube to ensure that it does not obstruct the detection of optical signals;

[0034] 2) Position the microelectrode array above the imaging chip according to the designed markings, ensuring that they are vertically aligned;

[0035] 3) Connect the aligned imaging chip and microelectrode array contacts to the pins inside the package via leads;

[0036] 4) Wrap the leads with epoxy resin, leaving space above the imaging chip to ensure that the leads inside the epoxy resin are isolated from the external environment;

[0037] 5) Remove excess adhesive residue, wait for the epoxy resin to cure, and cut off any unnecessary connections.

[0038] The packaged casing uses a custom PLCC236 casing with 59 pins on each of its four sides, which are connected to the contacts of the imaging chip and the microelectrode array, respectively. The pins are connected to the subsequent optoelectronic integrated system by soldering, which can realize optoelectronic dual-mode detection.

[0039] The embodiments described above are illustrative and not intended to limit the invention. Any other implementations obtained by those skilled in the art under the guidance of the invention without departing from the principles of the invention are considered to be within the protection scope of the invention.

Claims

1. A dual-mode imaging electrical detector chip based on heterogeneous packaging, characterized in that, The device includes an imaging chip, a microelectrode array, leads, contacts, and a package housing. The microelectrode array is mounted on a separate substrate, which is optically transparent and biocompatible BF33 with a thickness of 100-300 μm. The microelectrode array includes a conductive thin film material disposed on the separate substrate and a surface insulating layer above the conductive thin film material. The imaging chip and the microelectrode array have the same custom markings for vertical alignment. The contacts of the imaging chip and the microelectrode array are connected to the package housing via heterogeneous encapsulation.

2. The imaging electrical dual-mode detection chip based on heterogeneous packaging according to claim 1, characterized in that, The imaging chip integrates a photosensitive element array and a readout circuit to capture incident light and focus it onto the photosensitive element. It can be fabricated using any fabrication process, has high resolution, and can achieve cell-level imaging of biological tissues.

3. The imaging electrical dual-mode detection chip based on heterogeneous packaging according to claim 1, characterized in that, The conductive thin film material used is Ti-Au or Cr-Au, with Ti or Cr serving as an intermediate layer to allow Au to adhere to the substrate surface. The thickness of Ti or Cr is 5. 20 nm, Au thickness is 100 300 nm。 4. The imaging electrical dual-mode detection chip based on heterogeneous packaging according to claim 1, characterized in that, The microelectrode array uses a conductive thin film material with a surface insulating layer on top. This insulating layer is made of silicon oxide and is deposited onto the conductive thin film material via plasma-enhanced chemical vapor deposition, with a thickness of 100 μm. 500 nm。 5. The imaging electrical dual-mode detection chip based on heterogeneous packaging according to claim 1, characterized in that, The microelectrode array has individual microelectrodes with a size of 1. Within a 100 μm range, the spacing between microelectrodes is 1 μm. Within a 1 mm range, contacts are connected to the edge via metal leads.

6. The imaging electrical dual-mode detection chip based on heterogeneous packaging according to claim 1, characterized in that, The size, dimensions, spacing, and arrangement of the microelectrode units in the microelectrode array can be adjusted as needed to meet the requirements of different experimental scenarios and the targets being detected.

7. A dual-mode imaging electrical detection chip based on heterogeneous packaging according to claim 1, wherein the heterogeneous packaging includes the following steps: attaching the imaging chip to the center of the packaging shell substrate, and making an opening at the top of the packaging shell to ensure that the detection of optical signals is not obstructed; positioning the microelectrode array at a designated position above the imaging chip according to the designed markings, ensuring that they are vertically aligned; connecting the contacts of the aligned imaging chip and microelectrode array to the pins inside the packaging shell through leads; wrapping the leads with epoxy resin, and leaving space above the imaging chip to ensure that the leads inside the epoxy resin are isolated from the external environment; removing excess residual adhesive, waiting for the epoxy resin to cure, and cutting off unnecessary connections.

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