IGBT power module

Abstract

The present invention relates to the technical field of manufacturing power semiconductor electrical component assemblies, and in particular to an IGBT power module. The IGBT power module includes a heat sink, a plurality of IGBT chips, a plastic-coated copper busbar assembly, and a driving board; one side of the heat sink is a mounting surface; the plurality of IGBT chips include an upper bridge chipset and a lower bridge chipset arranged at intervals on the mounting surface, and a plurality of chip pins are arranged on the opposite sides of the upper bridge chipset and the lower bridge chipset; the plastic-coated copper busbar assembly includes an injection molded body and a plurality of copper busbars, the injection molded body cover is arranged on the heat sink to seal the IGBT chip, one end of each copper busbar is exposed on the side of the injection molded body, and the other end is arranged in the injection molded body and is electrically connected to the chip pin; the driving board is arranged on the side of the injection molded body away from the heat sink, and the chip pins and the other ends of the copper busbars are bent toward the driving board and extend out of the injection molded body, and are electrically connected to the driving board. The present invention solves the problem of low integration of existing power modules and improves the miniaturization of IGBT power modules.

Description

Technical Field

[0001] The invention relates to the technical field of manufacturing power semiconductor electrical component assemblies, and in particular to an IGBT power module. Background Art

[0002] With the increasing development of new energy vehicles, IGBT (Insulate-Gate Bipolar Transistor) devices are widely used in the field of new energy vehicle technology. At present, they have become the main power devices in motor controllers, inverters and new energy charging piles in new energy vehicles.

[0003] However, due to the increasingly higher performance requirements for new energy vehicle drive systems, the number of IGBT chips and other components in IGBT power modules is increasing, and the chip circuits and pin arrangements are relatively complex, resulting in a low degree of integration of IGBT power modules and increasing module size, affecting the overall volume and weight of the final assembled product. Summary of the invention

[0004] The main purpose of the present invention is to provide an IGBT power module, aiming to solve the problem of low integration level of existing power modules.

[0005] To achieve the above-mentioned purpose, the present invention proposes an IGBT power module, which includes a heat sink, multiple IGBT chips, a plastic-coated copper busbar assembly and a driving board; one side of the heat sink is a mounting surface; the multiple IGBT chips include multiple upper bridge chipsets and multiple lower bridge chipsets arranged at intervals, the upper bridge chipsets and the lower bridge chipsets are arranged at intervals on the mounting surface, and multiple chip pins are provided on the sides facing each other of the upper bridge chipsets and the lower bridge chipsets; the plastic-coated copper busbar assembly includes an injection molded body and multiple copper buses, the injection molded body cover is arranged on the heat sink to seal the IGBT chips, one end of each copper busbar is exposed on the side of the injection molded body, and the other end is arranged in the injection molded body and is electrically connected to the chip pin; the driving board is arranged on a side of the injection molded body away from the heat sink, and the chip pins and the other ends of the copper busbars are bent toward the driving board and extend out of the injection molded body, and are electrically connected to the driving board.

[0006] In one embodiment of the present invention, the upper bridge chipset and the lower bridge chipset are parallel to each other, and the multiple upper bridge chips of the upper bridge chipset and the multiple lower bridge chips of the lower bridge chipset are arranged in sequence and spaced apart in a direction perpendicular to the central connecting line of the upper bridge chipset and the lower bridge chipset.

[0007] In one embodiment of the present invention, the plurality of copper bars are respectively a positive copper bar, a negative copper bar and a three-phase copper bar, each of the copper bars is formed with a plurality of copper bar pins bent toward the driving board, the plurality of copper bar pins of each positive copper bar are respectively connected to the chip pins of at least two upper bridge chips, the plurality of copper bar pins of each negative copper bar are respectively connected to the chip pins of at least two lower bridge chips, and the plurality of copper bar pins of each three-phase copper bar are respectively connected to the chip pins of at least two lower bridge chips and at least two upper bridge chips.

[0008] In one embodiment of the present invention, a plurality of mounting holes are provided on the surface of the injection-molded body, a plurality of limiting holes are provided on the surface of the driving board, and a chip pin of each of the IGBT chips extends out of one of the mounting holes and is welded in one of the limiting holes so that the IGBT chip is electrically connected to the driving board.

[0009] In one embodiment of the present invention, the IGBT power module also includes a current sensor, which includes a current plate and a Hall sensor installed on the current plate, the current plate is installed on the side of the injection molded body facing the drive board, the current plate is electrically connected to the drive board, and the Hall sensor collects the current of the copper bus and transmits the current signal to the drive board through the current plate.

[0010] In one embodiment of the present invention, the injection molded body is provided with a U-shaped adapter pin, both ends of the adapter pin extend out of the injection molded body, the current plate is provided with a first adapter hole, the drive plate is provided with a second adapter hole, and both ends of the adapter pin are respectively inserted into the first adapter hole and the second adapter hole to electrically connect the current plate to the drive plate.

[0011] In one embodiment of the present invention, the current sensor also includes a magnetic ring, which is arranged in the injection molded body, one end of the copper busbar passes through the magnetic ring, and a current sampling hole is opened on the surface of the injection molded body. One end of the Hall sensor is arranged in the magnetic ring, and the other end passes through the current sampling hole and the current plate, and is exposed on the side of the current plate facing away from the injection molded body.

[0012] In one embodiment of the present invention, a current calibration hole is opened on the surface of the injection-molded body, the current calibration hole corresponds to the copper busbar, and the current calibration hole is used to calibrate the current sensor.

[0013] In one embodiment of the present invention, a surface of the injection molding body is further provided with injection holes, and a plurality of the injection holes are provided. The plurality of injection holes are used to inject potting glue into the injection molding body to seal the IGBT chip.

[0014] In one embodiment of the present invention, the IGBT power module also includes a temperature sensor, which is electrically connected to the IGBT chip. One end of the temperature sensor is disposed in the injection molded body, and the other end extends out of the injection molded body and is electrically connected to the drive board to feed back the temperature of the IGBT chip to the drive board.

[0015] The IGBT power module proposed by the technical solution of the present invention includes a heat sink, a plurality of IGBT chips, a plastic-coated copper busbar assembly and a driving board arranged in sequence. Wherein the plurality of IGBT chips are divided into an upper bridge chipset and a lower bridge chipset, and the upper bridge chipset and the lower bridge chipset are provided with a plurality of chip pins on the opposite sides thereof for connecting an external circuit. And the chip pins are all bent toward the direction arranged on the driving board and connected with the driving board, and by arranging the plurality of chip pins towards each other so that the plurality of chip pins are spaced closer, the circuit elements matching the IGBT chip on the driving board can be designed more closely, the utilization rate of the driving board is improved, the driving board can be set to a smaller volume, and the integration of the IGBT power module is thereby improved. The plastic-coated copper busbar assembly includes an injection molding body and a plurality of copper busbars, and the injection molding body plays the role of protecting the installation copper busbar of the IGBT chip, and the copper busbar is used to connect the external power supply circuit with the IGBT chip and the driving board, and thus realize the control of the IGBT power module. By arranging the upper bridge chipset and the lower bridge chipset with the sides provided with chip pins facing each other, it is more convenient for the copper busbar to connect multiple IGBT chips at the same time, thereby reducing the number of copper busbars and improving the integration of the IGBT power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 It is a structural schematic diagram of the IGBT power module of the present invention;

[0018] Figure 2 for Figure 1 A top view of the IGBT power module shown;

[0019] Figure 3 for Figure 1 An exploded view of the IGBT power module is shown;

[0020] Figure 4 for Figure 3 The schematic diagram of the structure of the driver board in the IGBT power module shown;

[0021] Figure 5 for Figure 3 The structural schematic diagram of the injection molded body in the IGBT power module shown;

[0022] Figure 6 for Figure 3 The structural schematic diagram of the current sensor in the IGBT power module shown;

[0023] Figure 7 for Figure 3 Schematic diagram of the structure of the copper busbar in the IGBT power module shown.

[0024] Description of Figure Numbers:

[0025] Label name Label name 1 IGBT power module 44 Current detection hole 10 Heat sink 45 Current calibration hole 11 Heat sink 46 Injection hole 12 Mounting surface 47 The first temperature detection hole 20 Ceramic Substrate 48 Adapter pin 30 IGBT Chip 49 Socket 31 Chip Pins 50 Temperature Sensor 32 Bridge chip 60 Driver board 33 Lower bridge chip 61 Limit hole 40 Plastic coated copper busbar assembly 62 Second transfer hole 41 Injection molded body 63 Second temperature detection hole 42 Copper busbar 64 Positioning hole 421 Three-phase copper busbar 70 Current Sensors 422 Positive copper bus 71 Current Plate 423 Negative copper bus 72 Hall sensor 424 Copper busbar pins 73 First transfer hole 425 Fixing holes 74 Magnetic ring 426 Installation barrel 741 Cavity 43 Mounting holes

[0026] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. The meanings of "and / or" and "and / or" appearing in the full text are the same, both indicating that three parallel solutions are included. Taking "A and / or B as an example", it includes solution A, or solution B, or a solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0031] The present invention provides an IGBT power module 1 .

[0032] Combination Figure 1-Figure 3 As shown, in one embodiment of the present invention, the IGBT power module 1 includes a heat sink 10, a plurality of IGBT chips 30, a plastic-coated copper busbar assembly 40 and a driving board 60; one side of the heat sink 10 is a mounting surface 12; the plurality of IGBT chips 30 include an upper bridge chip group 32 and a lower bridge chip group 33, the upper bridge chip group 32 and the lower bridge chip group 33 are arranged at intervals on the mounting surface 12, and a plurality of chip pins 31 are arranged on the opposite side of the upper bridge chip group 32 and the lower bridge chip group 33; the plastic-coated copper busbar assembly 40 includes an injection molded body 41 and a plurality of copper busbars, the injection molded body 41 is covered on the heat sink 10 to seal the IGBT chip 30, one end of each copper busbar is exposed on the side of the injection molded body 41, and the other end is arranged in the injection molded body 41 and is electrically connected to the chip pin 31; the driving board 60 is arranged on the side of the injection molded body 41 away from the heat sink 10, and the chip pin 31 and the other end of the copper busbar are bent toward the driving board 60 and extend out of the injection molded body 41, and are electrically connected to the driving board 60.

[0033] In this embodiment, the material of the heat sink 10 can be aluminum, which improves the heat dissipation effect while reducing the structural weight. A plurality of heat dissipation columns 11 are convexly provided on the side of the heat sink 10 facing away from the mounting surface 12, thereby increasing the heat dissipation area of ​​the heat sink 10 and improving the heat dissipation effect. The injection molded body 41 can be a plastic part, fixed on one side of the mounting surface 12 of the heat sink 10, and is used to protect the IGBT chip 30. The copper busbar is used to electrically connect the external circuit with the IGBT chip 30 and the drive board 60. The plurality of copper busbars are arranged in the injection molded body 41, and the injection molded body 41 has an insulating effect to avoid short circuits between the plurality of copper busbars. One end of the copper busbar is arranged on the outside of the injection molded body 41, and the other end is arranged in the injection molded body 41, and is connected to the IGBT chip 30. The present invention also arranges the driving board 60 on a side of the injection-molded body 41 away from the heat sink 10. The chip pins 31 of the IGBT chip 30 and one end of the copper busbar arranged in the injection-molded body 41 are bent toward the driving board 60 and extend out of the injection-molded body 41 to be connected to the driving board 60, thereby avoiding the problem of the overall volume of the module being larger due to the peripheral drive matching circuit board, thereby improving the integration of the IGBT power module 1.

[0034] The multiple IGBT chips 30 include an upper bridge chip group 32 and a lower bridge chip group 33, which are respectively used to control the switch and power output of the IGBT power module 1. The driver board 60 is provided with multiple circuit elements matching the upper bridge chip 32 and the lower bridge chip 33, so the upper bridge chip group 32 and the lower bridge chip group 33 are arranged back to back, that is, the upper bridge chip 32 and the lower bridge chip 33 are arranged on the side with the chip pin 31 facing each other, so as to facilitate the adjacent arrangement of multiple circuit elements on the driver board 60, thereby improving the utilization rate of the driver board 60, and also facilitating the driver board 60 to be set to a smaller volume, thereby further improving the integration of the IGBT power module 1. At the same time, the upper bridge chip group 32 and the lower bridge chip group 33 are arranged back to back, and a larger space is left on the side of the upper bridge chip group 32 and the lower bridge chip group 33 away from the chip pin 31, which is more conducive to the arrangement of components such as the temperature sensor 50, and at the same time, it is convenient to arrange more IGBT chips 30, further improving the integration of the IGBT power module 1.

[0035] Combination Figure 3 As shown, in one embodiment of the present invention, the upper bridge chip group 32 and the lower bridge chip group 33 are parallel to each other, and the multiple upper bridge chips 32 of the upper bridge chip group 32 and the multiple lower bridge chips 33 of the lower bridge chip group 33 are arranged in sequence and spaced apart in a direction perpendicular to the center connection line of the upper bridge chip group 32 and the lower bridge chip group 33.

[0036] In this embodiment, a plurality of IGBT chips 30 are arranged in an array, wherein a plurality of upper bridge chips 32 and a plurality of lower bridge chips 33 can be arranged in sequence along the length direction of the heat sink 10. Each upper bridge chip 32 is arranged oppositely to a lower bridge chip 33 along the width direction of the heat sink 10, and the chip pins 31 of the two are adjacent and arranged oppositely. This design can improve the arrangement convenience of the circuit elements connected to the chip pins 31 on the driving board 60 and the utilization rate of the driving board 60, and further improve the integration of the IGBT module.

[0037] Combination Figure 2 , Figure 3 and Figure 7 As shown, in one embodiment of the present invention, the multiple copper bars are respectively a positive copper bar 422, a negative copper bar 423 and a three-phase copper bar 421, each copper bar is formed with a plurality of copper bar pins 424 bent toward the driving board 60, the multiple copper bar pins 424 of each positive copper bar 422 are respectively connected to the chip pins 31 of at least two upper bridge chips 32, the multiple copper bar pins 424 of each negative copper bar 423 are respectively connected to the chip pins 31 of at least two lower bridge chips 33, and the multiple copper bar pins 424 of each three-phase copper bar 421 are respectively connected to the chip pins 31 of at least two lower bridge chips 33 and at least two upper bridge chips 32.

[0038] In this embodiment, a plurality of pins extend from one side of the IGBT chip 30, and the plurality of pins are respectively connected to the emitter, collector and gate of the IGBT chip 30 to realize the switch control of the IGBT chip 30. The positive copper bar 422 and the negative copper bar 423 are provided at one end outside the injection molding body 41, and a mounting cylinder 426 is convexly provided, and the injection molding body 41 is recessed to form a plug hole 49, and the sleeve is inserted into the plug hole 49, so that the positive copper bar 422 and the negative copper bar 423 are installed on the injection molding body 41. Both ends of the sleeve are through, and a fixing hole 425 is exposed at the end of the copper bar, and the fixing hole 425 is exposed on the outside of the IGBT power module 1, so that the external power plug can be inserted into the fixing hole 425 to supply power to the IGBT module. Each positive copper bar 422, negative copper bar 423 and three-phase copper bar 421 is arranged in the injection molded body 41 at one end away from the fixing hole 425, and extends a plurality of copper bar pins 424. Among them, two copper bar pins 424 are extended from the end of the positive copper bar 422 away from the fixing hole 425, which are respectively connected to the collector chip pins 31 of two adjacent upper bridge chips 32, and two copper bar pins 424 are extended from a point of the negative copper bar 423 away from the fixing hole 425, and are respectively connected to the emitter chip pins 31 of two adjacent lower bridge chips 33. Four copper bar pins 424 are extended from the end of the three-phase copper bar 421 away from the fixing hole 425, and are respectively connected to the gate chip pins 31 of two adjacent upper bridge chips 32 and the gate chip pins 31 of two adjacent lower bridge chips 33. By arranging the upper bridge chip 32 and the lower bridge chip 33 back to back, that is, arranging the chip pins 31 adjacent to each other, each positive copper bar 422, each negative copper bar 423, and each three-phase copper bar 421 can simultaneously control multiple upper bridge chips 32 and / or multiple lower bridge chips 33, thereby reducing the amount of copper bars used and improving the integration of the IGBT power module 1.

[0039] Combination Figure 3-Figure 5 As shown, in one embodiment of the present invention, a plurality of mounting holes 43 are provided on the surface of the injection-molded body 41, and a plurality of limiting holes 61 are provided on the surface of the driving board 60. The chip pin 31 of each IGBT chip 30 extends out of a mounting hole 43 and is welded in a limiting hole 61 so that the IGBT chip 30 is electrically connected to the driving board 60.

[0040] In this embodiment, since the upper bridge chip 32 and the lower bridge chip 33 are designed back to back, the mounting holes 43 provided on the injection molding body 41 and the limiting holes 61 on the driving board 60 are also arranged adjacent to each other, so as to reduce the spacing between the multiple mounting holes 43 and the multiple limiting holes 61, so as to improve the utilization rate of the injection molding body 41 and the driving board 60. It can be understood that the copper bar pins 424 and the chip pins 31 that need to be electrically connected can be inserted into the same limiting hole 61, and the copper bar pins 424, the chip pins 31 and the driving board 60 are electrically connected by soldering. The limiting holes 61 play the role of positioning the copper bar pins 424 and the chip pins 31, improve the stability of the connection, and at the same time avoid the occurrence of short circuits between pins that do not need to be connected, thereby improving the reliability of the IGBT power module 1. A positioning pin is also protruding from one side of the injection molding body 41 facing the driving board 60, and a positioning hole 64 is opened on the driving board 60. When the driving board 60 and the injection molding body 41 are installed, the positioning pin is correspondingly inserted into the positioning hole 64 to improve the convenience of installing the driving board 60 and the injection molding body 41 and the accuracy of the alignment of the chip pin 31 and the copper busbar pin 424 with the limiting hole 61.

[0041] Combination Figure 1 and Figure 6 As shown, in one embodiment of the present invention, the IGBT power module 1 also includes a current sensor 70, the current sensor 70 includes a current plate 71 and a Hall sensor 72 installed on the current plate 71, the current plate 71 is installed on the side of the injection molded body 41 facing the drive board 60, the current plate 71 is electrically connected to the drive board 60, and the Hall sensor 72 collects the current of the copper bus and transmits the current signal to the drive board 60 through the current plate 71.

[0042] In the present embodiment, one end of the Hall sensor 72 is arranged in the injection molding body 41 and close to the three-phase copper busbar 421. By inducing the magnetic flux lines of the copper busbar current and converting the magnetic signal into an electrical signal, the electrical signal is transmitted to the drive board 60 through the current board 71 to monitor the change of the output current of the copper busbar. A cavity can be opened at one end of the injection molding body 41, and the copper busbar portion and one end of the Hall sensor 72 are arranged in the cavity to realize the collection and detection of the copper busbar current. The surface of the injection molding body 41 is provided with a current detection hole 44 connected to the cavity, and the other end of the Hall sensor 72 extends out of the current detection hole 44 to facilitate connection with an external current sampling device. The shape of the current detection hole 44 is adapted to the shape of the Hall sensor 72, and the number is the same. It can be understood that the number of the Hall sensor 72 is the same as the number of the three-phase copper busbar 421, which is three, and the position corresponds to the corresponding data of the three-phase current of the IGBT power module 1UVW.

[0043] Please continue to refer to Figure 1 and Figure 6In one embodiment of the present invention, the injection molded body 41 is provided with a U-shaped adapter pin 48, both ends of the adapter pin 48 extend out of the injection molded body 41, the current plate 71 is provided with a first adapter hole 73, and the drive plate 60 is provided with a second adapter hole 62, and both ends of the adapter pin 48 are respectively inserted into the first adapter hole 73 and the second adapter hole 62, so that the current plate 71 is electrically connected to the drive plate 60.

[0044] In this embodiment, a U-shaped adapter pin 48 is provided at one end of the injection molded body 41 where the current sensor 70 is provided, the middle part of the U-shaped adapter pin 48 is fixed in the injection molded body 41, and the two ends of the adapter pin 48 extend out of the injection molded body 41. The material of the adapter pin 48 can be a metal material such as copper and aluminum. By connecting the two ends of the adapter pin 48 to the first adapter hole 73 of the current plate 71 and the second adapter hole 62 of the drive plate 60, the current plate 71 and the drive plate 60 are electrically connected. This design method avoids the steps of wiring and wiring caused by the wiring harness connection. At the same time, the structure is simple, the space occupied is small, and the integration of the IGBT power module 1 is improved. It can be understood that there are multiple adapter pins 48, the first adapter hole 73 and the second adapter hole 62 to improve the connection reliability of the drive plate 60 and the current plate 71.

[0045] Combination Figure 3 and Figure 6 As shown, in one embodiment of the present invention, the current sensor 70 also includes a magnetic ring 74, which is disposed in the injection molded body 41, one end of the copper busbar passes through the magnetic ring 74, and a current sampling hole is opened on the surface of the injection molded body 41. One end of the Hall sensor 72 is disposed in the magnetic ring 74, and the other end passes through the current sampling hole and the current plate 71, and is exposed on the side of the current plate 71 facing away from the injection molded body 41.

[0046] In this embodiment, the cross-sectional shape of the magnetic ring 74 is annular, and the magnetic ring 74 is arranged in the injection molded body 41. A cavity 741 with two ends opened is formed in the magnetic ring 74. One end of the three-phase copper busbar 421 provided with a fixing hole 425 passes through the cavity 741 of the magnetic ring 74 and is exposed on the outside of the injection molded body 41. At the same time, one end of the Hall sensor 72 is arranged in the magnetic ring 74. The magnetic ring 74 gathers the magnetic flux lines generated by the copper busbar to improve the detection accuracy of the Hall sensor 72 for the copper busbar current.

[0047] Combination Figure 3 and Figure 5 As shown, in one embodiment of the present invention, a current calibration hole 45 is opened on the surface of the injection-molded body 41 , the current calibration hole 45 corresponds to the copper busbar, and the current calibration hole 45 is used to calibrate the current sensor 70 .

[0048] In this embodiment, the number of current calibration holes 45 is the same as that of three-phase copper busbar 421, and the position corresponds to the upper and lower positions of three-phase copper busbar 421, that is, the three-phase copper busbar 421 disposed in the injection molded body 41 is partially exposed in the current calibration hole 45, and the shape and size of the current calibration hole 45 can be designed according to the shape and size of the current calibration tool. After the current sensor 70 is assembled, the current calibration tool is connected to the three-phase copper busbar 421 through the current calibration hole 45, thereby realizing the calibration of the current sensor 70 and improving the sampling accuracy of the current sensor 70 for the current of the three-phase copper busbar 421.

[0049] Combination Figure 5 As shown, in one embodiment of the present invention, a surface of the injection molding body 41 is further provided with injection holes 46 , and a plurality of injection holes 46 are provided. The plurality of injection holes 46 are used to inject potting glue into the injection molding body 41 to seal the IGBT chip 30 .

[0050] In this embodiment, by opening an injection hole 46 on the surface of the injection molding body 41, when the injection molding body 41 and the heat sink 10 are packaged, the IGBT chip 30 is arranged between the injection molding body 41 and the heat sink 10, and at this time, the potting glue is poured into the injection molding body 41 through the injection hole 46, and the potting glue covers the surface of the IGBT chip 30, thereby realizing the protection of the IGBT chip 30. The potting glue can be an AB mixed glue, which can isolate the IGBT chip 30 from moisture and dust, and has a high dielectric constant, so as to prevent static electricity, short circuit and other problems between the IGBT chips 30. The injection hole 46 can be set at two places, and they correspond to the upper bridge chip 32 and the lower bridge chip 33 respectively, so as to improve the uniformity of the potting glue.

[0051] Combination Figure 3 As shown, in one embodiment of the present invention, the IGBT power module 1 also includes a temperature sensor 50, which is electrically connected to the IGBT chip 30. One end of the temperature sensor 50 is disposed in the injection molding body 41, and the other end extends out of the injection molding body 41 and is electrically connected to the drive board 60 to feed back the temperature of the IGBT chip 30 to the drive board 60.

[0052] In this embodiment, a ceramic substrate 20 is arranged between each IGBT chip 30 and the heat sink 10 to improve the heat dissipation effect of the IGBT chip 30 and avoid short circuit with the heat sink 10. The temperature sensor 50 is arranged on the ceramic substrate 20 and is arranged at a distance from the IGBT chip 30. At the same time, the electrical connection between the temperature sensor 50 and the IGBT chip 30 is realized through the copper sheet on the surface of the ceramic substrate 20 to achieve the purpose of temperature monitoring of the IGBT chip 30. A plurality of temperature sensors 50 can be arranged, which are respectively arranged on a plurality of ceramic substrates 20 to achieve temperature monitoring of a plurality of IGBT chips 30. The temperature sensor 50 includes a temperature measuring terminal and a thermistor. A first temperature detection hole 47 is opened on the surface of the injection molding body 41, and a second temperature detection hole 63 is opened on the surface of the driving board 60. The positions of the first temperature detection hole 47 and the second temperature detection hole 63 correspond to each other, and the shapes are adapted to the temperature measuring terminal. One end of the temperature measuring terminal is attached to the ceramic substrate 20, and the other end extends out and passes through the first temperature detection hole 47 and the second temperature detection hole 63 in sequence, and is electrically connected to the driving board 60, so that the temperature signal is fed back to the driving board 60. By integrating the temperature sensor 50 into the IGBT power module 1, the structural volume is reduced, the integration of the IGBT power module 1 is further improved, and the purpose of miniaturization is achieved.

[0053] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An IGBT power module, characterized in that: The IGBT power module comprises: A heat sink, one side of which is a mounting surface; A plurality of IGBT chips, wherein the plurality of IGBT chips include an upper bridge chipset and a lower bridge chipset, wherein the upper bridge chipset and the lower bridge chipset are spaced apart from each other on the mounting surface, and a plurality of chip pins are disposed on the sides of the upper bridge chipset and the lower bridge chipset facing each other; A plastic-coated copper busbar assembly, the plastic-coated copper busbar assembly comprising an injection-molded body and a plurality of copper busbars, the injection-molded body being covered on the heat sink to seal the IGBT chip, one end of each of the copper busbars being exposed on a side of the injection-molded body, and the other end being disposed in the injection-molded body and electrically connected to the chip pins; and A driving board, the driving board is arranged on a side of the injection molding body away from the heat sink, the chip pins and the other end of the copper bar are bent toward the driving board and extend out of the injection molding body, and are electrically connected to the driving board; A current sensor, the current sensor comprising a current plate and a Hall sensor mounted on the current plate, the current plate being mounted on a side of the injection molded body facing the drive plate, the Hall sensor collecting the current of the copper busbar and transmitting the current signal to the drive plate through the current plate; The injection molded body is provided with a U-shaped transfer pin, both ends of which extend out of the injection molded body, the current plate is provided with a first transfer hole, the drive plate is provided with a second transfer hole, and both ends of the transfer pin are respectively inserted into the first transfer hole and the second transfer hole, so that the current plate is electrically connected to the drive plate; A cavity is formed at one end of the injection molded body, one end of the Hall sensor is arranged in the cavity, a current detection hole connected to the cavity is formed on the surface of the injection molded body, and the other end of the Hall sensor extends out of the current detection hole and is used for an external current sampling device.

2. The IGBT power module according to claim 1, characterized in that: The upper bridge chipset and the lower bridge chipset are parallel to each other, and the multiple upper bridge chips of the upper bridge chipset and the multiple lower bridge chips of the lower bridge chipset are sequentially spaced in a direction perpendicular to a central connection line between the upper bridge chipset and the lower bridge chipset.

3. The IGBT power module according to claim 2, characterized in that: The multiple copper bars are respectively a positive copper bar, a negative copper bar and a three-phase copper bar, each of the copper bars is formed with a plurality of copper bar pins bent toward the driving board, the multiple copper bar pins of each positive copper bar are respectively connected to the chip pins of at least two upper bridge chips, the multiple copper bar pins of each negative copper bar are respectively connected to the chip pins of at least two lower bridge chips, and the multiple copper bar pins of each three-phase copper bar are respectively connected to the chip pins of at least two lower bridge chips and at least two upper bridge chips.

4. The IGBT power module according to claim 3, characterized in that: The surface of the injection molded body is provided with a plurality of mounting holes, the surface of the drive board is provided with a plurality of limiting holes, the chip pin of each IGBT chip extends out of one of the mounting holes and is welded in one of the limiting holes so that the IGBT chip is electrically connected to the drive board.

5. The IGBT power module according to any one of claims 1 to 4, characterized in that: The current sensor also includes a magnetic ring, which is arranged in the injection molded body. One end of the copper busbar passes through the magnetic ring. A current sampling hole is opened on the surface of the injection molded body. One end of the Hall sensor is arranged in the magnetic ring, and the other end passes through the current sampling hole and the current plate and is exposed on the side of the current plate facing away from the injection molded body.

6. The IGBT power module according to any one of claims 1 to 4, characterized in that: A current calibration hole is provided on the surface of the injection-molded body, the current calibration hole corresponds to the copper busbar, and the current calibration hole is used to calibrate the current sensor.

7. The IGBT power module according to any one of claims 1 to 4, characterized in that: The surface of the injection molding body is also provided with injection molding holes, and a plurality of the injection molding holes are provided. The plurality of the injection molding holes are used to inject potting glue into the injection molding body to seal the IGBT chip.

8. The IGBT power module according to any one of claims 1 to 4, characterized in that: The IGBT power module also includes a temperature sensor, which is electrically connected to the IGBT chip. One end of the temperature sensor is disposed in the injection molded body, and the other end extends out of the injection molded body and is electrically connected to the drive board to feed back the temperature of the IGBT chip to the drive board.

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