Selective wave soldering apparatus

Abstract

The application provides a selective wave-soldering device, which comprises a rotating soldering mechanism and a conveying mechanism for conveying a PCB to a soldering station, and the rotating soldering mechanism comprises a base, a soldering assembly, a rotating assembly, a lifting assembly and an adjusting assembly; the soldering assembly comprises a total fixed plate and two soldering furnaces movably arranged on the total fixed plate, the soldering furnaces spray tin peaks to implement soldering from the bottom of the PCB, and the soldering furnaces move up and down relative to the total fixed plate; the rotating assembly is arranged on the base and can drive the soldering assembly to rotate; the lifting assembly can drive the soldering assembly to lift; and the adjusting assembly can form a height difference between the two soldering furnaces. Thus, different soldering process requirements can be met at the same time, the structure is compact, and the soldering efficiency is high; the rotation of the two soldering furnaces and the formation of the height difference of the soldering position prevent the soldering nozzle from colliding with electronic components on the PCB during soldering, thereby preventing the product from being damaged.

Description

Technical Field

[0001] This invention relates to the field of welding equipment technology, and in particular to a selective wave soldering apparatus. Background Technology

[0002] Wave soldering machines are commonly used for mass soldering of electrical components with inserted wires and DIP packages on PCBs. With the continuous development of SMT (Surface Mount Technology) technology, selective wave soldering machines are becoming increasingly widely used. Traditional wave soldering machines have open solder pots, where molten solder easily reacts chemically with air, producing solder dross, which affects the solder joint quality and the electrical performance of the PCBA. Furthermore, existing selective wave soldering machines can only provide one soldering process per cycle, failing to simultaneously meet the needs of different soldering processes for the same product, and also suffer from large size and poor integration.

[0003] Chinese invention patent CN201611006043.6 discloses a desktop selective wave soldering machine. A movable mounting frame is installed on the upper side of a fixed mounting base, and a movable support plate is mounted on the movable mounting frame. A solder pump assembly is installed on the lower side of the movable support plate on the fixed mounting base. A Y-axis drive linear module is installed on the fixed mounting base, and a Z-axis drive linear module is installed at the drive end of the Y-axis drive linear module. An X-axis drive linear module is installed on the movable mounting frame. The solder pump assembly includes a solder pump mounting frame, a solder pot assembly, and a solder liquid pumping mechanism. The solder pot assembly includes a solder pot body, a solder pot cover, and an electric heating plate. The solder liquid pumping mechanism includes a housing base, a housing panel, a drive impeller, a drive shaft, a pumping drive motor, and a solder liquid nozzle. This desktop selective wave soldering machine is equipped with a controller. However, due to the single solder pump assembly, it is difficult to meet the multi-process soldering requirements of single boards with different solder joint processes for the same product.

[0004] Therefore, it is necessary to design a selective wave soldering device to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a PCB selective wave soldering device that can simultaneously meet the different welding process requirements of the same product, has a compact structure, and high welding efficiency.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a selective wave soldering device, comprising a rotary soldering mechanism and a conveying mechanism for transporting a PCB board to a soldering station. The rotary soldering structure includes a base, a soldering assembly, a rotating assembly, a lifting assembly, and an adjusting assembly. The soldering assembly includes a main fixed plate and two soldering furnaces movably mounted on the main fixed plate. The soldering furnaces eject solder peaks from the bottom of the PCB board for soldering, and the soldering furnaces move up and down relative to the main fixed plate. The rotating assembly is mounted on the base and can drive the soldering assembly to rotate. The lifting assembly can drive the soldering assembly to rise and fall. The adjusting assembly is adapted to prevent the two soldering furnaces from colliding with the PCB board during soldering, and includes a cam that can adjust the height difference between the two soldering furnaces.

[0007] As a further improved technical solution of the present invention, the welding furnace includes a furnace body, a nozzle, an upper fixing plate for fixing the furnace body, a lower fixing plate, and a plurality of fixing rods connecting the upper fixing plate and the lower fixing plate, wherein the upper fixing plate is disposed in the circumferential direction of the furnace body.

[0008] As a further improvement of the present invention, the fixing rod passes through the main fixing plate, the main fixing plate is provided with a linear bearing, and the lower surface of the upper fixing plate is provided with a shaft fixing seat for mounting the fixing rod.

[0009] As a further improvement of the present invention, the nozzle is a fine-hole nozzle, a long nozzle, or an irregularly shaped nozzle.

[0010] As a further improvement of the present invention, the furnace body is an intelligent electromagnetic induction pump tin furnace, and the furnace body includes a titanium inner liner and an external heating plate.

[0011] As a further improvement of the present invention, the rotating component includes a fixed gear fixed on the base, a rotating bearing, a rotating shaft, a rotating motor fixed to the rotating shaft, and a movable gear driven by the rotating motor. The movable gear meshes with the fixed gear to drive the rotating shaft and the welding component to rotate.

[0012] As a further improvement of the present invention, the lifting assembly includes a rotating platform fixed to the rotating shaft, a lifting motor, a lead screw, and a scissor arm disposed on the rotating platform. The scissor arm is disposed between the main fixed plate and the rotating platform, and the lifting motor drives the main fixed plate to lift and lower through the lead screw and the scissor arm.

[0013] As a further improvement of the present invention, the adjustment component includes a cam disposed on the base, the cam being located in the circumferential direction of the welding furnace, and a fisheye bearing being provided at the bottom of the welding furnace. When one of the welding furnaces rotates to above the cam, the fisheye bearing cooperates with the cam to lift the welding furnace.

[0014] As a further improvement of the present invention, a laser temperature compensation component is also included. The laser temperature compensation component is disposed above the main fixing plate and close to the nozzle to heat and compensate the PCB board.

[0015] As a further improved technical solution of the present invention, the rotary welding mechanism also includes a vision component, which is used to perform optical acquisition and inspection of the PCB board, and is disposed on the upper surface of the main fixing plate and located between the welding furnaces.

[0016] As a further improved technical solution of the present invention, the conveying mechanism is located above the welding assembly, and includes a bracket, two conveying tracks arranged side by side, a roller group or chain set on the conveying track, and a conveying motor that drives the roller group or chain. The PCB board moves under the drive of the two roller groups or chains.

[0017] As a further improvement of the present invention, the conveying mechanism further includes a width adjustment component for adjusting the width between the two conveying tracks. The width adjustment component includes a width adjustment screw, a width adjustment screw nut, and a width adjustment motor. The width adjustment screw and the width adjustment screw nut drive one of the conveying tracks to move closer to or further away from the other conveying track.

[0018] As a further improvement of the present invention, the conveying mechanism further includes positioning components disposed on two conveying tracks. Each positioning component includes a positioning cylinder, an output rod, a support base and a positioning plate connected in sequence. The positioning cylinder drives the positioning plate to move in a direction perpendicular to the PCB board. The positioning plate cooperates with the roller assembly to clamp the PCB board to fix it.

[0019] As a further improvement of the present invention, sensors are provided at the front end, middle and rear end of the conveying mechanism. The sensors are connected to the control system to identify the position of the PCB board entering the conveying track, and control the conveying motor and the positioning component to operate according to the position information of the PCB board.

[0020] As a further improvement of the present invention, a moving mechanism is also provided below the rotary welding mechanism. The moving mechanism can drive the rotary welding mechanism to move. The moving mechanism includes an X-axis module and a Y-axis module.

[0021] As a further improvement of the present invention, it also includes an AOI inspection module, which can directly check the yield of the solder joints after soldering is completed, and determine whether the PCB board needs to be re-soldered or an alarm is triggered after it is moved out of the workstation based on the results.

[0022] As can be seen from the above technical solutions, the selective wave soldering device of the present invention, by setting two rotatable soldering furnaces, can solder different positions on the same PCB board. It can be specifically set to adapt to different solder joint sizes, meet different soldering process requirements, and has a compact structure and high soldering efficiency. In addition, by setting an adjustment component, a height difference is formed between the rotation and soldering positions of the two soldering furnaces, preventing the soldering furnaces from colliding with the PCB board during the soldering process and causing damage to the product. Attached Figure Description

[0023] Figure 1 This is a perspective view of a selective wave soldering apparatus for PCB boards according to an embodiment of the present invention.

[0024] Figure 2 for Figure 1 A three-dimensional view of the rotary welding mechanism.

[0025] Figure 3 for Figure 2 The front view of the rotary welding mechanism.

[0026] Figure 4 for Figure 2 Side view of the rotary welding mechanism.

[0027] Figure 5 for Figure 1 A three-dimensional view of the conveyor mechanism.

[0028] Figure 6 for Figure 1 A three-dimensional view of the conveyor mechanism from another angle.

[0029] Figure 7 for Figure 6 A magnified view of the positioning component. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Please refer to Figure 1 As shown, the present invention provides a selective wave soldering apparatus, which includes a rotary soldering mechanism 10, a conveying mechanism 20, and a moving mechanism 30. The rotary soldering mechanism 10 is used to solder the points to be soldered on the PCB board. The conveying mechanism 20 is located above the rotary soldering mechanism 10 and is used to convey the PCB board to the rotary soldering mechanism 10. The moving mechanism 30 is located below the rotary soldering mechanism 10 to drive the rotary soldering mechanism 10 to move. The moving mechanism 30 includes an X-axis module 301 and a Y-axis module 302.

[0032] Please refer to Figure 2 and Figure 3As shown, the rotary welding mechanism 10 includes a base 11, a welding assembly 12, a rotating assembly 13, a lifting assembly 14, and an adjusting assembly 15. The welding assembly 12 includes a main fixing plate 121 and two welding furnaces 121 movably mounted on the main fixing plate 120. The welding furnaces 121 spray solder peaks from the bottom of the PCB board for welding. Specifically, the welding furnace 121 includes a furnace body 122, a nozzle 123, an upper fixing plate 124 and a lower fixing plate 125 that fix the furnace body 122, and multiple fixing rods 126 that connect the upper fixing plate 124 and the lower fixing plate 125. The upper fixing plate 124 is located in the circumferential direction of the furnace body 121. The fixing rods 126 pass through the main fixing plate 120, and the welding furnace 121 can move up and down relative to the main fixing plate 120. The main fixing plate 120 is provided with a linear bearing 127, and the lower surface of the upper fixing plate 124 is provided with a shaft fixing seat 128 for mounting the fixing rods 126. Nozzle 123 is a fine-hole nozzle, a long nozzle or an irregularly shaped nozzle, and furnace body 122 is an intelligent electromagnetic induction pump soldering furnace, which includes a titanium inner liner and an external heating plate.

[0033] Please refer to Figure 2 and Figure 4 As shown, the rotating assembly 13 is mounted on the base 11 and is used to drive the welding assembly 12 to rotate. The rotating assembly 13 includes a fixed gear 131 fixed on the base 11, a rotating bearing, a rotating shaft, a rotating motor 134 fixed to the rotating shaft, and a movable gear 135 driven by the rotating motor 134. The movable gear 135 meshes with the fixed gear 131 to drive the rotating shaft and the welding assembly 12 to rotate.

[0034] The lifting assembly 14 is used to lift and lower the welding assembly 12. Please refer to... Figure 2 , Figure 3 and Figure 4 As shown, the lifting assembly 14 includes a rotating platform 141 fixed to the rotating shaft, a lifting motor 142, a lead screw 143, and a scissor arm 144 mounted on the rotating platform 141. The scissor arm 144 is located between the main fixed plate 120 and the rotating platform 141. The lifting motor 142 drives the main fixed plate 120 to rise and fall through the lead screw 143 and the scissor arm 144, thereby driving the two welding furnaces 121 to rise and fall.

[0035] Adjustment component 15 is used to create a height difference between the two welding furnaces 121. Please refer to... Figure 3 As shown, the adjustment assembly 15 includes a cam 151 mounted on the base 11 and a fisheye bearing 152 mounted at the bottom of the soldering furnace 121. The cam 151 is located in the circumferential direction of the soldering furnace 121. When one of the soldering furnaces 121 rotates above the cam 151, the fisheye bearing 152 cooperates with the cam 151 to lift the soldering furnace 121. It can be understood that when it is raised to the working position, it can be automatically locked by a pin. This design prevents the two soldering furnaces 121 from colliding with the PCB board during the soldering process.

[0036] Please refer to Figure 2 As shown, the rotary welding mechanism 10 also includes a vision component 16 and a laser temperature compensation component (not shown). The vision component 16 is used for optical acquisition and inspection of the PCB board 100 being welded. The vision component 16 is located on the upper surface of the main fixing plate 120 and between the welding furnaces 121. It also includes an AOI inspection module, which can directly check the yield of the solder joints after soldering is completed. Based on the results, it can determine whether the PCB board needs to be re-welded or whether an alarm should be triggered after it is removed from the welding station.

[0037] The laser temperature compensation component is positioned above the main fixing plate 120 and close to the nozzle 123 to heat and compensate for the temperature of the PCB board. The temperature compensation function depends on the product manufacturing process. The PCB far from the preheating zone will experience a drop in temperature, affecting the product's soldering yield, thus requiring temperature compensation to improve the soldering yield.

[0038] The conveyor mechanism 20 is used to transport the PCB board to the soldering station of the soldering assembly 11. Please refer to... Figure 5 As shown, the conveying mechanism 20 includes a support 21, two conveying tracks 22 arranged side by side, a roller assembly 23 mounted on the conveying tracks 22, and a conveying motor 24 driving the roller assembly 23. The PCB board 100 moves under the drive of the two roller assemblies 23. In other embodiments, the roller assembly 23 can be replaced by a chain drive.

[0039] The conveying mechanism 20 also includes a width adjustment assembly 25 for adjusting the width between the two conveying tracks 22. The width adjustment assembly 25 includes a width adjustment screw 251, a width adjustment screw nut 252, and a width adjustment motor 253. The width adjustment screw 251 and the width adjustment screw nut 252 drive one of the conveying tracks 22 to move closer to or further away from the other conveying track 22. Preferably, the width adjustment assembly 25 includes two sets of parallel width adjustment screws 251 and width adjustment screw nuts 252, and the width adjustment motor 253 drives the two width adjustment screws 251 to move simultaneously through gear transmission.

[0040] Please refer to Figure 6 and Figure 7 As shown, the conveying mechanism 20 also includes positioning components 27 respectively disposed on two conveying tracks 22. Each positioning component 27 includes a positioning cylinder 271, an output rod 272, a support base 273, and a positioning plate 274 connected in sequence. The positioning cylinder drives the positioning plate 274 to move in a direction perpendicular to the PCB board. The positioning plate 274 cooperates with the roller assembly 23 to clamp and fix the PCB board. In addition, sensors are provided at the front end, middle, and rear end of the conveying mechanism 20. The sensors are connected to the control system to identify the position of the PCB board 100 entering the conveying track 22, and control the conveying motor 24 and the positioning components 27 to operate according to the position information of the PCB board 100.

[0041] During operation, the PCB board is transported online to the designated position via the conveying mechanism 20. First, the vision component 16 calculates the position on the PCB board to be soldered. The control system then calculates the accurate value and drives the moving mechanism 30 to accurately move the rotating soldering mechanism 10 to the designated position for precise soldering.

[0042] In summary, the selective wave soldering apparatus for PCB boards of the present invention, by setting two rotatable soldering furnaces, can solder different positions on the same PCB board. It can be specifically set to adapt to different solder joint sizes, meet different soldering process requirements, and has a compact structure and high soldering efficiency. In addition, by setting an adjustment component, a height difference is formed between the two soldering furnaces during rotation and soldering position, preventing the soldering furnaces from colliding with the PCB board during soldering and causing damage to the product.

[0043] The terms used herein, such as "upper" and "lower," indicating spatial relative position, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0044] Furthermore, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on those skilled in the art. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present invention. All technical solutions and improvements that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A selective wave soldering device, characterized in that, The system includes a rotary welding mechanism and a conveying mechanism for transporting PCB boards to the welding station. The rotary welding mechanism comprises a base, a welding assembly, a rotating assembly, a lifting assembly, and an adjusting assembly. The welding assembly includes a main fixing plate and two welding furnaces movably mounted on the main fixing plate. The welding furnaces spray solder peaks to perform welding from the bottom of the PCB board. The welding furnaces can move up and down relative to the main fixing plate. The rotating component is mounted on the base and can drive the welding component to rotate. The rotating component includes a fixed gear, a rotary bearing, a rotating shaft, a rotary motor fixed to the base, and a movable gear driven by the rotary motor. The movable gear meshes with the fixed gear to drive the rotating shaft and the welding component to rotate. The lifting assembly can drive the welding assembly to rise and fall; the lifting assembly includes a rotating platform fixed to the rotating shaft, a lifting motor, a lead screw and a scissor arm disposed on the rotating platform, the scissor arm being disposed between the main fixed plate and the rotating platform, and the lifting motor driving the main fixed plate to rise and fall through the lead screw and the scissor arm; The adjustment assembly is adapted to prevent the two soldering furnaces from colliding with the PCB board during soldering. It includes a cam that can adjust the height difference between the two soldering furnaces. The cam includes a cam mounted on a base. The cam is located in the circumferential direction of the soldering furnace. The bottom of the soldering furnace is provided with a fisheye bearing. When one of the soldering furnaces rotates to above the cam, the fisheye bearing cooperates with the cam to lift the soldering furnace. The welding furnace includes a furnace body, a nozzle, an upper fixing plate for fixing the furnace body, a lower fixing plate, and a plurality of fixing rods connecting the upper fixing plate and the lower fixing plate. The upper fixing plate is located in the circumferential direction of the furnace body. The fixing rod passes through the main fixing plate, the main fixing plate is provided with a linear bearing, and the lower surface of the upper fixing plate is provided with a shaft fixing seat for mounting the fixing rod; The rotary welding mechanism also includes a vision component, which is used to perform optical acquisition and inspection of the PCB board. The vision component is located on the upper surface of the main fixing plate and between the welding furnaces. The rotary welding mechanism also includes a laser heat compensation component, which is located above the main fixing plate and close to the nozzle to heat and compensate the PCB board.

2. The selective wave soldering equipment as described in claim 1, characterized in that: The conveying mechanism is located above the welding assembly and includes a bracket, two conveying tracks arranged side by side, a set of rollers or chains on the conveying tracks, and a conveying motor that drives the set of rollers or chains. The PCB board moves under the drive of the two sets of rollers or chains. The conveying mechanism also includes a width adjustment component for adjusting the width between the two conveying tracks. The width adjustment component includes a width adjustment screw, a width adjustment screw nut, and a width adjustment motor. The width adjustment screw and the width adjustment screw nut drive one of the conveying tracks to move closer to or further away from the other conveying track.

3. The selective wave soldering equipment as described in claim 2, characterized in that: The conveying mechanism also includes positioning components disposed on two conveying tracks. Each positioning component includes a positioning cylinder, an output rod, a support base and a positioning plate connected in sequence. The positioning cylinder drives the positioning plate to move in a direction perpendicular to the PCB board. The positioning plate cooperates with the roller group to clamp the PCB board to fix it. Sensors are provided at the front, middle and rear ends of the conveying mechanism. The sensors are connected to the control system to identify the position of the PCB board entering the conveying track, and control the conveying motor and the positioning component to operate according to the position information of the PCB board.

4. The selective wave soldering equipment as described in claim 1, characterized in that: It also includes a moving mechanism located below the rotary welding mechanism, which can drive the rotary welding mechanism to move. The moving mechanism includes an X-axis module and a Y-axis module.

5. The selective wave soldering equipment as described in claim 1, characterized in that: It also includes an AOI inspection module, which can directly check the yield of solder joints after soldering is completed, and determine whether the PCB board needs to be re-soldered or should be moved out of the workstation and an alarm should be triggered based on the results.

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