A low temperature rail positioning test device and test method

Abstract

The present invention discloses a low-temperature track positioning test device and a test method, which relate to the field of chip low-temperature testing technology, including an insulation box, a first positioning track plate is installed on the bottom side wall of the insulation box, a temperature conduction plate is installed on one side of the first positioning track plate through a fixing frame, a temperature control unit is installed on one side of the temperature conduction plate, and a first slide groove is opened on the side of the first positioning track plate away from the temperature conduction plate. In the present invention, low-temperature cooling liquid is transmitted to the liquid conduction hole for heat conduction cooling, the first positioning track plate is placed in a vertical state, and constitutes a guide channel for directional movement of the chip to be tested, the product moves downward in sequence under the action of its own gravity, the limit assembly positions the chip to be tested, and then the detection assembly contacts the pins of the chip to be tested and completes the detection, so that the chip product test is tested in the track temperature chamber, avoiding large temperature fluctuations of the product during the transfer process, and reducing the transfer steps of the chip to be tested, and the process is more concise.

Description

Technical Field

[0001] The present invention relates to the technical field of low-temperature chip testing, and in particular to a low-temperature track positioning testing device and a testing method. Background Art

[0002] Electronic products need to go through a series of tests before leaving the factory. With the development of the modern electronics industry, the requirements for electronic products are getting higher and higher, the production process is becoming more and more complicated, and the production precision requirements are also high. It is inevitable that there will be some defective products. Due to unqualified raw materials or unreasonable design in the production process, the product will have quality problems. By conducting reliability tests, its shortcomings can be exposed in advance, and customers can get a complete experience before using it. Long-term testing will only improve the performance of the product.

[0003] In the prior art, the current low-temperature state testing method for automotive electronic products is mainly to place the product in a storage tray in a low-temperature environment to store it to a set temperature, and then use a robot or other tool to take out the product and transfer it to a test area for low-temperature electrical testing. Since the product needs to be transferred and involves more equipment, the process is complicated. At the same time, the product is easily affected by the ambient temperature during the transfer process, causing the product temperature to change and affecting the test results. Therefore, we disclose a low-temperature track positioning test device and test method to meet people's needs. Summary of the invention

[0004] The purpose of the present application is to provide a low-temperature track positioning test device and test method to solve the problem that the product testing process in the above-mentioned background technology is complicated, and the product is easily affected by the ambient temperature during the transfer process, causing the product temperature to change and affecting the test results.

[0005] To achieve the above-mentioned objectives, the present application provides the following technical solutions: a low-temperature rail positioning test device, comprising an insulation box, a first positioning rail plate is installed on the bottom side wall of the insulation box, a heat conduction plate is installed on one side of the first positioning rail plate through a fixing frame, a temperature control unit is installed on one side of the heat conduction plate, a first slide groove is provided on the side of the first positioning rail plate away from the heat conduction plate, a second positioning rail plate is installed on the side of the first positioning rail plate close to the first slide groove, a second slide groove is correspondingly provided on one side of the second positioning rail plate, the second slide groove matches the first slide groove and forms a T-shaped positioning slide, a limiting component is installed on one side of the T-shaped positioning slide, a detection component is installed on the inner side wall of the insulation box, and the detection end of the detection component corresponds to the position of the limiting component.

[0006] Preferably, the temperature control unit includes two cooling liquid transmission connectors, a liquid conduction hole is opened on the temperature conduction plate, the two cooling liquid transmission connectors are installed on one side of the temperature conduction plate, and one end of the two cooling liquid transmission connectors is connected to one end of the corresponding liquid conduction hole, and a temperature detection thermocouple is installed on the temperature conduction plate.

[0007] Preferably, the limiting unit includes a lower blocker and a pressing block, and a thermal insulation mounting base is installed on the inner side wall of the thermal insulation box body through two first fixed brackets, and a through hole is opened in the middle of one side of the thermal insulation mounting base, and the lower blocker and the pressing block are installed on the side corresponding to the first fixed bracket through a telescopic unit, and the lower blocker is located below the pressing block, and one end of the lower blocker and the pressing block both pass through the through hole and correspond to one side of the T-shaped positioning slide.

[0008] Preferably, the telescopic unit includes a first cylinder, which is installed on a side corresponding to the first fixed bracket, a first linear guide is installed on one side of the two first fixed brackets, a first slider is slidably installed on the two first linear guides, the telescopic end of the first cylinder is connected to a side corresponding to the first slider, a first connecting rod is installed on one side of the two first sliders, and one end of the lower blocker and the pressing block is installed on an end corresponding to the first connecting rod.

[0009] Preferably, a groove is provided on one side of the first positioning track plate, a positioning block is installed in the groove, two convex ribs are provided on one side of the positioning block to form a third slide groove and side cavities on both sides of the third slide groove, an avoidance hole is provided on one side of the second positioning track plate, the avoidance hole corresponds to the position of the positioning block, avoidance openings are provided on one side of the second positioning track plate at both sides of the avoidance hole, the lower blocker corresponds to one end of the pressing block, and a U-shaped notch is provided at one end of the pressing block.

[0010] Preferably, the detection unit includes two second connecting rods, and second fixed brackets are symmetrically installed on the inner wall of the thermal insulation box body, a second linear guide rail is installed on one side of the two second fixed brackets, and a second slider is slidably installed on the two second linear guide rails, a second cylinder is installed on one side of the two second fixed brackets, and the extended ends of the two second cylinders are connected to one side of the corresponding second slider, one end of the two second connecting rods is connected to one side of the corresponding second slider, and the other end is installed with a test claw unit through a fixed seat, and the two test claw units correspond to the corresponding avoidance opening positions.

[0011] Preferably, the test claw unit includes multiple upper test claws and multiple lower test claws, the multiple upper test claws are located in the same row and are evenly arranged, the multiple lower test claws are located in the same row and are evenly arranged, and the multiple upper test claws correspond to the corresponding lower test claws.

[0012] Preferably, an infrared sensor is installed on one side of the fixing bracket, and the infrared sensor corresponds to the position of the positioning block.

[0013] Preferably, observation ports are provided on one side of the thermal insulation mounting base at both sides of the through hole, a transparent plate is installed on one side of the thermal insulation mounting base at the observation port position, a transparent window is installed on one side of the thermal insulation box body, and the transparent plate corresponds to the position of the transparent window.

[0014] Preferably, a testing method for a low temperature rail positioning testing device comprises:

[0015] S1. Multiple chips to be tested are placed in the T-shaped positioning slideway in sequence. The chips to be tested slide downward along the T-shaped positioning slideway under the action of their own gravity and are arranged in a single row. The chip to be tested at the bottom stays at a set position under the blocking action of the lower blocker and is accurately positioned under the action of the pressing block.

[0016] S2, the coolant enters the liquid guide hole of the temperature conducting plate through one of the coolant transfer joints, and flows out through another coolant transfer joint, thereby cooling the temperature conducting plate and the first positioning track plate, thereby cooling the multiple chips to be tested located on one side of the first positioning track plate, and at the same time, the interior of the heat preservation box is kept at a constant temperature, so that the chips to be tested are always in a low temperature environment;

[0017] S3. After the chip to be tested is kept warm for a period of time in a low temperature environment, the second cylinder drives the second connecting rod to pull the corresponding upper test claw and lower test claw toward one side of the chip to be tested, and makes the upper test claw and lower test claw contact with the corresponding pins to complete the low temperature detection.

[0018] In summary, the technical effects and advantages of the present invention are as follows:

[0019] 1. In the present invention, low-temperature cooling liquid is transmitted to the liquid guide hole for heat conduction refrigeration, and a low-temperature state is formed in the heat preservation box. The first positioning track plate is placed in a vertical state and constitutes a guide channel for the directional movement of the chip to be tested. The product moves downward in sequence under the action of its own gravity, and the limit component positions the chip to be tested. Then the detection component contacts the pins of the chip to be tested and completes the detection. After the detection is completed, the chip product leaves the low-temperature test area under the action of its own gravity and enters the next process, so that the chip product test is tested in the track temperature chamber, avoiding large temperature fluctuations of the product during the transfer process, and reducing the transfer steps of the chip to be tested, and the process is more concise.

[0020] 2. In the present invention, through the setting of the positioning block, the size of the third slide groove is smaller than that of the first slide groove, so that the left and right sides of the chip body can be positioned more accurately. The bottom side of the third slide groove is a trumpet mouth, which is convenient for the chip to be tested to enter smoothly. The U-shaped groove at one end of the pressing block is in the shape of a trumpet mouth, which can accurately position the upper and lower parts of the chip body, so that the chip to be tested can be accurately positioned during detection, and the position of each chip to be tested in the track is repeated and consistent.

[0021] 3. In the present invention, after the product to be tested is positioned, the test claw unit moves with the second connecting rod and moves toward the product to be tested, and the test claw units on both sides press and contact the left and right pins of the product at the same time, respectively, to achieve electrical testing of the product. The test claws can press and contact the upper surfaces of the left and right bent feet of the product at the same time through the setting of the upper test claws and the lower test claws, respectively, and have a good conductive contact surface to improve the electrical test contact yield.

[0022] 4. In the present invention, by setting up an infrared sensor, a light beam is used to detect whether there is a chip to be tested at the current position to prevent abnormal detection. The internal situation of the insulation box can be observed through a transparent window, and the detection status can be observed through a transparent plate, which is convenient for identifying abnormalities. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 This is a side view of the present invention without the box body;

[0026] Figure 3 It is a schematic diagram of the three-dimensional structure of the first positioning track area in the present invention;

[0027] Figure 4 It is an exploded view of the components of the heat conduction plate area in the present invention;

[0028] Figure 5 A side view of the detection and positioning assembly of the present invention;

[0029] Figure 6 It is an exploded view of the components of the detection and positioning assembly in the present invention;

[0030] Figure 7It is a schematic diagram of the three-dimensional structure of the test claw assembly in the present invention;

[0031] Figure 8 It is a schematic diagram of the cutaway structure of the temperature control unit in the present invention;

[0032] Fig. 9 It is a schematic diagram of the three-dimensional structure of the positioning block in the present invention.

[0033] In the figure: 1, thermal insulation box; 2, first positioning track plate; 3, second positioning track plate; 4, second fixing bracket; 5, second cylinder; 6, thermal insulation mounting base; 7, transparent plate; 8, first fixing bracket; 9, transparent window; 10, second connecting rod; 11, coolant transmission joint; 12, lower blocker; 13, pressing block; 14, first linear guide; 15, chip to be tested; 151, chip body; 152, pin; 16, fixing bracket; 17, infrared sensor; 18, avoidance hole; 19, T-shaped positioning slide; 20, light beam; 21, heat conduction plate; 22, groove; 23, positioning block; 231, convex rib; 232, side cavity; 24, third slide groove; 25, first slide groove; 26, avoidance opening; 27, first connecting rod; 28, first slider; 29, first cylinder; 30, observation port; 31, test claw unit; 311, upper test claw; 312, lower test claw; 32, fixed seat; 33, second slider; 34, second linear guide; 35, liquid guide hole; 36, temperature detection thermocouple. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example: Reference Figure 1-9 A low-temperature track positioning test device shown in the figure includes an insulation box body 1, a first positioning track plate 2 is installed on the bottom side wall of the insulation box body 1, a heat conduction plate 21 is installed on one side of the first positioning track plate 2 through a fixing frame 16, a temperature control unit is installed on one side of the heat conduction plate 21, a first slide groove 25 is opened on the side of the first positioning track plate 2 away from the heat conduction plate 21, a second positioning track plate 3 is installed on the side of the first positioning track plate 2 close to the first slide groove 25, a second slide groove is correspondingly opened on one side of the second positioning track plate 3, the second slide groove and the first slide groove 25 match each other and form a T-shaped positioning slide 19, a limit assembly is installed on one side of the T-shaped positioning slide 19, a detection assembly is installed on the inner side wall of the insulation box body 1, and the detection end of the detection assembly corresponds to the position of the limit assembly.

[0036] Through the above mechanism, the temperature control unit conducts heat conduction cooling to the temperature conducting plate 21, the chip to be tested 15 and the first positioning track plate 2 in the test area to form a low-temperature state. The first positioning track plate 2 is placed in a vertical state, and the first slide groove 25 limits the left and right sides of the lower part of the plastic package of the chip body 151, and the second slide groove limits the left and right sides of the upper part of the plastic package of the chip body 151, forming a guide channel for the directional movement of the chip to be tested, that is, a T-shaped positioning slide 19. The product moves downward under the action of its own gravity, stops moving under the action of the limiting component after moving to a certain position, and is positioned. Then the detection component contacts the pin 152 of the chip to be tested 15 and completes the detection. When the chip product test is completed, the limiting component releases the chip product, and the chip product leaves the low-temperature test area under the action of its own gravity and enters the next process, so that the chip product test is tested in the track temperature chamber, avoiding large temperature fluctuations of the product during the transfer process, and reducing the transfer steps of the chip to be tested 15, and the process is more concise.

[0037] like Figure 4 and 8 As shown, the temperature control unit includes two cooling liquid transmission connectors 11, and a liquid guide hole 35 is opened on the temperature conducting plate 21. The two cooling liquid transmission connectors 11 are installed on one side of the temperature conducting plate 21, and one end of the two cooling liquid transmission connectors 11 is connected to one end of the corresponding liquid guide hole 35. A temperature detection thermocouple 36 is installed on the temperature conducting plate 21. The low-temperature cooling liquid is transmitted to the liquid guide hole 35 by the refrigerator circulation system. The temperature conducting plate 21, the chip to be tested 15 and the first positioning track plate 2 in the test area are cooled by heat conduction through the low-temperature cooling liquid, and a low-temperature state is formed in the thermal insulation box 1.

[0038] like Figure 2 , 5 As shown in 6, the limiting unit includes a lower blocker 12 and a pressing block 13. A thermal insulation mounting base 6 is installed on the inner wall of the thermal insulation box body 1 through two first fixed brackets 8. A through hole is opened in the middle of one side of the thermal insulation mounting base 6. The lower blocker 12 and the pressing block 13 are installed on the side corresponding to the first fixed bracket 8 through the telescopic unit. The lower blocker 12 is located below the pressing block 13. One end of the lower blocker 12 and the pressing block 13 both pass through the through hole and correspond to one side of the T-shaped positioning slide 19. When the chip 15 to be tested slides downward along the T-shaped positioning slide 19, the lower blocker 12 extends to make the chip 15 to be tested contact with the lower blocker 12 and stop moving. Then the pressing block 13 extends through the telescopic unit and presses the product, so that the positioning of the chip 15 to be tested is corrected, and the repeated position of the product is consistent. After the detection is completed, the lower blocker 12 and the pressing block 13 are retracted.

[0039] like Figure 5 and 6As shown, the telescopic unit includes a first cylinder 29, which is installed on one side of the corresponding first fixed bracket 8, and a first linear guide 14 is installed on one side of the two first fixed brackets 8. First sliders 28 are slidably installed on the two first linear guides 14. The telescopic end of the first cylinder 29 is connected to the side of the corresponding first slider 28, and a first connecting rod 27 is installed on one side of the two first sliders 28. One end of the lower blocker 12 and the pressing block 13 is installed on one end of the corresponding first connecting rod 27. The first cylinder 29 pushes the first slider 28 to move back and forth along the first linear guide 14 to form telescopic movement. Through the setting of the first linear guide 14, the moving direction of the lower blocker 12 and the pressing block 13 is more precise and does not deviate.

[0040] like Figure 4 and 9 As shown, a groove 22 is provided on one side of the first positioning track plate 2, a positioning block 23 is installed in the groove 22, two convex ribs 231 are provided on one side of the positioning block 23 to form a third slide groove 24 and side cavities 232 located on both sides of the third slide groove 24, an avoidance hole 18 is provided on one side of the second positioning track plate 3, the avoidance hole 18 corresponds to the position of the positioning block 23, and avoidance openings 26 are provided on one side of the second positioning track plate 3 at both sides of the avoidance hole 18, the lower blocker 12 corresponds to one end of the pressing block 13, and the pressing block 13 A U-shaped notch is provided at one end. Through the setting of the positioning block 23, the size of the third slide groove 24 is smaller than that of the first slide groove 25, so that the left and right sides of the chip body 151 can be positioned more accurately. The bottom side of the third slide groove 24 is a trumpet mouth, which is convenient for the chip 15 to be tested to enter smoothly. The U-shaped notch at one end of the pressing block 13 is in the shape of a trumpet mouth, which can accurately position the upper and lower parts of the chip body 151, so that the chip 15 to be tested can be accurately positioned during detection, so that the position of each chip 15 to be tested in the track is repeated and consistent.

[0041] like Figure 2 , 7As shown in 8, the detection unit includes two second connecting rods 10, and second fixed brackets 4 are symmetrically installed on the inner wall of the insulation box body 1. A second linear guide 34 is installed on one side of the two second fixed brackets 4, and a second slider 33 is slidably installed on the two second linear guides 34. A second cylinder 5 is installed on one side of the two second fixed brackets 4, and the extended ends of the two second cylinders 5 are connected to one side of the corresponding second slider 33. One end of the two second connecting rods 10 is connected to one side of the corresponding second slider 33, and the other end is installed with a test claw unit 31 through a fixed seat 32. The two test claw units 31 correspond to the positions of the corresponding avoidance openings 26. When the two test claw units 31 are located on both sides of the first positioning track plate 2, after the product 15 to be tested is positioned, the test claw unit 31 moves with the second connecting rod 10 and moves toward the product 15 to be tested, and the test claw units 31 on both sides press the left and right pins 152 of the product at the same time to achieve electrical testing of the product.

[0042] like Figure 7 and 8 As shown, the test claw unit 31 includes multiple upper test claws 311 and multiple lower test claws 312. The multiple upper test claws 311 are located in the same row and are evenly arranged, and the multiple lower test claws 312 are located in the same row and are evenly arranged. The multiple upper test claws 311 correspond to the corresponding lower test claws 312. The test claws can press and contact the upper surfaces of the bent feet of the left and right pins 152 of the product respectively through the setting of the upper test claws 311 and the lower test claws 312, and have a good conductive contact surface to improve the electrical test contact yield.

[0043] like Figure 3 and 4 As shown, an infrared sensor 17 is installed on one side of the fixing frame 16. The infrared sensor 17 corresponds to the position of the positioning block 23. Through the setting of the infrared sensor 17, the light beam 20 is used to detect whether there is a chip 15 to be tested at the current position to prevent abnormal detection.

[0044] like Figure 1 and 6 As shown, observation ports 30 are provided on both sides of the through hole on one side of the insulation mounting base 6, and transparent plates 7 are installed on the observation ports 30 on one side of the insulation mounting base 6. A transparent window 9 is installed on one side of the insulation box body 1, and the positions of the transparent plate 7 and the transparent window 9 correspond. The internal conditions of the insulation box body 1 can be observed through the transparent window 9, and the detection status can be observed through the transparent plate 7, so as to facilitate the identification of abnormalities.

[0045] A testing method for a low-temperature rail positioning testing device, the method comprising:

[0046] S1, placing multiple chips 15 to be tested in sequence in the T-shaped positioning slide 19, the chips 15 to be tested slide downward along the T-shaped positioning slide 19 under the action of their own gravity and arranged in a single row, the chip 15 to be tested located at the bottom side stays at the set position under the blocking action of the lower blocker 12, and is accurately positioned under the action of the pressing block 13;

[0047] S2, the coolant enters the liquid guide hole 35 of the temperature conducting plate 21 through one of the coolant transfer joints 11, and flows out through the other coolant transfer joint 11, thereby cooling the temperature conducting plate 21 and the first positioning track plate 2, thereby cooling the multiple chips to be tested 15 located on one side of the first positioning track plate 2, and at the same time, the interior of the heat preservation box 1 is kept at a constant temperature, so that the chips to be tested 15 are always in a low temperature environment;

[0048] S3. After the chip 15 to be tested is kept warm for a period of time in a low temperature environment, the second cylinder 5 drives the second connecting rod 10 to pull the corresponding upper test claw 311 and the lower test claw 312 toward one side of the chip 15 to be tested, and make the upper test claw 311 and the lower test claw 312 contact with the corresponding pin 152 to complete the low temperature detection.

[0049] Working principle of the present invention:

[0050] The low-temperature cooling liquid is transferred to the liquid guide hole 35 by the circulation system of the refrigerator, and the heat transfer cooling of the temperature conducting plate 21, the chip to be tested 15 and the first positioning track plate 2 in the test area is carried out by the low-temperature cooling liquid, so that a low-temperature state is formed in the heat preservation box 1. The first positioning track plate 2 is placed in a vertical state, and the first slide groove 25 limits the left and right sides of the lower part of the plastic package of the chip body 151, and the second slide groove limits the left and right sides of the upper part of the plastic package of the chip body 151, forming a guide channel for the directional movement of the chip to be tested, that is, a T-shaped positioning slide 19. The product moves downward under the action of its own gravity. When the chip to be tested 15 slides down along the T-shaped positioning slide 19 When moving, the lower blocker 12 extends to make the chip 15 to be tested contact with the lower blocker 12 and stop moving, and then the pressing block 13 extends through the telescopic unit and presses the product to correct the positioning of the chip 15 to be tested, so as to achieve consistent repeated positions of the products, and then the detection component contacts the pins 152 of the chip 15 to be tested and completes the detection. After the detection is completed, the lower blocker 12 and the pressing block 13 retract, and the chip product leaves the low-temperature test area under the action of its own gravity and enters the next process, so that the chip product test is tested in the track temperature chamber, avoiding large temperature fluctuations of the product during the transfer process, and at the same time reducing the transfer steps of the chip 15 to be tested, and the process is more concise.

[0051] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A low temperature rail positioning test device, comprising a heat preservation box (1), characterized in that: A first positioning track plate (2) is installed on the bottom side wall of the thermal insulation box body (1); a heat conducting plate (21) is installed on one side of the first positioning track plate (2) via a fixing frame (16); a temperature control unit is installed on one side of the heat conducting plate (21); a first slide groove (25) is provided on the side of the first positioning track plate (2) away from the heat conducting plate (21); a second positioning track plate (3) is installed on the side of the first positioning track plate (2) close to the first slide groove (25); a second slide groove is correspondingly provided on one side of the second positioning track plate (3); the second slide groove matches the first slide groove (25) and forms a T-type shaped positioning slide (19), a limit assembly is installed on one side of the T-shaped positioning slide (19), a detection assembly is installed on the inner side wall of the heat preservation box (1), and the detection end of the detection assembly corresponds to the position of the limit assembly; the temperature control unit comprises two cooling liquid transmission joints (11), the heat conduction plate (21) is provided with a liquid guide hole (35), the two cooling liquid transmission joints (11) are both installed on one side of the heat conduction plate (21), and one end of the two cooling liquid transmission joints (11) is connected to one end of the corresponding liquid guide hole (35), and a temperature detection thermocouple (36) is installed on the heat conduction plate (21); The limiting assembly comprises a lower stopper (12) and a pressing block (13); a heat-insulating mounting base (6) is mounted on the inner side wall of the heat-insulating box body (1) via two first fixing brackets (8); a through hole is provided in the middle of one side of the heat-insulating mounting base (6); the lower stopper (12) and the pressing block (13) are mounted on a side corresponding to the first fixing bracket (8) via a telescopic unit; the lower stopper (12) is located below the pressing block (13); one end of the lower stopper (12) and the pressing block (13) both pass through the through hole and correspond to one side of the T-shaped positioning slideway (19); The telescopic unit comprises a first cylinder (29), the first cylinder (29) being mounted on a side corresponding to the first fixed bracket (8), a first linear guide rail (14) being mounted on one side of the two first fixed brackets (8), a first slider (28) being slidably mounted on the two first linear guide rails (14), a telescopic end of the first cylinder (29) being connected to a side corresponding to the first slider (28), a first connecting rod (27) being mounted on one side of the two first sliders (28), and one end of the lower stopper (12) and the pressing block (13) being mounted on an end corresponding to the first connecting rod (27); A groove (22) is provided on one side of the first positioning track plate (2), a positioning block (23) is installed in the groove (22), two convex ribs (231) are provided on one side of the positioning block (23) to form a third slide groove (24) and side cavities (232) located on both sides of the third slide groove (24), a avoidance hole (18) is provided on one side of the second positioning track plate (3), the avoidance hole (18) corresponds to the position of the positioning block (23), and avoidance openings (26) are provided on one side of the second positioning track plate (3) at both sides of the avoidance hole (18), the lower blocker (12) and one end of the pressing block (13) correspond to each other, and a U-shaped notch is provided on one end of the pressing block (13), and the U-shaped notch at one end of the pressing block (13) is in the shape of a trumpet, so as to accurately position the chip body (151) up and down; When the chip to be tested (15) slides downward along the T-shaped positioning slideway (19), the lower stopper (12) extends so that the chip to be tested (15) contacts the lower stopper (12) and stops moving. Then, the pressing block (13) extends through the telescopic unit and presses the product, so that the positioning of the chip to be tested (15) is corrected, and the repeated position of the product is consistent. After the test is completed, the lower stopper (12) and the pressing block (13) are retracted, and the first positioning track plate (2) is placed in a vertical state. The first slide groove (25) limits the left side of the lower part of the plastic package of the chip body (151). On the right side, the second slide groove limits the left and right sides of the upper part of the plastic package of the chip body (151), forming a guide channel for the directional movement of the chip to be tested, that is, a T-shaped positioning slideway (19). The product moves downward under the action of its own gravity, and stops moving under the action of the limiting component after moving to a certain position, and is positioned. Then, the detection component contacts the pin (152) of the chip to be tested (15) and completes the detection. When the chip product test is completed, the limiting component releases the chip product, and the chip product leaves the low-temperature test area under the action of its own gravity and enters the next process.

2. A low temperature rail positioning test device according to claim 1, characterized in that: The detection assembly comprises two second connecting rods (10), a second fixed bracket (4) is symmetrically mounted on the inner side wall of the heat preservation box (1), a second linear guide rail (34) is mounted on one side of the two second fixed brackets (4), a second slider (33) is slidably mounted on the two second linear guide rails (34), a second cylinder (5) is mounted on one side of the two second fixed brackets (4), the extended ends of the two second cylinders (5) are connected to one side of the corresponding second slider (33), one end of the two second connecting rods (10) is connected to one side of the corresponding second slider (33), and the other end of the two second connecting rods (10) is mounted with a test claw unit (31) via a fixed seat (32), and the two test claw units (31) correspond to the positions of the corresponding avoidance openings (26).

3. A low temperature rail positioning test device according to claim 2, characterized in that: The test claw unit (31) comprises a plurality of upper test claws (311) and a plurality of lower test claws (312); the plurality of upper test claws (311) are located in the same row and are evenly arranged; the plurality of lower test claws (312) are located in the same row and are evenly arranged; and the plurality of upper test claws (311) correspond to the corresponding lower test claws (312).

4. A low temperature rail positioning test device according to claim 1, characterized in that: An infrared sensor (17) is installed on one side of the fixing frame (16), and the position of the infrared sensor (17) corresponds to that of the positioning block (23).

5. A low temperature rail positioning test device according to claim 1, characterized in that: One side of the thermal insulation mounting base (6) is provided with observation ports (30) at positions on both sides of the through hole, and one side of the thermal insulation mounting base (6) is provided with a transparent plate (7) at the position of the observation port (30). One side of the thermal insulation box body (1) is provided with a transparent window (9), and the transparent plate (7) and the transparent window (9) are located at corresponding positions.

6. A testing method for the low-temperature rail positioning testing device according to any one of claims 1 to 5, characterized in that: The method includes: S1, placing a plurality of chips to be tested (15) in sequence in the T-shaped positioning slideway (19), the chips to be tested (15) slide downward along the T-shaped positioning slideway (19) under the action of their own gravity and are arranged in a single row, the chip to be tested (15) located at the bottom side stays at a set position under the blocking action of the lower blocker (12), and is accurately positioned under the action of the pressing block (13); S2, the coolant enters the liquid guide hole (35) of the temperature conducting plate (21) through one of the coolant transfer joints (11), and flows out through the other coolant transfer joint (11), thereby cooling the temperature conducting plate (21) and the first positioning track plate (2), thereby cooling the plurality of chips to be tested (15) located on one side of the first positioning track plate (2), while the interior of the heat preservation box (1) is kept at a constant temperature, so that the chips to be tested (15) are always in a low temperature environment; S3. After the chip to be tested (15) is kept warm for a period of time in a low-temperature environment, the second cylinder (5) drives the second connecting rod (10) to pull the corresponding upper test claw (311) and the lower test claw (312) toward one side of the chip to be tested (15), and the upper test claw (311) and the lower test claw (312) are brought into contact with the corresponding pin (152), thereby completing the low-temperature detection.

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