Apparatus for cleaning a wafer

Abstract

This application provides an apparatus for cleaning wafers, comprising: an apparatus body, a clamping and rotating module, a spraying module, a liquid storage and pressurizing module, and a mixing module. The apparatus body forms a space for cleaning the wafer; the clamping and rotating module clamps the wafer and rotates it; the spraying module sprays various cleaning agents onto the wafer; the liquid storage and pressurizing module stores various cleaning agents and provides pressure to allow them to be sprayed out through the spraying module; the mixing module mixes the various cleaning agents stored in the liquid storage and pressurizing module, and the mixed cleaning agent can then enter the spraying module and be sprayed onto the wafer. The apparatus provided by this application can obtain various mixed cleaning agents of different concentrations and compositions through the mixing module, allowing different cleaning agents to be sprayed according to different needs, achieving good cleaning results; simultaneously, using sprayed cleaning agents to clean wafers reduces cleaning agent consumption compared to currently commonly used ultrasonic cleaning.

Description

Technical Field

[0001] Embodiments of this application relate to apparatus for cleaning a predetermined object using sprayed liquid or steam, and more specifically to an apparatus for cleaning wafers. Background Technology

[0002] Wafer cleaning is an essential step in semiconductor manufacturing, and the degree of cleanliness affects subsequent processing and the performance of the semiconductor product. Currently, the common method for cleaning wafers is to place them in a container of cleaning agent for ultrasonic cleaning. This method requires discarding all the cleaning agent from the previous cleaning cycle when changing the agent, resulting in high consumption and cost. Furthermore, as the cleanliness of the wafer surface changes during cleaning, the required composition and concentration of the cleaning agent also need to be adjusted. This method, where the composition and concentration of the cleaning agent are fixed at the start of cleaning, makes it difficult to adjust the concentration and composition in real time according to changing cleaning needs. Summary of the Invention

[0003] To address at least one aspect of the aforementioned technical problems, embodiments of this application provide an apparatus for cleaning wafers. The apparatus includes: an apparatus body, a clamping and rotating module, a spraying module, a liquid storage and pressurizing module, and a mixing module. The apparatus body forms a space for cleaning the wafer; a portion of the clamping and rotating module is disposed within the space and configured to clamp the wafer and rotate it; the spraying module is configured to spray multiple cleaning agents onto the wafer clamped on the clamping and rotating module; the liquid storage and pressurizing module stores multiple cleaning agents and provides pressure to the cleaning agents so that they are sprayed out through the spraying module; the mixing module is fixedly connected to the apparatus body, the liquid storage and pressurizing module is fixedly connected to the mixing module, and the spraying module is fixedly connected to the mixing module. The mixing module is configured such that the multiple cleaning agents stored in the liquid storage and pressurizing module enter the mixing module and mix within the mixing module; the mixed multiple cleaning agents then enter the spraying module, and the spraying module sprays the mixed multiple cleaning agents onto the wafer.

[0004] The device for cleaning wafers provided in the embodiments of this application can adjust the type and amount of cleaning agent entering the mixing module, thereby adjusting the type and proportion of various cleaning agents in the resulting mixed cleaning agent. This allows for the spraying of different cleaning agents onto the wafer according to different cleaning needs during the cleaning process, resulting in better wafer cleaning effect, reduced cleaning agent consumption during wafer cleaning, and lower wafer cleaning cost. Attached Figure Description

[0005] Other objects and advantages of this application will become apparent from the following description of embodiments of this application with reference to the accompanying drawings, and will help to provide a comprehensive understanding of this application.

[0006] Figure 1 This is a cross-sectional schematic diagram of a cleaning apparatus according to an embodiment of this application.

[0007] Figure 2 This is a disassembly diagram of the cleaning device according to an embodiment of this application.

[0008] Figure 3 This is a schematic diagram of the structure of the liquid mixing module in the cleaning apparatus of an embodiment of this application.

[0009] Figure 4 This is a schematic diagram of the structure of the support portion in the cleaning device according to an embodiment of this application.

[0010] Figure 5 This is a schematic diagram illustrating the process of cleaning a wafer using the cleaning apparatus of an embodiment of this application.

[0011] Explanation of reference numerals in the attached figures:

[0012] 1. Cleaning equipment; 2. Wafer;

[0013] 10. Device body; 101. Side wall; 102. Bottom wall; 1021. Drain port; 103. Device body cover; 1031. Cover sealing ring; 104. Hinge; 1041. Hinge fastener;

[0014] 20. Clamping rotating module; 201. Bearing part; 2011. Groove; 2012. Protrusion; 201. Rotating shaft; 2021. Rotating shaft sealing ring;

[0015] 30. Spraying module; 301. Nozzle; 302. Connector;

[0016] 40. Liquid storage and pressurization module; 401. Capillary tube; 402. Seal;

[0017] 50. Mixing module; 501. First component; 5011. Fixed cap; 5012. Fixed plate; 5013. Fixing component; 502. Second component; 5021. Channel; 5022. Mixing chamber; 5023. Second component fixing component; 5024. Slide groove; 503. Third component; 5031. Mating part;

[0018] 3. Power unit; 4. Liquid storage device; 5. Control device; 6. Placement device; 7. Piping; 8. Liquid connection piping.

[0019] It should be noted that the accompanying drawings are not necessarily drawn to scale, but are shown only in a schematic manner without affecting the reader's understanding. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only one embodiment of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the described embodiments of this application without creative effort are within the scope of protection of this application.

[0021] It should be noted that, unless otherwise defined, the technical or scientific terms used in this application should have the ordinary meaning understood by a person with ordinary skill in the art to which this application pertains. Where the terms "first," "second," etc., are used throughout the text, they are used only to distinguish similar objects and should not be construed as indicating or implying their relative importance, order of precedence, or implicitly specifying the number of technical features indicated. It should be understood that the data described by "first," "second," etc., can be interchanged where appropriate. Where "and / or" appears throughout the text, it means including three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B. Furthermore, for ease of description, spatial relative terms such as "above," "below," "top," "bottom," etc., may be used here, only to describe the spatial positional relationship between one device or feature as shown in the figure and other devices or features. It should be understood that this also includes different orientations in use or operation besides those shown in the figure.

[0022] To achieve better wafer cleaning results and meet the needs of wafer cleaning, embodiments of this application provide an apparatus for cleaning wafers (hereinafter referred to as a cleaning apparatus). Figure 1 As shown, it is a cross-sectional schematic diagram of the cleaning device 1 provided in an embodiment of this application. The device may include a device body 10, a clamping and rotating module 20, a spraying module 30, a liquid storage and pressurization module 40, and a liquid mixing module 50.

[0023] The device body 10 can form a space 105 for cleaning the wafer 2, in which the wafer 2 is located. Figure 2As shown, a portion of the clamping and rotating module 20 is disposed within the space where the wafer 2 is cleaned, and is configured to clamp the wafer 2 and rotate it. The spraying module 30 is configured to spray various cleaning agents onto the wafer 2 clamped on the clamping and rotating module 20. The liquid storage and pressurizing module 40 is configured to store various cleaning agents and provide pressure to the cleaning agents so that they are sprayed out through the spraying module 30. The mixing module 50 is fixedly connected to the device body 10, the liquid storage and pressurizing module 40 is fixedly connected to the mixing module 50, and the spraying module 30 is fixedly connected to the mixing module 50. The mixing module 50 is configured such that the various cleaning agents stored in the liquid storage and pressurizing module 40 enter the mixing module 50 and are mixed within the mixing module 50. The mixed cleaning agents then enter the spraying module 30 and are sprayed onto the wafer 2 by the spraying module 30.

[0024] The device for cleaning wafers provided in the embodiments of this application can adjust the type and amount of cleaning agent entering the mixing module, thereby adjusting the type and proportion of various cleaning agents in the resulting mixed cleaning agent. This allows for the spraying of different cleaning agents onto the wafer according to different cleaning needs during the cleaning process, resulting in better wafer cleaning effect, reduced cleaning agent consumption during wafer cleaning, and lower wafer cleaning cost.

[0025] See Figure 3 The diagram shows a structural schematic of the mixing module 50, which may include a first component 501, a second component 502, and a third component 503. The liquid storage and pressurization module 40 is fixedly connected to the first component 501, the first component 501 is fixedly connected to the second component 502, the second component 502 is fixedly connected to the third component 503, and the third component 503 is fixedly connected to the device body 10. The spraying module 30 is fixedly connected to the second component 502, and the third component 503 forms a space for the spraying module 30 to extend into the device body 10 along this space.

[0026] See Figure 1 The second component 502 forms a mixing chamber 5022 at the junction with the first component 501, and the second component 502 forms a channel 5021 for the flow of the mixed cleaning agent. The liquid storage and pressurization module 40 provides multiple cleaning agents to the mixing chamber 5022. Due to the pressure of the cleaning agent and the collision between the cleaning agent and the mixing chamber, the cleaning agent is mixed in the mixing chamber 5022. The mixed cleaning agent enters the spraying module 30 through the channel 5021.

[0027] Channel 5021 is formed in the middle of the second member 502, and mixing chamber 5022 is formed on the outer periphery of channel 5021. Channel 5021 is a through hole formed in the middle of the second member 502. The surface of mixing chamber 5022 includes the surface of the first member 501 facing the second member 502 and the surface of the extension of the second member 502 extending toward the middle of the second member 502 towards the first member 501. In the extension direction of device 1 from the first member 501 to the second member 502, this surface is located downstream of the surface of the mating part of the second member 502 and the first member 501.

[0028] like Figure 2 The diagram shown illustrates a disassembled schematic of the cleaning apparatus 1 according to an embodiment of this application. See also... Figure 1 and Figure 2 The liquid storage and pressurization module 40 may include multiple capillary tubes 401 and a sealing element 402. Different cleaning agents can flow into the mixing module 50 through the capillary tubes 401. The first component 501 may have multiple through holes, and a groove may also be formed at the location where the through holes are formed. Multiple capillary tubes 401 are inserted into the through holes, and the sealing element 402 can be sleeved on the capillary tubes 401 and placed in the groove.

[0029] In some embodiments, see Figure 2 Multiple seals 402 may be fitted onto each capillary tube 401. In some embodiments, the seal 402 may be a double-layered O-ring rubber ring.

[0030] Because the inner diameter of the capillary tube 401 is small, it is prone to clogging during use, affecting the cleaning effect. When the capillary tube 401 becomes clogged, it needs to be replaced. In related technologies, the capillary tube is fixedly connected by welding, making it difficult to replace a clogged capillary tube during use. The embodiment of this application uses a sealing element 402 with a double-layer rubber ring fitted on the capillary tube 401. The sealing element 402 can provide sufficient fixing force and fixing distance, which can not only prevent the capillary tube 401 from falling off due to the pressure of the cleaning agent spray and the vibration caused by the rotation of the clamping rotating module 20, but also achieve the purpose of replacing the capillary tube 401.

[0031] By adjusting the type and amount of cleaning agent flowing through capillary tube 401 to mixing chamber 5022, the composition and concentration of the mixed cleaning agent in mixing chamber 5022 can be changed, thus obtaining a variety of different mixed cleaning agents. Therefore, at different cleaning stages, various different mixed cleaning agents can be sprayed onto the surface of wafer 2 according to different cleaning needs to achieve better cleaning results.

[0032] See Figure 3The second component 502 may also have a groove 5024, and a fastener 5023 for fixing the second component 502 to the third component 503 is provided in the groove 5024 so that the position of the second component 502 being fixed to the third component 503 can be changed, and the second component 502 can rotate around its axis before being fixed.

[0033] In some embodiments, the position of the nozzle 301 of the spraying module 30 can be changed by adjusting the position of the fixing member 5023 in the slide groove 5024, thereby changing the relative position of the second member 502 with respect to the first member 501 and the third member 503. For example, the position can be adjusted in the following way:

[0034] Adjust the fixing member 5023 so that the second component 502 and the third component 5023 are no longer fixedly connected, and the second component 502 can move relative to the third component 503; keep the fixing member 5023 stationary, move the second component 502 so that the second component 502 moves along the slide groove 5024 relative to the fixing member 5023, and the position of the second component 502 relative to the third component 503 changes. At this time, the position of the nozzle 301 of the spraying module 30 fixedly connected to the second component 502 also changes; adjust the fixing member 5023 so that the second component 502 is fixedly connected to the third component 503 again.

[0035] By changing the position of the nozzle 301 of the spraying module 30, the nozzle 301 can clean different positions of the wafer 2 to achieve a better cleaning effect.

[0036] In addition, by changing the position of the nozzle 301 of the spraying module 30, the liquid outlet of the nozzle 301 can be located directly above the center of the wafer 2 to avoid cleaning blind spots caused by positional errors.

[0037] In some embodiments, the third component 503 may also have a mating portion 5031, which is disposed at the bottom of the third component 503, so that the third component 503 can be fixedly connected to the device body 10.

[0038] The spraying module 30 may include a nozzle 301 and a connector 302, wherein the connector 302 may be fixed to the second component 502 to fluidly communicate with the nozzle 301.

[0039] In some embodiments, nozzle 301 can be replaced as needed for cleaning.

[0040] See Figure 2 The diagram shows a disassembly schematic of the cleaning device 1. In some embodiments, the connector 302 may be a Luer interface to facilitate the replacement of the nozzle 301.

[0041] In some embodiments, the clamping rotation module 20 may include a support portion 201, which can be used to clamp the wafer 2. The wafer 2 is placed in the middle of the support portion 201, and the wafer 2 can be adsorbed in the middle of the support portion 201 by suctioning air, so as to prevent the wafer 2 from falling off during rotation cleaning.

[0042] like Figure 4 As shown, a schematic diagram of the structure of the support portion 201 is presented. An even number of protrusions 2012 are also provided around the periphery of the support portion 201, so that the periphery of the support portion 201 is not flush, which facilitates the accurate placement of the wafer 2 in the center of the support portion 201 and the easy loading and unloading of the wafer 2 on the support portion. In some embodiments, the wafer 2 can be a wafer of various different sizes.

[0043] In some embodiments, the support portion 201 may also have a groove 2011, which is located in the middle of the support portion 201 and the periphery of the support portion 201. A chamfer is formed on the side of the groove 2011 near the periphery to prevent the cleaning agent from being sucked away by the gas suction in the middle of the support portion 201 during the cleaning process.

[0044] In some embodiments, the clamping rotation module 20 may further include a rotation shaft 202, and the support portion 201 is fixedly connected to the rotation shaft 202. When cleaning the wafer 2, the rotation shaft 202 can drive the support portion 201 to rotate.

[0045] In some embodiments, the rotating shaft 202 further includes a rotating shaft seal ring 2021.

[0046] In some embodiments, the device body 10 may include a sidewall 101 forming a space 105, the sidewall 101 protruding outward in a direction away from the clamping rotation module 20 in the height direction of the clamping rotation module 20. (The following is a description of the configuration:) Figure 1 The sidewall 101 shown is to prevent the cleaning agent sprayed by the spraying module 30 from splashing back onto the wafer 2, thereby avoiding contamination of the wafer 2 and ensuring the cleaning effect of the wafer 2.

[0047] In some embodiments, the device body 10 may further include a bottom wall 102 forming a space 105, the bottom wall 102 protruding upward in the direction close to the clamping rotation module 20. (Set as follows) Figure 1 The bottom wall 102 shown is to prevent the cleaning agent flowing down from the wafer 2 from entering the rotating shaft 202 and affecting the normal rotation of the rotating shaft 202. In some embodiments, the bottom wall 102 is also provided with a drain port 1021 to drain the cleaning agent and avoid the cleaning agent from accumulating in large quantities in the space where the wafer 2 is being cleaned, thus affecting the operation of the cleaning apparatus 1.

[0048] In some embodiments, the device body 10 may further include a device body cover 103, which is connected to a side wall 101 via a hinge 104. Both sides of the hinge 104 are connected to the side wall 101 and the device body cover 103 via hinge fasteners 1041, respectively. The device body cover 103, the side wall 101, and the bottom wall 102 form a space 105 for cleaning the wafer 2. In some embodiments, the device body cover 103 may also have a cover sealing ring 1031.

[0049] In the embodiments of this application, such as Figure 5 The diagram shows a process of cleaning a wafer using the cleaning apparatus of an embodiment of this application. When cleaning a wafer 2 using the cleaning apparatus 1 provided in this application, a power unit 3, a liquid storage device 4, a control device 5, a placement device 6, a pipeline 7, and a liquid connection pipeline 8 can also be used.

[0050] The power unit 3 is fixedly connected to the cleaning device 1. The power unit 3 is also connected to the rotating shaft 202 of the cleaning device 1. It can drive the cleaning device 1 to rotate around the rotating shaft 202 and can also cause the wafer 2 to be adsorbed onto the support part 201 of the cleaning device 1.

[0051] The liquid storage device 4 is connected to the cleaning device 1 through a liquid connection pipeline 8, and there can be multiple liquid connection pipelines 8; the liquid storage device 4 can be multiple syringes, and the liquid storage device 4 can be used to store various cleaning agents, and can provide various cleaning agents to the cleaning device 1 through the liquid connection pipeline 8; a check valve can also be installed below the liquid storage device 4 to prevent the liquid in the liquid connection pipeline 8 from flowing back.

[0052] The placement device 6 has a groove on which the liquid storage device 4 can be placed, and there can be multiple grooves.

[0053] The control device 5 is connected to the liquid storage device 4 through a pipeline 7, which can be multiple. The control device 5 is equipped with multiple pneumatic control switches and pneumatic control outlets. The pneumatic control outlets are connected to the liquid storage device 4 through the pipeline 7. By adjusting the state of the pneumatic control switches, the output of the pneumatic control outlets can be controlled, which can change the air pressure in the liquid storage device, control the liquid output of the liquid storage device, and thus control the cleaning dosage entering the cleaning device 1.

[0054] During the cleaning process of wafer 2, the type and amount of cleaning agent flowing into the cleaning device 1 can be switched by manually adjusting the state of the pneumatic control switch of the control device 5; different cleaning needs can also be met and better cleaning results can be obtained by adjusting the switching time of the pneumatic control switch and the rotation speed and rotation time of the power device 3.

[0055] See Figure 5The process of cleaning wafer 2 is described in detail below with reference to specific embodiments. The cleaning device used in the cleaning process can be any cleaning device 1 of the embodiments of this application. The process may include the following steps:

[0056] The wafer 2 is placed on the support 201, and the power unit 3 is started, causing the wafer 2 to adhere to the support 201. At the same time, the cleaning device 1 drives the wafer 2 to rotate at a predetermined speed. The pneumatic control switch of the control device 5 is adjusted so that various cleaning agents in the liquid storage device 4 enter the mixing chamber 5022 of the cleaning device 1, resulting in a mixed cleaning agent. The mixed cleaning agent is sprayed onto the geometric center of the wafer 2 through the nozzle 401. According to different cleaning needs, the type and amount of cleaning agent flowing into the cleaning device 1 are adjusted by adjusting the pneumatic control switch of the control device 5, so that various different cleaning agents can be mixed in the cleaning device 1 and sprayed onto the wafer 2. After multiple cleanings, the pneumatic control switch of the control device 5 is adjusted so that the cleaning device 1 stops spraying cleaning agent onto the wafer 2. The rotation speed and rotation time of the power unit 3 are adjusted to spin dry the liquid on the wafer 2, completing the cleaning process.

[0057] Regarding the embodiments of this application, it should also be noted that, without conflict, the embodiments of this application and the features in the embodiments can be combined with each other to obtain new embodiments.

[0058] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. The scope of protection of this application shall be determined by the scope of the claims.

Claims

1. An apparatus for cleaning a wafer, comprising: It comprises: a device body forming a space for performing a cleaning operation on the wafer; a clamping and rotating module, a part of which is arranged in the space and is arranged to clamp and rotate the wafer; a spraying module arranged to spray a plurality of cleaning agents to the wafer clamped on the clamping and rotating module; a liquid storage and pressurization module arranged to store a plurality of cleaning agents and provide pressure for the cleaning agents to be sprayed through the spraying module; wherein a mixing module is further included, the mixing module is fixedly connected with the device body, the liquid storage and pressurization module is fixedly connected with the mixing module, and the spraying module is fixedly connected with the mixing module, the mixing module is arranged such that the plurality of cleaning agents stored by the liquid storage and pressurization module enter the mixing module and mix in the mixing module, and then the mixed plurality of cleaning agents enter the spraying module, and the mixed plurality of cleaning agents are sprayed to the wafer by the spraying module; the mixing module comprises a first component, a second component and a third component, the liquid storage and pressurization module is fixedly connected with the first component; the first component is fixedly connected with the second component; the second component is fixedly connected with the third component; the third component is fixedly connected with the device body; wherein the spraying module is fixedly connected with the second component, and the third component forms a space in which the spraying module extends, and the spraying module extends into the device body along the space; the second component has a sliding groove, and a fixing member for fixing the second component and the third component is arranged in the sliding groove, so that the position of the second component fixed to the third component can be changed.

2. The device according to claim 1, wherein wherein a mixing cavity is formed at the joint of the second component and the first component, and the second component forms a channel for the flow of the mixed cleaning agents, the liquid storage and pressurization module provides a plurality of cleaning agents to the mixing cavity, the cleaning agents are mixed in the mixing cavity, and the mixed cleaning agents enter the spraying module through the channel.

3. The device according to claim 2, wherein the channel is formed in the middle of the second component, and the mixing cavity is formed around the channel, and the channel is a through hole formed in the middle of the second component, the surface of the mixing cavity includes the surface of the first component facing the second component and the surface of the extension of the second component facing the first component extending from the joint of the second component and the first component to the middle of the second component, and in the extension direction of the device from the first component to the second component, the surface is located downstream of the surface at the joint of the second component and the first component.

4. The device according to claim 2 or 3, wherein the liquid storage and pressurization module comprises a plurality of capillary tubes and a sealing member, and different cleaning agents flow into the mixing module through the capillary tubes, and The first member is formed with a plurality of through holes, and a groove is formed at the position where the through hole is formed, the plurality of capillary tubes are inserted into the through holes, and the sealing member is sleeved on the capillary tubes and placed into the groove.

5. The apparatus of claim 4, wherein, A plurality of sealing members are sleeved on each capillary tube.

6. The apparatus of claim 1, wherein, The second member is capable of rotating around its axis before being fixed.

7. The apparatus of claim 1, wherein, The spraying module comprises a nozzle and a connecting piece, and the connecting piece is arranged to be fixed to the second member to fluidly connect the nozzle.

8. The apparatus of claim 1, wherein, The clamping and rotating module comprises a bearing part, and an even number of protruding parts are arranged on the periphery of the bearing part.

9. The apparatus of claim 8, wherein, The bearing part is formed with a groove, the groove is located at the middle part of the bearing part and the periphery of the bearing part, and a chamfer is formed on the side of the groove close to the periphery.

10. The apparatus of claim 1, wherein, The side wall of the device body forming the space is outwardly convex in the direction away from the clamping and rotating module in the height direction of the clamping and rotating module.

11. The apparatus of claim 1, wherein, The bottom wall of the device body forming the space is upwardly convex in the direction close to the clamping and rotating module.

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