A seamless joining method of a multi-layer substrate and a test carrier

Abstract

The present invention provides a method for seamlessly joining a multi-layer substrate and a test carrier, comprising: printing solder paste on the welding surface of the test carrier, the solder paste having a first thickness; using an automatic pressing device to bond the multi-layer substrate and the test carrier; after the bonded multi-layer substrate and the test carrier are sent into a vacuum vapor welding furnace for tin melting, the solder paste has a third thickness. The method for seamlessly joining a multi-layer substrate and a test carrier provided by the present invention improves the process flow of bonding the multi-layer substrate and the test carrier, thereby ensuring product flatness and position accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a method for seamlessly joining a multi-layer substrate and a testing carrier. Background Art

[0002] With the continuous advancement of semiconductor technology, chip testing technology as a supporting industry has also been continuously upgraded. Chip testing technology is gradually transitioning from traditional cantilever probe cards to vertical probe cards with more stable and outstanding performance, and has derived a series of test carriers with specific characteristics.

[0003] At present, the conventional method of combining multi-layer substrates and test carriers is to implant balls, then weld and fill with glue. However, the flatness and position accuracy of the products combined in this way are difficult to control. In addition, due to the large number of processes and complex techniques, it is difficult to guarantee the product qualification rate. When a defective product is returned for repair, complex processes are also required, which makes repair difficult and easily damages the expensive multi-layer substrate.

[0004] Therefore, it is necessary to provide a method for seamlessly joining a multi-layer substrate and a test carrier to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a method for seamlessly joining a multi-layer substrate and a test carrier, thereby ensuring product flatness and position accuracy by improving the process flow of joining the multi-layer substrate and the test carrier.

[0006] An embodiment of the present invention provides a method for seamlessly joining a multi-layer substrate and a test carrier, comprising:

[0007] Printing solder paste on the welding surface of the test carrier, wherein the solder paste has a first thickness;

[0008] Using an automatic positioning and pressing device to align and bond the multi-layer substrate with the test carrier;

[0009] After the bonded multi-layer substrate and the test carrier are sent into a vacuum vapor phase soldering furnace to melt the tin, the solder paste has a third thickness.

[0010] Preferably, the multi-layer substrate is a multi-layer organic substrate or a multi-layer ceramic substrate.

[0011] Preferably, the first thickness of the solder paste is 60 um.

[0012] Preferably, the automatic positioning and pressing device is provided with a temperature control sensing unit. When the temperature control sensing unit senses that the temperature reaches the melting temperature of the solder paste, the automatic positioning and pressing device is started to press down. When the automatic positioning and pressing device is pressed down to the limit height, the welding and melting of the solder paste ends, the thickness of the solder paste shrinks, and the third thickness of the solder paste is less than or equal to 30um.

[0013] Preferably, the automatic positioning and pressing device is provided with an optical sensing module, which is used to sense the real-time height of the automatic positioning and pressing device from the test carrier. During the tin melting process, the automatic positioning and pressing device presses down the multi-layer substrate and stops pressing after reaching a preset height from the test carrier.

[0014] Preferably, the preset height is the thickness of the multi-layer substrate plus 30 um.

[0015] Preferably, a precise positioning fixture is used to control the relative position accuracy within 50um.

[0016] Preferably, the vacuum vapor welding removes bubbles and holes generated in solder paste welding, so that after the solder melting is completed, the middle gap of the solder paste is less than 30um, and the flatness of the solder paste is less than or equal to 30um.

[0017] Preferably, the automatic positioning and pressing device is provided with a pressing module, the pressing module is provided with a cavity, the cavity contains a slider and a spring, the slider and the spring are abutted, the slider is used to move up and down in the cavity of the pressing module, and the spring is used to contract when the automatic positioning and pressing device is pressed down, and to relax when the automatic positioning and pressing device is lifted up.

[0018] Preferably, the automatic positioning and pressing device is provided with a limit module and a positioning pin, the limit module is used to limit and fix the pressing module on the automatic positioning and pressing device, and the positioning pin is used to fix the automatic positioning and pressing device on the test carrier.

[0019] Compared with the prior art, the technical solution of the embodiment of the present invention has at least the following beneficial effects:

[0020] The present invention provides a method for seamlessly joining a multi-layer substrate and a test carrier, comprising: printing solder paste on a welding surface of the test carrier, wherein the solder paste has a first thickness; using an automatic positioning and pressing device to bond the multi-layer substrate and the test carrier; after the bonded multi-layer substrate and the test carrier are sent into a vacuum vapor phase welding furnace for tin melting, the solder paste has a third thickness, and the process flow of bonding the multi-layer substrate and the test carrier is improved, thereby ensuring product flatness and position accuracy;

[0021] Furthermore, the automatic positioning and pressing device is provided with a temperature control sensing unit, and when the temperature control sensing unit senses that the temperature reaches the melting temperature of the solder paste, the automatic positioning and pressing device is started to press down, and when the automatic positioning and pressing device is pressed down to the limit height, the welding and tin melting are ended, and the thickness of the solder paste shrinks, and the third thickness of the solder paste is less than or equal to 30um. The real-time temperature is sensed by the temperature control sensing unit, so that the automatic positioning and pressing device is started to press down when the melting temperature of the solder paste is accurately reached, and the welding and tin melting are ended when the automatic positioning and pressing device reaches the limit height, so that the third thickness of the solder paste is accurately controlled within 30um. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic flow chart of a method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of printing solder paste on the welding surface of the test carrier board in the method for seamlessly joining a multi-layer substrate and a test carrier board in an embodiment of the present invention;

[0024] Figure 3 is a structural schematic diagram of a method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention when the solder paste has a first thickness;

[0025] Figure 4 is a structural schematic diagram of the solder paste having a second thickness in the method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention;

[0026] Figure 5 is a structural schematic diagram of the solder paste having a third thickness in the method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention;

[0027] Figure 6 It is a structural schematic diagram of an automatic positioning and pressing device in a method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention.

[0028] Description of reference numerals:

[0029] 11- Test the carrier board;

[0030] 12-Multilayer substrate;

[0031] 13- solder paste; 131- first thickness; 132- second thickness; 133- third thickness;

[0032] 141-pressing module; 1411-sliding block; 1412-spring; 142-limiting module; 143-locating pin;

[0033] 15-Optical sensing module. DETAILED DESCRIPTION

[0034] In order to make the purpose, features and beneficial effects of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It is understood that the specific embodiments described below are only used to explain the present invention, rather than to limit the present invention. In addition, the same or similar reference numerals may be used in the figures to refer to the same or similar elements in different embodiments, and the description of the same or similar elements in different embodiments and the description of the prior art elements, features, effects, etc. may be omitted.

[0035] Figure 1 is a schematic flow chart of a method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of printing solder paste on the welding surface of the test carrier board in the method for seamlessly joining a multi-layer substrate and a test carrier board in an embodiment of the present invention; Figure 3 is a structural schematic diagram of a method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention when the solder paste has a first thickness; Figure 4 is a structural schematic diagram of the solder paste having a second thickness in the method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention; Figure 5 is a structural schematic diagram of the solder paste having a third thickness in the method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention; Figure 6 It is a structural schematic diagram of an automatic positioning and pressing device in a method for seamlessly joining a multi-layer substrate and a test carrier in an embodiment of the present invention.

[0036] Now refer to Figures 1 to 6 An embodiment of the present invention provides a method for seamlessly joining a multi-layer substrate and a test carrier, which ensures product flatness and position accuracy by improving the process flow of joining the multi-layer substrate and the test carrier.

[0037] View now Figure 1 , a method for seamlessly joining a multi-layer substrate and a test carrier provided by an embodiment of the present invention comprises:

[0038] Step S101: printing solder paste 13 on the welding surface of the test carrier 11, wherein the solder paste 13 has a first thickness 131;

[0039] Step S102: using an automatic positioning and pressing device to align and join the multi-layer substrate 12 and the test carrier 11;

[0040] Step S103 : After the bonded multi-layer substrate 12 and the test carrier 11 are sent into a vacuum vapor phase soldering furnace to melt the solder, the solder paste 13 has a third thickness 133 .

[0041] Specifically, the solder paste 13 is printed on the soldering surface of the test carrier board 11 using a 0.06 mm thick steel mesh.

[0042] View now Figure 2 , solder paste 13 is printed on the welding surface of the test carrier board 11.

[0043] In a specific implementation, the multi-layer substrate 12 is a multi-layer organic substrate or a multi-layer ceramic substrate.

[0044] View now Figure 3 Before the multi-layer substrate 12 and the test carrier 11 are bonded together using the automatic positioning and pressing device, the solder paste 13 has a first thickness 131 .

[0045] In a specific implementation, the first thickness 131 of the solder paste 13 is 60 um.

[0046] Specifically, the thickness of the solder paste 13 is inspected by using SPI (Solder Paste Inspection) optical 3D inspection equipment.

[0047] In a specific implementation, the automatic positioning and pressing device is provided with a temperature control sensing unit. When the temperature control sensing unit senses that the temperature reaches the melting temperature of the solder paste, the automatic positioning and pressing device is started to press down. When the automatic positioning and pressing device is pressed down to the limit height, the welding and melting of the solder paste 13 ends, and the thickness of the solder paste 13 shrinks. The third thickness 133 of the solder paste 13 is less than or equal to 30um, and the melting temperature of the solder paste is 230 degrees.

[0048] In a specific implementation, the automatic positioning and pressing device is provided with an optical sensing module 15, which is used to sense the real-time height of the automatic positioning and pressing device from the test carrier 11. During the tin melting process, the automatic positioning and pressing device presses down the multi-layer substrate 12 and stops pressing after reaching a preset height from the test carrier 11.

[0049] View now Figure 4 When the automatic positioning and pressing device presses down the multi-layer substrate 12 , the solder paste 13 is compressed, and at this time, the solder paste 13 has a second thickness 132 .

[0050] Specifically, limit control nodes are set around the automatic positioning and pressing device. When the automatic positioning and pressing device reaches the limit control node, the optical sensing module 15 senses it and feeds back to the control end of the automatic positioning and pressing device, and the automatic positioning and pressing device stops pressing down.

[0051] In a specific implementation, the preset height is the thickness of the multi-layer substrate 12 plus 30 um.

[0052] In the specific implementation, a precise positioning fixture is used to control the relative position accuracy within 50um.

[0053] Specifically, X-ray is used to inspect the welding quality, and optical three-coordinate measurement is used to inspect whether the position accuracy is within 50um.

[0054] In a specific implementation, the vacuum vapor welding eliminates bubbles and holes generated in solder paste welding, so that after the solder melting is completed, the middle gap of the solder paste 13 is less than 30um, and the flatness of the solder paste 13 is less than or equal to 30um.

[0055] View now Figure 5 After the automatic positioning and pressing device completes the action of pressing down the multi-layer substrate 12, the soldering and melting of tin are terminated, and finally the solder paste has a third thickness 133.

[0056] In a specific implementation, the automatic positioning and pressing device is provided with a pressing module 141, and the pressing module 141 is provided with a cavity, in which a slider 1411 and a spring 1412 are accommodated, and the slider 1411 and the spring 1412 are abutted against each other, and the slider 1411 is used to move up and down in the cavity of the pressing module 141, and the spring 1412 is used to contract when the automatic positioning and pressing device is pressed down, and to relax when the automatic positioning and pressing device is lifted up.

[0057] In a specific implementation, the automatic positioning and pressing device is provided with a limiting module 142 and a positioning pin 143, wherein the limiting module 142 is used to limit and fix the pressing module 141 on the automatic positioning and pressing device, and the positioning pin 143 is used to fix the automatic positioning and pressing device on the test carrier 11.

[0058] The method for seamlessly joining a multi-layer substrate and a test carrier provided by an embodiment of the present invention comprises: printing solder paste on a welding surface of the test carrier, wherein the solder paste has a first thickness; using an automatic positioning and pressing device to bond the multi-layer substrate and the test carrier; after the bonded multi-layer substrate and the test carrier are sent into a vacuum vapor phase welding furnace for tin melting, the solder paste has a third thickness, and the process flow of bonding the multi-layer substrate and the test carrier is improved, thereby ensuring the flatness and position accuracy of the product;

[0059] Furthermore, the automatic positioning and pressing device is provided with a temperature control sensing unit, and when the temperature control sensing unit senses that the temperature reaches the melting temperature of the solder paste, the automatic positioning and pressing device is started to press down, and when the automatic positioning and pressing device is pressed down to the limit height, the welding and tin melting are ended, and the thickness of the solder paste shrinks, and the third thickness of the solder paste is less than or equal to 30um. The real-time temperature is sensed by the temperature control sensing unit, so that the automatic positioning and pressing device is started to press down when the melting temperature of the solder paste is accurately reached, and the welding and tin melting are ended when the automatic positioning and pressing device reaches the limit height, so that the third thickness of the solder paste is accurately controlled within 30um.

[0060] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even when only a single embodiment is described with respect to specific features. The feature examples provided in the present disclosure are intended to be illustrative rather than limiting, unless otherwise stated. In specific implementations, the technical features of one or more dependent claims may be combined with the technical features of the independent claims, based on actual needs and where technically feasible, and the technical features from the corresponding independent claims may be combined in any appropriate manner rather than just by the specific combinations listed in the claims.

[0061] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A method for seamlessly joining a multi-layer substrate and a test carrier, characterized in that: include: Printing solder paste on the welding surface of the test carrier, wherein the solder paste has a first thickness; Using an automatic positioning and pressing device to align and bond the multi-layer substrate with the test carrier; After the bonded multi-layer substrate and the test carrier are sent into a vacuum vapor phase soldering furnace to melt tin, the solder paste has a third thickness; The automatic positioning and pressing device is provided with a temperature control sensing unit. When the temperature control sensing unit senses that the temperature reaches the melting temperature of the solder paste, the automatic positioning and pressing device is started to press down. When the automatic positioning and pressing device is pressed down to the limit height, the welding and melting of the solder paste are completed, the thickness of the solder paste shrinks, and the third thickness of the solder paste is less than or equal to 30um. The automatic positioning and pressing device is provided with an optical sensing module, and the optical sensing module is used to sense the real-time height of the automatic positioning and pressing device from the test carrier. During the tin melting process, the automatic positioning and pressing device presses down the multi-layer substrate and stops pressing down after reaching a preset height from the test carrier. Limit control nodes are set around the automatic positioning and pressing device. When the automatic positioning and pressing device reaches the limit control node, the optical sensing module senses it and feeds back to the control end of the automatic positioning and pressing device, and the automatic positioning and pressing device stops pressing down. The automatic positioning and pressing device is provided with a pressing module, the pressing module is provided with a cavity, a slider and a spring are accommodated in the cavity, the slider and the spring are in contact, the slider is used to move up and down in the cavity of the pressing module, and the spring is used to contract when the automatic positioning and pressing device is pressed down, and to relax when the automatic positioning and pressing device is lifted up; The automatic positioning and pressing device is provided with a limit module and a positioning pin, wherein the limit module is used to limit and fix the pressing module on the automatic positioning and pressing device, and the positioning pin is used to fix the automatic positioning and pressing device on the test carrier; Use precise positioning fixtures to control the relative position accuracy within 50um, use x-ray to inspect the welding quality, and use optical three-coordinate to inspect whether the position accuracy is within 50um; The vacuum vapor welding removes bubbles and holes generated in solder paste welding, so that after the solder melting is completed, the middle gap of the solder paste is less than 30um, and the flatness of the solder paste is less than or equal to 30um.

2. The method for seamlessly joining a multi-layer substrate and a test carrier according to claim 1, characterized in that: The multi-layer substrate is a multi-layer organic substrate or a multi-layer ceramic substrate.

3. The method for seamlessly joining a multi-layer substrate and a test carrier according to claim 1, characterized in that: The first thickness of the solder paste is 60 um.

4. The method for seamlessly joining a multi-layer substrate and a test carrier according to claim 1, characterized in that: The preset height is the thickness of the multi-layer substrate plus 30 um.

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