Substrate Carrier Fixture

Abstract

The present invention relates to a substrate carrier clamp, which is equipped with a plurality of upper and lower clamps respectively provided with clamping magnets for clamping and holding the edge of a substrate. By tilting and rotating the substrate carrier clamp equipped with the upper and lower clamps to an inclined angle, chemicals such as etching liquid can be uniformly treated on the surface of the substrate. At the same time, the retention of chemicals such as etching liquid can be reduced by minimizing the contact area of ​​the substrate held by the upper and lower clamps. Furthermore, the structure is improved by forming first and second protrusions protruding in different shapes at the ends of the upper and lower clamps at the parts in contact with the upper and lower sides of the substrate to induce the discharge of the liquid and thereby prevent the retention of the etching liquid.

Description

Technical Field

[0001] The present invention relates to a substrate carrier fixture, and more particularly to a substrate carrier fixture equipped with a plurality of upper and lower clamps respectively provided with clamping magnets for clamping and holding the edge of a circuit substrate. The substrate carrier fixture equipped with the upper and lower clamps can be tilted and rotated to an inclined angle so that chemicals such as etching liquid can be uniformly treated on the surface of the substrate. At the same time, the retention of chemicals such as etching liquid can be reduced by minimizing the contact area of ​​the circuit substrate held by the upper and lower clamps. Furthermore, the substrate carrier fixture is improved by forming first and second protrusions protruding in different shapes at the ends of the upper and lower clamps at the parts in contact with the upper and lower sides of the substrate to induce the discharge of liquid and thereby prevent the retention of etching liquid.

[0002] In addition, the present invention relates to an improved substrate carrier clamp having a structure that can maintain the tension of a carrier clamp by adjusting the length of the first and second frames of the carrier clamp in the shape of a rectangular frame composed of the first, second and third and fourth frames by utilizing the repulsive force of an adjusting magnet, and can also easily complete the clamping and releasing actions of the upper clamp that can be rotated by means of a hinge pin and an elastic spring through the lifting and lowering actions of the contact frames of the first and second disassembly and assembly units. Background Art

[0003] Generally speaking, a printed circuit board (PCB) refers to a basic component used in electronic communication equipment, etc. Recently, with the trend of electronic products towards miniaturization, thinness, high density, packaging, and personal portability, the multi-layer formation of multi-layer circuit layers, fine patterning of circuit patterns, miniaturization, and packaging are all developing simultaneously.

[0004] Therefore, in order to form fine patterns on printed circuit boards and improve their reliability and design density, there is a trend towards a structure that compounds the layer structure of the circuit while changing the raw materials. The components have also evolved from dual in-line package (DIP) type to surface mount technology (SMT) type, and the mounting density is gradually increasing.

[0005] In addition, the printed circuit substrate includes a circuit pattern for electrically connecting a plurality of electronic components, and also includes a bump electrically connected to the circuit pattern, wherein the electronic components are electrically connected to the bump and mounted on the printed circuit substrate, thereby electrically connecting the electronic components and the circuit pattern to each other.

[0006] Recently, in order to adapt to the development of the semiconductor and display device industries and cater to the needs of consumers who desire thin and small products, it is urgent to develop a technology that can thin the display panel (Panel) manufactured in the form of glass bonding. In addition, more specifically, etching technology for forming fine patterns on substrates has also attracted people's attention.

[0007] That is, as devices become thinner, the thickness of glass used in substrates of liquid crystal displays (LCDs) and the like also needs to be reduced to an ultra-thin level, and the above-mentioned thinning technology can be achieved by etching the display panel.

[0008] As well-known existing technologies for thinning a panel by using a chemical etching method, there are dip coating and spray coating methods.

[0009] In particular, in single-side etching in which one side of a large glass substrate is etched or thinned by supplying an etching liquid from the outside of the substrate, such as by a spray method, the following process is generally performed.

[0010] First, a protective film (such as tape, etc.) is formed to adhere and fix the substrate to a substrate table used to fix the substrate, and after the substrate is adhered, the contact surface between the substrate and the substrate table is sealed. Next, etching is performed by supplying etching liquid to one side of the substrate using an etching module.

[0011] However, the etching process as described above is performed when the substrate thickness before etching is above a certain level, and ends with the substrate being thinned to an extremely thin thickness after etching. When the sealing material is subsequently removed and the tape is torn off, the functional film on the substrate may be damaged or the circuit on the other side of the etched surface of the substrate may be damaged.

[0012] As a prior art related to the existing clamp for substrate carrier, as disclosed in Korean registered patent gazette No. 10-1038572 "Substrate chemical processing system equipped with vacuum substrate clamp" (registration date: 2011.05.26), a chemical processing system for thinning or forming a pattern on a substrate by supplying etching liquid to the substrate using an etching liquid supply module includes: a vacuum substrate clamp body formed in a shape corresponding to the substrate; a plurality of vacuum holes formed on the vacuum substrate clamp body and connected to a vacuum pipeline for substrate adsorption; and a sealing portion for sealing the substrate surface that is close to the vacuum substrate clamp surface.

[0013] As described above, when vacuum pressure is applied, since a vacuum flow path and a vacuum hose need to be installed on the base plate, not only will the substrate structure become complicated, but a separate vacuum device for forming vacuum pressure needs to be additionally installed, which will lead to a significant increase in manufacturing costs and the printed circuit substrate being damaged by the vacuum pressure.

[0014] As another prior art related to the existing substrate carrier clamp, as disclosed in Korean Patent Gazette No. 10-2022-150488 "Substrate Holding Clamp Device for Substrate Processing Device" (publication date: 2022.11.11), a device used to hold each substrate in a substrate processing device for processing while continuously moving the substrate in a vertically upright state, includes: a clamp frame, a rectangular shape composed of an upper rod, a lower rod, a left rod and a right rod; upper and lower clamps, each of which is installed in a plurality along the extension direction of the upper rod and the lower rod, for holding the upper and lower ends of the substrate; and a side end holding mechanism, installed at one or more of the left rod and the right rod, for holding the side end of the substrate.

[0015] In the situation described above, because the upper and lower clamps and the side end holding mechanism will elastically clamp the edge of the substrate in the form of clamps, the etching liquid will be retained on the edge of the substrate clamped by the upper and lower clamps and the side end holding mechanism, resulting in a decrease in the thickness flatness of the etched substrate and a decrease in the etching effect.

[0016] Prior art literature

[0017] Patent Literature

[0018] (Patent Document 1) Korean Registered Patent Publication No. 10-1038572 “Substrate Chemical Processing System Equipped with Vacuum Substrate Clamp” (Registration Date: 2011.05.26)

[0019] (Patent Document 2) Korean Patent Publication No. 10-2022-150488 “Substrate Holding Clamp Device for Substrate Processing Device” (Publication Date: 2022.11.11) Summary of the invention

[0020] The present invention aims to solve the problems mentioned above, and its purpose is to provide a plurality of upper and lower clamps equipped with magnets respectively on the upper and lower clamps for clamping and holding the edge of the circuit substrate. The substrate carrier clamp equipped with the upper and lower clamps can be tilted and rotated to an inclined angle so that the etching liquid can evenly etch the surface of the substrate. At the same time, the retention of the etching liquid can be reduced by minimizing the contact area of ​​the circuit substrate held by the upper and lower clamps. Furthermore, the first and second protrusions protruding in different shapes at the ends of the upper and lower clamps in contact with the upper and lower sides of the substrate can induce the discharge of the liquid and thereby prevent the retention of the etching liquid.

[0021] Another object of the present invention is to provide a substrate carrier fixture having an improved structure that can maintain the tension of the carrier fixture by adjusting the length of the first and second frames of the carrier fixture in a rectangular frame shape composed of the first, second and third and fourth frames by utilizing the repulsive force of magnets.

[0022] Another object of the present invention is to provide a substrate carrier clamp with an improved structure that can easily complete the clamping and unclamping actions of the upper clamp that can be rotated by means of a hinge pin and an elastic spring through the lifting and lowering action of the disassembly unit.

[0023] In order to achieve the above-mentioned purpose, the present invention is characterized in that it includes: a clamping frame, which is composed of a first, a second and a third, and a fourth frame; upper and lower clamps are arranged in a manner separated from the first, second frames and the third, and fourth frames of the clamping frame, respectively, and are respectively provided with clamping magnets for clamping the edge of the substrate, so that the upper clamp can rotate around the hinge axis under the attraction of the magnet; a first protrusion is formed by protruding downward from the lower side surface of one end of the upper clamp; a second protrusion is formed by protruding upward from the upper side surface of one end of the lower clamp, and is composed of a plurality of protrusions separated from each other for discharging liquid; and a tension adjustment component is located between one end of the first and second frames and the fourth frame, and maintains tension by adjusting the interval between the first, second frames and the fourth frame.

[0024] The upper clamp has an extension portion formed at the other end which is extended outward compared to the hinge pin and interferes when the disassembly unit is lowered to rotate the upper clamp upward, while the lower clamp has a stepped recessed step formed on one end side of the upper surface.

[0025] The first and second protrusions are made of silicone resin material for contact with the substrate.

[0026] In order to minimize the contact area with the substrate, the upper and lower clamps are formed with first and second holding parts at one end, the volume of which is smaller than the width volume of the middle part, and the first and second protrusions are formed at the parts where the first and second holding parts contact each other.

[0027] The tension adjustment assembly includes: a first connecting block, which is bolted together in a manner overlapping with one end of the first and second frames and is equipped with a first adjusting magnet; a second connecting block, which is bolted together in a manner overlapping with one end and the other end of the fourth frame respectively, and is equipped with a second adjusting magnet with the same magnetic polarity as the first adjusting magnet to form a repulsive force, and is arranged to be spaced apart from the first connecting block; a connecting hole formed inside the first connecting block; and a guide pin, which is arranged inside the second connecting block in a manner embedded in a guide bushing and is connected in a manner that the end is embedded in the connecting hole, thereby guiding the horizontal movement of the first and second connecting blocks.

[0028] An elastic spring having elastic force in a direction in which the upper clamp rotates toward the lower clamp is combined with the hinge pin, thereby providing a restoring force.

[0029] The present invention is equipped with a plurality of upper and lower clamps respectively provided with clamping magnets in order to clamp and hold the edge of the substrate. By tilting and rotating the substrate carrier clamp equipped with the upper and lower clamps to an inclined angle, chemicals such as etching liquid can be uniformly treated on the surface of the substrate. At the same time, the retention of chemicals such as etching liquid can be reduced by minimizing the contact area of ​​the substrate held by the upper and lower clamps to the maximum. Furthermore, the first and second protrusions protruding in different shapes at the ends of the upper and lower clamps in contact with the upper and lower sides of the substrate can induce the discharge of liquid and thereby prevent the retention of etching liquid.

[0030] The present invention can maintain the tension of the carrier fixture by adjusting the length of the first and second frames of the carrier fixture in a rectangular frame shape formed by the first, second and third and fourth frames by using the repulsive force of the adjusting magnet.

[0031] The present invention can easily complete the clamping and releasing actions of the upper clamp which can be rotated by means of a hinge pin and an elastic spring through the lifting and lowering actions of the contact frames of the first and second disassembling and assembling units. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is an oblique view illustrating a substrate carrier fixture according to the present invention;

[0033] Figure 2 yes Figure 1 Floor plan of

[0034] Figure 3 is an oblique view illustrating the upper and lower clamps of the present invention;

[0035] Figure 4 yes Figure 3 sectional view of;

[0036] Figure 5 is a use state diagram illustrating a state in which the edge of a substrate is clamped by the first and second protruding portions of the upper and lower clamps of the present invention;

[0037] Figure 6 is an oblique view illustrating the structure of the tension adjustment assembly of the present invention;

[0038] Figure 7 yes Figure 6 Floor plan of

[0039] Figure 8 yes Figure 7 Front view of

[0040] Fig. 9 This is a structural diagram illustrating the structure of a substrate chemical processing system to which the substrate carrier fixture of the present invention is applied;

[0041] Fig.10 is an oblique view of the first and second disassembly and assembly units of the present invention;

[0042] Fig.11 yes Fig.10 Front view of

[0043] Fig.12 yes Fig.10 Floor plan of

[0044] Fig.13 is an oblique view of the tilting unit of the present invention;

[0045] Fig.14 It is a usage state diagram of the tilting unit of the present invention.

[0046] Description of Reference Numerals

[0047] 10: First Subject

[0048] 20: Second Subject

[0049] 30: Processing tank

[0050] 50: (Printed circuit) substrate

[0051] 100: Substrate carrier fixture

[0052] 110: Clamping frame

[0053] 111, 112, 113, 114: first, second, third, fourth frame

[0054] 120: Upper clamp

[0055] 121, 131: Clamping magnet

[0056] 122: Extension

[0057] 124, 134: First and second gripping parts

[0058] 125, 135: first and second protrusions

[0059] 130: Lower clamp

[0060] 135a: Drainage channel

[0061] 200: Tension adjustment assembly

[0062] 210, 220: first and second connection blocks

[0063] 230, 240: First and second adjustment magnets

[0064] 250: Connection hole

[0065] 260: Guide pin

[0066] 270: Guide bushing

[0067] 300A, 300B: First and second disassembly units

[0068] 301: Framework body

[0069] 310: Lifting actuator

[0070] 320: Contact frame

[0071] 325: Contact roller

[0072] 350: Arrange components

[0073] 352: Stopper components

[0074] 354: Mobile actuator

[0075] 400A: Substrate Supply Department

[0076] 400B: Substrate discharge unit

[0077] 410: Track Department

[0078] 420: Lifting Department

[0079] 430: Adsorption

[0080] 500A, 500B: First and second tilting units

[0081] 501: Fixed plate

[0082] 505: Tilt the subject

[0083] 510: Rotating pin

[0084] 520: Tilt Actuator

[0085] 525: Tilt Rod

[0086] 600A, 600B: First and second transfer units

[0087] 700A, 700B: First and second lifting units

[0088] 800: Mobile devices DETAILED DESCRIPTION

[0089] In the process of describing the present invention, when it is determined that the specific description of the relevant known technology or composition may cause the gist of the present invention to become unclear, the detailed description related thereto will be omitted. In addition, the terms used subsequently are defined in consideration of the functions in the present invention and may change according to the intention or convention of the user. Therefore, the definition should be made based on the entire contents of this specification. In addition, when it is recorded as "including" a certain constituent element, unless otherwise clearly stated to the contrary, it does not mean that other constituent elements are excluded, but that other constituent elements may also be included.

[0090] like Figures 1 to 8 As shown, the substrate carrier fixture according to the present invention includes: a clamping frame 110, which is composed of a first, a second and a third and a fourth frame 111, 112, 113, 114; an upper and a lower clamp 120, 130, which are respectively arranged in a manner of being spaced apart from the first and second frames 111, 112 and the third and fourth frames 113, 114 of the clamping frame 110, and are respectively provided with clamping magnets 121, 131 for clamping and holding the edge of the substrate 150, so that the upper clamp 120 can rotate around the hinge shaft 140 under the attraction of the magnet; a first protrusion 125, which is formed to protrude downward from the lower side surface of one end of the upper clamp 120; and a second protrusion 135, which is formed to protrude upward from the upper side surface of one end of the lower clamp 130, and is composed of a plurality of protrusions spaced apart from each other for discharging liquid.

[0091] The substrate 50 is a printed circuit board (PCB).

[0092] See also Figure 1 as well as Figure 2 In order to clamp and hold the edge of the substrate 50, the substrate carrier clamp 100 is combined in a manner that the lower clamp 130 is fixed to the first and second frames 111, 112 and the third and fourth frames 113, 114 of the clamping frame 110, and the upper clamp 120 is combined to the upper side of the lower clamp 130 in a manner that it can rotate around the hinge pin 140 as the center.

[0093] One end of the first and second frames 111 and 112 is coupled to the fourth frame 114 on the right side via the tension adjustment assembly 200, while the other end of the first and second frames 111 and 112 is coupled to the third frame 113 on the left side via a fastening component.

[0094] An elastic spring 150 having elastic force in a direction in which the upper clamp 120 rotates toward the lower clamp 130 is coupled to the hinge pin 140 , thereby providing a restoring force.

[0095] Furthermore, when the upper and lower clamps 120 and 130 overlap each other to clamp the substrate 50 , they can firmly clamp the edges of the substrate 50 by means of the attractive force of the magnets respectively provided thereto.

[0096] The upper clamp 120 is formed with an extension portion 122 at the other end, which is extended outward compared to the hinge pin 140 and rotates the upper clamp 120 upward due to interference when the disassembly and assembly unit described below performs a descending action. As a result, when the first and second disassembly and assembly units 300A and 300B perform a descending action and interfere, the upper clamp 120 can be folded in a direction away from the lower clamp 130 with the hinge pin 140 as the center, thereby releasing the clamping state of the substrate 50.

[0097] The lower clamp 130 is formed with a stepped recessed step 133 at one end side of the upper surface, and is fixed to the first and second frames 111, 112 and the third and fourth frames 113, 114 by fastening components such as bolts or rivets.

[0098] The cutout portion 133 will provide a space for accommodating the first protrusion 125 in a non-interference manner when the upper and lower clamps 120 and 130 are tightly attached for clamping.

[0099] like Figure 3 As shown, in order to minimize the contact area with the substrate 50, the upper and lower clamps 120, 130 are provided with first and second holding portions 124, 134 at one end, the volume of which is smaller than the width volume of the middle portion, and the first and second protrusions 125, 135 are formed at the portion where the first and second holding portions 124, 134 contact each other.

[0100] The first and second protrusions 125 and 135 are made of silicone resin material in order to minimize scratches caused when contacting the substrate 50 .

[0101] See also Figure 3 as well as Figure 4 The first protrusion 125 protrudes downward from the lower side surface of the first holding portion 124 of the upper clamp 120, and the second protrusion 135 protrudes upward from the upper side surface of the second holding portion 134 of the lower clamp 130. In order to prevent liquid such as etching liquid from being retained and easily discharged, a plurality of protrusions separated from each other in a grid shape are formed, and a drainage channel 135a for liquid discharge is formed between the protrusions.

[0102] like Figure 1 As shown, the clamping frame 110 also includes: a tension adjustment component 200, which is located between one end of the first and second frames 111, 112 and the fourth frame 114, and maintains tension by adjusting the interval between the first and second frames 111, 112 and the fourth frame 114.

[0103] like Figure 6 and Figure 7 as well as Figure 8 As shown, the tension adjustment component 200 includes: a first connecting block 210, which is bolted together in a manner overlapping with one end of the first and second frames 111 and 112, and is equipped with a first adjusting magnet 230; a second connecting block 220, which is bolted together in a manner overlapping with one end and the other end of the fourth frame 114, respectively, and is equipped with a second adjusting magnet 240 with the same magnetic polarity to form a repulsive force with the first adjusting magnet 230, and is arranged to be spaced relative to the first connecting block 210; a connecting hole 250, which is formed inside the first connecting block 210; and a guide pin 260, which is arranged inside the second connecting block 220 in a manner of being embedded in a guide bushing 270 and is combined in a manner of having its end embedded in the connecting hole 250, thereby guiding the horizontal movement of the first and second connecting blocks 210 and 220.

[0104] like Figure 7 as well as Figure 8 As shown, the left side portion of the first connecting block 210 is connected to an end portion located on the right side of the first and second frames 111 and 112 in an overlapping manner through fastening components such as bolts, while the right side portion is convex and bent upward and a first adjustment magnet 230 is arranged on the upper side.

[0105] like Figure 8As shown, the right side portion of the second connecting block 220 is configured in a manner of overlapping with the upper and lower sides of the end of the fourth frame 114 and is connected by fastening components such as bolts, while the left side portion is formed in a form corresponding to the first connecting block 210 and a second adjusting magnet 240 is configured on the upper side.

[0106] like Figure 8 As shown, the guide pin 260 is disposed on the inner side of the second connection block 220 , and its end is connected to the connection hole 250 of the first connection block 210 , thereby guiding the horizontal movement of the first connection block 210 .

[0107] Thus, the first connection block 210 can be spaced apart by a certain distance by means of the repulsive force of the first and second adjusting magnets, thereby providing assistance for the tension movement of the first and second frames 111 and 112 and maintaining the tension for clamping and holding the substrate 50 .

[0108] The tension adjustment assembly 200 is integrally connected to the first and second frames 111, 112 and the third frame 113 in order to maintain the tension transmitted to the substrate 50 clamped by the upper and lower clamps 120, 130, so that the guide pins 260 and the connecting holes 250 are used to configure the assembly 200 in a manner movable relative to the fourth frame 114, and the repulsive force of the first and second adjustment magnets is used to maintain the distance between the first, second and third frames 111, 112, 113 relative to the fourth frame 114, thereby maintaining the tension on one side of the substrate 50 and preventing the substrate 50 from being deformed.

[0109] Figures 9 to 14The schematic diagram is a diagram illustrating a substrate drug processing system using the substrate carrier fixture 100 according to the present invention as described above, comprising: a processing tank 30 for performing a drug process or a water washing process on a substrate 50; a first and a second main body 10, 20, arranged on the left and right sides of the processing tank 30, and equipped with a transfer device 800 for cyclically transferring the substrate carrier fixture 100 that clamps or releases the substrate 50; a first disassembly unit 300A, arranged on the first main body 10 in a manner that it can be raised and lowered, and by interfering with the upper clamp 120 of the substrate carrier fixture 100 when performing a descending action, The upper clamp 120 rotates to place the edge of the substrate 50 on one end of the lower clamp 130; the substrate supply part 400A is equipped in the first main body 10, and supplies the substrate to the upper side of the substrate carrier fixture 100 from which the clamping state of the upper and lower clamps 120 and 130 is released by the first disassembly unit 300A; the first tilting unit 500A is equipped in the first main body 10, and tilts and rotates the substrate carrier fixture 100 to a tilt angle in a state where the upper and lower clamps 120 and 130 of the substrate carrier fixture 100 clamp the substrate 50; the first transfer part 600A transfers the substrate carrier fixture 100 to the substrate carrier fixture 100; 00 is transferred from the first tilting unit 500A to the side of the second main body 20 via the processing tank 30; the second tilting unit 500B is arranged in the second main body 20, and tilts and rotates the substrate carrier fixture 100 supplied from the first transfer unit 600A to a tilt angle; the second disassembly unit is arranged in the second main body 20 in a manner that can perform a lifting action, and releases the clamping state of the upper and lower clamps 120 and 130 of the substrate carrier fixture 100 supplied from the second tilting unit 500B on the substrate 50 when performing a descending action; the substrate discharge unit 400B is discharged from the substrate carrier fixture 10 0, the upper and lower clamps 120, 130 of the first main body 10 absorb the substrate 50 in the released clamping state and discharge it to the outside; the second lifting unit 700B is arranged in the second main body 20, and drives the substrate carrier clamp 100 that has separated the substrate 50 to descend; the second transfer part 600B transfers the substrate carrier clamp 100 that has completed the descending action with the help of the second lifting unit 700B to the lower side of the first main body 10; and the first lifting unit 700A is arranged in the first main body 10, and drives the substrate carrier clamp 100 transferred with the help of the second transfer part 600B to ascend.

[0110] like Fig. 9As shown, the processing tank 30 is arranged in the space between the first and second main bodies 10 and 20, and is filled with a chemical liquid for etching, stripping, developing, washing and drying the substrate 50. The chemical process or washing process of the substrate 50 is performed by immersing the substrate transferred from the first main body 10 to the second main body 20 side by means of the first transfer part 600A.

[0111] like Fig. 9 As shown, the first body 10 is disposed on the left side of the processing tank 30 and serves to supply the substrate 50 to one side of the substrate carrier jig 100 and clamp it after the substrate carrier jig 100 is sequentially transferred.

[0112] like Fig. 9 As shown, the second main body 20 is arranged on the right side of the processing tank 30, and has the function of discharging the substrate 50 to the outside after separating it from the substrate carrier fixture 100 by releasing the clamping of the substrate 50 supplied by the first transfer part 600A and clamped by the substrate carrier fixture 100, and transferring the substrate carrier fixture 100 to the side of the first main body 10 by the second transfer part 600B after the separated substrate carrier fixture 100 is lowered by the second lifting unit 700B.

[0113] The first lifting unit 700A is disposed in the first main body 10 , and functions to lift the substrate carrier jig 100 transferred from the second transfer unit 600B from the lower side to the upper side of the first main body 10 .

[0114] like Fig.10 and Fig.11 as well as Fig.12 As shown, the first disassembly and assembly unit 300A includes: a frame body 301, which is fixed to the first body 10; a plurality of contact frames 320, which are arranged on the frame body 301 and perform up and down lifting actions with the aid of a lifting actuator 310 (cylinder or motor); and have the function of folding and rotating the upper clamp 120 upward around the hinge pin 140 by contacting the extension portion 122 of the upper clamp 120 when performing a descending action.

[0115] like Fig.10 and Fig.11 as well as Fig.12As shown, the second disassembly and assembly unit 300B includes: a frame body 301, which is fixed to the second body 20; a plurality of contact frames 320, which are arranged on the frame body 301 and perform up and down lifting actions with the aid of a lifting actuator 310 (cylinder or motor); and have the function of folding and rotating the upper clamp 120 upward around the hinge pin 140 by contacting the extension portion 122 of the upper clamp 120 when performing a descending action.

[0116] To this end, the first and second detachable units 300A and 300B are respectively provided with contact frames 320 at the front, rear, left and right sides thereof, which are in contact with the extension portion 122 when descending.

[0117] In addition, if Fig.11 As shown, the multiple contact frames 320 also include: contact rollers 325, which are arranged at intervals corresponding to the intervals of the extension parts 122 arranged at intervals at their respective lower parts, and respectively contact the extension parts 122 of the upper clamp 120 when performing a descending action.

[0118] In addition, the first and second disassembly and assembly units 300A and 300B further include an arranging assembly 350 for arranging the transferred substrate carrier fixture 100 to a correct position.

[0119] like Fig.10 As shown, the arrangement component 350 includes: a limiter component 352, which is used to stop the substrate carrier fixture 100 at a correct position in the left and right directions when it is transferred; and a moving actuator 354, which moves the substrate carrier fixture 100 in the forward and backward directions in order to stop the substrate carrier fixture 100 stopped by the limiter component 352 at a correct position in the forward and backward directions.

[0120] The stopper member 352 interferes with the substrate carrier fixture 100 when the substrate carrier fixture 100 is transferred, so that the substrate carrier fixture 100 is located at a correct position in the left and right directions when the movement stops.

[0121] like Fig. 9 As shown, the substrate supply part 400A has the function of placing the substrate 50 on the upper side of the lower clamp 130 of the substrate carrier clamp 100 after the substrate 50 is adsorbed by vacuum adsorption while the upper clamp 120 is folded upward by the contact frame 320 .

[0122] To this end, the substrate supply unit 400A moves in the horizontal direction along the rail unit 410 provided on the first body 10, and is equipped with an adsorption unit 430 for vacuum adsorption of the substrate 50, and can be lifted up and down by means of a lifting unit 420 (cylinder or motor).

[0123] When the substrate supplying portion 400A descends, the upper clamp 120 is folded and rotated by the first assembly and disassembly unit 300A, so that the edge of the substrate 50 is placed on the second holding portion 134 of the lower clamp 130 .

[0124] The first tilting unit 500A is disposed between the right side of the first detachable unit 300A and the processing tank 30, and the second tilting unit 500B is disposed between the processing tank 30 and the left side of the second detachable unit 300B.

[0125] like Fig.13 as well as Fig.14 As shown, the first and second tilting units 500A, 500B include: a fixing plate 501, fixed to the first and second bodies 10, 20 respectively; a tilting body 505, arranged on the upper side of the fixing plate 501, for accommodating the substrate carrier fixture 100 transferred from the first and second disassembly and assembly units 300A, 300B, and one side portion is rotatably arranged on the fixing plate 501 by means of a rotating pin 510; and a tilting actuator 520, connected to the lower part of the tilting body 505 through a tilting rod 525, for tilting and rotating the tilting body 505 around the rotating pin 510.

[0126] The first and second tilting units 500A and 500B use the tilting actuator 520 disposed on the fixing plate to tilt and rotate the tilting body 505 on which the substrate carrier fixture 100 transferred from the first mounting and disassembling unit 300A is mounted to a tilting angle.

[0127] Therefore, the first and second tilting units 500A and 500B can tilt and rotate the substrate 50 and the substrate carrier fixture 100 clamping the substrate 50 to a tilting angle by means of the rotation of the tilting body 505 .

[0128] The first and second tilting units 500A and 500B can prevent the chemical solution from being retained on the surfaces of the substrate 50 and the substrate carrier fixture 100, thereby achieving effects such as etching with a uniform thickness.

[0129] like Fig. 9 As shown, the first and second transfer parts 600A and 600B serve to transfer the substrate carrier fixture 100 from the first body 10 to the second body 20, or from the second body 20 to the first body 10. As an example, a conveyor belt may be used.

[0130] The transfer device 800 is configured between the first lifting unit 700A and the first disassembly unit 300A, the first disassembly unit 300A and the first tilting unit 500A, and the first tilting unit 500A and the processing tank 30 for the lateral transfer of the substrate carrier clamp 100, and is also configured between the processing tank 30 and the second tilting unit 500B, the second tilting unit 500B and the second disassembly unit 300B, and the second disassembly unit 300B and the second lifting unit 700B.

[0131] In addition, the transfer device 800 can use a method of laterally transferring the substrate carrier fixture 100 with the help of a cylinder, or can be equipped with a transfer roller that can laterally transfer the substrate carrier fixture 100 in the first and second bodies 10 and 20 to the left and right directions when the transfer shaft rotates with the help of a motor.

[0132] Next, the transfer device 800 will be described limited to the case where the substrate carrier jig 100 is transferred to the right direction.

[0133] When the substrate drug processing system supplies the substrate carrier fixture 100 from the second body 20 to the first body 10 side through the second transfer unit 600B at the lower side of the first body 10, the first lifting unit 700A separates the substrate carrier fixture 100 from the second transfer unit 600B and raises it to an upper position.

[0134] Next, when the substrate carrier fixture 100 is transferred to the first assembling and disassembling unit 300A on the right side by the transfer device 800, the substrate carrier fixture 100 can be arranged at a correct position in the first assembling and disassembling unit 300A by the arrangement assembly 350 of the first assembling and disassembling unit 300A.

[0135] At this time, the arrangement assembly 350 can move the substrate carrier fixture 100 to the correct position by moving the movement actuator 354 forward and backward after the substrate carrier fixture 100 is stopped by the stopper component 352 and its left and right movements are restricted.

[0136] Next, the first disassembly and assembly unit 300A can utilize the lifting actuator 310 to make the contact frame 320 descend, thereby making it contact with the extension portion 122 of the upper clamp 120 that interferes when the contact frame 320 descends, thereby making the upper clamp 120 rotate around the hinge pin 140 and increase the distance between it and the lower clamp 130.

[0137] Next, after the substrate supply unit 400A enters the first mounting and disassembling unit 300A in a state of vacuum-absorbing the substrate 50 , the substrate 50 is placed on the second gripping portion 134 of each lower clamp 130 .

[0138] Next, when the substrate supply part 400A is made to rise again and the contact frame 320 is raised to its original position again by using the lifting actuator 310 of the first disassembly and assembly unit 300A, the first holding part 124 of the upper clamp 120 will be combined in a manner of overlapping with the upper edge of the substrate 50 placed on the upper side of the second holding part 134 of the lower clamp 130, and with the help of the attractive force of the clamping magnets 121 and 131, the edge of the substrate 50 can be clamped and held from the upper and lower sides between the first and second holding parts 123 and 134 when the upper and lower clamps 120 and 130 are overlapping.

[0139] Next, when the substrate carrier jig 100 clamping the substrate 50 moves toward the first tilting unit 500A, the first tilting unit 500A can easily remove the liquid foreign matter accumulated on the surface of the substrate 50 by tilting and rotating the substrate carrier jig 100 .

[0140] In addition, the substrate carrier fixture 100 of the first tilting unit 500A will be transferred to the side of the second main body 20 via the processing tank 30 with the help of the first transfer part 600A, and the substrate carrier fixture 100 and the substrate 50 will be tilted and rotated in the second tilting unit 500B, so as to quickly remove the chemical liquid retained on the surface of the substrate 50 and the upper and lower clamps 120 and 130 in the process of passing through the processing tank 30. As an example, the etching performance of the substrate 50 can be improved by uniformly maintaining the etching thickness when etching the substrate 50.

[0141] By using the substrate 50 and the substrate carrier fixture 100 of the second tilting unit 500B, the substrate carrier fixture 100 can be arranged at a correct position by using the stopper component 352 and the moving actuator 354 of the arrangement assembly 350 during the process of entering the second disassembly unit 300B.

[0142] Next, when the contact frame 320 on the upper side of the substrate carrier clamp 100 arranged in the correct position is lowered by the lifting actuator 310, the second disassembly and assembly unit 300B causes the contact roller 324 provided on the lower part of the contact frame 320 to descend, thereby pressing the extension portion 122 of the upper clamp 120, thereby causing the upper clamp 120 to rotate around the hinge pin 140 and fold upward.

[0143] When the upper clamp 120 rotates, the first holding portion 124 is spaced apart from the second holding portion 134 , thereby releasing the clamped state of the substrate 50 .

[0144] Next, the substrate discharge unit 400B adsorbs the unlocked substrate 50 by vacuum adsorption and moves it to the upper side, then moves to the right along the rail unit 410 , and then moves downward to discharge the substrate 50 to the outside.

[0145] Thus, the present invention is equipped with a plurality of upper and lower clamps 120, 130, each of which is provided with clamping magnets 121, 131, respectively, in order to clamp and hold the edge of the substrate 50. By tilting and rotating the substrate carrier fixture 100 equipped with the upper and lower clamps 120, 130 to an inclined angle, chemicals such as etching liquid can be uniformly treated on the surface of the substrate 50. At the same time, the retention of chemicals such as etching liquid can be reduced by minimizing the contact area of ​​the substrate 50 held by the upper and lower clamps 120, 130 to the maximum extent. Furthermore, the first and second protrusions 125, 135 protruding in different shapes at the ends of the upper and lower clamps 120, 130 at the parts in contact with the upper and lower sides of the substrate 50 can be formed to induce the discharge of the liquid and thereby prevent the retention of the etching liquid.

[0146] In addition, the present invention can maintain the tension of the carrier fixture 100 by adjusting the length of the first and second frames 111 and 112 of the carrier fixture 100 formed of a rectangular frame by the first, second and third and fourth frames 111, 112, 113, 114 by using the repulsive force of the adjusting magnet.

[0147] The present invention can easily complete the clamping and unlocking actions of the upper clamp 120 that can be rotated by means of the hinge pin 140 and the elastic spring 150 by lifting and lowering the contact frame 320 of the first and second disassembly and assembly units 300A and 300B.

[0148] As mentioned above, specific embodiments are described in the detailed description of the present invention, but the present invention can be modified in various ways without departing from the scope thereof. Therefore, the present invention is not limited to the embodiments described in the above content, but should be defined within the scope of the appended claims and the equivalents of the claims.

[0149] That is, the present invention described in the above content is not limited to the preferred embodiment of the above-mentioned features. Personnel with general knowledge in the technical field to which the present invention belongs can perform various modified implementations without departing from the scope of the present invention requested in the claims, and the above-mentioned changes are included in the scope described in the claims.

Claims

1. A substrate carrier fixture, It is characterized in that include: A clamping frame (110) is composed of a first frame, a second frame, a third frame and a fourth frame (111, 112, 113, 114); The upper and lower clamps (120, 130) are respectively arranged in a manner of being spaced apart from the first and second frames (111, 112) and the third and fourth frames (113, 114) of the clamping frame (110), and are respectively provided with clamping magnets (121, 131) for clamping the edge of the substrate (50), so that the upper clamp (120) can rotate around the hinge pin (140) under the attraction of the magnet; A first protrusion (125) is formed to protrude downward from a lower side surface of one end of the upper clamp (120); A second protrusion (135) protrudes upward from an upper side surface of one end of the lower clamp (130) and is composed of a plurality of protrusions spaced apart from each other for discharging liquid; and The tension adjustment component (200) is located between one end of the first and second frames (111, 112) and the fourth frame (114), and maintains the tension by adjusting the interval between the first and second frames (111, 112) and the fourth frame (114).

2. The substrate carrier fixture according to claim 1, It is characterized in that The upper clamp (120) has an extension portion (122) formed at the other end thereof, which is extended outwardly compared to the hinge pin (140) and interferes with the first and second detachable units (300A, 300B) when they descend, thereby rotating the upper clamp (120) upward. The lower clamp (130) is formed with a stepped recessed step (133) on one end side of the upper surface.

3. The substrate carrier fixture according to claim 1, It is characterized in that The first and second protrusions (125, 135) are made of silicone resin material in order to contact the substrate (50).

4. The substrate carrier fixture according to claim 1, It is characterized in that In order to minimize the contact area with the substrate (50), the upper and lower clamps (120, 130) are formed with first and second holding portions (124, 134) at one end, the volume of which is smaller than the width volume of the middle portion. The first and second protruding parts (125, 135) are formed at the locations where the first and second holding parts (124, 134) contact each other.

5. The substrate carrier fixture according to claim 1, It is characterized in that The tension adjustment assembly (200) comprises: A first connection block (210) is connected to one end of the first and second frames (111, 112) by bolts in an overlapping manner and is equipped with a first adjustment magnet (230); A second connection block (220) is bolted to overlap one end and the other end of the fourth frame (114) respectively, and is provided with a second adjustment magnet (240) having the same magnetic polarity as the first adjustment magnet (230) in order to form a repulsive force, and is spaced apart from the first connection block (210); a connection hole (250) formed inside the first connection block (210); and The guide pin (260) is arranged inside the second connection block (220) in a manner of being embedded in the guide bushing (270) and is connected in a manner of having its end embedded in the connection hole (250), thereby guiding the horizontal movement of the first and second connection blocks (210, 220).

6. The substrate carrier fixture according to claim 1, It is characterized in that An elastic spring (150) having elastic force in the direction in which the upper clamp (120) rotates toward the lower clamp (130) is combined in the hinge pin (140), thereby providing a restoring force.

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