Middle frame, middle frame processing method and electronic device

Abstract

The present application discloses a middle frame, a processing method of the middle frame, and an electronic device, which relates to the technical field of electronic products and can be beneficial to the narrow frame design of electronic devices. The middle frame includes a middle plate and a frame; one side surface of the middle plate in the thickness direction is a first surface, the first surface has a first installation area and a second installation area, and the first installation area is spaced apart from the second installation area in a first direction; the first direction is perpendicular to the thickness direction of the middle plate; the frame is arranged around the middle plate, the frame has a first end face that is oriented in the same direction as the first surface, and the first end face has a wiring groove; the wiring groove extends along the first direction, and along the first direction, the wiring groove is located between the first installation area and the second installation area; the wiring groove is arranged with equal width. The middle frame provided in the embodiment of the present application is applied to electronic devices.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a middle frame, a method for processing the middle frame, and electronic equipment. Background Art

[0002] As mobile phones, tablet computers and other electronic devices are updated and updated with each passing day, the competition among electronic device manufacturers is becoming more and more fierce, and consumers are also demanding higher and higher requirements for electronic devices. The existing electronic devices have thick frames that cannot meet the needs of users. Summary of the invention

[0003] The embodiments of the present application provide a middle frame, a method for processing the middle frame, and an electronic device, which can facilitate the narrow frame design of the electronic device.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, some embodiments of the present application provide a middle frame, comprising a middle plate and a frame; one side surface of the middle plate in the thickness direction is a first surface, the first surface has a first installation area and a second installation area, and the first installation area is spaced apart from the second installation area in the first direction; wherein the first direction is perpendicular to the thickness direction of the middle plate; the frame is arranged around the edge of the middle plate, the frame has a first end face that is aligned with the first surface, and the first end face has a wiring groove; the wiring groove extends along the first direction, and along the first direction, the wiring groove is located between the first installation area and the second installation area; the two side groove walls in the width direction of the wiring groove are arranged in parallel.

[0006] In the embodiment of the present application, the groove walls on both sides of the width direction of the wiring groove are arranged in parallel, so no draft angle is set at the wiring groove, which can help reduce the width of the wiring groove. The reduction in the width of the wiring groove is conducive to reducing the thickness of the frame, so as to achieve the narrow frame design of the electronic device; on the other hand, it is also conducive to ensuring the structural strength and rigidity of the frame; on the other hand, on the basis of the beneficial effect of reducing the thickness of the frame brought about by the reduction in the width of the wiring groove, it is also conducive to increasing the volume of the accommodation space inside the electronic device, so that it is conducive to increasing the volume of the space inside the electronic device for arranging the battery, and then it is conducive to increasing the volume of the battery to improve the battery life.

[0007] In a possible implementation of the first aspect, the width of the wiring groove is within a range of less than 0.64 mm. In this way, the width of the wiring groove is relatively small, which is conducive to realizing a narrow frame design of the electronic device.

[0008] In a possible implementation of the first aspect, the width of the wiring groove is greater than or equal to 0.58 mm. This is helpful in reducing the difficulty of assembling the signal line, and also helps to limit the minimum wire diameter of the signal line, thereby ensuring the signal transmission quality of the signal line.

[0009] In a possible implementation of the first aspect, the depth of the wiring groove is in the range of greater than or equal to 1.5 mm and less than or equal to 2.5 mm. In this way, on the one hand, the reliability of signal line assembly can be enhanced; on the other hand, multiple signal lines can be accommodated.

[0010] In a possible implementation of the first aspect, the frame includes a metal frame and a plastic decorative frame, the metal frame is arranged around the middle plate, and the plastic decorative frame is arranged around the metal frame. At least a portion of the wiring trough is formed on the metal frame. That is, part of the wiring trough may be formed on the metal frame, or the entire wiring trough may be formed on the metal frame. In this way, it is beneficial to improve the bending and fracture resistance and impact fracture resistance of the first frame segment.

[0011] In a possible implementation of the first aspect, a portion of the frame corresponding to the wiring groove is a first frame segment, and the first frame segment includes a first metal segment located in a metal frame; in a first direction, the first metal segment includes a first sub-segment and a second sub-segment; the middle plate includes a metal conductor; the first sub-segment is directly connected to the metal conductor, and the second sub-segment is formed with a clearance hole that passes through the second sub-segment along the thickness direction of the middle plate, and the second sub-segment is divided into a first part and a second part by the clearance hole, and the second part is directly connected to the metal conductor; the first part is located on a side of the second part away from the middle plate; the first part is used to form an antenna radiator, and the clearance hole is filled with a plastic filling part.

[0012] In this way, the number of antenna radiators can be increased, the quality of the antenna's receiving and transmitting signals can be improved, and the signal dead zone can be reduced. In addition, the antenna radiator can be separated from the second part by the plastic filling part to meet the clearance requirement of the antenna radiator.

[0013] In a possible implementation of the first aspect, the wiring trough includes a first trough section and a second trough section that are connected, the first trough section is formed in the first subsection; the surface of the plastic filling portion that is in the same direction as the first surface is recessed to form a recessed trough, the recessed trough extends to the second portion in a direction close to the second portion, and the surface of the second portion that faces the first portion and the recessed trough jointly define the second trough section. In this way, the wiring trough and the antenna radiator can share the first frame section, which is conducive to saving the internal space of the electronic device.

[0014] In a possible implementation of the first aspect, a plastic connecting portion is attached to one or both sides of the first portion in the thickness direction of the middle plate, and the plastic connecting portion is directly connected between the plastic decorative frame and the plastic filling portion, so that the plastic connecting portion, the plastic decorative frame and the plastic filling portion are connected to form an integrally formed part. This is conducive to simplifying the processing technology of the middle frame, improving the processing efficiency of the middle frame and reducing the manufacturing cost of the middle frame.

[0015] In a possible implementation of the first aspect, the first end surface further has an assembly groove connected to the wiring groove, and the assembly groove extends along the first direction. The assembly groove is located on at least one side of the wiring groove in the first direction. That is, the assembly groove may be located only on one side of the wiring groove in the first direction close to the first installation area, or only on one side of the wiring groove in the first direction close to the second installation area, or may be located on both sides of the wiring groove in the first direction.

[0016] An opening is formed at one end of the assembly slot away from the wiring slot, and the opening faces the installation area closest to the opening in the first installation area and the second installation area. Specifically, when the assembly slot is on the side of the wiring slot in the first direction close to the first installation area, the opening faces the first installation area, and the signal line extends out of the assembly slot through the opening facing the first installation area, and is fixed and electrically connected to the first circuit board. When the assembly slot is on the side of the wiring slot in the first direction close to the second installation area, the opening faces the second installation area, and the signal line extends out of the assembly slot through the opening facing the second installation area, and is fixed and electrically connected to the second circuit board. When assembly slots are arranged on both sides of the wiring slot in the first direction, each assembly slot has an opening. The opening of the assembly slot on the side of the wiring slot in the first direction close to the first installation area faces the first installation area, and the opening of the assembly slot on the side of the wiring slot in the first direction close to the second installation area faces the second installation area.

[0017] The width of the assembly slot is greater than the width of the wiring slot. Since the width of the assembly slot is greater than the width of the wiring slot, the assembly slot is wider. This design reduces the difficulty of assembly due to space limitations, thereby reducing the difficulty of assembling the signal line into the wiring slot and improving the assembly efficiency of the signal line.

[0018] In a possible implementation of the first aspect, the first assembly groove includes a first assembly groove section and a second assembly groove section, the first assembly groove section is connected between the second assembly groove section and the wiring groove, the opening is formed in the second assembly groove section, and the width of the first assembly groove section gradually decreases in the direction from the second assembly groove section to the wiring groove. In this way, when the signal line is assembled into the wiring groove, the signal line can be guided by the first assembly groove section, thereby improving the assembly efficiency of the signal line.

[0019] In a possible implementation of the first aspect, chamfers are provided between the groove walls on both sides of the width direction of the wiring groove and the first end surface. In this way, a transition area can be created at the notch of the wiring groove. In this way, on the one hand, it is easier for the signal line to enter the wiring groove; on the other hand, it can prevent the signal line from being damaged by the sharp edge of the wiring groove.

[0020] In a possible implementation of the first aspect, a first convex rib and a second convex rib are provided on the first surface, the first convex rib and the second convex rib are spaced apart in the first direction, the two ends of the first convex rib along the second direction are respectively connected to the two side walls of the frame in the second direction, and the two ends of the second convex rib along the second direction are respectively connected to the two side walls of the frame in the second direction; wherein, the area on the first surface surrounded by the first convex rib and the frame forms a first installation area, and the area on the first surface surrounded by the second convex rib and the frame forms a second installation area. In this way, the first surface can be divided into a plurality of installation areas, which is conducive to maximizing the use of the first surface on the one hand; on the other hand, when the middle frame is applied to an electronic device, the first installation area and the second installation area can facilitate the installation of the first circuit board and the second circuit board. Specifically, the first installation area can be used to install a first pair of circuit boards, and the second installation area can be used to install a second pair of circuit boards.

[0021] In a second aspect, some embodiments of the present application provide an electronic device, including:

[0022] A middle frame as described in any of the above technical solutions;

[0023] A first circuit board, the first circuit board is installed in a first installation area;

[0024] a second circuit board, the second circuit board being mounted in the second mounting area;

[0025] The signal line has a first end and a second end, the first end is fixed to and electrically connected with the first circuit board, the second end is fixed to and electrically connected with the second circuit board, the signal line is arranged in the wiring groove, and the signal line is clamped by the relative groove walls of the wiring groove.

[0026] In the embodiment of the present application, no draft angle or bump is provided at the wiring groove, so that the width of the wiring groove can be reduced. The reduction in the width of the wiring groove is beneficial to reducing the thickness of the frame, so as to realize the narrow frame design of the electronic device; on the other hand, it is also beneficial to ensure the structural strength and rigidity of the frame; on the other hand, on the basis of the beneficial effect of reducing the thickness of the frame brought about by the reduction in the width of the wiring groove, it is also beneficial to increase the volume of the accommodation space inside the electronic device, so that it is beneficial to increase the volume of the space inside the electronic device for arranging the battery, and then it is beneficial to increase the volume of the battery to improve the battery life.

[0027] In a possible implementation of the second aspect, the signal line is a coaxial line, so that the loss and interference of the radio frequency signal can be reduced and the quality of the radio frequency signal transmission can be maintained.

[0028] In a possible implementation of the second aspect, the signal line diameter ranges from less than or equal to 0.64 mm. Thus, the signal line diameter is smaller, which is beneficial to narrowing the width of the wiring groove, thereby facilitating a narrow frame design of the electronic device.

[0029] In a possible implementation of the second aspect, there are multiple signal lines, and the multiple signal lines are arranged in the thickness direction of the middle plate, and the wire diameters of the multiple signal lines are equal. Among them, the multiple signal lines refer to that the number of signal lines is greater than or equal to 2. In this way, it is easy to meet the performance requirements of multi-band antennas. In addition, the design of equal wire diameters of multiple signal lines can also simplify the production engineering of signal lines and improve the production efficiency of signal lines compared to the design of different wire diameters used in the wiring trough with a draft angle.

[0030] In a possible implementation of the second aspect, a radio frequency chip is provided on the first circuit board; the second circuit board has a feed circuit, and the radio frequency chip and the feed circuit are electrically connected via a signal line; the frame includes a metal frame, and the metal frame is arranged around the middle plate; the metal frame includes a second metal segment, and the second metal segment is arranged along the edge of the second installation area, and the second metal segment is used to form a first antenna radiator, and the first antenna radiator is electrically connected to the feed circuit. In this way, on the one hand, the signal coverage range of the antenna electrically connected to the radio frequency chip on the first circuit board can be increased by the first antenna radiator; on the other hand, the transmission quality of the radio frequency signal received and sent by the radio frequency chip can be ensured by the cooperation of the signal line and the feed circuit.

[0031] In a possible implementation of the second aspect, the metal frame includes a third metal segment, the third metal segment is arranged along an edge of the first installation area, the third metal segment is used to form a second antenna radiator, and the second antenna radiator is electrically connected to the radio frequency chip. In this way, the antenna can transmit and receive electromagnetic waves.

[0032] In a third aspect, some embodiments of the present application provide a method for processing a middle frame as described in any of the above technical solutions, comprising the following steps:

[0033] Making a middle frame blank, wherein the middle frame blank comprises a middle plate and a frame blank, and the frame blank is arranged around the middle plate;

[0034] The frame blank is processed by computer numerical control technology to form a wiring groove.

[0035] The processing method of the middle frame of the embodiment of the present application can process the wire grooves with parallel groove walls on both sides in the second direction by computer numerical control processing of the frame blank, thereby breaking the limitation that the draft angle needs to be set when forming the wire grooves by the die-casting process, which is conducive to reducing the width of the wire grooves. The reduction in the width of the wire grooves is conducive to reducing the thickness of the frame on the one hand, so as to realize the narrow frame design of the electronic device; on the other hand, it is also conducive to ensuring the structural strength and rigidity of the frame; on the other hand, on the basis of the beneficial effect of reducing the thickness of the frame brought about by the reduction in the width of the wire grooves, it is also conducive to increasing the volume of the accommodation space inside the electronic device, so that it is conducive to increasing the volume of the space for arranging the battery inside the electronic device, and then it is conducive to increasing the volume of the battery to improve the battery life.

[0036] In a possible implementation of the third aspect, a first blank is manufactured by a die-casting process; the first blank includes a metal conductor and a metal frame blank, and the metal frame blank is arranged around the metal conductor; and a plastic decorative frame is formed on the outer peripheral surface of the metal frame blank by an injection molding process to obtain a middle frame blank. In this way, on the one hand, forming a plastic decorative frame on the outer peripheral surface of the metal frame blank is conducive to improving the appearance of the middle frame, and can effectively solve the problem that the surface roughness of the metal frame blank processed by the die-casting process is relatively large, and its appearance is difficult to meet the user's usage requirements.

[0037] On the other hand, since the wiring groove is formed by computer numerical control after the injection molding process is completed, the wiring groove has not yet been formed when the metal frame blank is injection molded. Therefore, there is no need to set an insert in the molding area corresponding to the wiring groove on the injection mold, thereby avoiding the problem of the production efficiency of the middle frame being reduced and the production cost being increased due to the easy breakage of the insert and the need to frequently repair the broken insert.

[0038] In a possible implementation of the third aspect, the metal frame blank has a clearance hole that penetrates the metal frame blank in the thickness direction of the metal conductor, and the portion of the metal frame blank that is located in the clearance hole and away from the metal conductor is the first part; the step of forming a plastic decorative frame on the outer peripheral surface of the metal frame blank using an injection molding process specifically includes: forming a plastic decorative frame on the outer peripheral surface of the metal frame blank using an injection molding process, forming a plastic filling structure in the clearance hole, and forming a plastic connecting portion on at least one side surface of the first part along the thickness direction of the metal conductor.

[0039] In this way, on the one hand, the plastic filling structure can be used to separate the antenna radiator on the first frame segment from the metal conductor to meet the clearance requirements of the antenna radiator; on the other hand, it is helpful to simplify the processing technology of the middle frame, improve the processing efficiency of the middle frame and reduce the manufacturing cost of the middle frame.

[0040] In a possible implementation of the third aspect, performing computer numerical control processing on the frame blank to form the wiring trough specifically includes: performing computer numerical control processing on the metal frame blank to form a first slot section of the wiring trough, and performing computer numerical control processing on the plastic filling structure to form a second slot section of the wiring trough. In this way, the wiring trough and the antenna radiator can share the first frame section, which is conducive to saving the internal space of the electronic device.

[0041] In a possible implementation of the third aspect, an assembly groove is formed on the metal frame blank; the frame blank is subjected to computer numerical control processing to form a wiring groove, which specifically includes: the frame blank is subjected to computer numerical control processing to form a wiring groove connected to the assembly groove. In this way, there is no need to process the assembly groove through computer numerical control technology. Thereby, the problem of increasing the production time of the middle frame due to the need to increase the number of passes or replace tools of different sizes when forming the assembly groove through computer numerical control technology processing of the metal frame blank can be effectively solved, which is conducive to improving the processing efficiency of the middle frame. It can be understood that in order to facilitate demolding, a draft angle can be set on the assembly groove.

[0042] In a possible implementation of the third aspect, the metal frame blank has a first antenna radiator and a second antenna radiator. The first antenna radiator and the metal conductor are spaced apart from each other, and the second antenna radiator and the metal conductor are spaced apart from each other to form a gap region. A process connection bridge is provided in the gap region between the first antenna radiator and the metal conductor, and in the gap region between the second antenna radiator and the metal conductor. In this way, the metal frame blank and the metal conductor can be integrally formed by a die-casting process.

[0043] In a possible implementation of the third aspect, while forming the wiring groove by computer numerical control technology, the process connection bridge can be cut off by computer numerical control technology and the side key groove can be formed on the frame. In this way, the process connection bridge cutting work and the wiring groove forming work and the side key groove forming work can be completed in one workpiece clamping. In this way, the number of clamping operations on the middle frame blank can be reduced, thereby saving corresponding operation time, and further improving the processing efficiency of the middle frame.

[0044] In a possible implementation of the third aspect, a guide groove is formed on the metal frame blank. The groove depth direction of the guide groove is the same as the thickness direction of the middle plate, the width of the guide groove gradually increases in the groove bottom wall of the guide groove and the groove opening direction of the guide groove, and a first groove section is processed at the guide groove by a computer numerical control process, and a second groove section is processed at the plastic filling structure to form a wiring groove.

[0045] In this way, the positioning and cutting of the tool used in the computer numerical control process are facilitated, the forming efficiency of the wiring groove can be improved, and then the processing efficiency of the middle frame can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A perspective view of an electronic device according to some embodiments of the present application;

[0047] Figure 2 Based on Figure 1 an exploded schematic diagram of the electronic device shown;

[0048] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown at line AA;

[0049] Figure 4 for Figure 1 An exploded schematic diagram of a middle frame in the electronic device shown;

[0050] Figure 5 for Figure 3 An enlarged view of the portion of the electronic device shown circled at A;

[0051] Figure 6 A schematic diagram of assembling a middle frame and signal lines provided in some other embodiments of the present application;

[0052] Figure 7 for Figure 6 The structure shown is a schematic diagram of a cross-section along line CC;

[0053] Figure 8 for Figure 7 The structure shown is an enlarged view of the circled portion at C;

[0054] Fig. 9 for Figure 6 The structure shown is a schematic diagram of the assembly of the metal conductor and the metal frame in the framed area at D.

[0055] Fig.10 for Figure 6 An enlarged view of the portion circled at B in the middle frame shown;

[0056] Fig.11 for Fig.10 A schematic diagram of the positional relationship between the chamfer and the first end face shown in FIG.

[0057] Fig.12 A flowchart of a method for processing a middle frame provided in some embodiments of the present application;

[0058] Fig.13 is a three-dimensional image of a first blank;

[0059] Fig.14 is a three-dimensional diagram of a middle frame blank;

[0060] Fig.15 for Fig.14 An enlarged view of the circled portion of the middle frame blank shown at E;

[0061] Fig.16 Based on Figure 6 A perspective view of the middle frame shown;

[0062] Fig.17 for Fig.16 The schematic diagram of the structure of the part circled at F in the middle frame shown. DETAILED DESCRIPTION

[0063] In the embodiments of the present application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0064] In the description of the embodiments of the present application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0065] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0066] In the description of the embodiments of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0067] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within ±10°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within ±10°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0068] The present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other suitable electronic device. For example, the electronic device may be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device (such as a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc.

[0069] See also Figure 1 and Figure 2 ,in, Figure 1 A perspective view of an electronic device 100 according to some embodiments of the present application; Figure 2 Based on Figure 1 The exploded schematic diagram of the electronic device 100 is shown. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 may include a screen 1, a middle frame 2, a back cover 3, a battery 4, a first circuit board 5, a second circuit board 6, a signal line 7 and an antenna 8.

[0070] Understandably, Figure 1 and Figure 2 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 1.

[0071] The screen 1 is used to display image information, video information, etc. The screen 1 includes a front cover plate 11 and a display screen 12. The front cover plate 11 is in the shape of a flat plate. Specifically, the shape of the front cover plate 11 includes but is not limited to a rectangular flat plate, a square flat plate, an oblong flat plate, a circular flat plate and an elliptical flat plate. The material of the front cover plate 11 includes but is not limited to glass, plastic and ceramic. The front cover plate 11 and the display screen 12 are stacked and fixedly connected. The connection method between the front cover plate 11 and the display screen 12 includes but is not limited to gluing. The front cover plate 11 is mainly used to protect the display screen 12 and prevent dust.

[0072] The display screen 12 may be a flexible display screen or a rigid display screen. For example, the display screen 12 may be an organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD), etc. The front cover plate 11 is light-transmissive, and the display surface of the display screen 12 faces the front cover plate 11. In this way, the image, video and other information displayed on the display screen 12 can be observed by the user through the front cover plate 11.

[0073] In order to facilitate the description of each embodiment below, an XYZ coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100, that is, the stacking direction of the front cover plate 11 and the display screen 12 is defined as the Z-axis direction, and the directions perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction, respectively, and the X-axis direction is perpendicular to the Y-axis direction. Specifically, in this embodiment, the electronic device 100 is in the shape of a rectangular flat plate, wherein the length direction of the electronic device 100 is the Y-axis direction (that is, the first direction), and the width direction of the electronic device 100 is the X-axis direction (that is, the second direction). It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and is not specifically limited here.

[0074] Please continue reading Figure 2 The middle frame 2 includes a middle plate 21 and a frame 22 .

[0075] The middle plate 21 is in the shape of a flat plate. The shape of the middle plate 21 is adapted to the shape of the front cover plate 11. The middle plate 21 is located on the side of the display screen 12 away from the front cover plate 11, and the middle plate 21 is stacked with the screen 1. The middle plate 21 is used as the structural "skeleton" of the electronic device 100, and the first circuit board 5, the second circuit board 6, the battery 4, etc. can be fixed on the middle plate 21.

[0076] Specifically, the surface of the middle plate 21 facing away from the screen 1 in the thickness direction (i.e., the Z-axis direction) is the first surface 211. The first surface 211 has a first mounting area C1, a second mounting area C2, and a third mounting area C3. The first mounting area C1 and the second mounting area C2 are spaced apart in the Y-axis direction, and the first mounting area C1 and the second mounting area C2 are located on both sides of the third mounting area C3 in the Y-axis direction.

[0077] Please continue reading Figure 2 The frame 22 is arranged around the edge of the middle plate 21 and the screen 1 .

[0078] The frame 22 and the middle plate 21 can be a structural whole, that is, the frame 22 and the middle plate 21 are an integral part. In this way, it is beneficial to improve the connection strength between the two and simplify the processing technology. In other examples, the frame 22 and the middle plate 21 can also be connected by gluing, welding, clamping or screw connection.

[0079] Please continue reading Figure 2 , a first convex rib 2111 and a second convex rib 2112 are provided on the first surface 211, and the first convex rib 2111 and the second convex rib 2112 are spaced apart in the Y-axis direction, and the two ends of the first convex rib 2111 in the X-direction are respectively connected to the two side walls of the frame 22 in the X-direction, and the two ends of the second convex rib 2112 in the X-direction are respectively connected to the two side walls of the frame 22 in the X-direction. The area on the first surface 211 surrounded by the first convex rib 2111 and the frame 22 forms a first installation area C1. The area on the first surface 211 surrounded by the second convex rib 2112 and the frame 22 forms a second installation area C2. The area on the first surface 211 surrounded by the first convex rib 2111, the second convex rib 2112, and the frame 22 forms a third installation area C3.

[0080] In other embodiments, the first convex rib 2111 and the second convex rib 2112 may be formed on the surface of the back cover 3 facing the middle plate 21. Specifically, the first convex rib 2111 and the second convex rib 2112 on the back cover 3 may be an integrally formed part with the back cover 3, or may be assembled by gluing, welding or clamping. It is understood that in other embodiments, the middle plate 21 and the back cover 3 may not be provided with the first convex rib 2111 and the second convex rib 2112.

[0081] The connection method between the frame 22 and the screen 1 includes but is not limited to gluing.

[0082] See also Figure 3 , Figure 3 for Figure 1The schematic diagram of the cross-sectional structure of the electronic device 100 at the AA line is shown. In order to facilitate the positioning and installation of the screen 1. In some embodiments, one end of the inner circumference of the frame 22 is formed with a first positioning groove 227 that is recessed in a direction away from the central axis O1 of the frame 22, and the front cover 11 is supported on the first positioning groove 227. In this way, the first positioning groove 227 can be used to position and install the screen 1, thereby improving the installation efficiency of the electronic device 100. Of course, it can be understood that in other examples, the first positioning groove 227 may not be provided on the frame 22.

[0083] In order to take into account both the structural strength and aesthetics of the frame, the frame 22 includes a metal frame 224 and a plastic decorative frame 225. Exemplarily, the material of the metal frame 224 is copper, iron, aluminum or other metal materials. The material of the plastic decorative frame 225 includes but is not limited to polypropylene, polystyrene, and polymethyl methacrylate.

[0084] The metal frame 224 is disposed around the middle plate 21, and the plastic decorative frame 225 is disposed around the metal frame 224. Of course, the present application is not limited thereto. In other embodiments, the frame 22 may also include only the metal frame 224.

[0085] Please continue reading Figure 2 and Figure 3 , the back cover 3 is in the shape of a flat plate. The shape of the back cover 3 includes but is not limited to a rectangular flat plate, an oblong flat plate, a circular flat plate or an elliptical flat plate. Specifically, the shape of the back cover 3 is adapted to the shape of the front cover 11. The material of the back cover 3 includes but is not limited to glass, plastic, metal and ceramic.

[0086] The back cover 3 is located on a side of the middle plate 21 away from the screen 1 , and the back cover 3 is stacked and spaced apart from the middle plate 21 . The frame 22 is arranged around a circumference of the back cover 3 .

[0087] The frame 22 is fixed to the back cover 3. For example, the frame 22 can be fixedly connected to the back cover 3 by gluing, welding or clamping. Figure 3 The other end of the inner circumference of the frame 22 is formed with a second positioning groove 228 that is recessed in a direction away from the central axis O1 of the frame 22, and the back cover 3 is supported on the second positioning groove 228. In this way, the back cover 3 can be positioned and installed by using the second positioning groove 228, thereby improving the installation efficiency of the electronic device 100. Of course, it can be understood that in other examples, the frame 22 may not be provided with the second positioning groove 228.

[0088] It is worth noting that when the frame 22 and the middle plate 21 are not a structural entity, the frame 22 can be an integral structure with the back cover 3.

[0089] The battery 4 is used to provide power for the first circuit board 5, the second circuit board 6 and the screen 1. The battery 4 can be installed in the third installation area C3 of the middle plate 21. Exemplarily, the battery 4 can be fixed to the third installation area C3 by threading, clamping, gluing or welding.

[0090] The first circuit board 5 is installed in the first installation area C1 of the middle plate 21. For example, the first circuit board 5 can be fixed on the middle plate 21 by means of thread connection, clamping, gluing or welding.

[0091] The first circuit board 5 can be a hard circuit board, a flexible circuit board, or a hard-soft circuit board. The first circuit board 5 can be a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, etc. Here, FR-4 is a code for a flame retardant material grade, and Rogers dielectric board is a high-frequency board.

[0092] The first circuit board 5 can be used for integrated chips. The chip can be, for example, an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), a universal storage (UFS), a radio frequency chip 51, etc. The first circuit board 5 is electrically connected to the display screen 12, and the first circuit board 5 is used to control the display screen 12 to display images or videos.

[0093] The second circuit board 6 can be installed in the second installation area C2 of the middle plate 21. The second circuit board 6 can be a hard circuit board, a flexible circuit board, or a hard-soft combination circuit board. The second circuit board 6 can use an FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on. The second circuit board 6 can be used to integrate electronic components such as universal serial bus (USB) devices.

[0094] Please continue reading Figure 2 The signal line 7 is used to connect the first circuit board 5 and the second circuit board 6 to realize data and signal transmission between the second circuit board 6 and the first circuit board 5. Specifically, the signal line 7 has a first end 71 and a second end 72, the first end 71 is fixed and electrically connected to the first circuit board 5, and the second end 72 is fixed and electrically connected to the second circuit board 6.

[0095] The wire diameter of the signal wire 7 may be within a range of less than or equal to 0.81 mm. For example, the wire diameter of the signal wire 7 is 0.64 mm, 0.7 mm, or 0.81 mm.

[0096] The antenna 8 is electrically connected to the RF chip 51 on the first circuit board 5 to transmit the RF signal from the RF chip 51 to the external space in the form of electromagnetic waves to achieve signal transmission; or the antenna 8 can also receive electromagnetic waves from the external space and convert the electromagnetic waves into RF signals and transmit them to the RF chip 51 to achieve signal reception.

[0097] In some embodiments, the RF chip 51 includes a transmitting path and a receiving path. The transmitting path includes devices such as a power amplifier and a filter, through which the signal is subjected to power amplification, filtering and other processing, and then transmitted to the antenna 8 and transmitted to the outside world through the antenna 8; the receiving path includes devices such as a low-noise amplifier and a filter, through which the external signal received by the antenna is subjected to low-noise amplification, filtering and other processing, and then transmitted to the RF chip 51, thereby realizing the communication of one signal between the electronic device 100 and the outside world through the RF chip 51 and the antenna 8.

[0098] The antenna 8 includes but is not limited to an omnidirectional antenna and a directional antenna. An omnidirectional antenna is an antenna that radiates signals in all directions of the antenna like a spherical transmitting source, that is, the signal radiation intensity in all directions of the antenna is the same at 360° to achieve the best communication effect. A directional antenna is an antenna that radiates signals in a specific direction.

[0099] Exemplarily, antenna 8 can be a Wi-Fi antenna, and electronic device 100 can achieve short-range communication through antenna 8 to achieve functions such as D2D (device-to-device communication), WiFi screen projection, and WiFi proximity discovery. Antenna 8 can operate in the 2.4G frequency band (frequency in the range of 2.4GHz to 2.5GHz) and / or the 5G frequency band (frequency in the range of 5GHz-6GHz) for WLAN communication. Understandably, both the 2.4G frequency band and the 5G frequency band are used for short-range wireless communication technology. The 2.4G frequency band has a narrow bandwidth, a low frequency, a strong ability to penetrate walls, and a large communication range; the 5G frequency band has a wide bandwidth, a high frequency, and a fast transmission speed. Antenna 8 can select a suitable frequency band according to the working environment to adapt to a variety of application environments and improve the communication performance of the electronic device 100.

[0100] Exemplarily, the number of antennas 8 may be one or more. When there are multiple antennas 8, the multiple antennas 8 may work independently of each other or in combination. Each antenna 8 in the electronic device 100 may be used to cover a single or multiple communication frequency bands. Different antennas 8 may also be reused to improve the utilization of the antennas 8.

[0101] See also Figure 4 , Figure 4 for Figure 1 The exploded schematic diagram of the middle frame 2 in the electronic device 100 is shown. It should be noted that: Figure 4 The decomposition of the "middle frame 2" is a structural decomposition based on the different materials in the middle frame 2, for example, Figure 4 As shown, the middle frame 2 includes a metal portion P1 and a non-metal portion P2. Figure 4 The multiple decomposed structures in the antenna 8 are detachable. The antenna 8 may include an antenna radiator 81, a grounding structure 83 and a feeding structure (not shown in the figure). In each antenna 8, the number of the antenna radiator 81 may be one or more.

[0102] In order to realize the signal receiving and transmitting function of the antenna radiator 81 in the antenna 8, the material of the antenna radiator 81 is metal. Exemplarily, the material of the antenna radiator 81 is copper, iron, aluminum or other metal materials.

[0103] In some embodiments, the metal frame 224 includes a second metal segment 2242 and a third metal segment 2243 .

[0104] The second metal segment 2242 is arranged along the edge of the second mounting area C2. The second metal segment 2242 is used to form the first antenna radiator 811. Exemplarily, the second metal segment 2242 may be one or more. When there are more than one second metal segment 2242, each second metal segment 2242 may form a first antenna radiator 811, and the plurality of second metal segments 2242 are spaced apart and distributed along the circumference of the frame 22. A gap (also called an antenna gap Q) may be formed between two adjacent second metal segments 2242.

[0105] The third metal segment 2243 is arranged along the edge of the first mounting area C1, and the third metal segment 2243 is used to form the second antenna radiator 812. Exemplarily, the third metal segment 2243 may be one or more. When there are more than one third metal segment 2243, each third metal segment 2273 is used to form one second antenna radiator 812, and the plurality of third metal segments 2273 are spaced apart and distributed along the circumference of the frame 22. An antenna slot Q may be formed between two adjacent third metal segments 2273.

[0106] In order to ensure the structural integrity of the metal frame 224, an insulating structure (not shown in the figure) may be filled in the antenna slot Q. Exemplarily, the material of the insulating structure includes but is not limited to plastic.

[0107] As a result, the setting of the insulating structure can achieve a fixed connection between two adjacent antenna radiators 81 on the one hand, and on the other hand, it can also serve the purpose of clearing the antenna radiators 81 on both sides of the antenna slot Q, thereby facilitating the antenna radiators 81 to receive and transmit signals.

[0108] It is understandable that the first antenna radiator 811 and the second antenna radiator 812 may be the antenna radiator 81 of the same antenna 8, or may be the antenna radiators 81 of different antennas 8. The present application does not impose any specific limitation on this. For ease of description, the following description is based on the example that the first antenna radiator 811 and the second antenna radiator 812 are the antenna radiators of the same antenna 81.

[0109] On this basis, in order to achieve the clearance of the above-mentioned antenna 8, please continue to refer to Figure 4 The middle plate 21 includes a metal conductor 212 and an insulating portion 213 .

[0110] The metal conductor 212 is used as a reference ground for the electronic device 100. The material of the metal conductor 212 includes, but is not limited to, copper, iron, or aluminum. Thus, each circuit element in the electronic device 100 can be grounded by being electrically connected to the reference ground, thereby avoiding problems such as leakage of circuit elements and damage caused by large current shocks.

[0111] The metal conductor 212 and the metal frame 224 can be an integrally formed part, that is, the metal part of the middle plate 21 and the metal part of the frame 22 are an integral structure. In this way, it is beneficial to improve the structural strength of the middle frame 2, simplify the processing technology of the middle frame 2, and reduce the production cost of the middle frame 2. Of course, the present application is not limited to this. In other embodiments, the metal conductor 212 and the metal frame 224 can also be connected together by assembly. Specifically, the connection method between the metal part of the frame 22 and the metal part of the middle plate 21 includes but is not limited to gluing, clamping, screw connection and welding, etc.

[0112] The material of the insulating portion 213 includes but is not limited to plastic. The metal conductor 212 is connected to the antenna radiator 81 through the insulating portion 213. In this way, the insulating portion 213 can be used to separate the antenna radiator 81 from the metal conductor 212 to meet the clearance requirement of the antenna radiator 81.

[0113] The insulating portion 213, the plastic decorative frame 225, and the insulating structure may be an integrally formed part, that is, the insulating portion 213, the plastic decorative frame 225, and the insulating structure are an integral structure. This is beneficial to improving the structural strength of the middle frame 2, simplifying the processing technology of the middle frame 2, and reducing the production cost of the middle frame 2.

[0114] The grounding structure 83 is fixedly connected between the metal conductor 212 and the antenna radiator 81. Exemplarily, one antenna radiator 81 corresponds to one grounding structure 83. Another exemplary embodiment, one antenna radiator 81 corresponds to multiple grounding structures 83. The present application does not impose any specific limitation on this, as long as the grounding structure 83 is connected between the antenna radiator 81 and the metal conductor 212 to achieve ground return.

[0115] Please return to Figure 2 The feeding structure includes a radio frequency circuit 84 formed on the first circuit board 5 , the aforementioned signal line 7 , and a feeding circuit 82 formed on the second circuit board 6 .

[0116] The radio frequency chip 51 on the first circuit board 5 is electrically connected to the second antenna radiator 812 via the radio frequency circuit 84, so that the antenna 8 can transmit and receive electromagnetic waves.

[0117] The RF chip 51 is electrically connected to the feed circuit 82 via the signal line 7, and the feed circuit 82 is electrically connected to the first antenna radiator 811. In this way, on the one hand, the signal coverage of the antenna 8 electrically connected to the RF chip 51 on the first circuit board 5 can be increased through the first antenna radiator 811; on the other hand, the transmission quality of the RF signal received and sent by the RF chip 51 can be ensured through the cooperation of the signal line 7 and the feed circuit 82.

[0118] It is understandable that, in other examples, the feeding structure may not include the RF circuit 84 , and the RF chip 51 and the second antenna radiator 812 may not be electrically connected.

[0119] Since the first circuit board 5 and the second circuit board 6 are separated by the battery 4 in the Y-axis direction, in order to facilitate the routing of the signal line 7. Figure 4 , and also see Figure 5 , Figure 5 for Figure 3 The electronic device 100 is shown in an enlarged view of the circled portion at A. The frame 22 has a first end surface 221 that is oriented in the same direction as the first surface 211 . The first end surface 221 has a wiring groove 222 . The signal line 7 is arranged in the wiring groove 222 .

[0120] Specifically, the frame 22 includes a first frame segment 226. The first frame segment 226 is between the above-mentioned first installation area C1 and the second installation area C2. The wiring groove 222 is formed on the first frame segment 226 and extends along the Y-axis direction. In this way, the wiring groove 222 is located between the first installation area C1 and the second installation area C2. On the one hand, it is convenient to wire the signal line 7 from the side of the first installation area C1 to the side of the second installation area C2 along the wiring groove 222, and the structure is simple. Moreover, the setting of the wiring groove 222 will not increase the size of the electronic device 100 in the Z-axis direction. In this way, the internal structure of the electronic device 100 can be made more compact, which is conducive to realizing the lightness and thinness of the electronic device 100.

[0121] In some embodiments, at least a portion of the wiring trough 222 is formed on the metal frame 224. That is, a portion of the wiring trough 222 may be formed on the metal frame 224, or the entire wiring trough 222 may be formed on the metal frame 224. In this way, the bending and fracture resistance and impact fracture resistance of the first frame segment 226 are improved.

[0122] See also Figure 5 In order to effectively fix the signal line 7, the wiring groove 222 is provided with a protrusion 2223 on the side wall surface in the X-axis direction, and the protrusion 2223 protrudes from the side wall surface in the X-axis direction of the wiring groove 222. The provision of the protrusion 2223 and the space reserved in the wiring groove 222 for accommodating the signal line 7 as a whole increase the width of the wiring groove 222.

[0123] Furthermore, in order to simplify the production process and improve production efficiency, the wire groove 222 is generally formed at the same time as the metal frame is formed by a die-casting process. Due to the constraints of the die-casting process, in order to facilitate demoulding, a draft angle is usually set on the wire groove 222. That is, the width of the wire groove 222 gradually increases in the direction from the bottom wall of the groove to the notch. The setting of the draft angle on the wire groove 222 will also cause the width of the notch of the wire groove 222 to be larger.

[0124] Based on the above two factors, the width of the slot of the wiring slot 222 is relatively wide. In the related art, the width of the wiring slot 222 reaches 1 mm.

[0125] It is understandable that when the width of the wiring groove 222 is large, it will inevitably affect the structural strength and rigidity of the frame 22, resulting in a reduction in the structural strength and rigidity of the frame 22. In order to ensure the structural strength and rigidity of the frame 22, it is necessary to set the thickness of the frame 22 to be relatively thick. However, the thickening of the frame 22 is not conducive to the narrow frame design of the electronic device 100 and cannot meet the user's usage requirements.

[0126] To solve the above technical problems, please refer to Figure 6-Figure 8 ,in, Figure 6 Schematic diagram of assembly of the middle frame 2 and the signal line 7 provided in some other embodiments of the present application; Figure 7 for Figure 6 The structure shown is a schematic diagram of a cross-section along line CC; Figure 8 for Figure 7 The structure shown is an enlarged view of the circled portion at C. In some embodiments, the groove walls on both sides of the wiring groove 222 in the X-axis direction are arranged in parallel. The signal line 7 is clamped by the opposite groove walls of the wiring groove 222 in the X-axis direction.

[0127] In this way, no draft angle and no protrusion 2223 are provided at the wiring groove 222, which can help reduce the width of the wiring groove 222. The reduction in the width of the wiring groove 222, on the one hand, helps reduce the thickness of the frame 22, so as to facilitate the narrow frame design of the electronic device 100; on the other hand, it is also helpful to ensure the structural strength and rigidity of the frame 22; on the other hand, based on the beneficial effect of reducing the thickness of the frame 22 brought about by the reduction in the width of the wiring groove 222, it is also helpful to increase the volume of the storage space inside the electronic device 100, so that it is helpful to increase the volume of the space inside the electronic device 100 for arranging the battery 4, and then it is helpful to increase the volume of the battery 4 to improve the battery life of the battery 4. Please refer to Fig. 9 , Fig. 9 for Figure 6 The structure shown is a schematic diagram of the assembly of the metal conductor 212 and the metal frame 224 in the framed area D.

[0128] In some embodiments, the first frame segment 226 includes a first metal segment 2241 located in the metal frame 224. In the Y-axis direction, the first metal segment 2241 includes a first sub-segment 2241a and a second sub-segment 2241b.

[0129] The first subsegment 2241 a is directly connected to the metal conductor 212 .

[0130] The second sub-segment 2241b is formed with a clearance hole K penetrating the second sub-segment 2241b along the thickness direction of the middle plate 21, and the second sub-segment 2241b is divided into a first part 2241b1 and a second part 2241b2 by the clearance hole K. The second part 2241b2 is directly connected to the metal conductor 212. The first part 2241b1 is located on a side of the second part 2241b2 away from the middle plate 21. The first part 2241b1 is used to form an antenna radiator 81, which can be called a third antenna radiator. The third antenna radiator can be directly connected to the second antenna radiator 812 or the first antenna radiator 811 described above to increase the signal radiation range of the antenna 8.

[0131] See also Figure 8 , Clearance hole K( Figure 8 The area shown by the dotted line in the middle is filled with a plastic filling part 24. In this way, the number of antenna radiators 81 can be increased, the quality of the received and transmitted signals of the antenna 8 can be improved, and the signal dead zone can be reduced. In addition, the plastic filling part 24 can be used to separate the antenna radiator 81 from the second part 2241b2 to meet the clearance requirement of the antenna radiator 81.

[0132] See also Figure 8In some embodiments, a plastic connecting portion 23 is attached to one or both sides of the first portion 2241b1 in the thickness direction of the middle plate 21, and the plastic connecting portion 23 is directly connected between the plastic decorative frame 225 and the plastic filling portion 24 located in the clearance hole K.

[0133] In this way, it is advantageous to integrally mold the plastic connection portion 23 , the plastic decorative frame 225 , and the plastic filling portion 24 through the injection molding process, thereby simplifying the processing technology of the middle frame 2 , improving the processing efficiency of the middle frame 2 , and reducing the manufacturing cost of the middle frame 2 .

[0134] See also Fig. 9 In some embodiments, the wiring slot 222 includes a first slot section 2221 and a second slot section 2222 that are connected. The first slot section 2221 is formed in the first sub-section 2241a.

[0135] See also Figure 8 The surface of the plastic filling portion 24 that is consistent with the first surface 211 is recessed to form a recessed groove 241. The recessed groove 241 extends to the second portion 2241b2 in a direction close to the second portion 2241b2. The surface of the second portion 2241b2 that faces the first portion 2241b1 and the recessed groove 241 jointly define a second groove section 2222.

[0136] In this way, the wiring groove 222 and the antenna radiator 81 can share the first frame segment 226, which is helpful to save the internal space of the electronic device 100. In addition, in this embodiment, since the groove walls on both sides of the wiring groove 222 in the X-axis direction are arranged in parallel, when the signal line 7 is clamped by the relative groove walls of the wiring groove 222 in the X-axis direction, the signal line 7 will not be bent or twisted, so that the problem of poor signal of the antenna 8 caused by the bending and twisting of the signal line 7 and the approach to the antenna radiator 81 can be avoided.

[0137] In order to reduce the loss and interference of radio frequency signals and maintain the quality of radio frequency signal transmission, in some embodiments, the signal line 7 is a coaxial line. In other embodiments, the signal line 7 can also be a conductive wire or an enameled wire.

[0138] Since the smaller the wire diameter of the signal line is, the lower the quality of its signal transmission is. On the one hand, in order to ensure the quality of signal transmission, on the other hand, in order to minimize the width L1 of the wiring groove 222, the wire diameter of the signal line is selected to be 0.64 mm. On this basis, the value range of the width L1 of the wiring groove 222 can be less than 0.64 mm and greater than or equal to 0.58 mm.

[0139] In this way, the signal line 7 can be interference-fitted with the side wall of the wiring groove 222 in the X-axis direction, so that the signal line 7 can be firmly clamped in the wiring groove 222 .

[0140] Exemplarily, the width L1 of the wiring groove 222 is 0.6 mm. It is understandable that in other embodiments, the width L1 of the wiring groove 222 may be 0.59 mm, 0.61 mm, 0.62 mm, or 0.63 mm.

[0141] Of course, the present application is not limited thereto. In some other embodiments, the signal line 7 may have a wire diameter less than 0.64 mm. In this case, the width L1 of the wiring groove 222 may be 0.53 mm, 0.54 mm, 0.55 mm, 0.56 mm, or 0.57 mm.

[0142] On the basis of the above embodiment, in order to meet the performance requirements of the multi-band antenna 8, please refer to Figure 8 In some embodiments, there are multiple signal lines 7, and the multiple signal lines 7 are arranged in the thickness direction of the middle plate 21, and the wire diameters of the multiple signal lines 7 are equal. Among them, the multiple signal lines 7 refer to that the number of signal lines 7 is greater than or equal to 2. In this way, each signal line 7 can be clamped by the relative groove wall of the wiring groove 222 to prevent the outer signal line 7 from escaping from the wiring groove. In addition, the design of equal wire diameters of multiple signal lines 7 can also simplify the production process of the signal lines 7 and improve the production efficiency of the signal lines 7.

[0143] Exemplarily, there are two signal lines 7. In this case, the depth L2 of the wiring groove 222 may be greater than or equal to 1.5 mm and less than or equal to 2.5 mm. Exemplarily, the depth L2 of the wiring groove 222 may be 1.55 mm, 1.60 mm, 1.65 mm, 1.70 mm, 1.75 mm, 1.80 mm, 1.85 mm, 1.90 mm, 1.95 mm, 2 mm, 2.05 mm, 2.10 mm, 2.15 mm, 2.2 mm, 2.25 mm, 2.30 mm, 2.35 mm, 2.40 mm or 2.45 mm.

[0144] Of course, the present application is not limited thereto. In other embodiments, the signal line may be one. Fig.10 , Fig.10 for Figure 6 The enlarged view of the circled portion of the middle frame 2 at B is shown. In some embodiments, the first end surface 221 also has an assembly groove 223 connected to the wiring groove 222, and the assembly groove 223 extends along the Y-axis direction. The assembly groove 223 is located on at least one side of the wiring groove 222 in the Y-axis direction. That is, the assembly groove 223 can be located only on the side of the wiring groove 222 in the Y-axis direction close to the first installation area C1, or only on the side of the wiring groove 222 in the Y-axis direction close to the second installation area C2, or on both sides of the wiring groove 222 in the Y-axis direction.

[0145] An opening 2231 is formed at one end of the assembly groove 223 away from the wiring groove 222, and the opening 2231 faces the installation area closest to the opening 2231 in the first installation area C1 and the second installation area C2. A portion of the signal line is accommodated in the assembly groove 223, and the signal line extends through the opening 2231 to be fixed and electrically connected to the circuit board (the first circuit board 5 or the second circuit board 6) closest to the opening 2231.

[0146] It should be noted that when the assembly slot 223 is located on the side of the wiring slot 222 close to the first installation area C1 in the Y-axis direction, the opening 2231 faces the first installation area C1, and the signal line 7 extends out of the assembly slot 223 through the opening facing the first installation area C1, and is fixed and electrically connected to the first circuit board 5. When the assembly slot 223 is located on the side of the wiring slot 222 close to the second installation area C2 in the Y-axis direction, the opening 2231 faces the second installation area C2, and the signal line 7 extends out of the assembly slot 223 through the opening facing the second installation area C2, and is fixed and electrically connected to the second circuit board 6. When the assembly slots 223 are arranged on both sides of the wiring slot 222 in the Y-axis direction, each assembly slot 223 has an opening 2231. The opening 2231 of the assembly groove 223 on the side of the wiring groove 222 close to the first installation area C1 in the Y-axis direction faces the first installation area C1, and the opening 2231 of the assembly groove 223 on the side of the wiring groove 222 close to the second installation area C2 in the Y-axis direction faces the second installation area C2.

[0147] The width of the assembly groove 223 is greater than the width of the wiring groove 222. Since the width of the assembly groove 223 is greater than the width of the wiring groove 222, the assembly groove 223 is wider. Such a design reduces the difficulty of assembly due to space limitations, thereby reducing the difficulty of assembling the signal line 7 into the wiring groove 222 and improving the assembly efficiency of the signal line 7.

[0148] On this basis, the difference between the width of the assembly groove 223 and the width of the wiring groove 222 is greater than 0 and less than or equal to 0.8 mm. For example, the difference between the width of the assembly groove 223 and the width of the wiring groove 222 is 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, or 0.7 mm. Exemplarily, when the width of the wiring groove 222 is 0.6 mm, the width of the assembly groove 223 can be 1.1 mm.

[0149] On this basis, the depth of the assembly groove 223 is greater than the depth of the wiring groove. Thus, it is convenient to assemble the signal line in the assembly groove. In other examples, the depth of the assembly groove 223 can also be less than or equal to the depth of the wiring groove.

[0150] Exemplarily, the depth of the assembly groove 223 may be in the range of greater than or equal to 1.75 mm and less than or equal to 1.95 mm.

[0151] In order to facilitate the assembly of the signal line 7 and improve the assembly efficiency of the signal line 7. In some embodiments, the assembly slot 223 includes a first assembly slot section 2232 and a second assembly slot section 2233, the first assembly slot section 2232 is connected between the second assembly slot section 2233 and the wiring slot 222, the opening 2231 is formed in the second assembly slot section 2233, and the width of the first assembly slot section 2232 gradually decreases in the direction from the second assembly slot section 2233 to the wiring slot 222. In this way, when the signal line 7 is assembled into the wiring slot 222, the signal line 7 can be guided by the first assembly slot section 2232, thereby improving the assembly efficiency of the signal line 7.

[0152] See also Fig.11 , Fig.11 for Fig.10 Schematic diagram of the positional relationship between the chamfer 2224 and the first end face 221 is shown in FIG. In some embodiments, chamfers 2224 are respectively provided between the groove walls on both sides of the width direction of the wiring groove 222 and the first end face 221. In this way, a transition area can be created at the notch of the wiring groove 222. In this way, on the one hand, it is easier for the signal line 7 to enter the wiring groove 222; on the other hand, it can prevent the signal line 7 from being damaged by the sharp edge of the wiring groove 222.

[0153] Exemplarily, the angle n between the connection direction of the two ends of the chamfer 2224 and the first end surface 221 is greater than or equal to 30° and less than or equal to 80°. Exemplarily, the angle n is 35°, 40°, 45°, 50°, 55°, 60°, 65°, 70° or 75°.

[0154] Exemplarily, the length L3 of the chamfer 2224 may be in a range of greater than or equal to 0.1 mm and less than or equal to 0.15 mm. For example, the length L3 of the chamfer 2224 is 0.11 mm, 0.12 mm, 0.13 mm or 0.14 mm.

[0155] See also Fig.12 , Fig.12 A flowchart of a method for processing the middle frame 2 provided in some embodiments of the present application. The method for processing the middle frame 2 comprises the following steps:

[0156] S10: making a middle frame blank, the middle frame blank comprising a middle plate 21 and a frame blank, and the frame blank is arranged around the middle plate 21 .

[0157] S20: Computerized Numerical Control (CNC) processing is performed on the frame blank to form a wiring groove 222. In other words, the wiring groove 222 is made by performing CNC processing on the frame blank.

[0158] The processing method of the middle frame 2 of the embodiment of the present application can process the wire groove 222 with the groove walls on both sides in parallel in the X-axis direction by computer numerical control processing of the frame blank, thereby breaking the limitation of the draft angle required to form the wire groove 222 by the die-casting process, which is conducive to reducing the width of the wire groove 222. The reduction in the width of the wire groove 222 is conducive to reducing the thickness of the frame 22 on the one hand, so as to realize the narrow frame design of the electronic device 100; on the other hand, it is also conducive to ensuring the structural strength and rigidity of the frame 22; on the other hand, on the basis of the beneficial effect of reducing the thickness of the frame 22 brought about by the reduction in the width of the wire groove 222, it is also conducive to increasing the volume of the accommodation space inside the electronic device 100, so that it is conducive to increasing the volume of the space for arranging the battery 4 inside the electronic device 100, and then it is conducive to increasing the volume of the battery 4 to improve the battery 4 endurance.

[0159] In some embodiments, the tool selected for computer numerical control processing of the frame blank is a saw blade. Since the cost of the saw blade is low, the investment cost of the tool can be reduced.

[0160] In some specific embodiments, the processing method of the middle frame 2 specifically includes the following steps:

[0161] S100: Made by die casting process Fig.13 The first blank shown. Fig.13 It is a three-dimensional view of the first blank.

[0162] Specifically, the first blank includes a metal conductor 212 and a metal frame blank 224 ′, and the metal frame blank 224 ′ is disposed around the metal conductor 212 .

[0163] The metal frame blank 224' has a first antenna radiator 811 and a second antenna radiator 812. The first antenna radiator 811 and the metal conductor 212 are spaced apart from each other, and the second antenna radiator 812 and the metal conductor 212 are spaced apart to form a gap region. A process connection bridge 25 is provided in the gap region between the first antenna radiator 811 and the metal conductor 212, and in the gap region between the second antenna radiator 812 and the metal conductor 212. In this way, the metal frame blank 224' and the metal conductor 212 can be integrally formed by a die-casting process.

[0164] A clearance hole K is formed on the metal frame blank 224' and passes through the metal frame blank 224' in the Z-axis direction. The portion of the metal frame blank 224' located at the clearance hole K and away from the metal conductor 212 is the first portion 2241b1 (i.e., the third antenna radiator). The portion of the metal frame blank 224' located at the clearance hole K and close to the metal conductor 212 is the second portion 2241b2, and the second portion 2241b2 is connected to the metal conductor 212.

[0165] The metal frame blank 224' is also formed with an assembly groove 223. It is understandable that, in order to facilitate demoulding, a draft angle is provided on the assembly groove 223.

[0166] Please continue reading Fig.13 A guide groove 229 is formed on the metal frame blank 224'. The groove depth direction of the guide groove 229 is the same as the Z-axis direction, and the width of the guide groove 229 gradually increases in the groove bottom wall of the guide groove 229 and the groove direction of the guide groove 229. Exemplarily, the groove depth of the guide groove 229 can be 0.35mm.

[0167] S110: The first blank is subjected to injection molding process to form Fig.14 The middle frame blank shown. Among them, Fig.14 It is a three-dimensional image of the middle frame blank.

[0168] See also Fig.15 , Fig.15 Based on Fig.14 The middle frame blank shown in FIG. 2 is an enlarged view of the circled portion at E. The plastic decorative frame 225 is formed on the outer peripheral surface of the metal frame blank 224' of the first blank by injection molding, and the clearance hole K ( Fig.15 A plastic filling structure 24' is formed in the area indicated by the middle dotted line, an insulating portion 213 is formed in the gap area, and a plastic connecting portion 23 is simultaneously formed on at least one side surface of the first portion 2241b1 along the Z-axis direction to obtain a middle frame blank.

[0169] In this embodiment, the surface roughness of the metal frame blank 224 ′ processed by the die-casting process is relatively large, and its appearance is difficult to meet the user's usage requirements. Forming a plastic decorative frame 225 on the outer peripheral surface of the metal frame blank 224 ′ is beneficial to improving the appearance of the middle frame 2.

[0170] S120: Process the middle frame blank by computer numerical control technology to form Fig.16 The middle frame shown. Fig.16 Based on Figure 6 A three-dimensional view of the middle frame shown.

[0171] See also Fig.17 , Fig.17 for Fig.16 The structure diagram of the circled portion of the middle frame shown at F is shown. Specifically, the first groove section 2221 is processed at the guide groove 229 by computer numerical control technology, and the second groove section 2222 is processed at the plastic filling structure 24' to form the wiring groove 222, and the wiring groove 222 is connected to the assembly groove 223. Therefore, the processing technology is simple.

[0172] It is understandable that after the second groove section 2222 is machined at the plastic filling structure 24 ′, the remaining portion is the plastic filling portion 24 .

[0173] In this embodiment, the wiring groove 222 is formed by computer numerical control processing after the injection molding process is completed. Therefore, when the metal frame blank 224' is injection molded, the wiring groove 222 has not yet been formed, so there is no need to set an insert in the molding area corresponding to the wiring groove 222 on the injection mold, thereby avoiding the problem of the production efficiency of the middle frame 2 being reduced and the production cost being increased due to the need to frequently repair the broken inserts due to the easy breakage of the inserts.

[0174] The plastic decorative frame 225, the plastic filling structure 24' and the plastic connection part connected between the plastic decorative frame 225 and the plastic filling structure 24' are integrally formed by injection molding. In this way, on the one hand, it is helpful to simplify the processing technology of the middle frame 2, improve the processing efficiency of the middle frame 2 and reduce the manufacturing cost of the middle frame 2; on the other hand, the plastic filling structure 24' can be used to separate the antenna radiator 81 on the first frame segment 226 from the metal conductor 212 to meet the clearance requirement of the antenna radiator 81.

[0175] By performing computer numerical control processing on the plastic filling structure 24 ′ to form the second slot section 2222 of the wiring slot 222 , the wiring slot 222 and the antenna radiator 81 can share the first frame section 226 , which is beneficial to saving the internal space of the electronic device 100 .

[0176] The assembly groove 223 is formed on the metal frame blank 224' by a die-casting process, so there is no need to process the assembly groove 223 by a computer numerical control process, which can effectively solve the problem of increasing the production time of the middle frame 2 due to the need to increase the number of passes or replace tools of different sizes when processing the metal frame blank 224' to form the assembly groove 223 by a computer numerical control process, which is beneficial to improving the processing efficiency of the middle frame 2.

[0177] Since the guide groove 229 can facilitate the positioning and cutting of the tool used in the computer numerical control process, processing the first groove section 2221 at the guide groove 229 through the computer numerical control process is beneficial to improving the forming efficiency of the wiring groove 222, thereby improving the processing efficiency of the middle frame 2.

[0178] In some embodiments, the plastic decorative frame 225 may be sprayed to improve the appearance of the frame 22. Specifically, the plastic decorative frame 225 may be sprayed before or during the computer numerical control process.

[0179] In some embodiments, while forming the wiring groove 222 by computer numerical control technology, the process connection bridge 25 can be cut off by computer numerical control technology, and the side key groove can be formed on the frame 22. In this way, the process connection bridge 25 cutting work and the wiring groove 222 forming work and the side key groove forming work can be completed in one workpiece clamping. In this way, the number of clamping operations on the middle frame blank can be reduced, thereby saving corresponding operation time, and further improving the processing efficiency of the middle frame 2.

[0180] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0181] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A middle frame, characterized in that: Including middle plate and frame; One side surface of the middle plate in the thickness direction is a first surface, the first surface has a first mounting area and a second mounting area, the first mounting area and the second mounting area are spaced apart in the first direction; wherein the first direction is perpendicular to the thickness direction of the middle plate, and the middle plate includes a metal conductor; The frame is arranged around the middle plate, the frame has a first end face which is oriented in the same direction as the first surface, and the first end face has a wiring groove; the wiring groove extends along the first direction, and along the first direction, the wiring groove is located between the first installation area and the second installation area; the groove walls on both sides of the wiring groove in the width direction are arranged in parallel; The portion of the frame corresponding to the wiring groove is a first frame segment, and the first frame segment includes a first metal segment; in a first direction, the first metal segment includes a first sub-segment and a second sub-segment; The first sub-segment is directly connected to the metal conductor, the second sub-segment is formed with a clearance hole that penetrates the second sub-segment along the thickness direction of the middle plate, the second sub-segment is divided into a first part and a second part by the clearance hole, the first part is located on a side of the second part away from the middle plate; the first part is used to form an antenna radiator, and the clearance hole is filled with a plastic filling part.

2. The middle frame according to claim 1, characterized in that: The width of the wiring groove has a value range of less than 0.64 mm.

3. The middle frame according to claim 2, characterized in that: The width of the wiring groove has a value range greater than or equal to 0.58 mm.

4. The middle frame according to any one of claims 1 to 3, characterized in that: The depth of the wiring groove has a value range of greater than or equal to 1.5 mm and less than or equal to 2.5 mm.

5. The middle frame according to claim 1, characterized in that: The frame includes a metal frame and a plastic decorative frame. The metal frame is arranged around the middle plate, and the plastic decorative frame is arranged around the metal frame. At least a part of the wiring groove is formed in the metal frame, and the first metal segment is located in the metal frame.

6. The middle frame according to claim 5, characterized in that: The wiring slot comprises a first slot section and a second slot section which are connected to each other, wherein the first slot section is formed in the first sub-section; The surface of the plastic filling portion that is aligned with the first surface is recessed to form a recessed groove, the recessed groove extends toward the second portion to the second portion, and the surface of the second portion that faces the first portion and the recessed groove together define the second groove section.

7. The middle frame according to claim 5, characterized in that: A plastic connecting part is attached to one or both side surfaces of the first part in the thickness direction of the middle plate, and the plastic connecting part is directly connected between the plastic decorative frame and the plastic filling part, so that the plastic connecting part, the plastic decorative frame and the plastic filling part are connected as an integral molded part.

8. The middle frame according to any one of claims 1 to 3, characterized in that: The first end surface also has an assembly groove connected to the wiring groove, and the assembly groove extends along the first direction; The assembly groove is located on at least one side of the wiring groove in the first direction; an opening is formed at one end of the assembly groove away from the wiring groove, and the opening faces the installation area closest to the opening in the first installation area and the second installation area, and the width of the assembly groove is greater than the width of the wiring groove.

9. The middle frame according to claim 8, characterized in that: The assembly groove includes a first assembly groove section and a second assembly groove section, the first assembly groove section is connected between the second assembly groove section and the wiring groove, the opening is formed in the second assembly groove section, and the width of the first assembly groove section gradually decreases in the direction from the second assembly groove section to the wiring groove.

10. The middle frame according to any one of claims 1 to 3, characterized in that: Chamfers are respectively provided between the groove walls on both sides of the wiring groove in the width direction and the first end surface.

11. The middle frame according to any one of claims 1 to 3, characterized in that: A first convex rib and a second convex rib are provided on the first surface, the first convex rib and the second convex rib are spaced apart in the first direction, two ends of the first convex rib along the second direction are respectively connected to two side walls of the frame in the second direction, and two ends of the second convex rib along the second direction are respectively connected to two side walls of the frame in the second direction, and the second direction is perpendicular to the first direction; The area on the first surface surrounded by the first rib and the frame forms the first installation area, and the area on the first surface surrounded by the second rib and the frame forms the second installation area.

12. An electronic device, characterized in that: include: The middle frame according to any one of claims 1 to 11; a first circuit board, the first circuit board being mounted in the first mounting area; a second circuit board, the second circuit board being mounted in the second mounting area; A signal line, wherein the signal line has a first end and a second end, wherein the first end is fixed to and electrically connected to the first circuit board, and the second end is fixed to and electrically connected to the second circuit board, and the signal line is arranged in the wiring groove, and the signal line is clamped by relative groove walls of the wiring groove.

13. The electronic device according to claim 12, characterized in that: The wire diameter of the signal wire has a value range of less than or equal to 0.64 mm.

14. The electronic device according to claim 12 or 13, characterized in that: There are a plurality of signal lines, and the plurality of signal lines are arranged in the thickness direction of the middle plate, and the line diameters of the plurality of signal lines are equal.

15. The electronic device according to claim 12 or 13, characterized in that: The first circuit board is provided with a radio frequency chip; the second circuit board has a feeding circuit, and the radio frequency chip and the feeding circuit are electrically connected through the signal line; The frame includes a metal frame, which is arranged around the middle plate; the metal frame includes a second metal segment, which is arranged along the edge of the second installation area, and the second metal segment is used to form a first antenna radiator, and the first antenna radiator is electrically connected to the feeding circuit.

16. The electronic device according to claim 15, characterized in that: The metal frame includes a third metal segment, which is arranged along an edge of the first installation area. The third metal segment is used to form a second antenna radiator, and the second antenna radiator is electrically connected to the radio frequency chip.

17. A method for processing a middle frame according to any one of claims 1 to 11, characterized in that: Making a middle frame blank, wherein the middle frame blank comprises a middle plate and a frame blank, and the frame blank is arranged around the middle plate; The frame blank is processed by computer numerical control technology to form a wiring groove.

18. The method for processing the middle frame according to claim 17, characterized in that: The following steps are involved: A first blank is manufactured by a die-casting process; the first blank comprises a metal conductor and a metal frame blank, and the metal frame blank is arranged around the metal conductor; An injection molding process is used to form a plastic decorative frame on the outer peripheral surface of the metal frame blank to obtain the middle frame blank.

19. The method for processing the middle frame according to claim 18, characterized in that: The metal frame blank has a clearance hole penetrating the metal frame blank in the thickness direction of the metal conductor, and a portion of the metal frame blank located in the clearance hole and away from the metal conductor is a first portion; The step of forming a plastic decorative frame on the outer circumferential surface of the metal frame blank by using an injection molding process specifically includes: forming a plastic decorative frame on the outer circumferential surface of the metal frame blank by using an injection molding process, forming a plastic filling structure in the clearance hole, and forming a plastic connecting portion on at least one side surface of the first part along the thickness direction of the metal conductor.

20. The method for processing the middle frame according to claim 19, characterized in that: The frame blank is processed by computer numerical control technology to form a wiring trough, which specifically includes: The metal frame blank is processed by computer numerical control technology to form a first slot section of the wiring slot, and the plastic filling structure is processed by computer numerical control technology to form a second slot section of the wiring slot.

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