Semiconductor test socket and installation method thereof

Abstract

The present invention belongs to the field of chip testing technology, and discloses a semiconductor test socket and its installation method. The semiconductor test socket includes a substrate, a pin positioning structure, a floating plate and a chip, and the substrate is provided with a positioning groove; the pin positioning structure includes a first positioning structure and a second positioning structure, and the first positioning structure and the second positioning structure both include a plurality of plug-in pin groups, a plurality of positioning blocks and positioning pins, and the plurality of plug-in pin groups and the plurality of positioning blocks are arranged one by one, and each plug-in pin group includes two parallel plug-in pins, and the positioning block is provided with a plug-in portion for clamping the pin tip and a receiving groove for receiving the pin body, and the plurality of positioning blocks are fixedly connected by the positioning pins; the floating plate is accommodated in the positioning groove; one end of the chip abuts against the pin tip of the plug-in pin of the first positioning structure, and the other end of the chip abuts against the pin tip of the plug-in pin of the second positioning structure. The semiconductor test socket provided by the present invention is easy to realize the assembly positioning of the plug-in pins, and improves the positioning effect.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a semiconductor testing socket and a mounting method thereof. Background Art

[0002] Various performance tests are required during the large-scale R&D and production of semiconductor chips. The chip test socket is a key component in the test. The function of the test socket is to position the chip and transmit electronic signal current between circuit boards to achieve the test effect. The quality and matching degree of the test socket directly affect the accuracy of the test judgment.

[0003] In the chip test socket industry, there are some chip tests with large currents, and spring pins cannot meet the electrical performance test requirements, so some special-shaped pins are used. The structure of special-shaped pins is more complicated than that of spring pins, and it is more difficult to position them during assembly. In addition, the internal space of the socket is small, and the structure size is limited, which is not convenient for staff to assemble.

[0004] Therefore, there is an urgent need for a semiconductor test socket and an installation method thereof to solve the above technical problems. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor test socket and an installation method thereof, aiming to solve the problem in the prior art that it is difficult to position special-shaped pins during assembly and it is inconvenient to assemble. The semiconductor test socket is easy to realize the assembly positioning of the plug-in pins, and the positioning effect of the special-shaped pins is improved. The installation method of the semiconductor test socket has a simple installation process and is conducive to quickly completing the assembly process.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] Semiconductor test sockets, including:

[0008] The base plate is provided with a positioning groove, and the bottom of the positioning groove is provided with a first receiving groove and a second receiving groove arranged adjacent to each other;

[0009] The needle positioning structure comprises a first positioning structure and a second positioning structure, wherein the first positioning structure is received in the first receiving groove, and the second positioning structure is received in the second receiving groove, and the first positioning structure and the second positioning structure each comprise a plurality of plug-in needle groups, a plurality of positioning blocks and positioning pins, wherein the plurality of plug-in needle groups and the plurality of positioning blocks are arranged in a one-to-one correspondence, and each of the plug-in needle groups comprises two parallelly arranged plug-in needles, wherein the plug-in needles comprise a needle body and a needle tip connected to each other, and the positioning block is provided with a plug-in portion for clamping the needle tip and a receiving groove for receiving the needle body, wherein the plurality of positioning blocks are stacked in sequence and fixedly connected by the positioning pin, and the extension direction of the needle tip is perpendicular to the extension direction of the positioning pin;

[0010] A floating plate is received in the positioning groove, a limiting hole is provided on the floating plate, and a limiting member for limiting the floating plate is provided on the base plate;

[0011] A chip is disposed in the limiting hole, one end of the chip abuts against the tip of the plugging needle of the first positioning structure, and the other end of the chip abuts against the tip of the plugging needle of the second positioning structure;

[0012] An upper cover is disposed on the substrate and has a pressing piece that can be pressed on the chip.

[0013] Optionally, the needle body is in a U-shaped structure, and the two branch ends of the U-shaped structure are bent respectively to form the needle tip, the two needle tips are a first needle tip and a second needle tip, the plug-in portion includes a first plug-in portion and a second plug-in portion, the first plug-in portion is used to clamp the first needle tip, and the second plug-in portion is used to clamp the second needle tip, one end of the chip abuts against the first needle tip of the plug-in needle of the first positioning structure, and the other end of the chip abuts against the first needle tip of the plug-in needle of the second positioning structure.

[0014] Optionally, a floating elastic member is provided between the floating plate and the positioning groove.

[0015] Optionally, a positioning plate is arranged between the floating plate and the positioning groove, and the positioning plate has a first through hole for the floating elastic member to pass through, a second through hole for the first needle tip of the plug-in needle of the first positioning structure to protrude, and a third through hole for the first needle tip of the plug-in needle of the second positioning structure to protrude, and the second through hole and the third through hole are connected.

[0016] Optionally, a first pressing protrusion that fits the first positioning structure is provided on the hole wall of the second through hole, and a second pressing protrusion that fits the second positioning structure is provided on the hole wall of the third through hole.

[0017] Optionally, the positioning plate and the base plate are connected via a first screw member.

[0018] Optionally, a guide column for guiding the positioning plate and the floating plate is provided at the bottom of the positioning groove.

[0019] Optionally, the limiting member is a screw.

[0020] Optionally, the semiconductor test socket also includes a base, the substrate is detachably mounted on the base, the second needle tip of the plug-in pin of the first positioning structure passes through the guide hole at the bottom of the first accommodating groove and abuts against the base, and the second needle tip of the plug-in pin of the second positioning structure passes through the guide hole at the bottom of the second accommodating groove and abuts against the base.

[0021] A method for installing a semiconductor test socket as described in any of the above schemes comprises:

[0022] Installing the positioning pin on the outermost positioning block;

[0023] Clamp each of the plug pins into the corresponding positioning block;

[0024] The remaining positioning blocks are stacked and fixed by the positioning pins to form the first positioning structure or the second positioning structure;

[0025] The first positioning structure or the second positioning structure is received in the corresponding first receiving groove or the second receiving groove.

[0026] Beneficial effects of the present invention: The semiconductor test socket provided by the present invention, the first positioning structure and the second positioning structure both include multiple plug-in pin groups and multiple positioning blocks, the multiple plug-in pin groups and the multiple positioning blocks are arranged in a one-to-one correspondence, each plug-in pin group includes two parallelly arranged plug-in pins, the positioning block is provided with a plug-in portion for clamping the needle tip and a receiving groove for receiving the needle body, which makes it easy to realize the assembly positioning of the plug-in pins and improves the positioning effect.

[0027] The present invention also provides an installation method for a semiconductor test socket. During installation, each plug-in pin is clamped on a corresponding positioning block, and then all the positioning blocks are stacked and fixed by positioning pins. The installation process is simple, easy to assemble, and the plug-in pins can achieve better positioning. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is an exploded view of a semiconductor test socket (the base is not shown) provided in an embodiment of the present invention;

[0029] Figure 2 is a cross-sectional view of a semiconductor test socket (the base is not shown) provided in an embodiment of the present invention;

[0030] Figure 3 is a three-dimensional view of a semiconductor test socket provided by an embodiment of the present invention;

[0031] Figure 4 is a structural schematic diagram of a first positioning structure and a second positioning structure after being respectively installed on a substrate at a viewing angle provided by an embodiment of the present invention;

[0032] Figure 5 is a structural schematic diagram of a first positioning structure and a second positioning structure after being respectively installed on a substrate from another perspective provided by an embodiment of the present invention;

[0033] Figure 6 is a schematic structural diagram of a plug pin assembly provided by an embodiment of the present invention;

[0034] Figure 7 It is an exploded view of the first positioning structure provided by an embodiment of the present invention.

[0035] In the figure:

[0036] 100, substrate; 110, positioning groove; 120, first receiving groove; 130, second receiving groove;

[0037] 210, first positioning structure; 220, second positioning structure; 2111, plug-in needle; 21111, needle body; 21112, needle tip; 212, positioning block; 2121, plug-in portion; 2122, storage groove; 213, positioning pin; 214, cover body;

[0038] 300, floating plate; 310, limiting hole;

[0039] 400, chip; 500, floating elastic part;

[0040] 600, positioning plate; 610, first through hole; 620, second through hole; 630, third through hole; 640, first pressing protrusion; 650, second pressing protrusion;

[0041] 700, first threaded member; 800, guide column; 900, limit member; 1000, base; 1100, upper cover; 1200, second threaded member; 1300, nut; 1400, gasket; 1500, fixing pin. DETAILED DESCRIPTION

[0042] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0043] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0046] The present embodiment provides a semiconductor test socket and an installation method thereof, aiming to solve the problem in the prior art that it is difficult to position and inconvenient to assemble special-shaped pins. The semiconductor test socket is easy to realize the assembly positioning of the plug-in pins, and improves the positioning effect of the special-shaped pins. The installation method of the semiconductor test socket has a simple installation process and is conducive to quickly completing the assembly process.

[0047] like Figure 1-Figure 7As shown, the semiconductor test socket includes a substrate 100, a needle positioning structure, a floating plate 300, a chip 400 and an upper cover 1100. The substrate 100 is provided with a positioning groove 110, and the bottom of the positioning groove 110 is provided with a first accommodating groove 120 and a second accommodating groove 130 arranged adjacent to each other; the needle positioning structure includes a first positioning structure 210 and a second positioning structure 220, the first positioning structure 210 is received in the first accommodating groove 120, and the second positioning structure 220 is received in the second accommodating groove 130, the first positioning structure 210 and the second positioning structure 220 each include a plurality of plug-in needle groups, a plurality of positioning blocks 212 and a positioning pin 213, the plurality of plug-in needle groups and the plurality of positioning blocks 212 are arranged one by one, and each plug-in needle group includes two plug-in needles 2111 arranged in parallel, and the plug-in needle 2111 includes a needle body 21111 and a needle tip 21112 connected to each other The positioning block 212 is provided with a plug-in portion 2121 for clamping the needle tip 21112 and a receiving groove 2122 for receiving the needle body 21111. Multiple positioning blocks 212 are stacked in sequence and fixedly connected by the positioning pin 213. The extension direction of the needle tip 21112 is perpendicular to the extension direction of the positioning pin 213. The floating plate 300 is accommodated in the positioning groove 110. The floating plate 300 is provided with a limiting hole 310. The substrate 100 is provided with a limiting member 900 for limiting the floating plate 300. The chip 400 is arranged in the limiting hole 310. One end of the chip 400 abuts against the needle tip 21112 of the plug-in pin 2111 of the first positioning structure 210, and the other end of the chip 400 abuts against the needle tip 21112 of the plug-in pin 2111 of the second positioning structure 220. The upper cover 1100 is covered on the substrate 100 and has a pressing member that can be pressed on the chip 400.

[0048] The semiconductor test socket provided by the present invention, the first positioning structure 210 and the second positioning structure 220 both include a plurality of plug-in pin groups and a plurality of positioning blocks 212, the plurality of plug-in pin groups and the plurality of positioning blocks 212 are arranged in a one-to-one correspondence, each plug-in pin group includes two parallelly arranged plug-in pins 2111, the positioning block 212 is provided with a plug-in portion 2121 for clamping the needle tip 21112 and a receiving groove 2122 for receiving the needle body 21111, which facilitates the assembly positioning of the plug-in pin 2111 and improves the positioning effect.

[0049] Optionally, the first positioning structure 210 and the second positioning structure 220 both include a cover 214, and the cover 214 is disposed on the outermost positioning block 212 to cover the receiving groove 2122 to prevent the plug pin group disposed in the receiving groove 2122 from being exposed, thereby improving the reliability of use.

[0050] Specifically, in this embodiment, the needle body 21111 is a U-shaped structure, and the two branch ends of the U-shaped structure are bent to form needle tips 21112, the two needle tips 21112 are the first needle tip and the second needle tip, the plug-in portion 2121 includes a first plug-in portion and a second plug-in portion, the first plug-in portion is used to clamp the first needle tip, and the second plug-in portion is used to clamp the second needle tip, one end of the chip 400 abuts against the first needle tip of the plug-in needle 2111 of the first positioning structure 210, and the other end of the chip 400 abuts against the first needle tip of the plug-in needle 2111 of the second positioning structure 220. By arranging the first plug-in portion and the second plug-in portion on the positioning block 212, the first needle tip and the second needle tip are clamped respectively, and the storage groove 2122 stores the needle body 21111, so as to improve the assembly positioning stability and reliability of the plug-in needle 2111.

[0051] Preferably, a floating elastic member 500 is provided between the floating plate 300 and the positioning groove 110. During testing, the upper cover 1100 is covered on the substrate 100, and the pressing member of the upper cover 1100 is pressed on the chip 400. At the same time, the upper cover 1100 will apply downward pressure to the floating plate 300. By providing the floating elastic member 500, the floating elastic member 500 can prevent the upper cover 1100 from exerting a large impact force on the floating plate 300, avoid damage to the floating plate 300 due to impact, and improve the reliability of use. In this embodiment, the floating elastic member 500 is configured as a spring.

[0052] Optionally, a positioning plate 600 is disposed between the floating plate 300 and the positioning groove 110. The positioning plate 600 has a first through hole 610 for the floating elastic member 500 to pass through, a second through hole 620 for the first needle tip of the plugging needle 2111 of the first positioning structure 210 to protrude, and a third through hole 630 for the first needle tip of the plugging needle of the second positioning structure 220 to protrude, and the second through hole 620 is connected to the third through hole 630. After the chip 400 is disposed in the limiting hole 310 of the floating plate 300, one end of the chip 400 abuts against the first needle tip of the plugging needle 2111 of the first positioning structure 210 protruding from the second through hole 620, and the other end abuts against the first needle tip of the plugging needle of the second positioning structure 220 protruding from the third through hole 630, thereby improving the positioning accuracy between the chip 400 and the needle tip 21112.

[0053] Preferably, the hole wall of the second through hole 620 is provided with a first pressing protrusion 640 that fits the first positioning structure 210, and the hole wall of the third through hole 630 is provided with a second pressing protrusion 650 that fits the second positioning structure 220. By providing the first pressing protrusion 640 and the second pressing protrusion 650, after the upper cover 1100 is closed, the first pressing protrusion 640 provides downward pressure to the first positioning structure 210, and the second pressing protrusion 650 provides downward pressure to the second positioning structure 220, thereby preventing the first positioning structure 210 and the second positioning structure 220 from deviating during the test process and improving the test stability.

[0054] Optionally, the positioning plate 600 and the base plate 100 are connected by a first screw member 700 to facilitate assembly and disassembly.

[0055] Preferably, a guide column 800 for guiding the positioning plate 600 and the floating plate 300 is provided at the bottom of the positioning groove 110. During the installation of the positioning plate 600 and the floating plate 300, the guide column 800 plays a guiding role to improve the installation efficiency.

[0056] Optionally, the limiting member 900 provided on the substrate 100 for limiting the floating plate 300 is a screw, the screw shaft portion of the screw is screwed onto the substrate 100, the screw umbrella portion of the screw is partially embedded in the substrate 100, and the remaining portion is overlapped onto the floating plate 300 to limit the floating plate 300 and prevent the floating plate 300 from falling out of the positioning groove 110.

[0057] The semiconductor test socket further includes a base 1000, on which the substrate 100 is detachably mounted, and the second needle tip of the plugging needle 2111 of the first positioning structure 210 passes through the guide hole at the bottom of the first receiving groove 120 and abuts against the base 1000, and the second needle tip of the plugging needle 2111 of the second positioning structure 220 passes through the guide hole at the bottom of the second receiving groove 130 and abuts against the base 1000. By arranging that the substrate 100 is detachably mounted on the base 1000, the convenience of disassembly and assembly is improved.

[0058] For example, the substrate 100 is mounted on the base 1000 through the second threaded member 1200, the second threaded member 1200 includes a screw and a nut 1300, the screw is screwed to the substrate 100 and the base 1000, one end of the screw extends out of the bottom surface of the base 1000, the nut 1300 is screwed to the end of the screw, and a gasket 1400 is provided between the nut 1300 and the base 1000 to ensure a stable and reliable connection. Preferably, a fixing pin 1500 is provided between the base 1000 and the substrate 100 to further improve the connection stability.

[0059] This embodiment also provides a method for installing the semiconductor test socket, comprising the steps of:

[0060] S1, installing the positioning pin 213 on the outermost positioning block 212;

[0061] S2, clamping each plug pin 2111 to the corresponding positioning block 212;

[0062] S3, stacking and fixing the remaining positioning blocks 212 by means of positioning pins 213 to form a first positioning structure 210 or a second positioning structure 220;

[0063] S4. Accommodate the first positioning structure 210 or the second positioning structure 220 into the corresponding first receiving groove 120 or the second receiving groove 130 .

[0064] The semiconductor test socket installation method provided in this embodiment is that during installation, each plug pin 2111 is snapped into the corresponding positioning block 212, and then all the positioning blocks 212 are stacked and fixed by the positioning pin 213. The installation process is simple and convenient, which is conducive to assembly, and the plug pin 2111 can achieve better positioning.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A semiconductor test socket, characterized in that: include: A base plate (100) is provided with a positioning groove (110), wherein the bottom of the positioning groove (110) is provided with a first receiving groove (120) and a second receiving groove (130) which are arranged adjacent to each other; The needle positioning structure comprises a first positioning structure (210) and a second positioning structure (220), wherein the first positioning structure (210) is received in the first receiving groove (120), and the second positioning structure (220) is received in the second receiving groove (130), wherein the first positioning structure (210) and the second positioning structure (220) each comprise a plurality of plug-in needle groups, a plurality of positioning blocks (212) and positioning pins (213), wherein the plurality of plug-in needle groups and the plurality of positioning blocks (212) are arranged in a one-to-one correspondence, and each of the plug-in needle groups comprises Two parallel plug-in needles (2111), the plug-in needle (2111) comprising a needle body (21111) and a needle tip (21112) connected to each other, the positioning block (212) being provided with a plug-in portion (2121) for clamping the needle tip (21112) and a receiving groove (2122) for receiving the needle body (21111), a plurality of the positioning blocks (212) being stacked in sequence and fixedly connected by the positioning pin (213), and an extension direction of the needle tip (21112) being perpendicular to an extension direction of the positioning pin (213); A floating plate (300) is received in the positioning groove (110), and a floating elastic member (500) is provided between the floating plate (300) and the positioning groove (110); a limiting hole (310) is provided on the floating plate (300), and a limiting member (900) for limiting the floating plate (300) is provided on the base plate (100); the limiting member (900) is a screw; the screw shaft of the screw is screwed onto the base plate (100), the screw cap portion of the screw is partially embedded in the base plate (100), and the remaining portion is overlapped onto the floating plate (300); A chip (400) is arranged in the limiting hole (310), one end of the chip (400) abuts against the needle tip (21112) of the plug-in needle (2111) of the first positioning structure (210), and the other end of the chip (400) abuts against the needle tip (21112) of the plug-in needle (2111) of the second positioning structure (220); An upper cover (1100), the upper cover (1100) is disposed on the substrate (100) and has a pressing piece that can be pressed onto the chip (400).

2. The semiconductor test socket according to claim 1, wherein: The needle body (21111) is a U-shaped structure, and the two branch ends of the U-shaped structure are bent respectively to form the needle tip (21112), the two needle tips (21112) are a first needle tip and a second needle tip, the plug-in portion (2121) includes a first plug-in portion and a second plug-in portion, the first plug-in portion is used to clamp the first needle tip, and the second plug-in portion is used to clamp the second needle tip, one end of the chip (400) is in contact with the first needle tip of the plug-in needle (2111) of the first positioning structure (210), and the other end of the chip (400) is in contact with the first needle tip of the plug-in needle (2111) of the second positioning structure (220).

3. The semiconductor test socket according to claim 2, characterized in that: A positioning plate (600) is provided between the floating plate (300) and the positioning groove (110), and the positioning plate (600) has a first through hole (610) for the floating elastic member (500) to pass through, a second through hole (620) for the first needle tip of the plug-in needle (2111) of the first positioning structure (210) to protrude, and a third through hole (630) for the first needle tip of the plug-in needle of the second positioning structure (220) to protrude, and the second through hole (620) and the third through hole (630) are connected.

4. The semiconductor test socket according to claim 3, characterized in that: The hole wall of the second through hole (620) is provided with a first pressing protrusion (640) which is fitted to the first positioning structure (210), and the hole wall of the third through hole (630) is provided with a second pressing protrusion (650) which is fitted to the second positioning structure (220).

5. The semiconductor test socket according to claim 3, characterized in that: The positioning plate (600) and the base plate (100) are connected via a first screw member (700).

6. The semiconductor test socket according to claim 3, characterized in that: A guide column (800) for guiding the positioning plate (600) and the floating plate (300) is provided at the bottom of the positioning groove (110).

7. The semiconductor test socket according to claim 2, wherein: The semiconductor test socket further comprises a base (1000), the substrate (100) being detachably mounted on the base (1000), the second needle tip of the plugging needle (2111) of the first positioning structure (210) passing through the guide hole at the bottom of the first receiving groove (120) and abutting against the base (1000), and the second needle tip of the plugging needle (2111) of the second positioning structure (220) passing through the guide hole at the bottom of the second receiving groove (130) and abutting against the base (1000).

8. A method for installing a semiconductor test socket according to any one of claims 1 to 7, characterized in that: include: Installing the positioning pin (213) on the outermost positioning block (212); Clamping each of the plug pins (2111) to the corresponding positioning block (212); The remaining positioning blocks (212) are stacked and fixed by means of the positioning pins (213) to form the first positioning structure (210) or the second positioning structure (220); The first positioning structure (210) or the second positioning structure (220) is accommodated in the corresponding first receiving groove (120) or the second receiving groove (130).

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