A device, system and method for capacitor temperature rise test

Abstract

The present invention belongs to the technical field of capacitor detection, and is a device, system and method for capacitor temperature rise test, including: a shell, an internal cavity having a plurality of core rows arranged in sequence, and a flow channel interval defined between two adjacent core rows; a plurality of mounting seats, which are arranged one by one in the flow channel interval, and the two ends of the mounting seats respectively penetrate the opposite side walls of the shell; a flow channel plate, which is arranged in the mounting seat and has a switchable combination or separation state relative to the mounting seat, and when the flow channel plate is combined with the mounting seat, the flow channel plate is configured to have coolant flowing inside, and when the flow channel plate is separated from the mounting seat, another flow channel plate with a shape different from the flow channel plate is combined with the mounting seat. It can effectively explore the influence of the flow channel plate on the heat dissipation of the capacitor and enhance the superiority of the temperature rise test of the thin film capacitor.

Description

Technical Field

[0001] The present invention belongs to the technical field of capacitor detection, and in particular relates to a device, a system and a method for capacitor temperature rise test. Background Art

[0002] Film capacitors are excellent capacitors because of their many excellent properties. Their main characteristics are as follows: non-polarity, high insulation impedance, excellent frequency characteristics (wide frequency response), and low dielectric loss. Based on the above advantages, film capacitors are widely used in analog circuits, and temperature rise tests on film capacitors can effectively detect the actual use of capacitors under power supply conditions, thereby improving the use effect.

[0003] At present, the common test method is to place the film capacitor in a constant temperature box and test it by loading ripple current, thermocouple and multi-channel temperature meter. However, since the capacitor structure is not easy to change and adjust, and the technology for testing capacitors with flow channel plate heat dissipation structure is relatively scarce, there are certain limitations in the test results of film capacitors, and it is not convenient to accurately judge the influence of flow channel plate structure on the heat dissipation of capacitors. Therefore, a capacitor temperature rise test technology is urgently needed to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a device, system and method for capacitor temperature rise test, aiming to solve at least one of the above-mentioned problems.

[0005] To achieve the above object, the present invention provides the following solutions:

[0006] A capacitor temperature rise test device, comprising:

[0007] The shell has a cavity inside which a plurality of core rows are sequentially arranged, and a flow channel section is defined between two adjacent core rows;

[0008] A plurality of mounting seats are provided, and the plurality of mounting seats are correspondingly arranged in the flow channel area, and two ends of the mounting seats respectively penetrate the opposite side walls of the shell;

[0009] A flow channel plate is arranged in the mounting seat and has a switchable combination or separation state relative to the mounting seat. When the flow channel plate is combined with the mounting seat, the flow channel plate is configured to have coolant flowing therein. When the flow channel plate is separated from the mounting seat, another flow channel plate having a shape different from that of the flow channel plate is combined with the mounting seat.

[0010] Preferably, a slot is provided in the mounting seat along the length direction, a protrusion is fixedly connected to the opposite side of the inner wall of the slot, a groove is provided on the side wall of the flow channel plate, and when the flow channel plate is combined with the mounting seat, the protrusion is engaged with the groove.

[0011] In addition, a capacitor temperature rise test system is provided, including:

[0012] Constant temperature box, temperature detection mechanism, coolant circulation mechanism, current output mechanism;

[0013] Comparison capacitor;

[0014] The capacitor temperature rise test device described above, wherein the control capacitor and the capacitor temperature rise test device are arranged in the constant temperature box, and are respectively connected to the temperature detection mechanism and the current output mechanism, and the coolant circulation mechanism is connected to the capacitor temperature rise test device.

[0015] Preferably, it also includes:

[0016] A computer is connected to the temperature detection mechanism for comparing the obtained temperature rise data of the reference capacitor and the temperature rise data of the capacitor temperature rise test device.

[0017] Preferably, the coolant circulation mechanism comprises:

[0018] A water tank for storing coolant;

[0019] The peristaltic pump is configured such that two ends are respectively connected to the water tank and the flow channel plate, and one end of the flow channel plate away from the peristaltic pump is connected to the water tank.

[0020] A method for capacitor temperature rise test, based on the capacitor temperature rise test system described above, comprises the following steps:

[0021] Use the capacitor temperature rise test device as the test capacitor;

[0022] Among them,

[0023] obtaining temperature rise data of at least one reference capacitor, and,

[0024] Acquiring temperature rise data of at least one test capacitor, wherein the test capacitor has a changeable cooling channel shape by replacing a flow channel plate structure to produce different heat dissipation effects;

[0025] Make the control capacitor and the test capacitor participate in the test at the same constant temperature;

[0026] During the test, ripple current is continuously provided to the control capacitor and the test capacitor;

[0027] The obtained temperature rise data of the control capacitor is determined as the standard value, and the obtained temperature rise data of the test capacitor formed under different cooling effects are determined as the comparison value;

[0028] Compare the comparison value with the standard value to obtain the heat dissipation effect of the flow channel plate on the test capacitor.

[0029] Preferably, when obtaining several temperature rise data of the test capacitor, after obtaining the temperature rise data of the previous test capacitor, the cooling channel shape of the test capacitor is changed by replacing the flow channel plate, and then the temperature rise data of the next test capacitor is obtained.

[0030] Preferably, the coolant circulation mechanism is connected to the flow channel plate so that the coolant flows through the flow channel plate at a specific flow rate.

[0031] Preferably, the control capacitor and the test capacitor are connected to each other through a current output mechanism, so that the two can simulate the temperature rise effect under actual use conditions.

[0032] Preferably, when obtaining the temperature rise data of the reference capacitor and the test capacitor, the temperature detection mechanism and the computer are connected to the reference capacitor and the test capacitor respectively.

[0033] Compared with the prior art, the present invention has the following advantages and technical effects:

[0034] The present invention utilizes the test capacitor to form a changeable cooling channel shape through the flow channel plate, thereby producing different heat dissipation effects, so that the temperature rise data of the test capacitor obtained includes a variety of heat dissipation conditions. It not only increases the test data on the influence of the heat dissipation structure of the flow channel plate on the heat dissipation effect of the capacitor, and realizes the diversification of the test data, but also through the arrangement of the reference capacitor, it can effectively ensure the accuracy of the temperature rise data when there are parameter variables in the test capacitor, thereby improving the accuracy of the test data test. In addition, it also provides a positive driving role in exploring the influence of the flow channel plate on the heat dissipation of the capacitor, thereby enhancing the superiority of the temperature rise test of the thin film capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative labor:

[0036] Figure 1 Flow chart of the test method;

[0037] Figure 2 It is the structural schematic diagram of the test device;

[0038] Figure 3 It is a schematic diagram of the structure of the mounting seat and the protrusion;

[0039] Figure 4 It is a structural schematic diagram of the plug connector and the mounting seat;

[0040] Among them, 1. flow channel plate; 2. mounting seat; 3. core row; 4. outer shell; 5. protrusion; 6. plug-in connector; 7. connecting pipe. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] Example: Refer to Figure 1-Figure 4 , a capacitor temperature rise test device is provided, comprising:

[0044] The housing 4 has a cavity inside which a plurality of core rows 3 are arranged in sequence, and a flow channel interval is defined between two adjacent core rows 3;

[0045] There are a plurality of mounting seats 2, which are arranged one by one in the flow channel area, and the two ends of the mounting seats 2 respectively penetrate the opposite side walls of the housing 4;

[0046] The flow channel plate 1 is arranged in the mounting seat 2 and has a switchable combination or separation state relative to the mounting seat 2. When the flow channel plate 1 is combined with the mounting seat 2, the flow channel plate 1 is configured to have a coolant flowing therethrough. When the flow channel plate 1 is separated from the mounting seat 2, another flow channel plate 1 having a shape different from that of the flow channel plate 1 is combined with the mounting seat 2.

[0047] Reference Figure 2 , by passing a plurality of mounting seats 2 through the outer shell 4 and fixing them to the outer shell 4, and arranging the portion of the mounting seats 2 located in the outer shell 4 in the flow channel interval defined between two adjacent core rows 3, and by passing the flow channel plate 1 through the mounting seats 2, and realizing a detachable connection with the mounting seats 2 by combining or separating, it is convenient to replace the flow channel plates 1 with different shapes, thereby providing different heat dissipation effects on the test device and improving the diversity of the test results.

[0048] Furthermore, in order to improve the heat dissipation effect of the flow channel plate 1 on the capacitor, a mounting seat 2 is also provided between the core row 3 located at the end and the inner wall of the adjacent shell 4 to further improve the heat dissipation effect of the capacitor. After the core row 3, the mounting seat 2 and the flow channel plate 1 are installed in the shell 4, they are encapsulated and filled with epoxy resin.

[0049] Furthermore, a slot is provided in the mounting seat 2 along the length direction, a protrusion 5 is fixedly connected to the opposite side of the inner wall of the slot, and a groove is provided on the side wall of the flow channel plate 1. When the flow channel plate 1 is combined with the mounting seat 2, the protrusion 5 is engaged with the groove.

[0050] By opening a slot in the mounting seat 2 and fixing a protrusion 5 on the inner wall of the slot, the groove opened on the flow channel plate 1 is correspondingly engaged with the protrusion 5 to achieve a detachable connection between the flow channel plate 1 and the mounting seat 2. Correspondingly, the mounting seat 2 is preferably but not limited to being made of aluminum.

[0051] In addition, a capacitor temperature rise test system is provided, including:

[0052] Constant temperature box, temperature detection mechanism, coolant circulation mechanism, current output mechanism;

[0053] Comparison capacitor;

[0054] In the above capacitor temperature rise test device, the control capacitor and the capacitor temperature rise test device are arranged in a constant temperature box and are respectively connected to the temperature detection mechanism and the current output mechanism, and the coolant circulation mechanism is connected to the capacitor temperature rise test device.

[0055] Furthermore, it also includes:

[0056] The computer is connected to the temperature detection mechanism for comparing the obtained temperature rise data of the reference capacitor and the capacitor temperature rise test device.

[0057] Further, the coolant circulation mechanism comprises:

[0058] A water tank for storing coolant;

[0059] The peristaltic pump is configured such that two ends are respectively connected to the water tank and the flow channel plate 1, and one end of the flow channel plate 1 away from the peristaltic pump is connected to the water tank.

[0060] By placing the reference capacitor and the capacitor temperature rise test device in a constant temperature box respectively, a reference capacitor and a test capacitor are formed, and the current output mechanism is electrically connected to the reference capacitor and the test capacitor respectively to simulate the power-on temperature rise effect under actual working conditions.

[0061] In one embodiment of the present technical solution, the current output mechanism is a common TLC-DL03C capacitor high-frequency ripple test bench, and the temperature detection mechanism can be a plurality of thermocouples (not shown in the figure) arranged in the housing 4. By connecting one end of the thermocouple to an external multi-channel temperature recorder and connecting the multi-channel temperature recorder to a computer, the temperature rise data can be acquired, recorded and compared. The above data information transmission principle is a prior art and will not be described in detail.

[0062] In addition, by connecting pipes at both ends of the peristaltic pump and communicating with the flow channel plate 1 and the water tank respectively, the end of the flow channel plate 1 away from the peristaltic pump is the liquid outlet end and is connected to the water tank, so that the flow rate of the coolant can be accurately controlled for circulation and transportation, and reference is made to Figure 4 A protrusion 5 is fixedly connected to the inner groove of the mounting seat 2, and plug connectors 6 are fixedly connected to the two ends of the connecting pipe 7 used to connect the flow channel plate 1 with the peristaltic pump and the water tank respectively. The plug connectors 6 are used to achieve rapid disassembly and assembly with the mounting seat 2, thereby ensuring the efficiency of disassembly and replacement of the flow channel plate 1 during the test.

[0063] A method for capacitor temperature rise test, based on the capacitor temperature rise test system described above, comprises the following steps:

[0064] Use the capacitor temperature rise test device as the test capacitor;

[0065] Among them,

[0066] obtaining temperature rise data of at least one reference capacitor, and,

[0067] Acquire temperature rise data of at least one test capacitor, and the test capacitor has a changeable cooling channel shape by replacing the flow channel plate 1 structure to produce different heat dissipation effects;

[0068] Make the control capacitor and the test capacitor participate in the test at the same constant temperature;

[0069] During the test, ripple current is continuously provided to the control capacitor and the test capacitor;

[0070] The obtained temperature rise data of the control capacitor is determined as the standard value, and the obtained temperature rise data of the test capacitor formed under different cooling effects are determined as the comparison value;

[0071] The comparison value is compared with the standard value to obtain the heat dissipation effect of the flow channel plate 1 on the test capacitor.

[0072] The present invention performs a comparative temperature rise test, uses the temperature rise data of the reference capacitor obtained separately, and the temperature rise data of the test capacitor obtained to compare the data, and takes the temperature rise data of the reference capacitor as the standard value, and the temperature rise data of the test capacitor as the comparison value, and uses the test capacitor to form a changeable cooling channel shape through the flow channel plate 1, thereby producing different heat dissipation effects, so that the temperature rise data of the obtained test capacitor covers a variety of heat dissipation conditions, which not only increases the test data on the influence of the heat dissipation structure of the flow channel plate 1 on the heat dissipation effect of the capacitor, and realizes the diversification of the test data, but also through the arrangement of the reference capacitor, it can effectively guarantee the accuracy of the temperature rise data when comparing the test capacitor when there are parameter variables, thereby improving the accuracy of the test data test, and in addition, in exploring the influence of the flow channel plate 1 on the heat dissipation of the capacitor, it also provides a positive driving role, and enhances the superiority of the thin film capacitor temperature rise test.

[0073] In one embodiment of the present technical solution, when conducting a test, at least two reference capacitors may be provided, and one of them adopts a conventional capacitor structure without a flow channel plate 1, and the other reference capacitor adopts a flow channel plate 1 structure, but the flow channel plate 1 structure is kept unchanged during the test, so that the flow channel plate 1 provides a constant heat dissipation effect for the reference capacitor. When the temperature rise data is obtained and compared, the data of several test capacitors are compared with the two reference capacitors respectively, and the heat dissipation effect change data generated when the flow channel plate 1 is changed, as well as the heat dissipation effect change data generated by changing the flow channel plate 1 and not using the flow channel plate 1 can be directly obtained, thereby improving the test efficiency.

[0074] In one embodiment of the present technical solution, changing the shape of the cooling channel includes but is not limited to changing the etching structure of the flow channel plate 1, the shape of the flow channel plate, or by disassembling and replacing the flow channel plate 1.

[0075] Furthermore, when obtaining several temperature rise data of the test capacitor, after obtaining the temperature rise data of the previous test capacitor, the cooling channel shape of the test capacitor is changed by replacing the shape of the flow channel plate 1, and then the temperature rise data of the next test capacitor is obtained.

[0076] After obtaining the temperature rise data of a test capacitor, the flow plate in the test capacitor is disassembled and replaced, and a structure with different shapes or etched flow channels is directly used to improve the test efficiency. At the same time, the effect of the test on the heat dissipation influence of the flow channel plate 1 is effectively improved, and the test cost is saved, and the consumption caused by adding capacitors is reduced.

[0077] Furthermore, the coolant circulation mechanism is connected to the flow channel plate 1 so that the coolant flows through the flow channel plate 1 at a specific flow rate.

[0078] Furthermore, the control capacitor and the test capacitor are connected to each other through a current output mechanism, so that the two can simulate the temperature rise effect under actual use conditions.

[0079] Furthermore, when obtaining the temperature rise data of the reference capacitor and the test capacitor, the temperature detection mechanism and the computer are connected to the reference capacitor and the test capacitor respectively.

[0080] The coolant circulation mechanisms which are respectively arranged are connected to the flow channel plate 1, and the coolant is circulated and transported at a specific flow rate to realize the heat dissipation effect of the flow channel plate 1, and the current output mechanisms are respectively connected to the reference capacitor and the test capacitor to maintain the temperature rise effect generated in the use state during the test. Combined with the control of the reference capacitor and the test capacitor in the test environment temperature at the same constant temperature, the accuracy of the temperature detection mechanism in detecting the temperature rise data is improved, thereby improving the accuracy of the test.

[0081] Using computers to record and store data facilitates data comparison and improves test efficiency.

[0082] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0083] The embodiments described above are only descriptions of the preferred modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A capacitor temperature rise test system, characterized in that: include: Constant temperature box, temperature detection mechanism, coolant circulation mechanism, current output mechanism; Comparison capacitor; The reference capacitor and the capacitor temperature rise test device are arranged in the constant temperature box and are connected to the temperature detection mechanism and the current output mechanism respectively, and the coolant circulation mechanism is connected to the capacitor temperature rise test device; The capacitor temperature rise test device comprises: The outer shell (4) has a cavity inside which a plurality of core rows (3) are arranged in sequence, and a flow channel section is defined between two adjacent core rows (3); A plurality of mounting seats (2) are provided, and the plurality of mounting seats (2) are arranged in a one-to-one correspondence in the flow channel area, and two ends of the mounting seats (2) respectively penetrate the opposite side walls of the outer shell (4); A flow channel plate (1) is arranged in the mounting seat (2) and has a switchable combination or separation state relative to the mounting seat (2); when the flow channel plate (1) is combined with the mounting seat (2), the flow channel plate (1) is configured to have a coolant flowing therein; when the flow channel plate (1) is separated from the mounting seat (2), another flow channel plate (1) having a shape different from that of the flow channel plate (1) is combined with the mounting seat (2); The method applied to capacitor temperature rise test is based on the capacitor temperature rise test system and comprises the following steps: using the capacitor temperature rise test device as a test capacitor; Among them, obtaining temperature rise data of at least one reference capacitor, and, Acquiring temperature rise data of at least one test capacitor, wherein the test capacitor has a changeable cooling channel shape by replacing a flow channel plate structure to produce different heat dissipation effects; Make the control capacitor and the test capacitor participate in the test at the same constant temperature; During the test, ripple current is continuously provided to the control capacitor and the test capacitor; The obtained temperature rise data of the control capacitor is determined as the standard value, and the obtained temperature rise data of the test capacitor formed under different cooling effects are determined as the comparison value; Compare the comparison value with the standard value to obtain the heat dissipation effect of the flow channel plate on the test capacitor.

2. The capacitor temperature rise test system according to claim 1, characterized in that: A slot is provided in the mounting seat (2) along the length direction, a protrusion (5) is fixedly connected to the opposite side of the inner wall of the slot, and a groove is provided on the side wall of the flow channel plate (1). When the flow channel plate (1) is combined with the mounting seat (2), the protrusion (5) is engaged with the groove.

3. The capacitor temperature rise test system according to claim 1, characterized in that: Also includes: A computer is connected to the temperature detection mechanism for comparing the obtained temperature rise data of the reference capacitor and the temperature rise data of the capacitor temperature rise test device.

4. The capacitor temperature rise test system according to claim 1, characterized in that: The coolant circulation mechanism comprises: A water tank for storing coolant; The peristaltic pump is configured such that two ends are respectively connected to the water tank and the flow channel plate (1), and one end of the flow channel plate (1) away from the peristaltic pump is connected to the water tank.

5. The capacitor temperature rise test system according to claim 1, characterized in that: When obtaining several temperature rise data of the test capacitor, after obtaining the temperature rise data of the previous test capacitor, the cooling channel shape of the test capacitor is changed by replacing the flow channel plate, and then the temperature rise data of the next test capacitor is obtained.

6. The capacitor temperature rise test system according to claim 1, characterized in that: The coolant circulation mechanism is connected to the flow channel plate, so that the coolant flows through the flow channel plate at a specific flow rate.

7. The capacitor temperature rise test system according to claim 1, characterized in that: The control capacitor and the test capacitor are connected to each other through the current output mechanism, so that the two can simulate the temperature rise effect under actual use conditions.

8. The capacitor temperature rise test system according to claim 1, characterized in that: When obtaining the temperature rise data of the reference capacitor and the test capacitor, the temperature detection mechanism and the computer are connected to the reference capacitor and the test capacitor respectively.

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