Vortex liquid-assisted laser processing device, method and laser processing system

Abstract

The present invention discloses a vortex-type liquid-assisted laser processing device, method and laser processing system, including a shell, a bottom plate, a laser focusing mirror and a nozzle, wherein the shell is a cylindrical shell with an arc transition at the lower end, the bottom plate gradually increases in height radially from the center to the edge, the bottom plate is arranged in the shell, and the bottom plate divides the interior of the shell into a liquid chamber and a gas chamber distributed up and down, a through hole is arranged in the center of the bottom plate, a plurality of grooves are radially distributed radially from the center to the outer edge on the top surface of the bottom plate, a liquid inlet is arranged on the side wall of the liquid chamber, an air inlet is arranged on the side wall of the gas chamber, an opening is arranged on the bottom wall of the gas chamber, a laser focusing mirror is arranged above the liquid chamber, and the laser focusing mirror is coaxial with the through hole, and the nozzle is arranged on the bottom surface of the bottom plate and distributed around the edge of the through hole. The present invention can realize efficient coupling processing of ultra-high power pulsed laser at micro-nano scale, so that the pulsed laser has high power output, and improves processing efficiency and stability.

Description

Technical Field

[0001] The invention relates to the technical field of laser processing, and in particular to a vortex liquid-assisted laser processing device, method and laser processing system. Background Art

[0002] Liquid-assisted laser processing technology is a new type of micro-processing technology. However, due to the immaturity of the technology, conventional liquid-assisted laser processing faces the problems of low processing power, shallow processing depth, and unstable processing. Existing liquid-assisted laser equipment cannot generate a vortex liquid flow in the liquid inside. After the laser is coupled to the liquid flow, the processing power and processing stability cannot be improved, and the processing accuracy is low. Therefore, it is urgent to innovate the liquid-assisted laser processing technology, which can form a vortex liquid flow and couple it with the pulsed laser to improve the processing power and optimize the processing stability. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a vortex liquid-assisted laser processing device, method and laser processing system that can realize efficient coupling processing of ultra-high power pulsed laser at the micro-nano scale, enable the pulsed laser to output parallel high power, and improve processing efficiency and stability.

[0004] The present invention is realized by the following technical scheme: a vortex liquid-assisted laser processing device, comprising:

[0005] A shell, the shell being a cylindrical shell with an arc-shaped transition at the lower end;

[0006] A bottom plate, the bottom plate gradually increases in height radially from the center to the edge, the bottom plate is arranged in the shell, and the bottom plate divides the interior of the shell into a liquid chamber and a gas chamber distributed up and down, a through hole is arranged in the center of the bottom plate, a plurality of grooves are radially distributed radially from the center to the outer edge on the top surface of the bottom plate, a liquid inlet is arranged on the side wall of the liquid chamber, a gas inlet is arranged on the side wall of the gas chamber, and an opening is arranged on the bottom wall of the gas chamber;

[0007] A laser focusing mirror, wherein the laser focusing mirror is arranged above the liquid chamber and is coaxial with the through hole;

[0008] Nozzles, the nozzles are arranged on the bottom surface of the bottom plate and distributed around the edges of the through holes;

[0009] The length of the outer arc length of each groove is the same, and the length of the inner arc length of each groove gradually increases or decreases in the clockwise direction. The outer arc length of the groove is d4, and its length range is 2um-5um. The inner arc length of the groove is d5, and its length range is 0.5um-8um. The angle between adjacent grooves ranges from 15° to 30°. The diameter of the through hole is d3, and its range is 50um-150um. The height of the through hole is h3, and its range is 0.5um-2um.

[0010] Furthermore, the width of the liquid chamber is d1, which ranges from 3 mm to 10 mm, and the height of the liquid chamber is h1, which ranges from 0.1 mm to 1 mm.

[0011] Furthermore, the width of the gas chamber is d2, which ranges from 3 mm to 5 mm, and the height of the gas chamber is h2, which ranges from 0.1 mm to 0.5 mm.

[0012] Furthermore, the base plate and the nozzle are made of any one of copper alloy, aluminum alloy, diamond and sapphire.

[0013] Furthermore, the liquid chamber is filled with distilled water or deionized water, and the gas chamber is filled with any one of nitrogen, argon, helium, air and oxygen.

[0014] A vortex liquid-assisted laser processing system includes a control unit, a laser source, a liquid supply device, a gas supply device, a power supply, and the vortex liquid-assisted laser processing device described above, wherein the control unit is respectively connected to the laser source, the liquid supply device, the gas supply device, and the power supply, and the power supply is used to supply power to the control unit, the laser source, the liquid supply device, and the gas supply device, the liquid supply device is connected to the liquid inlet, and the gas supply device is connected to the gas inlet.

[0015] Furthermore, the laser source includes a water cooler and a laser connected to each other, the laser generates a pulsed laser with the assistance of the water cooler, the liquid supply device includes an energy storage booster, a pressure gauge, a damper, and a filter purifier connected in sequence through pipelines, the energy storage booster is used to connect to the liquid source, the filter purifier is used to connect to the liquid inlet, and the gas supply device includes a gas storage tank, a throttle valve, a flow meter, and a booster connected in sequence through a gas path, and the booster is connected to the gas inlet.

[0016] The laser processing method using a vortex liquid-assisted laser processing system comprises the following steps:

[0017] S1. The control unit controls the energy storage booster to input the liquid into the liquid chamber through the filter purifier and the liquid inlet, and fills the liquid chamber. The liquid flows through a plurality of radially distributed grooves on the bottom plate to generate a vortex liquid flow;

[0018] S2. The control unit controls the supercharger to input the gas in the gas tank into the gas chamber through the gas inlet, and after the gas chamber is filled, the laser emits a pulsed laser, which is converged by a laser focusing mirror, and after the pulsed laser is fully coupled with the vortex liquid flow, it is emitted from the nozzle;

[0019] S3. The pulse laser coupled with the vortex liquid flow acts on the workpiece under the protection of the gas atmosphere for processing.

[0020] Furthermore, the method for processing the plurality of radially distributed grooves on the bottom plate in step S1 is:

[0021] S11. The bottom plate is suspended in the air using a fixture, and a pulsed laser is continuously used to impact the bottom plate to obtain a through hole that can pass the liquid flow and the laser;

[0022] S12. Using a pulsed laser to directly ablate the substrate to quantitatively remove a specific depth, thereby obtaining a groove with a certain inclination angle, and the width of the groove gradually increases or decreases from the edge of the substrate to the center of the substrate;

[0023] S13. Repeat step S12, control the outer arc length of each groove to be the same, the inner arc length of each groove to gradually increase in the clockwise direction or gradually decrease in the clockwise direction, and make the angle between two adjacent grooves the same, use pulsed laser to process the annular array grooves to obtain radially distributed grooves.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] A plurality of grooves with the same outer arc length and an inner arc length gradually increasing or decreasing in a clockwise direction are ablated on a bottom plate by direct pulse laser writing. According to Bernoulli's principle, when liquid enters the liquid chamber, the liquid flow between each two adjacent grooves has a flow velocity difference through the grooves on the bottom plate, forming liquid flows with different flow velocities, thereby realizing the regulation of the liquid flow velocity and flow direction. When the liquid in each groove flows into the nozzle through the through hole, the aggregated liquid flow can generate a vortex-like oscillating water jet under the influence of the flow velocity difference. The pulse laser is coupled with the vortex-oscillating water jet, and in the atmosphere of the gas in the gas chamber, the workpiece is processed by spraying it through the nozzle through the opening to the surface of the workpiece. The initial flow velocity is regulated to realize the "galvanometer" processing effect of the liquid-assisted laser, with high processing accuracy, small recast layer thickness, small heat-affected zone, greatly increased effective processing distance and range, straight cutting seam and smooth edge, effectively improving processing power, increasing processing depth and improving processing stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the laser processing device of the present invention;

[0027] Figure 2 It is a structural schematic diagram of the bottom plate of the present invention;

[0028] Figure 3 It is a structural schematic diagram of the laser processing system of the present invention;

[0029] Figure 4 It is a structural schematic diagram of the grooves on the processing bottom plate of the present invention;

[0030] Figure 5 A flowchart of a laser processing method using the laser processing system of the present invention;

[0031] Figure 6 The present invention is a flowchart of the process of processing the grooves on the bottom plate.

[0032] Description of reference numerals: 1-shell, 2-bottom plate, 3-liquid chamber, 4-gas chamber, 5-through hole, 6-groove, 7-liquid inlet, 8-gas inlet, 9-opening, 10-laser focusing lens, 11-nozzle, d1-width of liquid chamber, h1-width of liquid chamber, d2-width of gas chamber, h2-height of gas chamber, d3-diameter of through hole, h3-height of through hole, d4-outer arc length of groove, d5-inner arc length of groove, 12- Control unit, 13-laser source, 14-liquid supply device, 15-gas supply device, 16-power supply, 17-water cooler, 18-laser, 19-pulse laser, 20-energy storage booster, 21-pressure gauge, 22-damper, 23-filter purifier, 24-liquid source, 25-gas tank, 26-throttle valve, 27-flow meter, 28-booster, 29-reflector, 30-galvanometer, 31-fixture, 32-platform, 33-workpiece. DETAILED DESCRIPTION

[0033] Reference Figure 1 and Figure 2 , Figure 1 and Figure 2 The present invention is provided with a vortex liquid-assisted laser processing device embodiment schematic diagram, the present invention is further described below in conjunction with the embodiment: Embodiment 1

[0034] The vortex liquid-assisted laser processing device comprises: a shell 1, which is a cylindrical shell with an arc-shaped transition at the lower end.

[0035] The bottom plate 2 is provided with a bottom plate 2, which gradually increases in height radially from the center to the edge. The bottom plate 2 is arranged in the shell 1, and the bottom plate 2 divides the interior of the shell 1 into a liquid chamber 3 and a gas chamber 4 distributed up and down. A through hole 5 is provided in the center of the bottom plate 2, and a plurality of grooves 6 are radially distributed radially from the center to the outer edge on the top surface of the bottom plate 2. A liquid inlet 7 is provided on the side wall of the liquid chamber 3, an air inlet 8 is provided on the side wall of the gas chamber 4, and an opening 9 is provided on the bottom wall of the gas chamber 4.

[0036] The height is highest at the edge of the bottom plate 2 and lowest at the center of the bottom plate 2. The height difference from the edge to the center of the bottom plate 2 ranges from 0.5 mm to 1 mm.

[0037] The laser focusing mirror 10 is arranged above the liquid chamber 3 , and the laser focusing mirror 10 is coaxial with the through hole 5 .

[0038] The laser focusing lens 10 may be of a plano-concave type, a bi-convex type, a plano-convex type, a bi-concave type or a meniscus type.

[0039] The nozzles 11 are arranged on the bottom surface of the bottom plate 2 and are distributed around the edge of the through hole 5 .

[0040] The length of the outer arc of each groove 6 is the same, and the length of the inner arc of each groove 6 gradually increases or gradually decreases in the clockwise direction.

[0041] The outer arc length of the groove 6 is d4, and its length range is 2um-5um. The inner arc length of the groove 6 is d5, and its length range is 0.5um-8um.

[0042] The angle between adjacent grooves 6 ranges from 15° to 30°.

[0043] The diameter of the through hole 5 is d3, which ranges from 50um to 150um, and the height of the through hole 5 is h3, which ranges from 0.5mm to 2mm.

[0044] In this embodiment, the outer arc length d4 of the groove 6 is 3 um, and the inner arc length of the groove 6 is 0.5 um. <d5<6um。

[0045] The angle between two adjacent grooves 6 is 20°.

[0046] The diameter d3 of the through hole 5 is 100 um, and the height h3 of the through hole 5 is 0.5 mm.

[0047] The width of the liquid chamber 3 is d1, which is in the range of 3 mm-10 mm, and the height of the liquid chamber 3 is h1, which is in the range of 0.1 mm-1 mm.

[0048] In this embodiment, the width d1 of the liquid chamber 3 is 5 mm, and the height h1 of the liquid chamber 3 is 0.5 mm.

[0049] The width of the gas chamber 4 is d2, which is in the range of 3 mm-5 mm, and the height of the gas chamber 4 is h2, which is in the range of 0.1 mm-0.5 mm.

[0050] In this embodiment, the width d2 of the gas chamber 4 is 5 mm, and the height h2 of the gas chamber 4 is 0.3 mm.

[0051] The base plate 2 and the nozzle 11 are made of any one of copper alloy, aluminum alloy, diamond and sapphire.

[0052] The bottom plate 2 has a size of 10×10×0.5mm 3 A thin cylinder made of copper alloy.

[0053] The front cross section of the nozzle 11 is in the shape of a right triangle.

[0054] The liquid chamber 3 is filled with distilled water or deionized water, and the gas chamber 4 is filled with any one of nitrogen, argon, helium, air and oxygen.

[0055] By arranging the bottom plate 2 to gradually increase radially from the center to the edge, a plurality of grooves 6 are ablated on the top surface of the bottom plate 2 by pulse laser direct writing, and the outer arc length of each groove 6 is the same, and the inner arc length gradually increases in the clockwise direction or gradually decreases in the clockwise direction, so that the widths of two adjacent grooves 6 are different, and there is an angle between two adjacent grooves 6. The liquid chamber 3 is filled with liquid, and the liquid can generate different liquid flow rates when passing through the radially distributed grooves 6. After the liquid flow enters the nozzle 11, a vortex liquid flow is generated due to the flow rate difference, and coupled with the pulse laser 19, the swinging processing of the water jet is realized by regulating the liquid flow rate, thereby improving the processing accuracy, processing efficiency and processing stability, and can be applied to the processing of superhard brittle materials and other fields.

[0056] Reference Figure 3 , Figure 3 The present invention is provided with a vortex liquid assisted laser processing system embodiment structure schematic diagram, the present invention is further described below in conjunction with the embodiment: Embodiment 2

[0057] The vortex liquid-assisted laser processing system includes a control unit 12, a laser source 13, a liquid supply device 14, a gas supply device 15, a power supply 16, and the vortex liquid-assisted laser processing device described above. The control unit 12 is respectively connected to the laser source 13, the liquid supply device 14, the gas supply device 15, and the power supply 16. The power supply 16 is used to supply power to the control unit 12, the laser source 13, the liquid supply device 14, and the gas supply device 15. The liquid supply device 14 is connected to the liquid inlet 7, and the gas supply device 15 is connected to the gas inlet 8.

[0058] The laser source 13 includes a water cooler 17 and a laser 18 which are connected to each other. The laser 18 generates a pulsed laser 19 with the assistance of the water cooler 17. The liquid supply device 14 includes an energy storage booster 20, a pressure gauge 21, a damper 22, and a filter purifier 23 which are sequentially connected through pipelines. The energy storage booster 20 is used to connect to the liquid source 24, and the filter purifier 23 is used to connect to the liquid inlet 7. The gas supply device 15 includes a gas storage tank 25, a throttle valve 26, a flow meter 27, and a booster 28 which are sequentially connected through an air path. The booster 28 is connected to the air inlet 8.

[0059] When filling the liquid chamber 3 with liquid, the liquid is sent to the filter purifier 23 under the action of the energy storage booster 20, and the liquid flows into the liquid chamber 3 from the liquid inlet 7 through the filter purifier 23. In the process of filling the liquid chamber 3 with liquid, the liquid flow rate and liquid amount are controlled by the damper 22 and the pressure gauge 21. When filling the gas chamber 4 with gas, the gas in the gas storage tank 25 is filled into the gas chamber 4 through the gas inlet 8 under the action of the booster 28. In the process of charging, the gas flow and gas amount input into the gas chamber 4 are controlled by the throttle valve 26 and the flowmeter 27.

[0060] Reference Figures 4 to 6 , Figures 4 to 6 The following is a schematic diagram of the workflow of the laser processing method using the vortex liquid-assisted laser processing system of the present invention. The present invention is further described below in conjunction with the embodiments: Embodiment 3

[0061] The laser processing method using the vortex liquid-assisted laser processing system described above includes the following steps:

[0062] S1. The control unit controls the energy storage booster to input the liquid into the liquid chamber through the filter purifier and the liquid inlet, and fills the liquid chamber. The liquid flows through a plurality of radially distributed grooves on the bottom plate to generate a vortex liquid flow;

[0063] S2. The control unit controls the supercharger to input the gas in the gas tank into the gas chamber through the gas inlet, and after the gas chamber is filled, the laser emits a pulsed laser, which is converged by a laser focusing mirror, and after the pulsed laser is fully coupled with the vortex liquid flow, it is emitted from the nozzle;

[0064] S3. The pulse laser coupled with the vortex liquid flow acts on the workpiece under the protection of the gas atmosphere for processing.

[0065] Specifically, the method for processing the plurality of radially distributed grooves on the bottom plate in step S1 is as follows:

[0066] S11. The bottom plate is suspended in the air using a fixture, and a pulsed laser is continuously used to impact the bottom plate to obtain a through hole that can pass the liquid flow and the laser;

[0067] S12. Using a pulsed laser to directly ablate the substrate to quantitatively remove a specific depth, thereby obtaining a groove with a certain inclination angle, and the width of the groove gradually increases or decreases from the edge of the substrate to the center of the substrate;

[0068] S13. Repeat step S12, control the outer arc length of each groove to be the same, the inner arc length of each groove to gradually increase in the clockwise direction or gradually decrease in the clockwise direction, and make the angle between two adjacent grooves the same, use pulsed laser to process the annular array grooves to obtain radially distributed grooves.

[0069] Specifically, the pulse half-width of the pulse laser in step S12 does not exceed 200ns, the power of the pulse laser does not exceed 100W, the frequency is not less than 1kHz, the spot diameter of the pulse laser ranges from 1um to 100um, and the energy distribution of the pulse laser can be Gaussian distribution or flat-top distribution. In this embodiment, the half-width of the pulse laser is 200ns, the power of the pulse laser is 50W, the frequency is 500kHz, and the focused spot diameter is 20um.

[0070] Comparative Example 1: This example is prepared by referring to the preparation method of the embodiment. The difference between this example and the embodiment is that the pulse laser does not process the inner and outer arc length difference of the groove, and other processing parameters remain unchanged. The groove structure with the same outer arc length and inner arc length produces the same liquid flow rate, so that the difference in liquid flow rate entering the nozzle is almost zero, and a vortex liquid flow cannot be generated, and the liquid flow cannot swing. After coupling the liquid flow, the "galvanometer" processing effect of the liquid-assisted laser cannot be achieved, which reduces the processing efficiency and stability, and the processing effect is not as good as the embodiment.

[0071] Comparative Example 2: This example is prepared by referring to the preparation method of the embodiment. The difference between this example and the embodiment is that no liquid is passed through the liquid chamber, that is, the pulse laser directly processes the workpiece without coupling with the liquid flow, and other processing parameters remain unchanged. This pulse laser processing method that is not coupled with the liquid flow will cause thermal damage to the workpiece due to the lack of cooling and flushing effects of the water jet, and cause the molten material after laser ablation to adhere to the processing surface, reducing the uniformity and stability of the cutting edge, and the processing effect is not as good as the embodiment.

[0072] The above detailed description is a specific description of a feasible embodiment of the present invention. The embodiment is not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not deviate from the present invention should be included in the patent scope of this case.

Claims

1. A vortex liquid-assisted laser processing device, characterized in that: include: A shell, the shell being a cylindrical shell with an arc-shaped transition at the lower end; A bottom plate, the bottom plate gradually increases in height radially from the center to the edge, the bottom plate is arranged in the shell, and the bottom plate divides the interior of the shell into a liquid chamber and a gas chamber distributed up and down, a through hole is arranged in the center of the bottom plate, a plurality of grooves are radially distributed radially from the center to the outer edge on the top surface of the bottom plate, a liquid inlet is arranged on the side wall of the liquid chamber, a gas inlet is arranged on the side wall of the gas chamber, and an opening is arranged on the bottom wall of the gas chamber; A laser focusing mirror, wherein the laser focusing mirror is arranged above the liquid chamber and is coaxial with the through hole; Nozzles, the nozzles are arranged on the bottom surface of the bottom plate and distributed around the edges of the through holes; The length of the outer arc length of each groove is the same, and the length of the inner arc length of each groove gradually increases or decreases in the clockwise direction. The outer arc length of the groove is d4, and its length range is 2um-5um. The inner arc length of the groove is d5, and its length range is 0.5um-8um. The angle between adjacent grooves ranges from 15° to 30°. The diameter of the through hole is d3, and its range is 50um-150um. The height of the through hole is h3, and its range is 0.5um-2um.

2. The vortex liquid-assisted laser processing device according to claim 1, characterized in that: The width of the liquid chamber is d1, which ranges from 3 mm to 10 mm, and the height of the liquid chamber is h1, which ranges from 0.1 mm to 1 mm.

3. The vortex liquid-assisted laser processing device according to claim 2, characterized in that: The width of the gas chamber is d2, which ranges from 3 mm to 5 mm, and the height of the gas chamber is h2, which ranges from 0.1 mm to 0.5 mm.

4. The vortex liquid-assisted laser processing device according to claim 3, characterized in that: The base plate and the nozzle are made of any one of copper alloy, aluminum alloy, diamond and sapphire.

5. The vortex liquid-assisted laser processing device according to claim 4, characterized in that: The liquid chamber is filled with distilled water or deionized water, and the gas chamber is filled with any one of nitrogen, argon, helium, air and oxygen.

6. Vortex liquid-assisted laser processing system, characterized in that: It includes a control unit, a laser source, a liquid supply device, a gas supply device, a power supply, and a vortex liquid-assisted laser processing device as described in any one of claims 1 to 5, wherein the control unit is connected to the laser source, the liquid supply device, the gas supply device, and the power supply, respectively, and the power supply is used to supply power to the control unit, the laser source, the liquid supply device, and the gas supply device, the liquid supply device is connected to the liquid inlet, and the gas supply device is connected to the air inlet.

7. The vortex liquid-assisted laser processing system according to claim 6, characterized in that: The laser source includes a water cooler and a laser connected to each other. The laser generates a pulsed laser with the assistance of the water cooler. The liquid supply device includes an energy storage booster, a pressure gauge, a damper, and a filter purifier connected in sequence through pipelines. The energy storage booster is used to connect to the liquid source, and the filter purifier is used to connect to the liquid inlet. The gas supply device includes a gas storage tank, a throttle valve, a flow meter, and a booster connected in sequence through a gas path, and the booster is connected to the gas inlet.

8. A laser processing method using the vortex liquid-assisted laser processing system according to claim 7 comprises the following steps: S1. The control unit controls the energy storage booster to input the liquid into the liquid chamber through the filter purifier and the liquid inlet, and fills the liquid chamber. The liquid flows through a plurality of radially distributed grooves on the bottom plate to generate a vortex liquid flow; S2. The control unit controls the supercharger to input the gas in the gas tank into the gas chamber through the gas inlet, and after the gas chamber is filled, the laser emits a pulsed laser, which is converged by a laser focusing mirror, and after the pulsed laser is fully coupled with the vortex liquid flow, it is emitted from the nozzle; S3. The pulse laser coupled with the vortex liquid flow acts on the workpiece under the protection of the gas atmosphere for processing.

9. According to the laser processing method of the vortex liquid-assisted laser processing system of claim 8, the processing method of the plurality of radially distributed grooves on the bottom plate in step S1 is: S11. The bottom plate is suspended in the air using a fixture, and a pulsed laser is continuously used to impact the bottom plate to obtain a through hole that can pass the liquid flow and the laser; S12. Using a pulsed laser to directly ablate the substrate to quantitatively remove a specific depth, thereby obtaining a groove with a certain inclination angle, and the width of the groove gradually increases or decreases from the edge of the substrate to the center of the substrate; S13. Repeat step S12, control the outer arc length of each groove to be the same, the inner arc length of each groove to gradually increase in the clockwise direction or gradually decrease in the clockwise direction, and make the angle between two adjacent grooves the same, use pulsed laser to process the annular array grooves to obtain radially distributed grooves.

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