A circuit board fault rapid detection method, system and storage medium

Abstract

The invention discloses a method, system and storage medium for rapid fault detection of a circuit board, and relates to the technical field of circuit boards. A visual detection module captures a circuit board image through an infrared camera, divides a detection area by using image processing technology, identifies the degree of drilling and determines whether the through hole is deviated, so as to further analyze the influence of the through hole deviation on the performance of the circuit board. An information acquisition module detects and records the inner wall of the hole, obtains relevant residual material information, and monitors the performance change information and thermal distribution state information of the circuit board at the same time, so as to provide comprehensive data support for subsequent comprehensive fault analysis. A comprehensive fault analysis module extracts features from a data detection set, and calculates a fault evaluation index Gpzs through a trained fault detection model, so as to realize comprehensive evaluation and analysis of circuit board faults. By comparing and analyzing the fault evaluation index Gpzs with a fault threshold W, a fault scoring report is obtained, and corresponding sorting operations are taken.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a method, system and storage medium for rapid fault detection of circuit boards. Background Art

[0002] With the continuous development and expansion of the application scope of electronic equipment, the requirements for the reliability and stability of circuit boards are becoming higher and higher. As one of the core components of electronic equipment, the stability and reliability of circuit boards have an important impact on the performance and working efficiency of the entire equipment. Among them, the residual hole ink in multi-layer circuit boards refers to the hole ink or residual substances that may be left in the process of drilling holes in the circuit board. These residual substances may affect the electrical conductivity, thermal conductivity and overall stability of the circuit board.

[0003] However, the current multi-layer circuit board fault detection system still has some shortcomings in solving these problems. First, in terms of residual hole ink detection, the existing system may not be accurate enough in identifying and analyzing the impact of residual substances, resulting in many missed detections or misjudgments, affecting the stability and rate of signal transmission in the circuit board in the later stage, and even affecting the on-off performance of the circuit board; secondly, when the position of the through hole deviates from the safe area, it may cause changes in the electrical performance of the circuit board, which also requires detailed analysis, resulting in an incomplete and inaccurate evaluation of circuit board performance issues. Such missed detections or misjudgments in traditional systems may not be able to effectively predict the actual detection status of the circuit board. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a method, system and storage medium for rapid fault detection of a circuit board, which solve the problems in the above-mentioned background technology.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a circuit board fault rapid detection system, including a visual detection module, a coordinate establishment module, an information collection module, a comprehensive fault analysis module and a detection evaluation module;

[0008] The coordinate establishment module is used to pre-establish a three-dimensional coordinate system and determine the origin O i Position, and align the lower right corner of the circuit board to be tested with the origin O i Perform overlap and lock the specific position of the circuit board to be tested;

[0009] The visual inspection module is used to capture the image of the circuit board to be inspected through an infrared camera device, and use image processing technology to divide the image of the circuit board to be inspected into several groups of inspection areas, identify the degree of drilling, and if the through hole is completely drilled through and formed, determine whether there is a deviation in the through hole;

[0010] The information acquisition module is used to detect and record the inner wall of the hole of the circuit board to be detected, obtain relevant residual material information, and use several groups of detection areas to detect and obtain relevant thermal distribution state information, while monitoring the performance change information of the circuit board to be detected, and establishing a data detection set;

[0011] The fault comprehensive analysis module is used to extract features of relevant information in the data detection set, and obtain the conductivity Ddlz, thermal resistance Rzcz, and maximum temperature Wd max , minimum temperature Wd min , signal transmission delay time Xcsc and power consumption value-added Nhzz, and use the trained fault detection model to obtain the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs respectively, and obtain the fault evaluation index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs and performing dimensionless processing;

[0012] The detection and evaluation module is used to extract the historical data detection set in the historical time axis, calculate the average through a statistical algorithm, obtain the fault threshold W, and obtain a fault scoring report by comparing and analyzing the fault evaluation index Gpzs with the fault threshold W, and take corresponding sorting operations.

[0013] Preferably, the visual detection module includes a region segmentation unit and a visual observation unit;

[0014] The region segmentation unit is used to divide the image of the circuit board to be inspected into several groups of inspection regions in a mesh form, and mark them as the first inspection region Jq1, the second inspection region Jq2, the third inspection region Jq3, ..., the nth inspection region Jq n , and according to the established three-dimensional coordinate system, determine the corresponding coordinates of several groups of detection areas;

[0015] The visual observation unit is used to use an infrared camera to identify the drilling position and observe the drilling degree. If the drilling position is in an incompletely drilled state, an orange pause detection instruction is sent out; if the drilling position is in a completely drilled state and a through hole is formed, the deviation of the through hole is further determined through a three-dimensional coordinate system;

[0016] When there is a deviation, the circuit board to be tested will continue to be tested;

[0017] When there is no deviation, there is no need to consider the change in the electrical performance of the circuit board to be tested due to the deviation of the through hole;

[0018] Among them, when the orange pause detection command is sent, the current circuit board is intercepted and returns to the previous drilling manufacturing link.

[0019] Preferably, the data detection set includes relevant residual material information, relevant thermal distribution state information and performance change information;

[0020] The information acquisition module includes a first acquisition unit, a second acquisition unit and a third acquisition unit;

[0021] The first acquisition unit is used to detect and record relevant residual material information passing through the inner wall of the hole, and the relevant residual material information includes the coordinates, residual amount Clzs, conductivity Ddlz, thermal resistance value Rzcz and hole ink viscosity of the hole ink residue on the circuit board;

[0022] The second acquisition unit is used to detect and record in real time the performance change information of the circuit board to be detected, wherein the performance change information includes the rising edge, falling edge, noise value Zyzs, power consumption value Nhzz and impedance value Zkz of the signal transmitted on the circuit board;

[0023] The third acquisition unit is used to perform temperature detection on several groups of detection areas to obtain relevant thermal distribution information, and the relevant thermal distribution information includes the maximum temperature Wd within several groups of detection areas. max , minimum temperature Wd min and heat generating components on the circuit board.

[0024] Preferably, the comprehensive fault analysis module includes a hole wall residue analysis unit, a performance change analysis unit, a heat distribution analysis unit and a comprehensive analysis unit;

[0025] The hole wall residual analysis unit is used to obtain the residual hole ink influence coefficient Cmxs by associating the conductivity Ddlz with the thermal resistance value Rzcz according to the relevant residual material information and performing dimensionless processing. The residual hole ink influence coefficient Cmxs is obtained by the following formula:

[0026] ;

[0027] In the formula, Clzs represents the residual amount, a1, a2 and a3 represent the preset proportional coefficients of the thermal resistance value Rzcz, the electrical conductivity Ddlz and the residual amount Clzs respectively, and C represents the first correction constant.

[0028] Preferably, the performance change analysis unit is used to obtain the performance state coefficient Xtxs after dimensionless processing according to the deviation of the through hole and in combination with the performance change information. The performance state coefficient Xtxs is obtained by the following formula:

[0029] ;

[0030] In the formula, Xcsc represents the signal transmission delay time, Zkz represents the impedance value, Nhzz represents the power consumption increase, Zyzs represents the noise increase, and x, z, h and y represent the preset proportional coefficients of the signal transmission delay time Xcsc, the impedance value Zkz, the power consumption increase Nhzz and the noise increase Zyzs respectively.

[0031] Preferably, the heat distribution analysis unit is used to obtain the temperature state in a plurality of groups of detection areas according to a plurality of groups of detection areas, and obtain the temperature difference value Wcbz, wherein the temperature difference value Wcbz is obtained by the following formula:

[0032] ;

[0033] Where Wd max Expressed as the maximum temperature, Wd min Expressed as minimum temperature.

[0034] Preferably, the comprehensive analysis unit is used to combine the hole wall residue analysis unit, the performance change analysis unit and the thermal distribution analysis unit, and obtain the fault assessment index Gpzs by correlating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs, and after dimensionless processing, the fault assessment index Gpzs is obtained by the following formula:

[0035] ;

[0036] In the formula, and Both represent preset proportional coefficients, and V represents the second correction constant.

[0037] Preferably, the detection and evaluation module includes a comparison unit and an execution unit;

[0038] The comparison unit is used to compare and analyze the fault assessment index Gpzs with the fault threshold W to obtain a fault score report, wherein the specific content of the fault score report is as follows:

[0039] If the fault assessment index Gpzs ≥ the fault threshold W, it indicates that the current circuit board detection link is in an abnormal state, and a red pause detection instruction is sent;

[0040] If the fault assessment index Gpzs is less than the fault threshold W, it means that the current detection link of the circuit board is not in an abnormal state, and the next detection link will be automatically entered at this time without sending additional detection instructions;

[0041] The execution unit is used to take corresponding sorting operations according to the fault scoring report. If a red pause detection instruction is sent, the current circuit board will be automatically sorted to the unqualified placement area. If no additional detection instruction is sent, there is no need to intercept the circuit board and it will continue to be transported to the next detection link through the conveyor belt.

[0042] A method for quickly detecting a circuit board fault comprises the following steps:

[0043] Step 1: First, set up a three-dimensional coordinate system and determine the origin O i Position, and align the lower right corner of the circuit board to be tested with the origin O i To overlap;

[0044] Step 2: Then, the image of the circuit board to be inspected is captured by an infrared camera device, and the image processing technology is used to divide the image of the circuit board to be inspected into several groups of inspection areas, and the degree of drilling is identified. If the through hole is completely drilled through and formed, it is determined whether there is any deviation in the through hole;

[0045] Step 3: Next, the inner wall of the hole of the circuit board to be tested is tested and recorded to obtain relevant residual material information, and several groups of test areas are used to test and obtain relevant thermal distribution state information, while monitoring the performance change information of the circuit board to be tested to establish a data test set;

[0046] Step 4: Then extract the relevant information in the data detection set to obtain the conductivity Ddlz, thermal resistance Rzcz, and maximum temperature Wd max , minimum temperature Wd min , signal transmission delay time Xcsc and power consumption value-added Nhzz, and use the trained fault detection model to obtain the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs respectively, and obtain the fault evaluation index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs and performing dimensionless processing;

[0047] Step 5: Finally, by comparing and analyzing the fault assessment index Gpzs with the fault threshold W, a fault score report is obtained and corresponding sorting operations are taken.

[0048] A circuit board fault rapid detection storage medium stores a computer program, the computer program stores computer instructions, and a circuit board fault rapid detection method is implemented when the instructions are executed by a processor.

[0049] (III) Beneficial effects

[0050] The present invention provides a method, system and storage medium for rapid fault detection of a circuit board, which have the following beneficial effects:

[0051] (1) The visual inspection module captures the image of the circuit board through an infrared camera and uses image processing technology to divide the inspection area, identify the degree of drilling and determine whether the through hole is deviated, so as to further analyze the impact of the through hole deviation on the performance of the circuit board, and effectively reduce the possibility of missed detection or misjudgment. The information acquisition module detects and records the inner wall of the hole to obtain relevant residual material information, and monitors the performance change information and thermal distribution status information of the circuit board to establish a data detection set to provide comprehensive data support for subsequent comprehensive fault analysis; the comprehensive fault analysis module extracts features from the data detection set to obtain multi-dimensional parameters, and calculates the fault evaluation index Gpzs through the trained fault detection model to achieve comprehensive evaluation and analysis of the circuit board fault. The detection and evaluation module compares and analyzes the fault evaluation index Gpzs with the fault threshold W to obtain a fault scoring report, and takes corresponding sorting operations to further realize intelligent diagnosis and processing of circuit board faults, improve the accuracy and efficiency of fault detection, and reduce the risk of missed detection or misjudgment, thereby ensuring the reliability and stability of the circuit board.

[0052] (2) The system first analyzes the drilling degree of the through hole to see whether it is drilled through. If not, it issues a command to arrange for the hole to be re-drilled to conduct a preliminary inspection of the circuit board. The position of the through hole is then monitored to see if it deviates, that is, exceeds the safe area. At this time, the circuit board will be subjected to a second inspection. If the through hole deviates, the problems caused by it, such as changes in circuit board performance, poor connection of circuit board components, and signal distortion, will be further analyzed.

[0053] (3) Based on the precise analysis of the residual materials on the inner hole wall of the circuit board, the relevant residual material information in various aspects is recorded to achieve accurate detection of residual hole ink. While effectively reducing missed detection or misjudgment, a comprehensive analysis of the impact of problems such as poor signal transmission, heat accumulation, and deterioration of conductive performance caused by residual hole ink on the inner wall is conducted, which helps to improve the reliability and stability of the circuit board and reduce production losses and maintenance costs caused by failures. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic diagram of a circuit board fault rapid detection system flow chart of the present invention;

[0055] Figure 2 The present invention is a schematic diagram of the steps of a method for rapid fault detection of a circuit board. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] Example 1

[0058] See also Figure 1 , the present invention provides a circuit board fault rapid detection system, including a visual detection module, a coordinate establishment module, an information acquisition module, a comprehensive fault analysis module and a detection evaluation module;

[0059] The coordinate establishment module is used to pre-establish a three-dimensional coordinate system and determine the origin O i Position, and align the lower right corner of the circuit board to be tested with the origin O i Perform overlap and lock the specific position of the circuit board to be tested;

[0060] The visual inspection module is used to capture the image of the circuit board to be inspected through an infrared camera device, and use image processing technology to divide the image of the circuit board to be inspected into several groups of inspection areas, identify the degree of drilling, and if the through hole is completely drilled through and formed, determine whether there is a deviation in the through hole;

[0061] Image processing technology refers to the process of processing, analyzing and changing images using computer technology, which covers a variety of technologies and methods, including image acquisition, image preprocessing, image segmentation, feature extraction and image recognition, etc. Dividing the image of the circuit board to be inspected into several groups of inspection areas is usually achieved through image segmentation technology. The image segmentation method can use a clustering algorithm to divide the pixels in the image into several clusters, each cluster representing a detection area.

[0062] The information acquisition module is used to detect and record the inner wall of the hole of the circuit board to be detected, obtain relevant residual material information, and use several groups of detection areas to detect and obtain relevant thermal distribution state information, while monitoring the performance change information of the circuit board to be detected, and establishing a data detection set;

[0063] The fault comprehensive analysis module is used to extract features of relevant information in the data detection set, and obtain the conductivity Ddlz, thermal resistance Rzcz, and maximum temperature Wd max , minimum temperature Wd min, signal transmission delay time Xcsc and power consumption value-added Nhzz, and use the trained fault detection model to obtain the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs respectively, and obtain the fault evaluation index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs and performing dimensionless processing;

[0064] The detection and evaluation module is used to extract the historical data detection set in the historical time axis, calculate the average through a statistical algorithm, obtain the fault threshold W, and obtain a fault scoring report by comparing and analyzing the fault evaluation index Gpzs with the fault threshold W, and take corresponding sorting operations.

[0065] During the operation of this system, the visual inspection module and the information collection module can accurately identify and record the residual hole ink situation; the coordinate establishment module is combined with the visual inspection module to accurately detect whether the position of the through hole deviates from the safe area, and timely discover the position offset problem that may affect the electrical performance of the circuit board; the information collection module is combined with the comprehensive fault analysis module to monitor the performance change information of the circuit board, and further accurately report the fault score through the fault assessment index Gpzs and historical data comparison and analysis, providing an important basis for subsequent maintenance and processing. The application of this system can greatly improve the efficiency and accuracy of fault detection, timely discover and solve problems in circuit boards, improve the reliability and stability of the overall equipment, reduce the impact of faults on production and work, and improve the service life and work efficiency of equipment.

[0066] Example 2

[0067] Please refer to Figure 1 ,Specifically: the visual detection module includes a region segmentation unit and a visual observation unit;

[0068] The region segmentation unit is used to divide the image of the circuit board to be inspected into several groups of inspection regions in a mesh form, and mark them as the first inspection region Jq1, the second inspection region Jq2, the third inspection region Jq3, ..., the nth inspection region Jq n , and according to the established three-dimensional coordinate system, determine the corresponding coordinates of several groups of detection areas;

[0069] The visual observation unit is used to use an infrared camera to identify the drilling position and observe the drilling degree. If the drilling position is in an incompletely drilled state, an orange pause detection instruction is sent out; if the drilling position is in a completely drilled state and a through hole is formed, the deviation of the through hole is further determined through a three-dimensional coordinate system;

[0070] When there is a deviation, the circuit board to be tested will continue to be tested;

[0071] When there is no deviation, there is no need to consider the change in the electrical performance of the circuit board to be tested due to the deviation of the through hole;

[0072] Among them, when the orange pause detection command is sent, the current circuit board is intercepted and returns to the previous drilling manufacturing link.

[0073] In this embodiment, the region segmentation unit adopts a mesh division method to divide the image of the circuit board to be inspected into multiple inspection areas, and determines the coordinate position of each area, thereby realizing the precise positioning and regional division of the circuit board, which is helpful for subsequent inspection and analysis work; the visual observation unit combines with the infrared camera to realize real-time monitoring of the drilling position and observation of the drilling degree. When it is found that the drilling position is not completely drilled through, it can send an orange pause detection instruction in time to prevent the incomplete drilling from not being timely identified, further ensuring the accuracy and reliability of the detection; the deviation of the through hole is judged by the three-dimensional coordinate system. When there is a deviation phenomenon, the system will continue to perform link detection on the circuit board to be inspected, and take corresponding measures to deal with it, so as to avoid the situation where the electrical performance of the circuit board changes due to the deviation of the through hole. Through the precise regional division of the visual inspection module, this system can timely find problems and send instructions during the inspection process, ensuring the smooth progress of the circuit board inspection work and the reliability of the results. The sending of the orange pause detection instruction and the implementation of link detection effectively check whether the drilling link of the circuit board meets the standard, and on this basis, judge the deviation of the through hole, reduce problems such as signal transmission errors caused by incomplete drilling, and further improve the qualified rate of the circuit board.

[0074] Example 3

[0075] Please refer to Figure 1 ,Specifically: the data detection set includes relevant residual material information, relevant thermal distribution state information and performance change information;

[0076] The information acquisition module includes a first acquisition unit, a second acquisition unit and a third acquisition unit;

[0077] The first acquisition unit is used to detect and record relevant residual material information passing through the inner wall of the hole, and the relevant residual material information includes the coordinates, residual amount Clzs, conductivity Ddlz, thermal resistance value Rzcz and hole ink viscosity of the hole ink residue on the circuit board;

[0078] It needs to be explained that residual hole ink refers to the material that should not exist on the inner wall of the copper foil through the hole or the hole wall during the manufacturing process of the multi-layer circuit board, such as chemical residues, impurities or drilling paint that has not been completely removed.

[0079] The second acquisition unit is used to detect and record in real time the performance change information of the circuit board to be detected, wherein the performance change information includes the rising edge, falling edge, noise value Zyzs, power consumption value Nhzz and impedance value Zkz of the signal transmitted on the circuit board;

[0080] The third acquisition unit is used to perform temperature detection on several groups of detection areas to obtain relevant thermal distribution information, and the relevant thermal distribution information includes the maximum temperature Wd within several groups of detection areas. max , minimum temperature Wd min and heat generating elements on the circuit board. Among them, the temperature changes in several groups of detection areas can be detected by using thermal detection technology, which involves measuring the temperature of the circuit board using equipment such as a thermal sensor or an infrared thermal imager.

[0081] In this embodiment, the first acquisition unit detects and records the residual material information passing through the inner wall of the hole, further ensuring the comprehensive recording and analysis of the residual material, which is helpful to fully understand the influence of the residual material on the electrical conductivity and thermal conductivity of the circuit board, and prepare for the subsequent fault analysis and evaluation work; the second acquisition unit detects and records the performance change information of the circuit board to be detected in real time, realizes the timely monitoring and recording of the performance change of the circuit board, and helps to timely discover the performance changes and problems of the circuit board; the third acquisition unit performs temperature detection on several groups of detection areas and obtains relevant thermal distribution information, which is helpful to understand the thermal distribution status and thermal management status of the circuit board, and provides an important basis for subsequent fault analysis and prevention; this system realizes comprehensive monitoring and analysis of circuit board fault conditions by comprehensively recording residual material information, real-time monitoring of performance changes and accurate acquisition of thermal distribution status information, improves the efficiency and accuracy of fault diagnosis, and ensures the smooth progress of circuit board detection and maintenance work.

[0082] Example 4

[0083] Please refer to Figure 1 ,Specifically: the comprehensive fault analysis module includes a hole wall residue analysis unit, a performance change analysis unit, a thermal distribution analysis unit and a comprehensive analysis unit;

[0084] The hole wall residual analysis unit is used to obtain the residual hole ink influence coefficient Cmxs by associating the conductivity Ddlz with the thermal resistance value Rzcz according to the relevant residual material information and performing dimensionless processing. The residual hole ink influence coefficient Cmxs is obtained by the following formula:

[0085] ;

[0086] In the formula, Clzs is represented by the residual amount, a1, a2 and a3 are respectively represented by the preset proportional coefficients of the thermal resistance value Rzcz, the conductivity Ddlz and the residual amount Clzs, wherein 0.06≤a1≤0.36, 0.05≤a2≤0.42, 0.10≤a3≤0.22, and 0.30≤a1+a2+a3≤1.0, and C is represented by the first correction constant.

[0087] The above-mentioned thermal resistance value Rzcz refers to the degree of resistance of the material in the hole wall to heat transfer, which can be obtained by heat measurement equipment such as thermal sensors or thermal imagers;

[0088] The conductivity Ddlz can be detected and obtained by a conductivity sensor or a conductivity measuring instrument;

[0089] The residual amount Clzs refers to the material content remaining in the hole wall. The larger the residual amount Clzs, the greater the possibility of affecting the patency of the hole and the connection quality. The residual amount Clzs can be obtained by a residual substance detection instrument or a chemical analysis instrument to detect the content of the residual substance.

[0090] In this embodiment, the hole wall residue analysis unit obtains the residual hole ink influence coefficient Cmxs through comprehensive analysis based on the relevant residual material information, further realizing the accurate analysis of the influence of the residual hole ink, providing an important reference for subsequent fault diagnosis and evaluation, and accurately judging the influence of the residual hole ink on the circuit board.

[0091] Example 5

[0092] Please refer to Figure 1 Specifically, the performance change analysis unit is used to obtain the performance state coefficient Xtxs after dimensionless processing according to the deviation of the through hole and in combination with the performance change information. The performance state coefficient Xtxs is obtained by the following formula:

[0093] ;

[0094] In the formula, Xcsc represents the signal transmission delay time, Zkz represents the impedance value, Nhzz represents the power consumption increase, Zyzs represents the noise increase, x, z, h and y represent the preset proportional coefficients of the signal transmission delay time Xcsc, the impedance value Zkz, the power consumption increase Nhzz and the noise increase Zyzs respectively, wherein 0.03≤x≤0.32, 0.10≤z≤0.22, 0.05≤h≤0.30, 0.03≤y≤0.16, and 0.35≤x+z+h+y≤1.0.

[0095] The above signal transmission delay time Xcsc refers to the transmission time of the signal from the sending end to the receiving end;

[0096] The impedance value Zkz can be collected and obtained by an impedance measuring instrument or a network analyzer;

[0097] The power consumption value Nhzz can be directly collected by devices such as power meters or ammeters;

[0098] Noise value Zyzs can be directly collected by devices such as noise testers or sound sensors.

[0099] The signal transmission delay time Xcsc can be calculated by the rising edge and the falling edge, and the specific calculation content is: signal transmission delay time Xcsc=rising edge+falling edge;

[0100] In this embodiment, the performance change analysis unit combines the deviation of the through-hole and the performance change information to calculate the performance status coefficient Xtxs, thereby realizing a comprehensive evaluation of the overall performance status of the circuit board. Through the comprehensive analysis of multi-dimensional parameters, it is possible to more comprehensively evaluate the performance changes of the circuit board, further improving the sensitivity and accuracy to faults. Based on the calculation results of the performance status coefficient Xtxs, the system can more accurately predict possible faults in the circuit board, thereby reducing production downtime and maintenance costs caused by faults.

[0101] Example 6

[0102] Please refer to Figure 1 Specifically: the heat distribution analysis unit is used to obtain the temperature state in a plurality of detection areas according to a plurality of detection areas, and obtain the temperature difference Wcbz, wherein the temperature difference Wcbz is obtained by the following formula:

[0103] ;

[0104] Where Wd max Expressed as the maximum temperature, Wd min Expressed as minimum temperature.

[0105] The comprehensive analysis unit is used to combine the hole wall residue analysis unit, the performance change analysis unit and the thermal distribution analysis unit, and obtain the fault assessment index Gpzs by correlating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs, and after dimensionless processing. The fault assessment index Gpzs is obtained by the following formula:

[0106] ;

[0107] In the formula, and All are represented as preset proportional coefficients, V is represented as the second correction constant, where 0.11≤ ≤0.50,0.05≤ ≤0.50, and 0.25≤ + ≤1.0.

[0108] The detection and evaluation module includes a comparison unit and an execution unit;

[0109] The comparison unit is used to compare and analyze the fault assessment index Gpzs with the fault threshold W to obtain a fault score report, wherein the specific content of the fault score report is as follows:

[0110] If the fault assessment index Gpzs ≥ the fault threshold W, it indicates that the current circuit board detection link is in an abnormal state, and a red pause detection instruction is sent;

[0111] If the fault assessment index Gpzs is less than the fault threshold W, it means that the current detection link of the circuit board is not in an abnormal state, and the next detection link will be automatically entered at this time without sending additional detection instructions;

[0112] The execution unit is used to take corresponding sorting operations according to the fault scoring report. If a red pause detection instruction is sent, the current circuit board will be automatically sorted to the unqualified placement area. If no additional detection instruction is sent, there is no need to intercept the circuit board and it will continue to be transported to the next detection link through the conveyor belt.

[0113] In this embodiment, the heat distribution analysis unit calculates and obtains the temperature difference Wcbz according to the temperature state in multiple detection areas. Through the analysis of temperature distribution, the thermal characteristics of the circuit board can be more accurately evaluated, and possible thermal problems can be discovered in time, so as to better evaluate the uniformity of heat distribution and heat dissipation efficiency, thereby laying a foundation for improving the stability of the circuit board. The comprehensive analysis unit obtains the fault evaluation index Gpzs by calculation, and through comprehensive evaluation of the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs, a comprehensive evaluation of the circuit board failure risk is achieved, reducing the misjudgment and missed detection; the comparison unit in the detection and evaluation module compares and analyzes the fault evaluation index Gpzs with the fault threshold W, judges the abnormal state of the current detection link according to the result, and sends corresponding instructions, realizing intelligent diagnosis and processing of circuit board faults, and improving the accuracy and efficiency of fault detection. The execution unit takes corresponding sorting operations according to the fault scoring report. When an abnormal state occurs, the circuit board is automatically sorted to the unqualified placement area, reducing the need for manual intervention and improving the automation and efficiency of the production line. In short, the fault assessment index Gpzs is obtained through comprehensive analysis, which enables the system to comprehensively consider various conditions of the circuit board, thereby more comprehensively evaluating the health status and working status of the circuit board.

[0114] Example 7

[0115] Please refer to Figure 1 and Figure 2 Specifically: A method for quickly detecting a circuit board fault comprises the following steps:

[0116] Step 1: First, set up a three-dimensional coordinate system and determine the origin O i Position, and align the lower right corner of the circuit board to be tested with the origin O i To overlap;

[0117] Step 2: Then, the image of the circuit board to be inspected is captured by an infrared camera device, and the image processing technology is used to divide the image of the circuit board to be inspected into several groups of inspection areas, and the degree of drilling is identified. If the through hole is completely drilled through and formed, it is determined whether there is any deviation in the through hole;

[0118] Step 3: Next, the inner wall of the hole of the circuit board to be tested is tested and recorded to obtain relevant residual material information, and several groups of test areas are used to test and obtain relevant thermal distribution state information, while monitoring the performance change information of the circuit board to be tested to establish a data test set;

[0119] Step 4: Then extract the relevant information in the data detection set to obtain the conductivity Ddlz, thermal resistance Rzcz, and maximum temperature Wd max , minimum temperature Wd min , signal transmission delay time Xcsc and power consumption value-added Nhzz, and use the trained fault detection model to obtain the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs respectively, and obtain the fault evaluation index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs and performing dimensionless processing;

[0120] Step 5: Finally, by comparing and analyzing the fault assessment index Gpzs with the fault threshold W, a fault score report is obtained and corresponding sorting operations are taken.

[0121] Example 8

[0122] Please refer to Figure 1 Specifically: a storage medium for rapid fault detection of a circuit board, on which a computer program is stored, the computer program stores computer instructions, and when the instructions are executed by a processor, a method for rapid fault detection of a circuit board is implemented.

[0123] In this embodiment, the computer program on the computer storage medium includes computer instructions for implementing circuit board fault detection. This integration enables the method to deal with security requirements in a targeted manner when executing these instructions, thereby improving overall security. The execution of the instructions ensures that the method operates according to the designed process, thereby achieving a balance between security and performance.

[0124] Example: A certain circuit board manufacturer has introduced a method, system and storage medium for rapid fault detection of circuit boards. The following is an example of a certain circuit board manufacturer:

[0125] Data collection: thermal resistance Rzcz is 3.6; conductivity Ddlz is 65%; residual Clzs is 12.6;

[0126] Preset proportional coefficients: a1 is 0.22; a2 is 0.12; a3 is 0.11; the first correction constant C is 0.05;

[0127] The signal transmission delay time Xcsc is 2.4; the impedance value Zkz is 31.2; the power consumption value Nhzz is 65.12; the noise value Zyzs is 12.1;

[0128] Preset scale factors: x is 0.16; z is 0.12; h is 0.16; y is 0.05;

[0129] Maximum temperature Wd max is 36; minimum temperature Wd min is 22;

[0130] Preset scale factor: is 0.23; is 0.11; the second correction constant V is 0.6;

[0131] After normalizing the above data, the following calculations can be performed:

[0132] Residual ink influence coefficient =4;

[0133] Performance status factor =5.56;

[0134] Temperature difference =14;

[0135] Failure Assessment Index =7.48;

[0136] By observing the drilling degree, it is known that the drilling position is in a completely drilled through state and a through hole is formed. Then, through the three-dimensional coordinate system, it is further determined that there is a deviation phenomenon in the through hole. At this time, the circuit board to be tested will continue to be tested;

[0137] If the fault threshold W is 5, the fault assessment index Gpzs≥the fault threshold W, indicating that the current circuit board detection link is in an abnormal state. At this time, a red pause detection instruction is sent to automatically sort the current circuit board into the unqualified placement area.

[0138] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board fault rapid detection system, characterized in that: It includes visual inspection module, coordinate establishment module, information collection module, comprehensive fault analysis module and inspection and evaluation module; The coordinate establishment module is used to pre-establish a three-dimensional coordinate system and determine the origin O i Position, and align the lower right corner of the circuit board to be tested with the origin O i Perform overlap and lock the specific position of the circuit board to be tested; The visual inspection module is used to capture the image of the circuit board to be inspected through an infrared camera device, and use image processing technology to divide the image of the circuit board to be inspected into several groups of inspection areas, identify the degree of drilling, and if the through hole is completely drilled through and formed, determine whether there is a deviation in the through hole; The information acquisition module is used to detect and record the inner wall of the hole of the circuit board to be detected, obtain relevant residual material information, and use several groups of detection areas to detect and obtain relevant thermal distribution state information, while monitoring the performance change information of the circuit board to be detected, and establishing a data detection set; The fault comprehensive analysis module is used to extract features of relevant information in the data detection set, and obtain the conductivity Ddlz, thermal resistance Rzcz, and maximum temperature Wd max , minimum temperature Wd min , signal transmission delay time Xcsc and power consumption value-added Nhzz, and use the trained fault detection model to obtain the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs respectively, and obtain the fault evaluation index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs and performing dimensionless processing; The detection and evaluation module is used to extract the historical data detection set in the historical time axis, calculate the average through a statistical algorithm, obtain the fault threshold W, and obtain a fault scoring report by comparing and analyzing the fault evaluation index Gpzs with the fault threshold W, and take corresponding sorting operations.

2. A circuit board fault rapid detection system according to claim 1, characterized in that: The visual detection module includes a region segmentation unit and a visual observation unit; The region segmentation unit is used to divide the image of the circuit board to be inspected into several groups of inspection regions in a mesh form, and mark them as the first inspection region Jq1, the second inspection region Jq2, the third inspection region Jq3, ..., the nth inspection region Jq n , and according to the established three-dimensional coordinate system, determine the corresponding coordinates of several groups of detection areas; The visual observation unit is used to use an infrared camera to identify the drilling position and observe the drilling degree. If the drilling position is in an incompletely drilled state, an orange pause detection instruction is sent out; if the drilling position is in a completely drilled state and a through hole is formed, the deviation of the through hole is further determined through a three-dimensional coordinate system; When there is a deviation, the circuit board to be tested will continue to be tested; When there is no deviation, there is no need to consider the change in the electrical performance of the circuit board to be tested due to the deviation of the through hole; Among them, when the orange pause detection command is sent, the current circuit board is intercepted and returns to the previous drilling manufacturing link.

3. A circuit board fault rapid detection system according to claim 2, characterized in that: The data detection set includes relevant residual material information, relevant thermal distribution state information and performance change information; The information acquisition module includes a first acquisition unit, a second acquisition unit and a third acquisition unit; The first acquisition unit is used to detect and record relevant residual material information passing through the inner wall of the hole, and the relevant residual material information includes the coordinates, residual amount Clzs, conductivity Ddlz, thermal resistance value Rzcz and hole ink viscosity of the hole ink residue on the circuit board; The second acquisition unit is used to detect and record in real time the performance change information of the circuit board to be detected, wherein the performance change information includes the rising edge, falling edge, noise value Zyzs, power consumption value Nhzz and impedance value Zkz of the signal transmitted on the circuit board; The third acquisition unit is used to perform temperature detection on several groups of detection areas to obtain relevant thermal distribution information, and the relevant thermal distribution information includes the maximum temperature Wd within several groups of detection areas. max , minimum temperature Wd min and heat generating components on the circuit board.

4. A circuit board fault rapid detection system according to claim 3, characterized in that: The comprehensive fault analysis module includes a hole wall residue analysis unit, a performance change analysis unit, a heat distribution analysis unit and a comprehensive analysis unit; The hole wall residual analysis unit is used to obtain the residual hole ink influence coefficient Cmxs by associating the conductivity Ddlz with the thermal resistance value Rzcz according to the relevant residual material information and performing dimensionless processing. The residual hole ink influence coefficient Cmxs is obtained by the following formula: ； In the formula, Clzs represents the residual amount, a1, a2 and a3 represent the preset proportional coefficients of the thermal resistance value Rzcz, the conductivity Ddlz and the residual amount Clzs respectively, and C represents the first correction constant.

5. A circuit board fault rapid detection system according to claim 4, characterized in that: The performance change analysis unit is used to obtain the performance state coefficient Xtxs after dimensionless processing according to the deviation of the through hole and in combination with the performance change information. The performance state coefficient Xtxs is obtained by the following formula: ； In the formula, Xcsc represents the signal transmission delay time, Zkz represents the impedance value, Nhzz represents the power consumption increase, Zyzs represents the noise increase, and x, z, h and y represent the preset proportional coefficients of the signal transmission delay time Xcsc, the impedance value Zkz, the power consumption increase Nhzz and the noise increase Zyzs respectively.

6. A circuit board fault rapid detection system according to claim 4, characterized in that: The heat distribution analysis unit is used to obtain the temperature state within a plurality of detection areas according to a plurality of detection areas, and obtain the temperature difference Wcbz, wherein the temperature difference Wcbz is obtained by the following formula: ； Where Wd max Expressed as the maximum temperature, Wd min Expressed as the minimum temperature.

7. A circuit board fault rapid detection system according to claim 4, characterized in that: The comprehensive analysis unit is used to combine the hole wall residue analysis unit, the performance change analysis unit and the thermal distribution analysis unit, and obtain the fault assessment index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs, and performing dimensionless processing. The fault assessment index Gpzs is obtained by the following formula: ； In the formula, and Both represent preset proportional coefficients, and V represents the second correction constant.

8. A circuit board fault rapid detection system according to claim 1, characterized in that: The detection and evaluation module includes a comparison unit and an execution unit; The comparison unit is used to compare and analyze the fault assessment index Gpzs with the fault threshold W to obtain a fault score report, wherein the specific content of the fault score report is as follows: If the fault assessment index Gpzs ≥ the fault threshold W, it indicates that the current circuit board detection link is in an abnormal state, and a red pause detection instruction is sent; If the fault assessment index Gpzs is less than the fault threshold W, it means that the current detection link of the circuit board is not in an abnormal state, and the next detection link will be automatically entered at this time without sending additional detection instructions; The execution unit is used to take corresponding sorting operations according to the fault scoring report. If a red pause detection instruction is sent, the current circuit board will be automatically sorted to the unqualified placement area. If no additional detection instruction is sent, there is no need to intercept the circuit board and it will continue to be transported to the next detection link through the conveyor belt.

9. A method for rapid fault detection of a circuit board, applied to a rapid fault detection system of a circuit board as claimed in any one of claims 1 to 8, characterized in that: The following steps are included: Step 1: First, set up a three-dimensional coordinate system and determine the origin O i Position, and align the lower right corner of the circuit board to be tested with the origin O i To overlap; Step 2: Then, the image of the circuit board to be inspected is captured by an infrared camera device, and the image processing technology is used to divide the image of the circuit board to be inspected into several groups of inspection areas, and the degree of drilling is identified. If the through hole is completely drilled through and formed, it is determined whether there is any deviation in the through hole; Step 3: Next, the inner wall of the hole of the circuit board to be tested is tested and recorded to obtain relevant residual material information, and several groups of test areas are used to test and obtain relevant thermal distribution state information, while monitoring the performance change information of the circuit board to be tested to establish a data test set; Step 4: Then extract the relevant information in the data detection set to obtain the conductivity Ddlz, thermal resistance Rzcz, and maximum temperature Wd max , minimum temperature Wd min , signal transmission delay time Xcsc and power consumption value-added Nhzz, and use the trained fault detection model to obtain the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs respectively, and obtain the fault evaluation index Gpzs by associating the residual hole ink influence coefficient Cmxs, the temperature difference Wcbz and the performance state coefficient Xtxs and performing dimensionless processing; Step 5: Finally, by comparing and analyzing the fault assessment index Gpzs with the fault threshold W, a fault score report is obtained and corresponding sorting operations are taken.

10. A storage medium for rapid fault detection of a circuit board, on which a computer program is stored, characterized in that: The computer program stores computer instructions, and when the instructions are executed by the processor, the method for rapid fault detection of a circuit board as claimed in claim 9 is implemented.

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