A marking fixture for dicing lanes in DFN and QFN package die-cutting processes

Abstract

The present invention discloses a marking jig for dicing lanes in DFN and QFN packaging die-cutting processes, which relates to the technical field of marking jigs, and comprises a fixed frame, the top of which is connected with a vertical pole, a sliding unit and a storage box, and the sliding unit is located between four groups of vertical poles, the storage box is located on one side of the sliding unit, the surfaces of the four groups of vertical poles close to each other are connected with a material displacement unit, and the top of the vertical pole is connected with a lifting and pressing unit. The present invention is equipped with a lifting and pressing unit, an infrared receiving sensor and an infrared transmitting sensor, and the moving distance formula of the pressing plate is: d = h L ‑(h1+h2)+h3, d is the distance the press plate needs to move, h is L It represents the measured distance between the lamination plate and the film frame, h1 represents the thickness of the wafer, h2 represents the thickness of the blue film, and h3 represents the thickness of the scribe line. The thickness of the scribe line can be set according to the cutting needs to determine the moving distance of the lamination plate, thereby forming clear and accurate scribe lines on different wafers.

Description

Technical Field

[0001] The invention relates to the technical field of marking jigs, in particular to a marking jig for scribing lanes in a DFN and QFN packaging die-cutting process. Background Art

[0002] DFN and QFN are two ways of IC packaging. In the production process of QFN and DFN packaging, wafer dicing is a crucial process. A professional dicing machine is used to cut the wafer to separate thousands of independent chips. Before cutting, clear dicing lane marks need to be formed on the surface of the wafer to guide the dicing machine for precise cutting. These marks are realized by special marking jigs. There are precise positioning marks on the marking jigs to ensure that each chip can be cut and separated correctly.

[0003] The scribe line marks of traditional marking jigs are fixed and cannot be adjusted according to different wafer or chip sizes. These fixed marks may cause damage to the wafer structure when forming the scribe lines. Especially when the scribe lines are formed on the wafer surface, there is a certain risk of damaging the structural integrity of the wafer. The marking jig of the present application can accurately adjust the thickness of the scribe line marks, thereby forming clear and accurate scribe lines on different wafers. In this way, the risk of damage to the wafer structure can be reduced, and the accuracy of cutting and the efficiency of the entire manufacturing process can be improved.

[0004] The defects of existing marking fixtures are:

[0005] 1. Patent document CN207051432U discloses a universal automatic dot marking fixture. The document mainly considers how to adapt to the electrical performance test of high-precision printed circuit boards, but does not consider how to accurately adjust the thickness of the scribe line mark to form a clear scribe line on the surface of the wafer to facilitate accurate wafer cutting;

[0006] 2. Patent document CN209372906U discloses a defective product identification jig suitable for FPC electrical testing. The document mainly considers the problem of how to identify defective products during FPC electrical testing, but does not consider how to automatically transfer wafers with diced lanes for wafer cutting without manual operation to improve transfer efficiency;

[0007] 3. Patent document CN212991047U discloses a chip substrate defect product identification jig. The document mainly considers how to quickly identify the identification to improve the search efficiency, but does not consider how to stably install the wafer to ensure that the wafer will not shift during the cutting process;

[0008] 4. Patent document CN109326529B discloses a DFN / QFN production process. The document mainly considers how to improve production efficiency and testing efficiency, but does not consider how to collect and discharge the debris and coolant generated during the wafer cutting process to prevent the accumulation of debris and coolant from affecting subsequent wafer cutting. Summary of the invention

[0009] The object of the present invention is to provide a marking jig for dicing lanes in a DFN and QFN package die-cutting process, so as to solve the problems raised in the above-mentioned background technology.

[0010] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a marking jig for dicing lanes in a DFN and QFN package die-cutting process, comprising a fixed frame, a top of which is connected to a vertical pole, a sliding unit and a storage box, wherein the sliding unit is located between four groups of vertical poles, the storage box is located on one side of the sliding unit, surfaces of the four groups of vertical poles close to each other are connected to a material displacement unit, and the top of the vertical pole is connected to a lifting and pressing unit;

[0011] The lifting and pressing unit includes a top plate installed on the top of the vertical pole, the top plate is connected to a hydraulic rod, the bottom center of the hydraulic rod is connected to a lifting plate, the lifting plate is connected to four evenly arranged groups of sliding sleeves, and the four groups of sliding sleeves are respectively located on the outside of the four groups of vertical poles, the bottom of the lifting plate is connected to an inverted T-shaped fixing plate, the outside of the T-shaped fixing plate is connected to a pressing plate, the bottom of the pressing plate is connected to evenly arranged scribing lines, the bottom of the pressing plate is embedded with evenly arranged infrared receiving sensors, and the infrared receiving sensors are located on the outside of the scribing lines.

[0012] Preferably, the material displacement unit includes a fixed box installed on the surfaces of four groups of vertical rods close to each other, two groups of sliding rods are connected to the inside of the fixed box, a servo motor is connected to the center of one side of the fixed box, the output end of the servo motor is connected to a sliding screw, and the sliding screw is located between the two groups of sliding rods, one end of the sliding screw is connected to the inner wall of the fixed box through a shaft, two groups of limit baffles and sliding blocks are sleeved on the outer surfaces of the sliding screw and the two groups of sliding rods, and the limit baffles are used to limit the range of left and right movement of the sliding block.

[0013] Preferably, the bottom of the sliding block is connected to an L-shaped fixing plate, the top of the L-shaped fixing plate is connected to a supporting plate, and the supporting plate is located above the sliding unit, the bottom of the supporting plate is connected to two sets of stop plates, the center of one side of the L-shaped fixing plate is connected to an electric telescopic rod, the output end of the electric telescopic rod is connected to a push plate, and the push plate is located on one side of the supporting plate and the stop plate, one side of the L-shaped fixing plate is embedded with a pressure sensor 1, and the electric telescopic rod is located above the pressure sensor 1;

[0014] Two groups of symmetrically arranged stop grooves are provided inside the storage box, and a second pressure sensor is embedded in the center of the inner wall of the stop groove.

[0015] Preferably, a film sticking frame is connected to the top of the support plate, and evenly arranged infrared emission sensors are embedded in the top of the film sticking frame.

[0016] Preferably, the sliding unit comprises mounting plates symmetrically arranged on the top of the fixed frame, and surfaces of two groups of mounting plates close to each other are connected with evenly arranged rotating shafts, and rotating cylinders are sleeved on the outer sides of the rotating shafts.

[0017] Preferably, an overflow groove 1 is opened inside the support plate, four groups of positioning pins are evenly arranged are connected to the top of the support plate, four groups of alignment holes are evenly opened inside the film laminating frame, and the alignment holes and the positioning pins are interlocked with each other, an overflow groove 2 is opened inside the film laminating frame, and the overflow groove 2 is located above the overflow groove 1, a wafer is connected to the top of the film laminating frame, and a blue film is adhered to the top of the wafer.

[0018] Preferably, an overflow chamber, a sedimentation chamber and an installation chamber are provided inside the storage box, and the overflow chamber is located above the sedimentation chamber and the installation chamber, and the installation chamber is located outside the sedimentation chamber, a water outlet pipe 1 is connected to the bottom of the overflow chamber, one end of the water outlet pipe 1 is connected to a water pump, and the water pump is installed inside the installation chamber, one end of the water pump is connected to a water outlet pipe 2, and the water outlet pipe 2 passes through the rear wall of the storage box, a slag discharge pipe is connected to the bottom of the sedimentation chamber, and a solenoid valve is connected to the bottom of the slag discharge pipe.

[0019] Preferably, a movable storage box is connected to the interior of the fixed frame, and the movable storage box is located below the slag discharge pipe.

[0020] Preferably, the method of using the marking fixture is as follows:

[0021] S1. When using the marking jig, adhere the wafer to the top of the film-sticking frame through the blue film, and align the alignment holes inside the film-sticking frame with the positioning pins on the top of the pallet for installation;

[0022] S2, forming a clear scribe line on the wafer surface by lifting and pressing the unit;

[0023] S3, transporting the wafer to the top of the storage box through the material displacement unit for wafer cutting;

[0024] S4. Wafer debris, blue film debris and coolant generated during the cutting process are collected and discharged through the overflow chamber and sedimentation chamber inside the storage box.

[0025] Preferably, in said S2, the following steps are also included:

[0026] S21. The formula for the moving distance of the press plate is:

[0027] d=h L -(h1+h2)+h3;

[0028] Where d is the distance the press plate needs to move, h L It represents the distance between the pressing plate and the film laminating frame measured by the infrared transmitting sensor and the infrared receiving sensor, h1 represents the thickness of the wafer, h2 represents the thickness of the blue film, and h3 represents the thickness of the dicing road;

[0029] S22, starting the hydraulic rod to drive the lifting plate, the T-shaped fixing plate and the bottom pressing plate to move downward, so as to form a clear scribe line on the surface of the wafer as a physical mark when the wafer is cut;

[0030] In said S3, the following steps are also included:

[0031] S31, start the servo motor to drive the sliding block to move on the outer surface of the sliding rod and the sliding screw, thereby driving the push plate to push the support plate and the stop plate to move to one side. At the same time, the bottom drum starts to rotate when the support plate moves, accelerating the movement of the support plate;

[0032] S32, during the movement of the support plate and the stop plate, the stop plate continuously moves toward the stop groove opened inside the storage box, and the support plate moves to one side on the top of the storage box. When the pressure sensor embedded in one side of the L-shaped fixing plate detects that the pressure is greater than the set safety value, it means that the L-shaped fixing plate touches the outer wall of the storage box, and the servo motor stops working;

[0033] S33, then start the electric telescopic rod, drive the push plate to push the support plate and the stop plate to continue moving until one end of the stop plate contacts the inner wall of the stop groove and applies pressure to the second pressure sensor. When the second pressure sensor detects that the pressure is greater than the set safety value, the electric telescopic rod stops working, and the stop plate is completely installed inside the stop groove.

[0034] In said S4, the following steps are also included:

[0035] S41, the wafer debris, blue film debris and coolant generated during the wafer cutting process successively pass through the overflow channel 2 opened inside the film laminating frame and the overflow channel 1 opened inside the support plate into the overflow chamber and the sedimentation chamber inside the storage box;

[0036] S42. Solid matter settles inside the sedimentation chamber due to gravity and is discharged into the mobile storage box through the solenoid valve and the slag discharge pipe. The liquid is discharged through the outlet pipe 1, the water pump and the outlet pipe 2 at the bottom of the overflow chamber.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] 1. The present invention is equipped with a lifting and pressing unit, an infrared receiving sensor and an infrared transmitting sensor. The moving distance formula of the pressing plate is: d = h L -(h1+h2)+h3, where d is the distance the press plate needs to move, and h is L It represents the distance between the pressing plate and the film frame measured by the infrared transmitting sensor and the infrared receiving sensor, h1 represents the thickness of the wafer, h2 represents the thickness of the blue film, and h3 represents the thickness of the scribe line. The thickness of the scribe line can be set according to the cutting needs to determine the moving distance of the pressing plate. Then the hydraulic rod is started to drive the lifting plate, the T-shaped fixing plate and the bottom pressing plate to move downward, thereby forming clear and accurate scribe lines on different wafers as physical marks when the wafer is cut. In this way, the risk of damage to the wafer structure can be reduced, the accuracy of cutting and the efficiency of the entire manufacturing process can be improved. The problem of how to accurately adjust the thickness of the scribe line mark can be solved to form a clear scribe line on the wafer surface to facilitate accurate wafer cutting.

[0039] 2. The present invention is equipped with a material displacement unit, pressure sensor 1 and pressure sensor 2, and starts the servo motor to drive the sliding block to move, and at the same time drives the push plate to push the support plate and the stop plate to move into the stop groove. When the pressure sensor 1 embedded in one side of the L-shaped fixed plate detects that the pressure is greater than the set safety value, it means that the L-shaped fixed plate touches the outer wall of the storage box, and the servo motor stops working, and then starts the electric telescopic rod to drive the push plate to push the support plate and the stop plate to continue moving until one end of the stop plate contacts the inner wall of the stop groove. When the pressure sensor 2 detects that the pressure is greater than the set safety value, the electric telescopic rod stops working. At this time, the stop plate is completely installed in the stop groove, which can solve the problem of how to automatically transfer the wafer with the dicing lanes to perform wafer cutting without manual operation, thereby improving the transfer efficiency. At the same time, the support plate is always in the same plane, which can ensure the stability of the wafer thereon.

[0040] 3. The present invention ensures the correct alignment between the two by the mutual engagement of the alignment holes and the positioning pins, which can ensure the stability between the support plate and the film frame. The blue film ensures the stability between the film frame and the wafer. The support plate, the film frame and the blue film provide a stable platform, so that the wafer on the top of the film frame will not be displaced during the cutting process, thereby improving the accuracy and efficiency of the manufacturing process, and can solve the problem of how to stably install the wafer and ensure that the wafer will not shift during the cutting process.

[0041] 4. The present invention is equipped with an overflow chamber and a sedimentation chamber. The wafer debris, blue film debris and coolant generated in the wafer cutting process successively pass through the overflow groove 2 opened inside the film frame and the overflow groove 1 opened inside the support plate into the overflow chamber and the sedimentation chamber inside the storage box. Then the solid matter is settled in the sedimentation chamber due to gravity, and is discharged into the mobile storage box by the solenoid valve and the slag discharge pipe. The liquid is discharged from the storage box through the outlet pipe 1, the water pump and the outlet pipe 2 at the bottom of the overflow chamber. This can solve the problem of how to collect and discharge the debris and coolant generated in the wafer cutting process and prevent the accumulation of debris and coolant from affecting the subsequent cutting of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0043] Figure 2 It is a front structural schematic diagram of the present invention;

[0044] Figure 3 It is a schematic diagram of the cross-sectional structure of the present invention;

[0045] Figure 4 It is a schematic diagram of the internal structure of the fixing box of the present invention;

[0046] Figure 5 It is a schematic diagram of the structure of the material displacement unit of the present invention;

[0047] Figure 6 It is a schematic diagram of the assembly structure of the support plate, film sticking frame, wafer and blue film of the present invention;

[0048] Figure 7 It is a schematic diagram of the top view structure of the support plate, film laminating frame, wafer and blue film of the present invention;

[0049] Figure 8 It is a schematic diagram of the assembly structure of the T-shaped fixing plate and the pressing plate of the present invention;

[0050] Fig. 9 It is a schematic diagram of the structure of the overflow chamber, the settling chamber and the installation chamber of the present invention;

[0051] Fig.10 It is the work flow chart of the present invention.

[0052] In the figure: 1. fixed frame; 2. vertical pole; 3. storage box; 4. fixed box; 5. sliding rod; 6. sliding screw rod; 7. sliding block; 8. L-shaped fixed plate; 9. supporting plate; 10. stop plate; 11. electric telescopic rod; 12. push plate; 13. pressure sensor 1; 14. stop groove; 15. pressure sensor 2; 16. mounting plate; 17. rotating shaft; 18. rotating drum; 19. overflow groove 1; 20. positioning Pin; 21. Film sticking frame; 22. Alignment hole; 23. Overflow channel 2; 24. Wafer; 25. Blue film; 26. Top plate; 27. Hydraulic rod; 28. Lifting plate; 29. ​​Sliding sleeve; 30. T-shaped fixing plate; 31. Pressing plate; 32. Scribing line; 33. Infrared receiving sensor; 34. Infrared transmitting sensor; 35. Overflow chamber; 36. Sedimentation chamber; 37. Installation chamber; 38. Mobile storage box. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0055] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] See also Figure 1 , Figure 2 , Figure 3 , Figure 8 and Fig.10The present invention provides an embodiment: a marking jig for dicing lanes in a DFN and QFN package die-cutting process, comprising a fixed frame 1, the top of which is connected to a vertical pole 2, a sliding unit and a storage box 3, and the sliding unit is located between four groups of vertical poles 2, the storage box 3 is located on one side of the sliding unit, the surfaces of the four groups of vertical poles 2 close to each other are connected to a material displacement unit, and the top of the vertical pole 2 is connected to a lifting and pressing unit;

[0057] The lifting and pressing unit includes a top plate 26 installed on the top of the vertical pole 2, the top plate 26 is connected to a hydraulic rod 27, the bottom of the hydraulic rod 27 is connected to a lifting plate 28 at the center of the bottom, the lifting plate 28 is connected to four groups of sliding sleeves 29 that are evenly arranged, and the four groups of sliding sleeves 29 are respectively located on the outside of the four groups of vertical poles 2, the bottom of the lifting plate 28 is connected to an inverted T-shaped fixing plate 30, the outside of the T-shaped fixing plate 30 is connected to a pressing plate 31, the bottom of the pressing plate 31 is connected to evenly arranged scribing lines 32, the bottom of the pressing plate 31 is embedded with evenly arranged infrared receiving sensors 33, and the infrared receiving sensors 33 are located on the outside of the scribing lines 32.

[0058] Furthermore, the fixed frame 1 is connected to the top with the vertical pole 2, the sliding unit and the storage box 3 to fix them, ensuring the stability of the vertical pole 2, the sliding unit and the storage box 3. The sliding sleeve 29 is located between the vertical pole 2 and the lifting plate 28 to ensure the stability of the lifting plate 28 moving up and down, while reducing the friction between the vertical pole 2 and the lifting plate 28 to avoid wear of the vertical pole 2 and the lifting plate 28.

[0059] The scribing line 32 connected to the bottom of the pressing plate 31 can leave a clear scribing line on the surface of the wafer 24, so as to facilitate accurate cutting of the wafer 24. The infrared receiving sensor 33 is used to receive infrared rays emitted from the infrared emitting sensor 34 embedded in the top of the film pasting frame 21, so as to detect the distance between the pressing plate 31 and the film pasting frame 21. When the pressing plate 31 needs to be replaced, the pressing plate 31 can be taken out from the outside of the internal inverted T-shaped fixing plate 30, and then the new pressing plate 31 can be installed on the outside of the inverted T-shaped fixing plate 30;

[0060] The moving distance formula of the pressing plate 31 is: d = h L -(h1+h2)+h3, where d represents the distance that the pressing plate 31 needs to move, and h LIt represents the distance between the pressing plate 31 and the film frame 21 measured by the infrared transmitting sensor 34 and the infrared receiving sensor 33, h1 represents the thickness of the wafer 24, h2 represents the thickness of the blue film 25, and h3 represents the thickness of the scribe line. The thickness of the scribe line can be set according to the cutting needs to determine the moving distance of the pressing plate 31. Then the hydraulic rod 27 is started to drive the lifting plate 28, the T-shaped fixing plate 30 and the bottom pressing plate 31 to move downward, forming a clear scribe line on the surface of the wafer 24 as a physical mark when the wafer 24 is cut.

[0061] See also Figure 1 , Figure 2 and Figure 4 An embodiment of the present invention is: a marking jig for dicing lanes in DFN and QFN package die-cutting processes, the material displacement unit comprising a fixed box 4 mounted on surfaces of four groups of vertical rods 2 close to each other, two groups of sliding rods 5 connected to the interior of the fixed box 4, a servo motor connected to the center of one side of the fixed box 4, a sliding screw 6 connected to the output end of the servo motor, and the sliding screw 6 is located between the two groups of sliding rods 5, one end of the sliding screw 6 is connected to the inner wall of the fixed box 4 through a shaft, two groups of limit baffles and a sliding block 7 are sleeved on the outer surfaces of the sliding screw 6 and the two groups of sliding rods 5, and the limit baffle is used to limit the range of left and right movement of the sliding block 7.

[0062] Furthermore, the vertical rod 2 fixes the fixed box 4 to ensure the stability of the fixed box 4. Starting the servo motor can drive the sliding block 7 to move on the outer surface of the sliding rod 5 and the sliding screw 6. The limit baffle is used to limit the range of left and right movement of the sliding block 7 to prevent damage or malfunction of the material displacement unit.

[0063] See also Figure 4 and Figure 5 , an embodiment of the present invention: a marking jig for dicing lanes in a DFN and QFN package die-cutting process, wherein the bottom of the sliding block 7 is connected to an L-shaped fixing plate 8, the top of the L-shaped fixing plate 8 is connected to a support plate 9, and the support plate 9 is located above the sliding unit, and the bottom of the support plate 9 is connected to two groups of stop plates 10, and the center of one side of the L-shaped fixing plate 8 is connected to an electric telescopic rod 11, the output end of the electric telescopic rod 11 is connected to a push plate 12, and the push plate 12 is located on one side of the support plate 9 and the stop plate 10, and a pressure sensor 13 is embedded in one side of the L-shaped fixing plate 8, and the electric telescopic rod 11 is located above the pressure sensor 13;

[0064] Two groups of symmetrically arranged retaining grooves 14 are provided inside the storage box 3 , and a second pressure sensor 15 is embedded in the center of the inner wall of the retaining groove 14 .

[0065] Further, the sliding block 7 fixes the L-shaped fixing plate 8 connected to the bottom to ensure the stability of the L-shaped fixing plate 8, the supporting plate 9 fixes the two sets of stopper plates 10 connected to the bottom to ensure the stability of the stopper plates 10, the L-shaped fixing plate 8 fixes the electric telescopic rod 11 connected at the center of one side to ensure the stability of the electric telescopic rod 11, and the electric telescopic rod 11 fixes the push plate 12 connected to the output end to ensure the stability of the push plate 12;

[0066] When the sliding block 7 starts to move, it drives the push plate 12 to push the support plate 9 and the stop plate 10 to move to one side. At the same time, the bottom drum 18 starts to rotate when the support plate 9 moves, accelerating the movement of the support plate 9. During the movement of the support plate 9 and the stop plate 10, the stop plate 10 continuously moves toward the stop groove 14 opened inside the storage box 3, and the support plate 9 moves to one side at the top of the storage box 3. When the pressure sensor 13 embedded in one side of the L-shaped fixing plate 8 detects that the pressure is greater than the set safety value, it means that the L-shaped fixing plate 8 touches the outer wall of the storage box 3, and the servo motor stops working;

[0067] Then the electric telescopic rod 11 is started, driving the push plate 12 to push the support plate 9 and the stop plate 10 to continue moving until one end of the stop plate 10 contacts the inner wall of the stop groove 14 and applies pressure to the pressure sensor 2 15. When the pressure sensor 2 15 detects that the pressure is greater than the set safety value, the electric telescopic rod 11 stops working. At this time, the stop plate 10 is completely installed inside the stop groove 14.

[0068] See also Figure 6 The present invention provides an embodiment: a marking jig for dicing lanes in a DFN and QFN package die-cutting process, wherein a film-sticking frame 21 is connected to the top of the support plate 9, and uniformly arranged infrared emission sensors 34 are embedded in the top of the film-sticking frame 21.

[0069] Furthermore, the infrared emitting sensor 34 embedded in the top of the film sticking frame 21 is used to emit infrared rays to the infrared receiving sensor 33 embedded in the bottom of the pressing plate 31 .

[0070] See also Figure 1 and Figure 3 An embodiment of the present invention is a marking jig for dicing lanes in a DFN and QFN package die-cutting process, wherein the sliding unit comprises mounting plates 16 symmetrically arranged on the top of a fixed frame 1, and two sets of mounting plates 16 are connected to surfaces close to each other with evenly arranged rotating shafts 17, and a rotating cylinder 18 is sleeved on the outer side of the rotating shaft 17.

[0071] Furthermore, when the support plate 9 moves to the right, the drum 18 is driven to rotate, and the rotation of the drum 18 also pushes the movement of the support plate 9. The rotating shaft 17 connected to the surfaces of the two sets of mounting plates 16 close to each other supports the drum 18 to ensure the stability of the drum 18.

[0072] See also Figure 6 and Figure 7 An embodiment of the present invention is: a marking jig for dicing lanes in a DFN and QFN package die-cutting process, wherein an overflow groove 19 is provided inside the support plate 9, and four groups of positioning pins 20 are evenly arranged on the top of the support plate 9, and four groups of alignment holes 22 are evenly provided inside the film pasting frame 21, and the alignment holes 22 and the positioning pins 20 are mutually engaged, and an overflow groove 23 is provided inside the film pasting frame 21, and the overflow groove 23 is located above the overflow groove 19, and a wafer 24 is connected to the top of the film pasting frame 21, and a blue film 25 is adhered to the top of the wafer 24.

[0073] Furthermore, the mutual engagement of the alignment hole 22 and the positioning pin 20 can ensure the stability between the support plate 9 and the film frame 21, and the blue film 25 ensures the stability between the film frame 21 and the wafer 24, so that the wafer 24 on the top of the film frame 21 will not be displaced during the cutting process. The wafer 24 debris, blue film 25 debris and coolant generated during the cutting process of the wafer 24 successively pass through the overflow groove 23 opened inside the film frame 21 and the overflow groove 19 opened inside the support plate 9 into the overflow chamber 35 and the sedimentation chamber 36 inside the storage box 3.

[0074] See also Figure 1 and Fig. 9 An embodiment of the present invention is a marking jig for dicing lanes in a DFN and QFN package die-cutting process, wherein an overflow chamber 35, a sedimentation chamber 36 and an installation chamber 37 are provided inside the storage box 3, and the overflow chamber 35 is located above the sedimentation chamber 36 and the installation chamber 37, and the installation chamber 37 is located outside the sedimentation chamber 36, a water outlet pipe 1 is connected to the bottom of the overflow chamber 35, one end of the water outlet pipe 1 is connected to a water pump, and the water pump is installed inside the installation chamber 37, one end of the water pump is connected to a water outlet pipe 2, and the water outlet pipe 2 runs through the rear wall of the storage box 3, a slag discharge pipe is connected to the bottom of the sedimentation chamber 36, and a solenoid valve is connected to the bottom of the slag discharge pipe.

[0075] Furthermore, after the wafer 24 debris, blue film 25 debris and coolant generated during the wafer 24 cutting process enter the overflow chamber 35 and the sedimentation chamber 36, the solid matter is settled inside the sedimentation chamber 36 due to gravity, and is discharged into the mobile storage box 38 by the solenoid valve and the slag discharge pipe, and the liquid is discharged from the storage box 3 through the outlet pipe 1, the water pump and the outlet pipe 2 at the bottom of the overflow chamber 35.

[0076] See also Figure 1 , Figure 2 and Fig. 9The present invention provides an embodiment: a marking jig for dicing lanes in a DFN and QFN package die-cutting process, wherein a movable storage box 38 is connected to the interior of the fixed frame 1, and the movable storage box 38 is located below the slag discharge pipe.

[0077] Further, the method of using the marking fixture is as follows:

[0078] S1. When using the marking jig, adhere the wafer 24 to the top of the film-sticking frame 21 through the blue film 25, and align the alignment hole 22 inside the film-sticking frame 21 with the positioning pin 20 on the top of the support plate 9 for installation;

[0079] S2, forming a clear scribe line on the surface of the wafer 24 by means of the lifting and pressing unit;

[0080] S3, transporting the wafer 24 to the top of the storage box 3 through the material displacement unit to cut the wafer 24;

[0081] S4. The wafer 24 debris, blue film 25 debris and coolant generated during the cutting process are collected and discharged through the overflow chamber 35 and the sedimentation chamber 36 inside the storage box 3.

[0082] Furthermore, in said S2, the following steps are also included:

[0083] S21, the moving distance formula of the pressing plate 31 is:

[0084] d=h L -(h1+h2)+h3;

[0085] Where d represents the distance that the pressing plate 31 needs to move, h L represents the distance between the pressing plate 31 and the film laminating frame 21 measured by the infrared transmitting sensor 34 and the infrared receiving sensor 33, h1 represents the thickness of the wafer 24, h2 represents the thickness of the blue film 25, and h3 represents the thickness of the dicing road;

[0086] S22, start the hydraulic rod 27 to drive the lifting plate 28, the T-shaped fixing plate 30 and the bottom pressing plate 31 to move downward, so as to form a clear scribe line on the surface of the wafer 24 as a physical mark when the wafer 24 is cut;

[0087] In said S3, the following steps are also included:

[0088] S31, start the servo motor to drive the sliding block 7 to move on the outer surface of the sliding rod 5 and the sliding screw 6, thereby driving the push plate 12 to push the support plate 9 and the stop plate 10 to move to one side. At the same time, the bottom drum 18 starts to rotate when the support plate 9 moves, accelerating the movement of the support plate 9;

[0089] S32, during the movement of the support plate 9 and the stop plate 10, the stop plate 10 continuously moves toward the stop groove 14 opened inside the storage box 3, and the support plate 9 moves to one side at the top of the storage box 3. When the pressure sensor 13 embedded in one side of the L-shaped fixing plate 8 detects that the pressure is greater than the set safety value, it means that the L-shaped fixing plate 8 touches the outer wall of the storage box 3, and the servo motor stops working;

[0090] S33, then start the electric telescopic rod 11, drive the push plate 12 to push the support plate 9 and the stop plate 10 to continue to move until one end of the stop plate 10 contacts the inner wall of the stop groove 14 and applies pressure to the second pressure sensor 15. When the second pressure sensor 15 detects that the pressure is greater than the set safety value, the electric telescopic rod 11 stops working, and at this time the stop plate 10 is completely installed inside the stop groove 14;

[0091] In said S4, the following steps are also included:

[0092] S41, the wafer 24 debris, blue film 25 debris and coolant generated during the wafer 24 cutting process successively pass through the overflow groove 23 opened inside the film frame 21 and the overflow groove 19 opened inside the support plate 9 into the overflow chamber 35 and the sedimentation chamber 36 inside the storage box 3;

[0093] S42, the solid matter settles inside the sedimentation chamber 36 due to gravity and is discharged into the mobile storage box 38 through the electromagnetic valve and the slag discharge pipe, and the liquid is discharged through the outlet pipe 1, the water pump and the outlet pipe 2 at the bottom of the overflow chamber 35.

[0094] Working principle: When using the marking jig, adhere the wafer 24 to the top of the film-sticking frame 21 through the blue film 25, align the alignment hole 22 inside the film-sticking frame 21 with the positioning pin 20 on the top of the support plate 9, and start the hydraulic rod 27 to drive the lifting plate 28, the T-shaped fixing plate 30 and the bottom pressing plate 31 to move downward, forming a clear scribe line on the surface of the wafer 24 as a physical mark when the wafer 24 is cut;

[0095] Then the servo motor is started to drive the sliding block 7 to move on the outer surface of the sliding rod 5 and the sliding screw 6, thereby driving the push plate 12 to push the support plate 9 and the stop plate 10 to move to one side. At the same time, the bottom drum 18 starts to rotate when the support plate 9 moves, accelerating the movement of the support plate 9;

[0096] During the movement of the support plate 9 and the stop plate 10, the stop plate 10 continuously moves toward the stop groove 14 opened inside the storage box 3, and the support plate 9 moves to one side on the top of the storage box 3. When the pressure sensor 13 embedded in one side of the L-shaped fixing plate 8 detects that the pressure is greater than the set safety value, it means that the L-shaped fixing plate 8 touches the outer wall of the storage box 3, and the servo motor stops working;

[0097] Then the electric telescopic rod 11 is started, driving the push plate 12 to push the support plate 9 and the stop plate 10 to continue to move until one end of the stop plate 10 contacts the inner wall of the stop groove 14 and applies pressure to the pressure sensor 2 15. When the pressure sensor 2 15 detects that the pressure is greater than the set safety value, the electric telescopic rod 11 stops working, and at this time the stop plate 10 is completely installed inside the stop groove 14;

[0098] The wafer 24 debris, blue film 25 debris and coolant generated during the wafer 24 cutting process successively pass through the overflow groove 23 opened inside the film frame 21 and the overflow groove 19 opened inside the support plate 9 and enter the overflow chamber 35 and the sedimentation chamber 36 inside the storage box 3;

[0099] The solid matter settles in the sedimentation chamber 36 due to gravity and is discharged into the mobile storage box 38 through the electromagnetic valve and the slag discharge pipe, and the liquid is discharged through the outlet pipe 1, the water pump and the outlet pipe 2 at the bottom of the overflow chamber 35.

[0100] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A marking jig for dicing lanes in a DFN and QFN package die-cutting process, comprising a fixed frame (1), characterized in that: The top of the fixed frame (1) is connected to a vertical pole (2), a sliding unit and a storage box (3), and the sliding unit is located between the four groups of vertical poles (2), and the storage box (3) is located on one side of the sliding unit. The surfaces of the four groups of vertical poles (2) close to each other are connected to a material displacement unit, and the top of the vertical pole (2) is connected to a lifting and pressing unit; The lifting and pressing unit comprises a top plate (26) installed on the top of the vertical pole (2), the top plate (26) is internally connected to a hydraulic rod (27), the bottom center of the hydraulic rod (27) is connected to a lifting plate (28), the lifting plate (28) is internally connected to four groups of sliding sleeves (29) arranged evenly, and the four groups of sliding sleeves (29) are respectively located on the outside of the four groups of vertical poles (2), the bottom of the lifting plate (28) is connected to an inverted T-shaped fixing plate (30), the outside of the T-shaped fixing plate (30) is connected to a pressing plate (31), the bottom of the pressing plate (31) is connected to evenly arranged scribing lines (32), the bottom of the pressing plate (31) is embedded with evenly arranged infrared receiving sensors (33), and the infrared receiving sensors (33) are located on the outside of the scribing lines (32); The storage box (3) is provided with an overflow chamber (35), a sedimentation chamber (36) and an installation chamber (37), and the overflow chamber (35) is located above the sedimentation chamber (36) and the installation chamber (37), and the installation chamber (37) is located outside the sedimentation chamber (36). The bottom of the overflow chamber (35) is connected to a water outlet pipe 1, one end of which is connected to a water pump, and the water pump is installed in the installation chamber (37), one end of which is connected to a water outlet pipe 2, and the water outlet pipe 2 passes through the rear wall of the storage box (3), and the bottom of the sedimentation chamber (36) is connected to a slag discharge pipe, and the bottom of the slag discharge pipe is connected to an electromagnetic valve.

2. The marking jig for dicing lanes in DFN and QFN package die-cutting process according to claim 1, characterized in that: The material displacement unit comprises a fixed box (4) mounted on the surfaces of four groups of vertical rods (2) close to each other, two groups of sliding rods (5) are connected inside the fixed box (4), a servo motor is connected at the center of one side of the fixed box (4), an output end of the servo motor is connected to a sliding screw (6), and the sliding screw (6) is located between the two groups of sliding rods (5), one end of the sliding screw (6) is connected to the inner wall of the fixed box (4) through a shaft, and two groups of limit baffles and sliding blocks (7) are sleeved on the outer surfaces of the sliding screw (6) and the two groups of sliding rods (5), and the limit baffles are used to limit the range of left and right movement of the sliding block (7).

3. The marking jig for dicing lanes in DFN and QFN package die-cutting process according to claim 2, characterized in that: The bottom of the sliding block (7) is connected to an L-shaped fixing plate (8), the top of the L-shaped fixing plate (8) is connected to a supporting plate (9), and the supporting plate (9) is located above the sliding unit, the bottom of the supporting plate (9) is connected to two groups of stop plates (10), the center of one side of the L-shaped fixing plate (8) is connected to an electric telescopic rod (11), the output end of the electric telescopic rod (11) is connected to a push plate (12), and the push plate (12) is located on one side of the supporting plate (9) and the stop plate (10), a pressure sensor (13) is embedded in one side of the L-shaped fixing plate (8), and the electric telescopic rod (11) is located above the pressure sensor (13); Two groups of symmetrically arranged stop grooves (14) are provided inside the storage box (3), and a second pressure sensor (15) is embedded in the center of the inner wall of the stop groove (14).

4. The marking jig for dicing lanes in DFN and QFN package die-cutting process according to claim 3, characterized in that: The top of the support plate (9) is connected to a film sticking frame (21), and the top of the film sticking frame (21) is embedded with evenly arranged infrared emission sensors (34).

5. The marking jig for dicing lanes in DFN and QFN package die-cutting process according to claim 1, characterized in that: The sliding unit comprises mounting plates (16) symmetrically arranged on the top of the fixed frame (1); surfaces of two sets of mounting plates (16) close to each other are connected to evenly arranged rotating shafts (17); and a rotating cylinder (18) is sleeved on the outer side of the rotating shaft (17).

6. The marking jig for dicing lanes in DFN and QFN package die-cutting process according to claim 4, characterized in that: The support plate (9) is provided with an overflow groove 1 (19) inside, the top of the support plate (9) is connected with four groups of positioning pins (20) arranged evenly, the film pasting frame (21) is provided with four groups of alignment holes (22) evenly inside, and the alignment holes (22) and the positioning pins (20) are mutually engaged, the film pasting frame (21) is provided with an overflow groove 2 (23) inside, and the overflow groove 2 (23) is located above the overflow groove 1 (19), the top of the film pasting frame (21) is connected with a wafer (24), and a blue film (25) is adhered to the top of the wafer (24).

7. The marking jig for dicing lanes in DFN and QFN package die-cutting process according to claim 1, characterized in that: The interior of the fixed frame (1) is connected to a movable storage box (38), and the movable storage box (38) is located below the slag discharge pipe.

8. The method for using a marking jig for dicing lanes in a DFN and QFN package die-cutting process according to claim 6, characterized in that: The use of the marking fixture is as follows: S1. When using the marking jig, adhere the wafer (24) to the top of the film sticking frame (21) through the blue film (25), and align the alignment hole (22) inside the film sticking frame (21) with the positioning pin (20) on the top of the support plate (9) for installation; S2, forming a clear scribe line on the surface of the wafer (24) by means of a lifting and pressing unit; S3, transporting the wafer (24) to the top of the storage box (3) through the material displacement unit to cut the wafer (24); S4. The wafer (24) debris, blue film (25) debris and coolant generated during the cutting process are collected and discharged through the overflow chamber (35) and the sedimentation chamber (36) inside the storage box (3).

9. The method for using a marking jig for dicing lanes in a DFN and QFN package die-cutting process according to claim 8, characterized in that: In said S2, the following steps are also included: S21, the formula for the moving distance of the pressing plate (31) is: d = hL-(h1+h2)+h3; Wherein d represents the distance that the pressing plate (31) needs to move, hL represents the distance between the pressing plate (31) and the film laminating frame (21) measured by the infrared transmitting sensor (34) and the infrared receiving sensor (33), h1 represents the thickness of the wafer (24), h2 represents the thickness of the blue film (25), and h3 represents the thickness of the dicing road; S22, starting the hydraulic rod (27), driving the lifting plate (28), the T-shaped fixing plate (30) and the bottom pressing plate (31) to move downward, so as to form a clear scribe line on the surface of the wafer (24) as a physical mark when the wafer (24) is cut; In said S3, the following steps are also included: S31, starting the servo motor to drive the sliding block (7) to move on the outer surface of the sliding rod (5) and the sliding screw (6), thereby driving the push plate (12) to push the support plate (9) and the stop plate (10) to move to one side, and at the same time, the bottom rotating drum (18) starts to rotate when the support plate (9) moves, thereby accelerating the movement of the support plate (9); S32, during the movement of the support plate (9) and the stop plate (10), the stop plate (10) continuously moves toward the stop groove (14) provided inside the storage box (3), and the support plate (9) moves to one side at the top of the storage box (3). When a pressure sensor (13) embedded in one side of the L-shaped fixing plate (8) detects that the pressure is greater than a set safety value, it means that the L-shaped fixing plate (8) touches the outer wall of the storage box (3), and the servo motor stops working; S33, then starting the electric telescopic rod (11), driving the push plate (12) to push the support plate (9) and the stop plate (10) to continue moving until one end of the stop plate (10) contacts the inner wall of the stop groove (14) and applies pressure to the second pressure sensor (15). When the second pressure sensor (15) detects that the pressure is greater than the set safety value, the electric telescopic rod (11) stops working, and at this time, the stop plate (10) is completely installed inside the stop groove (14); In said S4, the following steps are also included: S41, wafer (24) debris, blue film (25) debris and coolant generated during the wafer (24) cutting process successively pass through the overflow groove 2 (23) opened inside the film laminating frame (21) and the overflow groove 1 (19) opened inside the support plate (9) and enter the overflow chamber (35) and the sedimentation chamber (36) inside the storage box (3); S42. The solid matter settles in the sedimentation chamber (36) due to gravity and is discharged into the mobile storage box (38) through the electromagnetic valve and the slag discharge pipe. The liquid is discharged through the outlet pipe 1, the water pump and the outlet pipe 2 at the bottom of the overflow chamber (35).

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